JP2002118151A - Method of manufacturing semiconductor device and semiconductor manufacturing apparatus - Google Patents

Abstract

(57) [Summary] [PROBLEMS] To improve the workability by shortening the tool adjustment time and reduce the variation in adjustment. SOLUTION: A tool block 12f provided with a mount tool 12c provided with a pressing surface 12d, and a spherical portion 12k in contact with an outer spherical portion 12j of the tool block 12f.
Guide block 12g provided with a tool block 12
The fixing tool 12h is provided with a fixing member 12h for pressing the fixing tool f against the guide block 12g, and a mount stage 12b having a mounting surface 12e for supporting the wiring board.
2c is contacted so that the pressing surface 12d of 2c follows the mounting surface 12e of the mount stage 12b to adjust the parallelism.
After the adjustment, the tool block 12f is connected to the guide block 12g.
, And fixed by the fixing member 12h to perform chip mounting.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor manufacturing technology, and more particularly to a technology effective when applied to improvement of workability of a semiconductor manufacturing device such as a flip chip bonder.

[0002]

2. Description of the Related Art The technology described below studies the present invention,
Upon completion, they were examined by the inventor, and the outline is as follows.

A flip chip bonder is known as a semiconductor manufacturing apparatus for bonding a semiconductor chip to a wiring board (chip supporting member) by flip chip mounting.

In a flip chip bonder, a mount stage and a mount tool are arranged to face each other. In chip mounting (chip bonding), a wiring board is arranged on the mount stage, and a semiconductor chip is supported by the mount tool. Then, the semiconductor chip and the wiring board are pressurized by the mount stage and the mount tool to perform the chip mount.

[0005] Here, the mounting tool of the flip chip bonder is mounted on an XY stage configured by combining different stages that can move in an arc shape in the X or Y direction.

Therefore, when mounting the chip, the stages are separately adjusted so that the mount tool and the mount stage are set in parallel.

[0007] For various flip chip bonders, see, for example, Press Journal Inc., July 7, 1998.
Published on March 27, "Monthly Semiconductor World Extra Number '99
Semiconductor Assembly / Inspection Technology ", pp. 119-123.

[0008]

However, in the flip chip bonder of the above-mentioned technology, it is necessary to change a mount stage and a mount tool when a product type is changed. Thus, the adjustment of the XY stage is performed, so that it takes a long time to adjust the parallel alignment between the mount tool and the mount stage.

In addition, since the operator performs the parallel alignment after the replacement of the mount tool and the mount stage, there is a problem that the adjustment is uneven.

Further, in the adjustment, the pressure-sensitive paper is actually pressed by the mounting tool and the mount stage using the pressure-sensitive paper until the color of the pressure-receiving portion of the pressure-sensitive paper becomes uniform (to be within an allowable range). The work of pressurizing and checking the color of the pressure-sensitive paper is continued endlessly.

Thus, there is a problem that the adjustment takes a very long time.

An object of the present invention is to provide a method of manufacturing a semiconductor device and a semiconductor manufacturing apparatus capable of shortening tool adjustment time to improve workability and reducing variation in adjustment.

Still another object of the present invention is to provide a semiconductor device manufacturing method and a semiconductor manufacturing apparatus for automatic tool change.

The above and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

[0015]

SUMMARY OF THE INVENTION Among the inventions disclosed in the present application, the outline of a representative one will be briefly described.
It is as follows.

That is, in the method of manufacturing a semiconductor device according to the present invention, the step of arranging the pressing surface of the mount tool of the tool block provided with the mount tool and the mounting surface of the stage so as to face each other; A step of contacting the pressing surface of the stage and the mounting surface of the stage to freely move the tool block to adjust the parallelism between the two, and a step of fixing the tool block to the guide block by a fixing member, A step of supporting a semiconductor chip by the pressing surface of the mount tool of the tool block, a step of disposing a chip support member on the mounting surface of the stage, and the step of mounting the semiconductor chip by the mount tool and the stage. Pressurizing the chip support member and joining them together.

According to the present invention, when the pressing surface of the mounting tool is brought into contact with the mounting surface of the mount stage, the tool block that supports the mounting tool can move freely. It can follow the mounting surface of the mount stage.

