JP2002033580A - Multilayer wiring board and producing method therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a multilayer wiring board and a producing method therefor, with which a layer connection can be surely performed and reliability is high. SOLUTION: Concerning the multilayer wiring board provided with a conductor post 104 for layer connection, a wiring pattern 107 having a pad to be connected with the conductor post 104, a metal material 105 for bonding for bonding the conductor post and a pad 106 and an insulating layer 109 existent between layers, at least one part of the insulating layer 109 is made into metal bonding adhesives 108.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multilayer wiring board on which a semiconductor chip is mounted, and more particularly to a multilayer wiring board for simultaneously performing electrical connection and bonding between layers and a method of manufacturing the same.

[0002]

2. Description of the Related Art In recent years, with the demand for higher functionality and lighter, thinner and smaller electronic devices, high-density integration and high-density mounting of electronic components have been progressing. Semiconductor packages are becoming more and more
The size and the number of pins have been reduced.

[0003] A conventional circuit board is called a printed wiring board, and after patterning copper foil adhered to a glass epoxy board made of a laminated board made of glass fiber woven fabric impregnated with epoxy resin, a plurality of sheets are stacked. The mainstream was to use a wiring board in which a through hole was formed by bonding and drilling, a via was formed by performing copper plating on the wall surface of the hole, and a via was formed to perform electrical connection between layers. However, the mounting components have been reduced in size and density, and the wiring density of the above-described wiring boards has become insufficient, and problems have arisen in mounting components.

[0004] Against this background, recently, build-up multilayer wiring boards have been adopted. The build-up multilayer wiring board is formed while stacking an insulating layer made of only a resin and a conductor. As the interlayer connection method, high-density is achieved by freely arranging small-diameter via holes in various ways such as a laser method, a plasma method, and a photo method instead of the conventional drilling. Manufacturing methods of the build-up multilayer wiring board are roughly classified into a method of forming vias in an insulating layer and then connecting layers, and a method of forming an interlayer connecting portion and then stacking insulating layers. Further, the interlayer connection portion is divided into a case where a via hole is formed by plating and a case where the via hole is formed by a conductive paste or the like, and is further subdivided depending on an insulating material and a via forming method used. Among them, a method of forming fine vias for interlayer connection on a prepreg with a laser, filling the vias with a conductive adhesive such as copper paste, and obtaining an electrical connection with the conductive adhesive, a method of forming an electrical connection on the via Since stacked vias for forming vias are possible, not only high density but also wiring design can be greatly simplified. However, in this method, the electrical connection between the layers is performed using a conductive adhesive, and thus the reliability is not sufficient. In addition, an advanced technology for embedding a conductive adhesive in a fine via is required, and it is difficult to cope with further miniaturization.

Japanese Patent Application Laid-Open No. 8-195560 discloses that “a laminate in which a predetermined number of insulator layers having conductor circuit layers on both sides or one side and insulator layers having no conductor circuit layers are stacked is pressurized. In a method of manufacturing a printed circuit board for forming and simultaneously electrically connecting at least two predetermined upper and lower conductive circuit layers, the insulating layers are formed of a sheet-shaped insulating resin layer containing no glass fiber. A protrusion (metal block) made of a conductor for electrical connection between the conductor circuit layers is provided on a predetermined location of the conductor circuit layer, and the laminate is pressed using a pressing jig plate. And a manufacturing method in which a protrusion breaks through an insulating resin layer by pressing pressure, and abuts and presses against an opposing conductive circuit layer. In addition, `` In addition, a solder layer having a melting temperature higher than the resin curing temperature of the insulating resin layer is provided at the tip of the protrusion, and the insulating resin layer is pierced by the protrusion with heat and pressure, and the solder layer is turned into a conductor circuit layer. After the connection, the temperature is raised to the melting temperature of the solder in this state, the solder layer is melted, the projections are connected to the conductor circuit layer, and then the manufacturing method is cooled and the solder layer is solidified. '' I have. However, in the former method, electrical connection is only physical contact, and it is expected that reliability is low. In the latter method, the solder layer at the tip of the protrusion and the surface of the conductor circuit layer are sufficiently cleaned, that is, if the surface oxide film is not removed or reduced, the solder cannot spread and wet, so the solder joint is performed. It is impossible.

In JP-A-11-251703,
`` An insulator layer having a through hole filled with a conductive composition, a conductive buffer layer formed on one or both surfaces of the conductive composition, and a conductive buffer layer formed on the conductive buffer layer A circuit board having a wiring pattern and a conductive buffer layer forming an alloy or an intermetallic compound with either or both of the conductive composition and the wiring pattern. Also in this method, a conductive buffer layer forming an intermetallic compound, a conductive composition,
If the surface of the wiring pattern is not sufficiently cleaned,
The conductive buffer layer cannot wet and spread, metal bonding becomes insufficient, and a highly reliable electrical connection cannot be obtained.

