JP2000218803A - Multi-array type multi-color nozzle array print head - Google Patents

Abstract

(57) [Problem] To provide a multi-array type multi-color nozzle array print head provided with an ink flow path having a good flowability and a simple structure. An element head substrate is alternately arranged in two rows in a staggered manner at two dashed lines at a position of a parent substrate, and ink tanks (56-1, 56) are provided at both ends of a printing area.
-2) are provided, and a total of eight ink supply paths 57 are formed, each of which is in communication with the yellow, magenta, cyan, and black ink storage chambers of each ink tank 56.
The epoxy-modified resin film 59 having the connection holes formed thereon is temporarily bonded to the parent substrate 53, and the element head substrate 50 is positioned thereon and temporarily bonded to form the ink supply holes 40 and the ink supply paths 57 into the connection holes 61. After that, bonding is completed in a heating furnace, and wire bonding is performed by a COB method to complete a multi-array type multi-color nozzle array print head.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multi-array type multi-color nozzle array print head having an ink flow path for constantly and smoothly flowing ink.

[0002]

2. Description of the Related Art In recent years, as an image forming apparatus for individuals,
A relatively simple printer such as a thermal transfer printer that drives the heating element of the print head to thermally transfer the ink from the ink ribbon to the paper surface, or an inkjet printer that prints by discharging the ink from the ink bottle onto the paper surface. Serial printers have become mainstream and are widely used.

At present, not only monochrome printing but also full-color printing is realized. Full-color printing is usually the three primary colors of subtractive color mixing, yellow (yellow),
Magenta (red dye name) and cyan (greenish blue)
In some cases, this is performed using four colors of ink in which black (black) dedicated to a black portion of a character or image is added.

[0004] In particular, an ink jet printer discharges ink droplets from nozzles of a print head and absorbs the ink droplets on a recording material such as paper or cloth to print characters or images. This is a recording method that generates little noise, does not require special fixing processing, and has no waste of ink.

FIG. 7 is a perspective view schematically showing the configuration of such a serial ink jet printer (hereinafter simply referred to as a printer). The printer 1 shown in FIG. 1 is a small printer used personally at home, and has a carriage 2 on which a print head 3 for executing printing and an ink cartridge 4 containing ink are attached.

The carriage 2 has a guide rail 5 on the one hand.
And slidably supported on the other hand, and is fixed to the toothed drive belt 6 on the other hand. As a result, the print head 3 and the ink tank 4 are reciprocated in the width direction of the apparatus main body (printer 1) indicated by the double-headed arrow B in the drawing, that is, in the main scanning direction of the print image. A flexible communication cable 7 is connected between the print head 3 and a control device (not shown) of the apparatus main body, and print data and a control signal are sent from the control device to the print head 3 via the flexible communication cable 7.

The print head 3 is integrally formed as a head unit with the ink cartridge 4 from the beginning and is detachably fixed to the carriage 2 or the print head 3 is fixed to the carriage, and the print head 3 The cartridge 4 is detachably engaged and integrated.

[0008] Monochrome printers have been the mainstream of the conventional inkjet printers, but recently, full-color printers have been the mainstream. As shown by a broken line in FIG. ), Magenta (M), cyan (C) and black (K) inks, respectively.
The four inks (four colors) are supplied to the print head 3 from one ink chamber 4b.

The print head 3 is opposed to the print head 3.
A platen 9 is provided at the lower end of the frame 8 of the apparatus main body so as to extend in the reciprocating movement direction indicated by the double-headed arrow B in FIG. In contact with the platen 9, the paper 10 is fed by a pair of paper feed rollers 11 (the lower roller is shaded by the paper 10 and cannot be seen in the drawing) and a pair of paper ejection rollers 12 (the lower roller is similarly shaded ), The sheet is intermittently conveyed in the printing sub-scanning direction (the diagonally lower left direction in the figure) indicated by the arrow C in the figure.

As a result, the print head 3 moves intermittently in the sub-scanning direction relative to the paper 10. During the intermittent movement (intermittent transport of the paper 10), the print head 3
Is driven by the motor 13 via the toothed drive belt 6 and the carriage 2 to eject ink near the paper 10 and print on the paper. Printing can be performed on the entire surface of the paper 10 by repeating the intermittent conveyance of the paper 10 and the printing during the reciprocating movement by the print head 3.

FIGS. 8 (a), 8 (b) and 8 (c) are schematic views showing the manufacturing method and structure of the print head 3. FIG. As shown in FIG. 2A, the print head 3
It is formed by an I formation processing technology and a thin film formation processing technology,
After completion, they are individually cut out from the silicon wafer 14 and collected.