Accordingly, the pressurizing surface of the mount tool and the mounting surface of the mount stage can be easily and stably parallelized, and the tool block is lowered to press the mount tool against the mount stage. Therefore, the parallelism adjustment can be automated.

As a result, the parallelism of the mount tool and the mount stage can be easily adjusted when the type is changed, and the time spent for adjusting the parallelism can be reduced.

Further, the semiconductor manufacturing apparatus of the present invention includes a mount tool provided with a pressing surface capable of supporting a semiconductor chip, a tool block capable of freely moving, and a guide including a spherical portion which comes into contact with the tool block. Blocks and
A fixing member that presses and fixes the tool block against the guide block, and a mounting surface that supports a chip supporting member that can be joined to the semiconductor chip, wherein the chip supporting member is provided with the semiconductor chip on the mounting surface. A movable stage provided so as to be capable of being arranged to face, and a mount processing unit which presses the semiconductor chip and the chip supporting member by the mount tool and the stage to join them together. Then, when the tool block is fixed to the guide block by the fixing member, the pressing surface of the mount tool and the mounting surface of the stage are brought into contact with each other to freely move the tool block, thereby allowing the tool block to move freely. The degree is adjusted and fixed.

[0021]

Embodiments of the present invention will be described below in detail with reference to the drawings. In all the drawings for describing the embodiments, members having the same functions are denoted by the same reference numerals, and the repeated description thereof will be omitted.

FIG. 1 is a schematic diagram showing the structure of a flip chip bonder as an example of a semiconductor manufacturing apparatus according to an embodiment of the present invention, and FIG. 2 is an operation showing an example of a chip mounting operation in the flip chip bonder shown in FIG. FIG. 3 is a schematic view showing an example of the structure of a mount processing unit in the flip chip bonder shown in FIG. 1, (a) is a cross-sectional view of a mount tool and a mount stage, and (b) is an arrow A in (a). FIG. 4 is a sectional view showing the structure of a CSP as an example of a semiconductor device manufactured using the flip chip bonder shown in FIG. 1, and FIG. 5 is a view showing the manufacture of a CSP as a semiconductor device according to an embodiment of the present invention. FIGS. 6 to 8 show an example of an assembling procedure of the method. FIGS. 6 to 8 show a method of adjusting the parallelism between the mounting tool and the mounting stage in the flip chip bonder shown in FIG. Is a sectional view showing an example of management.

The flip chip bonder, which is an example of the semiconductor manufacturing apparatus of the present embodiment shown in FIG. 1, is used to assemble the CSP 6 which is an example of the small semiconductor device shown in FIG.
This is a manufacturing apparatus that mounts (bonds) the semiconductor chip 1 to the wiring board (chip supporting member) 4, and joins the semiconductor chip 1 and the wiring board 4.

In this embodiment, a case where a tape-shaped thin film wiring substrate 4 is used as an example of the wiring substrate 4 will be described. Therefore, the flip chip bonder shown in FIG.
The semiconductor chip 1 is mounted on a tape-shaped wiring board 4 which is a chip supporting member.

The general structure of the flip chip bonder according to the present embodiment will be described with reference to FIGS.
The semiconductor chip 1 and the wiring board 4 are pressurized by the wafer setting unit 11 for picking up the individual semiconductor chips 1 from the diced semiconductor wafer 7 and the mount tool 12c and the mount stage (stage) 12b to join them. And a transport unit 9 for transporting the wiring substrate 4 to the mount processing unit 12.

Further, the mount processing unit 12 includes a mount head 1 which is movable while supporting the semiconductor chip 1.
2a, a mounting tool 12c having an inner spherical surface portion 12i and an outer spherical surface portion 12j as shown in FIG. 3A and having a pressing surface 12d capable of supporting the semiconductor chip 1 and capable of freely moving. Mount head 1
A tool block 12f provided at the tip of 2a, a guide block 12g provided with a spherical portion 12k that contacts the outer spherical portion 12j of the tool block 12f, and a fixing spherical portion 1 that contacts the inner spherical portion 12i of the tool block 12f.
A fixing member 12h for fixing the tool block 12f by pressing the tool block 12f against the guide block 12g by the fixing spherical portion 12t; a mounting surface 12e for supporting the wiring substrate 4 which can be joined to the semiconductor chip 1; A movable mount stage 12b provided so that the wiring board 4 can be arranged on the mounting surface 12e so as to face the semiconductor chip 1.
Are provided.

