JP2001223500A - Accuracy inspection method for electrical component mounting system - Google Patents

Abstract

(57) Abstract: Provided is a method capable of easily and accurately detecting the mounting accuracy of a mounting device by the mounting device. An inspection chip (100) is suctioned by a suction nozzle (62).
Is held, the inspection chip is rotated four times by 90 degrees, the inspection chip at each rotation position is imaged by the parts camera 68, and the rotation of the parts camera and the suction nozzle is performed based on the average value of the image of each inspection chip. After obtaining the relative position with respect to the center, the inspection chip mounted on the mounting position 102 is imaged by the F mark camera 66, and the deviation of the relative position between the suction nozzle and the F mark camera is detected.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to inspection of a part relating to mounting accuracy of an electric component mounting system for mounting an electric component (including an electronic component) on a circuit substrate such as a printed wiring board.

[0002]

2. Description of the Related Art In recent years, there has been a strong demand for improvements in the mounting accuracy of electrical components in order to meet the demands for shortening the lead wire spacing of electrical components and improving mounting density. In order to improve the mounting accuracy, electric component mounting such as a component holder, an imaging device for imaging an electric component held by the component holder, an imaging device for imaging a reference mark of a circuit substrate on which the electric component is mounted, and the like. It has already been performed to obtain other relative positional deviations with respect to any one of the parts related to the mounting accuracy of the system and control the mounting operation of the electric component mounting system based on the relative positional deviations. In one of the conventional accuracy inspection methods, at the time of manufacturing and maintenance of the electric component mounting system, the above-described relative displacement is obtained and adjusted using a special inspection device.

[0003]

However, a special inspection device is required for detecting the relative displacement, and for example, the user of the electric component mounting system can easily perform the inspection. Did not. In addition, the relative position shift changes each time the entire mounting apparatus is deformed due to a change in air temperature, heat generated by a servomotor, temperature rise due to ball screw friction, and the like, and further, wear and deformation of system components. It also changes by. Therefore, in order to improve the mounting accuracy, it is necessary to frequently detect the relative displacement and to cope with the change. For it,
In conventional accuracy inspection methods and apparatuses, in order to eliminate the detection error of the relative displacement, the relative displacement was detected a plurality of times (ideally several tens of times) and the average value was obtained.
The relative position shift cannot be detected frequently, and it is difficult to sufficiently cope with the change in the relative position shift. Furthermore, in the conventional accuracy test, the eigenvalue related to the acquired mounting accuracy is regarded as absolute. As described above,
At one time, the same eigenvalue was detected several times, and the average of those values was considered to be the true eigenvalue.However, the value once regarded as the true eigenvalue was kept until the next accuracy check was performed. , It was used as an immutable value. However, in practice, as described above, many of the eigenvalues change as the mounting work progresses or as the amount of use of the system is accumulated.

In view of the above circumstances, the present invention is to improve the accuracy inspection of a part related to the mounting accuracy of an electric component mounting system, and more specifically, to improve a characteristic value related to the mounting accuracy such as a relative displacement. The present invention has been made to be able to detect easily or in a manner capable of following a change accompanying the progress of the mounting work and the accumulation of the system usage amount. According to the present invention, the accuracy inspection method of each of the following aspects is provided. Thus, a recording medium for precision inspection, an electric component mounting system, and the like can be obtained. As in the case of the claims, each aspect is divided into sections, each section is numbered, and if necessary, the other sections are cited in a form in which the numbers are cited. This is for the purpose of facilitating the understanding of the present invention, and should not be construed as limiting the technical features and combinations thereof described in the present specification to the following embodiments. Further, when a plurality of items are described in one section, it is not always necessary to adopt all of the items together, and it is also possible to take out and adopt only some of the items.

