JP2002026074A - Bonding apparatus and bonding method - Google Patents

Abstract

(57) [Problem] To improve the equipment efficiency and space efficiency of a manufacturing line by enabling a chip to be bonded to any of opposing surfaces of a substrate by a single bonding apparatus. SOLUTION: In a flip chip bonder 10 having a bonding head 14 capable of receiving a chip 2 taken out by a reversing unit 13 in an inverted state and bonding the chip 2 downward to an upper surface of a substrate 1, a flipping unit 13 is provided. Has a bonding stage 15 for receiving the chip 2 taken out in a non-inverted state and bonding the chip 2 upward to the lower surface of the substrate 1.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] The present invention relates to a bonding apparatus and a bonding method.

[0002]

2. Description of the Related Art Conventionally, there is a flip chip bonder for bonding a chip (flip chip) such as a semiconductor element to a bonding portion of a substrate such as a lead frame with an electrode surface facing downward (face down method). A conventional flip chip bonder includes a substrate support device for supporting a substrate, a chip supply table for mounting chips with the electrode surface facing upward, a chip mounted on the chip supply table, and taking out the chip by reversing the chip. A reversing unit with the surface facing downward, a bonding head for receiving the chip taken out by the reversing unit in a reversed state, and bonding the chip downward to the upper surface of the substrate, and a bonding stage for supporting the lower surface of the substrate during bonding by the bonding head. Is configured.

[0003]

However, when a flip chip bonder is incorporated in a manufacturing line and used, not only the chip is bonded to the substrate downward but also upward (face-up method) depending on the process before and after. In other words, there is a possibility that it is necessary to bond a chip having an electrode surface facing upward from below to a substrate supported with the bonding portion facing down.

In order to construct a manufacturing line that can bond a chip to a substrate from above or below from the prior art, a face-down type dedicated downward bonding device (flip chip bonder) and a face-up type It is necessary to arrange a dedicated upward bonding device side by side. This is unfavorable in terms of the equipment efficiency of the production line and the reduction in space.

An object of the present invention is to make it possible to bond a chip to both opposing surfaces of a substrate by a single bonding apparatus, and to improve the equipment efficiency and space efficiency of a manufacturing line.

[0006]

According to a first aspect of the present invention, there is provided a substrate supporting apparatus for supporting a substrate, a chip supply table for mounting chips, and taking out and taking out the chips mounted on the chip supply table. A reversing unit for reversing the chip, a first bonding head for receiving the chip taken out by the reversing unit and bonding the received chip to a first surface of the substrate, and a reversing unit for taking out the chip. A second bonding head for receiving the chip and bonding the received chip to a second surface opposite to the first surface of the substrate, wherein the second bonding head is provided by the first bonding head. The second surface of the substrate can be supported when the chip is bonded, and the first bonding head is provided with the second bonding head. It is obtained so as to be capable supporting the first surface of the substrate during bonding of the chip by Inguheddo.

According to a second aspect of the present invention, in the first aspect of the present invention, the reversing unit further includes a chip pick-up position for picking up a chip from the chip supply table, and the chip being attached to the first bonding head and the second bonding head. Wherein the first bonding head is movable between the transfer position and a bonding position for bonding the chip to a first surface of the substrate; and The second bonding head is configured to be movable between the transfer position and a bonding position for bonding the chip to the second surface of the substrate.

According to a third aspect of the present invention, in the first or second aspect of the present invention, there is further provided a first detecting device for detecting the position of the chip received by the first bonding head;
A second detecting device for detecting the position of the chip received by the bonding head and a third detecting device for detecting the position of the substrate supported by the substrate supporting device.

According to a fourth aspect of the present invention, in the bonding method using the bonding apparatus of the first aspect, when bonding the chip received by the first bonding head to the first surface of the substrate, 2 when the bonding head supports the second surface of the substrate and bonds the chip received by the second bonding head to the second surface of the substrate, the first bonding head is connected to the first surface of the substrate. It is designed to support the surface.