FIG. 2B shows the ink ejection surface of the print head 3 (a surface of the print head 3 of FIG. 7 as viewed from the direction of arrow A in FIG. 2).
And four nozzle rows 15 for discharging four kinds of inks of yellow (Y), magenta (M), cyan (C) and black (Bk) are provided on the ink ejection surface of the print head 3. Is formed.

In one nozzle row 15, about 125 or 256 nozzles 16 are arranged in a line at a density of, for example, 300 dpi (dots / inch) (about 12 nozzles per mm). . Each nozzle row 15 has one
Each ink chamber 4b of the ink cartridge 4 corresponding to one
, Ink of a color corresponding to each nozzle row 15 is supplied.

FIG. 1C is an enlarged cross-sectional view taken along the line DD 'of FIG. 1B. As shown in FIGS. 2B and 2C, the print head 3 is provided on a chip substrate 17 with a drive circuit 1 composed of an LSI.
8 and a thin-film resistance heating section 19 are formed. An individual wiring electrode 21 connecting the resistance heating section 19 and the driving circuit 18 and a common electrode 23 serving as a common wiring from the grounding terminal 22 are formed thereon. Partition walls 24 are stacked. The resistance heating portions 19 and the individual drive electrodes 21 are arranged by the number of nozzles 16 of the nozzle row 15 formed later.

An ink groove 25 extending in parallel with the nozzle row 15 to be formed later, and an ink supply hole 26 communicating with the ink groove 25 and penetrating the lower surface are formed in the chip substrate 17. , Orifice plate 27 from above
Is heated and pressurized to form a thermoplastic adhesive 28 on the underside.
And is laminated on the partition wall 24. By laminating the orifice plates 27, an ink passage 29 having a height of about 10 μm corresponding to the thickness of the partition wall 24 is formed between the resistance heating portion 19 and the ink groove 25. Thereafter, the above-described nozzles 16 for ejecting ink are formed on the orifice plate 27. If the diameter of the silicon wafer 14 shown in FIG. 1A is, for example, 6 inches, 90 or more print heads 3 as described above can be collected.

The ink cartridge 4 shown in FIG.
The ink in each of the ink chambers 4b is supplied to the ink supply hole 26 and the ink groove 2 shown in FIG.
5, and the ink is supplied to the resistance heating section 19 through the ink passage 29. The resistance heating section 19 is selectively driven by the drive circuit 18 in accordance with print data, generates heat instantaneously, and causes the nozzle 16 to eject ink droplets due to a film boiling phenomenon.

In recent years, as a member of information communication equipment, the demand for printers has been rapidly increasing in recent years, and with the increase in demand, there has been an increasing demand for faster printing. On the other hand, when printing is performed by the serial type ink jet printer 1 as shown in FIG. 7, once the size of the print head 3 in the sub-scanning direction is longer, that is, as the size of the nozzle row 15 is longer, In the main scanning, printing can be performed in a wide range in the sub-scanning direction of the paper 10, so that printing can be performed at high speed. That is, the longer the size of the print head 3 in the sub-scanning direction, the better.

However, due to the limitations of the LSI manufacturing technology for processing the drive circuit and the like by micromachining on the element head substrate 17 due to the exposure machine and the limitations of the thin film forming technology for forming the resistance heating portion, the drive electrode, the partition, and the like. , Silicon wafer 1
There is a limit to the size of the print head 3 formed on the print head 4, and only a print head having a size of up to about 10 × 15 mm can be formed.

In order to overcome this problem, there has been proposed a technique in which the above-described print head 3, which has been conventionally used alone, is used as an element head and joined in the sub-scanning direction. However, if the length of the carriage 2 is too long in the sub-scanning direction, the carriage 2 becomes large and the driving load increases. To cope with this, first, a plurality of guide rails 5 supporting the carriage 2 are provided, the drive belt 6 is changed to a stronger one, and the motor 13 is changed to a large one having a large driving force. There is a need. Further, in order to suppress the vibration of the apparatus main body, it is necessary to change the frame to a stronger one.

In this case, the manufacturing cost increases, the size of the entire apparatus increases, and the advantage of speeding up the printing process is lost. Therefore, instead of extending the element head substrate long in the sub-scanning direction, the element head substrate is formed long in the main scanning direction, that is, the entire printing area of the paper width, and is fixed to the apparatus main body, and only the paper is moved in the sub-scanning direction. It has been proposed to carry and print.

For example, the width of A4 size paper is 210 mm, and when a 15 mm margin is left and right and its effective printing area is 180 mm, 12 element head substrates of 10 × 15 mm are connected and arranged on the parent substrate. Then, in theory, the above-described print head is completed. However, since the element head substrate actually has an edge portion, it is necessary to cut off and connect the edge portion. Therefore, several more element head substrates are required.