(1) A component holder for holding an electric component,
A substrate supporting device that supports a circuit substrate, a first imaging device that captures at least a part of an electrical component held by the component holder, and at least one of a circuit substrate supported by the substrate supporting device And a second imaging device for imaging the part, a method for inspecting the accuracy of the portion related to the mounting accuracy of the electrical component mounting system for mounting the electrical component on the circuit board, by the electrical component mounting system itself, A precision inspection method for an electrical component mounting system, comprising detecting a relative position shift of at least one of the other of the component holder, the first imaging device, and the second imaging device. In the accuracy inspection method described in this section, since the mounting accuracy of the electrical component mounting system itself is inspected, the inspection of the mounting accuracy can be easily performed. Therefore, it can be executed frequently, and it is also possible to sequentially detect deformation of the entire apparatus due to a change in air temperature, heat generated by a servomotor, temperature rise due to ball screw friction, and the like. Note that the first imaging device and the second imaging device can be configured as a common imaging device. The relative position shift includes at least one of a shift of a relative position of at least one other axis with respect to any one of the axes and a relative phase shift which is a shift of a rotational position around the axis. (2) a component holder for holding an electric component, a substrate supporting device for supporting a circuit substrate, a first imaging device for imaging at least a part of the electric component held on the component holder, A second imaging device for imaging at least a part of the circuit substrate supported by the material support device, and a method for inspecting a portion related to mounting accuracy of an electric component mounting system for mounting an electric component on the circuit substrate. Then, the inspection chip is held by the component holder, and at least a part of the inspection chip held by the component holder is imaged by the first imaging device. It is placed at the placement position, at least a part of the placed inspection chip is imaged by the second imaging device, and based on the imaging result of the first imaging device and the imaging result of the second imaging device, Parts holder, first imaging device And other precision inspection method of the electrical component mounting system which comprises a step of detecting at least one of relative displacement of the two for any one of the second image pickup apparatus [Claim 1]. In the accuracy inspection method described in this section, the same inspection chip is imaged in a state where it is held by the component holder and in a state where it is mounted on the mounting position, so that the inspection chip is obtained. As a medium, the relative position with respect to at least one of the other two of one of the component holder, the first imaging device, and the second imaging device is grasped, and the function of the electric component mounting system itself is used. It is possible to detect a relative displacement of a part related to the component mounting accuracy of the electrical component mounting system, and it is not necessary to use a special jig as in the related art. As the inspection chip, a chip manufactured exclusively for inspection is desirable, but it is also possible to use a normal electric component to be mounted. As will be described later in detail in the embodiment section, when the change in the relative position between the component holder and the second imaging device is so small as to be negligible and the relative position can be regarded as unchanged, or when the component holder and the second imaging device are not changed. When the relative position with respect to the device is detected and known in advance, it is not essential to detect the position of the component holder in implementing the present invention. In addition, the deviation of the actual position of the component holder from the normal position may not affect the mounting position accuracy as long as the electrical component can be held without trouble.In such a case, the position of the component holder is detected. It is not essential to do. The electric component mounting system may be, for example, an electric component mounting system in which the electric component is mounted on the circuit substrate by moving the component holder in a direction along the surface of the circuit substrate, or A mounting position at which the holder mounts the electric component on the circuit substrate is fixedly determined, and the circuit substrate supported by the circuit substrate supporting device moves in a direction along the surface of the circuit substrate with respect to the mounting position. The electrical component mounting system may be moved to mount the electrical component on the circuit board. (3) The relative position shift between the inspection chip and at least one of the component holder and the first imaging device is obtained from the imaging result of the first imaging device,
(2) including a step of acquiring a relative displacement between the second imaging device and the mounted inspection chip from the imaging result of the imaging device.
An accuracy inspection method according to claim [Claim 2]. The steps described in this section are performed in the accuracy inspection method described in (2) based on “the component holder, the first imaging apparatus, and the second imaging apparatus based on the imaging result of the first imaging apparatus and the imaging result of the second imaging apparatus. This is a typical specific example of a process of detecting a relative position shift of at least one of the other two imaging devices with respect to any one of the two imaging devices: (4) The component holder, the first imaging device, and the second imaging device (2) or (3), wherein the step of detecting the relative displacement of the device includes the step of detecting a relative displacement of at least one of the component holder of the second imaging device and the first imaging device. Accuracy inspection method [Claim 3] Since a circuit board is imaged by the second image pickup device and the mounting position where the currently held electric component is to be mounted is acquired, the accuracy is related to the position of the circuit board. Second imaging device and component related to position of electrical component It is desirable to detect the relative position between the holder and the first imaging device, and particularly, if the relative position between the first imaging device and the second imaging device is detected, it is easy to improve the mounting accuracy of the electric component. (5) After acquiring the displacement of the inspection chip with respect to the component holder, the displacement is corrected, and the inspection chip is placed at a predetermined placement position.
The accuracy inspection method described in (4). In the accuracy inspection method described in this section, similarly to the case where the electric component is mounted on the circuit substrate, the mounting accuracy of the inspection chip placed after correcting the displacement with respect to the component holder is detected. According to this method, it is possible to inspect the overall accuracy of all parts related to the mounting of the electric component. On the other hand, the inspection chip may be placed at the placement position without correcting the positional deviation with respect to the component holder. In this case, it is possible to detect the accuracy of the portion excluding the portion for correcting the displacement of the electric component with respect to the component holder. Also, do both tests,
By taking the difference between the two results, it is possible to detect the accuracy of only the portion that corrects the displacement of the electric component with respect to the component holder. (6) The accuracy inspection method according to any one of the above items (2) to (5), wherein the inspection chip is prepared in the placement position in advance. The inspection chip may be supplied by a dedicated supply device each time the mounting accuracy is detected, but in this case, a step of removing the used inspection chip is required, and the operation for the accuracy inspection is performed. Is complicated. On the other hand,
If the test chip is prepared at the mounting position in advance, the step of removing the used test chip by removing the test chip from the mounting position and mounting the test chip again at the mounting position may be repeated. Can be omitted, and the operation for accuracy inspection can be simplified accordingly. In addition, a small number of test chips is required, and a chip supply device for supplying the test chips is not required. (7) The component holder holding the inspection chip is rotated to a plurality of rotation positions, the inspection chip is imaged by the first imaging device at each rotation position, and the component holder of the inspection chip is obtained from the imaging result. The accuracy inspection method according to any one of the paragraphs (2) to (6), wherein the positional deviation is obtained with respect to. When the electric component is mounted on the circuit substrate, the position of the component holder in the image captured by the first imaging device is assumed to be invariable, and the invariable component holder position and the electrical component obtained by the image processing are determined. Is obtained as the position shift of the electric component with respect to the component holder. When inspecting the mounting accuracy of the electric component mounting system, the displacement of the inspection chip with respect to the component holder may be acquired in the same manner as when mounting the electric component. When the position of the tool is shifted from the normal position, the shift cannot be detected. In contrast, in the accuracy inspection method described in this section, the inspection chip is rotated to a plurality of rotation positions by rotating the component holder, and the inspection chip at the plurality of rotation positions is imaged and obtained. Obtaining the rotation center of the inspection chip based on the obtained image data, detecting the rotation center as the position of the component holder, and accurately detecting the displacement of the inspection chip with respect to the position of the component holder. Can be. (8) The accuracy inspection method according to the above mode (7), wherein the position of the component holder is acquired as the center of a circle passing through all the center positions of the image of the inspection chip imaged at each rotation position. (9) The plurality of rotation positions are positions obtained by dividing 360 degrees at equal angular intervals, and the position of the component holder is acquired as an average value of the center position of the image of the inspection chip imaged at each rotation position. The accuracy inspection method described in paragraph (7) or (8). In the accuracy inspection method described in this section, since the position of the component holder can be obtained by calculating the average of the center positions of the images of the inspection chip, the position of the component holder and the inspection chip can be obtained. The deviation can be easily obtained. If one rotation angle is reduced, the number of data of the center position of the inspection chip to be acquired increases, and the detection accuracy of the center position increases. However, the number of times of imaging and data processing increase, and the time required for inspection increases. Is preferably about 90 degrees. (10) The electric component is held by the component holder, and the component holder is moved in a direction parallel to the surface of the circuit substrate fixedly supported by the substrate supporting device, so that the electric component is transferred to the circuit substrate. A method for inspecting the accuracy of an electric component mounting system to be mounted, wherein a delay is caused in a currently performed mounting operation among components of the electric component mounting system during operation of the electric component mounting system. An accuracy inspection method for an electrical component mounting system, wherein an accuracy inspection of a portion related to the mounting accuracy of an electrical component of the electrical component mounting system is performed using a component that can be used without any problem. In the accuracy inspection method described in this section, the mounting accuracy of the electric component mounting system can be inspected without causing a delay in the mounting operation, so that the mounting accuracy can be maintained without reducing the mounting efficiency during the operation of the mounting system. Can be inspected. (11) The mounting of the electric component on one of the circuit base materials is completed, and the carrying out of the circuit base material after the completion of the mounting and the carrying in of the next circuit base material are performed by the component holder. The accuracy inspection method according to the above mode (10), wherein the inspection chip is mounted at the mounting position described above, and the mounting position error is acquired, thereby checking the accuracy of the electrical component mounting system (claim 10). In the accuracy inspection method described in this section, the mounting accuracy is detected during the loading and unloading of the circuit substrate by using the fact that the component holder and the imaging device are not used. Inspection of mounting accuracy can be performed without lowering work efficiency during work. In an electric component mounting system in which an electric component is mounted by moving the component holder in a direction parallel to the surface of the circuit substrate, the mounting position is not set on the circuit substrate, and the circuit substrate transport device is moved. If it is set at a position that does not interfere with
