JP2001328039A - Substrate peeling device - Google Patents

Abstract

(57) [Problem] To provide a substrate peeling apparatus capable of reliably peeling a flexible thin plate-shaped substrate from an auxiliary jig without adversely affecting the substrate. SOLUTION: The substrate peeling device 1 includes an ionized compressed air 1
4 is squeezed out with an air knife 9 and the substrate 24 is peeled off by injecting it at a temporary bonding point between the substrate 24 and the auxiliary jig 25. Since the air is directly jetted toward the temporary bonding eyes, the peeling can be surely performed. In addition, since the substrate 24 is separated by air, there is no mechanical contact with the substrate 24, and it is possible to prevent the substrate 24 from being damaged. Further, since the air is ionized compressed air 14, the static electricity generated at the time of peeling is neutralized, so that it is possible to prevent the substrate 24 from being neutralized and adversely affect the thin-film electrodes and the like formed on the substrate 24.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flexible thin plate substrate used for a liquid crystal display element, for example, which is adhered to an auxiliary jig during a processing step, and is separated from the auxiliary jig after the processing. The present invention relates to a substrate peeling device used in the above.

[0002]

2. Description of the Related Art As an example in which a flexible thin plate-like substrate is used, a substrate of a liquid crystal display element can be considered. Originally, glass was generally used as a substrate of a liquid crystal display element. However, as liquid crystal display elements have become thinner and lighter, glass substrates have the characteristics of being thick, heavy, and fragile. Attempted.

[0003] However, the plastic substrate has a problem that it is deformed after a heating step such as a thin film formation because of its low heat resistance, and it is hard to withstand processing by itself due to lack of rigidity. there were.

[0004] In order to strengthen the substrate, a plan has been devised in which the substrate is mounted on an auxiliary jig and passed through a manufacturing process.

For example, in Japanese Patent Application No. 6-165332 filed by the present applicant, an auxiliary jig is used for manufacturing a liquid crystal display element comprising a thin glass or plastic substrate. The thin plate-shaped substrate is peeled off from the auxiliary jig after being passed through a processing step by being adhered thereon with an adhesive sheet.

[0006]

By the way, as a method of peeling the thin plate-like substrate stuck on this auxiliary jig,
For example, as shown in FIGS.
It is conceivable to apply a method used when peeling a film-like protective sheet (laminate or the like) 34 provided on the surface of the film. In this method, the adhesive sheet 35 is attached to a corner of the protective sheet 34, and the protective sheet 34 is peeled off from the substrate 36 by pulling up the adhesive tape 35.

However, such a method is suitable for a material having a very low sticking force, but peels a material stuck on a jig with a sticking force enough to withstand the above-mentioned processing step. The peeling force is too small.

Further, when the substrate to be separated from the auxiliary jig is a substrate of a liquid crystal display element in particular, it is sufficient to simply apply the separation force and simply separate from the jig. Absent. That is, in the case of a substrate for a liquid crystal display element, etc., the thin film formed on the upper surface of the substrate is not destroyed, the lower surface of the substrate, which is an adhesive surface with the auxiliary jig, is not damaged, Must be reliably separated from the auxiliary jig without being charged.

The present invention has been made in view of the above points, and when peeling a flexible thin substrate from an auxiliary jig, the substrate can be reliably peeled without adversely affecting the substrate. It is intended to provide a substrate peeling device.

[0010]

In order to solve the above-mentioned problems, a substrate peeling apparatus according to the present invention provides a flexible thin plate-like substrate which has been pasted on an adhesive sheet of an auxiliary jig and has undergone a processing step. A substrate peeling device for peeling from a sheet, a push-up mechanism for pushing up a protruding portion of a flexible thin substrate from below, a sucking mechanism for sucking up and holding a portion of the flexible thin substrate pushed up by the push-up mechanism, and A peeling force applying unit that is disposed between the flexible thin plate substrate held by the mechanism and the pressure-sensitive adhesive sheet, and that applies a peeling force to peel the flexible thin plate-like substrate from the pressure-sensitive adhesive sheet; Moving means for moving the pressure-sensitive adhesive sheet and the flexible thin plate-shaped substrate along the attachment surface, and the moving means is separated from the pressure-sensitive adhesive sheet. Is characterized by having a substrate mounting member for mounting the flexible sheet-like substrate.

