JP2002146161A - Molding material of epoxy resin for sealing and electronic part device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a molding material of an epoxy resin for sealing little in chip shift, and excellent in reflow crack resistance and void resistance even in a thin surface mounting-type package, and an electronic part device having elements sealed with the material. SOLUTION: The molding material of an epoxy resin for sealing is composed of (A) an epoxy resin, (B) a hardener, (C) a hardening accelerator and (D) a filler as the essential components, and has a disk flow of >=70 mm. The electronic part device has elements sealed with the epoxy resin molding material for sealing.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention comprises a sealing epoxy resin molding material having excellent reflow crack resistance and void resistance, which is particularly suitable for a thin surface mount type package, and a device sealed with the epoxy resin molding material. It relates to an electronic component device.

[0002]

2. Description of the Related Art Conventionally, in the field of element sealing of electronic component devices such as transistors and ICs, resin sealing has become the mainstream in terms of productivity and cost, and epoxy resin molding materials have been widely used. The reason is that the epoxy resin is workable,
This is because various properties such as moldability, electrical properties, moisture resistance, heat resistance, mechanical properties, and adhesiveness to an insert product are balanced.

In recent years, high-density mounting of electronic components has been progressing. Along with this trend, electronic component devices have become the mainstream from conventional pin insertion type packages to surface mount type packages. Surface-mounted ICs and LSIs are thin and small packages in order to increase the mounting density and lower the mounting height. It is getting thinner. Furthermore, these packages are different in mounting method from the conventional pin insertion type. That is, in the pin insertion type package, the pins are inserted into the wiring board and then soldered from the back surface of the wiring board, so that the package is not directly exposed to a high temperature. However, since the surface mount IC is temporarily fixed to the surface of the wiring board and processed by a solder bath or a reflow device, it is directly exposed to a soldering temperature (reflow temperature). As a result, when the IC package absorbs moisture, the absorbed moisture rapidly expands and vaporizes at the time of soldering, and the generated vapor pressure acts as a peeling stress. Peeling occurs between them, causing the package to crack. At present, this phenomenon has become a major problem relating to surface mount ICs.

Also, TSOP (Thin Small Outline Pac)
kage), TQFP (Thin Quad Flat Package) and other thin packages, if the epoxy resin molding compound for sealing has low fluidity, chip shifts will occur during molding, and voids will occur due to these shifts. Or the thickness balance between the upper and lower sealing epoxy resin molding materials is lost, and reflow cracks occur.

[0005]

Since the above problems cannot be avoided in an IC package sealed with a current base resin composition, the IC package is shipped in a moisture-proof package before being mounted on a wiring board. Are used after being sufficiently dried. However, these methods are laborious and costly. In addition, in the direction of reducing the spiral flow conventionally used as an index of fluidity, the composition design of the conventional epoxy resin molding material for sealing has been performed,
These methods alone have not been sufficient.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and a sealing epoxy resin molding material having a small chip shift and excellent reflow crack resistance and void resistance even in a thin surface mount type package, and a sealing material using the same. An electronic component device having a stopped element is provided.

[0007]

Means for Solving the Problems The inventors of the present invention have conducted intensive studies to solve the above-mentioned problems, and as a result, measurement of the flowability in a low shear region which cannot be evaluated by the conventional flowability evaluation method (spiral flow) has been carried out. Ascertain that the possible disk flow is related to the chip shift, and find that a specific encapsulating epoxy resin molding material that defines the disk flow can achieve the above object, and complete the present invention. Reached.

That is, the present invention provides (1) an epoxy resin, (B) a curing agent, (C) a curing accelerator, and (D) a filler as essential components, and a disc having a disk flow of 70 mm or more. The epoxy resin molding material for sealing, (2) the epoxy resin molding material for sealing according to the above (1), wherein (C) the curing accelerator contains an adduct of an organic phosphine compound and a quinone compound;
(3) The sealing epoxy resin molding material according to (2), wherein the organic phosphine compound is triphenylphosphine and the quinone compound is 1,4-benzoquinone;
(A) The epoxy resin molding material for sealing according to any one of the above (1) to (3), wherein the compounding amount of the biphenyl type epoxy resin is 50% by weight or less based on the epoxy resin, (5)
(B) The epoxy resin molding material for sealing according to any one of the above (1) to (4), wherein the curing agent contains at least 50% by weight of a phenol-aralkyl resin, and (6) a filler (D). The amount is from 78 to the epoxy molding compound for sealing.
The epoxy resin molding material for sealing according to any one of (1) to (5) above, which is 95% by weight, and (7) the epoxy resin for sealing according to any one of (1) to (7) above. The present invention relates to an electronic component device including an element sealed with a molding material.

