JP2002038224A - Composite material, its production method and radiating sheet - Google Patents
Composite material, its production method and radiating sheetInfo
- Publication number
- JP2002038224A JP2002038224A JP2000225189A JP2000225189A JP2002038224A JP 2002038224 A JP2002038224 A JP 2002038224A JP 2000225189 A JP2000225189 A JP 2000225189A JP 2000225189 A JP2000225189 A JP 2000225189A JP 2002038224 A JP2002038224 A JP 2002038224A
- Authority
- JP
- Japan
- Prior art keywords
- fine particles
- composite material
- high hardness
- carbon
- hardness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000002131 composite material Substances 0.000 title claims abstract description 46
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- 239000010419 fine particle Substances 0.000 claims abstract description 97
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 43
- 229910052799 carbon Inorganic materials 0.000 claims abstract description 42
- 229910052751 metal Inorganic materials 0.000 claims abstract description 28
- 239000002184 metal Substances 0.000 claims abstract description 28
- 239000011159 matrix material Substances 0.000 claims abstract description 21
- 239000000463 material Substances 0.000 claims description 25
- 238000000465 moulding Methods 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 3
- 239000002245 particle Substances 0.000 abstract description 18
- 229910000838 Al alloy Inorganic materials 0.000 abstract description 9
- 239000006185 dispersion Substances 0.000 abstract 1
- 238000012856 packing Methods 0.000 abstract 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 10
- 229910052782 aluminium Inorganic materials 0.000 description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 8
- 229910010271 silicon carbide Inorganic materials 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 7
- 239000000203 mixture Substances 0.000 description 6
- 230000017525 heat dissipation Effects 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 3
- 239000011812 mixed powder Substances 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000004931 aggregating effect Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 239000011156 metal matrix composite Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical compound C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 description 1
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Manufacture Of Alloys Or Alloy Compounds (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は金属をマトリックス
相とし、高硬度の材質製の微粒子を分散相とした複合材
料及びその製造方法並びに放熱板に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a composite material using a metal as a matrix phase and fine particles made of a material of high hardness as a dispersed phase, a method for producing the same, and a heat sink.
【０００２】[0002]
【従来の技術】半導体装置の放熱板（ヒートシンク）を
金属製とした場合は、金属と半導体装置の熱膨張率の差
が大きく、半導体装置が破損する虞があるため、従来、
放熱板として金属マトリックス相にセラミックスを分散
させたもの、例えばＳｉＣ粒子をアルミニウム基材に分
散させた複合材料が知られている。前記複合材料を放熱
板に使用する場合は、電子部品を搭載する側の面を所定
の粗さに加工したり、穴開け加工を行う必要がある。と
ころが前記複合材料は非常に高硬度の材料であるため、
前記加工が困難で加工コストも高くなる。2. Description of the Related Art When a heat sink (heat sink) of a semiconductor device is made of metal, the difference in coefficient of thermal expansion between the metal and the semiconductor device is large, and the semiconductor device may be damaged.
As a heat radiating plate, a material in which ceramics are dispersed in a metal matrix phase, for example, a composite material in which SiC particles are dispersed in an aluminum base material is known. When the composite material is used for a heat sink, the surface on which the electronic component is to be mounted must be processed to a predetermined roughness or a hole must be formed. However, since the composite material is a very hard material,
The processing is difficult and the processing cost increases.
【０００３】この問題を解消するものとして特開平１１
−８７５８１号公報には、図３に示すように、金属マト
リックス４２ａ中に分散粒子４２ｂを含有する金属基複
合材料４２と、その表面に固着して配設された加工用部
材（加工容易材）４３とよりなる複合材料４１が提案さ
れている。加工用部材４３は熱膨張率が金属基複合材料
４２の熱膨張率の±６０％以内であるとともに、ビッカ
ース硬さＨｖが１５０以下となっている。この複合材料
４１は加工用部材４３と分散粒子４２ｂとをマトリック
ス用の溶融金属によって高圧条件下で鋳込むことにより
製造される。To solve this problem, Japanese Patent Application Laid-Open No.
