KR200160921Y1 - Integrated circuit card module - Google Patents
Integrated circuit card module Download PDFInfo
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- KR200160921Y1 KR200160921Y1 KR2019960014743U KR19960014743U KR200160921Y1 KR 200160921 Y1 KR200160921 Y1 KR 200160921Y1 KR 2019960014743 U KR2019960014743 U KR 2019960014743U KR 19960014743 U KR19960014743 U KR 19960014743U KR 200160921 Y1 KR200160921 Y1 KR 200160921Y1
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
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- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
Abstract
본 고안은 집적회로(IC) 카드 모듈에 관한 것으로서, 본 고안에 따른 IC카드 모듈은 일면에 의부 가기와의 접촉을 허용하는 제1접촉 단자와 반대면에 반도체 칩과의 접촉을 허용하는 제2접촉 단자가 형성된 PCB;, 상기 반도체 칩에 형성된 돌출 패드;, 상기 PCB와 상기 돌출 패드를 전기적으로 결합시키는 접착제를 포함한다.The present invention relates to an integrated circuit (IC) card module, the IC card module according to the present invention is a second contact portion that allows contact with the semiconductor chip on the opposite side to the first contact terminal that allows contact with the cutting edge on one side A PCB including a contact terminal, a protrusion pad formed on the semiconductor chip, and an adhesive for electrically coupling the PCB and the protrusion pad.
따라서, 상술한 바와 같이 본 고안에 의하면, 반도체 칩에 형성된 돌출 패드를 연결단자와 압착에 의해 직접 연결함으로써, IC 카드 모듈의 두께를 얇게 하면서도 반도체 칩의 신뢰성을 향상시키고, 플라스틱 카드와의 조립도 용이하게 할 수 있는 효과를 갖는다.Therefore, according to the present invention as described above, by directly connecting the protruding pad formed on the semiconductor chip by the connection terminal and the pressing, the thickness of the IC card module can be improved while improving the reliability of the semiconductor chip and assembling with the plastic card. It has an effect that can be facilitated.
Description
제1도는 종래의 IC 카드의 단면을 나타낸 도면이다.1 is a diagram showing a cross section of a conventional IC card.
제2도는 제1도에 도시된 플라스틱 카드의 단면을 나타낸 도면이다.2 is a cross-sectional view of the plastic card shown in FIG.
제3도는 제1도에 도시된 IC 카드 모듈의 단면을 나타낸 도면이다.3 is a cross-sectional view of the IC card module shown in FIG.
제4a도는 일반적인 IC 카드 모듈 PCB 구조를 나타낸 단면도이다.4A is a cross-sectional view showing a general IC card module PCB structure.
제4b도는 본 고안에 따른 돌출패드를 형성한 반도체 칩의 단면을 나타낸 도면이다.4b is a cross-sectional view of a semiconductor chip having a protrusion pad according to the present invention.
제4c도는 본 고안에 따른 IC 카드 모듈 PCB와 반도체 칩의 돌출패드를 결합한 상태를 나타낸 도면이다.4c is a view showing a state in which the IC card module PCB and the protrusion pad of the semiconductor chip according to the present invention combined.
제4d도는 본 고안에 따른 보호막을 형성한 상태를 나타낸 도면이다.4d is a view showing a state in which a protective film according to the present invention is formed.
제5도는 제4a도 내지 제4d도를 통해 완성된 본 고안에 의한 IC카드의 단면도를 나타낸 도면이다.5 is a cross-sectional view of the IC card according to the present invention completed through FIGS. 4A to 4D.
본 고안은 집적회로(IC) 카드 모듈에 관한 것으로서, 더욱 상세하게는 반도체 칩에 생성한 돌출 패드와 IC 카드 모듈의 PCB의 리드단자를 AU을 이용하여 압착하여 연결함으로써 두께를 줄인 집적회로(IC) 카드 모듈에 관한 것이다.The present invention relates to an integrated circuit (IC) card module, and more particularly, an integrated circuit (IC) having a reduced thickness by pressing and connecting the protruding pads created on a semiconductor chip and the lead terminals of the PCB of the IC card module using AU. ) Card module.
현재 집적회로 카드(일명 IC 카드)는 전화카드, 신분증 및 전자 화폐에 이르기 까지 그 응용 범위가 확대될 전망이다.Currently, integrated circuit cards (also known as IC cards) are expected to extend their applications to phone cards, ID cards and electronic money.