According to this configuration, the peeling force applying means for applying a peeling force for peeling the flexible thin plate substrate from the auxiliary jig between the auxiliary jig and the flexible thin plate substrate, that is, on the bonding surface, is provided. The peeling force applying means moves in the peeling direction along the application surface. Thereby, the peeling force is directly and continuously applied to the bonding portion between the auxiliary jig and the flexible thin plate-shaped substrate.

Further, the substrate peeling device of the present invention may be provided with a static eliminator for removing the electric charges carried by the flexible thin plate substrate when peeling the flexible thin substrate from the pressure-sensitive adhesive sheet. According to this configuration, the static eliminator is provided for removing the electric charges that are taken when the flexible thin plate-like substrate is peeled from the auxiliary jig. Thereby, the flexible thin plate-shaped substrate is neutralized.

Further, as the charge removing means, an ion neutralizing means for blowing ionized air onto the flexible thin plate-like substrate may be used. According to this configuration, the ionized air is supplied to the flexible thin plate-shaped substrate. As a result, the charged flexible thin plate-shaped substrate is supplied with air having a charge of the opposite polarity to the air and neutralized.

Further, as the peeling force applying means, a fluid ejecting means for applying a peeling force by ejecting a pressure fluid may be used. According to this configuration, since the peeling force is due to the pressure of ejecting the pressure fluid, the peeling is performed in a state of being in mechanically non-contact with the flexible thin plate-shaped substrate.

Further, an air knife may be used as the fluid ejecting means. According to this configuration, compressed air is used as the pressure fluid.

Further, the air knife is set so as to blow compressed air toward a temporary bonding line between the flexible thin plate-shaped substrate and the adhesive sheet, and the compressed air injected from the air knife is used for the temporary bonding. It is preferable that the blow-back generated at the joint is set so as to blow through between the flexible thin plate-shaped substrate and the substrate mounting member.

[0017] Thus, the blow-back of the compressed air injected from the air knife blows through between the flexible thin plate-shaped substrate and the substrate mounting member, and the separated portion of the flexible thin plate-shaped substrate is raised. Moreover, the flexible thin plate-shaped substrate after peeling is mounted on the substrate mounting member.

The air knife may be one that blows ionized air onto the flexible thin plate-shaped substrate. According to this configuration, ionized air is injected from the air knife. Thus, the air that separates the flexible thin plate-like substrate from the auxiliary jig also simultaneously performs charge elimination.

It is also preferable that the substrate mounting member has a plurality of holes near the edge of the substrate mounting surface on the side for receiving the substrate. According to this configuration, a plurality of holes are provided on the substrate mounting surface of the substrate mounting member. As a result, a part of the blown-back air of the compressed air generated between the flexible thin plate-shaped substrate and the substrate mounting member passes through the hole of the substrate mounting surface from the upper side of the substrate mounting member to the lower side of the substrate mounting member. Escape and reduce the wind speed.

Further, as the peeling force applying means, a single-edge wedge for applying a blade to the temporary bonding between the flexible thin plate substrate and the adhesive sheet may be used. Further, as the peeling force applying means, a rotating roller that rolls up the flexible thin substrate from the pressure-sensitive adhesive sheet and peels it off may be used. Thus, the flexible thin plate-like substrate can be reliably separated from the auxiliary jig.

[0021]

[Embodiment 1] An embodiment of the present invention will be described below with reference to FIGS.

As shown in FIG. 1, a substrate peeling apparatus 1 according to the present embodiment includes an apparatus main body 2 and an apparatus 1 mounted on the apparatus main body 2.
And an axis robot 3.

A peeling apparatus bed 4 is provided at the upper end of the apparatus main body 2, and a suction table 5 for mounting a target workpiece is provided at the center thereof. The suction table 5 is connected to a suction table convertor 6 installed inside the apparatus main body 2, and sucks and fixes a target work placed on the suction table 5.

