JP2002033341A - Semiconductor device - Google Patents

Abstract

(57) [Summary] [PROBLEMS] To prevent the occurrence of a tilt defect in which a semiconductor element chip is locally lifted due to thermal expansion of air in a cavity of a die tip part when a semiconductor element chip is housed in a package. It is an object of the present invention to provide a semiconductor device capable of performing the above. SOLUTION: A substantially square-shaped die tip portion 14 is provided on the bottom surface of a storage portion 12 of a package 10, and a ventilation groove 18 for ventilating a hollow portion 16 at the center thereof and the outside is provided. For this reason, the semiconductor element chip 20 is
After bonding to the upper surface of the die chip portion 14 via the heat sink 2, when heat treatment is performed to cure the adhesive 22, thermal expansion has occurred in the cavity 16 of the die chip portion 14 covered with the semiconductor element chip 20. The air escapes outside the die tip portion 14 through the ventilation groove 18. Accordingly, occurrence of a tilt error in which the semiconductor element chip 20 is locally lifted due to thermal expansion of air in the cavity 16 of the die tip section 14 is prevented.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device,
In particular, the present invention relates to a semiconductor device in which a semiconductor element chip is housed in a package.

[0002]

2. Description of the Related Art A conventional process for accommodating a semiconductor element chip in a package is shown in FIGS. 6A and 6A, which are schematic plan views of a semiconductor device, and FIGS. b) and FIG. 7A which is a schematic plan view of the semiconductor device, and FIG. 7B which is a sectional view taken along the line AA in FIG. 7A. First, a package 10 as shown in FIG. 6 is prepared.
Is provided with a concave storage portion 12 for storing a semiconductor element chip in the center thereof. A substantially square-shaped die tip 14 is provided on the bottom surface of the storage portion 12, and a central portion surrounded by four sides of the substantially square is a hollow portion 16.

Then, as shown in FIG. 7, an adhesive (not shown) is applied to the upper surface of the die tip portion 14, and the semiconductor element chip 20 is mounted on the upper surface of the die tip portion 14 to which the adhesive is applied. Place and press. Thus, the back surface of the semiconductor element chip 20 is adhered to the upper surface of the die chip portion 14 via the adhesive.

Subsequently, the package 10 in which the semiconductor element chip 20 is mounted on the upper surface of the die chip section 14 is placed in a high-temperature bath (curing furnace) and subjected to a predetermined heat treatment, and the back surface of the semiconductor element chip 20 is cleaned. 14 The adhesive bonded to the upper surface is cured. In this way, the semiconductor element chip 20 is fixed on the upper surface of the die chip section 14.

The reason why the die tip portion 14 is provided on the bottom surface of the concave storage portion 12 of the package 10 is as follows. That is, when the die tip portion 14 is not provided, when the semiconductor element chip 20 is stored in the recessed storage portion 12, the corner of the semiconductor element chip 20 comes into contact with the bottom of the storage portion 12, and the semiconductor chip is caused by the impact. In some cases, corners of the element chip 20 were missing.

For this reason, by providing the die chip portion 14 and mounting the semiconductor element chip 20 on the upper surface of the die chip portion 14, as shown in FIG. A space 24 is formed between the bottom of the portion 12. And the semiconductor element chip 2
The contact between the corner of 0 and the bottom of the housing 12 is avoided, and the corner of the semiconductor element chip 20 is prevented from being damaged.

The reason why the die tip portion 14 has a substantially rectangular shape and the center portion is the hollow portion 16 is as follows. When the die tip portion 14 is formed as a flat base having no hollow portion 16 at the center thereof, when the package 10 is placed in a high-temperature bath and subjected to a predetermined heat treatment, the flat die portion is formed. 14 is warped and the likelihood of the flatness of the flat upper surface being impaired increases. When such a situation occurs, the semiconductor element chip 20 adhered to the upper surface of the die chip portion 14 via an adhesive is locally lifted, and a so-called tilt error occurs.

For this reason, by forming the die tip portion 14 in a substantially rectangular shape and providing the hollow portion 16 at the center thereof, even when heat treatment is performed, warpage or the like is caused and flatness of the upper surface is impaired. By avoiding this, occurrence of tilting of the semiconductor element chip 20 is prevented.

