JP2001339169A - Multilayer wiring board - Google Patents

Abstract

(57) Abstract: An electronic circuit board or package for mounting a high-speed electronic component such as a semiconductor element on a multi-layer wiring board having a group of parallel wirings arranged orthogonally, which reduces switching noise of the semiconductor element and the like. The present invention provides a multilayer wiring board suitable for, for example, the following. SOLUTION: A second insulating layer I2 having a second parallel wiring group L2 orthogonal to the first parallel wiring group L1 is stacked on a first insulating layer I1 having a first parallel wiring group L1. , The first and second parallel wiring groups L1 and L2 are electrically connected by the through conductor group T.
And second parallel wiring groups L1 and L2 have power supply wirings P1 and P2 and ground wirings G1 and G2, respectively, and have their wiring widths increased at positions where power supply wirings P1 and P2 intersect with ground wirings G1 and G2. This is a multilayer wiring board provided with opposing portions PP and GP. Necessary capacitance components can be secured by the facing portions PP and GP, and simultaneous switching noise can be reduced.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multilayer wiring board used for an electronic circuit board or the like, and more particularly to a wiring structure in a multilayer wiring board on which a semiconductor element operating at a high speed is mounted.

[0002]

2. Description of the Related Art Conventionally, in a multilayer wiring board on which a semiconductor element such as a semiconductor integrated circuit element is mounted and which is used for an electronic circuit board or the like, an insulating material made of ceramics such as alumina is used for forming a wiring conductor for internal wiring. Layers and wiring conductors made of a refractory metal such as tungsten (W) are alternately laminated to form a multilayer wiring board.

In a conventional multilayer wiring board, signal wirings of internal wiring wiring conductors usually have a strip wiring structure, and a so-called solid pattern is formed above and below wiring conductors formed as signal wirings via insulating layers. A ground (ground) layer or a power supply layer having a wide area of the shape was formed.

Further, with the increase in the speed of electric signals handled by the multilayer wiring board, a polyimide resin or an epoxy resin having a relatively small relative dielectric constant of 3.5 to 5 instead of an alumina ceramic having a relative dielectric constant of about 10 instead of an insulating layer. And a conductive layer for internal wiring made of copper (Cu) is formed on the insulating layer by using a thin film forming technique such as a vapor deposition method such as a vapor deposition method or a sputtering method. By forming a wiring conductor in a pattern and multiplying the insulating layer and the wiring conductor into layers, a multilayer wiring board having a high density, a high function and a high speed operation of a semiconductor element has been obtained.

On the other hand, the wiring structure of the internal wiring of the multilayer wiring board is designed to reduce ringing noise and reduce crosstalk between signal wirings by matching the impedance of the wirings, and to realize high-density wiring. A structure has been proposed in which a group of parallel wirings is formed on the upper surface of an insulating layer, and this is multi-layered to electrically connect predetermined wirings of the wiring group of each layer via through conductors such as via conductors and through-hole conductors. ing.

In a multilayer wiring board having such a parallel wiring group, an electronic component such as a semiconductor element mounted on the multilayer wiring board is electrically connected to a mounting board on which the multilayer wiring board is mounted. Then, an appropriate wiring is selected from each parallel wiring group in the multilayer wiring board, and the connection between the wirings between different wiring layers is performed via a through conductor such as a via conductor.

[0007] According to such a multilayer wiring board, the number of wiring layers can be reduced as compared with the case where the signal lines are constituted by strip lines, and the signal wirings within the parallel wiring groups and between the parallel wiring groups. The crosstalk between them can be reduced.