In Japanese Patent Application Laid-Open No. 11-204939,
`` Having a wiring pattern on at least one side of the insulating sheet,
A plurality of circuit boards having conductive via holes penetrating the front and back surfaces of the insulating sheet, and having connection electrodes provided at arbitrary locations on the front and back surfaces electrically connected to the via holes, via an insulating layer. A multi-layer circuit board having a laminated structure, wherein the insulating layer connecting the plurality of adjacent circuit boards has a viscosity of 10 to 100 ° C. when heated to a temperature of 100 to 300 ° C.
A multilayer circuit board comprising a cured layer of a thermosetting adhesive, which is reduced to not more than 00 poise and cured at least 70 to 80% when left in the temperature range for 10 minutes, is described. Also in this method, a conductive adhesive is used as a connection electrode, or Au or Sn is formed on the surface of the connection electrode and a connection is attempted with an Au-Sn alloy or the like. As shown, the reliability is low, and Au-Sn
In the connection using an alloy, the Sn surface is not cleaned, so that the wettability between metals is poor, and a sufficient bond is not formed. In fact, "Development of multilayer wiring board by batch lamination method of tape-like film" (Journal of Japan Institute of Electronics Packaging, vol.
1, No. 2 (1998)), since the Au—Sn alloy does not spread over the entire surface,
-Sn is a partial joining with a thermosetting adhesive interposed therebetween, and the connection reliability is not sufficient. Here, the cured layer of the thermosetting adhesive is provided with an epoxy-based adhesive. Specifically, the epoxy resin is a bisphenol A type or a cresol novolak type, and the curing agent is a phenol novolak resin. Its function is only interlayer adhesion, and there is no description regarding a metal surface cleaning function such as removal of an oxide film on a metal surface or reduction. Also, Japanese Patent Application Laid-Open No. 11-204939 states that “as a connection electrode,
A method of making an electrical connection at a temperature of 300 ° C. or less using an alloy containing Sn as a main component such as Sn—Pb solder ”is described, but soldering must be performed unless the bonding surface is cleaned. Is impossible.

[0008] In general, for solder bonding, dirt such as oxides on the metal surface of the electrode facing the solder surface is removed, and reoxidation of the metal surface during solder bonding is prevented.
A soldering flux is used, which lowers the surface tension of the solder and makes the molten solder more likely to wet the metal surface. As the flux, a flux obtained by adding an activator or the like for removing and reducing an oxide film to a thermoplastic resin flux such as rosin is used. However, if this flux remains, the thermoplastic resin melts at high temperature and high humidity, and the active ions in the activator are also released, causing problems such as a decrease in electrical insulation and corrosion of printed wiring. Therefore, at present, it is necessary to wash and remove the residual flux after soldering. Therefore, the above-mentioned Japanese Patent Application Laid-Open No.
Such a soldering flux is used for metal bonding of a multilayer printed circuit board, a circuit board, and a multilayer circuit board described in Japanese Patent Application Laid-Open No. 560, JP-A-11-251703 and JP-A-11-204939. Even though metal bonding can be performed reliably, insulation reliability cannot be obtained.

[0009]

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problem of interlayer connection in a multilayer wiring board on which a semiconductor chip is mounted. The purpose is to provide.

[0010]

SUMMARY OF THE INVENTION The present invention provides a conductor post for interlayer connection, a wiring pattern having a pad for connection with the conductor post, and a bonding pattern for bonding the conductor post and the pad. A multilayer wiring board comprising a metal material layer and an insulating layer existing between the layers, wherein at least a part of the insulating layer is made of a metal bonding adhesive, and the interlayer connection is metal bonding. It is a board.

The joining metal material layer of the multilayer wiring board of the present invention is preferably made of solder, and the conductor posts are preferably made of copper.

The metal bonding adhesive for a multilayer wiring board of the present invention is:
Preferably, the resin (A) having at least one or more phenolic hydroxyl groups and the resin (B) acting as a curing agent thereof are essential components, and the resin (A) having the phenolic hydroxyl group is further included. Phenol novolak resin, alkylphenol novolak resin, resol resin, cresol novolak resin, and polyvinyl phenol resin, and it is preferable that the resin (A) having a phenolic hydroxyl group is metal-bonded. 20 wt% or more in the adhesive 80
It is preferably contained in an amount of not more than wt%.

The metal bonding adhesive for a multilayer wiring board of the present invention preferably comprises an epoxy resin (C) and a compound (D) having an imidazole ring and acting as a curing agent for the epoxy resin (C). Is an essential component, and the compound (D) acting as a curing agent is preferably contained in the metal bonding adhesive at 1 wt% to 10 wt%.

