JP2002001251A - Substrate processing equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To stably and surely obtain good processing quality in a scanning type ultraviolet irradiation process, especially also at an end portion of a substrate in a scanning direction. SOLUTION: First, one end of a substrate G (right end Ga).
UV irradiation is performed in a stationary state with respect to. During the ultraviolet irradiation, the stage 76 remains stationary at the origin position in the Y direction, and the ultraviolet rays are intensively or locally incident on the surface of the substrate right end Ga. Next, ultraviolet irradiation by scanning is performed on the entire surface of the substrate G. In the ultraviolet irradiation step by this scanning, the stage 76 moves one-way at a predetermined speed from the origin position to the forward movement position in the Y direction, so that ultraviolet light is emitted from the right end to the left end of the surface of the substrate G. Next, ultraviolet irradiation is performed on the left end Gb of the substrate in a stationary state. In this ultraviolet irradiation step, ultraviolet light is intensively or locally incident on the surface of the substrate left end Gb.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a substrate processing apparatus for performing predetermined processing by irradiating a substrate to be processed with ultraviolet rays.

[0002]

2. Description of the Related Art In the manufacture of semiconductor devices, various types of fine processing are performed on the premise that a surface of a substrate to be processed (for example, a semiconductor wafer, an LCD substrate, etc.) is in a cleaned state. Therefore, prior to each processing or between each processing, the surface of the substrate to be processed is cleaned,
For example, in a photolithography process, the surface of a substrate to be processed is cleaned before applying a resist.

Conventionally, as a cleaning method for removing organic substances on the surface of a substrate to be processed, a dry cleaning technique using ultraviolet irradiation has been known. This cleaning technique has a predetermined wavelength (185 n when a low-pressure mercury lamp is used as an ultraviolet light source).
m, 254 nm, 172 n for dielectric barrier discharge lamps
m) Oxygen is excited using ultraviolet light, and the organic substances on the substrate surface are oxidized by ozone and nascent oxygen.
It is to be vaporized and removed.

In general, such an ultraviolet irradiation cleaning apparatus for performing dry cleaning by irradiation with ultraviolet light contains one or more lamps serving as ultraviolet light sources arranged side by side in a lamp chamber having a window made of quartz glass. Arranging the substrate to be processed in the cleaning processing chamber adjacent to the lamp chamber through the window,
Ultraviolet rays emitted from a lamp in the lamp chamber are irradiated to the surface of the substrate to be processed through the quartz glass window. Recently, the number of lamps has been reduced and the size of the quartz glass window has been reduced by moving the lamp relatively parallel to the surface of the substrate to be processed and scanning the surface with ultraviolet light. .

[0005]

However, the conventional cleaning type ultraviolet irradiation cleaning apparatus has a problem that the cleaning effect is not sufficient at both ends of the substrate in the scanning direction. The cause of this problem is that both ends of the substrate in the scanning direction are the starting and ending positions of the scanning and the turning on and off positions of the lamps, so that the illuminance or irradiation amount of ultraviolet rays is insufficient spatially and temporally. is there. Therefore, the closer to the edge of the substrate, the lower or insufficient the amount of ultraviolet irradiation, and the weaker the cleaning effect.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems of the prior art, and provides a good treatment at each part of a substrate to be processed, particularly at a substrate end in the scanning direction in a scanning type ultraviolet irradiation treatment. An object of the present invention is to provide a substrate processing apparatus capable of stably and reliably obtaining quality.

It is another object of the present invention to provide a substrate processing apparatus capable of uniformly and efficiently obtaining good processing quality in each part of a substrate to be processed in a scanning type ultraviolet irradiation process.

[0008]

In order to achieve the above object, a substrate processing apparatus of the present invention irradiates a substrate with ultraviolet light to perform a predetermined processing. A supporting means for supporting, one or a plurality of lamps which emit ultraviolet rays when supplied with electric power, an ultraviolet irradiating means for irradiating ultraviolet rays emitted from the lamps toward the substrate to be processed, and One or both of the support means and the ultraviolet irradiation means are predetermined so that the target surface of the substrate to be processed supported by the support means is scanned from one end to the other end of the substrate. And the driving means for moving the substrate in one direction and the one end and / or the other end of the substrate to be processed with both the support means and the ultraviolet irradiation means substantially stationary. The ultraviolet rays from the outside line irradiation means has a configuration and a control means for irradiating a predetermined time.

In the substrate processing apparatus of the present invention, one end and / or the other end of the substrate to be processed in the scanning direction is continuously irradiated with ultraviolet light for a predetermined time in a stationary state, so that a desired ultraviolet light is emitted. Stable and reliable processing can be performed with the irradiation amount. In addition, by setting the scanning speed to an appropriate value for the other processing surface portion of the substrate to be processed, it is possible to perform a stable and reliable processing at a desired ultraviolet irradiation amount. In the scanning direction, the ultraviolet irradiation unit of the ultraviolet irradiation unit does not protrude outside from one end and / or the other end of the substrate to be processed, so that the apparatus space can be reduced.