According to a fifth aspect of the present invention, in the bonding method using the bonding apparatus of the second aspect, the reversing unit reverses the chip taken out from the chip take-out position and is positioned at the transfer position. Sometimes
Transferring the chip from the reversing unit to the first bonding head at the transfer position, bonding the chip to a first surface of the substrate by the first bonding head, wherein the first bonding head When bonding to the first surface of the substrate, the second bonding head shall support the second surface of the substrate, and the reversing unit does not reverse the chip taken out from the chip take-out position without reversing the chip. When the chip is located at the transfer position, the chip is transferred from the reversing unit to the second bonding head at the transfer position, and the chip is bonded to the second surface of the substrate by the second bonding head. The second bonding head bonds the chip to a second surface of the substrate. When the graying in which the first bonding head is adapted to support a first surface of the substrate.

According to a sixth aspect of the present invention, there is provided a bonding method using the bonding apparatus of the third aspect, wherein the reversing unit reverses the chip taken out from the chip take-out position and is positioned at the transfer position. Sometimes
The chip is transferred from the reversing unit to the first bonding head at the transfer position, the position of the chip received by the first bonding head is detected by the first detection device, and the chip is detected by the third detection device. Detecting the position of the substrate supported by the substrate support device, the chip and the substrate based on the position of the chip detected by the first detection device and the substrate position detected by the third detection device Bonding the chip to the first surface of the substrate by the first bonding head while aligning the second bonding head when the first bonding head bonds the chip to the first surface of the substrate. A head supporting the second surface of the substrate, wherein the reversing unit removes the chip from the chip removing position; When the chip is positioned at the transfer position without inverting the chip, the chip is transferred from the reversing unit to the second bonding head at the transfer position, and the second bonding head is moved by the second detection device. The position of the received chip is detected, the position of the substrate supported by the substrate support device is detected by the third detection device, and the position of the chip detected by the second detection device and the third detection device are detected. Bonding the chip to the second surface of the substrate by the second bonding head while aligning the chip with the substrate based on the substrate position detected in the above, and the second bonding head attaches the chip to the second surface of the substrate. When bonding to the second surface of the substrate, the first bonding head supports the first surface of the substrate. It is.

[0012]

According to the first and fourth aspects of the present invention, the following operations are provided. Bonding the chip to the first surface of the substrate by bonding the chip received by the first bonding head to the first surface of the substrate and supporting the second surface of the substrate by the second bonding head; it can. On the other hand, the chip received by the second bonding head is bonded to the second surface of the substrate, and the first surface of the substrate is supported by the first bonding head, so that the chip is placed on the second surface of the substrate. Can also be bonded. Therefore, the chip can be bonded to the first surface or the second surface of the substrate by a single bonding apparatus, and the equipment efficiency and the space efficiency of the production line can be improved.

According to the second and fifth aspects of the present invention, the following operations are provided. Since both the first bonding head and the second bonding head can be moved from the bonding position to the chip transfer position, even when the chip is bonded to the first surface of the substrate, the chip remains on the second surface of the substrate. Also at the time of bonding, the chips can be transferred from the reversing unit to the bonding heads at the chip transfer position.

According to the third and sixth aspects of the invention, the following operations are provided. When bonding the chip to the first surface of the substrate, the substrate and the chip are aligned based on the detection position of the chip received by the first bonding head by the first detection device and the detection position of the substrate by the third detection device. By doing so, the precision of bonding can be improved. On the other hand, when the chip is bonded to the second surface of the substrate, the detection position of the chip received by the bonding stage by the second detection device is aligned with the detection position of the substrate by the third detection device, so that the bonding accuracy is high. Can be achieved.

[0015]

FIG. 1 is a schematic diagram showing a flip chip bonder according to the present invention, FIG. 2 is a schematic diagram showing a downward bonding system of a flip chip bonder, and FIG. 3 is a schematic diagram showing an upward bonding system of a flip chip bonder. FIG.

As shown in FIG. 1, the flip chip bonder 10 has a corresponding electrode group (not shown) of the chip 2 opposed to a connected terminal group (not shown) of the substrate 1 such as a lead frame, and press-contacts the two. And bonding.

The flip chip bonder 10 includes a substrate support device 11, a chip supply table 12, and a reversing unit 1.
3, a bonding head 14, and a bonding stage 15.