JP-A-87581 discloses, as shown in FIG. 3, a metal matrix composite material 42 containing dispersed particles 42b in a metal matrix 42a, and a processing member (an easily processable material) fixedly disposed on the surface thereof. 43, a composite material 41 has been proposed. The processing member 43 has a coefficient of thermal expansion within ± 60% of the coefficient of thermal expansion of the metal-based composite material 42 and a Vickers hardness Hv of 150 or less. The composite material 41 is manufactured by casting a processing member 43 and dispersed particles 42b with a molten metal for a matrix under high pressure conditions.
【０００４】[0004]
【発明が解決しようとする課題】ところが、特開平１１
−８７５８１号公報に開示された複合材料４１のように
加工用部材（加工容易材）４３を金属基複合材料４２の
片側に配設した場合は、加工用部材４３と金属基複合材
料４２との熱膨張係数の差により、鋳造後に複合材料４
１に変形（反り）が発生するという問題がある。SUMMARY OF THE INVENTION However, Japanese Patent Application Laid-Open
When the processing member (easy processing material) 43 is disposed on one side of the metal-based composite material 42 as in the composite material 41 disclosed in Japanese Patent No. Due to the difference in the coefficient of thermal expansion, the composite 4
1 has a problem that deformation (warpage) occurs.
【０００５】本発明は前記従来の問題点に鑑みてなされ
たものであって、その第１の目的は製造が容易でしかも
加工性が良好な複合材料を提供することにあり、第２の
目的はその複合材料の製造方法を提供することにある。
また、第３の目的は前記複合材料を使用した放熱板を提
供することにある。The present invention has been made in view of the above-mentioned conventional problems, and a first object of the present invention is to provide a composite material which is easy to manufacture and has good workability. Is to provide a method for producing the composite material.
Further, a third object is to provide a heat sink using the composite material.
【０００６】[0006]
【課題を解決するための手段】前記第１の目的を達成す
るため請求項１に記載の発明では、金属をマトリックス
相とし、高硬度の材質製の微粒子の周囲にカーボン微粒
子を凝集させたものを分散相とした。なお、高硬度の材
質とは炭化珪素（ＳｉＣ）程度の硬度を有する材質を意
味する。According to the first aspect of the present invention, in order to achieve the first object, a metal is used as a matrix phase and carbon fine particles are aggregated around fine particles made of a material having high hardness. Was used as a dispersed phase. Note that a material having high hardness means a material having a hardness of about silicon carbide (SiC).
【０００７】従って、この発明の複合材料では高硬度の
材質製の微粒子の一部が高硬度微粒子より硬度の低いカ
ーボン微粒子と置換された状態となるため、複合材料の
熱伝導率、熱膨張係数及び強度を維持したまま加工性が
向上する。また、高硬度微粒子の周囲にカーボン微粒子
が凝集した状態のため、凝集し易いカーボン微粒子を使
用しても、複合材料全体に高硬度微粒子とカーボン微粒
子とが均一化された状態で分散され、複合材料の物性が
安定する。Accordingly, in the composite material of the present invention, since a part of the fine particles made of a material having a high hardness is replaced with carbon particles having a lower hardness than the fine particles of the high hardness, the thermal conductivity and the coefficient of thermal expansion of the composite material are reduced. And the workability is improved while maintaining the strength. In addition, since the carbon fine particles are aggregated around the high hardness fine particles, even when the carbon fine particles that easily aggregate are used, the high hardness fine particles and the carbon fine particles are dispersed in a uniform state throughout the composite material, and the composite material is dispersed. The physical properties of the material are stabilized.
【０００８】請求項２に記載の発明では、請求項１に記
載の発明において、前記金属は高熱伝導率を有する。高
熱伝導率とはアルミニウムの熱伝導率と同程度以上の熱
伝導率であることを意味する。従って、この発明では、
複合材料の熱伝導率が高くなって放熱性が向上する。According to a second aspect of the present invention, in the first aspect of the invention, the metal has a high thermal conductivity. High thermal conductivity means that the thermal conductivity is equal to or higher than the thermal conductivity of aluminum. Therefore, in the present invention,
The thermal conductivity of the composite material is increased, and the heat dissipation is improved.