According to one aspect of the present invention, in the ultraviolet irradiation means, a plurality of the lamps are arranged in a line in parallel with the scanning direction with a lamp longitudinal direction orthogonal to the scanning direction. May be configured such that the plurality of lamps are sequentially turned on or off at predetermined time intervals one by one from the last side in the scanning direction. With such a configuration, variations in the amount of ultraviolet irradiation due to scanning are compensated for the end of the substrate to which the ultraviolet irradiation is performed in the stationary state as described above, and the amount of ultraviolet irradiation in the stationary mode and the scanning mode is made uniform. Can be done.

[0011]

Preferred embodiments of the present invention will be described below with reference to the accompanying drawings.

FIG. 1 shows a coating and developing system as an example of a system into which the substrate processing apparatus of the present invention can be incorporated.
This coating and developing system is installed in a clean room, and performs, for example, cleaning, resist coating, pre-baking, developing and post-baking in a photolithography process in an LCD manufacturing process, for example, using an LCD substrate as a substrate to be processed. is there. The exposure processing is performed by an external exposure apparatus (not shown) installed adjacent to this system.

The coating and developing system is roughly divided into a cassette station (C / S) 10, a process station (P / S) 12, and an interface (I / O).
/ F) 14.

A cassette station (C / S) 10 installed at one end of the system includes a cassette stage 16 on which a predetermined number, for example, four, of cassettes C accommodating a plurality of substrates G can be placed, and a cassette stage 16 on this stage 16. And a transfer mechanism 20 for loading and unloading the substrate G with respect to the cassette C. The transfer mechanism 20 has a unit capable of holding the substrate G, for example, a transfer arm, is operable in four axes of X, Y, Z, and θ, and is a process station (P / S) described later.
The transfer of the substrate G to and from the main transfer device 38 on the 12th side can be performed.

The process station (P / S) 12 includes:
The cleaning process unit 22, the coating process unit 24, and the developing process unit 26 are sequentially changed from the cassette station (C / S) 10 side to the substrate relay unit 23, the chemical solution supply unit 25.
And are provided in a horizontal row with (and sandwiching) a space 27 therebetween.

The cleaning process unit 22 includes two scrubber cleaning units (SCRs) 28 and two upper and lower ultraviolet irradiation / irradiation units.
It includes a cooling unit (UV / COL) 30, a heating unit (HP) 32, and a cooling unit (COL).

The coating process unit 24 includes a resist coating unit (CT) 40 and a reduced-pressure drying unit (VD) 42
And the edge remover unit (ER) 44 and the upper and lower 2
Stage type adhesion / cooling unit (AD / COL) 4
6, upper and lower two-stage heating / cooling unit (HP / COL)
48 and a heating unit (HP) 50.

The development process section 26 includes three development units (DEV) 52, two upper and lower two-stage heating / cooling units (HP / COL) 55, and a heating unit (HP) 5
3 is included.

At the center of each of the process sections 22, 24 and 26, transport paths 36, 52 and 58 are provided in the longitudinal direction, and the main transport devices 38, 54 and 60 move along each transport path to Each unit in the unit is accessed to carry in / out or carry in the substrate G. In this system, in each of the process units 22, 24, and 26, a spinner system unit (SCR, CT, DEV, etc.) is disposed on one side of the transport paths 36, 52, and 58, and heat treatment or heat treatment is performed on the other side. Irradiation treatment system unit (HP, CO
L, UV, etc.).

An interface unit (I / F) 14 installed at the other end of the system has a process station (P / F).
S) An extension (substrate transfer section) 57 and a buffer stage 56 are provided on the side adjacent to 12, and a transport mechanism 59 is provided on the side adjacent to the exposure apparatus.

FIG. 2 shows a processing procedure in the coating and developing processing system. First, the cassette station (C
/ S) 10, the transport mechanism 20 takes out one substrate G from the predetermined cassette C on the stage 16 and
It is transferred to the main transfer device 38 of the cleaning process section 22 of the process station (P / S) 12 (step S1).

In the cleaning process section 22, the substrate G
First, they are sequentially carried into an ultraviolet irradiation / cooling unit (UV / COL) 30, subjected to dry cleaning by ultraviolet irradiation in the upper ultraviolet irradiation unit (UV), and then cooled to a predetermined temperature in the lower cooling unit (COL). (Step S2). This ultraviolet irradiation cleaning removes organic substances on the substrate surface. This improves the wettability of the substrate G,
The cleaning effect in the scrubbing cleaning in the next step can be enhanced.

Next, the substrate G is provided with a scrubber cleaning unit (S
One of the CRs 28 undergoes a scrubbing cleaning process to remove particulate contamination from the substrate surface (step S3).
After the scrubbing cleaning, the substrate G is heated by a heating unit (H
(P) 32 undergoes dehydration by heating (step S)
4) Then, the substrate is cooled to a certain substrate temperature by the cooling unit (COL) 34 (step S5). Thus, the pre-processing in the cleaning process unit 22 is completed, and the substrate G is transported by the main transport unit 38 to the coating process unit 24 via the substrate transfer unit 23.

