JP2002190681A - Electronic equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide electronic equipment capable of correcting bending of a circuit board. SOLUTION: This electronic equipment is provided with a frame body 1, shield plates 7 and 8 fixed to the frame body 1, and a circuit board 11 housed in the frame body 1, on which an electric component 14 is soldered to a wiring pattern 15. Then, a protrusion 3b for fixing to be soldered to the circuit board 11 is formed in the frame body 1, and a through-hole 12 is formed at the central part of the circuit board 11, and a floating preventing part, constituted of a protrusion 8 to be inserted into the through-hole 12, is formed at the shield plates 7 and 8 so that the central part of the wiring pattern 15 side formed with the electric component 14 of the circuit board 11 can be suppressed, and that the bending of the circuit board 11 can be corrected.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device such as a TV tuner, and more particularly to a structure for holding a circuit board housed in the device.

[0002]

2. Description of the Related Art A conventional electronic device of this type is, for example, shown in FIG.
As shown in FIG. 8, a circuit board 23 in which an electric component 22 such as a capacitor or a diode is soldered and mounted on an upper surface in a box-shaped frame 21 having upper and lower surfaces opened.
A projection formed on a shield plate 26 which is housed by engaging a locking projection 24 formed by making a cut in a side wall of the circuit board 23 into a through hole 25 formed in a peripheral portion of the circuit board 23 and partitioning the inside of the frame 21. 27 are inserted through holes 28 formed in the center of the circuit board 23, respectively.
The projection 27 is connected to the wiring pattern 29 formed on the circuit board 23 by soldering (solder is not shown), and the ground circuit of the circuit board 23 and the frame 21 are electrically connected by this connection (note that the frame 21 is electrically connected). In FIG. 7, the wiring pattern 29 is hatched.

[0003] The assembling of this electronic equipment is performed by firstly using the locking projection 2.
When the circuit board 23 on which the electric component 22 is mounted is inserted into the frame 21 from above so that the projections 4 and the projections 27 correspond to the through holes 25 and the holes 28, respectively, the projections 27
Is inserted, and the edge of the through hole 25 is
7, and when the circuit board 23 is further pushed into the frame 21 in this state, the elasticity of the locking projections 24 causes the locking projections 24 to bend outward, and the locking projections 24 When the upper end portion passes through the through hole 25, the locking projection 24 is restored to the original state, and the locking projection 2 is inserted into the through hole 25.
4 is locked, and the outer peripheral edge of the circuit board 23 is supported.
Next, the assembling of the electronic device is completed by soldering the locking projections 24 and the projections 27 to the wiring patterns 29 in a reflow process.

[0004]

However, in the above-mentioned conventional electronic equipment, since the electric component 22 is mounted on the circuit board 23 by soldering, as shown in FIG. The central portion of the circuit board 23 on the side of the wiring pattern 29 on which the electric component 22 is provided rises. When the circuit board 23 locked to the frame body 21 is warped up and the locking projections 24 and the projections 27 are connected to the wiring pattern 29 by soldering in the reflow process,
The amount of solder for connecting the locking projection 24 and the wiring pattern 29 is smaller than the amount of solder for connecting the projection 27 and the wiring pattern 29, and the electrical connection between the locking projection 24 and the wiring pattern 29 is sufficiently ensured. There was a problem that it became impossible to do. In such a case, the soldering between the locking projection 24 and the wiring pattern 29 is manually performed separately from the reflow process, which increases the production cost.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide an electronic device capable of correcting a warpage of a circuit board.

[0006]

In order to achieve the above object, an electronic apparatus according to the present invention comprises a frame, a shield plate fixed to the frame, and an electric device which is housed in the frame and has a wiring pattern. A circuit board to which parts are soldered, wherein the frame body is formed with fixing projections to be soldered to the circuit board,
A hole is provided in the center of the circuit board, and the shield board is inserted through the hole to suppress a center of the circuit board on the side of the wiring pattern on which the electric component is provided. The most main feature of the present invention is the provision of an anti-floating portion comprising a projection for correcting the warpage.

Further, in the above configuration, the fixing projection is formed in a straight pin shape, and is loosely fitted into a through hole formed in the circuit board.

In the above structure, a plurality of sets of the holes and the projections are provided to form a plurality of the floating prevention portions.

[0009] In the above structure, the pair of protrusions may include a rising portion located at a base and a guide portion provided at an upper end of the rising portion, and the interval between the pair of rising portions may be set to the pair. The outer circumference of each of the pair of rising portions inserted into the hole of the circuit board is pressed against the inner wall of the hole of the circuit board, respectively, so that the circuit is formed. The warpage of the substrate was corrected.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of an electronic apparatus according to the present invention will be described below with reference to FIGS.