【０００９】第２の目的を達成するため請求項３に記載
の発明では、高硬度の材質製の微粒子とカーボン微粒子
とを混合して、周囲にカーボン微粒子を凝集させた高硬
度微粒子を成形型内に充填した後、マトリックス相とな
る金属を溶融したものを加圧状態で鋳込むようにした。In order to achieve the second object, according to the third aspect of the present invention, fine particles made of a material having high hardness are mixed with carbon fine particles, and the high-hardness fine particles obtained by agglomerating carbon fine particles around the molding die are formed. After filling the inside, a molten metal of a matrix phase was cast under pressure.
【００１０】この発明の製造方法では、高硬度微粒子と
カーボン微粒子とが予め混合されて、高硬度微粒子の周
囲にカーボン微粒子が凝集された状態の混合物（混合粉
体）が形成される。そして、その混合物が成形型内に充
填されるため、単純に双方の微粒子を成形型内に入れて
混合した場合と異なり、高硬度微粒子とカーボン微粒子
とが成形型内に均一化された状態で分散される。その状
態で、マトリックス相となる溶融金属が加圧状態で成形
型内に注入されるため、複合材料は金属マトリックス相
に高硬度微粒子とカーボン微粒子とが成形型内に均一化
された状態で分散された構造となる。In the manufacturing method of the present invention, the high-hardness fine particles and the carbon fine particles are preliminarily mixed to form a mixture (mixed powder) in which the fine carbon particles are aggregated around the high-hardness fine particles. And since the mixture is filled in the mold, unlike the case where both the fine particles are simply put into the mold and mixed, the high-hardness fine particles and the carbon fine particles are uniformed in the mold. Distributed. In this state, the molten metal that will be the matrix phase is injected into the mold under pressure, so that the composite material is dispersed in the metal matrix phase in a state where the high-hardness fine particles and carbon fine particles are homogenized in the mold. The structure is as follows.
【００１１】第３の目的を達成するため請求項４に記載
の発明の放熱板は、請求項１又は請求項２に記載の複合
材料を使用した。従って、この発明では、放熱板の電子
部品を搭載する側の面を所定の粗さに加工したり、穴開
け加工を行う場合に、高硬度微粒子だけが分散相を構成
している複合材料に比較して加工が容易となる。[0011] In order to achieve the third object, a radiator plate according to a fourth aspect of the present invention uses the composite material according to the first or second aspect. Therefore, according to the present invention, when the surface of the heat sink on the side on which the electronic component is mounted is processed to a predetermined roughness or when a hole is formed, a composite material in which only high-hardness fine particles constitute a dispersed phase is obtained. Processing becomes easier in comparison.
【００１２】[0012]
【発明の実施の形態】以下、本発明を具体化した一実施
の形態を図１及び図２に従って説明する。図１（ａ）は
複合材料の模式断面図である。複合材料１はマトリック
ス相２が金属で構成されている。分散相３は図１（ｂ）
に示すように、高硬度の材質製の微粒子（以下、高硬度
微粒子という）３ａの周囲にカーボン微粒子３ｂが凝集
したもので構成されている。DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to FIGS. FIG. 1A is a schematic sectional view of a composite material. In the composite material 1, the matrix phase 2 is composed of a metal. The dispersed phase 3 is shown in FIG.
As shown in FIG. 2, carbon particles 3b are aggregated around fine particles (hereinafter, referred to as high-hardness fine particles) 3a made of a material having high hardness.