제1도는 종래의 IC 카드의 단면을 나타낸 도면으로서, 플라스틱 카드(10)과 IC 카드 모듈(12)로 이루어진다.1 is a cross-sectional view of a conventional IC card, which is composed of a plastic card 10 and an IC card module 12. As shown in FIG.
일반적으로 IC 카드는 0.76㎜ 두께의 플라스틱 카드(10)에 소정의 홀을 만들고, 그 홀에 IC 카드 모듈(12)이 내장되도록 조립하여 형성된다.In general, the IC card is formed by making a predetermined hole in the plastic card 10 having a thickness of 0.76 mm and assembling the IC card module 12 therein.
제2도는 제1도에 도시된 플라스틱 카드의 단면도로서, IC 카드 모듈(12)은 0.76 ㎜ 두께의 플라스틱 카드(10) 내에 꼭 맞도록 내장시키기 위해 플라스틱 카드(10)의 두께보다는 얇아야 한다. 일반적인 IC 카드 모듈(12)의 두께는 0.6㎜정도지만 경박 단소를 추구하는 사용자의 요구에 의해 앞으로 점점 낮아질 전망이다.2 is a cross-sectional view of the plastic card shown in FIG. 1, wherein the IC card module 12 should be thinner than the thickness of the plastic card 10 to fit snugly within the 0.76 mm thick plastic card 10. FIG. Although the thickness of the general IC card module 12 is about 0.6 mm, it is expected to be gradually lowered in the future by the demand of the user seeking a light and small size.
제3도는 제1도에 도시된 IC 카드 모듈(12)의 단면을 나타낸 도면으로서, 참조부호 120은 외부기기와 접촉되는 플레이트를 나타내고, 참조부호 122는 플레이트(120)를 지지하기 위한 PCB를 나타내고, 참조부호 126은 마이크로 프로세서 및 메모리가 내장된 반도체 칩을 나타내고, 참조부호 124는 플레이트(120)와 연결된 연결 단자를 나타내고, 참조부호 128은 반도체 칩(126)과 플레이트(120)와 연결된 연결단자(124)를 연결하는 연결선을 나타낸다.3 is a cross-sectional view of the IC card module 12 shown in FIG. 1, reference numeral 120 denotes a plate in contact with an external device, and reference numeral 122 denotes a PCB for supporting the plate 120. , Reference numeral 126 denotes a semiconductor chip in which a microprocessor and a memory are embedded, reference numeral 124 denotes a connection terminal connected to the plate 120, and reference numeral 128 denotes a connection terminal connected to the semiconductor chip 126 and the plate 120. The connection line connecting 124 is shown.
또한, 참조부호 130은 반도체 칩(l26)과 연결 단자(l24)가 연결된 접합 부위를 보호하고, 반도체 칩(126)을 외부로부터 보호하기 위한 설치된 보호막을 나타낸다.In addition, reference numeral 130 denotes a protective film provided to protect a junction portion to which the semiconductor chip l26 and the connection terminal l24 are connected, and to protect the semiconductor chip 126 from the outside.
이와 같이 구성된 IC 카드 모듈는 두께를 얇게 하면서도 제품의 신뢰성을 확보하는 것이 중요하다.It is important for the IC card module configured as described above to have a thin thickness and to ensure product reliability.
따라서, IC 카드 모듈(12)의 두께를 얇게 하기 위해 반도체 칩(l26)의 두께를 얇게 하거나, 반도체 칩(126)과 연결 단자(124)를 연결하기 위한 연결선(128)을 보호하는 보호막(l28)의 두께를 줄여야 한다.Therefore, a thin film of the semiconductor chip l26 to make the thickness of the IC card module 12 thin, or a protective film l28 that protects the connecting line 128 for connecting the semiconductor chip 126 and the connecting terminal 124. ) Should be reduced in thickness.
그러나, 반도체 칩(126)의 두께를 얇게 한 경우, 외부 압박에 의해 반도체 칩(126)에 손상이 발생하거나, 플라스틱 카드(제2드에 도시)와 조립시 제품의 신뢰성을 확보하기 어려운 문제가 발생한다.However, in the case where the thickness of the semiconductor chip 126 is made thin, the semiconductor chip 126 may be damaged due to external pressure, or it may be difficult to secure the reliability of the product when assembled with the plastic card (shown in the second drawing). Occurs.
또한, 보호막(130)의 두께를 얇게 한 경우 연결선(128)의 노출로 인해 제품의 신뢰성을 확보하기 어려운 문제가 발생한다.In addition, when the thickness of the passivation layer 130 is reduced, a problem arises that it is difficult to secure the reliability of the product due to the exposure of the connection line 128.