This electronic device has a box-shaped frame 1 made of a sheet metal such as a thin iron flat plate, shield plates 2, 3, 4 fixed in the frame 1, and a circuit housed in the frame 1. And a substrate 5.

As shown in FIGS. 1 and 5, the frame 1 is formed in a box shape having upper and lower surfaces opened, and has side walls 2, 3, 4, and 4.
5 includes fixing projections 2b, 3b, 4b, 5b having a straight pin shape by making cuts 2a, 3a, 4a, 5a, respectively, and holding projections 3c provided at the center of the side wall 3, respectively. Is formed.

The shield plates 6 and 7 are made of a sheet metal such as a thin iron flat plate which is the same as the frame 1, and as shown in FIG.
As shown in FIG. 2, the upper edge of the shield plate 6 is connected to a rising portion 8a located at the base and connected to the upper end of the rising portion 8a. Guide 8
b and a pair of projections 8 are provided, and as shown in FIG.
Two sets of the pair of projections 8 are provided. Then, as shown in FIGS. 2 and 3, in the pair of protrusions 8, the interval A between the pair of rising portions 8a is set to be larger than the interval B between the pair of guide portions 8b.

The shield plate 9 is made of a sheet metal, such as a thin iron flat plate, like the frame 1, and is fixed to the shield plates 6, 7 across the shield plates 6, 7 as shown in FIG. As shown in FIG. 4, on the upper edge of the shield plate 9,
A projection 10 including a rising portion 10a located at the base and a guide portion 10b connected to the upper end of the rising portion 10a is provided.

As shown in FIGS. 1 and 5, the rectangular circuit board 11 has a plurality of holes 12 formed in the center thereof, and a plurality of through holes 13 formed in the periphery of each side. On the upper surface of the circuit board 11, electrical components 14 such as capacitors and diodes are soldered and mounted on a wiring pattern (not shown) to form a desired electronic circuit. Is formed (note that the wiring pattern 15 is hatched in FIG. 1). Then, as shown in FIGS. 2 and 3, the circuit board 11 is pressed against the inner wall of the hole 12 by the outer portions of the rising portions 8 a of the pair of projections 8 inserted into the hole 12, respectively. The fixing projection 3b is loosely fitted in the through hole 13, and as shown in FIG. 4, the outer side of the rising portion 10a of the projection 10 inserted into the hole 12 is pressed against the inner wall of the hole 12, One side of the holding projection 3c is housed in the frame 1 while being pressed against the inner wall of the through hole 13, and the fixing projection 3b, the pair of projections 8 and the holding projection 3c are connected to the wiring pattern 15 in FIG. They are connected by solder (not shown).

Next, a method of assembling the electronic device having the above structure will be described.
The fixing projection 3b and the holding projection 3c
When the circuit board 11 on which the electric components 14 are mounted is inserted into the frame 1 from above so as to correspond to the through holes 13, the fixing projections 3 b are inserted into the through holes 13 and a pair of The guide portion 8b of the projection 8 and the guide portion 10b of the holding projection 10 are inserted, and the circuit board 11 is inserted into the frame 1 while being guided by the guide portions 8b. When the circuit board 11 is further inserted into the frame 1,
The circuit board 11 is inserted into the frame 1 while the outer portions of the rising portions 8a of the pair of projections 8 and the outer portions of the rising portions 10a of the projections 10 slide on the inner wall of the hole portion 12, and the cuts 2a, 3
The circuit board 11 is brought into contact with the lower portions of a, 4a and 5a. Next, the pair of projections 8, the projections 10, the fixing projections 3b, and the holding projections 3c are respectively connected to the wiring pattern 1 in a reflow process.
5 is soldered to complete the assembly of the electronic device.

Thus, the assembling of the electronic device is completed, but after the assembling, the warped circuit board 1 is lifted.
When the central portion of the first member 1 is pressed, the rising portions 8a of the pair of protrusions 8 are formed.
Are pressed against the inner wall of the hole 12, respectively, to lock the circuit board 11 at that position, and the pair of projections 8 function as a floating prevention section for correcting warpage of the circuit board 11. Further, the rising portion 1 of the projection 10 inserted into the hole 12
0a is pressed against the inside of the holding projection 3c against the inner wall of the through hole 13, and the projection 10 and the holding projection 3c are pressed against each other.
Function as a floating prevention unit that corrects the warpage of the circuit board 11.

The electronic device thus constructed and assembled is mounted on a circuit board of an external device such as a TV, and the electronic circuit (not shown) is connected to the circuit board of the external device to perform a predetermined control process. It is supposed to do.