【００１３】マトリックス相２の金属には高熱伝導率を
有するもの、即ちアルミニウムの熱伝導率と同程度以上
の熱伝導率を有する金属が使用されている。この実施の
形態ではでマトリックス相２の金属にアルミニウム又は
アルミニウム合金（以下、単にアルミニウム合金と言
う）が使用されている。As the metal of the matrix phase 2, a metal having a high thermal conductivity, that is, a metal having a thermal conductivity equal to or higher than that of aluminum is used. In this embodiment, aluminum or an aluminum alloy (hereinafter simply referred to as an aluminum alloy) is used as the metal of the matrix phase 2.
【００１４】高硬度の材質としては炭化珪素（ＳｉＣ）
と同程度の熱伝導率及び熱膨張率を有するセラミックス
が使用されている。この実施の形態では高硬度微粒子３
ａとしてＳｉＣの微粒子が使用されている。高硬度微粒
子３ａ及びカーボン微粒子３ｂの粒度や充填量は、複合
材料１に要求される特性（物性）に応じて設定される
が、高硬度微粒子３ａの粒子径は例えば数μｍ〜１００
μｍ程度で、カーボン微粒子３ｂの粒子径は例えば数ｎ
ｍ〜１００ｎｍ程度である。この実施の形態では高硬度
微粒子３ａとして粒子径が１０μｍのものと１００μｍ
のものとの混合物が使用され、カーボン微粒子３ｂとし
ては粒子径が０．０３５μｍ即ち、３５ｎｍのものが使
用されている。高硬度微粒子３ａ及びカーボン微粒子３
ｂの充填率は体積％で５０〜７０％で、そのうちカーボ
ン微粒子３ｂの高硬度微粒子３ａに対する割合が数％以
上となっている。Silicon carbide (SiC) is used as a material having high hardness.
Ceramics having the same thermal conductivity and thermal expansion coefficient as those of the above are used. In this embodiment, the high hardness fine particles 3
As a, fine particles of SiC are used. The particle size and filling amount of the high-hardness fine particles 3a and the carbon fine particles 3b are set according to the characteristics (physical properties) required for the composite material 1.
μm, the particle diameter of the carbon fine particles 3b is, for example, several n
m to about 100 nm. In this embodiment, the high-hardness fine particles 3a having a particle diameter of 10 μm and 100 μm
The carbon fine particles 3b have a particle diameter of 0.035 μm, that is, 35 nm. High hardness fine particles 3a and carbon fine particles 3
The filling rate of b is 50 to 70% by volume, and the ratio of the carbon fine particles 3b to the high-hardness fine particles 3a is several percent or more.
【００１５】次に前記のように構成された複合材料１の
製造方法を図２に基づいて説明する。複合材料１は、２
段階に分けて製造される。第１段階では分散相を構成す
る高硬度微粒子３ａ及びカーボン微粒子３ｂの混合物
（混合粉体）が調整される。混合物はＳｉＣ粉末（微粒
子）とカーボン粉末（微粒子）とをボールミルにて混合
することにより調整される。カーボン微粒子３ｂは粒子
径が小さい（０．０３５μｍ）ため凝集し易いが、ボー
ルミルで混合することにより、高硬度微粒子３ａ（Ｓｉ
Ｃ微粒子）の周囲にカーボン微粒子３ｂが凝集したもの
が比較的容易に得られる。Next, a method for manufacturing the composite material 1 configured as described above will be described with reference to FIG. Composite material 1 is 2
Manufactured in stages. In the first stage, a mixture (mixed powder) of the high hardness fine particles 3a and the carbon fine particles 3b constituting the dispersed phase is prepared. The mixture is prepared by mixing SiC powder (fine particles) and carbon powder (fine particles) in a ball mill. Although the carbon fine particles 3b have a small particle diameter (0.035 μm), they are easily aggregated. However, the high hardness fine particles 3a (Si
Carbon fine particles 3b aggregated around the (C fine particles) can be obtained relatively easily.