In the coating processing section 24, the substrate G
First, the adhesion / cooling unit (AD / COL) 4
6 in sequence, and the first adhesion unit (A
In D), a hydrophobizing treatment (HMDS) is performed (step S).
6) Then, the substrate is cooled to a constant substrate temperature in the next cooling unit (COL) (step S7).

Thereafter, the substrate G is coated with a resist solution in a resist coating unit (CT) 40, and then subjected to a drying process under reduced pressure in a reduced-pressure drying unit (VD) 42, and then the substrate is removed in an edge remover unit (ER) 44. Excess (unnecessary) resist on the periphery is removed (step S
8).

Next, the substrate G is placed in a heating / cooling unit (H
P / COL) 48, and the first heating unit (HP) performs baking (pre-bake) after coating (step S9), and then cools to a constant substrate temperature by the cooling unit (COL) (step S9). Step S10). In addition,
The heating unit (HP) 50 can be used for baking after the application.

After the coating process, the substrate G is transferred to the interface (I / F) 14 by the main transfer device 54 of the coating process unit 24 and the main transfer device 60 of the development process unit 26.
To the exposure apparatus from there (step S
11). The exposure device exposes a resist on the substrate G to a predetermined circuit pattern. Then, the substrate G after the pattern exposure is transferred from the exposure apparatus to the interface unit (I / F) 14.
Is returned to. The transfer mechanism 59 of the interface unit (I / F) 14 transfers the substrate G received from the exposure apparatus via the extension 57 to the process station (P / S) 1.
(Step S11).

In the developing process section 26, the substrate G
One of the developing units (DEV) 52 undergoes a developing process (step S12), and then is sequentially loaded into one of the heating / cooling units (HP / COL) 55, and is post-baked in the first heating unit (HP). Is performed (step S13), and then cooled to a certain substrate temperature by the cooling unit (COL) (step S14). A heating unit (HP) 53 can be used for this post-baking.

The substrate G that has been subjected to a series of processes in the developing process section 26 is returned to the cassette station (C / S) 10 by the transfer devices 60, 54, and 38 in the process station (P / S) 24. Stored in one of the cassettes C by the transport mechanism 20 (step S
1).

In this coating and developing system, the present invention can be applied to the ultraviolet irradiation unit (UV) of the cleaning process section 22. Hereinafter, an embodiment in which the present invention is applied to an ultraviolet irradiation unit (UV) will be described with reference to FIGS.

As shown in FIGS. 3 and 4, the ultraviolet irradiation unit (UV) according to the embodiment of the present invention has a quartz glass window 62 attached to the lower surface, and one or more windows are installed in the room (in the illustrated example, FIG. (n = 4, ie, four) cylindrical ultraviolet lamps 64 (1), 64 (2) 2, 64 (n) arranged side by side in the horizontal direction perpendicular to the longitudinal direction of the lamps.
And a cleaning processing chamber 68 provided adjacent to and below the lamp chamber 66.

In the lamp chamber 66, each of the ultraviolet lamps 64 (i) (i = 1, 2,..., N) may be, for example, a dielectric barrier discharge lamp. And emits ultraviolet light (ultraviolet excimer light) having a wavelength of 172 nm suitable for cleaning of organic contamination. Behind or above each ultraviolet lamp 64 (i), a concave reflecting mirror 70 having an arc-shaped cross section is arranged. Ultraviolet rays emitted from each lamp 64 (i) upward or to the side are concave mirrors directly above. The light is reflected by the portion and directed toward the quartz glass window 62 side.

An ultraviolet lamp 64 is provided in the lamp chamber 66.
A cooling jacket (not shown) for cooling (1) to 64 (n) by, for example, a water-cooling method, or an inert gas for preventing entry of oxygen that absorbs ultraviolet rays (and thus deteriorates lamp luminous efficiency) into the room. A gas distribution mechanism (not shown) for introducing and filling a gas such as N2 gas may be provided. On both sides of the lamp chamber 66, there are provided utility units 74 for accommodating a control unit and a utility supply unit for supplying a required utility or control signal to each unit in the ultraviolet irradiation unit (UV).

A horizontally movable and vertically movable stage 76 for mounting and supporting the substrate G is provided in the cleaning processing chamber 68.
Is provided. In this embodiment, the ball screw 78
Stage 7 on a self-propelled stage drive 80 using
6 is mounted so as to be able to move up and down in the vertical direction (Z direction in the figure), and the stage driving unit 80 is moved in a predetermined horizontal direction (Y direction in the figure) along the ball screw 78 and the guide 82 extending in parallel with the ball screw 78. It is configured to be able to reciprocate between an origin position (FIG. 3) and a forward movement position (FIG. 4) so as to cross right below the lamp chamber 66 in parallel with the lamp arrangement direction. Although not shown, an exhaust system for exhausting the interior of the cleaning processing chamber 68 may be provided.