FIG. 9 (a) is a diagram showing a state of a connecting portion when twelve element head substrates are connected to form a print head in this manner, and FIG. 9 (b) is a diagram showing the connecting portion. FIG. 6 is a diagram illustrating a direction in which an ink droplet should be ejected from a nozzle in FIG. FIG. 7A shows the n-th and n + 1-th (n = 1, 2,..., 12) element head substrates n, n of the twelve elements.
+1 is indicated. These twelve element head substrates are fixed to the printer main body, and only the sheet 20 shown in FIG. 2B is conveyed in the sub-scanning direction indicated by the arrow E in FIGS. 2A and 2B.
For example, the nozzle row 15-1 discharges yellow ink, the nozzle row 15-2 discharges magenta ink, the nozzle row 15-3 discharges cyan ink,
The nozzle row 15-4 is configured to eject black ink.

[0023]

However, at the connection portion of each element head substrate, the interval between adjacent nozzles is reduced.
In order to form the nozzles at intervals similar to the nozzle intervals of the nozzle rows for each element head substrate, for example, if the print head has a resolution of 300 dpi, the pitch of the nozzles is 84 μm.
And if the nozzle has a hole diameter of 32 μm,
The gap between the nozzles is 50 μm, and it is necessary to cut accurately at an interval that bisects this, that is, 25 μm away from the edge nozzle 16-128 or 16-1 at the edge of the element head substrate.

It is relatively easy to accurately cut and polish the silicon substrate itself with the current technology. However, due to the nature of the resin-based polyimide material, the partition walls and orifice plate laminated thereon, especially the thermoplastic adhesive material adhered to the back surface of the orifice plate, are cut and polished accurately. It is impossible to do.
Also, a problem occurs in the cut portion in terms of physical strength.

Therefore, as shown in FIG. 9 (b), it is necessary to provide a margin (error absorption width) of the gap F at the connecting portion. Then, in order to keep the density of the print dots in the joint portion the same as in the other portions, as shown in FIG.
7, 16-126,... And 16-1, 16-2,.
.. The pitch of the print dots is corrected to be uniform on the printing paper surface by processing by inclining the center line direction of the nozzles so that the ink ejection directions of の and の are each successively closer to the connection portion.

However, this method has a problem that it is very difficult to process the inclined nozzle near the connecting portion between the element head substrates n and n + 1. In addition, as it is, conventionally, since the ink supply paths for supplying ink from the ink tanks are formed in the respective element head substrates, the ink supply paths are complicated and the fluidity of the ink is reduced. I have.

It is preferable that the element head substrate is mounted on the parent substrate by a COB mounting method with good mass productivity. However, in the case of a top shooter type element head substrate, the ink supply system is provided on the ink ejection surface of the print head. Since it must be arranged on the opposite side, a problem occurs in joining the element head substrate and the parent substrate. In other words, a sealing material must be used at the joint between the head substrate and the parent substrate. However, when the element head substrate is die-bonded onto the parent substrate, the sealing material is heated and compressed to expand and supply fine ink. The problem of closing the hole occurs.

At present, a simple ink supply method to a print head to which a large number of such element head substrates are connected, that is, a multi-array print head has not yet been established.

The object of the present invention is to solve the above-mentioned conventional problems,
An object of the present invention is to provide a multi-array type multi-color nozzle array print head which can be easily manufactured and has an ink flow path for constantly and smoothly flowing ink.

[0030]

According to the present invention, there is provided a multi-array type multi-color nozzle array print head in which a plurality of element head substrates each having discharge nozzles arranged in a plurality of columns are arranged on a parent substrate. A multi-color nozzle row print head, wherein the ink tanks are arranged outside the printing area of the parent board in correspondence with the plurality of rows of ejection nozzles, and are formed on the parent board in parallel along the nozzle row direction. And a plurality of ink supply paths for supplying ink supplied from the ink tank to ink grooves communicating with the corresponding nozzle rows of the element head substrate via ink supply holes.

The element head substrates may be arranged so as to be arranged in series on the parent substrate in series. Further, the element head substrate includes:
For example, as described in claim 3, it is preferable to dispose on the parent board in a staggered arrangement.

In this case, for example,
The element head substrate includes four nozzle rows corresponding to yellow, magenta, cyan, and black discharge inks, and the ink tanks are respectively disposed outside print areas on both sides of the parent substrate. Is yellow,
Magenta, cyan, and black ink storage chambers are provided, and eight ink supply paths are formed. Four ink supply paths are connected to and communicate with the respective ink storage chambers of one of the ink tanks. The book is configured to be connected to and communicate with each of the ink storage chambers of the other ink tank.