【００１６】次にこの混合物を図２（ａ）に示すよう
に、成形型４内に充填する。この実施の形態では成形型
４に金型が使用されている。高硬度微粒子３ａとカーボ
ン微粒子３ｂとを成形型４内に入れて混合した場合は、
高硬度微粒子３ａとカーボン微粒子３ｂとが偏った状態
で充填され易い。しかし、高硬度微粒子３ａ（ＳｉＣ粒
子）の周囲にカーボン微粒子３ｂが凝集したものが予め
調整されて、それが成形型内に充填されるため、高硬度
微粒子３ａとカーボン微粒子３ｂとが成形型４内に均一
化された状態で分散される。Next, as shown in FIG. 2A, the mixture is filled in a molding die 4. In this embodiment, a mold is used for the mold 4. When the high hardness fine particles 3a and the carbon fine particles 3b are put in the mold 4 and mixed,
The high-hardness fine particles 3a and the carbon fine particles 3b are easily filled in an uneven state. However, the aggregate of the carbon fine particles 3b around the high hardness fine particles 3a (SiC particles) is adjusted in advance, and is filled in the molding die, so that the high hardness fine particles 3a and the carbon fine particles 3b are combined with the molding die 4. Dispersed in a uniform state.
【００１７】その状態で溶融状態のアルミニウム合金５
が成形型４内に加圧状態で注入されて、図２（ｂ）の状
態となる。そして、所定時間経過後、成形型４が冷却さ
れてアルミニウム合金が凝固、冷却される。そして、製
品としての複合材料１が成形型４から取り出される。In this state, the molten aluminum alloy 5
Is injected into the mold 4 in a pressurized state, and the state shown in FIG. After a lapse of a predetermined time, the mold 4 is cooled, and the aluminum alloy is solidified and cooled. Then, the composite material 1 as a product is taken out of the mold 4.
【００１８】前記のようにして製造された複合材料１
は、例えば半導体装置用の放熱部材として使用される。
その場合、複合材料１は、電子部品を搭載する側の面が
所定の粗さに加工されたり、必要に応じて穴開け加工が
行われる。このとき、従来の複合材料と異なり、分散相
３の一部が高硬度微粒子３ａに代えてカーボン微粒子３
ｂで構成されているため、加工が容易になる。The composite material 1 manufactured as described above
Is used, for example, as a heat dissipation member for a semiconductor device.
In that case, the surface of the composite material 1 on which the electronic component is mounted is processed to a predetermined roughness, or a hole is formed as necessary. At this time, unlike the conventional composite material, a part of the dispersed phase 3 is replaced with the carbon fine particles 3 instead of the high-hardness fine particles 3a.
Since it is composed of b, processing becomes easy.
【００１９】この実施の形態では以下の効果を有する。 （１） 複合材料１が、金属をマトリックス相２とし、
高硬度微粒子３ａの周囲にカーボン微粒子３ｂを凝集さ
せたものを分散相３としている。従って、分散相３全体
を高硬度微粒子３ａで構成したものに比較して、表面の
切削（研削）加工や穴開け加工等が容易となる。This embodiment has the following effects. (1) The composite material 1 has a metal as a matrix phase 2,
The dispersed phase 3 is obtained by agglomerating carbon fine particles 3b around the high hardness fine particles 3a. Therefore, as compared with the case where the entire dispersed phase 3 is composed of the high-hardness fine particles 3a, the surface cutting (grinding) processing, the boring processing, and the like are facilitated.
【００２０】（２） 高硬度微粒子３ａの周囲にカーボ
ン微粒子３ｂを凝集させたものを分散相３としているた
め、マトリックス相２に高硬度微粒子３ａ及びカーボン
微粒子３ｂを均一化した状態で分散させ易くなり、反り
等の熱変形が防止される。(2) Since the dispersed phase 3 is formed by aggregating the carbon fine particles 3b around the high hardness fine particles 3a, it is easy to disperse the high hardness fine particles 3a and the carbon fine particles 3b in the matrix phase 2 in a uniform state. And thermal deformation such as warpage is prevented.
【００２１】（３） マトリックス相２としてアルミニ
ウムの熱伝導率と同程度以上の熱伝導率を有する金属が
使用されている。従って、半導体装置等の電子部品の放
熱材として使用するのに好適となる。(3) As the matrix phase 2, a metal having a thermal conductivity equal to or higher than that of aluminum is used. Therefore, it is suitable for use as a heat dissipating material for electronic components such as semiconductor devices.
