JP2002074299A - Ic card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent an IC chip from being cracked even when an IC card is bent and deformed. SOLUTION: This IC card 11 is provided with a substrate 12 on which an IC chip 15 is mounted, and a terminal substrate 18 is adhered onto the substrate 12 so that the IC chip 15 can be covered, and a recessed part 18a into which the IC chip 15 is fit is formed on one face of the terminal substrate 18, and a terminal 20 for connection is formed on the other face. Thus, the thickness of the terminal substrate 18 can be made thick, and the strength can be increased, and even when the terminal substrate 18 is deformed like a recession, the deformation force can be prevented from being transmitted to the IC chip 15.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC card having an IC chip embedded in a plastic plate.

[0002]

2. Description of the Related Art An example of an IC card is shown in FIGS. As shown in FIG. 9, the IC card 1 includes a plastic plate 2 and an IC module 4 housed in a housing recess 3 formed in the plastic plate 2. As shown in FIG. 10, the IC module 4 includes a module substrate 5 and an IC chip 6 mounted on the lower surface of the module substrate 5.

A connection terminal 7 is provided on an upper surface of the module substrate 5, and a conductor pattern 8 is provided on a lower surface of the module substrate 5. The terminal 7 and the conductor pattern 8 are connected by a through hole 9. The IC chip 6 and the conductor pattern 8 are connected by a bonding wire 10. Further, the IC chip 6 is molded and sealed with a resin 100.

[0004]

In the case of the above-mentioned conventional IC card 1, the IC chip 6 may be broken when it is bent and deformed by some external force. This is because the IC chip 6 is directly bonded to the module substrate 5, so that when a force indicated by an arrow A in FIG. This is considered to be because the IC chip 6 is deformed into a concave shape, and as a result, a stress in the tensile direction acts on the IC chip 6 to break the IC chip 6.

FIG. 12 shows an example of a non-contact type IC card as another example of the IC card. As shown in FIG. 12, a non-contact type IC card 101 includes two plastic plates 102 and 103 and an IC module 104.
And a coil 105 for non-contact communication. The IC module 104 has substantially the same configuration as the IC module 4 described above, except that the terminal 7 is not provided on the upper surface of the module substrate 5 in FIG. It is not provided.

The coil 105 is soldered to the conductor pattern 8 on the module substrate 5 of the IC module 104. Further, the IC module 104 and the coil 10
5 is embedded between the two plastic plates 102 and 103. The two plastic plates 102 and 103
Is, for example, thermally fused.

However, a non-contact type IC having such a configuration
Also in the case of the card 101, since the IC module 104 is embedded between the plastic plates 102 and 103,
When the IC card 101 is bent and deformed by some external force, the IC chip 6 of the IC module 104 may be broken.

Accordingly, an object of the present invention is to provide an IC card that can prevent an IC chip from breaking even if the IC card is bent and deformed.

[0009]

According to the first aspect of the present invention, an IC chip is mounted on a substrate, and a terminal substrate is adhered on the substrate so as to cover the IC chip.
A concave portion for fitting an IC chip was provided on one surface of the terminal substrate, and a connection terminal was provided on the other surface. According to this configuration, even if the IC card is bent and deformed and the terminal board is deformed into a concave shape, the deformation force is not transmitted to the IC chip, so that the IC chip does not break. Further, since the terminal board can be configured to have a large thickness as a whole, the bending rigidity of the terminal board itself increases.

By the way, when a concave portion is provided in the terminal substrate, the bottom wall portion of the concave portion of the terminal substrate becomes thin, and strange irregularities may appear on the surface of the terminal substrate. In contrast, claim 2
According to the invention, since the inside of the concave portion of the terminal substrate is filled with the soft substance, the gel-like substance or the liquid, it is possible to prevent the unevenness from being raised on the surface of the terminal substrate. Also in this configuration, even if the terminal board is deformed into a concave shape, the deformation force is not transmitted to the IC chip.

According to the third aspect of the present invention, the opening area of the concave portion of the terminal substrate is configured to be slightly larger than the size of the IC chip, so that the bonding area when bonding the terminal substrate to the substrate is increased. Therefore, the terminal substrate can be firmly bonded to the substrate, and peeling of the terminal substrate can be prevented.