[0009]

DETAILED DESCRIPTION OF THE INVENTION (A) used in the present invention
The epoxy resin is generally used for molding epoxy resin molding material for encapsulation and is not particularly limited. Examples thereof include phenol novolak type epoxy resin, phenol such as ortho-cresol novolak type epoxy resin, cresol, xylenol, and resorcinol. Phenols such as catechol, bisphenol A and bisphenol F and / or naphthols such as α-naphthol, β-naphthol and dihydroxynaphthalene and compounds having an aldehyde group such as formaldehyde, acetaldehyde, propionaldehyde, benzaldehyde and salicylaldehyde. Epoxidized novolak resin obtained by condensation or co-condensation in the presence of an acidic catalyst, bisphenol A, bisphenol F, bisphenol S, alkyl-substituted or unsubstituted biphenyl Glycidyl ether type epoxy resin such as diglycidyl ether such as phenol, stilbene type epoxy resin, hydroquinone type epoxy resin, phthalic acid, glycidyl ester type epoxy resin obtained by reaction of epichlorohydrin with polybasic acid such as dimer acid, diaminodiphenylmethane, A glycidylamine type epoxy resin obtained by reacting a polyamine such as isocyanuric acid with epichlorohydrin, an epoxidized product of a cocondensation resin of dicyclopentadiene with phenols and / or naphthols, an epoxy resin having a naphthalene ring,
Epoxidized aralkyl-type phenolic resins such as phenol aralkyl resins and naphthol aralkyl resins, trimethylolpropane-type epoxy resins, terpene-modified epoxy resins, and linear aliphatic epoxy resins obtained by oxidizing olefin bonds with a peracid such as peracetic acid And alicyclic epoxy resins. These may be used alone or in combination of two or more.

In particular, when a biphenyl-type epoxy resin represented by the following general formula (I) is used, the amount of the biphenyl-type epoxy resin is preferably 50% by weight or less based on the epoxy resin from the viewpoint of continuous workability.

Embedded image (Here, R ^{1 to} R ⁴ are selected from a hydrogen atom and a substituted or unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms, all of which may be the same or different. The biphenyl type epoxy resin represented by the general formula (I) is, for example, 4,4'-bis (2,3-epoxypropoxy) biphenyl or 4,4'-bis (2,3-
Epoxy propoxy) -3,3 ', 5,5'-tetramethylbiphenyl-based epoxy resin, epichlorohydrin and 4,4'-biphenol or 4,4'-
An epoxy resin obtained by reacting with (3,3 ', 5,5'-tetramethyl) biphenol is exemplified.

The curing agent (B) used in the present invention is not particularly limited and is generally used in molding epoxy resin molding compounds. For example, phenol, cresol, resorcin, catechol, bisphenol A,
Phenols such as bisphenol F, phenylphenol, aminophenol and / or α-naphthol, β-
Resin obtained by condensing or co-condensing naphthols such as naphthol and dihydroxynaphthalene with compounds having an aldehyde group such as formaldehyde, phenols and / or naphthols and dimethoxyparaxylene or bis (methoxymethyl) Examples thereof include phenol-aralkyl resins synthesized from biphenyl and aralkyl-type phenol resins such as naphthol-aralkyl resins. These may be used alone or in combination of two or more.

Above all, from the viewpoints of reflow crack resistance and adhesion, a phenol-aralkyl resin represented by the following general formula (II) is preferable, wherein R is a hydrogen atom and the average value of n is from 0 to 8. Phenol / aralkyl resins are more preferred, and specific examples include p-xylylene-type ziloc, m-xylylene-type ziloc, and the like. When this phenol / aralkyl resin is used, its compounding amount is 5 to the total amount of the curing agent in order to exhibit its performance.
0% by weight or more is preferred.

