JP2002067328A - Recording head - Google Patents

Abstract

(57) [Problem] To provide a recording head suitable for promoting the miniaturization of a long recording head, which facilitates mounting work for installing a drive circuit on the back surface of a substrate. An ink supply path, a heating element, a common electrode, and an individual wiring electrode are provided on a surface of a head substrate.
5, a printing portion 39 including a partition wall 36, a top plate 37, and a discharge nozzle 38 is provided. Third extension portions 35-1, 35-2, 35-
3 is formed directly on the substrate by patterning,
The connection terminal of the third extension 35-3 and the head substrate 3
A drive circuit 41 disposed in advance on the back surface of the second device 2 is bonded with a wire 42, and the wire bonding portion is covered with a protective resin 43. The wiring installation is easy and the reliability is excellent, and the mounting work of the inkjet head becomes easy.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a recording head suitable for facilitating the miniaturization of a long recording head, which facilitates mounting work for installing a drive circuit on the back surface of a substrate.

[0002]

2. Description of the Related Art Heretofore, a heat transfer printer which drives a heating element of a recording head to thermally transfer ink on an ink ribbon to a paper surface by sublimation or melting to perform printing, and ejects ink from an ink bottle to the paper surface. There is an ink jet printer that performs printing by using a printing method. Each of these printers has an arbitrary printhead provided with a large number of heating elements formed at a fine resolution of 300 dots / 25.4 mm (approximately 12 per mm2) or more. Print pattern on paper, and record characters and color images (print, print)
I do.

[0003] In particular, in a recording method using an ink jet printer, ink droplets (print dots) are ejected from paper, cloth or the like by ejecting ink droplets from a large number of fine holes (nozzles) arranged on an ink ejection surface of a recording head. It discharges and lands on the recording material and absorbs it, thereby recording characters and images, etc.It generates less noise and performs special fixing processing like an electrophotographic printer using toner. It is not necessary and full-color printing is a relatively easy printing method.

In an electrophotographic printer using toner, a recording head composed of a large number of monolithically formed LEDs and the like forms an electrostatic latent image on the surface of a photoreceptor, and this electrostatic latent image is converted into a toner image. After the toner image is transferred to paper, the toner image is fixed on the paper surface by heat and pressure.

[0005] Full-color recording usually uses three color inks (toner in the electrophotographic system, hereinafter the same) of three subtractive primary colors, yellow (yellow), magenta (red), and cyan (greenish blue). Alternatively, recording (printing) is performed by using four colors of ink to which black (black) used for black portions of characters and images is added.

In the above-described ink jet printer, as a method of ejecting ink droplets, a thermal jet method in which ink droplets are ejected from minute nozzles by the pressure of bubbles generated by heat generated by a heating element disposed in a minute ink chamber. There is a piezo-jet method in which ink droplets are ejected from minute ejection nozzles by a mechanical deformation pressure of an ink chamber caused by electromechanical conversion by a piezoresistive element.

Further, the thermal jet system has two types of configurations depending on the direction of ink droplet ejection. One is a configuration in which ink is ejected in a direction perpendicular to the heat generating surface of the heat generating portion. Above all, those that eject ink droplets in a direction perpendicular to the heat generating surface of the heat generating portion are called roof shooter type or top shooter type ink jet printer heads, and discharge ink in a direction parallel to the heat generating surface of the heat generating portion. It is known that the power consumption is extremely small as compared with the side shooter type.

The method of manufacturing this roof shooter type thermal ink jet printer head is, for example, 6 × 2
Using a silicon LSI forming technique and a thin film forming technique on a large number of chip substrates of about 10 mm × 15 mm divided into, for example, 90 or more pieces on one silicon wafer having a diameter of 5.4 mm or more. There is a method of monolithically forming a large number of heat generating parts and a driving circuit, a wiring electrode, an ink flow path, a discharge nozzle, etc. for individually driving them.