In this embodiment, the stage 76 is mounted on the substrate G
Is placed at the origin position in the Y direction with the quartz glass window 62 of the lamp chamber 66 as shown in FIG.
Is opposed to one end Ga of the substrate G (right side in the figure), and when the stage 76 is located at the forward movement position in the Y direction with the substrate G mounted thereon, as shown in FIG. The quartz glass window 62 at the other end (left side in the figure) Gb of the substrate G
To be opposed. The ultraviolet lamps 64 (1) to 64 (n) in the lamp chamber 66 have a dimension (the lamp) that slightly protrudes from the substrate G in the lamp longitudinal direction with respect to the substrate G on the stage 76 located immediately below. Head).

A plurality of (for example, six) lift pins 84 for vertically supporting the substrate G when loading / unloading the substrate G are vertically penetrated through the stage 76. In this embodiment, each of the lift pins 84 is fixed at a predetermined height position for transferring the substrate, and the stage 76 is positioned against the fixed lift pins 84 so as not to hinder the loading / unloading of the substrate G. And stage 76 itself substrate G
The upper limit height Hc indicated by the dashed line for mounting and supporting
Can be moved up and down by an elevating mechanism (not shown). On the upper surface of the stage 76, a large number of support pins (not shown) for supporting the substrate G, a vacuum chuck suction port (not shown) for sucking and holding the substrate G, and the like are provided.

On the side wall of the cleaning chamber 68 adjacent to the origin position of the stage 76 in the Y direction, an openable / closable shutter (for opening / closing the substrate G at a height near the upper end of the fixed lift pin 84). Door) 86 is attached. The shutter 86 faces the transport path 36 (FIG. 1) of the cleaning process unit 22, and the substrate G is transferred from the transport path 36 into the cleaning processing chamber 68 through the shutter 86 in which the main transport device 38 is open. Loading and unloading can be performed.

FIG. 5 shows this ultraviolet irradiation unit (UV).
3 shows the configuration of the control system. The control unit 88 may be constituted by a microcomputer, and a built-in memory stores a necessary program for controlling each unit in the unit and the entire unit. It is connected to a main controller (not shown) that controls the overall processing procedure of the system and to various parts of a control system in the ultraviolet irradiation unit (UV).

In this embodiment, main parts in the present ultraviolet irradiation unit (UV) related to the control unit 88 are as follows:
A shutter driving unit 90 for driving the shutter 86; a stage elevating driving unit 92 for elevating the stage 76 in the Z direction; a scanning driving unit 94 for horizontally or scanning driving the stage 76 in the Y direction; A lamp power supply unit 96 for driving and driving the ultraviolet lamps 64 (1) to 64 (n) in 66, sensors 98 for detecting the state of each unit in the apparatus, and the like. The stage elevating drive unit 92 and the scan drive unit 94 each have, for example, a servomotor as a drive source, and are provided in the stage drive unit 80. The lamp power supply 96 is provided in the utility unit 74 together with the control unit 88. The sensors 98 are in the stage 7
6, the origin position and the forward movement position in the Y direction, and Z
And a position sensor for detecting a height position for mounting the substrate and a height position for retreating in the direction.

FIG. 6 shows the ultraviolet irradiation unit (UV)
The main operation procedure in is shown. First, upon receiving an instruction from the main controller, each unit in the unit including the control unit 88 is initialized (step A1). During this initialization, the stage 76 is positioned at a predetermined origin position close to the shutter 86 in the Y direction, and is lowered to the retreat height position (Hd) in the Z direction. As will be described later, the times Ta and Tb during which the lamps 64 (1) to 64 (n) in the lamp chamber 66 emit light for a while with the stage 76 stationary at the start and end of scanning are set in predetermined registers. May be.

When the main transfer device 38 (FIG. 1) transfers the unprocessed substrate G from the cassette station (C / S) 10 to the position before the main ultraviolet irradiation unit (UV), the control unit 8 operates.
Reference numeral 8 controls the corresponding sections so as to transfer the substrate G to and from the main transport device 38 (step A2).

More specifically, first, the shutter driver 90 is controlled to open the shutter 86. The main transfer device 38 has a pair of transfer arms, and places the substrate G before cleaning on one transfer arm, and leaves the other transfer arm empty (no substrate). When there is no cleaned substrate G in the ultraviolet irradiation unit (UV), the transfer arm for supporting the substrate G before cleaning has the shutter 86 opened.
Through the cleaning processing chamber 68, and the uncleaned substrate G
Is transferred onto the fixed lift pins 84. If there is a cleaned substrate G in the ultraviolet irradiation unit (UV), the cleaned substrate G is first carried out by an empty transfer arm, and then the uncleaned substrate G is carried in as described above. I do. As described above, when the substrate G to be subjected to the ultraviolet cleaning process by the main ultraviolet irradiation unit (UV) is loaded and placed on the fixed lift pins 84 by the main transfer device 38, the shutter 86 is closed.

Next, the control section 88 controls the stage up / down drive section 92 to raise the stage 76 to the substrate mounting height position Hc (step A3). At this time, the suction of the vacuum chuck portion is started while the stage 76 is rising,
The substrate G may be suctioned and held at the same time when the stage 76 reaches the substrate mounting height position Hc. When the stage 76 rises to the substrate mounting height position Hc with the substrate G mounted thereon, the right end Ga of the substrate G is fixed to the ultraviolet emission window 62 of the lamp chamber 66 located immediately above the same. They face each other at intervals (Fig. 3).