Regardless of whether the circuit substrate is being loaded or unloaded or the circuit substrate is stationary, the inspection chip can be placed at the placement position on the component holder. (12) The mounting position is set at a position on the substrate support device that does not interfere with the circuit substrate (10) or
The accuracy inspection method described in (11). In the accuracy inspection method described in this section, the mounting position is provided on the substrate support device and provided at a position that does not interfere with the circuit substrate,
Both can be performed while avoiding mutual interference between the accuracy inspection and the mounting operation. For example, a mounting operation for mounting an electric component on a circuit substrate can be performed in a state where the inspection chip is mounted at the mounting position. (13) The placement position is set to a portion on the base material supporting device that is immovable. (10) to (12)
Accuracy inspection method described in section. When the mounting position is set on the moving member, the inspection chip mounted on the mounting position may move when the moving member accelerates or decelerates, but the mounting position cannot be moved. If set for the part,
There is no danger. Note that the mounting position is set in a range in which the second imaging device can image. (14) A method for inspecting the accuracy of an electric component mounting system for mounting an electric component on a circuit board while holding the electric component by a component holder, wherein an eigenvalue relating to the mounting accuracy of the electric component mounting system is determined by a time interval A method for inspecting the accuracy of an electrical component mounting system, wherein a plurality of eigenvalues detected and acquired plural times are integrated and processed to obtain a true eigenvalue. The eigenvalue obtained by the above-described inspection method includes a detection error. In the accuracy inspection method described in this section, since the eigenvalue is acquired a plurality of times, the influence of the detection error can be reduced, and a value close to the true eigenvalue can be obtained. In addition, a plurality of detections of the eigenvalues are performed at time intervals, and the detection results are processed in an integrated manner, so that the eigenvalues change with the progress of the mounting work and accumulate the usage of the electric component mounting system. It can follow the change of the eigenvalue. This method may be executed by the electric component mounting system itself, or may be provided with an accuracy inspection device for inspecting the mounting accuracy separately from the mounting system, and may be executed by the device. The integral processing is a kind of correction processing that corrects with a newly obtained eigenvalue while respecting what has been obtained in the past and once regarded as a true eigenvalue. The value between the calculated eigenvalues is set as a new true eigenvalue. The new true eigenvalue may be any value between the past true eigenvalue and the newly obtained eigenvalue, but if the value at a certain subdivision point is to be the new true eigenvalue, the The division ratio may be fixed, or may be changed according to the number of corrections performed as described in (16). The internal division ratio should be determined according to the degree to which it is appropriate to respect each of the past true eigenvalue and the newly detected eigenvalue, and it is predicted that the change in the eigenvalue is small. In each case, the degree of respect (weight) of the past true eigenvalue is increased. (15) Each of the plurality of detections of the eigenvalue is performed with the work of mounting the electric component on the circuit substrate interposed therebetween (1).
The accuracy inspection method according to the item 4) [Claim 7]. The mounting of the electric component performed during the plurality of detections of the eigenvalue is performed based on a value obtained based on the eigenvalue detected earlier and regarded as a true eigenvalue. The eigenvalue may be detected once or a plurality of times, but it is preferable that the eigenvalue be detected without deteriorating the efficiency of the work of mounting the electric component. According to the accuracy inspection method described in this section, it is possible to cope with a change in the eigenvalue accompanying the progress of the mounting work of the electric component and an increase in the accumulated usage of the electric component mounting system. (16) The integral process determines a new true eigenvalue based on past true eigenvalues, newly acquired eigenvalues, and the number of times the eigenvalues have been detected so far (14) or (15). )). In the method described in this section, the eigenvalue is acquired while changing the internal division ratio according to the number of detections. For example, immediately after the start of the accuracy test, a value between the past true eigenvalue and the currently detected eigenvalue, which is close to the newly detected new eigenvalue, is acquired as a new true eigenvalue, and the eigenvalue detection is performed. As the number of times increases, a value closer to the past true eigenvalue than the presently detected eigenvalue is set as a new true eigenvalue, and conversely, a value closer to the current detected eigenvalue is set as a true eigenvalue. Or you can. (17) The accuracy inspection method according to any one of the above items (1) to (9), wherein, during the operation of the electric component mounting system, a component of the electric component mounting system that is currently in operation is operated. An accuracy inspection method, comprising: performing an accuracy inspection of a portion related to the mounting accuracy of an electrical component of an electrical component mounting system using a component that can be used without causing a delay in a mounting operation performed. In the accuracy inspection method described in this section, the features described in any one of paragraphs (11) to (13) can be applied. (18) The accuracy inspection method according to any one of the above items (14) to (16), wherein during the operation of the electric component mounting system, a component of the electric component mounting system that is currently operated is not checked. An accuracy inspection method, comprising: performing an accuracy inspection of a portion related to the mounting accuracy of an electrical component of an electrical component mounting system using a component that can be used without causing a delay in a mounting operation performed. In the accuracy inspection method described in this section, the features described in any one of paragraphs (11) to (13) can be applied. (19) The accuracy detection method according to any one of (1) to (9), wherein a plurality of eigenvalues related to mounting accuracy of the mounting system for the electric component are detected, and the obtained plurality of eigenvalues are integrated. A method for inspecting the accuracy of an electrical component mounting system, comprising: In the accuracy inspection method described in this section, items (10) to (13), (15), (1
The features described in any one of the items 6) can be applied. (20) The accuracy inspection method according to any one of paragraphs (1) to (9), wherein, during operation of the electric component mounting system, a mounting operation that is currently performed among components of the electric component mounting system. Using components that can be used without causing delays, perform an accuracy inspection of the part related to the mounting accuracy of the electrical component of the electrical component mounting system, and evaluate the eigenvalue related to the mounting accuracy of the mounting system for the electrical component. A plurality of acquired eigenvalues are integrated and processed to obtain true eigenvalues. In the accuracy inspection method described in this section, items (11) to (13), (1
The features described in any one of the paragraphs (5) and (16) can be applied. (21) The mounting position of the inspection chip is set at a plurality of positions separated in a moving direction of a moving device that relatively moves the component holder and the circuit substrate in a direction parallel to a surface of the circuit substrate. The accuracy inspection method according to any one of paragraphs (2) to (20). With this configuration, the relative positioning accuracy between the component holder and the circuit substrate by the moving device can be detected at a plurality of positions. It is desirable that the mounting position is set in a state of being distributed corresponding to the entire range of movement by the moving device. (22) A component holder for holding an electrical component, a substrate supporting device for supporting a circuit substrate, and a first image capturing device for the electrical component.
A method for detecting the mounting accuracy of an electrical component of an electrical component mounting system for mounting an electrical component on a circuit substrate, the method comprising: an imaging device; and a second imaging device that images the circuit substrate. After the inspection chip is held by the first imaging device and the inspection chip is mounted on the mounting position, the mounted inspection chip is The first imaging device and the second imaging device are imaged based on the data of the image of the inspection chip acquired by the first imaging device and the data of the image of the inspection chip acquired by the second imaging device. 2. An accuracy inspection method comprising detecting a relative phase shift around an optical axis with an imaging device. In order to detect the relative phase shift between the first imaging device and the second imaging device, the relative position between the component holder and the first imaging device is not changed, and the relative position between the component holder and the first imaging device is not changed. It is not necessary to detect relative displacement. Any of the features of the paragraphs (2) to (21) can be applied to the inspection method of this section. (23) In an electric component mounting system for holding an electric component by a component holder and mounting the electric component on a circuit substrate, an inspection program for inspecting, by a computer, a portion related to the mounting accuracy of the electric component mounting system. A holding step of holding the inspection chip on the component holder, a first imaging step of imaging at least a part of the held inspection chip by the first imaging device, and a predetermined mounting of the component holder. A mounting step of moving the test chip to a position and mounting the test chip, a second imaging step of imaging at least a part of the mounted test chip by a second imaging device, and the first imaging device. Obtaining a relative displacement between the inspection chip and at least one of the component holder and the first imaging device based on the obtained image data. An inspection program including an image processing step and a second image processing step of acquiring a relative position shift between the inspection chip and the second imaging device based on image data obtained by the second imaging device is a computer. A recording medium recorded so as to be readable on a medium [Claim 8]. The features described in paragraphs (2) to (22) can be applied to the program described in this paragraph. By executing this program in an existing electric component mounting system, it is possible to automatically detect a mounting error. (24) Relative positional deviation between the inspection chip acquired in the first image processing step and at least one of the component holder and the first imaging device, and the inspection chip acquired in the second image processing step. (23) The recording medium according to (23), further including a correction step of correcting an electric component mounting control program by the electric component mounting system based on a relative position shift with respect to the second imaging device. This makes it possible to automatically remove or reduce the mounting error of the electric component mounting system. (25) a component holder for holding an electric component, a moving device for relatively moving the component holder and a circuit substrate on which the electric component is to be mounted in a direction parallel to a surface of the circuit substrate, A first imaging device capable of imaging at least a portion of the electrical component held by the component holder, a second imaging device capable of imaging at least a portion of the circuit substrate, the component holder, the moving device, and the second imaging device. A control device that controls the first imaging device and the second imaging device to mount the electric component on the circuit substrate.
The control device causes the component holder to hold an inspection chip, and causes the first imaging device to image at least a part of the inspection chip, and then places the inspection chip on the component holder in a predetermined manner. The inspection chip is placed at the placement position, at least a part of the placed inspection chip is imaged by the second imaging device, and the inspection chip and the component holder are based on image data acquired by the first imaging device. And a relative displacement between at least one of the first imaging device and the first imaging device, and a displacement between the inspection chip and the second imaging device based on data of an image acquired by the second imaging device. An electric component mounting system comprising a control unit [Claim 9]. In the electric component mounting system described in this section, the features described in paragraphs (2) to (24) can be applied.