[0009] Further, the above-described heating portion, wiring electrode, and the like are formed by using a thin film forming technique on a glass substrate without using a silicon wafer.
There is also a method in which a recording head unit including an ink flow path, a discharge nozzle, and the like is formed, a driving circuit unit using an LSI forming technique is formed in a separate body such as a silicon substrate, and the driving circuit unit and the recording head unit are connected.

FIGS. 5 (a), (b), (c), FIGS. 6 (a), (b), (c), FIGS. 7 (a), (b), (c), and FIG. 8 (a) 5 (a), 5 (b) and 5 (c) are views showing a method of manufacturing such a conventional roof shooter type ink jet printer head (hereinafter simply referred to as a recording head) in the order of steps, and FIGS. (c) schematically shows a schematic plan view of a state of being formed on an insulating substrate such as glass in a series of steps, and a cross-sectional view taken along the line AA ′. Although FIG. 3 (c) shows a configuration having 23 heating elements or discharge nozzles, the number of heating elements or discharge nozzles is actually 64 depending on the design policy. , 128, 256, etc.

FIGS. 6 (a), 7 (a) and 8 (a) are enlarged views of the plan views of FIGS. 5 (a), 5 (b) and 5 (c), respectively. For convenience, the configuration is shown with five heating elements or five discharge nozzles. 6 (b), 7 (b) and 8
(b) corresponds to A in FIGS. 6 (a), 7 (a) and 8 (a), respectively.
-A 'cross-sectional view, FIG. 6 (c), FIG. 7 (c) and FIG. 8 (c)
B- in FIGS. 6 (a), 7 (a) and 8 (a) respectively.
It is B 'arrow sectional drawing. With reference to FIGS. 5 (a), 5 (b) and 5 (c) to FIGS. 8 (a), 8 (b) and 8 (c), a conventional method of manufacturing a recording head will be briefly described below.

As shown in FIGS. 5 (a) and 6 (a), 6 (b) and 6 (c), an area of 25 to 40 μm square is formed on a substrate 1 made of glass or the like by using a thin film forming technique. And a common electrode 3 and an individual wiring electrode 4 connected to both ends of the heating element 2, respectively.
The individual wiring electrodes 4 are individually formed corresponding to the heating elements 2 to form individual wiring electrode rows 4 ′, and the common wiring electrode 3 is a single electrode as a whole and has one end in the longitudinal direction of the substrate. A common electrode terminal 3 'is formed at the upper end (in the figure, at the upper end), and a large and elongated opening 3-1 is formed along the vicinity of the left end in the lateral direction of the substrate.
Is formed, and the surface 1-1 of the substrate 1 is exposed inside the opening 3-1.

Subsequently, as shown in FIGS. 5 (b) and 7 (a), (b) and (c), the left and upper portions of the common electrode 3 with respect to the opening 3-1 and the individual wiring electrodes The photosensitive resin is used between a portion where the heating element 4 is disposed and between each heating element 2 and the heating element 2.
About 10μ by photolithography technology and baking
The partition 5 having a height of m (seal partition 5-1, 5-2, partition partition 5-3) is formed.

The partition 5 is composed of seal partitions 5-1 and 5-
2, a large internal ink flow path which is isolated from the outside as a whole is formed, and a seal partition 5-2 on the individual wiring electrode 4 and a partition partition 5-3 extending between the respective heating elements 2 are combined with a comb body and a comb. And a comb-shaped partition wall 5 of this comb.
-3 are used as partition walls, and fine divisions in which the heating elements 2 are located at the bases between the teeth are formed by the number of the heating elements 2.

Subsequently to the above, the substrate 1 is further placed in the opening 3-1 of the common wiring electrode 3 along the shape of the opening 3-1 by dry etching technique such as sandblasting.
An elongated slit-shaped ink supply groove 6 is formed on the front surface 1-1 of the substrate 1, and one opening is opened in the ink supply groove 6, and the other opening penetrates the substrate 1 and opens on the back side of the substrate 1. The ink supply hole 7 is formed.