Next, the control section 88 controls the lamp power supply section 96 to turn on all the ultraviolet lamps 64 (1) to 64 (n) at the same time (step A4). UV lamp 64 (1) -6
By turning on 4 (n), the ultraviolet irradiation cleaning process (step A5) for the substrate G is started.

FIG. 7 shows the procedure of the ultraviolet irradiation cleaning process (step A5).

As described above, the ultraviolet lamps 64 (1)-
When 64 (n) is turned on, an ultraviolet irradiation step in a stationary state with respect to one end (right end Ga) of the substrate G is executed from that point on (step B1). During this ultraviolet irradiation step, the stage 76 remains stationary at the origin position in the Y direction, and the ultraviolet light emitted downward from the quartz glass window 62 of the lamp chamber 66 is directed to the surface of the right end portion Ga of the substrate located immediately below. Incident intensively or locally.

By irradiating the surface of the right end portion Ga of the substrate with ultraviolet rays (ultraviolet excimer light) having a wavelength of 172 nm, oxygen existing near the ultraviolet irradiation area is changed to ozone O3 by the ultraviolet rays. Further, the ozone O3 is excited by the ultraviolet light and the oxygen atom radical O
* Is generated. Due to the oxygen radicals, organic substances attached to the ultraviolet irradiation region are decomposed into carbon dioxide and water and removed from the substrate surface. Note that the ultraviolet lamps 64 (1) to 64 (n) in the lamp chamber 66 are so arranged that the illuminance of the ultraviolet light incident on the surface of the substrate G exceeds a predetermined value (lower limit value) necessary for removing the organic substances as described above. The brightness is set.

The right edge G of the substrate performed as described above
UV irradiation process in a stationary state for a (step B1)
Is the amount of ultraviolet irradiation per unit area (integrated light amount) at least at each part of the right end (edge) surface of the substrate G.
The time may be selected to be equal to or longer than a predetermined value so that Pa exceeds a reference value Ps that can guarantee a desired cleaning result.

When the control unit 88 measures the time Ta (step B2), the control unit 88 terminates the ultraviolet irradiation step on the right end of the substrate G at that time, and the stage driving unit 8
The stage 76 is moved in the Y direction by the 0 scan driver 94. Thus, an ultraviolet irradiation step by scanning is performed on the entire surface of the substrate G (step B3).

In the ultraviolet irradiation step by this scanning (step B3), the stage 76 is moved to the origin position in the Y direction (FIG. 3).
8 moves from the lamp chamber 66 to the front surface of the substrate G in a reverse direction from the right end to the left end of the substrate G (FIG. 8).
(Y ′ direction) at the above speed. Even during this scanning, the organic substances are decomposed and removed by the action of ozone and oxygen atom radicals O * at the respective portions on the substrate G where the ultraviolet rays are incident, similarly to the above. The scanning speed (movement speed of the stage 76) V is the above-mentioned reference value Ps, which is the amount of ultraviolet irradiation (integrated light amount) Pj per unit area at each part of the substrate surface through which ultraviolet light passes.
The speed may be selected to be less than a predetermined value so as to exceed the predetermined value.

When the stage 76 reaches the forward movement position in the Y direction (step B4), the control unit 88 moves forward in response to a signal from a predetermined position sensor, stops the scanning drive unit 94, and moves the stage 76 in the Y direction. Is stopped, and the ultraviolet irradiation step by the above-described scanning is completed. At this time, the left end Gb of the substrate G is located immediately below the lamp chamber 66 as shown in FIG.

Therefore, immediately after the step of irradiating the ultraviolet ray by scanning (step B3) is completed, the ultraviolet ray irradiating step (step B5) of the substrate left end Gb in a stationary state is executed. In this ultraviolet irradiation step, ultraviolet light emitted downward from the quartz glass window 62 of the lamp chamber 66 is intensively or locally incident on the surface of the substrate left end Gb located immediately below. As a result, organic substances are decomposed and removed by the action of ozone and oxygen atom radicals O * at the respective portions of the surface of the substrate left end Gb to be irradiated with ultraviolet rays in the same manner as described above.

The time Tb required for the above-mentioned stationary ultraviolet cleaning process (step B5) for the right end portion Gb of the substrate is at least the amount of ultraviolet irradiation per unit area at each portion of the left end (edge) surface of the substrate G. (Integrated light amount) Pb may be selected to be equal to or longer than a predetermined value so as to exceed the reference value Ps, and is usually set to the same value as the set time Ta of the ultraviolet irradiation step (step B1) for the right end of the substrate May be.

When the control unit 88 has counted the set time Tb (step B6), the control unit 88 completes the all-ultraviolet irradiation cleaning processing for the substrate G (step A5) at that time, and controls the lamp power supply unit 96 to control the ultraviolet lamp 64. (1) to 64 (n) are turned off all at once (step A6).