In this electronic device, when the circuit board 11 is inserted into the frame 1, the outer portions of the pair of projections 8 press the inner walls of the hole 12 outward of the hole 12. As a result, the circuit board 11 acts so as to be pushed outward, thereby forming a locking function as an anti-floating portion, and the outer side of the projection 10 moves the inner wall of the hole 12 to the outside of the hole 12. When the circuit board 11 is pressed, the circuit board 11 is spread outward and performs the same function. Even if the circuit board 11 warps due to heat generated when the electric components 14 are soldered, the circuit board 1
1 can be properly corrected.

In this embodiment, the pair of projections 8 have been described as having a shape as shown in FIGS. 2 and 3, but the present invention is not limited to this. Various changes such as the shape shown in FIG. 6 are possible.

[0021]

The present invention is embodied in the form described above, and has the following effects.

An electronic device according to the present invention includes a frame, a shield plate fixed to the frame, and a circuit board housed in the frame and having an electric component soldered to a wiring pattern. Forming a fixing projection to be soldered to the circuit board, providing a hole in the center of the circuit board,
The shield plate is provided with an anti-floating portion that is inserted into the hole portion, suppresses a central portion of the circuit board on the wiring pattern side where the electric components are provided, and includes a protrusion that corrects the warpage of the circuit board. Therefore, the warpage of the circuit board can be appropriately corrected, and the subsequent soldering can be reliably performed.

Further, since the fixing protrusion is formed in a straight pin shape and is loosely fitted in a through hole formed in the circuit board, the fixing protrusion when the circuit board is inserted into the frame body. A collision between the projection and the circuit board can be avoided, and the circuit board can be smoothly housed in the frame.

Further, since a plurality of sets of the holes and the projections are provided to form the plurality of floating preventing portions, the warpage of the circuit board can be corrected more reliably.

[0025] Further, there is provided a pair of the projections comprising a rising portion located at the root and a guide portion provided at the upper end of the rising portion, and the interval between the pair of rising portions is set to be equal to the distance between the pair of guide portions. The gap is set to be larger than the gap, and the outer portions of each of the pair of rising portions inserted into the hole of the circuit board are pressed against the inner wall of the hole of the circuit board to reduce the warpage of the circuit board. Since the circuit board has been corrected, the circuit board can be smoothly housed in the frame, and the circuit board can be held in the frame in a state where the warpage of the circuit board has been corrected.

[Brief description of the drawings]

FIG. 1 is a plan view of an electronic device of the present invention.

FIG. 2 is a sectional view taken along line 2-2 in FIG. 1;

FIG. 3 is a sectional view taken along line 3-3 in FIG. 1;

FIG. 4 is a sectional view taken along line 4-4 in FIG. 1;

FIG. 5 is an exploded perspective view of the electronic device of the invention.

FIG. 6 is an exemplary sectional view showing a modification of a pair of protrusions according to the electronic apparatus of the invention.

FIG. 7 is a plan view of a conventional electronic device.

FIG. 8 is a sectional view taken along line 8-8 in FIG. 7;

FIG. 9 is an explanatory view showing a state in which a circuit board is incorporated in a frame in a conventional electronic device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Frame 2 Side wall 2a Notch 2b Fixing protrusion 3 Side wall 3a Notch 3b Fixing protrusion 3c Holding protrusion 4 Side wall 4a Notch 4b Fixing protrusion 5 Side wall 5a Notch 5b Fixing protrusion 6 Shield plate 7 Shield plate 8 Projection 8a Rise 8b guide portion 9 shield plate 10 protrusion 10a rising portion 10b guide portion 11 circuit board 12 hole portion 13 through hole 14 electric component 15 wiring pattern

Claims (4)

[Claims] 1. A frame, a shield plate fixed to the frame, and a circuit board housed in the frame and having an electric component soldered to a wiring pattern, wherein the circuit board is provided on the frame. Forming a fixing projection to be soldered to the circuit board, providing a hole in the center of the circuit board, and the shield plate is inserted through the hole to provide the electric component of the circuit board. An electronic device, comprising: a floating prevention portion comprising a projection for correcting a warpage of the circuit board while suppressing a central portion on a wiring pattern side. 2. The electronic device according to claim 1, wherein the fixing projection is formed in a straight pin shape, and is loosely fitted into a through hole formed in the circuit board. 3. The electronic device according to claim 1, wherein a plurality of sets of the holes and the projections are provided to form a plurality of the floating prevention portions. 4. A pair of said projections comprising a rising portion located at the base and a guide portion provided continuously at an upper end of said rising portion, and an interval between said pair of rising portions is defined by a distance between said pair of guiding portions. The gap is set to be larger than the gap, and the outer portions of each of the pair of rising portions inserted into the hole of the circuit board are pressed against the inner wall of the hole of the circuit board to reduce the warpage of the circuit board. The electronic device according to claim 1, wherein the electronic device has been corrected.