Embedded image (Here, R is selected from a hydrogen atom and a substituted or unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms, and n represents an integer of 0 to 10.)

The equivalent ratio of the epoxy resin (A) to the curing agent (B), that is, the ratio of the number of epoxy groups in the epoxy resin to the number of hydroxyl groups in the curing agent is not particularly limited. It is preferable to set the value in the range of 0.5 to 2 in order to suppress the amount, and more preferably 0.6 to 1.3. In order to obtain an epoxy resin molding compound for sealing having excellent moldability and reflow crack resistance, it is more preferably set to a range of 0.8 to 1.2.

The curing accelerator (C) used in the present invention is generally used in epoxy resin molding materials for sealing, and is not particularly limited. For example, 1,8-diaza-bicyclo (5,4) , 0) undecene-7,1,5-diaza-bicyclo (4,3,0) nonene, 5,6-dibutylamino-1,8-diaza-bicyclo (5,4,0) undecene-7 and the like Amidine compounds and these compounds include maleic anhydride, 1,4-benzoquinone, 2,5
-Tolquinone, 1,4-naphthoquinone, 2,3-dimethylbenzoquinone, 2,6-dimethylbenzoquinone, 2,
3-dimethoxy-5-methyl-1,4-benzoquinone,
Quinone compounds such as 2,3-dimethoxy-1,4-benzoquinone and phenyl-1,4-benzoquinone; compounds having an intramolecular polarization obtained by adding a compound having a π bond such as diazophenylmethane and phenol resin; benzyl Tertiary amines such as dimethylamine, triethanolamine, dimethylaminoethanol, tris (dimethylaminomethyl) phenol and derivatives thereof, and imidazoles such as 2-methylimidazole, 2-phenylimidazole and 2-phenyl-4-methylimidazole And their derivatives, organic phosphine compounds such as tributylphosphine, methyldiphenylphosphine, triphenylphosphine, tris (4-methylphenyl) phosphine, diphenylphosphine, phenylphosphine and the like, and their organic phosphines Maleic acid compound, the quinone compounds, diazo phenyl methane, and phenol resin π
Phosphorus compound having intramolecular polarization obtained by adding a compound having a bond, tetraphenylphosphonium tetraphenylborate, triphenylphosphine tetraphenylborate, 2-ethyl-4-methylimidazole tetraphenylborate, N-methylmorpholine tetraphenylborate And the like, and their derivatives. These may be used alone or in combination of two or more. Above all, an adduct of an organic phosphine compound and a quinone compound is preferable, and an adduct of triphenylphosphine and 1,4-benzoquinone is more preferable from the viewpoint of moldability and reflow crack resistance.

[0015] The amount of the curing accelerator (C) is not particularly limited as long as the curing acceleration effect is achieved.
It is preferably 2% by weight, more preferably 0.01 to 1% by weight. If it is less than 0.005% by weight, the curability in a short time tends to be inferior. If it exceeds 2% by weight, the curing rate tends to be too fast to obtain a good molded product.

The filler (D) used in the present invention is blended in a molding material for improving hygroscopicity, reducing linear expansion coefficient, improving thermal conductivity and improving strength. preferable. For example, fused silica, crystalline silica, alumina, zircon, calcium silicate, calcium carbonate, potassium titanate, silicon carbide, silicon nitride, aluminum nitride, boron nitride, beryllia, zirconia, zircon, fosterite, steatite, spinel, mullite, Examples thereof include powders of titania and the like, spherical beads and glass fibers thereof. Further, examples of the inorganic filler having a flame-retardant effect include aluminum hydroxide, magnesium hydroxide, zinc borate, zinc molybdate and the like. These inorganic fillers may be used alone or in combination of two or more. Among them, fused silica is preferred from the viewpoint of reducing the coefficient of linear expansion, and alumina is preferred from the viewpoint of high thermal conductivity. The shape of the inorganic filler is preferably spherical from the viewpoint of fluidity during molding and mold abrasion. (D) The compounding amount of the filler is preferably from 78 to 95% by weight, more preferably from 80 to 90% by weight, based on the epoxy resin molding material for sealing, from the viewpoints of reflow crack resistance and moldability.