[0006]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An electric component mounting system according to one embodiment of the present invention is shown in FIGS. Since this electric component mounting system has the same basic configuration as the system described in detail in Japanese Patent Application Laid-Open No. 6-291490, the entire description will be simplified here, and only the parts that are deeply relevant to the present invention will be described. This will be described in detail. In FIG. 2, reference numeral 10 denotes a base. A plurality of columns 12 are erected on the base 10, and an operation panel and the like are provided on a fixed base 14 fixed to the columns 12. As shown in FIG. 3, a printed circuit board 16 (used as a generic name of a printed wiring board before electric components are mounted and a printed circuit board after electric components are mounted) is also provided on the base 10 in the X-axis direction. There is provided a substrate conveyor 18 for transporting (in the horizontal direction in FIGS. 3 and 4). The printed board 16 is conveyed by a board conveyor 18, and the printed board 16 is positioned and supported at a predetermined component mounting position by a positioning support device (not shown).

A feeder-type electric component supply device 20 and a tray-type electric component supply device 22 are provided on both sides in the Y-axis direction orthogonal to the X-axis direction in the horizontal plane of the base 10, respectively.
Is provided. In the feeder-type electric component supply device 20, a large number of feeders 24 are arranged side by side in the X-axis direction. Taping electrical components are set in each feeder 24. The taping electrical component is configured such that the electrical component is accommodated in each of the component accommodating recesses formed at equal intervals in the carrier tape, and the openings of the component accommodating recesses are closed by a cover film affixed to the carrier tape. This prevents the electrical components from jumping out of the component housing recesses during tape feeding. This carrier tape is fed at a predetermined pitch in the Y-axis direction, and the cover film is peeled off and sent to the component supply position.

Further, the tray-type electric component supply device 22 includes:
The electric components are supplied in a component tray. A plurality of component trays are stacked in a large number of component tray storage boxes 26 arranged as shown in FIG. Each of these component tray housing boxes 26 is supported by a support member (not shown), and is sequentially raised to a component supply position by a lifting device (not shown). It is necessary to secure space for taking it out.

Therefore, the component tray housing box 26 to which the electric components have been supplied is raised by the space at the same time when the next component tray housing box 26 is raised to the component supply position, and is moved to the upper retreat area. Evacuated. In the tray-type electric component supply device 22, even if the component tray has finished supplying the electric components, the component tray housing box 26 cannot be lifted by one component tray, and the component supply position is changed as the component tray is discharged. Except that the tray is lowered one sheet at a time, it is the same as the electric component supply device described in Japanese Patent Publication No. 2-57719, and the description is omitted. In addition,
The component tray housing box 26 is pulled out in the X-axis direction as shown by a two-dot chain line in FIG. 3 so that an operator can inspect the inside or the like.

The electric components 28 supplied by the feeder type electric component supply device 20 and the tray type electric component supply device 22 are mounted on the printed circuit board 16 by an electric component mounting device 30 provided on the base 10. Guide rails 32 extending in the X-axis direction are provided on both sides of the substrate conveyor 18 in the Y-axis direction on the base 10 as shown in FIG. 2, and an X-axis slide 34 is movably fitted in a guide block 36. ing.

