JP2002271035A - Hybrid ic - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a hybrid IC which has small interference between mounted electronic components and is suitable for high-density mounting. SOLUTION: A multi-layer printed wiring board 20 is equipped with a 1st insulator layer 22 where patterns 27 constituting electronic elements are formed, and a 2nd insulator layer 24 which has the electronic component 30 mounted on one surface side and has a less dielectric constant than the 1st insulator layer 22. Therefore, the production of an electric field passing through the multi-layered printed wiring board 20 between the electronic components 30 is suppressed and the stray capacitance between the electronic component 30 can be suppressed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hybrid IC having a plurality of electronic components mounted on a single printed wiring board and a method for manufacturing the same.

[0002]

2. Description of the Related Art Conventionally, as a hybrid IC of this kind, electronic components such as semiconductor components and chip components are mounted on a printed wiring board such as a ceramic printed wiring board or a resin printed wiring board in which a resistor element and a capacitor element are embedded. Is known. When embedding a capacitor element, a resonance element, or the like, a printed wiring board having a high dielectric constant is used. Thereby, the interior of the element can be easily formed, and the wiring length of the resonance element can be shortened.

[0003]

However, in the conventional hybrid IC, since a printed circuit board having a high dielectric constant is used, the stray capacitance between terminals of electronic components mounted on the printed circuit board is reduced. There has been a problem in that the operation becomes abnormal, and operation abnormalities such as oscillation and crosstalk may occur. To solve this problem, methods such as increasing the spacing between electronic components or bypassing the wiring pattern have been considered.However, this method has the problem that it is difficult to improve the mounting density. there were.

[0004] The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a hybrid IC which has little interference between mounted electronic components and is suitable for high-density mounting.

[0005]

According to the present invention, there is provided a hybrid IC comprising a multilayer printed wiring board and electronic components mounted on the multilayer printed wiring board. The board includes a first insulator layer on which a printed component is formed, and a second insulator layer on one side serving as a mounting surface of the electronic component and having a lower dielectric constant than the first insulator layer. We propose the one characterized by

According to the present invention, since the electronic component is mounted on the second insulator layer having a lower dielectric constant than the first insulator layer on which the printed component is formed, a multilayer structure is provided between the electronic components. The generation of an electric field passing through the printed wiring board can be suppressed, and as a result, the generation of stray capacitance between electronic components can be suppressed. This enables high-density mounting of electronic components.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A hybrid IC according to one embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a sectional view of the hybrid IC.

The hybrid IC 00 includes a multilayer printed wiring board 20, a plurality of electronic components 30 mounted on the multilayer printed wiring board 10, and a metal covering one surface of the multilayer printed wiring board 20 on the mounting side of the electronic component 30. And a shield case 40 made of the same.

The multilayer printed wiring board 20 is formed by laminating a first insulator layer 22 formed by laminating a plurality of first insulator sheets 21 and a plurality of second insulator sheets 23. And a second insulator layer 24 having a lower dielectric constant than the insulator layer 22. The first insulator layer 22
One surface is arranged so as to be a mounting surface of the electronic component 30 of the multilayer printed wiring board 20. The multilayer printed wiring board 20 has a first
The insulator layer 22 and the second insulator layer 24 are each made of a ceramic material such as glass or barium titanate in order to obtain a predetermined dielectric constant. Here, the dielectric constant of the second insulator layer 24 is preferably 50% or less, more preferably 20% or less, with respect to the dielectric constant of the first insulator layer 22.

On the upper surface of the first insulator layer 22, a pattern 25 is formed. The pattern 25 has an electronic component 30
Has been implemented. Via holes 26 are formed in the first insulator layer 22 to connect the pattern 25 and a later-described electronic element pattern 27 provided in the second insulator layer 24.

On the second insulator layer 24, an electronic element pattern 27 constituting an electronic element which is a printed part is formed. Here, examples of the electronic element include a capacitor, a resistor, an inductor, and a resonance element. The electronic element pattern 27 is formed of a shape and a material corresponding to an electronic element to be configured. For example, in the case of a capacitor, a plurality of rectangular electronic element patterns 27
Are opposed to each other with the insulator sheet 23 interposed therebetween. Also,
In the case of an inductor, the electronic element pattern 27 is formed in a coil shape. Furthermore, in the case of a resonance element, a strip line type electronic element pattern 27 is used.
Are formed and the pattern is formed so as to be sandwiched between the electronic element patterns 27 serving as grounds. Furthermore, in the case of a resistor, the electronic element pattern 27 is formed of a resistor paste having a desired resistance value. In FIG. 1, a capacitor is formed in a region A, a resonance element is formed in a region B, and a resistor is formed in a region C.