Therefore, the feature of the flip chip bonder of the present embodiment is that when performing the parallelism adjustment (parallel alignment adjustment) between the pressing surface 12d of the mount tool 12c and the mounting surface 12e of the mount stage 12b in chip mounting. ,
Lower the mount head 12a to mount the tool 12
c is the mounting surface 12d of the mount stage 12b.
Both are brought into contact so as to follow 2e. At this time, the tool block 12f in the free state is freely moved to adjust the parallelism between the two (parallel alignment is performed). After the adjustment, the tool block 12f is pressed against the guide block 12g and fixed, and the chip is mounted in this state. Is what you do.

Therefore, the mount tool 12c provided on the mount head 12a and the mount stage 12
The parallelism adjustment with b can be automated, thereby shortening the parallelism adjustment time.

The mounting tool 12c, tool block 12f, guide block 12g, and fixing member 12
For example, h is formed of a material that can be formed or cut.

The adjustment of the parallelism between the mount tool 12c and the mount stage 12b is controlled by the control unit 13 shown in FIG.

Here, a base block 12l shown in FIGS. 3A and 3B is attached to the tip of the mount head 12a, a guide block 12g is fixed to the base block 12l, and further, a tool block 12f. A mounting tool 12c having a pressing surface 12d on the distal end surface is fixed by screws 12m.

The guide block 12g and the fixing member 1
2h is engaged with the cylinder and the piston with the tool block 12f interposed therebetween, and the fixed member 12h is supported by the guide block 12g so as to be able to reciprocate freely, and is supplied from the air supply section 12q of the guide block 12g. Block 1 by the pressure of air 12r
2f is pushed up and pressed against the guide block 12g to be fixed.

That is, the guide block 12g is provided with a hollow portion 12p on which the piston portion 12n of the fixed member 12h is disposed and which allows the piston portion 12n to reciprocate, and air 12r is supplied from the air supply portion 12q to the hollow portion 12p. When supplied, the fixing member 12h ascends together with the piston portion 12n, and has a structure in which the tool block 12f is sandwiched and fixed between the fixing member 12h and the guide block 12g.

Therefore, when adjusting the parallelism between the mount tool 12c and the mount stage 12b, the air 12r is applied to the cavity 12 of the guide block 12g.
p, the fixing member 12h is arranged at the lowermost position, whereby the tool block 12f is set in a free state as shown in FIG.
2c is pressed against the mounting surface 12e of the mount stage 12b to parallelize the two surfaces, and then the desired air 12r is supplied to the cavity 12p to provide the piston 12
n to raise the fixing member 12h and the guide block 12g.
Thus, the tool block 12f is sandwiched and fixed.

In the tool block 12f, an outer spherical portion 12j is formed at the outer peripheral portion of the guide block 12g in contact with the spherical portion 12k, and the inner fixing member 1 is formed.
The inner spherical surface portion 1 is located at the contact point with the fixing spherical portion 12t of 2h.
2i are formed.

In this way, when the tool block 12f is in the free state (freely movable state), the pressing surface 12d of the mount tool 12c is moved to the mounting surface 12e of the mount stage 12b.
After performing parallel projection on both sides by pressing against the outside, the outer spherical portion 12j of the tool block 12f, the spherical portion 12k of the guide block 12g, and the inner spherical portion 12i of the tool block 12f and the fixing spherical portion 12t of the fixing member 12h are formed. Since the respective surfaces make spherical contact, the pressing surface 12d of the mounting tool 12c and the mounting surface 12e of the mounting stage 12b are pressed against each other, and the tool block 12f can be fixed at the same angle when the two are parallel. As a result, the pressurizing surface 12d of the mount tool 12c and the mounting surface 12e of the mount stage 12b can be easily and stably parallelized.

The mount head 12a shown in FIG.
Is mounted on an XY table 10 that is movable in the X and Y directions, and is guided by a Z moving mechanism, thereby being movable in the XYZ directions.

Further, the mount stage 12b and the mount head 12a join the semiconductor chip 1 and the wiring board 4 by applying a load, heat or ultrasonic waves to the semiconductor chip 1 and the wiring board 4.