According to the fourth aspect of the present invention, since a predetermined gap is provided between the bottom surface of the concave portion of the terminal board and the IC chip, the gap becomes a so-called air gap, and static electricity is applied to the surface of the terminal board. In such a case, the transmission of the static electricity to the IC chip can be blocked by the gap.

According to the fifth aspect of the present invention, since the terminal board is bonded to a portion where the IC chip is not mounted on the board on which the IC chip is mounted, the terminal board is deformed into a concave shape. However, the deformation force is not transmitted to the IC chip.

According to the sixth aspect of the present invention, a non-contact communication coil is provided on a substrate, and both ends of the coil are connected to an IC.
Since it is configured to be connected to the chip, a dual-purpose IC card having a function as a contact type IC card and a function as a non-contact type IC card can be configured.

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of the present invention will be described below with reference to FIGS. The IC card of this embodiment is a dual-purpose IC card having a function as a contact-type IC card and a function as a non-contact-type IC card. FIG. 1 is a diagram showing a cross-sectional structure of an IC chip portion of the IC card of the present embodiment. FIG. 2 is an exploded perspective view of the IC card of the present embodiment.

As shown in FIG. 2 above, the substrate 12 constituting the exterior of the IC card 11 of the present embodiment on the lower surface side in FIG.
It is formed of a sheet-shaped insulating member, for example, a plastic sheet (ie, a plastic plate). A predetermined conductor pattern 13 is formed on the upper surface of the substrate 12 in FIG. 2 by screen-printing a conductive paste (for example, silver paste). This conductor pattern 13
Is an antenna 14 composed of a rectangular coil-shaped conductor pattern.
And a conductor pattern 16 for connecting the IC chip 15
It is composed of In this case, the antenna 14 constitutes a coil for non-contact communication.

The IC chip 15 is a contact type I
Function to operate as C card (contact type transmission function)
And a function for operating as a non-contact IC card (non-contact transmission function). Further, the IC chip 15 is provided with a bump (not shown) for connecting to the conductor pattern 16. In this embodiment, the IC chip 15 is flip-chip mounted on the substrate 12 by, for example, a film-like anisotropic conductive adhesive 17. Thus, the IC chip 15 and the conductor pattern 16 are connected (see FIG. 1). As the anisotropic conductive adhesive, a paste-like adhesive may be used instead of the above-mentioned film-like adhesive.

Further, the IC card 11 is connected to a non-contact type IC.
When operated as a card, power and signals are transmitted and received to and from an IC card read / write device (not shown) via the antenna 14.

On the upper surface of the substrate 12, for example, a rectangular plate-shaped terminal substrate 18 is adhered so as to cover the IC chip 15. In this case, the terminal substrate 18 is bonded by the film-like anisotropic conductive adhesive 17 used when bonding the IC chip 15. That is, the terminal board 1
8 is configured to be bonded to the substrate 12 at the same time as the IC chip 15. The terminal board 18 is, for example, a double-sided printed wiring board.

A lower surface in FIG. 1 which is one surface of the terminal substrate 18 is provided with a concave portion 18a for fitting the IC chip 15, and a conductor pattern for connecting to the conductor pattern 16 of the substrate 12. 19 are provided. The size (area) of the opening of the recess 18 a is slightly larger than the size of the IC chip 15. A connection terminal 20 is provided on the other surface of the terminal substrate 18 in FIGS. 1 and 2. The shape, size, and the like of the terminal 20 are determined by, for example, the standard of a contact type IC card. Also, the terminal board 18 has
As shown in FIG. 5, a through hole 21 is provided for connecting the terminal 20 on the upper surface and the conductor pattern 19 on the lower surface.

In the above configuration, when the terminal substrate 18 and the IC chip 15 are bonded to the substrate 12 as described above, the terminals 20 are connected to the through holes 21 and the conductor pattern 1.
9. It is configured to be connected to the IC chip 15 via the conductor pattern 16. Further, a predetermined gap (that is, an air gap) is formed between the inner bottom of the concave portion 18a of the terminal board 18 and the IC chip 15 in the state of being bonded as described above.