따라서, 상기의 문제점을 해결하기 위해 반도체 칩(l26)의 두께를 확보하면서도 IC 카드 모듈(12)의 두께를 얇게 할 수 있는 IC 카드 모듈이 요구된다.Therefore, in order to solve the above problem, an IC card module that can reduce the thickness of the IC card module 12 while securing the thickness of the semiconductor chip l26 is required.
본 고안은 상기의 요구에 부응하기 위해 창출된 것으로서, 반도체 칩에 돌출 패드를 형성하고, 외부기기와 접촉되는 플레이트의 연결 단자를 연결하는 종래의 와이어 형태의 연결선을 대체하여, 반도체 칩의 돌출 패드와 플레이트의 연결단자를 압착에 의해 직접 연결함으로써, 반도체 칩의 두께를 확보하면서도 보호막의 두께를 얇게 한 IC 카드 모듈을 제공하는 것을 그 목적으로 한다.The present invention was created to meet the above demands, and forms a protruding pad on the semiconductor chip, and replaces the conventional wire-shaped connecting line connecting the connection terminal of the plate in contact with an external device, thereby protruding pad of the semiconductor chip It is an object of the present invention to provide an IC card module in which the thickness of the protective film is reduced while the thickness of the semiconductor chip is secured by directly connecting the connection terminals of the and plate by pressing.
상기의 목적을 달성하는 본 고안에 따른 IC 카드 모듈은 일면에 외부 기기와의 접촉을 허용하는 제1접촉 단자와 반대면에 반도체 칩과의 접촉을 허용하는 제2접촉 단자가 형성된 PCB, 상기 반도체 칩에 형성된 돌출 패드, 및 상기 PCB와 상기 돌출 패드를 전기적으로 결합시키는 접착제를 포함하는 것이 바람직하다.In accordance with an aspect of the present invention, an IC card module includes: a PCB having a second contact terminal configured to allow contact with a semiconductor chip on a surface opposite to a first contact terminal configured to allow contact with an external device; It is preferable to include a protruding pad formed in the chip, and an adhesive for electrically coupling the PCB and the protruding pad.
본 고안에 있어서, 상기 PCB는 플렉시블한 보드임을 특징으로 한다.In the present invention, the PCB is characterized in that the flexible board.
본 고안에 있어서, 상기 접착제는 상기 PCB에 형성된 제2접촉 단자와 상기 돌출 패드를 전기적으로 결합 및 고착시키는 AU임을 특징으로 한다.In the present invention, the adhesive is characterized in that the AU for electrically coupling and fixing the second contact terminal and the protruding pad formed on the PCB.
본 고안에 있어서, 상기 PCB와 반도체 칩을 고착시키는 코팅물을 더 구비하는 것을 특징으로 한다.In the present invention, it is characterized in that it further comprises a coating for fixing the PCB and the semiconductor chip.
본 고안에 있어서, 상기 코팅물은 적어도 상기 PCB와 반도체 칩의 돌출 패드와의 접촉 부의를 둘러싸도록 형성된 것을 특징으로 한다.In the present invention, the coating is characterized in that it is formed to surround at least the contact portion between the PCB and the projecting pad of the semiconductor chip.
이하 첨부한 도면을 참조하여 본 고안을 보다 상세히 설명한다.Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings.
제4a도는 일반적인 IC 카드 모듈의 PCB 구조를 나타낸 단면도로서, 반도체 칩에 저장된 데이터를 인식하기 위해 외부 기기와 접촉 혹은 연결하기 위한 플레이트(plate)(120), 플레이트(l20)를 지지하기 위한 100㎛ 이하의 유연한 필름 또는 PCB(122) 및 PCB(122)에 구멍을 뚫어 플레이트(120)와 반도체 칩에 형성한 돌출 패드를 연결하기위한 연결 단자(124)로 이루어진다. 여기서 플레이트(120)는 금으로 도포된다.FIG. 4A is a cross-sectional view illustrating a PCB structure of a general IC card module, in which a plate 120 for contacting or connecting to an external device and a plate 100 for supporting a plate l20 are recognized to recognize data stored in a semiconductor chip. It consists of a connection terminal 124 for connecting the protruding pad formed in the plate 120 and the semiconductor chip by drilling a hole in the flexible film or PCB 122 and the PCB 122. Here the plate 120 is coated with gold.