The sealing epoxy resin molding material of the present invention comprises:
From the viewpoint of suppressing the occurrence of chip shift, the disk flow needs to be 70 mm or more, preferably 72 mm or more, and more preferably 73 mm or more. Here, the disk flow means that 5 g of an epoxy resin molding material for sealing is applied at a mold temperature of 1.
The average value of the measured values of the major axis and the minor axis of a molded product molded under the conditions of 80 ° C., a load of 78 N, and a curing time of 90 seconds.

In the present invention, (A) an epoxy resin,
An epoxy resin for sealing having a disc flow of 70 mm or more by adjusting the combination and the amount of components used as (B) a curing agent, (C) a curing accelerator, (D) a filler and other additives. A molding material can be obtained.
The selection of (A) an epoxy resin, (B) a curing agent and (C) a curing accelerator, and the blending amount of (D) a filler are particularly important.

The sealing epoxy resin molding material of the present invention may contain, if necessary, epoxy silane, mercapto silane, amino silane, alkyl silane, ureido silane, and vinyl silane in order to enhance the adhesiveness between the resin component and the filler. And other known silane compounds, titanium compounds, aluminum chelates, and aluminum / zirconium compounds. Examples thereof include vinyltrichlorosilane, vinyltriethoxysilane, vinyltris (β-methoxyethoxy) silane, γ-methacryloxypropyltrimethoxysilane, β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, and γ-glycol. Sidoxypropyltrimethoxysilane, γ-glycidoxypropylmethyldimethoxysilane, vinyltriacetoxysilane, γ-mercaptopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, γ-anilinopropyltrimethoxysilane, γ-aniline Linopropylmethyldimethoxysilane, γ- [bis (β-hydroxyethyl)] aminopropyltriethoxysilane, N-β- (aminoethyl)
-Γ-aminopropyltrimethoxysilane, γ- (β-
(Aminoethyl) aminopropyldimethoxymethylsilane, N- (trimethoxysilylpropyl) ethylenediamine, N- (dimethoxymethylsilylisopropyl) ethylenediamine, methyltrimethoxysilane, dimethyldimethoxysilane, methyltriethoxysilane, N-β
Silane coupling agents such as-(N-vinylbenzylaminoethyl) -γ-aminopropyltrimethoxysilane, γ-chloropropyltrimethoxysilane, hexamethyldisilane, vinyltrimethoxysilane, γ-mercaptopropylmethyldimethoxysilane, Isopropyl triisostearoyl titanate, isopropyl tris (dioctyl pyrophosphate) titanate, isopropyl tri (N-aminoethyl-aminoethyl) titanate, tetraoctyl bis (ditridecyl phosphite)
Titanate, tetra (2,2-diallyloxymethyl-
1-butyl) bis (ditridecyl) phosphite titanate, bis (dioctylpyrophosphate) oxyacetate titanate, bis (dioctylpyrophosphate) ethylene titanate, isopropyltrioctanoyl titanate, isopropyldimethacrylisostearoyl titanate, isopropyltridodecylbenzenesulfonyl titanate And isopropylisostearoyl diacryl titanate, isopropyl tri (dioctyl phosphate) titanate, isopropyl tricumyl phenyl titanate, tetraisopropyl bis (dioctyl phosphite) titanate, and other titanate-based coupling agents. Two or more kinds may be used in combination.

The amount of the coupling agent is preferably 0.05 to 3% by weight, more preferably 0.1 to 2.5% by weight, based on the filler (D). If it is less than 0.05% by weight, the adhesion to the frame tends to decrease, and if it exceeds 3% by weight, the moldability of the package tends to decrease.

The epoxy resin molding material for encapsulation of the present invention includes a brominated epoxy resin, a phosphorus compound such as antimony trioxide, a phosphoric acid ester and red phosphorus, melamine, melamine cyanurate, a melamine-modified phenol resin, and a guanamine-modified phenol. Conventionally known flame retardants such as nitrogen-containing compounds such as resins, phosphorus / nitrogen-containing compounds such as cyclophosphazene, and metal compounds such as zinc oxide, iron oxide, molybdenum oxide, and ferrocene can be added as needed.