The present invention also provides a step of forming a conductor post, a step of forming a wiring pattern having a pad for connecting to the conductor post, and a step of forming a bonding metal material on at least one of the conductor post and the pad. A step of forming a layer, a step of forming an insulating layer, and the conductor post,
A step of bonding to the pad with the bonding metal material layer via at least a metal bonding adhesive layer portion of the insulating layer, and a step of curing the metal bonding adhesive layer by heating. This is a method for manufacturing a multilayer wiring board.

Further, the present invention is a multilayer wiring board obtained by the above manufacturing method.

[0016]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited thereto.

FIG. 1 is a view for explaining an example of a multilayer wiring board according to an embodiment of the present invention and a method of manufacturing the same.
(G) is a sectional view showing the structure of the multilayer wiring board obtained by the present invention. In the multilayer wiring board of the present invention, the conductor post 104 for interlayer connection is provided at the tip of the conductor post 104 via the metal bonding adhesive layer 108 forming at least a part of the insulating layer 109 existing between the layers. Metallic material layer 1 for joining
05, the wiring pattern 107 and the pad 106 are formed on the non-bonded surface of the connection wiring board 110 by bonding to the pad 106a of the connected wiring board 111. The insulating layer may have a single-layer structure of a metal bonding adhesive layer, a two-layer structure of an insulating film layer and a metal bonding adhesive layer, or the like.

In the method for manufacturing a multilayer wiring board of the present invention, first, a conductor 102 with an insulating film 101 is
A conductive foil is laminated on one sheet by heating and pressing, or a resin varnish for an insulating film is uniformly applied on the conductive foil and dried to form a via 103 in the insulating film 101 (FIG. 1). (A)). Examples of a method for forming the via 103 include a method using a laser, a method using imaging of a photosensitive insulating film, and the like.

Next, conductive posts 104 for interlayer connection are formed in the vias 103 (FIG. 1B). Conductor post 10
Examples of the method for forming 4 include methods such as electroless plating and / or electrolytic plating. Alternatively, the conductor may be formed by etching. As an example of forming a conductor by etching, a conductor post is formed by etching one side of the conductor in advance, then an insulating film is formed so as to cover the formed conductor post, and the insulating film is polished to polish the tip of the conductor post. And the like.

Next, a joining metal material is applied on the conductor posts 104 to form a joining metal material layer 105.
(C)). Examples of a method for forming the bonding metal material layer 105 include electrolytic plating, electroless plating, and a method of printing a bonding metal material paste. The bonding metal material layer is formed on the conductor post 104 or the pad 1 of the connected wiring board 111 shown in FIG.
06a.

Next, a wiring pattern 107 having a pad 106 for interlayer connection is formed by etching the conductor 102 (FIG. 1D). Wiring pattern 107
In addition to the method of forming the conductor by etching, an additional method such as electroless copper plating and / or electrolytic copper plating may be used. The connected wiring board 111 shown in FIG. 1F can be obtained by the same steps as those shown in FIGS. 1A to 1D.

Further, a metal bonding adhesive layer 108 is formed on the surface on which the bonding metal material layer 105 is formed, and a connection wiring board 110 is obtained (FIG. 1E). In the example of this embodiment, two layers of the insulating film 101 and the metal bonding adhesive layer 108 form the insulating layer 109. Metal bonding adhesive layer 1
08 is, for example, a method of applying a metal bonding adhesive to a varnish using a solvent, and then directly applying a varnish to the surface on which the bonding metal material layer 105 is formed by printing, curtain coating, bar coating, or the like; It is formed by a method such as laminating a film type metal bonding adhesive by roll lamination. The surface on which the metal bonding adhesive layer is formed may be on the pad 106a side of the connected wiring board 111 shown in FIG.

The above-obtained connection metal material layer 105 of the conductor post 104 of the connection wiring board 110 and the connection wiring board 11
The first pad 106a is aligned (FIG. 1).
(F)). The alignment can be performed by a method in which a positioning mark formed in advance on the wiring pattern of each layer is read and aligned by an image recognition device, or a method in which alignment is performed using a positioning pin or the like. The connected wiring board 111 may be obtained by the same steps as those shown in FIGS. 1A to 1D, but may be made of glass epoxy copper clad generally used as a core substrate of a build-up multilayer wiring board. It may be a laminated plate.

After the alignment, the conductor post 104 is heated to a temperature at which metal bonding is possible, and the conductor post 104 is brought into contact with the metal bonding adhesive layer 108.
To be connected to the wiring board 1 by the joining metal material 105
11 until the bonding to the pad 106a, and further heating to cure the metal bonding adhesive layer 108 and bond the layers, thereby connecting the wiring board 110 and the wiring board 1 to be connected.
11 are laminated (FIG. 1 (g)). As a method of laminating each layer, a method such as a vacuum press can be used.