【００２２】（４） マトリックス相２がアルミニウム
又はアルミニウム合金であるため、軽量で必要な熱伝導
性を確保できる。 （５） 熱伝導率が高いＳｉＣが高硬度微粒子３ａとし
て使用され、熱伝導率の高いカーボン微粒子３ｂが分散
相３に使用されている。従って、分散相３の充填率を高
めて複合材料１の熱膨張率を半導体装置の熱膨張率に近
づけた場合でも複合材料１の熱伝導率を高くでき、放熱
材として使用したときの放熱効率が向上する。(4) Since the matrix phase 2 is aluminum or an aluminum alloy, it is lightweight and can secure necessary thermal conductivity. (5) SiC having a high thermal conductivity is used as the high hardness fine particles 3a, and carbon fine particles 3b having a high thermal conductivity are used as the dispersed phase 3. Therefore, even when the filling factor of the dispersed phase 3 is increased and the thermal expansion coefficient of the composite material 1 approaches the thermal expansion coefficient of the semiconductor device, the thermal conductivity of the composite material 1 can be increased, and the heat radiation efficiency when used as a heat radiating material Is improved.
【００２３】（６） 高硬度微粒子３ａは粒子径が数μ
ｍ〜１００μｍ程度で、カーボン微粒子３ｂは粒子径が
数ｎｍ〜百ｎｍ程度である。従って、高硬度微粒子３ａ
の周囲にカーボン微粒子３ｂが適度に凝集した状態に調
整し易い。(6) The high-hardness fine particles 3a have a particle diameter of several μm.
m to about 100 μm, and the particle diameter of the carbon fine particles 3b is about several nm to about 100 nm. Therefore, the high hardness fine particles 3a
Is easily adjusted to a state in which the carbon fine particles 3b are appropriately aggregated around the periphery.
【００２４】（７） 高硬度微粒子３ａとカーボン微粒
子３ｂとがボールミルで混合される。従って、高硬度微
粒子３ａの周囲にカーボン微粒子３ｂが適度に凝集した
状態の混合物を調整し易い。(7) The high hardness fine particles 3a and the carbon fine particles 3b are mixed by a ball mill. Therefore, it is easy to adjust the mixture in a state where the carbon fine particles 3b are appropriately aggregated around the high hardness fine particles 3a.
【００２５】実施の形態は前記に限定されるものではな
く、例えば次のように構成してもよい。 ○ マトリックス相２の金属はケイ素を含むアルミニウ
ムと同程度以上の熱伝導率を有するものであればよく、
アルミニウム合金に限らず他の金属例えば銅を使用して
もよい。この場合、熱伝導率がアルミニウム合金より高
いため、複合材料１を放熱材として使用する際に放熱効
率が向上する。The embodiment is not limited to the above, and may be configured as follows, for example. ○ The metal of the matrix phase 2 only needs to have a thermal conductivity equal to or higher than that of aluminum containing silicon,
Not limited to aluminum alloys, other metals such as copper may be used. In this case, since the heat conductivity is higher than that of the aluminum alloy, the heat dissipation efficiency is improved when the composite material 1 is used as a heat dissipation material.
【００２６】○ 分散相３を構成する高硬度微粒子３ａ
は炭化ケイ素の微粒子に限らず、炭化ケイ素と同程度以
上の熱伝導率及び熱膨張率を有する他の材質でもよい。 ○ 複合材料１の使用方法としては、半導体装置の放熱
部材や電子部品搭載基材に限らない。放熱部材以外の用
途に使用する場合は、高硬度微粒子３ａとして熱伝導率
を考慮せずに硬度が大きな他の材質、例えば、窒化ホウ
素（ＢＮ）、炭化チタン、炭化タングステン等を使用し
てもよい。○ High hardness fine particles 3a constituting the dispersed phase 3
Is not limited to fine particles of silicon carbide, but may be another material having a thermal conductivity and a thermal expansion coefficient equal to or higher than that of silicon carbide. The method of using the composite material 1 is not limited to the heat dissipation member of the semiconductor device or the electronic component mounting base material. When used for applications other than heat dissipating members, other materials having high hardness, for example, boron nitride (BN), titanium carbide, tungsten carbide, etc. may be used as the high hardness fine particles 3a without considering thermal conductivity. Good.