The substrate supporting device 11 is a guide rail 1 for supporting and guiding the substrate 1 conveyed by a conveying means (not shown).
1A and the guide rail 1 at the bonding position.
1A has a clamper (not shown) for holding the substrate 1.

The chip supply table 12 has a wafer sheet 3 on which a large number of chips 2 are attached with their electrode surfaces facing upward.
Is placed.

The reversing unit 13 sucks and picks up the chips 2 supplied to the chip supply table 12 by the suction nozzle 13A, and rotates the suction head 13A.
B enables the chip 2 to be turned 180 degrees. The reversing unit 13 is provided with a chip pick-up position for picking up the chip 2 relative to the chip supply table 12 along the guide rod 13C and a chip transfer position at which the chip 2 can be transferred to the bonding head 14 or the bonding stage 15. It is possible to move between.

The bonding head 14 is movable between a chip transfer position and a bonding position. At the chip transfer position, the bonding head 14 picks up the chip 2 picked up and inverted by the reversing unit 13 and functions as a suction nozzle 14A (also functions as a pressurizing unit for pressing the chip 2 against the upper surface of the substrate 1).
To be picked up and received. Here, the electrode group of the chip 2 inverted by the inversion unit 2 is located on the lower side. The bonding head 14 moves to the bonding position, and enables bonding to the bonding portion on the upper surface (first surface) of the substrate 1 with the chip 2 sucked and held by the suction nozzle 14A with the electrode surface facing down.

The bonding stage 15 is disposed below the substrate 1 at the bonding position, and can support the substrate 1 by abutting the lower surface thereof during bonding by the bonding head 14.

However, in the flip chip bonder 10, the bonding stage 15 is movable between the chip transfer position and the bonding position in order to enable upward bonding. And bonding stage 1
Reference numeral 5 denotes a suction nozzle 15A (which also functions as a pressurizing portion that presses against the lower surface of the substrate 1) in a non-inverted state (the electrode surface of the chip 2 is facing upward) at the chip transfer position with the chip 2 taken out by the reversing unit 13 in a non-inverted state. After being sucked and received and moved to the bonding position, the chip 2 sucked and held by the suction nozzle 15A can be bonded upward to the bonding portion on the lower surface (second surface) of the substrate 1. During upward bonding by the bonding stage 15, the bonding head 14 supports the substrate 1 by contacting the upper surface thereof.

In the flip chip bonder 10, a camera 21 constituting a third detecting device for pattern recognition of a bonding portion of the substrate 1 supported by the substrate supporting device 11, and a suction nozzle of the bonding head 14 The camera 22 constituting a first detection device for pattern recognition of the position of the chip 2 received by the chip 14A and the second detection device for pattern recognition of the position of the chip 2 received by the suction nozzle 15A of the bonding stage 15 are provided. It has a camera 23 to configure. Flip chip bonder 10
It is assumed that, when the center of the chip 2 is sucked, for example, on the center axis of the suction nozzle 14A of the bonding head 14, the suction position of the chip 2 with respect to the bonding head 14 is at a standard position with no displacement. When the suction nozzle 15A of the bonding stage 15 sucks the center of the chip 2 on the center axis, for example,
It is assumed that the suction position of the chip 2 with respect to No. 5 is at a standard position with no displacement. If the bonding point of the substrate 1 on the substrate support device 11 is at the standard position and the bonding position of the chip 2 to which the bonding head 14 or the bonding stage 15 is being mounted is at the standard position, the bonding head 14 or the bonding Since the stage 15 is simply positioned at the standard position of the bonding portion, the chip 2 to which the stage 15 is adsorbed can be bonded to the bonding portion of the substrate 1 without displacement. On the other hand, camera 2
As a result of the pattern recognition using Nos. 1 to 23, when the bonding point of the substrate 1 is deviated from the standard position or the suction position of the chip 2 to which the bonding head 14 or the bonding stage 15 is adsorbed is deviated from the standard position. Are the bonding head 14 and the bonding stage 1
Reference numeral 5 denotes a camera 21 to 2 at a standard position of the bonding portion.
In consideration of the shift amounts detected as a result of the pattern recognition using No. 3, the shift amounts of the chips 2 on which they are sucked are controlled so as to be aligned with the bonding portions of the substrate 1 without shifting.