Thereafter, as shown in FIGS. 5 (c) and 8 (a), (b) and (c), the top plate 9 is placed on the partition wall 5 by heat and pressure using a thermoplastic adhesive. Glue the metal film mask 1 on the surface
1 is formed by film formation by sputtering and wet etching by a resist mask. According to the metal film mask 11, a large number of discharge nozzles 12 are collectively formed on the top plate 9 at a position facing the heating element 2 by helicon wave dry etching or the like. Form.

As a result, in the interior covered by the top plate 9,
Ink flow path 13 having a height corresponding to the thickness of partition wall 5 of 10 μm
Are formed between the partition part surrounding the heating element 2 from three sides and the ink supply groove 6. This allows a large number of ejection nozzles 12
Are formed on the substrate 1 in a single-color recording head having a line.

FIG. 9 is a diagram showing the state of assembly and wiring connection of a drive circuit for driving the heating element 2 to generate heat, which is performed in the final step following the above. As shown in the figure, a drive circuit 15 made of a silicon chip having a diffusion layer formed thereon is bonded and fixed to a vacant area left to the right of the print portion 14 of the substrate 1. The drive electrode terminals and the terminals of the individual wiring electrodes 4 on the printing section 14 are bonded by wires 16, and the wires 16 are sealed and protected with a resin 17 to complete the recording head 18.

The recording head 18 supplies ink from outside to the ink flow path 13 at the time of printing.
The heating element 2 is selectively applied with a pulse voltage in accordance with print information, is driven to generate heat, generates heat instantaneously, generates film bubbles at the interface between the heating element 2 and the ink, and increases the growth pressure of the film bubbles. Thus, the ink droplets are ejected from the ejection nozzle 12 toward the external paper surface.

In recent years, printers that perform full-color printing usually use three subtractive primary colors of yellow (Y), magenta (M), and cyan (C).
Black (B
k) plus a total of four color inks. Therefore, in a full-color recording head, it is necessary to arrange at least four mono-color recording heads in parallel. According to the above-described manufacturing method, it is possible to monolithically arrange the four monocolor recording heads 18 on one substrate in a monolithic manner. Can also be positioned more precisely with today's microfabrication technology.

However, as shown in FIG.
In the state where the empty area of the substrate 1 is secured to the right of the above and the drive circuit 15 is assembled in this empty area, there is a problem that the area for disposing the recording head 18 becomes large. In particular,
Such a full-color recording head having a configuration in which four mono-color recording heads 18 are further arranged in parallel has a problem that the whole becomes extremely large.

In the serial printer, the direction indicated by the double-headed arrow C shown in FIG. 5C is the printing sub-scanning direction, and the printing unit 14 (the recording head 18 shown in FIG. ) Prints on paper while reciprocating in the direction perpendicular to the double-headed arrow C, and the recording head has a relatively small configuration.

However, in the line printer, the direction indicated by the double-headed arrow C in FIG. 5C is the main printing direction, and the recording head is set to the full length of the printing area in the main scanning direction (the width direction of the paper). The sheet is formed and fixed to the printer body, and only the sheet is transported in a direction perpendicular to the double-headed arrow C. In other words, the recording head has an extremely long longitudinal direction,
In the configuration in which the printing unit and the drive circuit are arranged side by side on the same surface of the substrate as described above in addition to the long longitudinal configuration, the entire substrate becomes excessively large especially in a recording head formed for a line printer. There is a practical problem.

FIG. 10 is a schematic sectional side view showing a different example of the assembling of the drive circuit and the wiring connection in the print head proposed to solve the above problem. As shown in FIG. 1, the recording head 20 includes a heater board 22 formed on a support plate 21 and an ink chamber 24 formed by a periphery of the heater board 22 and a top plate 23 formed thereon. Ink is supplied from outside via the ink flow path 25. Then, the heat in the heater board 22 causes the ink in the ink chamber 24 to be ejected to the outside from the ejection nozzle 26 as an ink droplet.

The heating of the heater board 22 is driven by a drive circuit (not shown) via a flexible wiring board 27. A number of Al wirings (not shown) corresponding to the number of drive elements are formed on the flexible wiring board 27, and approximately the first half of the entire length is arranged on the upper surface of the support plate 21, and the second half Are turned around from the top to the bottom at the end of the support plate 21 and are turned back to be disposed on the lower surface of the support plate 21.