As shown in FIG. 2, a wafer support 11a on which a diced semiconductor wafer 7 is disposed and a diced semiconductor wafer 7 mounted on the wafer support 11a. The semiconductor chip 1 to be bonded from the pickup collet 11
c, the semiconductor chip 1 picked up is turned upside down, and the mount head 12
A flip head 11b for delivering to a collet 12s provided at the tip of a mounting tool 12c is installed. In the wafer setting section 11, the pick-up of the semiconductor chip 1 from the diced semiconductor wafer 7 and the semiconductor chip 1 The chip 1 is transferred to the mount head 12a.

The transfer of the semiconductor wafer 7 to the wafer setting section 11 is performed by the wafer lifter 8 shown in FIG.

The wiring board 4 is sent out to the transport section 9 by a loader 17, and the wiring board 4 after chip bonding is accommodated in an unloader 18.

Next, the structure of the CSP 6 shown in FIG. 4 in which chip mounting (chip bonding) is performed using the flip chip bonder (semiconductor manufacturing apparatus) shown in FIGS. 1 and 2 of this embodiment will be described.

The CSP 6 is a small-sized device whose external size is slightly larger than that of the semiconductor chip 1, and is provided on the outer peripheral portion of the main surface 1 a (the surface on which the semiconductor integrated circuit is formed) of the semiconductor chip 1. Plural pads 1b
Will be described.

However, the location where the pad 1b is provided is not particularly limited, and the semiconductor chip 1
May be an outer peripheral portion of the main surface 1a, an inner side (for example, a center pad arrangement), or both.

The configuration of the CSP 6 has a lead 4c connected to the pad 1b of the semiconductor chip 1 and a wiring 4a connected to the lead 4c and also to the bump electrode 2 as an external terminal. The thin-film tape-shaped wiring board 4, the elastomer 3, which is an elastic member disposed between the semiconductor chip 1 and the wiring board 4, and the pad 1 formed by sealing resin or the like in the opening 4 b of the wiring board 4.
b and a sealing portion 5 formed by sealing the lead 4c.

Here, the thin-film tape-shaped wiring board 4 is
For example, it is formed of a polyimide-based film substrate.

The sealing resin used for the sealing portion 5 is, for example, an epoxy-based thermosetting resin, and the resin is sealed by molding or potting.

Next, the semiconductor device (C
The manufacturing method of SP6) including the chip mounting (chip bonding) method will be described with reference to the manufacturing process flow chart shown in FIG.

First, as shown in step S1, a thin-film tape-shaped wiring board 4 made of polyimide or the like is prepared, and an elastomer for attaching the elastomer 3, which is an elastic member, is performed (step S2).

On the other hand, the diced semiconductor wafer 7 is set by the wafer lifter 8 on the wafer support table 11a of the wafer setting section 11 of the flip chip bonder shown in FIG.

Subsequently, the chip mount (chip bonding) shown in step S3 is performed using the flip chip bonder of this embodiment shown in FIG.

First, in the flip chip bonder, as shown in FIG. 6, the pressing surface 12d of the mounting tool 12c provided at the tip of the mounting head 12a shown in FIG.
And the mounting surface 12e of the mount stage 12b are arranged to face each other.

At this time, the fixing member 12h including the piston portion 12n and the tool block 12f supported by the fixing member 12h
Both are free.

In this state, the mount head 12a is lowered (or the mount stage 12b may be raised), and as shown in FIG. 7, the pressurizing surface 12d of the mount tool 12c and the mounting surface 12e of the mount stage 12b. And contact.

That is, the mount head 12a is lowered, and the pressing surface 12d of the mount tool 12c is pressed against the mounting surface 12e of the mount stage 12b.

At this time, since the tool block 12f to which the mounting tool 12c is attached is supported so as to be freely movable, the tool block 12f moves freely, whereby the pressing surface 12d of the mounting tool 12c is moved to the mounting stage 12c.
It follows the mounting surface 12e of b.

That is, when the mount tool 12c is pressed against the mount stage 12b, the mount tool 12c follows the mount stage 12b, and at the same time, the tool block 12f moves so as to follow the mount stage 12b.