[0008]

However, in the conventional multilayer wiring board having a parallel wiring group, the power wiring in each of the parallel wiring groups is disposed between the upper and lower parallel wiring groups stacked perpendicular to each other. There is a problem in that the overlapping area between the wiring and the ground wiring at the position where they intersect is small, and a large capacitance cannot be formed between the power wiring and the ground wiring facing each other with the insulating layer interposed therebetween. Then, as a result of the inability to form a large capacitance between the power supply wiring and the ground wiring, electric charges supplied to a semiconductor element or the like which switches at high speed are supplied from outside the multilayer wiring substrate through thin wiring conductors of the power supply wiring and the ground wiring. As a result, noise may be generated by switching of the semiconductor element due to the inductance components of the power supply wiring and the ground wiring, which may cause malfunction of electronic components such as the mounted semiconductor element. There was a problem.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and has as its object to constitute a group of parallel wirings which are alternately stacked so as to be orthogonal to each other, thereby reducing crosstalk between wirings. Provided is a multilayer wiring board suitable for an electronic circuit board or the like on which an electronic component such as a semiconductor element that operates at a high speed can be reduced by a power supply wiring and a ground wiring so that noise generated by switching of a semiconductor element or the like can be reduced. It is in.

[0010]

According to the present invention, there is provided a multilayer wiring board comprising a second parallel wiring group orthogonal to the first parallel wiring group on a first insulating layer having the first parallel wiring group. A first insulating layer having a first insulating layer, a first insulating layer, a first insulating layer, and a second insulating layer. Each of the groups has a power supply wiring and a ground wiring, and an opposing portion having a large wiring width is provided at a position where the power supply wiring and the ground wiring intersect.

Further, in the multilayer wiring board according to the present invention, in the above structure, the size of the facing portion is larger than the wiring width of the power supply wiring and the ground wiring and smaller than the interval between the wirings adjacent on both sides. It is characterized by the following.

In the multilayer wiring board according to the present invention, in each of the above structures, the first and second parallel wiring groups each include a plurality of signal wirings and a power supply wiring or a ground wiring adjacent to each signal wiring. It is characterized by having.

According to the multilayer wiring board of the present invention, there is provided a multilayer wiring body in which the first and second parallel wiring groups are vertically arranged one above the other and stacked vertically and electrically connected by the through conductor group. Therefore, the crosstalk noise between the wirings of the parallel wiring groups can be reduced and minimized, and in the laminated wiring body, the wiring width is set at the position where the power wiring and the ground wiring intersect. The provision of the enlarged opposing section ensures a necessary and sufficient capacitance component between the power supply wiring and the ground wiring opposing each other with the insulating layer interposed, and is suitable for high-speed switching semiconductor devices. Since the electric charge stored in the facing part can be supplied, the electric current is not supplied through the long current path from the outside of the multilayer wiring board to the semiconductor element or the like, but through the short current path from the facing part to the semiconductor element or the like. It can be supplied, as a result, it is possible to greatly reduce the simultaneous switching noise associated with operation of the electronic components such as semiconductor devices.

Thus, according to the multilayer circuit board of the present invention, crosstalk noise between wirings can be reduced by a laminated wiring body in which parallel wiring groups are orthogonally arranged, and electronic components such as semiconductor elements and the like can be reduced. It can greatly reduce simultaneous switching noise associated with the operation of the device, and operate at high speed without causing noise, transmission loss of high frequency signals, and malfunction of electronic components such as mounted semiconductor elements. Electronic components such as semiconductor elements can be operated accurately and stably. Therefore, a multilayer wiring board suitable for an electronic circuit board on which electronic components operating at a high speed is mounted, various packages, and the like can be obtained.

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a multilayer wiring board according to the present invention will be described in detail based on an embodiment shown in the accompanying drawings.

FIG. 1 is an exploded plan view showing an example of an embodiment of a laminated wiring body according to the multilayer wiring board of the present invention. FIG. 1A shows a first insulating layer, and FIG. Are respectively shown in plan views. FIG. 2 is a cross-sectional view corresponding to the line AA ′ in FIG. 1 showing an example of an embodiment of the multilayer wiring board of the present invention having a laminated wiring body obtained by laminating them, and FIG. FIG. 4 is a sectional view corresponding to the line BB ′;
Is a cross-sectional view corresponding to the line CC ′.