Through the above steps, a multilayer wiring board can be manufactured in which the wiring patterns of each layer and the conductor posts are metal-bonded with a bonding metal material and the respective layers are bonded with a metal bonding adhesive.

The joining metal material layer used in the present invention is preferably made of solder. By using solder bonding, A
Compared with a single point bonding method using ultrasonic waves such as u-Au bonding, metal bonding can be performed at once, so that productivity is high and cost can be reduced. In addition, soldering is a connection method using copper paste or silver paste,
The reliability is higher than the connection method by physical contact between the conductor post and the pad. Examples of the solder used include Sn, In, or Sn, Ag, Cu, Zn, Bi, Pd,
Solder made of at least two kinds of Sb, Pb, In, and Au can be used. More preferably, it is an environment-friendly Pb-free solder.

The type of the conductor post used in the present invention is not limited as long as it is a metal such as copper, aluminum, silver, nickel and tin. More preferably, the conductor posts are made of copper. By using copper, stable electric connection with low electric resistance can be obtained. As a method of forming the conductor post, there is a method of forming by etching a copper foil, or a method of forming by electroless plating or electrolytic plating. An advantage of forming the conductor posts by etching is that the heights between the conductor posts are uniform. On the other hand, the advantage of forming the conductor post by plating is that the shape of the tip of the formed conductor post can be freely controlled.

The metal bonding adhesive used in the present invention is preferably an adhesive having a surface cleaning function and high insulation reliability. The surface cleaning function includes, for example, a function of removing an oxide film present on the surface of the bonding metal material layer and the surface of the metal to be connected, and a function of reducing the oxide film. Due to the surface cleaning function of the metal bonding adhesive, wettability with the surface for connection with the bonding metal material layer is sufficiently enhanced. for that reason,
In order to clean the metal surface, the metal bonding adhesive must be in contact with the surface for connection with the bonding metal material layer. By cleaning both surfaces, the force of the joining metal material layer to wet and spread on the surface to be joined works, and the force of the wetting and spreading of the joining metal material layer causes the metal joining at the metal joining portion. The adhesive is eliminated.
As a result, in the metal bonding using the metal bonding adhesive, resin residue is less likely to be generated, and the electrical connection reliability is high.

The first preferred metal bonding adhesive used in the present invention comprises, as essential components, a resin (A) having at least one or more phenolic hydroxyl groups and a resin (B) acting as a curing agent thereof. The phenolic hydroxyl group of the resin (A) having a phenolic hydroxyl group removes dirt such as an oxide on a bonding metal material layer and a metal surface or reduces oxides by its surface cleaning function, thereby reducing the metal bonding. Acts as a flux. Further, since a good cured product can be obtained by the resin (B) acting as a curing agent, cleaning and removal after metal bonding is not required.
Maintains electrical insulation even in a high-temperature, high-humidity atmosphere,
Enables highly reliable metal bonding.

The resin (A) having at least one phenolic hydroxyl group used in the first preferred metal bonding adhesive in the present invention includes a phenol novolak resin, an alkylphenol novolak resin, a resole resin, a cresol novolak resin, It is preferably selected from polyvinylphenol resins, and one or more of these can be used.

The resin (A) having a phenolic hydroxyl group used for the first preferred metal adhesive in the present invention comprises:
As the resin (B) acting as a curing agent, an epoxy resin, an isocyanate resin, or the like is used. Specifically, all are based on phenol-based compounds such as bisphenol, phenol novolak, alkylphenol novolak, biphenol, naphthol and resorcinol, and skeletons such as aliphatic, cycloaliphatic and unsaturated aliphatic. Examples thereof include modified epoxy compounds and isocyanate compounds.

The resin (A) having a phenolic hydroxyl group used in the first preferred metal bonding adhesive in the present invention.
Is preferably contained in the adhesive in an amount of 20 wt% or more and 80 wt% or less. A more preferred upper limit is 60 wt.
%. If the content is less than 20 wt%, the effect of cleaning the metal surface is reduced, and there is a possibility that metal bonding cannot be performed.
On the other hand, if it is more than 80% by weight, a sufficient cured product may not be obtained, in which case the bonding strength and the reliability are reduced. On the other hand, the resin (B) acting as a curing agent is preferably contained in the adhesive in an amount of 20 wt% or more and 80 wt% or less. Further, a colorant, a curing catalyst, an inorganic filler, various coupling agents, a solvent, and the like may be added to the resin used for the metal bonding adhesive.