A terminal electrode 28 is formed on a side surface of the multilayer printed wiring board 20. The terminal electrode 28 is connected to the pattern 25 or the electronic element pattern 27.

Examples of the electronic component 30 include an IC and a semiconductor device having a predetermined function, chip components such as a multilayer capacitor and a multilayer inductor, and a winding coil.

Next, a method of manufacturing the hybrid IC will be described. First, a first ceramic slurry is obtained by mixing and stirring a predetermined amount of a dielectric ceramic material mainly composed of, for example, BaTiO ₃ , an organic binder, and an organic solvent or water. Next, a first ceramic green sheet is formed from the ceramic slurry by a tape molding method such as a doctor blade method. By the same method, the first
The second ceramic green sheet is formed using a material having a lower dielectric constant than the material of the ceramic green sheet. Here, the first ceramic green sheet and the second
It is preferable that the ceramic green sheets have similar heat shrinkage characteristics. If the thermal expansion characteristics are significantly different, cracks and the like may occur in the firing step described later.

Next, after a via hole is formed in the first ceramic green sheet as required, a conductive paste is printed in a predetermined shape by a screen printing method, an intaglio printing method, a relief printing method, or the like. Here, as the conductive paste, a paste having good conductivity is used for forming a capacitor element or a resonance element. Further, a resistor having a predetermined resistance value is used for forming a resistor. Similarly, after forming a via hole in the second ceramic green sheet, a conductive paste for connecting the via hole is printed by a screen printing method or the like.

Next, the first ceramic green sheet and the second ceramic green sheet are laminated and pressed in a predetermined order by using a pressing device to form a ceramic laminate.

Next, this ceramic laminate is cut into a size per unit part. Next, the cut ceramic laminate is fired under predetermined temperature and atmosphere conditions.
Next, terminal electrodes are formed on the side surfaces of the fired ceramic laminate by a dipping method or the like to obtain a multilayer printed wiring board 20.

Next, the electronic components 30 are mounted on the multilayer printed wiring board 20. Finally, the shield case 40 is mounted to obtain a hybrid IC.

According to such a hybrid IC 10, the first insulator layer 22 on which an electronic element pattern for forming a capacitor element, a resonance element, a resistance element and the like is formed.
The electronic component 30 is formed on the second insulator layer 24 having a lower dielectric constant.
Is mounted, generation of an electric field between the electronic components 30 and passing through the multilayer printed wiring board 20 can be suppressed, and as a result, generation of a stray capacitance between the electronic components 30 can be suppressed. Accordingly, even if the electronic components 30 are mounted at a narrow pitch or the pattern 25 is routed near the electronic components 30, oscillation and crosstalk are less likely to occur. That is,
High-density mounting of the electronic component 30 becomes possible. As an application of the hybrid IC 10, for example, a high-frequency IC in which a filter circuit and an amplifier circuit are integrated is exemplified.

Although the embodiment of the present invention has been described above, the present invention is not limited to this. The scope of the invention is indicated by the appended claims, and all modifications that fall within the meaning of each claim are included in the present invention.

For example, the multilayer printed wiring board is not limited to a barium titanate-based ceramic substrate.
For example, a glass-based ceramic substrate may be used. Further, the printed components provided in the multilayer printed wiring board are not limited to capacitors, resonance elements, resistors, and inductors, but may be other elements.

[0022]

As described in detail above, according to the present invention,
Since the electronic component is mounted on the second insulator layer having a lower dielectric constant than the first insulator layer on which the printed component is formed, generation of an electric field between the electronic components and passing through the multilayer printed wiring board is prevented. It is possible to suppress the occurrence of stray capacitance between electronic components as a result. This enables high-density mounting of electronic components.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view of a hybrid IC.

[Explanation of symbols]

10 hybrid IC, 20 multilayer printed wiring board, 21
... first insulator sheet, 22 ... first insulator layer, 23 ...
2nd insulator sheet, 24 ... 2nd insulator layer, 25 ... pattern, 26 ... via hole, 27 ... pattern for electronic elements, 28 ... terminal electrode, 30 ... electronic component, 40 ... shield case

Claims (1)

[Claims] 1. A hybrid IC comprising a multilayer printed wiring board and an electronic component mounted on the multilayer printed wiring board, wherein the multilayer printed wiring board has a first insulator layer on which a printed component is formed. And a second insulator layer having one surface serving as a mounting surface of the electronic component and having a lower dielectric constant than the first insulator layer.