In any case, the element head substrate is
For example, as described in claim 5, a heating adhesive film which is mounted on the parent substrate by COB and has an opening corresponding to the ink supply hole is interposed between the parent substrate and the element head substrate. The ink supply hole is formed so as to correspond to the entire area of the ink groove, for example.

[0034]

Embodiments of the present invention will be described below with reference to the drawings. FIGS. 1A, 1B, 1C, and 1D are diagrams illustrating a method of manufacturing an element head substrate according to an embodiment in the order of steps with one nozzle row for easy understanding. In each of the series of steps, a schematic plan view of an individual element head substrate formed on a silicon wafer chip substrate is schematically shown.
Although FIG. 4D shows 21 large ink ejection nozzles (orifices), in actuality, there are 128 or 2 orifices.
56 orifices are formed on a substrate having a size of about 10 × 15 mm. Then, such an element head substrate is divided by a scribe line on one silicon wafer, and a large number (for example, 90 or more) is formed.
It has been formed.

FIG. 2A is a schematic enlarged view of FIG. 1B shown in the upper part, a sectional view taken along line FF 'of the upper part shown in the middle part, and an upper part GG shown in the lower part. 'A sectional arrow view is shown.
FIG. 2 (b) shows a step that follows the step of FIG. 2 (a).
The portions shown in the upper, middle, and lower stages correspond to the portions shown in the upper, middle, and lower portions of FIG. FIG. 2C schematically shows the upper part of FIG. 1D in an enlarged scale. The parts shown in the upper, middle, and lower sections correspond to the upper, middle, and lower sections in FIG. 2A. In FIGS. 2A, 2B and 2C, 128 or 256 orifices are represented by five orifices for the sake of convenience in illustration. Hereinafter, a method of manufacturing each element head substrate will be described with reference to FIGS. 1 (a) to 1 (d) and FIGS. 2 (a), 2 (b) and 2 (c). First, a basic manufacturing method will be described.

In step 1, on a silicon wafer of 4 inches or more, a drive circuit having electrode wiring and its terminals are formed by LSI forming processing for each element head substrate, and a passivation film having a thickness of 1 to 2 μm is formed. Thereafter, a contact hole is formed and an unnecessary portion of the passivation film is removed.

FIG. 1A shows a state immediately after the above step 1 is completed. That is, a drive circuit 32 and a drive circuit terminal 33 are formed on a silicon substrate 31, and an oxide film (passivation film) 34 is formed although it cannot be clearly seen in FIG.

Next, in step 2, a resistive film for forming a heating element made of Ta—Si—O or the like is formed to a thickness of 4000 ° by sputtering or the like using a thin film forming technique, and the common electrode and the individual wiring are formed. An electrode film for forming an electrode is formed. This electrode film is made of W-Al (or W-Ti, W
It is preferable to form a multilayer structure in which an electrode film made of Au is laminated on a barrier metal film made of -Si) or the like.

Then, a pattern of a wiring portion is formed on the electrode film and the barrier metal film by photolithography, and a pattern of a minute heating portion (heating element) which becomes a substantially square exposed portion is formed on the resistance film. In this step, the position of the heating element is determined.

FIG. 1 (b) shows a state after the formation of the electrode film in the above step 2, and FIG. 2 (a) shows a state immediately after the above step 2 is completed. That is, on the silicon substrate 31, a common electrode 35 (35a, 35b), a common electrode power supply terminal 36 (see FIG. 1B), individual wiring electrodes 37, and a large number of heat generating portions 38 are formed.

Subsequently, in step 3, the individual heat generating portions 38
A partition member made of an organic material such as photosensitive polyimide is formed to a height of about 20 μm by coating to form an ink path corresponding to
0 to 60 minutes, 2 hours in some cases, 300 ° C to 400
Curing (dry curing, baking) by applying heat of ° C. is performed, and a barrier made of the photosensitive polyimide having a height of 10 μm after curing is formed and fixed on a silicon substrate.

Further, in step 4, an ink groove is formed on the surface of the silicon substrate by wet etching or sand blasting, and an ink supply hole communicating with the ink groove and opening on the lower surface is formed.

FIG. 2B shows a state immediately after the above Steps 3 and 4 are completed. That is, the ink groove 3
9 and an ink supply hole 40 are formed, a common electrode 35 (35b) portion located on the left side of the ink groove 39, a portion where the right individual wiring electrode 37 is provided, and
Partition walls 41 (41, 41-1, 41-2) are formed between the eight. If the partition 41 has a portion 41-1 on the individual wiring electrode 37 as a comb body, a portion 41-2 extending between the heat generating portions 38 has a shape corresponding to the teeth of the comb.
As a result, the fine ink paths where the heat generating portions 38 are located at the roots between the teeth are formed by the number of the heat generating portions 38 with the teeth of the comb as partition walls. By changing the length of the teeth of the comb, the conductance of the flowing ink changes, and the interference between the ink flowing in adjacent ink paths is also affected.