On the upper surface of the substrate 12 in FIGS. 1 and 2, a cover member 22 constituting an exterior of the IC card 11 on the upper surface side in the drawing is bonded via an adhesive layer 23. The cover member 22 is formed of a film-like insulating member, for example, a plastic sheet (that is, a plastic plate), similarly to the substrate 12. The adhesive layer 23 is made of, for example, a sheet-like thermoplastic adhesive. Further, the cover member 22 and the adhesive layer 23 are formed with rectangular through-holes 22 a and 23 a slightly larger than the terminal board 18.

In the case of this configuration, when a laminate of the substrate 12, the sheet-like adhesive layer 23, and the cover member 22 is thermocompression-bonded with a hot press device, the intermediate sheet-like adhesive layer 23 is melted. The fluidity is increased and the substrate 1
2 and the cover member 22 are sufficiently filled. At this time, the gap between the through hole 23a of the adhesive layer 23 and the terminal board 18 is filled with the adhesive layer 23 that has melted and flowed. As a result, the two are firmly bonded. The IC card 11 thus bonded is configured so that its thickness dimension is, for example, 0.76 mm or less.

The lower surface (outer surface) of the substrate 12 and the upper surface (outer surface) of the cover member 22 are designed so that a desired design is appropriately printed.

When the IC card 11 having the above configuration is used as a contact type IC card, power is supplied from an IC card read / write device (not shown) through the terminals 20 of the terminal board 18 and the above-described IC card is used. IC card 11
The data signal is transmitted and received between the IC card and the IC card read / write device. Further, the I
When the C card 11 is used as a non-contact type IC card, power is supplied from an IC card read / write device (not shown) via the antenna 14 and the I card is used.
Data signals are transmitted and received between the C card 11 and the IC card read / write device.

In this embodiment having such a structure, the IC chip 15 is mounted on the
A terminal substrate 18 is adhered on the terminal substrate 2 so as to cover the IC chip 15, and the IC chip 1
5 was provided, and a connection terminal 20 was provided on the other surface. According to this configuration, even if the IC card 11 is bent and deformed and the terminal board 18 is deformed into a concave shape, the deformation force is not transmitted to the IC chip 15, so that the IC chip 15 is not broken. Further, in the above-described embodiment, the terminal board 18 can be configured to be much thicker than the module board 5 of the conventional configuration (see FIGS. 9 and 10) as a whole. The rigidity can be increased, and the terminal board 18 also functions as a reinforcing plate.

Further, in the above embodiment, the terminal board 1
8, the opening area of the recess 18a is configured to be slightly larger (for example, one round) than the size of the IC chip 15 so that the bonding area between the two when the terminal substrate 18 is bonded to the substrate 12 is increased. Therefore, the terminal board 1
8 can be firmly bonded, and peeling of the terminal board 18 can be reliably prevented.

In the case of the conventional IC card 1 shown in FIG. 9, since the IC chip 6 and the bonding wires 9 are molded with the resin 10, the bonding area between the module substrate 5 and the housing recess 3 of the plastic plate 2 is increased. Is considerably smaller. For this reason, the adhesive strength of the module substrate 5 is reduced, and a problem occurs in which the end of the module substrate 5 is lifted or peeled off. On the other hand, according to the present embodiment, such a problem can be solved.

In the case of the above embodiment, the IC card 11
With the function as a contact type IC card and the non-contact type
It was configured as a dual-purpose IC card having the function as a C card. According to this configuration, the IC card 11
Is used as a non-contact type IC card, unlike the conventional non-contact type IC card 101 (see FIG. 12), it is possible to reliably prevent the IC chip 15 from cracking, and thus to improve reliability. Contactless IC card with high reliability can be provided. According to the above embodiment, it is possible to provide the IC card 11 that can be used for both contact and non-contact.

In the above embodiment, the terminal board 1
Since a predetermined gap is provided between the inner bottom surface of the concave portion 18a of FIG. 8 and the IC chip 15, the gap becomes a so-called air gap. The transmission to the IC chip 15 can be blocked by the gap.