In these figures, I1 to I3 are first to third insulating layers, respectively, and L1 and L2 are disposed substantially parallel to the upper surfaces of the first and second insulating layers I1 and I2, respectively. First and second parallel wiring groups, S1 and S
2 is a signal wiring in the first and second parallel wiring groups L1 and L2, respectively, and G1 and G2 are a first and a second wiring, respectively.
, P1 and P2 in the parallel wiring groups L1 and L2
Is a power supply wiring in each of the first and second parallel wiring groups L1 and L2, and T is a through conductor group that electrically connects the first parallel wiring group L1 and the second parallel wiring group L2 at a predetermined location. It is. These constitute a multilayer wiring body according to the multilayer wiring board of the present invention. In these figures, the signal wiring S1
The illustration of the through conductor group T for S2 is omitted.

The plurality of signal lines S1 and S2 arranged on the same plane may transmit different signals, respectively, and the plurality of power lines P1 and S1 arranged on the same plane may be used.
P2 may supply different powers.

In such a multilayer wiring board of the present invention, for example, an MPU (Micro Processing Unit) · A
SIC (Application Specific Integrated Circuit)
An electronic component such as a semiconductor device such as a DSP (Digital Signal Processor) is mounted. It is used as a package for storing electronic components such as a package for storing semiconductor devices, a substrate for mounting electronic components, a so-called multi-chip module or multi-chip package on which a large number of semiconductor integrated circuit devices are mounted, or a motherboard. These electronic components are mounted on the surface of the multilayer wiring board by, for example, so-called bump electrodes, or are attached to the mounting portion by an adhesive, a brazing material, or the like, and are connected to the mounting portion via a bonding wire or the like. It is electrically connected to the second parallel wiring group L2. A connection portion with an external electric circuit and a connection portion with an electronic component such as a semiconductor element to be mounted are not shown.

The through conductor group T here penetrates the insulating layer I2 and electrically connects the upper and lower wirings, or the wiring and external connection terminals formed on the surface of the semiconductor element or the multilayer wiring board. Usually, a through-hole conductor, a via conductor, or the like is used, and is formed at a location required for connection.

In the multilayer wiring body of the multilayer wiring board according to the present invention, the first parallel wiring group L1 including the signal wiring S1 and the ground wiring G1 is wired substantially parallel to the first direction, and is stacked thereon. Similarly, a second parallel wiring group L2 including a signal wiring S2 and a ground wiring G2 is connected to a second parallel wiring group L2 orthogonal to the first direction.
, And these wirings are electrically connected to each other by a through conductor group T penetrating through the second insulating layer I2 to form a laminated wiring body.

According to such a laminated wiring body, since the first parallel wiring group L1 and the second parallel wiring group L2 are laminated so as to be orthogonal to each other, the parallel wiring groups L1 · L
Crosstalk noise between the two wirings can be reduced to a minimum.

In the multilayer wiring body of the multilayer wiring board according to the present invention, the first and second parallel wiring groups L1 and L2
Position of the power line P1, P2 and the ground line G1, G2 with respect to the power line P1, P2 and the ground line G1, G2, that is, the position where the power line P1 intersects with the ground line G2, and the power line At the position where P2 and ground wiring G1 intersect, opposing portions PP and ground wiring G1 of power supply wirings P1 and P2 whose wiring widths are increased
A facing portion GP in G2 is provided, and the facing portion PP and GP face each other with the second insulating layer I2 interposed therebetween.

As described above, the opposing portion PP is formed at a portion where the power supply lines P1 and P2 and the ground lines G1 and G2 cross and oppose each other.
-By providing the GP, it is possible to secure a necessary and sufficient capacitance component between the facing portions PP and GP facing each other with the second insulating layer I2 interposed therebetween, and to provide a semiconductor element or the like that switches at high speed. Since charges accumulated between the levers PP and GP can be supplied through a short current path, simultaneous switching noise accompanying the operation of electronic components such as semiconductor elements mounted on the multilayer wiring board is significantly reduced. It is possible to do.

In order to provide such opposed parts PP and GP, when forming the power supply wirings P1 and P2 and the ground wirings G1 and G2 by a well-known wiring formation method, the wiring width at the intersection is increased by a predetermined length. Then, a so-called pad-shaped conductor may be formed.