제4b도는 본 고안에 따른 돌출 패드를 형성한 반도체 칩의 단면을 나타낸 도면으로서, 참조부호 40은 반도체 칩 위에 10 내지 20㎛정도의 두께로 형성된 돌출 패드를 나타내며, 이 돌출 패드(40)는 제4a도에 도시된 연결 단자(124)와의 압착에 의해 연결된다. 여기서 돌출 패드(40)은 저항이 낮은 금도금하는 것이 바람직하다.4B is a cross-sectional view of a semiconductor chip having a protruding pad according to the present invention, and reference numeral 40 denotes a protruding pad formed on the semiconductor chip with a thickness of about 10 to 20 μm. It is connected by crimping with the connecting terminal 124 shown in FIG. 4A. The protruding pad 40 is preferably plated with low resistance.
제4c도는 본 고안에 따른 IC 카드 모듈 PCB와 반도체 칩의 돌출 패드를 결합한 상태를 나타낸 도면으로서, 참조부호 42는 제4b도에 도시된 반도체 칩의 돌출 패드(40)와 제4a도에 도시된 연결 단자(124)가 결합된 접합 부위를 나타낸다.FIG. 4C is a view showing a state in which the IC card module PCB and the protruding pad of the semiconductor chip are coupled according to the present invention, and reference numeral 42 denotes the protruding pad 40 and the 4A of the semiconductor chip shown in FIG. 4B. The junction site where the connection terminal 124 is coupled is shown.
여기서, 반도체 칩에 형성된 돌출 패드(40)와 연결단자(124)의 연결은 약 400℃정도의 온도를 가한 후 압착하여 결합되는 것이 바람직하다.Here, the connection between the protruding pad 40 and the connection terminal 124 formed on the semiconductor chip is preferably pressed after applying a temperature of about 400 ℃.
제4d도는 본 고안에 따른 보호막을 형성한 상태를 나타낸 도면으로서, 참조부호 44는 보호막을 나타낸다.4d is a view showing a state in which a protective film according to the present invention is formed, and reference numeral 44 denotes a protective film.
제4c도에 도시된 접합 부위(42)를 보호하기 위해 형성하는 보호막(44)의 형성방법은 반도체 칩의 전체 또는 반도체 칩의 엣지 접합부위를 수지로 코팅하거나, 댐안에 채우거나, 몰딩방법에 의해 실시된다. 여기서, 코팅 수지는 접촉이 강하고 습기에 강한 것을 사용하는 것이 바람직하다.The method of forming the protective film 44 formed to protect the bonding portion 42 shown in FIG. 4C includes coating the whole of the semiconductor chip or the edge bonding portion of the semiconductor chip with resin, filling in a dam, or molding method. Is carried out by. Here, it is preferable to use coating resin which is strong in contact and resistant to moisture.
제5도는 제4a도 내지 제4d도를 통해 완성된 본 고안에 의한 IC카드의 단면도를 나타낸 도면으로서, 참조부호 50은 IC 카드 모듈을 나타내고, 참조부호 52는 IC 카드 모듈을 지지하기 위한 플라스틱 카드를 나타낸다.5 is a cross-sectional view of an IC card according to the present invention completed through FIGS. 4A to 4D, wherein reference numeral 50 denotes an IC card module, and reference numeral 52 denotes a plastic card for supporting the IC card module. Indicates.
상술한 바와 같이 본 고안에 따른 IC 카드 모듈은 반도체 칩에 돌출 패드를 형성하고, 형성된 돌출 패드를 연결단자와 압착에 의해 직접 연결함으로써, IC 카드 모듈의 두께를 얇게 하면서도 반도체 칩의 신뢰성을 향상시키고, 플라스틱 카드와의 조립도 용이하게 할 수 있는 효과를 갖는다.As described above, the IC card module according to the present invention forms a protruding pad on the semiconductor chip and directly connects the protruding pad to the connection terminal by crimping, thereby reducing the thickness of the IC card module and improving the reliability of the semiconductor chip. It also has an effect that can be easily assembled with a plastic card.
Claims (5)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019960014743U KR200160921Y1 (en) | 1996-06-03 | 1996-06-03 | Integrated circuit card module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019960014743U KR200160921Y1 (en) | 1996-06-03 | 1996-06-03 | Integrated circuit card module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR980004819U KR980004819U (en) | 1998-03-30 |
| KR200160921Y1 true KR200160921Y1 (en) | 1999-11-15 |
Family
ID=19457860
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019960014743U Expired - Fee Related KR200160921Y1 (en) | 1996-06-03 | 1996-06-03 | Integrated circuit card module |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR200160921Y1 (en) |
-
1996
- 1996-06-03 KR KR2019960014743U patent/KR200160921Y1/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| KR980004819U (en) | 1998-03-30 |
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