In the vicinity of the substrate peeling start position of the suction table 5, a push-up mechanism 7 is provided. The push-up mechanism 7 moves upward in a diagonal direction and temporarily pushes up a portion of the target work placed on the suction table 5 that protrudes toward the push-up mechanism 7 from below.

A moving mechanism 8 is provided in the vicinity of the substrate peeling start position slightly away from the suction table 5 than the push-up mechanism 7. The moving mechanism 8 has an air knife 9 serving as a peeling unit and a scraper 10 located above the air knife 9, and is driven by an induction motor 11 serving as a driving source incorporated in the apparatus main body 2 and a timing belt 12. , Move horizontally.

The air knife 9 is connected to a not-shown compressed air generator and an ion generator 13 built in the apparatus main body 2. The compressed air generated from the compressed air generator passes through the ion generator 13 to become ionized compressed air 14, which is further throttled by the air knife 9 before being injected. That is, the air knife 9 serves as a peeling unit and also serves as a charge removing unit. The injection of the ionized compressed air 14 is performed while moving in the horizontal direction. The shape of the air knife 9 is as shown in FIG.
Slit-shaped air jets 9a to 9c are provided at some places. Further details will be described later.

The scraper 10 places the peeled substrate. As shown in FIGS. 3 (a) to 3 (c), the shape is plate-like, and ribs 10a... Are formed at three edges except for the receiving side of the substrate so that the mounted substrate does not slide down. Is provided. A large number of small air vents 10c are provided on the mounting surface 10b, and are arranged in a substantially pyramid shape with the receiving side of the substrate at the bottom. In addition, as shown in FIG.
The periphery of the b side is chamfered so as not to damage the substrate. And it is attached to the moving mechanism 8 by the attaching parts 10d provided on the lower surface opposite to the mounting surface 10b, and performs horizontal movement.

On the peeling device bed 4, a static elimination blower 31 is installed at a position facing the suction table 5 with the support leg 15 of the uniaxial robot 3 described later interposed therebetween. From the static elimination blower 31, ionized air supplied from an ion generator (not shown) inside the apparatus main body 2 is blown toward the target work on the adsorption table 5. Therefore, the charge on the upper surface of the target work (the surface opposite to the suction surface with the suction table 5) is removed.

On the other hand, the one-axis robot 3 is
It is supported by supporting legs 15 erected at a position facing the push-up mechanism 7 in the vicinity. A main body 16 is attached to the support leg 15 at an angle, and an arm 17 extends from the main body 16 so as to face the push-up mechanism 7. At the tip of the arm 17, a suction mechanism 20 including a telescopic part 18 and a suction pad 19 is provided.
The telescopic part 18 is telescopically moved by a driving source (not shown),
The suction pad 19 is connected to a suction pad convum 21 built in the apparatus main body 2. Then, the expansion and contraction portion 18 extends to the portion of the target work pushed up by the push-up mechanism 7 on the suction table 5, and is temporarily sucked and held by the suction pad 19 at the tip thereof.

All the operations of the mechanisms constituting the substrate peeling apparatus 1 are performed by inputting to an operation panel 22 provided at an end on the peeling apparatus bed 4 and a control panel built in the apparatus main body 2. 23.

By the way, as shown in FIG. 4, the target object to be subjected to the peeling process by the substrate peeling apparatus 1 is a flexible thin plate-like substrate 24 which is composed of an adhesive jig 26 as an auxiliary jig 25.
And a temporary attachment to the jig plate 27, that is, an adhesive sheet 26 adhered to the jig plate 27.

Further, as shown in FIG. 5, the corner of the jig plate 27 which is applied to the push-up mechanism 7 is cut into a triangular shape, and the corner (cut-off portion) 24a of the substrate 24 is cut.
Protrudes above the push-up mechanism 7 and is easily pushed up by the push-up mechanism 7 from below.

Next, an actual peeling operation using the substrate peeling apparatus 1 will be described.