Further, an anion exchanger may be added to the sealing epoxy resin molding material of the present invention from the viewpoint of improving the moisture resistance and high-temperature storage characteristics of semiconductor elements such as ICs. The anion exchanger is not particularly limited, and conventionally known anion exchangers can be used. For example, hydrotalcites, magnesium, aluminum, titanium,
Examples include hydrated oxides of elements selected from zirconium and bismuth, and these can be used alone or in combination of two or more. Among them, the following general formula (III)
Is preferred.

Embedded image Mg _1-X Al _X (OH) ₂ (CO ₃ ) _{X / 2} · mH ₂ O (III) (0 <X ≦ 0.5, m is a positive integer)

Further, in the epoxy resin molding material for sealing of the present invention, release agents such as higher fatty acids, metal salts of higher fatty acids, ester waxes, polyolefin waxes, polyethylene, polyethylene oxide, etc.
A coloring agent such as carbon black, a stress relieving agent such as silicone oil or silicone rubber powder, and the like can be added as necessary.

The epoxy resin molding material for sealing of the present invention comprises:
As long as the various raw materials can be uniformly dispersed and mixed, it can be prepared by any method, but as a general method,
A method in which raw materials having a predetermined compounding amount are sufficiently mixed by a mixer or the like, melt-kneaded by a mixing roll, an extruder, or the like, and then cooled and pulverized can be used. It is easy to use if it is tableted with dimensions and weight that match the molding conditions.

The electronic component device obtained by sealing the element with the sealing epoxy resin molding material obtained by the present invention includes a support member such as a lead frame, a wired tape carrier, a wiring board, glass, and a silicon wafer. An active element such as a semiconductor chip, a transistor, a diode, and a thyristor, and an element such as a passive element such as a capacitor, a resistor and a coil are mounted thereon, and necessary portions are sealed with the epoxy resin molding material for sealing of the present invention. And electronic component devices.
As such an electronic component device, for example, a semiconductor element is fixed on a lead frame, and a terminal portion of an element such as a bonding pad and a lead portion are connected by wire bonding or a bump, and then the sealing epoxy resin of the present invention is used. DI sealed by transfer molding using molding material
P (DualInline Package), PLCC (Plastic Leaded)
Chip Carrier), QFP (QuadFlat Package), SO
P (Small Outline Package), SOJ (Small Outline Package)
J-lead package), TSOP (Thin Small Outline Pac)
kage), TQFP (ThinQuad Flat Package), and other general resin-encapsulated ICs, and a TCP (Tape Carrier Package) in which a semiconductor chip connected to a tape carrier by a bump is sealed with the epoxy resin molding material for sealing of the present invention. ), Wire bonding on the wiring formed on the wiring board or glass,
Active elements such as semiconductor chips, transistors, diodes, and thyristors and / or passive elements such as capacitors, resistors, and coils connected by flip chip bonding or soldering are sealed with the epoxy resin molding material for sealing of the present invention. COB (Chip On Board) module, hybrid IC, multi-chip module, device mounted on the surface of organic substrate with terminals for wiring board connection formed on the back surface, and wiring formed on the device and organic substrate by bump or wire bonding After the connection, a BGA (Ball Grid Arra) in which the element is sealed with the epoxy resin molding material for sealing of the present invention.
y), CSP (Chip Size Package) and the like.
Further, the epoxy resin molding material for encapsulation of the present invention can be effectively used for a printed circuit board.

The most common method for sealing an element using the sealing epoxy resin molding material of the present invention is a low pressure transfer molding method.
A compression molding method or the like may be used.

[0027]

Next, the present invention will be described with reference to examples, but the scope of the present invention is not limited to these examples.