Next, the control unit 88 returns the stage 76 to the start position (step A7). In this embodiment,
First, the stage 76 is moved or moved back from the forward movement position (FIG. 4) to the origin position in the Y direction (FIG. 3) by the scanning drive unit 94, and then the vacuum chuck is turned off at the origin position in the Y direction, and then the stage is moved up and down. The stage 76 is lowered to the retreat height position (Hd) by the part 92, and the substrate G is supported by the fixed lift pins 84. In this manner, all the steps in the main ultraviolet ray cleaning unit (UV) for one substrate G are completed,
Wait for the main transfer device 38 (FIG. 1) to come.

FIG. 8 schematically shows the operation of the above-described ultraviolet irradiation cleaning process (step A5) in this embodiment. In this ultraviolet irradiation cleaning process, the lamp chamber 66 not only scans and irradiates the entire surface of the substrate G with ultraviolet light from the right end to the left end of the substrate G with respect to the substrate G on the stage 76, but also scans and irradiates the substrate right end G Ultraviolet rays are locally radiated to the left end Gb in a state of being stationary for a predetermined time Ta, Tb.

In this embodiment, "the right edge Ga of the substrate" refers to the stage 76 at the origin position in the Y direction (FIG. 3).
Is the surface area of the substrate G on which ultraviolet light from the lamp chamber 66 is incident with illuminance effective for cleaning in the state where the substrate 76 is located at the left side Gb of the substrate. Is the surface area of the substrate G where the ultraviolet light from the lamp chamber 66 is incident at an illuminance effective for cleaning in a state where it is located at the position shown in FIG.

At the right end portion Ga and the left end portion Gb of the substrate, the irradiation time of the ultraviolet irradiation by scanning overlapping with the ultraviolet irradiation in the stationary state increases toward the center of the substrate. It becomes maximal. For the sake of simplicity, it is assumed that ultraviolet light is irradiated from the quartz glass window 62 of the lamp chamber 66 as parallel light having a width W in the scanning direction and irradiates the substrate surface immediately below with a constant illuminance E. The ultraviolet irradiation amount (integrated light amount) Pi per unit area at each scanning direction position yi of the substrate left end Gb of No. 8 is given by the following equation (1). Pi = E (Tb + yi / V) ‥‥‥ (1)

In this equation (1), the first term (E
(Tb) corresponds to the above-mentioned ultraviolet irradiation amount (integrated light amount) Pb at the left end of the substrate G. Tb is a set time of the ultraviolet irradiation step in a stationary state with respect to the substrate left end Gb, and V is a scanning speed (assumed constant).

In FIG. 8, the ultraviolet irradiation amount (integrated light amount) Pj per unit area at each substrate position yj in the scanning direction at the intermediate portion of the substrate is given by the following equation (2). Pj = E · W / V ‥‥‥ (2)

As described above, in this embodiment, the lamp chamber 66 hardly or slightly protrudes from the edge of the substrate G in the ultraviolet scanning of the substrate G due to the relative positional relationship with the substrate G. The device space in the direction can be reduced. In addition, there is an advantage that ultraviolet rays need not be radiated to the outside of the substrate G. Ultraviolet rays from the lamp chamber 66 are locally applied to the both ends Ga and Gb in the scanning direction, in which the amount of ultraviolet irradiation tends to be reduced temporally and spatially in the scanning of the ultraviolet rays, before and after the start of the scanning, respectively. Irradiating light in a focused or intensive manner, so that even with an apparatus configuration in which the scanning distance or the apparatus size in the scanning direction is shortened, the irradiation amount is equal to or more than the reference value Ps that can guarantee a desired cleaning result on each surface of the substrate G. It is possible to irradiate ultraviolet rays, so that organic contamination can be stably and reliably removed from every corner of the substrate surface.

In the above-described embodiment, the scanning of the substrate G with the ultraviolet rays from one end to the other is stopped only once in the ultraviolet irradiation cleaning process (step A5), but may be repeated a plurality of times. Not only forward movement but also backward movement can be used for scanning.

In the above embodiment, the lamp chamber 6
6 while the plurality of ultraviolet lamps 64 (1) to 64 (n) are all emitting light, the right end Ga and the left end Gb of the substrate G.
UV irradiation process in a stationary state with respect to
B5) was performed. However, as another embodiment, the turning on and off of the ultraviolet lamps 64 (1) to 64 (n) in these stationary ultraviolet irradiation steps (steps B1 and B5) are shown in FIGS. 9 and 10, respectively. By sequentially performing the sequence at predetermined time intervals in a simple sequence, it is possible to equalize the UV irradiation amount (integrated light amount) distribution on the substrate G as shown in FIG. 11 and to save lamp power consumption.

In FIG. 9, in the ultraviolet irradiation process (step B 1) in the stationary state on the right end Ga of the substrate G performed before the scanning (step B 1), (A) → (B) →
As shown in (C) → (D), the rightmost lamp 64 (n) which is the last in the scanning direction (Y ′ direction) is first turned on, and after a predetermined time, the second lamp 64 (n−1) from the last. ) Is turned on, and the subsequent lamps 64 (n-2), 64 (n-3)} are sequentially turned on at the predetermined time intervals toward the head in the scanning direction (Y 'direction).