First, the substrate 24 temporarily attached to the auxiliary jig 25 on the suction table 5 is set so that the corners 24a protrude above the push-up mechanism 7, and then the start switch of the operation panel 22 is pressed. Adsorb and fix. Next, the substrate 24
The push-up mechanism 7 pushes up the corner 24a from below,
Peel off from the auxiliary jig 25. At this time, as shown in FIG. 6, when the extendable portion 18 of the suction mechanism 20 is extended and the suction pad 19 at the tip reaches the pushed-up corner 24a, suction is performed. Then, as shown in FIG. 7, the ionized compressed air 14 is further squeezed and jetted from the air knife 9 toward a temporary bonding point (boundary) between the substrate 24 and the adhesive sheet 26 to perform peeling. At this time, the substrate 24
Until is lifted, the suction by the suction pad 19 is held. Further, the air knife 9 continues the peeling advance, and when the scraper 10 above the air knife 9 enters between the peeled substrate 24 and the adhesive sheet 26, the suction mechanism 20 releases the suction, and the expansion and contraction portion 18 is moved. Shrink,
The suction pad 19 retreats (rises) to a position where the scraper 10 can pass.

From this state, the air knife 9 further separates and advances while injecting the ionized compressed air 14, and the substrate 2
4 is peeled off from the auxiliary jig 25.

During this time, the ionized compressed air 14 is
The blow-back generated by being jetted at the temporary bonding between the adhesive sheet 26 and the adhesive sheet 26 blows through between the substrate 24 and the scraper 10. The exfoliated portion of the substrate 24 is lifted up by the blowing air and does not rub on the scraper 10.

After being completely peeled off, the substrate 24 is softly attached and placed on the scraper 10.

At the start of peeling, the substrate 24 is attracted to the scraper 10 because the blowback is strong. On the other hand, the blow-back air is released to the lower side of the scraper 10 by the air vent holes 10c.

That is, in the peeling process of the substrate 24, the portion that has already been peeled is held in a state of being lifted in the air by the air flowing between the substrate 24 and the scraper 10, and the peeling of the substrate 24 is completely completed. When completed, the substrate 24 is softly attached and placed on the scraper 10, so that damage such as scratching or bending of the substrate 24 during or after peeling can be prevented.

Regarding the flow rate of the ionized compressed air 14 for separation, which is ejected from the air knife 9, the relationship between the opening size of the air ejection ports 9a to 9c of the air knife 9 and the compressed air pressure supplied from the compressed air generator. Is determined from

For example, when a rectangular substrate of 320 (mm) × 324 (mm) is peeled off, the three air outlets 9 are used.
Regarding the detailed dimensions of the air knife 9 including the opening sizes of a to 9c, referring to FIG. 2, if the outlet thickness (T) = 0.15 ± 0.01 (mm), the total outlet width ( a +
b + c) = 85-90 (mm), air knife width (A) = 2
It is preferably 00 (mm). This was determined based on experimental data as shown in Table 1.
In this experiment, a compressed air for general factory (5 kg / cm ² ) was sprayed from an air knife onto a substrate adhered on an auxiliary jig having a size of 320 (mm) × 324 (mm). It is a result of examining the degree of peeling. It should be noted that the regulator pressure in the table indicates a pressure drop value at the time of compressed air injection. Furthermore, using the air knife of the approximate dimensions determined from this experiment, a peeling test of the substrate was performed to determine the optimal flow rate of the jet air and the optimal dimensions of the air knife for peeling,
Table 2 shows the results. Then, from this table, the shape and dimensions of the air knife 9 were determined as described above.

[0042]

[Table 1]

[0043]

[Table 2]

The separation air injected from the air knife 9 is the ionized compressed air 14.
The charge removing effect of removing the electric charges carried on the substrate 24 at the time of peeling is apparent from the results of the experiments described below.

In this experiment, the case where the ionized compressed air using the ion generator (ESCA411 manufactured by HUGLE) was used as the compressed air for peeling, and the case where the compressed air for the general factory without using the ion generator was used. The measured state of the substrate 24 before and after the peeling in each of the examples was measured. In an environment of a temperature of 24 ° C. and a humidity of 50%, first, as shown in FIG.
(STATIRON-M2 type). Then, as shown in FIG. 4B, ionized compressed air and compressed air for general factory were respectively injected from the air knife 9 to peel the substrate 24 from the auxiliary jig 25. Each substrate 24 after peeling
Tables 3 and 4 show the results obtained by measuring the charge amount at the measurement points (1) to (3). Table 3 shows the results when ionized compressed air was used, and Table 4 shows the results when general factory compressed air was used. The average maximum charge after peeling with ionized compressed air is 0.32 KV,
The average maximum charge amount after peeling with compressed air for general factories is 2.1 KV, and the static elimination effect by using ionized compressed air as the static elimination means is remarkable.