[0009]

However, in the conventional package 10, when the back surface of the semiconductor element chip 20 is bonded to the upper surface of the die chip portion 14 via an adhesive, a cavity at the center of the die chip portion 14 is formed. The portion 16 is covered with the semiconductor element chip 20 to form a closed space.

Therefore, when the package 10 is subsequently subjected to a predetermined heat treatment in the high-temperature bath, the air in the cavity 16 of the die chip portion 14 which has become a closed space thermally expands.
At this time, the air in the cavity 16 contains the package 1
There is no escape in the structure of 0. Therefore, the semiconductor element chip 20 may be lifted before the adhesive bonding the semiconductor element chip 20 to the upper surface of the die chip portion 14 is cured by the heat treatment. That is, the semiconductor element chip 20 is locally lifted, and a tilt error occurs.

The present invention has been made in view of the above circumstances, and when a semiconductor element chip is housed in a package, the semiconductor element chip is removed due to thermal expansion of air in a cavity of a die chip portion. It is an object of the present invention to provide a semiconductor device capable of preventing occurrence of a tilt error that locally rises.

[0012]

The above object is achieved by a semiconductor device according to the present invention described below. That is,
2. A semiconductor device according to claim 1, wherein the semiconductor device chip is housed in a package, and is provided in a substantially rectangular shape on the bottom surface of the housing portion of the package, and has a hollow portion in the center. And a ventilation groove provided in the die tip portion for ventilating the outside of the die tip portion and the cavity, and the semiconductor element chip fixed on the die tip portion. I do.

As described above, in the semiconductor device according to the first aspect, the outside of the die tip and the central hollow portion are ventilated to the die tip provided in a substantially rectangular shape on the bottom surface of the package housing. When the semiconductor device chip is bonded to the upper surface of the die chip portion with an adhesive by providing the ventilation groove, the central cavity portion of the die chip portion is covered with the semiconductor device chip. Even so, the cavity does not become a closed space. For this reason, when air in the hollow portion of the die tip is thermally expanded when the package is subsequently subjected to a predetermined heat treatment in the high-temperature bath, the air in the hollow portion passes through the ventilation groove and is outside the die tip portion. Will run away. Therefore, it is possible to easily prevent the occurrence of a tilt failure in which the semiconductor element chip is locally lifted due to the thermal expansion of the air in the cavity of the die tip portion.

According to a second aspect of the present invention, there is provided the semiconductor device according to the first aspect, wherein the ventilation groove is formed at least on two opposing sides of the substantially rectangular shape of the die tip portion. With a configuration provided one by one, when performing a predetermined heat treatment on the package,
The thermally expanded air in the hollow portion at the center of the die chip portion covered with the semiconductor element chip passes through ventilation grooves provided on two opposite sides of the die chip portion, and flows in two opposite directions. You will run away at the same time. Therefore, in addition to the effect of the first aspect, the semiconductor element chip is prevented from finely moving in one direction as a reaction when the air in the cavity of the die tip escapes to the outside through the ventilation groove. You.

[0015]

BRIEF DESCRIPTION OF THE DRAWINGS FIG.
An embodiment of the present invention will be described. (First Embodiment) FIGS. 1A and 1B are a plan view showing a semiconductor device in which a semiconductor element chip is housed in a package according to a first embodiment of the present invention, and AA thereof. It is a line sectional view. 2 to 4 are process diagrams for explaining a method of manufacturing the semiconductor device shown in FIG. 1, that is, a process of housing a semiconductor element chip in a package. 2A to 4B are a plan view and a sectional view corresponding to FIGS. 1A and 1B, respectively.

As shown in FIGS. 1A and 1B, in the semiconductor device according to this embodiment, for example, a CCD
At the center of the package 10 for (Charge Coupled Device), a concave storage section 12 is provided.

On the bottom surface of the storage portion 12, a substantially rectangular die tip portion 14 is provided, and a central portion surrounded by four sides of the substantially rectangular shape is a hollow portion 16.
The hollow portion 16 is provided in the die tip portion 14.
A vent groove 18 for ventilating the air and the outside is provided at a predetermined location, which is a feature of the present embodiment.