Further, in this state, as shown in FIG.
The desired air 12r is supplied to the cavity 12p to raise (lift) the piston portion 12n of the fixing member 12h, thereby fixing the tool block 12f between the fixing member 12h and the guide block 12g.

In the tool block 12f, an outer spherical portion 12j is formed at the outer peripheral portion of the guide block 12g in contact with the spherical portion 12k, and the inner fixing member 1 is formed.
The inner spherical surface portion 1 is located at the contact point with the fixing spherical portion 12t of 2h.
2i are formed.

Accordingly, in a free state of the tool block 12f, the pressing surface 12d of the mount tool 12c is pressed against the mounting surface 12e of the mount stage 12b to parallelize both surfaces. Spherical portion 12k of guide block 12g, inner spherical portion 12i of tool block 12f and fixing member 1
The fixing spherical portions 12t of 2h make spherical contact with each other, and as a result, the pressing surface 12d of the mount tool 12c and the mounting surface 12e of the mount stage 12b are pressed against each other, and the angle when they are parallel to each other ( In the state, the tool block 12f is fixed.

Thus, the pressing surface 12 d and the mounting surface 12
The tool block 12f is fixed in a state where e is parallel, so that the pressing surface 12d of the mount tool 12c and the mounting surface 12e of the mount stage 12b can be parallelized, that is, the parallelism can be adjusted.

After adjusting the parallelism, as shown in FIG. 2, the semiconductor chip 1 to be mounted in the wafer setting section 11 is picked up from the semiconductor wafer 7 by the pickup collet 11c of the flip head 11b. Then, the semiconductor chip 1 is turned over and moved to the mount processing unit 12.

Thereafter, the back surface 1c of the semiconductor chip 1 is attached to the collet 12 provided at the tip of the mount head 12a.
s, and stands by above the mount stage 12b. That is, the semiconductor chip 1 is supported by the pressing surface 12d (see FIG. 3A) of the mount tool 12c.

On the other hand, the tape-shaped wiring board (chip supporting member) 4 is sent out from the loader 17 to
Then, the wiring substrate 4 on which the elastomer 3 is attached is arranged on the mount stage 12b of the mount processing unit 12. That is, the mounting surface 12e of the mount stage 12b
The wiring board 4 is arranged.

As a result, the semiconductor chip 1 supported on the pressurizing surface 12d of the mount tool 12c whose parallelism has been adjusted and the wiring substrate 4 supported on the mounting surface 12e of the mount stage 12b face each other. Is done.

Thereafter, a load and heat are applied to the semiconductor chip 1 and the wiring board 4 by the mount tool 12c and the mount stage 12b, and the semiconductor chip 1 and the wiring board 4 are bonded by thermocompression bonding to perform chip mounting (chip bonding).

At the time of the thermocompression bonding, an ultrasonic wave may be applied.

After the chip mounting, the wiring board 4 is sent to the unloader 18 and stored therein.

Thereafter, the lead bonding shown in step S4 of FIG. 5 is performed.

Here, the pads 1b of the semiconductor chip 1 shown in FIG. 4 are connected to the leads 4c of the wiring board 4 using an inner lead bonder or the like.

Thereafter, the sealing shown in step S5 is performed.

In the sealing step, the semiconductor chip 1 may be molded (or molded) by using a sealing resin.
The pad 1b and the lead 4c are sealed with resin, thereby forming a sealing portion 5.

Subsequently, ball attachment shown in step S6 is performed.

Here, a predetermined number of bump electrodes 2 are formed by mounting one solder ball as an external terminal on each of the lands at predetermined positions connected to the wiring 4a of the wiring board 4.

Thereafter, the sorting and marking shown in step S7 are performed, and the assembly of the CSP 6 shown in FIG. 4 is completed.

According to the method of manufacturing the semiconductor device (CSP 6) and the semiconductor manufacturing device (flip chip bonder) of the present embodiment, the following operational effects can be obtained.

That is, when the mounting head 12a is lowered to bring the pressing surface 12d of the mounting tool 12c into contact with the mounting surface 12e of the mounting stage 12b, the tool block 12f supporting the mounting tool 12c can move freely. Therefore, the pressing surface 12d of the mount tool 12c can be made to follow the mounting surface 12e of the mount stage 12b.