[0046]

[Table 3]

[0047]

[Table 4]

As described above, in the substrate peeling device 1 according to the present embodiment, when the substrate 24 is peeled from the auxiliary jig 25, the substrate 24 and the adhesive sheet 26 are directly facing the temporary bonding line. Then, the ionized compressed air 14 further narrowed down is injected from the air knife 9. Thereby, the peeling of the substrate 24 from the auxiliary jig 25 is reliably performed. The air knife 9 is mounted on the moving mechanism 8 and moves along the attachment surface of the substrate 24. Thereby, the peeling operation by the air knife 9 is continuously performed, so that the peeling can be performed more reliably. In addition, since the peeling is performed without mechanical contact using the wind pressure, the substrate 24 is not damaged. Further, since the air to be injected is the ionized compressed air 14, the static electricity generated at the time of peeling is neutralized and the substrate 2
4 is performed. As a result, there is no adverse effect on the thin-film electrodes formed on the substrate 24. Further, since static elimination can be performed only by sending the ionized compressed air 14, the static elimination operation is simple. Further, the ionized compressed air 14
Since it is not necessary to collect after the peeling process, the structure of the substrate peeling apparatus 1 does not become complicated.

Embodiment 2 Next, another embodiment of the present invention will be described with reference to FIGS. 9 and 10. For the sake of convenience, members having the same functions as those shown in the drawings of the above-described embodiment will be denoted by the same reference numerals, and description thereof will be omitted.

In this embodiment, as shown in FIG.
The peeling means mounted on the moving mechanism 8 in the substrate peeling device 29 is a single-edged wedge 30.
This embodiment differs from the first embodiment in that a nozzle (not shown) for ejecting ionized air is mounted on the moving mechanism 8. Incidentally, as the charge removing means, a charge removing gun or a charge removing bar may be used.

As shown in FIG. 10, this substrate peeling device 2
9, the single-edge wedge 30 directly scrapes off the blade by directly applying the blade to the temporary bonding line between the substrate 24 and the adhesive sheet 26, and the scraped-off substrate 24 is placed on the scraper 10. The one-edge wedge 30 further continues the peeling advance. At this time, ionized air is blown from the nozzle toward the peeling surface of the substrate 24 in parallel with the above. This state is executed until the peeling is completely completed.

As described above, in the substrate peeling device 29 according to the present embodiment, the one-edge wedge 30 is directly applied to the temporary bonding between the substrate 24 and the adhesive sheet 26, and the peeling is performed. This ensures that the substrate 24 is peeled off. Also, in parallel with the peeling operation, the substrate 2
Since the ionized air is blown toward the separation surface of No. 4, static electricity generated at the time of separation is neutralized, and the charge of the substrate 24 is removed. As a result, there is no adverse effect on the thin-film electrodes formed on the substrate 24.

Embodiment 3 Next, still another embodiment of the present invention will be described with reference to FIGS. 11 and 12. For convenience of explanation, members having the same functions as the members shown in the drawings of the above-described embodiment include:
The same reference numerals are added, and the description is omitted.

This embodiment is different from the second embodiment in that the peeling means mounted on the moving mechanism 8 in the substrate peeling device 32 is a rotary roller 33 as shown in FIG.

The rotating roller 33 is, as shown in FIG.
The substrate 24 is disposed between the substrate 24 and the adhesive sheet 26, and is rotated in the direction of arrow A in the figure to roll up the substrate 24 from the adhesive sheet 26 and peel it off.