The X-axis slide 34 is, as shown in FIG.
From the feeder type electric component supply device 20 to the substrate conveyor 18
And two nuts 38 (only one is shown in FIG. 4) are screwed into ball screws 40, respectively. Each of them is rotated in synchronism by the X-axis servo motor 42, thereby being moved in the X-axis direction.

As shown in FIGS. 3 and 4, a Y-axis slide 44 is provided on the X-axis slide 34 so as to be movable in a Y-axis direction which is a direction orthogonal to the X-axis direction. As shown in FIG. 4, a ball screw 48 extending in the Y-axis direction is attached to a vertical side surface 46 of the X-axis slide 34, and the Y-axis slide 44 is screwed on a nut 50. The Y-axis slide 44 is rotated through the gears 54 and 56 by the Y-axis servo motor 52 shown in FIG.
8 and is moved in the Y-axis direction.

On the vertical side surface 59 of the Y-axis slide 44,
As shown in FIG. 4, a mounting head 60 is mounted. The mounting head 60 is provided with a suction nozzle 62 as a component suction tool for sucking the electric component 28 via a holder 64 that can be moved up and down with respect to the mounting head 60. The mounting head 60 further has an F-mark camera 66 (see FIG. 3) for imaging a fiducial mark (hereinafter referred to as an F mark) as a reference provided on the printed circuit board 16.
And a parts camera 68 that images the electric component 28 are immovably provided. The F mark camera 66 and the parts camera 68 are CCD cameras. F mark camera 6
An illumination device 70 is provided corresponding to the number 6, and illuminates the F mark and its surroundings. The F mark camera 66 captures an image of the F mark from an opening formed at the center of the lighting device 70. The holder 64 is provided with a backlight 71 for illuminating the electric component 28 sucked by the suction nozzle 62 from behind, and the parts camera 68 can acquire a silhouette image of the electric component 28 with the backlight 71 as a bright background. .

As shown in FIGS. 3 and 4, the X-axis slide 34 has two prisms 7 as two reflecting devices.
2 is fixed, and constitutes an imaging system together with the parts camera 68. These prisms 72 are located at positions corresponding to the ball screws 40 that move the X-axis slide 34 in the Y-axis direction below the X-axis slide 34, and the feeder-type electric component supply device 20 and the printed circuit board 1
6 and between the tray-type electric component supply device 22 and the printed circuit board 16.

The structures of these prisms 72 are the same.
As shown in FIG.
The prism 72 is fixed to the axial slide 34, and the prism 72 is positioned at about 45 degrees with respect to a vertical plane including the center line of the suction nozzle 62 just below the movement path of the mounting head 60 in the Y-axis direction.
The reflection surface 76 is inclined in such a manner as to become lower as the part is farther from the X-axis slide 34, and is inclined symmetrically with respect to the reflection surface 76 and the vertical plane immediately below the movement path of the parts camera 68 in the Y-axis direction. And a reflection surface 78.

The X-axis slide 34 of the casing 74
A shutter 80 is fixed to the outer surface opposite to the side. The size of the shutter 80 in the Y-axis direction is the reflection surfaces 76 and 78.
The projection is upwardly projected from the casing 74, and the protruding end is bent horizontally toward the X-axis slide 34 to form a shielding portion 82 that protrudes between the reflection surface 78 and the part camera 68. . A cutout 84 is provided at the center of the shielding portion 82 in the Y-axis direction. Therefore, when the Y-axis slide 44 moves, the parts camera 6
8 moves on the shielding portion 82, and when passing through the notch 84, the reflected light from the reflecting surface 78 is obtained.
The size of the notch 84 in the X-axis direction is large enough to allow the entire image forming light reflected from the reflecting surface 78 to pass therethrough, and the size of the notch 84 in the Y-axis direction is the moving speed v of the part camera 68 in the Y-axis direction. Is multiplied by the exposure time t.

As shown in FIGS. 1 and 3, there are four mounting positions 102 on the substrate conveyor 18 where test chips 100 (see FIG. 4) for testing mounting accuracy, which will be described later, are mounted.
And a test chip 100 is provided at each mounting position 102.
Are respectively mounted. The board conveyor 18 has guide rails 104 for guiding a pair of belts (not shown). By changing the distance between the guide rails 104, the printed board 16 having different dimensions can be conveyed. , Those guide rails 104
The two mounting positions 10 are located at positions on the upper surface of the substrate adjacent to the printed circuit board 16 positioned at the component mounting position.
2 is provided.

The mounting positions 102 are not four, but one.
Or a plurality of appropriate locations. Further, the test chips 100 may be placed one by one at each placement position 102 or a plurality of the test chips 100 may be placed. Further, the inspection chip 100 may be dedicated to each of the mounting positions 102, and may be a plurality of mounting positions 1.
02 may be shared. In the present embodiment, it is assumed that one dedicated inspection chip 100 is provided at each mounting position 102.

Inspection chip 100 in this embodiment
Is a small piece of plastic called a gauge chip.
It has a rectangular shape with a planar shape and dimensions of 3 mm x 6 mm, but the electrical components to be mounted may be used as inspection chips, or a quartz glass inspection chip manufactured with high dimensional accuracy. May be used.

The present electric component mounting system includes a control device 110 shown in FIG. 5 as control means. The control device 110 includes a CPU 112, a ROM 114, a RAM 116
And a computer having a bus 118 for connecting them. An image input interface 122 is connected to the bus 118, and the F mark camera 6
6 and the parts camera 68 are connected. Bus 11
8 also has a servo interface 124 connected thereto,
An X-axis servomotor 42 and a Y-axis servomotor 52 are connected. A digital input interface 126 is also connected to the bus 118. Further, a digital output interface 128 is connected to the bus 118, and the board conveyor 18, the feeder type electric component supply device 20, the tray type electric component supply device 22, the electric component mounting device 30, and the like are connected to the bus 118. The ROM 114 contains the electric component 2
Various control programs are stored, including a mounting program for mounting 8 on the printed circuit board 16.
The program includes a mounting accuracy inspection program represented by the flowcharts of FIGS. 8 to 11.

Next, the operation will be described. The mounting operation for mounting the electric components on the printed circuit board 16 is described in Japanese Patent Application Laid-Open No. 6-291.
Since it is described in detail in Japanese Patent Application Publication No. 490, the entire description is simplified, and the parts deeply relevant to the present invention are described in detail. When the electric component 28 is mounted on the printed circuit board 16, the mounting head 60 moves the X-axis slide 34 and the Y-axis slide 44 to move the feeder-type electric component supply device 2.
0 or move to the component supply position of the tray-type electrical component supply device 22 to hold the electrical component 28. After the suction nozzle 62 is brought into contact with the electric component 28, a negative pressure is supplied to the suction nozzle 62, and the suction nozzle 62 sucks the electric component 28, and then the suction nozzle 62 is raised.