Accordingly, the pressing surface 12d of the mounting tool 12c and the mounting surface 12e of the mounting stage 12b can be easily and stably parallelized, and the tool block 12f can be lowered to mount the mounting tool 12c. Is simply pressed against the mount stage 12b, so that the parallelism adjustment can be automated.

As a result, the parallelism of the mount tool 12c and the mount stage 12b can be easily adjusted when the type is changed, and the time spent for adjusting the parallelism can be reduced.

Therefore, the workability of the flip chip bonder (semiconductor manufacturing apparatus) having the mount tool 12c and the mount stage 12b can be improved by shortening the tool adjustment time.

Further, since the parallelism adjustment can be performed by the automatic adjustment method, the variation of the adjustment by the operator does not occur, and therefore, the variation of the parallelism adjustment can be reduced.

In addition, since the parallelism adjustment simply involves lowering the mount tool 12c at the tip of the mount head 12a and pressing and fixing the mount tool 12c against the mount stage 12b, the automatic parallelism adjustment and the mounting tool 12c Automatic change of the mounted mount head 12a can also be realized, and thus automatic tool change including the parallelism adjustment can be performed.

As described above, the invention made by the inventor has been specifically described based on the embodiments of the present invention. However, the present invention is not limited to the embodiments of the present invention, and does not depart from the gist of the invention. It is needless to say that various changes can be made.

For example, like the mount tool, the tool block and the guide block of the modified example shown in FIGS. 9A and 9B, the tool block 12f and the guide block 12f are used.
g in the horizontal direction (the pressing surface 1 of the mount tool 12c).
(A direction parallel to 2d) may be provided.

That is, anti-rotation projections 12v are provided on both sides of the tool block 12f, and anti-rotation guides 12u into which the anti-rotation projections 12v are fitted are provided on both sides of the guide block 12g. The rotation preventing projection 12v and the rotation preventing guide 12u are fitted to each other, so that the pressing surface 12
θ rotation in a direction parallel to d can be prevented.

Thus, the mounting accuracy at the time of chip mounting can be improved.

Further, like the mount tool, the tool block and the guide block of the modified example shown in FIGS. 10A and 10B, the tool block 12f (see FIG. 3) includes the X-axis tool block 14 and the Y-axis tool block. The guide block 12g has a Y-axis groove 15a formed therein, and the Y-axis protrusion 15b fitted into the Y-axis groove 15a.
Are provided in the Y-axis tool block 15.

On the other hand, an X-axis groove 14a is formed in the Y-axis tool block 15, and an X-axis protrusion 14b fitted into the X-axis groove 14a is provided in the X-axis tool block 14. Similarly to the modification shown in FIG. 9, the rotation of the mount tool 12c in the direction parallel to the pressing surface 12d can be prevented.

The X-axis tool block 14 and the Y-axis tool block 15 are not limited to spherical shapes but may be arc-shaped.

Further, like the mount tool, the tool block and the guide block of the modified example shown in FIG. It may be an expression.

That is, the hollow portion 12p is evacuated, and the electromagnet 16a (which may be a solenoid) is embedded in the inner peripheral wall forming the hollow portion 12p of the guide block 12g, so that the reciprocating motion of the fixed member 12h is electrically driven. can do.

Thus, space saving and energy saving can be achieved.

In the above embodiment, the case where the semiconductor device is the CSP 6 has been described. However, the semiconductor device is assembled by joining the semiconductor chip 1 and the chip supporting member by the chip mounting method of the embodiment. If it is a flip-chip product other than the CSP 6 (for example, a multi-chip module), the chip supporting member is not limited to the tape-shaped thin-film wiring board 4 but is made of a relatively hard material. It may be a printed wiring board or a ceramic substrate.

Further, in the above embodiment, the case where the semiconductor manufacturing apparatus is a flip chip bonder has been described. However, the semiconductor manufacturing apparatus connects the semiconductor chip 1 and the chip supporting member by the chip mounting method of the above embodiment. Other assembling devices, such as a die bonder, a chip mounter, a handling device, and a material handling device, may be used as long as the assembly is performed.

[0095]

Advantageous effects obtained by typical ones of the inventions disclosed by the present application will be briefly described as follows.
It is as follows.