Accordingly, the substrate peeling device 32 according to the present embodiment
In the above, the temporary bonding line between the substrate 24 and the adhesive sheet 26 is rolled up while the rotating roller 33 is rotating and peeled off. Thereby, the substrate 24 is completely peeled off. In addition, since ionized air is blown from the nozzle toward the peeling surface of the substrate 24 in parallel with the peeling operation, static electricity generated at the time of peeling is neutralized, and the charge of the substrate 24 is removed. As a result, there is no adverse effect on the thin-film electrodes formed on the substrate 24.

In addition to the above-described first to third embodiments, for example, peeling by a method as shown in FIG. 13 can be considered. In this method, one end of the substrate 24 is clamped and lifted obliquely upward. For example, teaching can be performed by a robot or the like to substitute the robot.

[0058]

As described above, the substrate peeling apparatus of the present invention is a substrate peeling apparatus for peeling a flexible thin plate-like substrate which has been pasted on a pressure-sensitive adhesive sheet of an auxiliary jig and has undergone a processing step from the pressure-sensitive adhesive sheet. A push-up mechanism for pushing up the protruding portion of the flexible thin plate substrate from below, a sucking-up mechanism for sucking up and holding the portion of the flexible thin plate pushed up by the push-up mechanism, and a flexible thin plate held by the sucking-up mechanism A peeling force applying unit disposed between the substrate and the pressure-sensitive adhesive sheet, for applying a peeling force for peeling the flexible thin plate-like substrate from the pressure-sensitive adhesive sheet; and Moving means for moving the thin sheet substrate along the bonding surface with the thin sheet substrate, and the moving means places the flexible thin sheet substrate peeled off from the adhesive sheet. A configuration that includes a Itano placing member.

As a result, there is an effect that the flexible thin plate-like substrate can be reliably separated from the auxiliary jig.

Further, the substrate peeling device of the present invention may be provided with a static eliminator for removing the electric charge carried by the flexible thin plate substrate when the flexible thin substrate is peeled from the adhesive sheet. Accordingly, it is possible to prevent the adverse effects caused by the charging of the flexible thin plate-like substrate, for example, when a thin-film electrode is formed on the flexible thin plate-like substrate, the occurrence of such a situation that the charging destroys the thin-film electrode is caused. It has the effect of being able to.

Further, as the charge removing means, an ion neutralizing means for blowing ionized air onto the flexible thin plate-like substrate may be used. Thereby, since static elimination can be performed only by sending ionized air, there is an effect that the static elimination operation is simple.

As the peeling force applying means, a fluid ejecting means for applying a peeling force by injecting a pressure fluid may be used. Thereby, there is an effect that it is possible to prevent a situation in which the flexible thin plate-shaped substrate is damaged due to mechanical contact at the time of peeling.

Further, an air knife may be used as the fluid ejecting means. Thereby, since what is ejected is air, there is an effect that handling is simple, for example, unlike water or the like, collection after injection is unnecessary.

The air knife is set so as to blow compressed air toward a temporary bonding line between the flexible thin plate-shaped substrate and the pressure-sensitive adhesive sheet. It is preferable that the blow-back generated at the joint is set so as to blow through between the flexible thin plate-shaped substrate and the substrate mounting member.

Thus, in the peeling process of the flexible thin plate-like substrate, the already peeled portion is held in a state of being lifted up in the air by blowing back, and when completely peeled off, it is softly attached on the substrate mounting member, Since it is placed, it is possible to prevent the flexible thin plate-shaped substrate from being damaged or bent during the peeling or after the peeling.

The air knife may be one that blows ionized air onto the flexible thin plate-like substrate. Thereby, the member for peeling and the member for static elimination can be made the same, so that there is an effect that the apparatus can be simplified.

Further, it is preferable that the substrate mounting member has a plurality of holes near the edge of the substrate mounting surface on the side for receiving the substrate. Thereby, there is an effect that the wind velocity at the start of peeling is strong, and it is possible to prevent the flexible thin plate-like substrate from being attracted to the substrate mounting member.

Further, as the peeling force applying means, a single-edge wedge which applies a blade to the temporary bonding of the flexible thin plate substrate and the adhesive sheet may be used. Further, as the peeling force applying means, a rotating roller that rolls up the flexible thin substrate from the pressure-sensitive adhesive sheet and peels it off may be used. Thus, there is an effect that the flexible thin plate-like substrate can be reliably separated from the auxiliary jig.