FIG. 3 shows a specific configuration of the static electricity test determined by JIS. As shown in FIG. 3, in a state where the IC card 11 is placed on the metal plate 24 grounded via the resistor via the insulating layer 25, the IC card 11 is discharged by the static electricity applying device 26. I am trying to do it. In this case, it is generally known that the discharge to the terminal 20 portion of the IC card 11 is weaker than the other portions in both air and contact discharges.

FIG. 11 shows a route of the static electricity when the terminal 7 of the IC card 1 having the conventional configuration is discharged. As shown in FIG. 11, three routes R1, R2, and R3 indicated by arrows can be considered as routes of the static electricity.

On the other hand, the IC card 11 of this embodiment
FIG. 4 shows three routes R1, R2, and R3 of static electricity when the terminal 20 is discharged. As shown in FIG. 4, with respect to the first wraparound route R1, the air gap provided between the inner bottom surface of the concave portion 18a of the terminal board 18 and the IC chip 15 causes the IC chip 15 to move.
Direct discharge to the hardly occurs.

In the second round route R2, since the through hole 21 extends to near the lower surface of the IC card 11, static electricity is generated on the metal plate 2 under the IC card 11.
It becomes easy to penetrate to 4. Regarding the third wraparound route R3, since the total length of the conductor pattern can be lengthened and the conductor pattern is made of a conductor having a high resistance value such as silver paste, the static electricity reaching the IC chip 15 is attenuated. Can be.

In the above embodiment, the IC chip 15 is fitted into the recess 18a of the terminal board 18 via a gap.
The IC chip 15 may be sealed by filling a soft substance (for example, a soft rubber-like or gum-like substance), a gel-like substance, or a liquid inside 8a. According to this configuration, it is possible to prevent projections and depressions on the surface of the terminal board 18. In the case of this configuration as well, even if the terminal board 18 is deformed into a concave shape, the deformation force is applied to the IC chip 15
Is not transmitted to the IC chip 15 and the cracking of the IC chip 15 can be prevented.

FIG. 5 shows a second embodiment of the present invention, and the points different from the first embodiment will be described. The same components as those in the first embodiment are denoted by the same reference numerals. In the second embodiment, as shown in FIG. 5, the through hole 27 connecting the terminal 20 on the upper surface side of the terminal board 18 and the conductor pattern 19 on the lower surface side is separated from the IC chip 15,
The terminal board 18 is configured to be disposed on the periphery. The configuration of the second embodiment other than that described above is the same as that of the first embodiment.

Therefore, in the second embodiment, substantially the same operation and effect as in the first embodiment can be obtained. In particular,
According to the second embodiment, since the through holes 27 are provided in the terminal board 18 so as to be away from the IC chip 15, the static electricity reaching the IC chip 15 can be further attenuated, and the static electricity can be reduced. Chip 15
The effect of escaping to the lower surface of the IC card 11 is increased by the difficulty of flowing to the side.

FIGS. 6 and 7 show a third embodiment of the present invention, and the differences from the first embodiment will be described. The same components as those in the first embodiment are denoted by the same reference numerals. In the third embodiment, as shown in FIGS. 6 and 7, a portion where the IC chip 15 is not mounted on the substrate 12 on which the IC chip 15 is mounted, specifically,
The terminal board 28 was bonded to a portion adjacent to the IC chip 15. The terminal board 28 is not provided with a recess corresponding to the recess 18a of the terminal board 18 of the first embodiment. The other configuration of the third embodiment is the same as that of the first embodiment.
The configuration is the same as that of the embodiment.

Therefore, in the third embodiment, substantially the same functions and effects as those of the first embodiment can be obtained. In particular,
According to the third embodiment, even if the terminal board 28 is deformed into a concave shape, the deformation force is not transmitted to the IC chip 15, and the breakage of the IC chip 15 can be prevented more reliably. According to the third embodiment, the IC card 1
1 is simplified.