The Al wiring at the end of the portion provided on the upper surface of the flexible wiring board 27 is connected by bonding to the terminals (not shown) of the heater board 22 by wires 28 and provided on the lower surface of the support plate 21. A contact pad 29 is formed on the Al wiring in the portion indicated.
A drive circuit (not shown) is connected to the flexible wiring board 27 via the contact pads 29 and is arranged on the back surface of the support plate 21.

[0027]

However, since this structure has a structure in which the flexible wiring board 27 is bent in the direction in which the flexible wiring board 27 is inverted, the internal wiring formed in the bent portion with an extremely small thickness is formed. There is a drawback that it is easy to cause injury.

Further, since the flexible wiring board 27 is arranged so as to largely detour along the end of the support plate 21, the wiring area D on the front side (upper surface) of the support plate 21 promotes the miniaturization of the recording head 20. There is also a problem that it may be an injury in doing so. SUMMARY OF THE INVENTION An object of the present invention is to provide a recording head suitable for promoting miniaturization of a long recording head, which can appropriately and easily perform a mounting operation for installing a drive circuit on the back surface of a substrate in view of the above conventional circumstances. It is.

[0029]

A recording head according to a first aspect of the present invention is a recording head for performing recording by arranging a plurality of recording elements corresponding to recording dots in a predetermined direction in parallel with each other. A plurality of printing elements provided on the front surface of the substrate, a drive circuit for driving the printing elements provided on the back surface side of the substrate, and a substrate directly connecting the printing elements and the drive circuit. And an electric wiring pattern formed by adhesion.

The electric wiring pattern may be, for example,
As described above, it is preferable that the recording element and the drive circuit are connected to each other through a through hole formed in the substrate. Also, the recording element may be, for example,
As described in the description, it is preferable that the recording material is disposed so as to correspond to the entire area in the width direction of the recording area. An ink jet recording element that ejects from an ejection nozzle may be used.

Preferably, the substrate is a glass substrate, for example, and the drive circuit is disposed directly on the back surface of the substrate, for example, as described in claim 6. You may make it so. Next, a recording head according to a seventh aspect of the present invention is a recording head for performing recording by arranging a plurality of recording elements corresponding to recording dots in a predetermined direction in parallel, the substrate being provided on a surface of the substrate. A plurality of printing elements, a circuit board installed on the back side of the board, a driving circuit for driving the printing elements installed on the circuit board, and electrical wiring connecting the printing elements and the driving circuit; , Is configured.

The electric wiring may be, for example,
As described, a wire bonding connection may be provided.

[0033]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1A is a plan view of a recording head according to a first embodiment, and FIG. 1B is a cross-sectional view taken along the line EE ′. As shown in FIGS. 3A and 3B, the recording head 30 has a heating element 33 as a recording element, a common electrode 34, an individual wiring Electrode 35 and partition 3
6 are stacked, and a top plate 37 is further stacked on the partition wall 36, and a discharge nozzle 38 is formed on the top plate 37 at a position facing the heating element 33.

The manufacturing method of the ink supply path 31, the heating element 33, the common electrode 34, the individual wiring electrode 35, the partition 36, the top plate 37 and the discharge nozzle 38 formed in the head substrate 32 is described with reference to FIGS. The manufacturing method of the ink supply groove 6 and the ink supply hole 7, the heating element 2, the common electrode 3, the individual wiring electrode 4, the partition 5, the top plate 9, and the discharge nozzle 12 in the manufacturing process of the printing unit 14 shown in FIG. .

In FIG. 1B, a thin-film resistor forming the heating element 33 is provided on the lower surface of the common electrode 34 and the individual wiring electrode 35, and these electrode portions are formed in two layers. However, the portion that generates heat as a heating element is only a portion that is sandwiched between both electrodes and has an exposed area of about 40 μm square, and this portion is shown as a heating element 33.