Examples 1-10, Comparative Examples 1-2 Epoxy equivalent as epoxy resin 195, softening point 65 ° C
O-cresol novolak type epoxy resin (Epoxy resin 1: ESCN-19 manufactured by Sumitomo Chemical Co., Ltd.)
0) and / or a biphenyl-type epoxy resin having an epoxy equivalent of 196 and a melting point of 106 ° C. (Epoxy resin 2: Epicoat YX-4000 manufactured by Yuka Shell Epoxy Co., Ltd.)
H), a phenol aralkyl resin having a softening point of 70 ° C. as a curing agent (curing agent 1: trade name MILEX XL-225 manufactured by Mitsui Chemicals, Inc.) and / or a phenol novolak resin (curing agent 2: trade name manufactured by Meiwa Kasei Co., Ltd.) H-10
0), triphenylphosphine and 1,1 as a curing accelerator
Adduct with 4-benzoquinone (curing accelerator 1) or phenol novolak salt of diazabicycloundecene (curing accelerator 2: trade name SA-84 manufactured by San Apro Co., Ltd.)
1), average particle size 5.5 μm, specific surface area 5.
0 m ² / g angular fused silica, spherical fused silica having an average particle size of 30 μm and a specific surface area of 3.8 m ² / g, epoxysilane as a coupling agent (trade name A-187, manufactured by Nippon Unicar Co., Ltd.), and a flame retardant Bisphenol A type brominated epoxy resin having a bromine content of 48% by weight (brominated epoxy: ESB-400T manufactured by Sumitomo Chemical Co., Ltd.)
And antimony trioxide (trade name: RX, manufactured by Sumitomo Metal Mining Co., Ltd.), polyethylene wax (trade name: PED-191, manufactured by Clariant Japan Co., Ltd.) and carnauba wax (trade name: CERARIKA NODA) as a release agent, carbon black as a colorant (Product name MONARCH80 manufactured by Cabot Specialty Chemicals, Inc.
0) were blended in parts by weight as shown in Table 1, and after premixing (dry blending), kneading at a kneading temperature of 80 ° C. and a kneading time of 10 minutes was performed by kneading with a twin-roll mill, followed by cooling and pulverization.
The epoxy resin molding materials for sealing of Examples 1 to 10 and Comparative Examples 1 and 2 were produced.

[0029]

[Table 1]

The epoxy resin molding materials for sealing of the produced examples and comparative examples were evaluated by the following tests. In addition,
The epoxy resin molding material for sealing was molded by a transfer molding machine under the conditions of a mold temperature of 180 ° C., a molding pressure of 6.9 MPa, and a curing time of 90 seconds. Post-curing is 175 ° C
For 5 hours. (1) Spiral flow (indicator of fluidity) An epoxy resin molding material for sealing is molded under the above conditions using a mold for spiral flow measurement according to EMMI-1-66, and the flow distance (cm) is determined. Was. (2), disk flow 200mm (W) × 200mm (D) × 25mm (H)
Upper mold and 200mm (W) × 200mm (D) × 15m
Using a flat plate mold for disk flow measurement having a lower mold of m (H), 5 g of a sealing epoxy resin molding material weighed by an upper balance is placed on the center of the lower mold heated to 180 ° C. After 5 seconds, the upper mold heated to 180 ° C. was closed, and a load of 78 N was applied.
The molding was compression-molded under the condition of a curing time of 90 seconds, the major axis (mm) and the minor axis (mm) of the molded article were measured with calipers, and the average value (mm) was used as the disk flow. (3) Al peel adhesive strength Aluminum (Al) peel adhesive strength is obtained by laying an aluminum foil having a thickness of 30 μm on a mold, and using a transfer molding machine to mold an epoxy resin molding material for sealing at a mold temperature of 180 ° C. and a molding pressure of 6.9.
MPa, curing time 90 seconds, 5 minutes at 175 ℃
A test piece (127 mm ×
12.7 mm × 4.0 mm) was peeled off using Tensilon (RTM-100 manufactured by Orientec) at a peeling speed of 5 mm.
Under a condition of 0 mm / min, an aluminum foil having a width of 12.7 mm was peeled off at right angles, and the strength (N / m) was measured. (4) Chip shift and void 8.6 mm x 15.0 m on 42 alloy lead frame (manufactured by Hitachi Cable, Ltd.) having a LOC (Lead On Chip) structure.
The thickness from the top of the lead frame to the top of the package, on which a silicone chip of mx 0.28 mm is mounted, is 0.
TSOP (Thin Small Outline Packag) with a thickness of 22 mm and a thickness of 0.28 mm from the lower surface of the chip to the lower surface of the package
e) using an epoxy resin molding compound for sealing under the above conditions (ATOM TSOP 24 manufactured by M-Tex Matsumura Corporation)
p) at 175 ° C., 9.8 MPa, 90 s, and the chip shift and the appearance of well voids were observed. Regarding the chip shift, a shift amount of less than 20 μm was good, and a shift amount of 20 μm or more was bad. As for voids, those having a void amount of less than 0.3 mm were evaluated as good, and those having a void amount of 0.3 mm or more were evaluated as defective. (5) Reflow crack resistance TSOP (Thin Small) produced in the same manner as in (4) above
Outline Package) after curing at 175 ° C for 5 hours,
85 ° C / 65% RH and 85 ° C / 85% RH
After humidification for 68 hours, reflow treatment was performed at 240 ° C. for 15 seconds, and the presence or absence of cracks was observed. If neither external cracks nor internal cracks were found, it was good. Were acceptable, and those that occurred in both cases were regarded as defective. (6) Continuous workability Using a mold capable of molding 60 QFP80 pin packages with external dimensions of 14 mm × 20 mm × 2 mm in one shot, a molding epoxy resin molding material at 175 ° C. and 6.9 M is used.
Continuous molding was performed for 50 shots under the conditions of pa and 90 seconds, the sticking of the cull portion was observed, and the number of shots at which sticking was observed was evaluated. When sticking was not observed in 50 consecutive shots, “> 50” was displayed in Table 2. Table 2 shows the evaluation results.