(1). When the pressure surface of the mount tool and the mounting surface of the mount stage are in contact, the tool block supporting the mount tool can move freely, so that the pressure surface of the mount tool follows the mounting surface of the mount stage. Can be Therefore, both can be easily and stably parallelized, and
The parallelism adjustment can be automated.

(2). According to the above (1), the parallelism of the mount tool and the mount stage can be easily adjusted when the type is changed, and the time spent for the parallelism can be reduced. Therefore, the workability can be improved by shortening the tool adjustment time in the semiconductor manufacturing apparatus.

(3). According to the above (1), since the parallelism adjustment can be performed by the automatic adjustment method, the variation of the adjustment by the operator does not occur, and the variation of the parallelism adjustment can be reduced.

(4). Since the parallelism adjustment is only performed by lowering the mount tool and pressing it against the mount stage and fixing the same, the automation of the parallelism adjustment and the automatic exchange of the head to which the mount tool is attached can be realized. Automatic tool change including degree adjustment is possible.

[Brief description of the drawings]

FIG. 1 is a schematic configuration diagram illustrating a structure of a flip chip bonder as an example of a semiconductor manufacturing apparatus according to an embodiment of the present invention.

FIG. 2 is an operation schematic diagram showing an example of a chip mounting operation in the flip chip bonder shown in FIG.

3A and 3B are diagrams showing an example of the structure of a mount processing unit in the flip chip bonder shown in FIG. 1, wherein FIG. 3A is a cross-sectional view of a mount tool and a mount stage, and FIG. It is the A arrow view of (a).

4 is a cross-sectional view showing a structure of a CSP as an example of a semiconductor device manufactured using the flip chip bonder shown in FIG.

FIG. 5 is a CSP as a semiconductor device according to the embodiment of the present invention;
FIG. 7 is a manufacturing process flow chart showing an example of an assembling procedure of the manufacturing method of FIG.

FIG. 6 is a cross-sectional view showing an example of the principle of a method of adjusting the parallelism between the mount tool and the mount stage in the flip chip bonder shown in FIG.

FIG. 7 is a cross-sectional view showing an example of the principle of a method of adjusting the parallelism between the mount tool and the mount stage in the flip chip bonder shown in FIG.

FIG. 8 is a cross-sectional view showing an example of the principle of a method of adjusting the parallelism between the mount tool and the mount stage in the flip chip bonder shown in FIG.

FIGS. 9A and 9B are diagrams showing the structure of a modification of the mount tool, the tool block, and the guide block in the flip chip bonder according to the embodiment of the present invention;
(A) is a side view, (b) is a view on arrow B of (a).

FIGS. 10A and 10B are diagrams showing the structure of a modified example of a mount tool, a tool block, and a guide block in the flip chip bonder according to the embodiment of the present invention; FIG. (b) is a view on arrow C of (a).

FIG. 11 is a cross-sectional view illustrating a structure of a modified example of a mount tool, a tool block, and a guide block in the flip chip bonder according to the embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Semiconductor chip 1a Main surface 1b Pad 1c Back surface 2 Bump electrode 3 Elastomer 4 Wiring board (chip supporting member) 4a Wiring 4b Opening 4c Lead 5 Sealing part 6 CSP (semiconductor device) 7 Semiconductor wafer 8 Wafer lifter 9 Transport part 10XY Table 11 Wafer setting unit 11a Wafer support 11b Flip head 11c Pickup collet 12 Mount processing unit 12a Mount head 12b Mount stage (stage) 12c Mount tool 12d Pressing surface 12e Mounting surface 12f Tool block 12g Guide block 12h Fixing member 12i Inner spherical surface Part 12j Outer spherical part 12k Spherical part 12l Base block 12m Screw 12n Piston part 12p Hollow part 12q Air supply part 12r Air 12s Collet 12t Fixing ball Surface 12u Rotation prevention guide 12v Rotation prevention protrusion 13 Control unit 14 X-axis tool block 14a X-axis groove 14b X-axis protrusion 15 Y-axis tool block 15a Y-axis groove 15b Y-axis protrusion 16 Coil motor 16a Electromagnet 17 Loader 18 Unloader