【００２７】前記実施の形態から把握される請求項記載
以外の発明（技術思想）について、以下に記載する。 （１） 請求項１又は請求項２に記載の発明において、
前記高硬度の材質は炭化珪素と同程度以上の熱伝導率及
び熱膨張率を有するセラミックスである。[0027] Inventions (technical ideas) other than those described in the claims grasped from the embodiment will be described below. (1) In the invention described in claim 1 or 2,
The high hardness material is a ceramic having a thermal conductivity and a thermal expansion coefficient equal to or higher than that of silicon carbide.
【００２８】（２） 請求項１又は請求項２に記載の発
明において、前記金属はアルミニウム又はアルミニウム
合金である。 （３） 請求項１又は請求項２に記載の発明において、
前記高硬度の微粒子は粒子径が数μｍ〜１００μｍ程度
で、前記カーボン微粒子は粒子径が数ｎｍ〜百ｎｍ程度
である。(2) In the invention described in claim 1 or 2, the metal is aluminum or an aluminum alloy. (3) In the invention described in claim 1 or claim 2,
The high-hardness fine particles have a particle diameter of about several μm to 100 μm, and the carbon fine particles have a particle diameter of about several nm to 100 nm.
【００２９】（４） 請求項３に記載の発明において、
前記高硬度の微粒子とカーボン微粒子とはボールミルで
混合される。(4) In the invention according to claim 3,
The high hardness fine particles and the carbon fine particles are mixed in a ball mill.
【００３０】[0030]
【発明の効果】以上詳述したように請求項１及び請求項
２に記載の発明によれば、製造が容易でしかも加工性が
良好となる。また、請求項３に記載の発明によれば、前
記複合材料を生産性良く簡単に製造することができる。
また、請求項４に記載の発明によれば、製造が容易でし
かも加工性が良好な放熱板が得られる。As described in detail above, according to the first and second aspects of the present invention, the production is easy and the workability is good. According to the third aspect of the present invention, the composite material can be easily manufactured with high productivity.
According to the fourth aspect of the present invention, a radiator plate which is easy to manufacture and has good workability can be obtained.
【図１】 （ａ）は一実施の形態の複合材料の模式断面
図、（ｂ）は微粒子の状態を示す模式拡大断面図。FIG. 1A is a schematic cross-sectional view of a composite material according to one embodiment, and FIG. 1B is a schematic enlarged cross-sectional view showing a state of fine particles.
【図２】 製造工程を示す模式断面図。FIG. 2 is a schematic sectional view showing a manufacturing process.
【図３】 従来技術の複合材料の模式断面図。FIG. 3 is a schematic sectional view of a conventional composite material.
１…複合材料、２…マトリックス相、３…分散相、３ａ
…高硬度微粒子、３ｂ…カーボン微粒子、４…成形型。DESCRIPTION OF SYMBOLS 1 ... Composite material, 2 ... Matrix phase, 3 ... Disperse phase, 3a
... High hardness fine particles, 3b ... Carbon fine particles, 4 ... Molding mold.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 河野 栄次 愛知県刈谷市豊田町２丁目１番地 株式会 社豊田自動織機製作所内 Ｆターム(参考） 4K020 AA22 AC01 BA08 BB26 5F036 AA01 BA23 BB01 BD01 ────────────────────────────────────────────────── ─── Continued on the front page (72) Inventor Eiji Kono 2-1-1 Toyota-cho, Kariya-shi, Aichi F-term in Toyota Industries Corporation (reference) 4K020 AA22 AC01 BA08 BB26 5F036 AA01 BA23 BB01 BD01
Claims (4)
質製の微粒子の周囲にカーボン微粒子を凝集させたもの
を分散相とした複合材料。1. A composite material in which metal is a matrix phase and fine particles made of high-hardness material are aggregated with carbon fine particles around the fine particles.