Thereafter, in step 5, an orifice plate of a film of polyimide having a thickness of 10 to 30 μm is coated on one side with a very thin thermoplastic polyimide as an adhesive, for example, to a thickness of 2 to 5 μm. The ink path formed by the partition wall 41-2 is covered with the uppermost layer of the stacked structure, thereby forming a fine pit-shaped ink path. Then, pressure is applied while heating at 200 to 300 ° C. to fix the orifice plate. Subsequently, the thickness of a mask such as Ni, Cu, or Al having a thickness of 0.
A metal film of about 5 to 1 μm is formed.

FIG. 1C shows a state immediately after the above step 5 is completed. That is, in the upper layer of the substrate 31,
An orifice plate 43 coated with a thermoplastic polyimide 42 on one side (the opposite side in FIG. 1 (c)) is laminated so as to cover the entire area, and a metal film is formed on its upper surface (the front side in FIG. 1 (c)). 44 are formed.

Further, as a step 6, the metal film on the orifice plate is patterned to form a mask for selectively etching the polyimide, and then the orifice plate is subjected to the above-mentioned etching by a helicone wave etching apparatus or the like. According to the metal film mask, holes of 40 μm to 20 μm φ are formed to form a large number of nozzle holes (orifices) at a time, and contact holes corresponding to the print head side terminals such as a drive circuit terminal and a common electrode power supply terminal 36 are also formed at a time. I do.

FIGS. 1D and 2C show a state immediately after the above-mentioned step 6 is completed. That is, the orifice plate 43 covering the entire area of the element head substrate 31
The above-described ink path is covered at the top, and the thickness of the
A pit-shaped ink path 45 having a height corresponding to μm is formed,
An ink flow path 46 that connects the ink path 45 and the ink groove 39 is formed.

The orifice plate 43 has a heating section 38.
A nozzle hole (orifice) 47 for discharging ink is formed by etching at a portion corresponding to the element head substrate 48, whereby an element head substrate 48 having one row of nozzle holes 47 is formed.
Is completed on a silicon wafer.

In this way, after the orifice plate 43 is attached, the nozzle hole (orifice) is processed in accordance with the pattern of the base, that is, the position of the heat generating portion 38.
This is a practical method with much higher productivity than bonding an orifice plate in which an orifice has been processed in advance.
In the case of dry etching, the mask is Ni,
By using a metal film such as Cu or Al, a selectivity between the resin and the metal film of about 100 can be obtained. Therefore, 2
1 for etching 40 to 40 μm polyimide film
It is sufficient to form the mask with a metal film of μm or less.

The processing up to this point is performed in a wafer state.
Finally, as a step 7, cutting is performed by using a dicing saw or the like, and each unit is individually divided, die-bonded to a parent substrate described later, and terminals are connected.

The element head substrate 48 having the above-described one row of nozzle holes 47 has a structure of a monochrome ink jet head. Normally, in full color printing, the three primary colors of subtractive color mixing are yellow (Y) and magenta (M). ), Cyan (C), and black (Bk) dedicated to black portions of characters and images, and a total of four colors of ink are required. Therefore, at least four nozzle rows are required. According to the above-described manufacturing method, the element head substrate having four nozzle rows can be monolithically formed, and the positional relationship between the rows can be accurately arranged by today's semiconductor manufacturing technology. is there.

FIG. 3A is a diagram showing a state in which the element head substrate formed so as to have four nozzle rows as described above is arranged on the parent substrate, and FIG. It is the elements on larger scale. The element head substrate 50 shown in FIGS.
4 nozzle rows 51 are provided, and each nozzle row 51
For example, 288 nozzles 47 shown in FIGS. 1A and 2C are formed at intervals of 600 dpi.

The size of the element head substrate 50 is about 15
mm × 12 mm, and a drive circuit is built in by the above-described manufacturing method. Then, drive circuit terminals 52 are arranged at both ends of the element head substrate 50. However, the drive circuit terminals 52 of the element head substrate 50 may be formed only at one end of the substrate.

Four nozzle rows 5 of each element head substrate 50
1, in this example, the upper nozzle row is black (Bk) ink, the second nozzle row is yellow (Y) ink,
The third row of nozzles is configured to discharge magenta ink, and the fourth row of nozzles is configured to discharge cyan ink.