FIG. 8 shows a fourth embodiment of the present invention, and the differences from the first embodiment will be described. The same components as those in the first embodiment are denoted by the same reference numerals. In the fourth embodiment, as shown in FIG. 8, a plastic plate 29 having substantially the same configuration as the plastic plate 2 of the conventional configuration (see FIG. 9) is prepared.
An accommodation recess 29a for accommodating 8 is formed. Then, the IC chip 15 is provided substantially at the center of the bottom surface in the accommodation recess 29a.
Was configured to be implemented. Further, the conductive pattern 16 is formed by screen-printing a conductive paste (for example, silver paste) on the bottom surface in the accommodation recess 29a. Further, the IC card 11 of the fourth embodiment is an IC card having only a function as a contact type IC card.

The configuration of the fourth embodiment other than the above is almost the same as the configuration of the first embodiment. Therefore, in the fourth embodiment, substantially the same operation and effect as in the first embodiment can be obtained.

In the first to third embodiments, a dual-purpose (combination) type IC having a function as a contact type IC card and a function as a non-contact type IC card is used.
Although the present invention is applied to the card 11, the present invention is not limited to this, and the present invention may be applied to an IC card 11 having only a function as a contact IC card.

[Brief description of the drawings]

FIG. 1 is a partial longitudinal sectional side view of an IC card showing a first embodiment of the present invention.

FIG. 2 is an exploded perspective view of an IC card.

FIG. 3 is a diagram showing a configuration of an electrostatic test.

FIG. 4 is a diagram corresponding to FIG.

FIG. 5 is a view corresponding to FIG. 1, showing a second embodiment of the present invention;

FIG. 6 is a longitudinal sectional side view of an IC card showing a third embodiment of the present invention.

FIG. 7 is a perspective view showing a state where an IC chip and a terminal board are mounted on the board.

FIG. 8 is a view corresponding to FIG. 1, showing a fourth embodiment of the present invention;

FIG. 9 is a diagram corresponding to FIG. 1 showing a conventional configuration.

FIG. 10 is a longitudinal sectional side view of an IC module.

11 is a view corresponding to FIG. 9 showing a route of static electricity wraparound;

FIG. 12 is a diagram corresponding to FIG. 1 showing a different conventional configuration.

[Explanation of symbols]

11 is an IC card, 12 is a board, 13 is a conductor pattern,
14 is an antenna (coil for non-contact communication), 15 is an IC
Chip, 17 anisotropic conductive adhesive, 18 terminal board, 2
0 is a terminal, 21 is a through hole, 22 is a cover member, 2
3 is an adhesive layer, 27 is a through hole, 28 is a terminal board,
29 indicates a plastic plate.

 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Atsushi Watanabe 1-1-1 Showa-cho, Kariya-shi, Aichi F-term in DENSO Corporation (reference) 2C005 MA08 MA09 NA02 NA08 NA09 NA19 PA33 PA34 RA12 RA15 RA16 5B035 AA08 BA05 BB09 CA03 CA23

Claims (6)

[Claims] 1. A substrate on which an IC chip is mounted, and bonded on the substrate so as to cover the IC chip.
An IC card comprising: a recess provided on one surface thereof for fitting the IC chip; and a terminal board provided with connection terminals on the other surface. 2. A soft substance is provided inside the concave portion of the terminal substrate.
2. The IC card according to claim 1, wherein the IC card is filled with a gel substance or a liquid. 3. The method according to claim 1, wherein the opening area of the concave portion of the terminal substrate is equal to the I area.
3. The IC card according to claim 1, wherein the IC card is configured to have a size slightly larger than a size of the C chip, and a bonding area when bonding the terminal substrate to the substrate is increased. 4. A method according to claim 1, wherein the bottom surface of the concave portion of the terminal board and the IC are provided.
4. The IC card according to claim 1, wherein a predetermined gap is provided between the IC card and the chip. 5. A substrate on which an IC chip is mounted, and a terminal substrate having one surface adhered to a portion of the substrate on which the IC chip is not mounted, and a connection terminal provided on the other surface. An IC card comprising: 6. The IC card according to claim 1, wherein a coil for non-contact communication is provided on the substrate, and both ends of the coil are connected to the IC chip.