The size of the ventilation groove 18 may be as small as possible, as long as it has a function of ventilating the cavity 16 of the die tip portion 14 and the outside. It may be any size as long as the upper surface of the die tip portion 14 remains. Therefore, the dimensions can be arbitrarily changed within this range.

On the upper surface of the die tip portion 14,
The back surface of the semiconductor element chip 20 on which a CCD or the like is formed is fixed via an adhesive. Thus, the semiconductor element chip 20 is housed in the housing 12 of the package 10.

Next, a method of manufacturing the semiconductor device shown in FIGS. 1A and 1B, that is, a process of housing a semiconductor element chip in a package will be described with reference to FIGS. First, a package 10 as shown in FIGS. 2A and 2B is prepared. That is, this package 1
At 0, a concave storage section 12 is provided at the center. On the bottom surface of the housing portion 12, a substantially square-shaped die tip portion 14 is provided, the center of which is a hollow portion 16 and the die tip portion 14 is formed.
Is provided with a ventilation groove 18 for ventilating the cavity 16 and the outside.

Next, as shown in FIGS. 3A and 3B, an adhesive 22 is applied to the upper surface of the die tip portion 14 of the package 10.

Next, as shown in FIGS. 4A and 4B, the semiconductor element chip 20 is placed face-up on the upper surface of the die chip section 14 to which the adhesive 22 has been applied, and pressed. Thus, the back surface of the semiconductor element chip 20 is adhered to the upper surface of the die chip portion 14 via the adhesive 22.

At this time, the hollow portion 16 at the center of the die tip portion 14 is covered by the semiconductor element chip 20, but the die tip portion 14 is provided with a ventilation between the hollow portion 16 and the outside. Since the ventilation groove 18 is provided, the cavity 16 does not become a closed space.

Subsequently, the package 10 in which the semiconductor chip 20 is mounted on the upper surface of the die tip section 14 is placed in a high-temperature bath and subjected to a predetermined heat treatment.
The adhesive 22 bonding the back surface to the upper surface of the die tip portion 14 is cured. In this way, the semiconductor element chip 20 is fixed on the upper surface of the die chip section 14.

At this time, the cavity 1 of the die tip portion 14 covered with the semiconductor element chip 20 is
The air in the cavity 6 thermally expands, but the thermally expanded air in the cavity 16 escapes to the outside of the die tip portion 14 through the ventilation groove 18. Therefore, the hollow portion 1 of the die tip portion 14
The occurrence of a tilt failure in which the semiconductor element chip 20 locally rises due to the thermal expansion of the air in 6 is easily prevented.

As described above, the semiconductor element chip 20 as shown in FIGS.
The semiconductor device housed in the housing section 12 of the No. 0 is manufactured.

As described above, according to the present embodiment, the ventilation groove 18 through which the hollow portion 16 and the outside are ventilated is provided in the substantially square-shaped die tip portion 14 whose central portion is the hollow portion 16.
Is provided, the semiconductor element chip 20 is placed face-up on the upper surface of the die chip portion 14, pressed, and the back surface of the semiconductor element chip 20 is bonded to the upper surface of the die chip portion 14 via the adhesive 22. At this time, the hollow portion 16 at the center of the die tip portion 14 is
Although it is in a state of being covered by the
Does not become a closed space due to the presence of the ventilation groove 18.

For this reason, the package 10 is placed in a high-temperature bath and subjected to a predetermined heat treatment to cure the adhesive 22 that bonds the back surface of the semiconductor chip 20 to the upper surface of the die chip 14, and to attach the semiconductor chip 20. While the air in the cavity 16 of the die chip 14 covered with the semiconductor element chip 20 thermally expands when being fixed to the upper surface of the die chip 14, the thermally expanded air in the cavity 16 The air escapes to the outside of the die tip portion 14 through the ventilation groove 18. Therefore, due to the thermal expansion of the air in the cavity 16 of the die tip portion 14, the semiconductor element chip 20
Can easily prevent the occurrence of tilting failure that locally rises, and a highly reliable semiconductor device can be realized.