The mounting head 60 holding the electric components 28 is moved to the component mounting position along a straight line connecting the component supply position of the feeder 24 and the component mounting position of the printed circuit board 16 with the X-axis. The slide 34 passes over a prism 72 fixed at a position between the component supply position and the component mounting position. Regardless of whether the component supply position and the component mounting position are on the feeder-type electric component supply device 20 or the printed circuit board 16, the X-axis slide is required to move the mounting head 60 from the component supply position to the component mounting position. It moves in the Y-axis direction on 34 and passes through a portion between the feeder-type electric component supply device 20 and the printed circuit board 16. Therefore, the mounting head 60 always passes over the prism 72 fixed to the portion of the X-axis slide 34 located between the component supply position and the component mounting position.

At this time, the light forming the silhouette image of the electric component 28 with the backlight 71 as a bright background is reflected in the horizontal direction by the reflection surface 76 and then reflected upward by the reflection surface 78. The mounting head 60 is a prism 72
When passing above, the electric component 28 passes over the reflection surface 76, the parts camera 68 passes over the reflection surface 78, and enters the imaging surface through the notch 84 formed in the shielding portion 82 of the shutter 80. The part camera 68 captures a silhouette image of the electric component 28 by the image forming light.

The parts camera 68 is attached to the Y-axis slide 44 together with the suction nozzle 62,
2 to move integrally with the electrical component 28 held by
When the electric component 28 and the part camera 68 pass over the prism 72, the image forming light reflected by the reflection surface 78 follows the part camera 68, and the part camera 68 is electrically operated even during the movement of the Y-axis slide 44. Part 2
8 can be imaged in the same state as stationary. As described above, the length of the notch 84 of the shutter 80 in the Y-axis direction is a length obtained by multiplying the exposure time of the parts camera 68 by the moving speed, and the image pickup device is sufficiently exposed by the image forming light. Is imaged.

The data of the captured image is compared with data of a normal image having no holding position error in the control device 110, and a center position error ΔX, ΔY and a rotational position error Δθ are calculated. In addition, the horizontal position error Δ
X ′ and ΔY ′ are calculated by previously capturing an image of the F mark provided on the printed circuit board 16 by the F mark camera 66, and the movement of the electric component based on these errors until the F mark moves to the component mounting position. The electric component 28 is rotated while the distance is corrected, and the rotational position error Δθ
Is corrected, and the electric component 28 is mounted in the component mounting position of the printed circuit board 16 in a correct posture.

In parallel with the above processing, the mounting head 60 is moved to the component mounting position on the printed circuit board 16, and the suction nozzle 62 is lowered to mount the electric component 28 at the mounting position. Thus, one mounting operation is completed.

In the electric component mounting system according to the present embodiment, an inspection of the accuracy of the device is performed during the mounting operation of the electric component 28 described above. The mounting accuracy inspection program shown in the flowcharts of FIGS. 8 to 11 is executed. This mounting accuracy inspection program is always executed during the operation of the electrical component mounting system, and the progress of the mounting operation is monitored. Work inspection is performed.
Specifically, when all the electric components 28 to be mounted on one printed circuit board 16 have been mounted, and the printed circuit board 16 on which mounting has been completed is started to be carried out by the board conveyor 18, the mounting work inspection also starts. Then, the process is completed before the loading and positioning of the printed circuit board 16 on which the electric component 28 is to be mounted is completed.

When the mounting accuracy test is started, first, the mounting head 60 is moved to a position corresponding to one of the four mounting positions 102 (for example, the closest one). In the same manner as when the electric component 28 is sucked from the feeder 24 by the suction nozzle 62, the mounting position 1 is set in advance.
The inspection chip 100 placed on the substrate 02 is sucked. The inspection chip 100 is moved to a first imaging position where the suction member is imaged while being suctioned by the suction nozzle 62. The first imaging position is a position corresponding to the one of the two prisms 72 that is closer to the mounting position 102 where the inspection chip has been sucked this time. The mounting head 60 is reciprocated two times after passing over the prism 72, and the suction nozzle 62 is rotated by 90 degrees at positions deviated from the notches 84 of the shutter 80. The inspection chip 100 is imaged at the rotational position.

The center coordinates of the image of the inspection chip 100 are calculated based on the four pieces of image data obtained by the imaging. As shown in FIG. 6, it is assumed that a coordinate plane set in advance with respect to the field of view 150 of the parts camera 68 (here, a coordinate plane with the center of the field of view as the origin O is set)
The part camera 6 draws a straight line that is orthogonal to the coordinate plane and passes through the origin.
8), the center coordinates of the image of the test chip 100 at each rotational position are acquired (in the figure, the test chip 100 is used).
Only one image is shown). Here, assuming that the center coordinates of the n-th (where n is an integer of 1 to 4) image data are (X _n , Y _n ), the average value of the center coordinates of the inspection chips 100 ( X _AVE ,
Y _AVE ) is calculated by the following equations (1) and (2).

X _AVE = (X ₁ + X ₂ + X ₃ + X ₄ ) / 4 (1) Y _AVE = (Y ₁ + Y ₂ + Y ₃ + Y ₄ ) / 4 (2)

Further, the average value (X _AVE ,
Y _AVE ) based on the suction nozzle 62 acquired in the past.
_Are rotationally coordinated (X _CENTER , Y _CENTER ) are integrated and new rotational center coordinates (X _CENTER , Y _CENTER ) are obtained. This integral correction will be described later in detail.

The calculation of the average value (X _AVE , Y _AVE ) of the center coordinates and the new rotation center coordinates (X _CENTER , Y _CENTER ) is performed while the mounting head 60 is moved toward the mounting position 102. The suction nozzle 62 is
Is rotated by 90 degrees, and the center position and orientation of the inspection chip 100 based on the newly acquired rotation center coordinates (X _CENTER , Y _CENTER ) and the image data of the inspection chip 100 acquired first. Is corrected, and thereafter, is placed at the original placement position 102. As described above, in the present embodiment, the inspection chip 100 is returned to the original mounting position 102, but when one inspection chip 100 is shared by the plurality of mounting positions 102, the inspection chip 100 The mounting position 10 different from the original mounting position 102
2 may be placed. However, it is necessary to store the mounting position 102 where the test chip 100 is actually mounted.