The size of the power supply lines P1, P2
In the case where the signal wiring S1 is larger than the wiring width of the ground wirings G1 and G2 and is located between the wirings adjacent to both sides of the wiring where the opposed parts PP and GP are provided, for example, the signal wiring S1 is adjacent to both sides of the power supply wiring P1, If there is, the distance between the signal wirings S1 may be smaller than the distance between the signal wirings S1, and may be appropriately set according to the specifications such as the wiring width and the wiring interval of the multilayer wiring board and the size of the required capacitance component. . This allows
While securing a necessary and sufficient capacitance component between the power supply wirings P1 and P2 and the ground wirings G1 and G2, it is possible to prevent the multilayer wiring board from being unnecessarily large and to achieve high integration and high density. It will be able to respond.

In the example shown in FIG. 1 and FIG. 2, the first and second parallel wiring groups L1 and L2 constituting the laminated wiring body include power wirings P1 and P2 or ground wirings G1 and G2 for signal wirings S1 and S2. They are arranged adjacent to each other. Thereby, the signal lines S1 and S1 on the same insulating layers I1 and I2
The two can be electromagnetically cut off, and crosstalk noise between the left and right signal lines S1 and S2 on the same plane can be reduced favorably.

Further, the power lines P1 and P2 or the ground lines G1 and G2 are always adjacent to the signal lines S1 and S2, so that the power lines P1 and P2 and the signal line S1 on the same plane are formed.
S2, ground wirings G1 and G2, and signal wirings S1 and S2
And the inductance of the power supply lines P1 and P2 and the ground lines G1 and G2 can be reduced. Due to this reduction in inductance, power supply noise and ground noise can be effectively reduced.

This is because the first parallel wiring group L1
Similarly, when orthogonally parallel wiring groups are used as wiring layers below or above the second parallel wiring group L2, these also apply.

In the multilayer wiring board of the present invention,
A multilayer wiring board can be formed by stacking multilayer wiring portions having various wiring structures above and below the multilayer wiring body. For example,
Similar to the multilayer wiring body, the wiring structure of the parallel wiring group stacked orthogonally, the wiring structure of the strip line structure, and the microstrip line structure, the coplanar line structure, etc., to the specifications required for the multilayer wiring board It can be appropriately selected and used depending on the situation.

Further, for example, an electronic circuit may be formed by laminating a polyimide insulating layer and a conductor layer formed by copper deposition. Further, a package for semiconductor element accommodation may be configured by attaching a chip resistor, a thin film resistor, a coil inductor, a cross capacitor, a chip capacitor, and an electrolytic capacitor.

The first and second insulating layers I1 and I2
Is not limited to a substantially square shape as shown, but may be a rectangular shape, a rhombic shape, a polygonal shape, or the like.

Note that the first and second parallel wiring groups L1.
L2 is not limited to those formed on the surfaces of the first and second insulating layers I1 and I2, and may be formed inside the respective insulating layers I1 and I2.

When the second parallel wiring group L2 is formed inside the second insulating layer I2 with respect to the example shown in FIG. 2, the second parallel wiring group L2 is not exposed on the surface. , The third insulating layer I3 is not always necessary.

In the multilayer wiring board of the present invention, each of the insulating layers including the first and second insulating layers I1 and I2 is formed, for example, by a ceramic green sheet laminating method. Sintered body, silicon carbide sintered body, silicon nitride sintered body, mullite sintered body,
Use an inorganic insulating material such as glass ceramics, or use an organic insulating material such as polyimide, epoxy resin, fluorine resin, polynorbornene, benzocyclobutene, or use an inorganic resin such as ceramic powder as an epoxy resin. It is formed using an electrical insulating material such as a composite insulating material formed by bonding with a thermosetting resin.

These insulating layers may be formed so as to form a desired multilayer wiring board by a method such as a green sheet laminating method or a build-up method according to the characteristics of each insulating layer. The thickness of these insulating layers is appropriately set according to the characteristics of the material used, and to satisfy conditions such as mechanical strength and electrical characteristics corresponding to required specifications and ease of forming a through conductor group. Is done.