According to this embodiment, when the package 10 to be prepared first is manufactured by, for example, a pressure molding method, only the mold used at that time is changed from the conventional mold, and the ventilation groove 18 is formed. Die tip part 1 provided
4 can be easily manufactured, and therefore, can be manufactured with almost no increase in the manufacturing cost and the number of steps as compared with the conventional case where the ventilation groove is not provided in the die tip portion.

(Second Embodiment) FIGS. 5A and 5B are a plan view and a cross-sectional view taken along the line AA of a semiconductor device according to a second embodiment of the present invention. Note that the same components as those of the semiconductor device shown in FIGS. 1A and 1B in the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

The semiconductor device according to the present embodiment includes the first
In the embodiment, the ventilation groove 18 for ventilating the cavity 16 of the die tip portion 14 and the outside thereof is provided at a predetermined one place, but the ventilation groove is formed by four sides of the substantially rectangular shape of the die tip portion. One is provided at each of two opposing sides.

That is, as shown in FIGS. 5 (a) and 5 (b), in the semiconductor device according to the present embodiment, a substantially square-shaped die tip portion 14 having a hollow portion 16 at the center thereof is formed. On two opposing sides of the four sides of the substantially rectangular shape, ventilation grooves 18a and 18b for venting the cavity 16 and the outside are provided one by one, which is a feature of the present embodiment. is there.

The dimensions of the ventilation grooves 18a and 18b are somewhat smaller as long as they function to ventilate the cavity 16 of the die tip portion 14 and the outside similarly to the first embodiment. Or semiconductor element chip 2
It may be any size as long as the upper surface of the die tip portion 14 for connection with the back surface remains. Therefore, the dimensions can be arbitrarily changed within this range.

The method of manufacturing the semiconductor device shown in FIGS. 5A and 5B, that is, the process of accommodating a semiconductor element chip in a package is also described in the first embodiment described with reference to FIGS. Since the configuration is basically the same as that of the embodiment, its illustration and description are omitted.

As described above, according to the present embodiment, the ventilation groove 18 for ventilating the hollow portion 16 and the outside is provided in the substantially square-shaped die tip portion 14 whose central portion is the hollow portion 16.
By providing the a and 18b, the package 10 is placed in a high-temperature bath and subjected to a predetermined heat treatment as in the case of the first embodiment, and the back surface of the semiconductor element chip 20 is placed on the upper surface of the die chip portion 14. When the adhesive 22 is cured and the semiconductor chip 20 is fixed to the upper surface of the die chip 14, air in the cavity 16 of the die chip 14 covered with the semiconductor chip 20 is removed. Even if the thermal expansion occurs, the thermally expanded air flows through the ventilation grooves 18a, 1
8b escapes to the outside of the die tip portion 14, so that it is easy to cause a tilt error in which the semiconductor element chip 20 is locally lifted due to thermal expansion of air in the cavity 16 of the die tip portion 14. And a highly reliable semiconductor device can be realized.

Moreover, in this case, the ventilation grooves 18a, 18b
Is provided on each of two opposing sides of the substantially square-shaped sides,
When the package 10 is placed in a high-temperature bath and subjected to a predetermined heat treatment, the thermally expanded air in the cavity 16 of the die chip portion 14 covered with the semiconductor element chip 20 passes through the ventilation grooves 18a and 18b. As a result, the semiconductor element chip 20 moves slightly in one direction as a reaction when air in the cavity 16 of the die tip portion 14 escapes through the ventilation grooves 18a and 18b to the outside. Can be prevented.

In the first embodiment, the case where the ventilation groove 18 is provided at one predetermined position of the die tip portion 14 is described. In the second embodiment, the four sides of the die tip portion 14 are formed. Although the case where the ventilation grooves 18a and 18b are provided at each of two opposing sides is described above, the installation position and the number of the ventilation grooves need not be limited to the above case. Also, for example, the die tip unit 1
The ventilation grooves may be provided on each of the four sides 4, and the number of ventilation grooves provided on each side need not be limited to one.

Also in such a case, as described above, when the package 10 is formed by the pressure molding method, the package 10 can be easily formed only by changing the mold used at that time to the conventional one. A package in which an arbitrary number of ventilation grooves are provided at an arbitrary place without increasing the manufacturing cost and the number of steps almost as compared with the case where the ventilation grooves are not provided in the conventional die tip portion. Can be produced.