The second preferred metal bonding adhesive used in the present invention comprises an epoxy resin (C) and a compound (D) having an imidazole ring and acting as a curing agent for the epoxy resin (C) as essential components. The imidazole ring of compound (D) removes dirt such as oxide on the bonding metal material layer and the metal surface or reduces the oxide film by the surface cleaning function caused by the unpaired electrons of the tertiary amine. And acts as a flux for metal bonding. Further, since the imidazole ring also acts as a curing agent when anionically polymerizing the epoxy resin (C), it is possible to obtain a good cured product, and it is not necessary to remove and wash after soldering. Maintains electrical insulation and enables metal bonding with high bonding strength and high reliability.

In the present invention, the amount of the compound (D) used for the second preferable metal bonding adhesive is 1 wt% or more and 1 wt% or more.
The content is preferably 0% by weight or less. A more preferred upper limit is 5 wt%. When the amount of compound (D) added is 1
If it is less than wt%, the surface cleaning function is weak, and the epoxy resin (C) may not be sufficiently cured. If the amount of the compound (D) is more than 10% by weight, the curing reaction proceeds rapidly, the fluidity of the metal bonding adhesive layer during metal bonding is reduced, and metal bonding may be hindered. Further, the obtained cured product may become brittle, and a metal joint having sufficient strength may not be obtained.

The epoxy resin (C) used in combination with the compound (D) in the second preferred metal bonding adhesive of the present invention includes bisphenol, phenol novolak, alkylphenol novolak, biphenol, naphthol and the like. Examples thereof include a phenol-based epoxy resin such as a resorcinol-based resin and an epoxy compound modified based on a skeleton of an aliphatic, cycloaliphatic, or unsaturated aliphatic group.

The compound (D) having an imidazole ring and acting as a curing agent for the epoxy resin (C) used in the second preferred metal bonding adhesive in the present invention includes:
Imidazole, 2-methylimidazole, 2-ethyl-
4-methylimidazole, 2-phenylimidazole,
1-benzyl-2-methylimidazole, 2-undecylimidazole, 2-phenyl-4-methylimidazole, bis (2-ethyl-4-methyl-imidazole),
2-phenyl-4-methyl-5-hydroxymethylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-methylimidazole, 1- Examples thereof include cyanoethyl-2-phenylimidazole and triazine-added imidazole. In addition, these are made into epoxy adducts,
Microencapsulated ones can also be used. These may be used alone or in combination of two or more.

In the present invention, the blending amount of the epoxy resin (C) used for the second preferable metal bonding adhesive is preferably 30 to 99% by weight of the whole metal bonding adhesive. 30wt%
If the amount is less than the above range, a sufficient cured product may not be obtained. Components other than the epoxy resin (C) and the compound (D) acting as a curing agent thereof include resins used for metal bonding adhesives, and thermosetting resins such as cyanate resins, acrylic resins, methacrylic resins, and maleimide resins. Or a thermoplastic resin. Further, a colorant, a curing catalyst, an inorganic filler, various coupling agents, a solvent, and the like may be added to the resin used for the metal bonding adhesive.

The method for preparing the metal bonding adhesive includes, for example, a method in which a resin (A) having a solid phenolic hydroxyl group and a resin (B) acting as a solid curing agent are dissolved in a solvent, and a method in which a solid phenol is prepared. Resin having a functional hydroxyl group (A)
And a method of dissolving the resin in a resin (B) acting as a liquid curing agent, and a method of dissolving the resin (B) acting as a solid curing agent in a resin (A) having a liquid phenolic hydroxyl group. A method of dispersing or dissolving a compound (D) having an imidazole ring and acting as a curing agent for the epoxy resin (C) in a solution in which the solid epoxy resin (C) is dissolved in a solvent; )), A method of dispersing or dissolving a compound (D) having an imidazole ring and acting as a curing agent for the epoxy resin (C). As a solvent to be used, acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, toluene, mesitylene, xylene, hexane, isobutanol, n-butanol, 1-methoxy, 2-propanol acetate, butyl cellosolve, ethyl cellosolve, methyl cello Solve, Cellsolve acetate, ethyl lactate, ethyl acetate, dimethyl phthalate, diethyl phthalate, dibutyl phthalate, diethylene glycol, n-butyl benzoate, N-methylpyrrolidone, N, N-
Examples include dimethylformamide, tetrahydrofuran, γ-butyllactone, anisole and the like. Preferably,
A solvent having a boiling point of 200 ° C. or less.

[0039]

EXAMPLES The present invention will be described in more detail with reference to the following Examples, but it should not be construed that the invention is limited thereto.