In this case, the rightmost lamp 64 (n) irradiates the rightmost portion (right edge) even in the area of the right side edge Ga of the substrate, and the irradiation time is all lamps 64 (1) to 64 (n). ) The longest of. On the other hand, the left end (leading) lamp 64 (1) irradiates the portion closest to the substrate center even in the region of the right end portion Ga of the substrate, and the irradiation time is the same as that of all the lamps 64 (1) to 64 (n). The shortest. Therefore, when the ultraviolet irradiation step (step B1) in the stationary state is completed, the ultraviolet irradiation amount distribution has a stepped shape as shown by the solid line Q1 in FIG. 12, and the lamp chamber 66 is located within the region of the right end Ga of the substrate. In the portion facing the rightmost lamp 64 (n), the amount of ultraviolet irradiation is the largest. The irradiation time of the rightmost lamp 64 (n) may be set so that this ultraviolet irradiation amount Pa 'exceeds the above-mentioned reference value Ps which guarantees a desired cleaning effect. For simplicity of understanding, the ultraviolet light emitted downward from each lamp 64 (i) through the quartz glass window 62 is parallel light having a width wo in the scanning direction and has a constant illuminance on the substrate surface immediately below. It is assumed that irradiation is performed.

In the ultraviolet irradiation step (step B 3) performed by the scanning that is performed next, the ultraviolet irradiation amount distribution is as shown by the dashed line Q 2 in FIG. 12, and the integrated light amount becomes the lowest at the right end position of the substrate G. As a result, the two ultraviolet irradiation steps (steps B1 and B3) are performed at the right end Ga of the substrate.
As a result, the total amount of ultraviolet irradiation in each portion has a distribution characteristic as indicated by a dotted line Q3 in FIG. 12, and is substantially uniform.

In FIG. 10, the ultraviolet irradiation step (step B5) in the stationary state on the left end portion Gb of the substrate performed immediately after the end of scanning (step B5) is shown in FIG.
In the sequence of (C) → (D), 64 (n), 64 (n) from the end (right end) in the scanning direction (Y ′ direction) to the front (left side),
The lights are sequentially turned off at predetermined intervals of 64 (n-1) ‥‥ 64 (1). Thereby, at the left end Gb of the substrate,
An almost uniform UV irradiation dose distribution can be obtained in the same manner as described above with a pattern symmetrical to the right end Ga of the substrate. Both ends G
The ultraviolet irradiation amount Pj at the intermediate portion of the substrate between a and Gb is given by the above equation (2) as in the above embodiment.

In the above embodiment, the lamp chamber 66 is fixed, and the substrate G is moved in parallel in the lamp arrangement direction. However, as shown in FIG. 13, a configuration in which the substrate G side is fixed at a predetermined position and the lamp chamber 66 side is moved in parallel with the substrate surface is also possible.

In the configuration example shown in FIG. 13, a self-propelled scanning drive unit 102 using a ball screw 100 is integrally attached to the lamp chamber 66, and this scanning drive unit 102 is mounted on the ball screw 100.
And reciprocate in the horizontal direction (Y direction) along the guide 102 extending in parallel with the lamp chamber 6.
The ultraviolet rays from 6 can scan the surface of the substrate G supported on the stage 76 at a fixed position from end to end in the Y direction. The utility unit 74 containing the various utility supply units and the control unit may be installed above the horizontal movement area of the lamp chamber 66, and the supply of the inert gas, electric power, etc. from the unit 74 into the lamp chamber 66 is movable or An extendable pipe 106, a cable 108, or the like may be used.

Also in this configuration example, when the lamp chamber 66 is located at the origin position in the Y direction and the forward movement position, the scanning direction (Y
Direction), the lamp chamber 66 is connected to both ends Ga, Gb of the substrate G.
You may face it. As described above, the method in which the substrate G side is fixed at a predetermined position and the lamp chamber 66 side is moved in parallel with the substrate surface can further reduce the size of the apparatus in the scanning direction.

The ultraviolet irradiation step in a stationary state is omitted for either one of the two ends Ga and Gb of the substrate G. That is, the lamp chamber 66 is provided for one of the substrate ends.
It is also possible to irradiate ultraviolet rays (by scanning) as they protrude outside in the scanning direction and pass through.

The structure inside the lamp chamber 66 and the inside of the cleaning processing chamber 68 in the above-described embodiment, in particular, the ultraviolet lamp 64 (1)
The configuration of the stage ６４64 (n), the stage 76, the stage driving section 80, and the like are merely examples, and various modifications can be made to each section.

In the above embodiment, the ultraviolet irradiation cleaning device (U
V). However, the substrate processing apparatus of the present invention is also applicable to a process of irradiating a substrate to be processed with ultraviolet rays for a purpose other than the removal of organic contamination. For example, in the coating and developing system as described above, the same ultraviolet irradiating apparatus as in the above embodiment can be used in the step of irradiating the substrate G with ultraviolet rays for the purpose of curing the resist after the post-baking (step S13). The substrate to be processed in the present invention is not limited to the LCD substrate, but may be a semiconductor wafer, a CD substrate, a glass substrate, a photomask, a printed substrate, or the like.