The first and second parallel wiring groups L1 and L2 and the other wiring layers and the through conductor group T are made of metal powder metallized metal such as tungsten or molybdenum / molybdenum-manganese / copper / silver / silver-palladium. Alternatively, it is formed of a thin film of a metal material such as copper, silver, nickel, chromium, titanium, gold, niobium, or an alloy thereof.

These wiring conductors and through conductors are formed by forming a metal layer by a thick film printing method, for example, by a sputtering method, a vacuum evaporation method, or a plating method according to the characteristics of the respective materials and the method of forming the insulating layer. It is formed in a predetermined pattern shape and size by a lithography method, and is provided on each insulating layer.

The width of each wiring and the distance between the wirings of the first and second parallel wiring groups L1 and L2 are determined according to the characteristics of the material to be used. -It is set appropriately so as to satisfy conditions such as easiness of arrangement on I2.

The thickness of each of the parallel wiring groups L1 and L2 is 1
It is preferably about 20 μm. This thickness is 1 μm
If it is less than 1, the resistance of the wiring increases, and it tends to be difficult to provide a good power supply to the semiconductor element by the wiring group, secure a stable ground, and propagate a good signal.
On the other hand, if it exceeds 20 μm, the insulation layer laminated thereon may be insufficiently covered, resulting in poor insulation.

Each of the through conductors of the through conductor group T may have a cross section of a circular shape, or may have an elliptical shape, a rectangular shape such as a square or a rectangle, or another shape. The position and size are appropriately set according to the characteristics of the material to be used, so as to satisfy conditions such as electrical characteristics corresponding to required specifications and easiness of formation and arrangement on the insulating layer.

For example, when glass ceramic is used for the insulating layer and a conductor material mainly containing copper (Cu) is used for the parallel wiring group, the thickness of the insulating layer is set to 100 μm, and the line width of the wiring is set to 100 μm. By setting the distance between the wirings to 100 μm and the diameter of the through conductor to 100 μm, the impedance of the signal wiring is set to 50Ω, and the upper and lower parallel wiring groups can be electrically connected while suppressing reflection of high-frequency signals.

It should be noted that the present invention is not limited to the above-described embodiments, and that various changes can be made without departing from the scope of the present invention.

For example, a plurality of insulating layers and wiring layers are sequentially laminated, and a plurality of grounding or power supply conductor layers and the semiconductor element are formed below a mounting area of the semiconductor element provided at the center of the upper surface. A plurality of line wiring layers composed of a plurality of line conductors electrically connected to each other via one through conductor group;
Around each of the signal wiring development sections, each divided area formed in the same plane as the line wiring layer and divided into two to four straight lines having intersections in the mounting area so that the central angles are substantially equal. And a first wiring layer formed of a group of parallel wirings directed toward the intersection and a parallel wiring formed in the same plane as the ground or power supply conductor layer and orthogonal to the first wiring layer in each of the divided regions. A parallel wiring portion formed by electrically connecting a second wiring layer formed of a group with a second through conductor group, wherein the semiconductor element is connected to the first wiring layer via the line wiring layer. A multilayer wiring board electrically connected to the first and second parallel wiring groups in the parallel wiring portion, each of which has a power wiring and a ground wiring, and a position where the power wiring and the ground wiring cross each other. To its wiring width The greater the opposing portions may have a multilayer wiring board provided. With this configuration, in addition to the above-described functions and effects, the mounted semiconductor element is electrically connected to the first wiring layer of the parallel wiring unit via the line wiring layer of the signal wiring development unit. Therefore, the wiring connected to the input / output electrodes of the semiconductor element arranged at a very narrow pitch and extremely high density has an increased wiring pitch (interval) between the line conductors in the signal wiring development section, The wiring and ground wiring can be rearranged, developed into wide-pitch wiring suitable for the parallel wiring part, and rearranged and connected, so that high-density wiring can be achieved while taking advantage of the excellent electrical characteristics of the parallel wiring group. Electrical connection can be efficiently performed with the semiconductor element having the input and output electrodes. Moreover, by providing a plurality of line wiring layers by the signal wiring development section, the signal wiring, power supply wiring, and ground wiring from the semiconductor element can be efficiently rearranged and connected to the surrounding parallel wiring section. Since it is possible to set the optimum wiring and develop it in parallel wiring parts, it is possible to optimize the wiring design and reduce the number of laminations even when aiming for multi-layering corresponding to high density of semiconductor elements. It becomes possible.