Example 1 [Preparation of a metal bonding adhesive varnish] m, p-cresol novolak resin (PAS-1, Nippon Kayaku Co., Ltd., OH equivalent: 12)
0) 100 g and bisphenol F type epoxy resin (RE-404S, Nippon Kayaku Co., Ltd., epoxy equivalent: 165) 1
40 g was dissolved in 60 g of cyclohexanone, and triphenylphosphine (Hokuko Chemical Co., Ltd.) was used as a curing catalyst.
Was added to produce a metal bonding adhesive varnish.

[Preparation of Multilayer Wiring Board] A 50 μm diameter via (via 103) is formed on a 25 μm thick polyimide resin film (insulating film 101) on a 12 μm thick copper foil (conductor 102).
Was formed by a UV-YAG laser. The via is filled with copper by electrolytic copper plating, and the copper post (conductor post 10) is filled.
4) was formed. On the formed copper post, Sn-Pb eutectic solder (joining metal material 105) was formed by electrolytic plating. An etching mask was formed on the copper foil side, and a wiring pattern (wiring pattern 107) and a pad (pad 106) having a line width / line space of 40 μm / 40 μm were formed. After applying the metal bonding adhesive varnish obtained above on the surface on which the Sn-Pb eutectic solder plating has been applied by bar coating,
After drying at 80 ° C. for 20 minutes, a metal bonding adhesive layer (metal bonding adhesive layer 108) having a thickness of 15 μm was formed, and a connection wiring board (connection wiring board 110) was obtained. In the wiring pattern of each layer,
A positioning mark formed in advance is read by an image recognition device, and a wiring board to be connected (a wiring board) made of a glass epoxy core substrate (201) equivalent to FR-5 on which a wiring pattern of 12 μm thickness and a pad (pad 206) are formed. The connection wiring board 211) was aligned with the wiring pattern of the connection wiring board on which the metal bonding adhesive layer was formed, and was temporarily pressed at a temperature of 100 ° C. In this step, connection wiring boards were bonded to both surfaces of the glass epoxy core substrate. This is heated and pressed by a vacuum press at a temperature of 220 ° C., and the copper post (104) is soldered to the pad (106a) of the wiring board to be connected via the metal bonding adhesive layer (108).
Further, this is heat-treated at 180 ° C. for 60 minutes to cure the metal bonding adhesive layer, and bond the glass epoxy core substrate and the connection wiring board with the metal bonding adhesive to obtain a multilayer wiring board for a temperature cycle test. Was.

As shown in FIG. 2, the obtained multilayer wiring board is designed to have a circuit in which 60 metal joints are connected in series on both sides for a temperature cycle test. Also,
The multilayer wiring board has a line width / line interval = 4 for an insulation resistance test.
A comb wiring pattern of 0 μm / 40 μm is also formed.

The multilayer wiring board obtained above was subjected to a temperature cycle test, a cross-section observation of a metal joint, and an insulation resistance test. The evaluation results are shown in Table 1.

Example 2 In Example 1, a bisphenol A type novolak resin (LF4781 manufactured by Dainippon Ink and Chemicals, Inc.) was used in place of 100 g of the m, p-cresol novolak resin used in the preparation of the metal bonding adhesive varnish in Example 1. , OH equivalent 120) 100
Except for using g, a metal bonding adhesive varnish and a multilayer wiring board were prepared and evaluated in the same manner as in Example 1.

Example 3 In Example 1, instead of 100 g of m, p-cresol novolak resin used for preparing the metal bonding adhesive varnish, polyvinyl phenol resin (Marukalinker M, OH manufactured by Maruzen Petrochemical Co., Ltd.) was used. A metal bonding adhesive varnish and a multilayer wiring board were prepared and evaluated in the same manner as in Example 1 except that 100 g of the equivalent 120) was used.

Example 4 Phenol novolak resin (PR-produced by Sumitomo Durez Co., Ltd.)
51470, OH equivalent 105) 100 g, diallyl bisphenol A type epoxy resin (Nippon Kayaku Co., Ltd. RE-
210 g of 810 NM, epoxy equivalent 220) was dissolved in 80 g of cyclohexanone, and 0.3 g of 2-phenyl-4,5-dihydroxymethylimidazole (2PHZ-PW manufactured by Shikoku Chemicals Co., Ltd.) was added as a curing catalyst, followed by metal bonding. An adhesive varnish was prepared, and then a multilayer wiring board was prepared and evaluated in the same manner as in Example 1.