In the present embodiment, the free area of the head substrate 32 following the right side of the printing section 39 is extremely small, and the first extension section 35-1 exposed to the outside from the partition 36 of the individual wiring electrode 35 in this free area. Is provided, and the first extension portion 35-1 is provided.
A second extension 35-2 is formed by extending around the side surface of the head substrate 32, and a third extension 35-3 further extending the second extension 35-2 is formed on the back surface of the head substrate 32. It is formed so as to wrap around. The head substrate 3
2 along one short side end, the first extension 34-1, the second extension 34-2, and the third extension (not shown) of the common electrode 34 are connected to the first extension of the individual wiring electrode 35. To the third extension 35
-1, 35-2, and 35-3.

The individual wiring electrode 35 and its extension and the common electrode 34 and its extension are formed by uniformly forming a wiring electrode film on a required area of the head substrate 32 by sputtering or the like, Etc. are simultaneously formed simultaneously by a patterning method.

Thereafter, as shown in FIG. 1 (b), a drive circuit 41 previously formed in another process is disposed on the back surface of the head substrate 32, and is formed for each drive element of the drive circuit 41. Connection pad (not shown) and extension 3 of individual wiring electrode 35
The connection terminals 5-3 are bonded by wires 42.

The third extension of the lower surface of the head substrate 32 of the common electrode 34 (the third extension 35-3 of the individual wiring electrode 35).
Similarly, the connection between the connection terminal (not shown) formed at the tip end and the external power supply terminal (not shown) is also performed by wire bonding (the same applies hereinafter), and only the individual wiring electrode 35 will be described. ).

Subsequently, the wire bonding portion is covered with the protective resin 43 to complete the recording head 30. As described above, the drive circuit 41 provided on the back surface of the head substrate 32 and the third extension 35-3 of the individual wiring electrode formed on the back surface of the head substrate 32 by being directly adhered by patterning, are connected by wire bonding. , The mounting of the drive circuit 41 on the head substrate 32 is easy. The connection between the connection terminal of each wiring electrode and the drive circuit 41 or the external power supply terminal can also be suitably performed by a COG (chip on glass) method.

FIG. 2A is a plan view of a recording head according to a second embodiment, and FIG. 2B is a sectional view taken along line FF 'of FIG. 2 (a) and 2 (b), the same components as those of the recording head 30 shown in FIGS. 1 (a) and 1 (b) include the same components as those in FIGS. 1 (a) and 1 (b). The numbers are given.

The print head 45 of this embodiment shown in FIGS.
The second extension 35-2 ′ for diffracting the extension of the individual wiring electrode 35 toward the back surface of the head substrate 32 has a through hole 46.
1A and 1B is different from the print head 30 shown in FIGS. 1A and 1B. This through hole 46
Is formed by, for example, laser processing, and a conductive layer is formed on the inner wall surface of the through hole 46 by an electroless plating method to form a second extended portion 35-2 ', and the upper and lower portions thereof are formed by the first extended portion 35-1 and the third extended portion 35-2'. Connect to extension 35-3.

In the print head 45, since the second extension 35-2 ', which is a wiring that may be disconnected due to diffracting to the back surface of the head substrate 32, is formed on the entire inner wall surface of the through hole 46, the print head 45 is disconnected. And the like are less likely to occur, and the reliability is improved. FIG. 3A is a plan view of a recording head according to a third embodiment, and FIG. 3B is a cross-sectional view taken along the line GG ′. 1A and 1B, the same components as those of the recording head 30 shown in FIGS. 1A and 1B are the same as those shown in FIGS. 1A and 1B. Are given.

The print head 47 shown in FIGS. 3A and 3B of this embodiment
A through groove 48 is formed in the head substrate 32 ′ constituting the printing section, extending in parallel with the direction in which the ejection nozzles 38 are arranged. Further, only the extension 35-1 provided on the upper surface of the head substrate 32 'is formed on the individual wiring electrode 35. A drive circuit board 49 on which the drive circuit 41 is mounted is prepared in advance separately from the head board 32 ', and the drive circuit board 49 is fixedly attached to the back surface of the head board 32'.