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Akira Kuroda 3-3-2 Fujibashi, Ome-shi, Tokyo Within Hitachi Tokyo Electronics Co., Ltd. (72) Inventor Tomoji Suda 3-2-2 Fujibashi, Ome-shi, Tokyo Hitachi East Inside Kyoto Electronics Co., Ltd. (72) Inventor Shiki Ono 3-3-2 Fujibashi, Ome-shi, Tokyo Hitachi Tokyo Electronics Co., Ltd. F-term (reference) 5F044 PP16 5F047 FA07 FA12

Claims (5)

[Claims] A step of arranging a pressing surface of the mounting tool of a tool block provided with a mounting tool and a mounting surface of a stage so as to face each other; Adjusting the parallelism of the tool block by bringing the tool block into free contact with a mounting surface; and fixing the tool block to a guide block by a fixing member; A step of supporting the semiconductor chip by a pressing surface; a step of arranging a chip supporting member on the mounting surface described above of the stage; Bonding the semiconductor device. 2. The step of arranging a pressing surface of the mounting tool of a tool block provided with a mounting tool and a mounting surface of a stage so as to face each other, wherein the pressing surface of the mounting tool is in front of the stage. Adjusting the parallelism between the pressing surface of the mount tool and the mounting surface of the stage by moving the tool block freely so as to follow the mounting surface, and bringing the two into contact with each other; and fixing the tool block to a fixing member. Fixing the semiconductor chip by pressing the guide block against the guide block by the fixing spherical portion, supporting the semiconductor chip by the pressing surface of the mount tool of the tool block, and mounting a chip support member on the mounting surface of the stage. Disposing, pressing the semiconductor chip and the chip supporting member by the mount tool and the stage The method of manufacturing a semiconductor device characterized by a step of bonding the user. 3. A tool block having a mounting tool provided with a pressing surface capable of supporting a semiconductor chip, a tool block capable of freely moving, a guide block having a spherical portion in contact with the tool block, and A fixing member that is pressed against and fixed to the guide block; and a mounting surface that supports a chip supporting member that can be joined to the semiconductor chip, wherein the chip supporting member can be disposed on the mounting surface in opposition to the semiconductor chip. A movable stage provided as described above, and a mount processing unit that presses the semiconductor chip and the chip support member by the mount tool and the stage to join the chip and the chip support member. When fixing the tool block to the guide block by the above, the pressing surface of the mounting tool and the stage Contacting the mounting surface is free movement of the tool block to a semiconductor manufacturing apparatus characterized by fixing by adjusting the parallelism of the two. 4. A tool block having an inner spherical portion and an outer spherical portion formed thereon, a mounting tool provided with a pressing surface capable of supporting a semiconductor chip, and a freely movable tool block; and the outer spherical portion of the tool block. A guide block having a spherical portion that comes into contact with the guide block; a fixing member that has a fixing spherical portion that comes into contact with the inner spherical portion of the tool block, and pressing the tool block against the guide block by the fixing spherical portion to fix the tool block. A movable stage provided with a mounting surface for supporting a chip supporting member that can be joined to the semiconductor chip, and provided such that the chip supporting member can be arranged on the mounting surface so as to face the semiconductor chip. A semiconductor device that presses the semiconductor chip and the chip support member by the mount tool and the stage to join the two. When the tool block is fixed to the guide block by the fixing member, the tool block is freely moved so that the pressing surface of the mount tool follows the mounting surface of the stage. A semiconductor manufacturing apparatus wherein the two are brought into contact with each other to adjust and fix the degree of parallelism between the two. 5. A tool block having a mounting tool provided with a pressing surface capable of supporting a semiconductor chip, a tool block capable of freely moving, a guide block having a spherical portion in contact with the tool block, and reciprocating on the guide block. A fixing member that is movably supported and presses and fixes the tool block against the guide block by air pressure; and a mounting surface that supports a chip supporting member that can be joined to the semiconductor chip. A movable stage provided on the mounting surface so as to be able to face the semiconductor chip, and a bonding between the semiconductor chip and the chip supporting member by pressing the semiconductor chip and the chip supporting member by the mount tool and the stage; And a mounting processing unit where the tool block is fixed to the guide block by the fixing member. Wherein the tool block is freely moved so that the pressing surface of the mount tool follows the mounting surface of the stage, and the parallelism between the two is adjusted and fixed. .