Example 5 Bisphenol F type epoxy resin (RE manufactured by Nippon Kayaku Co., Ltd.)
-404S, epoxy equivalent 165) 30 g, and cresol novolak epoxy resin (EOCN-1020-6).
5, 70 g of Nippon Kayaku Co., Ltd., epoxy equivalent 200)
Dissolved in 60 g of cyclohexanone, and used as a curing agent 2-phenyl-4-methyl-5-hydroxymethylimidazole (2P4MHZ-PW manufactured by Shikoku Chemicals Co., Ltd., melting point 1)
(92 ° C. to 197 ° C.) 1.5 g was added to prepare a metal bonding adhesive varnish, and then a multilayer wiring board was prepared and evaluated in the same manner as in Example 1.

Example 6 In place of 1.5 g of 2-phenyl-4-methyl-5-hydroxymethylimidazole used in Example 5, 3 g of 2-phenyl-4-methyl-5-hydroxymethylimidazole was used. Except for the above, a metal joining adhesive varnish was produced in the same manner as in Example 5.

Example 7 In place of 1.5 g of 2-phenyl-4-methyl-5-hydroxymethylimidazole used in Example 5, 5 g of 2-phenyl-4-methyl-5-hydroxymethylimidazole was used. Except for the above, a metal bonding adhesive varnish was produced in the same manner as in Example 5, and then a multilayer wiring board was produced and evaluated in the same manner as in Example 1.

Example 8 m, p-cresol novolak resin (Nippon Kayaku Co., Ltd.
AS-1, OH equivalent 120) and bisphenol F type epoxy resin (RE-404S, manufactured by Nippon Kayaku Co., Ltd.)
140 g of epoxy equivalent 165) was added to cyclohexanone 6
0 g to prepare a metal bonding adhesive varnish. Next, a multilayer wiring board was produced and evaluated in the same manner as in Example 1 except that the metal bonding adhesive layer was heat-treated at 180 ° C. for 60 minutes and at 200 ° C. for 60 minutes under the curing conditions.

Example 9 Phenol novolak resin (PR-produced by Sumitomo Durez Co., Ltd.)
106 g of HF-3, OH equivalent 106) and diallyl bisphenol A type epoxy resin (RE-8 manufactured by Nippon Kayaku Co., Ltd.)
35 g of 10NM, epoxy equivalent 220) and 210 g of dicyclopentadiene type novolak epoxy resin (Nippon Kayaku Co., Ltd. XD-1000L, epoxy equivalent 250)
It was dissolved in 100 g of methyl ethyl ketone to produce a metal bonding adhesive varnish. Next, regarding the production of the multilayer wiring board, the metal bonding adhesive layer was cured at 180 ° C. for 60 minutes.
Except that the heat treatment was performed at 200 ° C. for 60 minutes, the evaluation was performed and performed in the same manner as in Example 1.

Example 10 Phenol novolak resin (PR-produced by Sumitomo Durez Co., Ltd.)
53647, OH equivalent 106), 106 g, and diallyl bisphenol A type epoxy resin (RE-Nippon Kayaku Co., Ltd.)
810 NM, epoxy equivalent 220) 35 g and dicyclopentadiene type novolak epoxy resin (Nippon Kayaku Co., Ltd.)
XD-1000L, epoxy equivalent 250) 210g
Was dissolved in 100 g of methyl ethyl ketone to prepare a metal bonding adhesive varnish. Next, for the production of the multilayer wiring board, the metal bonding adhesive layer was cured at 180 ° C. for 60 hours.
And a heat treatment at 200 ° C. for 60 minutes was performed in the same manner as in Example 1, and evaluated.

Example 11 Bisphenol A type novolak resin (Sumitomo Durez Co., Ltd.)
120 g of LF4871 (manufactured by Nippon Kayaku Co., Ltd.) and 120 g of diallyl bisphenol A type epoxy resin
35 g of E-810NM, epoxy equivalent 220) and dicyclopentadiene type novolak epoxy resin (Nippon Kayaku
XD-1000L, epoxy equivalent 250) 210
g was dissolved in 100 g of methyl ethyl ketone to prepare a metal bonding adhesive varnish. Next, regarding the production of the multilayer wiring board, the metal bonding adhesive layer was cured at 180 ° C. for 6 hours.
Except for 0 minute and heat treatment at 200 ° C. for 60 minutes, the same method as in Example 1 was performed and evaluated.

[Evaluation Method] Temperature cycle test After confirming the initial conduction of the multilayer wiring board obtained above, -40
A temperature cycle test was performed in which one cycle was 30 ° C. and 30 minutes at 125 ° C. Table 1 summarizes the results of the number of disconnection failures after 1000 cycles of the temperature cycle test for the ten inserted multilayer wiring boards.

2. Observation of Cross Section of Metal Joint The cross section of the metal joint of the multilayer wiring board obtained above was observed with an electron microscope (SEM) to evaluate the state of the metal joint. The results are summarized in Table 1.