In this example, a so-called zigzag arrangement of twenty element head substrates 50 in two rows constitutes a multi-array type multi-color nozzle row print head 55. That is, 10
A row 54-1 and a row 54-2 are formed as a set, and in each row, the element head substrates 50 are arranged at an equal interval in a stepping stone shape, and two rows (54-1, 54-2) of those rows are arranged. Each of the element head substrates 50 alternately forms a checkerboard pattern, and
3 to form a multi-array type multi-color nozzle array print head 55 as a whole.

The multi-array type multi-color nozzle array print head 55 has a longitudinal direction corresponding to the width of A4 size paper, and is fixed to a frame of the printer body. In particular, only the paper (not shown) is transported in the sub-scanning direction indicated by the arrow H in the figure, and an image or the like is printed (printed) by the print head 55.

The step-like interval J between the one row of element head substrates 50 is the “length of one row of nozzle rows” + “nozzle pitch” of the element head substrates 50. And column 54-1
Is set to an integral multiple of the nozzle pitch. Thereby, the nozzle rows corresponding to each other in the row 54-1 and the row 54-2 (for example, the nozzle row Bk of the element head substrate 50n + 1 and the nozzle row Bk of the element head substrate 50n + 2).
Are continuously formed at a correct interval in the width direction on the paper surface.

In other words, the printing information of the non-printable, ie, non-printable, portion of the space J between the element head substrate 50n and the element head substrate 50n + 2 in the column 54-1 is stored in the memory of the printer. Printing is performed at the same timing on the element head substrate 50n + 1 in the row 54-2, and the whole is printed.

FIG. 4A is a diagram showing the configuration of an ink supply path on the parent substrate side for supplying ink to the element head substrate 50 arranged on the parent substrate 53 as described above, and FIG. FIG. 2 is an enlarged cross-sectional view taken along the line MM ′ in FIG. Also,
(c) shows the element head substrate 50 again, and FIG.
FIG. 3 is an enlarged view of the section taken along the line NN ′. FIG. 6A shows the parent board 53 before the element head substrate 50 is disposed, and the position where the element head substrate 50 is to be disposed is indicated by a broken line 50 ′.
Indicated by.

As shown in FIG. 6A, the parent substrate 53 has
Ink tanks 56 (56-1, 56-2) are provided at both ends of the print area where the element head substrate 50 is provided. Each of the ink tanks 56 has four ink storage chambers for yellow, magenta, cyan, and black.
The eight ink supply paths 57 communicating with these are provided with the parent substrate 53.
Is formed on.

Four of the eight ink supply paths 57 are connected to and communicate with the respective ink storage chambers of one of the ink tanks 56-1.
Reference numeral 7 is connected to and connected to each ink storage chamber of the other ink tank 56-2. Then, the column 54-1 shown in FIG.
Element head substrate 50 is connected to one of the ink tanks 56-1.
Are arranged on the four ink supply paths 57 extending from the ink tank 56, and the element head substrates 50 in the row 54-2 are arranged on the four ink supply paths 57 extending from the other ink tank 56-2.

As shown in FIG. 4C, the element head substrate 50 has four nozzle rows 51 corresponding to yellow, magenta, cyan, and black discharge inks, and is arranged in parallel with these nozzle rows. The ink grooves 39 shown in FIGS. 2 (b) and 2 (c), which are shown by two-dot chain lines in a perspective view, are formed, and open to the back surface of the substrate in communication therewith. Are provided (three in the example shown in the figure) for uniform ink supply to the ink grooves 39.

FIG. 5A is a cross-sectional view showing the state of the joint between the parent substrate 53 and the element head substrate 50.
(b), (c), and (d) are exploded views thereof, and (e) is a perspective view showing the back surface of the element head substrate 50. Figures (b) and (e)
As shown in FIG.
A ring-shaped dipping-proof groove 58 is formed around the back opening.

Then, the parent substrate 53 and the element head substrate 50
A heat-reactive adhesive film, for example, an epoxy-modified resin film 59 having a thickness of about 30 μm, both surfaces of which are protected by release paper, is used for bonding. The epoxy-modified resin film 59 has a portion corresponding to the ink supply hole 40,
A circular connection hole 61 for supplying ink by press punching is formed in advance. The diameter of this connection hole 61 is
8 is formed larger than the outer diameter.

First, the release paper on one side of the epoxy-modified resin film 59 which is a die bond tape material having the connection hole 61 is peeled off and removed, and the exposed surface is temporarily bonded to a predetermined position of the parent substrate 53. Next, the release paper on the upper surface is peeled off and removed, and the element head substrate 50 is positioned thereon and temporarily bonded. Thus, the ink supply hole 40 of the element head substrate 50 and the ink supply path 57 of the parent substrate 53 communicate with each other through the connection hole 61 of the epoxy-modified resin film 59.