[0039]

As described above, according to the semiconductor device of the present invention, the following effects can be obtained. In other words, according to the semiconductor device of the present invention, the ventilation groove for ventilating the outside of the die chip portion and the central hollow portion into the die chip portion provided in a substantially rectangular shape on the bottom surface of the package storage portion. Is provided, when the semiconductor element chip is adhered to the upper surface of the die chip portion, even if the hollow portion at the center of the die chip portion is covered by the semiconductor element chip, the hollow portion remains Since the space does not become a closed space, when the package is subsequently subjected to a predetermined heat treatment, the thermally expanded air in the cavity of the die tip portion can escape to the outside of the die tip portion through the ventilation groove. Therefore, it is possible to easily prevent the occurrence of a tilt error in which the semiconductor element chip locally rises due to the thermal expansion of the air in the cavity of the die tip portion, and to realize a highly reliable semiconductor device.

According to the semiconductor device of the second aspect, in the semiconductor device of the first aspect, the ventilation groove has at least one ventilation groove on each of two opposing sides of the substantially rectangular shape of the die tip portion. When the package is subjected to a predetermined heat treatment, the thermally expanded air in the central hollow portion of the die chip portion covered with the semiconductor element chip causes the air that has expanded in the central portion of the die chip portion to face the die chip portion. Since the air escapes in two opposite directions at the same time through the ventilation groove provided on the side, in addition to the effect of the above-mentioned claim 1, the air in the cavity of the die tip portion passes through the ventilation groove. As a result, the semiconductor element chip can be prevented from slightly moving in one direction as a reaction when escaping to the outside. Therefore, a semiconductor device having higher reliability can be realized.

[Brief description of the drawings]

FIGS. 1A and 1B are a plan view and a cross-sectional view taken along line AA of a semiconductor device in which a semiconductor element chip is housed in a package according to a first embodiment of the present invention; .

FIG. 2 is a process chart (1) for explaining a method of manufacturing the semiconductor device shown in FIG. 1, that is, a process of accommodating a semiconductor element chip in a package, wherein FIGS. It is the top view and sectional drawing corresponding to 1 (a) and (b).

FIG. 3 is a process diagram (part 2) for explaining a method of manufacturing the semiconductor device shown in FIG. 1, that is, a process of housing a semiconductor element chip in a package, wherein (a) and (b) are diagrams; It is the top view and sectional drawing corresponding to 1 (a) and (b).

FIG. 4 is a process diagram (part 3) for explaining a method of manufacturing the semiconductor device shown in FIG. 1, that is, a process of housing a semiconductor element chip in a package, wherein (a) and (b) are diagrams; It is the top view and sectional drawing corresponding to 1 (a) and (b).

FIGS. 5A and 5B are a plan view and a cross-sectional view taken along line AA of a semiconductor device in which a semiconductor element chip is housed in a package according to a second embodiment of the present invention. .

FIG. 6 is a process diagram (1) for explaining a process of accommodating a semiconductor element chip in a conventional package, wherein (a) and (b) are a plan view and A-
FIG. 3 is a sectional view taken along line A.

FIG. 7 is a process diagram (part 2) for explaining a process of accommodating a semiconductor element chip in a conventional package, wherein (a) and (b) are a plan view and A-
FIG. 3 is a sectional view taken along line A.

[Explanation of symbols]

10 package, 12 storage section, 14 die tip section, 16 hollow section, 18, 18a, 18b ...
Vent groove, 20 ... semiconductor element chip, 22 ... adhesive,
24 ... space.

Claims (2)

[Claims] 1. A semiconductor device in which a semiconductor element chip is housed in a package, comprising: a die chip portion provided in a substantially rectangular shape on a bottom surface of a housing portion of the package, and having a hollow portion in a central portion; The semiconductor device chip is provided in the die tip portion, and vents through the outside of the die tip portion and the cavity portion, and the semiconductor element chip fixed on the die tip portion. Semiconductor device. 2. The semiconductor device according to claim 1, wherein the ventilation groove is provided at least one at each of two opposing sides of the substantially rectangular shape of the die tip portion. apparatus.