3. Insulation Resistance Test After measuring the initial insulation resistance of the multilayer wiring board obtained above, apply a DC voltage of 5.5 V in an atmosphere of 85 ° C./85% relative humidity, and measure the insulation resistance after a lapse of 1000 hours. did. The applied voltage at the time of measurement was 100 V for 1 minute, and the initial insulation resistance and the insulation resistance after treatment were summarized in Table 1.

[0057]

[Table 1]

As can be seen from the evaluation results shown in Table 1,
The multilayer wiring board of the present invention and the multilayer wiring board manufactured by the method of manufacturing a multilayer wiring board of the present invention can be reliably metal-bonded, and in a temperature cycle test, there is no disconnection failure, and the insulation resistance is low even in an insulation resistance test. Did not drop.

[0059]

According to the present invention, it is possible to provide a highly reliable multilayer wiring board and a method for manufacturing the same, which can surely make interlayer connections and, in particular, have a metal surface cleaning function and an insulation reliability. The use of a metal bonding adhesive having a high degree of adhesion makes it possible to obtain a multilayer wiring board with even higher interlayer connection reliability.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view for explaining a multilayer wiring board of the present invention and a method for manufacturing the same.

FIG. 2 is a cross-sectional view of a multilayer wiring board for explaining a circuit design in which metal joints are connected in series.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 101 Insulating film 102 Conductor 103 Via 104 Conductor post 105 Bonding metal material layer 106, 106a, 206 Pad 107 Wiring pattern 108 Metal bonding adhesive layer 109 Insulating layer 110 Connection wiring board 111, 211 Connection wiring board 201 Glass epoxy core substrate

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification code FI Theme coat ゛ (Reference) C08G 59/62 C08G 59/62 C09J 161/04 C09J 161/04 163/00 163/00 201/06 201 / 06 H05K 3/38 H05K 3/38 E (72) Inventor Ryoichi Okada 2-5-8 Higashishinagawa, Shinagawa-ku, Tokyo Sumitomo Bakelite Co., Ltd. F-term (reference) 4J036 AC01 AC05 AD07 AD08 AF06 AF07 AJ08 CD04 DC40 DC41 FB07 FB08 JA06 JA07 JA08 4J040 EB031 EB041 EC031 EC032 EC041 EC042 EC061 EC062 EC071 EC092 EC291 EC292 EF262 GA05 HC24 JB02 KA16 LA09 LA11 MA02 NA20 5E343 AA02 AA16 AA18 BB24 BB67 A12 A12 A12 CCA CCA CC12 CC CC02 CC08 CC10 CC32 CC41 DD02 DD12 DD22 DD32 DD44 EE09 EE12 FF07 FF14 GG15 GG17 GG18 GG22 GG25 GG28 HH11 HH13

Claims (10)

[Claims] 1. A conductor post for interlayer connection, a wiring pattern having a pad for connecting to the conductor post, a joining metal material layer for joining the conductor post and the pad, A multilayer wiring board provided with an insulating layer, wherein at least a part of the insulating layer is made of a metal bonding adhesive, and the interlayer connection is metal bonding. 2. The multilayer wiring board according to claim 1, wherein the bonding metal material layer is made of solder. 3. The multilayer wiring board according to claim 1, wherein the conductor posts are made of copper. 4. A metal bonding adhesive comprising a resin (A) having at least one or more phenolic hydroxyl groups and a resin (B) acting as a curing agent thereof as essential components. The multilayer wiring board according to any one of claims 1 to 3. 5. A resin (A) having a phenolic hydroxyl group.
5. The multilayer wiring board according to claim 4, wherein at least one selected from the group consisting of a phenol novolak resin, an alkylphenol novolak resin, a resole resin, a cresol novolak resin, and a polyvinyl phenol resin. 6. 6. A resin (A) having a phenolic hydroxyl group.
The multilayer wiring board according to claim 4, wherein the metal bonding adhesive contains 20 wt% or more and 80 wt% or less in the metal bonding adhesive. 7. The metal bonding adhesive is an epoxy resin (C).
The multilayer wiring according to any one of claims 1 to 3, wherein a compound (D) having an imidazole ring and acting as a curing agent for the epoxy resin (C) is an essential component. Board. 8. The compound (D) acting as a curing agent,
The multilayer wiring board according to claim 7, wherein the metal bonding adhesive contains 1 wt% or more and 10 wt% or less. 9. A step of forming a conductor post, a step of forming a wiring pattern having a pad for connecting to the conductor post, and forming a bonding metal material layer on at least one of the conductor post and the pad. Forming an insulating layer, bonding the conductor post to the pad by the bonding metal material layer via at least a metal bonding adhesive layer portion of the insulating layer, and heating the metal bonding. Curing the adhesive layer. 10. A multilayer wiring board obtained by the manufacturing method according to claim 9.