The head substrate 3 of the drive circuit substrate 49
An ink supply path 51 on the drive circuit board side is formed in advance at a position corresponding to the ink supply path 31 of 2 ′, and the drive circuit board 49 is placed at an appropriate position corresponding to the through groove. A through hole 52 penetrating from below is formed. The same number of the through holes 52 are formed in correspondence with the heating elements 33 (that is, the individual wiring electrodes 35), and the same number of the electrode wirings 53 are formed in the drive circuit board 49 in correspondence with the individual wiring electrodes 35. Are respectively laid from the upper surface to predetermined positions on the lower surface via the corresponding through holes 52.

The method of disposing the electrode wiring 53 through the through hole 52 is based on the first to third extension portions 35-1, 35-35 of the individual wiring electrode 35 shown in FIGS. 2 (a) and 2 (b). It is formed by the same processing as in the case of the arrangement method of 2 'and 35-3.
An end of the lower surface of each electrode wiring 53 on the drive circuit board 49 is connected by bonding to a connection pad (not shown) formed for each drive element of the drive circuit 41 by a wire 54. The connection portion is sealed with a protective resin 55.

The drive circuit board 49 is connected to the head board 32 '.
After assembling, as shown in FIG.
3 and the extension 5-1 of the individual wiring electrode 35 of the head substrate 32 'is bonded to the end of the upper surface portion of the drive circuit board 49 with a wire 56, and the connection is sealed with a protective resin 57. Stop.

As described above, the print head 47 is configured so that a separate drive circuit board is attached to the head substrate and connected to the heating element by patterning wiring and wire bonding, so that the drive circuit can be mounted on the head substrate. This further facilitates the mounting work efficiency of the recording head.

In each of the first to third embodiments, the connection between the drive circuit and the wiring electrode is made by wire bonding. However, the connection may be made by bumps such as COG connection. FIG. 4 is an example of a COG connection,
FIG. 9 is a diagram showing a modification in which the wire bonding connection in the embodiment shown in FIG. 1 is changed to a COG connection, and as shown in FIG.
The bumps 58 are formed on the connection terminals of the third extension portions 35-3 of the individual wiring electrodes 35 disposed on the lower surface of the head substrate 32 made of a rigid body such as glass. It is press-fitted via a conductive adhesive 59 (ACF).
Thereby, the conductive particles 59-in the anisotropic conductive adhesive 59 are removed.
The bumps 58 of the drive circuit chip 41 ′ and the connection terminal portions of the individual wiring electrodes 35 on the head substrate 32 side are reliably and electrically connected via 1. Further, in this example, the drive circuit chip 41 ′
And the head substrate 32 are filled with an adhesive 60,
The G connection is fixed and protected.

In each of the above-described embodiments, a method of connecting a heating element as a recording element and a drive circuit is described as an example. However, the present invention is not limited to this. The present invention is also applicable to connection wiring between an exposure element such as an LED used in the apparatus and a driving circuit thereof.

[0051]

As described above in detail, according to one aspect of the present invention, the recording element provided on the front surface of the substrate and the drive circuit provided on the back surface are directly formed on the substrate surface. Electrical connection by the wiring pattern
A highly reliable mounting operation of a recording head suitable for promoting downsizing of a long recording head is facilitated.

In the case of the first embodiment of the present invention,
Since the wiring pattern is formed along the path extending from the front surface of the substrate to the rear surface via the end surface, downsizing of the head substrate and thus the recording head is further promoted. Furthermore, in the case of the second embodiment of the present invention, since pattern wiring from the heating element of the printing unit provided on the substrate surface to the drive circuit on the back surface of the substrate is performed through the through hole, problems such as disconnection hardly occur. The reliability of the recording head is improved.

Further, according to another aspect of the present invention, since the drive circuit of the recording element provided on the front surface of the substrate is provided on the circuit board provided on the back surface of the substrate, the drive circuit is further mounted on the head substrate. As a result, the work efficiency of the recording head preparation is improved.

[Brief description of the drawings]

FIG. 1A is a plan view of a recording head according to a first embodiment, and FIG. 1B is a sectional view taken along the line EE ′ of FIG.