Therefore, the bonding method using the flip chip bonder 10 is as follows. (A) Downward bonding (face down method) (FIGS. 1 and 2) (1) Position the reversing unit 13 at the chip take-out position,
Chip 2 is taken out (FIG. 1) and chip 2 is inverted.

(2) The reversing unit 13 and the bonding head 14 are moved to the chip transfer positions, and the chips 2 held by the reversing unit 13 are transferred to the bonding head 14 in a reversed state (FIG. 2).

(3) The position of the substrate 1 clamped by the substrate support device 11 is detected by using the camera 21, and the position of the chip 2 received by the bonding head 14 is detected by using the camera 22.

(4) The position of the chip 2 received by the bonding head 14 detected by the camera 22 and the position of the camera 2
The chip 2 held by the bonding head 14 is positioned downward while aligning the chip 2 with the substrate 1 based on the position of the bonding portion of the substrate 1 detected by using the substrate 1.
And press-bonding to the bonding portion on the upper surface.
At this time, the substrate 1 is supported from below by the bonding stage 15.

(B) Upward bonding (face-up method) (FIGS. 1 and 3) (1) Position the reversing unit 13 at the chip take-out position,
The chip 2 is taken out (FIG. 1).

(2) The reversing unit 13 and the bonding stage 15 are moved to the chip transfer positions, and the chip 2 held by the reversing unit 13 is transferred to the bonding stage 15 in a non-reversed state (FIG. 3).

(3) The camera 21 detects the position of the substrate 1 clamped to the substrate support device 11, and the camera 23 detects the position of the chip 2 received by the bonding stage 15.

(4) The chip 2 and the substrate 1 are separated based on the position of the chip 2 received by the bonding stage 15 detected by the camera 23 and the position of the bonding portion of the substrate 1 detected by the camera 21. While aligning, the chip 2 held by the bonding stage 15 is pressed upward to the bonding portion on the lower surface of the substrate 1 for bonding. At this time, the substrate 1 is supported by the bonding head 14 from above.

Therefore, according to the present embodiment, the following operations are provided. The flip chip bonder 10 includes the bonding head 1
By bonding the chip 2 received at 4 downward to the upper surface of the substrate 1 and supporting the substrate 1 from below by the bonding stage 15, the chip 2 can be bonded downward to the upper surface of the substrate 1. On the other hand,
Bonding the chip 2 upward to the lower surface of the substrate 1 by bonding the chip 2 received on the bonding stage 15 upward to the lower surface of the substrate 1 and supporting the substrate 1 from the upper surface side by the bonding head 14 Can also. Therefore, the chip 2 can be bonded to both the upper surface and the lower surface of the substrate 1 by the single flip chip bonder 10, so that the equipment efficiency and the space efficiency of the production line can be improved.

Since both the bonding head 14 and the bonding stage 15 can be moved from the bonding position to the chip transfer position, both when the chip 2 is bonded downward and when the chip 2 is bonded upward, the reversing unit 13 performs these bonding operations. Delivery of the chip 2 to the head 14 or the bonding stage 15 can be performed at the chip transfer position.

At the time of downward bonding of the chip 2,
Camera 2 of chip 2 received by bonding head 14
By positioning the two based on the detection position using the camera 2 and the detection position using the camera 21 on the substrate 1, it is possible to improve the accuracy of the downward bonding. On the other hand, at the time of upward bonding of the chip 2, the two are aligned based on the detection position of the chip 2 received by the bonding stage 15 using the camera 23 and the detection position of the substrate 1 using the camera 21. Accuracy can be improved.

The embodiment of the present invention has been described in detail with reference to the drawings. However, the specific configuration of the present invention is not limited to this embodiment, and the design can be changed without departing from the scope of the present invention. The present invention is also included in the present invention.

[0037]

As described above, according to the present invention, it is possible to bond a chip to any of the opposing surfaces of a substrate by using a single flip chip bonder, thereby improving the equipment efficiency and space efficiency of a production line.

[Brief description of the drawings]

FIG. 1 is a schematic view showing a flip chip bonder.

FIG. 2 is a schematic view showing a downward bonding method of a flip chip bonder.