Next, the placed inspection chip 100 is
The image is taken by the mark camera 66. Mounting head 60
Is moved by the suction nozzle 62 from the position where the inspection chip 100 is placed on the mounting position 102 so that the F-mark camera 66 is located directly above the mounting position 102, and the inspection chip 100 is moved to the F mark. The image is taken by the camera 66. Here, since the relative position between the rotation center of the suction nozzle 62 and the F mark camera 66 is set in advance, if there is no error in the relative position, the inspection chip 100 is positioned at the center of the field of view of the F mark camera 66. Should be located, and the attitude of the inspection chip 100 should not be inclined. Therefore, as shown in FIG. 7, if the position shift (X, Y) of the center of the image of the inspection chip 100 from the center of the field of view 160 of the F mark camera 66 is detected, this is detected as the rotation center of the suction nozzle 62. This represents a relative positional deviation of the F mark camera 66 with respect to the center of the field of view (referred to as a relative positional deviation between the suction nozzle 62 and the F mark camera 66). Further, the posture of the inspection chip 100 assumed in advance (in the present embodiment, the direction of extension is
60 is detected relative to the field of view of the F mark camera 66 and the part camera 68, the relative phase shift (the relative angle between the field of view of the F mark camera 66 and the part camera 68) is detected. 68 (referred to as a relative phase shift with respect to 68).

The inspection chip 100 may be placed without being corrected. Inspection chip 10
If the posture of the suction nozzle 62 is not corrected, the calculation load associated with the correction of the posture is reduced, and the rotation angle error of the suction nozzle 62 and the suction nozzle 62 caused by the correction of the posture are reduced.
Without being affected by the calculation error of the change in the center position of the inspection chip 100 due to the rotation of the suction nozzle 62, the F mark camera 66, and the part camera 68, and the relative positional deviation between the part camera 68 and the F mark camera The relative phase shift can be detected. In other words, when it is desired to perform an accuracy inspection of the electric component mounting system including a rotation angle error of the suction nozzle 62 caused by the posture correction and a calculation error of a change in the center position of the test chip 100 due to the rotation of the suction nozzle 62. In other words, the position of the inspection chip 100 may be corrected and then mounted. further,
By inspecting the case where the inspection chip 100 is mounted with the posture corrected and the case where the inspection chip 100 is mounted without correction, and comparing the results of both inspections, the error caused by the posture correction and other errors can be reduced. May be detected separately.

As described above, the first relative position, which is the relative position of the suction nozzle 62 with respect to the parts camera 68,
A second relative position, which is a relative position based on a relative position shift between the suction nozzle 62 and the F mark camera 66, and a rotation inclination, which is a tilt based on a relative phase shift between the parts camera 68 and the F mark camera 66, are acquired. The preset first and second relative positions and rotational inclination are integratedly corrected. With the above, one mounting accuracy inspection is completed, and the electric component 2
The mounting operation for mounting 8 on the printed circuit board 16 is restarted.

The above mounting accuracy inspection will be described in more detail with reference to the flowcharts of FIGS. First, in steps S1 (hereinafter simply referred to as S1; the same applies to other steps) to S3, it is awaited that the mounting operation for mounting the electric component 28 on one printed circuit board 16 is started. In S1, the mounting start flag F
It is determined whether _START is 0 or not. The mounting start flag F _START has a value of 0 indicating that the start of the current mounting operation has not been detected, and a value of 1 indicating that the start of the mounting operation has already been detected. In this execution, the mounting start flag F
_{Since START} has an initial value of 0, the determination in S1 is YES, the process proceeds to S2, and it is determined whether or not the mounting work has been started. Assuming that the mounting operation has not been started, S2
Is NO, and one execution of this program ends. On the other hand, if the mounting work has started, S2
Is YES, and in S3, the mounting start flag F
_START is set to 1. In the subsequent execution of this program, the determination in S1 is NO, and the process skips to S4.

When the start of the mounting operation is detected, the process proceeds to S4
In steps S6 to S6, it is awaited that the mounting work is completed. Similarly to S1 and S2, when S4 and S5 are repeatedly executed to detect the end of the mounting work, the mounting end flag F _END is set to 1 in S6. In the subsequent execution of this program, the determination in S4 is NO, and S
Skip to 10.

When the end of the mounting work is detected, the execution of the next mounting work is prohibited in S7. Here, the next mounting operation refers to an operation using the mounting head 60, and the printed circuit board 1 not using the mounting head 60.
6 is allowed. The inspection of the mounting accuracy of this program is of a length that can be sufficiently completed during the loading / unloading operation of the printed circuit board 16, and the mounting operation is not started before the inspection of the mounting accuracy is completed. However, if the next mounting operation is performed before the end of the inspection, two inconsistent commands for the operation of the mounting head 60 will be output, and the suction nozzle 62 will be output.
Therefore, the execution of the next mounting work is prohibited during the inspection, just in case, because it may cause damage or the like.

Next, at S8, the suction nozzle 6 is set at the mounting position 102 where the test chip 100 is mounted in advance.
In order to image the inspection chip 100 with the parts camera 68 in S9, the mounting head 6
0 is moved to a first imaging position corresponding to one of the two prisms 72 closer to the mounting position 102.

Next, the mounting head 60 is reciprocated twice so as to pass over the prism 72, and the notch 8
The suction nozzle 62 is rotated by 90 degrees at positions deviating from the position 4, and the inspection chip 100 is imaged at each of the 0, 90, 180, and 270 rotation positions.

First, as shown in FIG. 9, whether the first imaging flag F ₁ is 0 is determined at S10. When the first imaging flag F ₁ is 0, the first imaging for imaging the inspection chip 100 four times with the parts camera 68 is not completed, and when the first imaging flag F ₁ is 1, the first imaging is already completed. Since in this run the first imaging flag F ₁ is the initial value 0 S10 the determination is YES, whether the imaging number n is 4 or less is the number of current imaging of the first imaging step in S11 Is determined. In this execution, if the number of times of imaging n is 1, the determination in S11 is YES. In S12, the mounting head 60
The n-th (n = 1 in this case) imaging is performed after passing through the imaging position, and in S13, the mounting head 60
It is stopped at a stop position that is separated from the first imaging position by a fixed distance 1 in the Y-axis direction. The direction in which the mounting head 60 is moved is opposite between the case where the number of times of imaging n is an even number and the case where the number of imagings n is an odd number.
The distance 1 from the imaging position is equal. Next, S14
, The suction nozzle 62 is rotated 90 degrees.

Next, in S15, the image acquired by the current (n-th) imaging is processed into image data n, and the center coordinates (X _n , Y _n ) of the inspection chip 100 are acquired.
In S16, 1 is added to the number of times of imaging n, and the number of times of imaging is set to a new number of times n. This completes one execution of the program. When S12 to S16 are repeatedly executed and the inspection chip 100 is imaged four times, the determination of S11 becomes NO and S17 when the present program is executed next time.
In step (1), the first imaging flag F1 is set to 1, and one execution of this program is completed. Thereafter, steps S11 to S17 are skipped until one accuracy check is completed.