After all the element head substrates 50 are sequentially bonded, the whole is fixed to a jig, and placed in a heating furnace at 100 ° C. to 150 ° C. for several hours to apply an epoxy-modified resin film 59 as a heat-reactive adhesive. It is thermoset to complete the joint.

At this time, the epoxy-modified resin film 59 softened by heating is extruded by the bonding pressure to narrow the inner periphery of the connection hole 61 and to try to enter the ink supply hole 40. However, the connection hole 61 is formed sufficiently large. In addition, since a ring-shaped immersion groove 58 is formed around the joint (opening) of the ink supply hole 40, the extruded softening adhesive is blocked by the immersion groove 58. The ink does not enter the ink supply hole 40. In addition, as the heating adhesive film, a film having a low viscosity at the time of heating and a high rigidity is preferable.

Thereafter, the Al pads of the element head substrate 50 and the wiring pads on the parent substrate 53 are wire-bonded with Au or Al wires, and the wire portions are further sealed with a sealing resin to complete the whole. Since the bonding is performed by the epoxy-modified resin film 59, the sealing with the outside is complete, and there is no possibility that the sealing resin by resin sealing permeates into the ink supply holes and the like. As a result, COB mounting of a top shooting type inkjet print head, which has not been practically used in the past, can be easily realized.

When the element head substrate 50 is joined to the parent substrate 53, the element head substrate 50 is not disposed as shown in FIG.
A portion of the epoxy-modified resin film 59 where the connection hole 61 for ink supply is not punched is attached to an exposed portion of the ink supply path 57 corresponding to the section J shown in FIG. At the same time, the exposed portion of the ink supply path 57 can be closed.
Of course, a thin plate prepared separately may be attached and closed.

In the above embodiment, the example in which the ink supply hole 40 is formed as a round hole has been described, but the shape of the ink supply hole is not limited to this. FIGS. 6A and 6B are diagrams showing two examples of the configuration of the ink supply holes of the element head substrate.
In the example shown in FIG. 6A, three rectangular ink supply holes 62 are formed in one ink groove 39 of the element head substrate 50. Although not shown, a large rectangular ink supply connection hole is also formed in the heating adhesive film 59 so as to correspond to the ink supply holes 62. Therefore, through the three ink supply holes 62 and the ink supply connection holes, the ink grooves 39 of the element head substrate 50-1 are connected to the ink supply paths 57 of the parent substrate 53 described above.
And the ink is communicated via a wider flow path, so that the ink supply from the ink tank 56 is performed smoothly and at a high speed.

When the silicon chip of the element head substrate has a sufficient thickness, it communicates over substantially the entire surface of the ink groove 39, as shown in FIG. The ink supply hole 64 without the reinforcing portion 63 may be formed.
In this case, the supply of ink from the ink tank 56 is performed more smoothly and at a higher speed. In any of the above cases, it is preferable to provide an immersion-proof groove along these shapes around the ink supply holes 62 or 64.

In the above-described embodiment, two rows of element head substrates are staggered in two rows. However, the layout of the element head substrates with respect to the parent board is not limited to this, as shown in FIG. The ink supply paths formed in the parent substrate are four in this case. Also in this case, two ink tanks may be provided at both ends. In this case, each ink tank may supply ink to four ink supply paths jointly, or two ink tanks may share the ink.

Further, the immersion prevention groove may be provided not only on the element head substrate side but also on the parent substrate side along the ink supply path.

[0074]

As described above in detail, according to the present invention, a plurality of element head substrates each having a plurality of discharge nozzle rows are arranged on a parent substrate, and the discharge nozzle rows are arranged on the parent substrate. Since the ink supply paths are formed in parallel with each other, the ink supply paths of the multi-array type multi-color nozzle head can be easily configured, and ink can be supplied smoothly to the plurality of nozzle rows of the plurality of element head substrates. It becomes possible. If the element head substrates are arranged in a staggered pattern, it is easy to align the nozzles between the element head substrates, and COB mounting of the element head substrate on the parent substrate enables high-speed printing with excellent ink flow reliability. A multi-type inkjet printer can be manufactured with good mass productivity.

[Brief description of the drawings]

FIGS. 1 (a), (b), (c), and (d) are diagrams illustrating a method of manufacturing an element head substrate according to an embodiment in the order of steps with one nozzle row.

2 (a) is an enlarged view of FIG. 1 (b) in the upper section, an upper section is a sectional view taken along line FF ′ of the upper section, a lower section is a sectional view taken along line GG ′ of the upper section, and FIG. Figure showing the process following a), and (c) shows the top of FIG.
(d) is an enlarged view, and the middle and lower sections are views corresponding to (a) and (b).

3A is a diagram showing a state in which an element head substrate is disposed on a parent substrate, and FIG. 3B is a partially enlarged view thereof.