FIG. 3 is a schematic view showing an upward bonding method of a flip chip bonder.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate 2 Chip 10 Flip chip bonder 11 Substrate support device 12 Chip supply table 13 Inversion unit 14 Bonding head 15 Bonding stage 21, 22, 23 Camera

Claims (6)

[Claims] 1. A substrate support device for supporting a substrate, a chip supply table on which chips are mounted, a reversing unit for taking out the chips mounted on the chip supply table, and reversing the chips taken out, A first bonding head for receiving the chip taken out by the reversing unit and bonding the received chip to a first surface of the substrate; and receiving the chip taken out by the reversing unit and placing the received chip on the substrate. A second bonding head capable of bonding to a second surface opposite to the first surface of the first bonding head, wherein the second bonding head is a second bonding head of the substrate when bonding the chip by the first bonding head. The first bonding head is formed of the chip by the second bonding head. A bonding surface capable of supporting the first surface of the substrate during bonding. 2. The chip reversing unit according to claim 1, further comprising: a chip pick-up position for picking up chips from the chip supply table;
The chip is movable between a transfer position for transferring the chip to the bonding head and the second bonding head, and the first bonding head bonds the chip to the transfer position and a first surface of the substrate. Wherein the second bonding head is movable between the transfer position and a bonding position for bonding the chip to the second surface of the substrate. The bonding apparatus according to claim 1, wherein 3. A first detection device for detecting a position of the chip received by the first bonding head;
3. The apparatus according to claim 1, further comprising a second detection device for detecting a position of the chip received by the bonding head, and a third detection device for detecting a position of the substrate supported by the substrate support device. The bonding apparatus as described in the above. 4. A bonding method using the bonding apparatus according to claim 1, wherein when bonding the chip received by the first bonding head to a first surface of the substrate, the second bonding head is connected to the first bonding head. The first bonding head supports the first surface of the substrate when supporting the second surface of the substrate and bonding the chip received by the second bonding head to the second surface of the substrate. A bonding method characterized by the above-mentioned. 5. A bonding method using the bonding apparatus according to claim 2, wherein when the reversing unit is positioned at the transfer position by reversing the chip taken out from the chip take-out position. The chip is transferred from the reversing unit to the first bonding head at the mounting position, and the chip is bonded to the first surface of the substrate by the first bonding head, and the first bonding head attaches the chip to the first bonding head. When bonding to the first surface of the substrate, the second bonding head supports the second surface of the substrate, and the reversing unit performs the transfer without reversing the chip taken out from the chip take-out position. When the transfer unit is located at the transfer position, And transferring the chip to the down loading head,
The second bonding head bonds the chip to a second surface of the substrate, and the second bonding head bonds the chip to a second surface of the substrate. 1. A bonding method, comprising: supporting the first surface. 6. The bonding method using the bonding apparatus according to claim 3, wherein the reversing unit reverses the chip taken out from the chip take-out position and is positioned at the transfer position when the chip is taken out. The chip is transferred from the reversing unit to the first bonding head at the mounting position, the position of the chip received by the first bonding head is detected by the first detection device, and the substrate is detected by the third detection device. Detecting the position of the substrate supported by a supporting device, and positioning the chip and the substrate based on the position of the chip detected by the first detecting device and the position of the substrate detected by the third detecting device. Bonding the chip to the first surface of the substrate by the first bonding head while aligning the first bonding head; When the head bonds the chip to the first surface of the substrate, the second bonding head supports the second surface of the substrate, and the reversing unit removes the chip from the chip removal position. When the chip is positioned at the transfer position without being inverted, the chip is transferred from the reversing unit to the second bonding head at the transfer position, and is received by the second bonding head by the second detection device. The position of the chip is detected, and the position of the substrate supported by the substrate support device is detected by the third detecting device, and the position of the chip detected by the second detecting device and the position of the chip detected by the third detecting device are detected. The chip is moved by the second bonding head while aligning the chip with the substrate based on the position of the substrate. Bonding to the second surface of the substrate, wherein the first bonding head supports the first surface of the substrate when the second bonding head bonds the chip to the second surface of the substrate. Bonding method.