FIG. 2A is a plan view of a recording head according to a second embodiment, and FIG. 2B is a cross-sectional view taken along line FF 'of FIG.

FIG. 3A is a plan view of a recording head according to a third embodiment, and FIG. 3B is a sectional view taken along the line GG ′ of FIG.

FIG. 4 is a diagram illustrating an example of bump connection.

FIGS. 5A, 5B, and 5C are schematic plan views and cross-sectional views showing a conventional method of manufacturing a recording head in the order of steps.

FIGS. 6 (a), (b), and (c) are a plan view and a sectional view showing the structure of FIG. 5 (a) in an enlarged manner in detail.

FIGS. 7 (a), (b), and (c) are a plan view and a cross-sectional view showing the structure of FIG.

8 (a), (b), and (c) are a plan view and a sectional view showing the structure of FIG. 5 (c) in an enlarged manner and in detail.

FIG. 9 is a diagram showing a state of a drive circuit for driving a heating element to generate heat, which is performed in a final step of a conventional print head manufacturing method, and a state of wiring connection.

FIG. 10 is a diagram showing another example of assembling a drive circuit of a conventional recording head and wiring connection.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate 1-1 Surface 2 Heating element 2 'Heating element row 3 Common electrode 3' Common electrode terminal 3-1 Opening 4 Individual wiring electrode 4 'Individual wiring electrode row 5 Partition wall 5-1 and 5-2 Seal partition wall 5- REFERENCE SIGNS LIST 3 partitioning wall 6 ink supply groove 7 ink supply hole 9 top plate 11 metal film mask 12 discharge nozzle 13 ink flow path 14 printing unit 15 drive circuit 16 wire 17 resin 18 recording head 20 recording head 21 support plate 22 heater board 23 top plate Reference Signs List 24 Ink chamber 25 Ink flow path 26 Discharge nozzle 27 Flexible wiring board 28 Wire 29 Contact pad 30 Recording head 31 Ink supply path 32, 32 'substrate 33 Heat generating element 34 Common electrode 34-1 Wiring terminal 34-2, 34-3 Extension Part 35 Individual wiring electrode 35-1 First extension 35-2 Second extension 35-3 Extension part 36 Partition wall 37 Top plate 38 Discharge nozzle 39 Printing part 41 Drive circuit 41 'Drive circuit chip 42 Wire 43 Protective resin 45 Print head 46 Through hole 47 Print head 48 Through groove 49 Drive circuit board 51 Ink supply path 52 Through hole 53 Electrode wiring 54, 56 Wire 55, 57 Protective resin 58 Bump 59 Anisotropic conductive adhesive 61 Adhesive

Claims (8)

[Claims] 1. A recording head for performing recording by arranging a plurality of recording elements corresponding to recording dots in a predetermined direction in parallel, comprising: a substrate; a plurality of recording elements disposed on a surface of the substrate; A driving circuit for driving the recording element provided on the back side of the substrate; and an electric wiring pattern directly formed on the substrate for connecting the recording element and the driving circuit. Recording head. 2. The recording head according to claim 1, wherein the electric wiring pattern connects the recording element and the drive circuit via a through hole formed in the substrate. 3. The recording head according to claim 1, wherein the recording elements are arranged so as to correspond to the entire recording area of the recording material in the width direction. 4. The recording element according to claim 1, wherein the recording element is an ink jet recording element that applies pressure to the ink to eject the ink from a discharge nozzle.
The recording head according to the above. 5. The recording head according to claim 1, wherein the substrate is a glass substrate. 6. The recording head according to claim 1, wherein the drive circuit is disposed directly on a back surface of the substrate. 7. A recording head for performing recording by arranging a plurality of recording elements corresponding to recording dots in a predetermined direction in parallel, comprising: a substrate; a plurality of recording elements disposed on a surface of the substrate; A circuit board installed on the back side of the board, a drive circuit for driving the printing element installed on the circuit board, and an electric wiring connecting the printing element and the drive circuit. Recording head. 8. The recording head according to claim 7, wherein the electric wiring includes a wire bonding connection.