4A is a diagram showing a configuration of an ink supply path on a parent substrate side for supplying ink to an element head substrate, and FIG.
FIG. 3 is an enlarged view of an M ′ cross-sectional view, FIG. 3C is a view showing the element head substrate again, and FIG.

5 (a) is a cross-sectional view showing a state of a joint between a parent substrate and an element head substrate, (b), (c), and (d) are exploded views thereof, and (e) is a back surface of the element head substrate. FIG.

FIGS. 6A and 6B are diagrams illustrating two examples of the configuration of an ink supply hole of an element head substrate.

FIG. 7 is a perspective view schematically showing a configuration of a conventional serial ink jet printer.

8 (a), (b), and (c) are diagrams showing a schematic manufacturing method and configuration of a conventional print head.

9A is a diagram illustrating a state of a connection portion when a conventional print head that is long in the main scanning direction is formed, and FIG. 9B is a diagram illustrating an ink ejection direction at the connection portion.

[Explanation of symbols]

 Reference Signs List 1 small serial printer 2 carriage 3 print head 4 ink cartridge 4b ink chamber 5 guide rail 6 toothed drive belt 7 flexible communication cable 8 frame of apparatus body 9 platen 10 paper 11 paper feed roller pair 12 paper discharge roller pair 13 motor 14 silicon Wafer 15 Nozzle row 16 Nozzle 17 Chip substrate 18 Drive circuit 19 Resistance heating section 20 Paper 21 Individual wiring electrode 22 Grounding terminal 23 Common electrode 24 Partition wall 25 Ink groove 26 Ink supply hole 27 Orifice plate 28 Thermoplastic adhesive 29 Ink passage 31 Silicon substrate 32 Drive circuit 33 Drive circuit terminal 34 Oxide film (passivation film) 35 (35a, 35b) Common electrode 36 Common electrode power supply terminal 37 Individual wiring electrode 38 Heating portion 39 Ink groove 40 Ink supply hole 4 (41, 41-1, 41-2) Partition wall 42 Thermoplastic polyimide 43 Orifice plate 44 Metal film 45 Ink path 46 Ink flow path 47 Nozzle hole (orifice, discharge nozzle) 48, 50 Element head substrate 51 Nozzle row 52 Drive circuit Terminal 53 Parent board 55 Multi-array type multi-color nozzle array print head 56 (56-1, 56-2) Ink tank 57 Ink supply path 58 Impermeable groove 59 Epoxy-modified resin film 61 Ink supply connection hole 62, 64 Rectangular Ink supply hole 63 Reinforcing part

 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Minoru Kumagai 3-10-6 Imai, Ome-shi, Tokyo Casio Computer Co., Ltd. Ome Works F-term (reference) 2C057 AF01 AF91 AF93 AG14 AG16 AG92 AG93 AP02 AP13 AP22 AP33 AP77 AQ02 BA03 BA13

Claims (6)

[Claims] 1. A multi-array type multi-color nozzle array print head in which a plurality of element head substrates each having discharge nozzles arranged in a plurality of columns are arranged on a parent substrate, wherein a print area of the parent substrate is outside. An ink tank arranged in correspondence with the plurality of rows of ejection nozzles; and an ink tank formed on the parent substrate in parallel along the nozzle row direction, the ink supplied from the ink tank corresponding to the element head substrate. And a plurality of ink supply paths for supplying, via ink supply holes, to ink grooves communicating with the nozzle rows. 2. A multi-array type multi-color nozzle array print head according to claim 1, wherein said element head substrates are arranged continuously on said parent substrate in series. 3. A multi-array type multi-color nozzle array print head according to claim 1, wherein said element head substrates are arranged on said parent substrate in a staggered arrangement. 4. The element head substrate includes four nozzle rows corresponding to yellow, magenta, cyan, and black discharge inks, and the ink tanks are respectively disposed outside print areas on both sides of the parent substrate. Each of the ink tanks includes four ink storage chambers of yellow, magenta, cyan, and black, and eight ink supply paths are formed, and four ink supply paths are provided in each of the ink storage chambers of one of the ink tanks. 4. A multi-array type multi-color nozzle row print head according to claim 3, wherein the other four ink tanks are connected and communicate with each other, and the other four ink tanks are connected and communicate with each other. 5. The element head substrate includes:
2. The multi-array type multi-layered multi-layered multi-layered multi-layered film according to claim 1, wherein a heating adhesive film having an opening corresponding to the ink supply hole is interposed between the parent substrate and the element head substrate. Color nozzle array print head. 6. The ink supply hole according to claim 1, wherein the ink supply hole is formed so as to correspond to the entire area of the ink groove.
The multi-array type multi-color nozzle row print head according to 2, 3, 4, or 5.