[0074]

As described above, according to the substrate processing apparatus of the present invention, good processing quality can be stably ensured at each part of the substrate to be processed, particularly at the substrate edge in the scanning direction in the scanning type ultraviolet irradiation processing. , And can also be obtained uniformly and efficiently.

[Brief description of the drawings]

FIG. 1 is a plan view showing a configuration of a coating and developing processing system to which a substrate processing apparatus of the present invention can be applied.

FIG. 2 is a flowchart illustrating a processing procedure in the coating and developing processing system according to the embodiment.

FIG. 3 is a diagram illustrating a configuration of an ultraviolet irradiation unit according to the embodiment (a state in which a stage is located at an origin position in a scanning direction).

FIG. 4 is a diagram illustrating a configuration of an ultraviolet irradiation unit of the embodiment (a state in which a stage is located at a forward movement position in a scanning direction).

FIG. 5 is a block diagram illustrating a configuration of a control system of the ultraviolet irradiation unit according to the embodiment.

FIG. 6 is a flowchart showing a main operation procedure in the ultraviolet irradiation unit of the embodiment.

FIG. 7 is a flowchart illustrating a procedure of an ultraviolet irradiation cleaning process in the ultraviolet irradiation unit of the embodiment.

FIG. 8 is a diagram schematically illustrating an action of an ultraviolet irradiation cleaning process in the ultraviolet irradiation unit of the embodiment.

FIG. 9 is a diagram showing a sequence in which a plurality of ultraviolet lamps are sequentially turned on in a stepwise manner in another embodiment.

FIG. 10 is a diagram showing a sequence for sequentially turning off a plurality of ultraviolet lamps in a stepwise manner in another embodiment.

FIG. 11 is a view showing an ultraviolet irradiation amount distribution obtained on a substrate by the stepwise lamp on / off control of FIGS. 9 and 10;

FIG. 12 is a diagram for explaining an ultraviolet irradiation dose distribution characteristic obtained at an end of a substrate by the stepwise lamp lighting control of FIG. 9;

FIG. 13 is a diagram illustrating a configuration of an ultraviolet irradiation unit according to another embodiment.

[Explanation of symbols]

 38 Main transfer unit UV ultraviolet irradiation unit 62 Quartz glass window 64 (1), 64 (2), ‥‥, 64 (n) Ultraviolet lamp 66 Lamp room 68 Cleaning processing room 76 Stage 78 Ball screw 80 Stage drive unit 82 Guide 84 Fixed Lift pin 86 Shutter 88 Control unit 92 Stage elevation drive unit 94 Scan drive unit 96 Lamp power supply unit 98 Sensors 100 Ball screw 102 Scan drive unit 104 Guide

Claims (6)

[Claims] 1. A substrate processing apparatus for performing predetermined processing by irradiating ultraviolet rays to a substrate to be processed, a support means for supporting the substrate to be processed, and one or more lamps for emitting ultraviolet rays when supplied with electric power. An ultraviolet irradiation unit for irradiating ultraviolet light emitted from the lamp toward the substrate to be processed, and a processing surface of the substrate to be processed, wherein the ultraviolet light from the ultraviolet irradiation unit is supported by the support unit. Driving means for moving one or both of the support means and the ultraviolet irradiation means in a predetermined direction so as to scan from one end to the other end of the substrate, and one end and / or the other end of the substrate to be processed Control means for irradiating the ultraviolet ray from the ultraviolet ray irradiating means for a predetermined time while both the supporting means and the ultraviolet ray irradiating means are substantially stationary with respect to the portion. Processing apparatus. 2. In the ultraviolet irradiation means, a plurality of the lamps are arranged in a line in parallel with the scanning direction with a lamp longitudinal direction orthogonal to the scanning direction, and the control means controls the plurality of lamps. 1 from the rear side in the scanning direction
The substrate processing apparatus according to claim 1, wherein the substrate is sequentially turned on or off at predetermined time intervals. 3. A predetermined reference amount at which the integrated light amount per unit area of the ultraviolet light applied to the surface of the substrate to be processed by the ultraviolet light irradiating unit over the predetermined time is a minimum required in the ultraviolet light irradiation processing. 3. The substrate processing apparatus according to claim 1, wherein the length of the predetermined time is set so as to exceed a predetermined time. 4. An integrated light amount per unit area of the ultraviolet light to be irradiated on the surface of the substrate to be processed by the ultraviolet light irradiating means by the scanning is a predetermined reference amount which is a minimum required in the ultraviolet light irradiation processing. The substrate processing apparatus according to claim 1, wherein the scanning speed is set so as to exceed the scanning speed. 5. The substrate processing apparatus according to claim 1, wherein the ultraviolet irradiation unit faces one end of the substrate to be processed supported by the support unit at an origin position of the scanning. 6. The substrate processing apparatus according to claim 1, wherein the ultraviolet irradiation unit faces one end of the substrate to be processed supported by the support unit at the forward movement position of the scan.