に記載の複合材料の製造方法。2. The metal of claim 1, wherein said metal has a high thermal conductivity.
3. The method for producing a composite material according to item 1.
子とを混合して、周囲にカーボン微粒子を凝集させた高
硬度微粒子を成形型内に充填した後、マトリックス相と
なる金属を溶融したものを加圧状態で鋳込む複合材料の
製造方法。3. A method in which fine particles made of a material having high hardness and carbon fine particles are mixed, and high-hardness fine particles in which carbon fine particles are aggregated are filled in a molding die, and then a metal serving as a matrix phase is melted. A method for producing a composite material in which the material is cast in a pressurized state.
を使用した放熱板。4. A heat radiating plate using the composite material according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000225189A JP2002038224A (en) | 2000-07-26 | 2000-07-26 | Composite material, its production method and radiating sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000225189A JP2002038224A (en) | 2000-07-26 | 2000-07-26 | Composite material, its production method and radiating sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2002038224A true JP2002038224A (en) | 2002-02-06 |
Family
ID=18719007
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000225189A Withdrawn JP2002038224A (en) | 2000-07-26 | 2000-07-26 | Composite material, its production method and radiating sheet |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002038224A (en) |
-
2000
- 2000-07-26 JP JP2000225189A patent/JP2002038224A/en not_active Withdrawn
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN100400467C (en) | Heat sink with high thermal conductivity, method for the production thereof and use thereof | |
| US6447894B1 (en) | Silicon carbide composite, method for producing it and heat dissipation device employing it | |
| US5366688A (en) | Heat sink and method of fabricating | |
| CN103501939B (en) | Composite material for heat dissipation substrate and manufacturing method thereof | |
| JP5531329B2 (en) | Package based on semiconductor heat dissipation parts | |
| KR100594602B1 (en) | Method for producing copper based material of low thermal expansion and high thermal conductivity | |
| US20040104502A1 (en) | Method of forming a thermally conductive article using metal injection molding material with high and low aspect ratio filler | |
| JP2009242899A (en) | SiC/Al COMPOSITE SINTERED COMPACT AND PRODUCTION METHOD THEREOF | |
| JPH11307701A (en) | Heat dissipating board and manufacturing method thereof | |
| JP2022132241A (en) | Molded article and its manufacturing method | |
| JP2002038224A (en) | Composite material, its production method and radiating sheet | |
| US6597574B2 (en) | Radiator plate and process for manufacturing the same | |
| EP1375688B1 (en) | Heat dissipation member for electronic apparatus and method for producing the same | |
| WO2004038049A1 (en) | Composite material, method for producing same and member using same | |
| JP2002235126A (en) | Method for producing composite material | |
| JP2003078087A (en) | Heat dissipating composite substrate with fins for semiconductor devices | |
| JP2001288526A (en) | Heat radiating material and its production method | |
| JP2003105470A (en) | Al-Si based powder alloy material and method for producing the same | |
| JP2003073756A (en) | Composite material and method for producing the same | |
| JPH1187581A (en) | Metal-based composite material part and method of manufacturing the same | |
| JP3458832B2 (en) | Manufacturing method of composite material | |
| JP2003234445A (en) | Substrate material for mounting semiconductor device and method for manufacturing the same | |
| JP2004323953A (en) | Copper-based low thermal expansion high thermal conduction member, and its production method | |
| JP2002226925A (en) | Method for manufacturing composite material | |
| JPH108164A (en) | Production of aluminum composite with low thermal expansion and high thermal conductivity, and its composite |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20041014 |
|
| A761 | Written withdrawal of application |
Free format text: JAPANESE INTERMEDIATE CODE: A761 Effective date: 20060310 |