[0031]

[Table 2]

In Comparative Examples 1 and 2 in which the disc flow was out of the range specified by the present invention, chip shift and voids were observed, and the reflow crack resistance was poor. On the other hand, Examples 1 to 10 all have little occurrence of chip shift and voids and have good reflow crack resistance. In particular, Example 1 in which an epoxy resin and a curing agent were used in a preferred composition, and the blending amount of the inorganic filler was in the range of 78 to 95% by weight.
Nos. 4 to 4 show remarkably excellent reflow crack resistance and good continuous workability.

[0033]

According to the present invention, when an electronic component such as an IC or an LSI is encapsulated by using the epoxy resin molding material for encapsulation according to the present invention, a thin surface mount type package such as TSOP as shown in the embodiment can be obtained. In addition, since an electronic component device having a small chip shift, good reflow crack resistance and good void resistance, and excellent reliability can be obtained, its industrial value is great.

Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat II (Reference) H01L 23/29 H01L 23/30 R 23/31 F term (Reference) 4J002 CC03X CC04X CC05X CD01W CD02W CD03W CD04W CD06W CD10W CD13W CD17W CD20W CE00X DE077 DE097 DE137 DE147 DE187 DE237 DF017 DJ007 DJ017 DK007 DL007 EN026 EN106 EU096 EU116 EW016 EY016 FA047 FA087 FD017 FD130 FD14X FD156 GQ01 GQ05 4J036 AB07 AB12 AB17 AC01 AC05 AD07 AD08 AD10 DA01 AF05 DA05 AF05 DA05 AF05 DC10 DC12 DC40 DC41 DC46 DD07 DD09 FA02 FA03 FA04 FA05 FB07 FB08 JA07 4M109 AA01 EA03 EB03 EB04 EB11 EC05 EC20

Claims (7)

[Claims] (1) an epoxy resin, (B) a curing agent,
An epoxy resin molding material for encapsulation comprising (C) a curing accelerator and (D) a filler as essential components and having a disk flow of 70 mm or more. 2. The epoxy resin molding material for sealing according to claim 1, wherein (C) the curing accelerator contains an adduct of an organic phosphine compound and a quinone compound. 3. The epoxy resin molding material for sealing according to claim 2, wherein the organic phosphine compound is triphenylphosphine and the quinone compound is 1,4-benzoquinone. 4. The composition according to claim 1, wherein the amount of the biphenyl type epoxy resin is not more than 50% by weight based on the epoxy resin.
4. The epoxy resin molding material for sealing according to any one of claims 1 to 3. 5. The epoxy resin molding material for sealing according to claim 1, wherein (B) the curing agent contains at least 50% by weight of a phenol-aralkyl resin. 6. The compounding amount of the filler (D) is 78 to 95% by weight based on the epoxy resin molding material for sealing.
5. The epoxy resin molding material for sealing according to any one of 5. 7. An electronic component device comprising an element sealed with the epoxy resin molding material for sealing according to claim 1.