[Brief description of the drawings]

FIG. 1 is a partially cutaway front view of a substrate peeling apparatus according to a first embodiment of the present invention.

2A and 2B show the shape of an air knife in Embodiment 1 of the present invention, wherein FIG. 2A is a plan view and FIG. 2B is a sectional view.

3A and 3B show the structure of the scraper according to the first embodiment of the present invention, wherein FIG. 3A is a plan view, FIG.
(C) is a side view, and (d) is a cross-sectional view of a hole.

FIG. 4 is a front view of a target workpiece according to the first to third embodiments of the present invention.

5A and 5B show the target work of FIG. 4, in which FIG. 5A is an overall perspective view, and FIG. 5B is an enlarged perspective view of a corner.

FIG. 6 is an explanatory diagram illustrating a state during operation of the substrate peeling device according to the first embodiment of the present invention.

FIG. 7 is a front view showing a peeling operation by the air knife in the first embodiment of the present invention.

FIG. 8 is a plan view showing measurement points on a substrate according to a charge amount measurement experiment performed to show a charge removal effect by ionized compressed air in Example 1 of the present invention;
(B) is a front view which shows the board | substrate peeling method.

FIG. 9 is a partially cutaway front view of a substrate peeling device according to a second embodiment of the present invention.

FIG. 10 is a front view showing a peeling operation by a single-edge wedge according to the second embodiment of the present invention.

FIG. 11 is a partially cutaway front view of a substrate peeling device according to a third embodiment of the present invention.

FIG. 12 is a front view showing a peeling operation by a rotating roller in Embodiment 3 of the present invention.

FIG. 13 is a front view showing a peeling operation by the clamp mechanism in the embodiment of the present invention.

14 (a) is a front view and FIG. 14 (b) is a plan view showing a peeling operation of a conventional example.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Substrate peeling apparatus 8 Moving mechanism (moving means) 9 Air knife (peeling force giving means, static eliminating means, ion neutralizing means, fluid jetting means) 10 Scraper (substrate mounting member) 10c Air vent (hole) 13 Ion generator (Electric neutralization means) 24 Flexible thin plate-like substrate 25 Auxiliary jig

Claims (5)

[Claims] 1. A substrate peeling device for peeling a flexible thin plate-like substrate which has been pasted on a pressure-sensitive adhesive sheet of an auxiliary jig and has undergone a processing step from the pressure-sensitive adhesive sheet, wherein a protruding portion of the flexible thin-plate substrate is moved downward. A push-up mechanism that pushes up from, a sucking-up mechanism that sucks up and holds a portion pushed up by the push-up mechanism in the flexible thin plate substrate, and is disposed between the flexible thin plate substrate held by the sucking mechanism and the adhesive sheet, Peeling force applying means for applying a peeling force for peeling the flexible thin plate substrate from the pressure-sensitive adhesive sheet, and moving the peeling force applying means along the bonding surface between the pressure-sensitive adhesive sheet and the flexible thin plate substrate. Moving means, and the moving means has a substrate mounting member for mounting the flexible thin plate-like substrate peeled off from the adhesive sheet. Plate peeling apparatus. 2. The peeling force applying means is an air knife for applying a peeling force by injecting compressed air, and the air knife is directed toward a temporary bonding line between the flexible thin plate-shaped substrate and the adhesive sheet. It is set so that compressed air is blown, and the blow-back generated when the compressed air ejected from the air knife is ejected at the temporary bonding point blows through between the flexible thin plate-shaped substrate and the substrate mounting member. The apparatus according to claim 1, wherein the apparatus is set. 3. The substrate peeling device according to claim 2, wherein the substrate mounting member has a plurality of holes near an edge of the substrate mounting surface on a side for receiving the substrate. 4. A substrate peeling apparatus according to claim 1, wherein said peeling force applying means is a single-edge wedge for applying a blade to a temporary bonding of said flexible thin plate substrate and said adhesive sheet. 5. A substrate peeling apparatus according to claim 1, wherein said peeling force applying means is a rotating roller which rolls up and peels said flexible thin substrate from said adhesive sheet by rotating. .