In the above embodiments, the present invention has been described as a multilayer wiring board on which a semiconductor element is mounted. However, the present invention may be applied to a semiconductor element housing package for housing a semiconductor element or a multi-chip module. Good. Further, as the insulating layer, a sintered body of aluminum nitride or silicon carbide based on heat dissipation or a sintered body of glass ceramic based on low dielectric constant may be used.

[0046]

According to the multilayer wiring board of the present invention, there is provided a multilayer wiring body in which the first and second parallel wiring groups are vertically arranged one above the other and stacked vertically and electrically connected by the through conductor group. Since the opposed portion having the increased wiring width is provided at the position where the power supply wiring and the ground wiring intersect, the crosstalk noise between the wirings of the respective parallel wiring groups can be reduced and minimized, A sufficient and sufficient capacitance component can be secured between the power supply wiring and the ground wiring opposed to each other with the insulating layer interposed therebetween, and the current path for supplying electric charges to electronic components such as semiconductor elements is shortened. Simultaneous switching noise accompanying the operation can be greatly reduced.

As described above, according to the present invention, there is provided a wiring structure which is constituted by a group of parallel wirings stacked perpendicularly to each other and capable of reducing crosstalk noise between wirings, and furthermore, its electric characteristics are deteriorated. Provided is a multilayer wiring board suitable for an electronic circuit board or the like on which an electronic component such as a semiconductor element or the like that operates at a high speed can reduce noise generated by switching of a semiconductor element or the like by a power supply wiring and a ground wiring without using a power supply wiring and a ground wiring. We were able to.

[Brief description of the drawings]

FIGS. 1A and 1B are plan views of a first insulating layer and a second insulating layer, respectively, showing an example of an embodiment of a multilayer wiring body according to the multilayer wiring board of the present invention.

FIG. 2 is a cross-sectional view corresponding to the line AA ′ in FIG. 1, showing an example of an embodiment of the multilayer wiring board of the present invention including the multilayer wiring body shown in FIG.

FIG. 3 is a cross-sectional view corresponding to the line BB ′ of FIG. 1, showing an example of the embodiment of the multilayer wiring board of the present invention including the multilayer wiring body shown in FIG.

FIG. 4 is a cross-sectional view corresponding to the line CC ′ in FIG. 1, illustrating an example of the embodiment of the multilayer wiring board of the present invention including the multilayer wiring body illustrated in FIG.

[Explanation of symbols]

 I1, I2 ... Insulating layer L1, L2 ... Parallel wiring group P1, P2 ... Power supply wiring G1, G2 ... Ground wiring S1, S2 ... Signal wiring T ... ..... Through conductor group PP, GP ..... Opposing part

Claims (3)

[Claims] 1. A second insulating layer having a second parallel wiring group orthogonal to the first parallel wiring group is laminated on a first insulating layer having a first parallel wiring group. 1st and 2nd
And a first and second parallel wiring group respectively having a power supply wiring and a ground wiring, and a power supply wiring and a ground wiring. A multilayer wiring board, wherein an opposing portion having a larger wiring width is provided at a position where the wiring crosses a ground wiring. 2. The multilayer wiring board according to claim 1, wherein the size of the facing portion is larger than the width of the power supply wiring and the ground wiring, and smaller than the distance between wirings adjacent on both sides. . 3. The first and second parallel wiring groups each have a plurality of signal wirings and a power supply wiring or a ground wiring adjacent to each signal wiring.
Or the multilayer wiring board according to claim 2.