The rotation and movement of the suction nozzle 62 are as follows.
In FIG. 9, for convenience, it is shown as being performed before and after in time, but actually, S13 and S14,
The image processing of S15 is performed in parallel. Of course, it may be performed in the order shown in FIG.

Next, when this program is executed, FIG.
As shown in S18, in S18, S12 to S16
Center coordinates of the inspection chip 100 obtained in
(X _n, Y_n) Is read. And S19
Therefore, based on the above-described equations (1) and (2),
Four center coordinates (X_n, Y_n) Average (X_AVE, Y_AVE)But
Calculated in step S20, using one of the past true eigenvalues.
A certain past rotation center coordinate (X_CENTER, Y_CENTER) Read
Will be issued. Here, the eigenvalue refers to each electrical component mounting system.
Values that are unique to the stem, and true eigenvalues in the past
A place for the first mounting accuracy inspection after starting operation of the component mounting system
In this case, the settings set in advance for the electrical component mounting system
It is a constant eigenvalue, and in the second and subsequent mounting accuracy inspections
It means the unique value obtained based on the previous inspection.

In S21, the past rotation center coordinates (X
_CENTER , Y _CENTER ) is corrected based on the average value (X _AVE , Y _AVE ) of the center coordinates of the test chip 100 and the correction index N. Specifically, based on the following equations (3) and (4), the new rotation center coordinates (X _CENTER , Y
_CENTER ) is obtained. The correction index N is 1 at the start of the operation of the electric component mounting system, and is a natural number of 6 or less to which 1 is added every time the inspection is performed while the system is continuously operated. When the correction index N is increased to 6, the value is maintained while the electric component mounting system is continuously working.

X _CENTER = (X _AVE −X _CENTER ) / 2 ^(N−1) + X _CENTER (3) Y _CENTER = (Y _AVE −Y _CENTER ) / 2 ^(N−1) + Y _CENTER. (4)

Next, in S22 and S23, the suction nozzle 62 rotates and moves to the mounting position 102. Specifically, the suction nozzle 62 is rotated, and the test chip 100 sucked by the suction nozzle 62 is placed at the mounting position 102.
And the center of the test chip 100 is moved to a position that coincides with the center of the mounting position 102. In FIG. 10, the rotation and movement of the suction nozzle 62 are shown to be performed before and after time for convenience.
The final part of S15 (the fourth image processing of the imaging result and the rotation of the suction nozzle 62 from 270 degrees to 360 degrees) and the image processing of S18 to S21 are performed in parallel. Of course, the processing may be performed in the order shown in FIG.

Next, in S24, the inspection chip 100
Is placed on the placement position 102. In S25 shown in FIG. 11, the inspection chip 100 is
A second imaging step for imaging is performed. In S26, the center coordinates and the inclination of the inspection chip 100 are acquired based on the image data acquired in the second imaging step. A coordinate plane set in advance within the field of view 160 of the F mark camera 66 (here, a coordinate plane having the origin at the center of the field of view 160 is set, and is orthogonal to the coordinate plane;
The straight line passing through the origin is referred to as the optical axis of the F mark camera 66). The center coordinates (X, Y) of the inspection chip 100 on the
The inclination θ about the optical axis of the mark camera 66 is obtained.

Subsequently, in S27, the center coordinates (X, Y) and the inclination θ of the inspection chip 100 are determined by the relative displacement between the rotation center of the suction nozzle 62 and the F mark camera 66, and the F mark camera 66 and the parts. Camera 6
8 relative phase shift. On the basis of the center coordinates of the inspection chip 100 and the rotation center coordinates of the suction nozzle 62 acquired in S12 to S19, the inspection chip 100 has its center set to the F mark camera 6 in S24.
6 should be placed so as to correspond to the center of the field of view and coincide with the phase of the coordinate plane. Therefore,
The current relative position of the suction nozzle 62 with respect to the F-mark camera 66 is a value shifted by (X, Y) in the horizontal direction with respect to the past true eigenvalue set immediately before, and the parts camera of the F-mark camera 66 The relative phase to 68 is
The value is shifted by θ around the optical axis with respect to the past true eigenvalue set immediately before.

Next, at S28, the past true eigenvalue
Of the suction nozzle 62 with respect to the F mark camera 66
Center coordinates (X₀, Y₀) And F mark camera 66
Rotation phase θ for the camera 68₀Is read. S
29, the following equations (5) to (7) are used.
New rotation center coordinates (X₀, Y₀) And rotation phase θ ₀
Is obtained.

X ₀ = X / 2 ^(N-1) + X ₀ (5) Y ₀ = Y / 2 ^(N-1) + Y ₀ (6) θ ₀ = θ / 2 ^{(N− 1)} + θ ₀ ... (7)

In S30, it is determined whether the correction index N is smaller than 6. In the execution of this program, if the correction index N is 1, the determination in S30 is Y
It becomes ES, and in S31, 1 is added to the correction index N to make a new correction index N. On the other hand, if the correction index N is 6, the determination in S30 is NO and S3
Skip to 2. In the present embodiment, immediately after the operation of the electric component mounting system is started, the value between the past unique value and the latest detected value to respect the newly detected value and the latest detected value is used. However, if the number of corrections increases, correction is performed so as to obtain a value close to that value while respecting past eigenvalues.

Here, in the present embodiment, the upper limit of the correction index N is set to 6. However, if the correction index becomes 7 or more, the correction value for correcting the past eigenvalue becomes too small and the eigenvalue becomes smaller. Since it is not possible to sufficiently follow even a gradual change, the upper limit of the correction index N is determined to avoid such a change.

Next, in S32, each flag F _START ,
Is the F _END and F ₁ is 0, the imaging count n is set to 1.
In S33, the prohibition of the next mounting operation is released, and the start of the mounting operation is permitted. This completes one execution of the program.

As is apparent from the above description, in the electric component mounting system of the present embodiment, the F mark camera 66 constitutes the “second image pickup device”, and the parts camera 68 constitutes the “first image pickup device”. are doing. Further, in the mounting accuracy inspection program, S12 to S16 constitute a “first imaging step”, S18 to S21 constitute a “first image processing step”, S22 to S24 constitute a “mounting step”, S25 constitutes a “second imaging step”, and S26 to S29 constitute a “second image processing step”.
Is composed.

In the present embodiment, the parts camera 68
, The relative position of the suction nozzle 62 with respect to the F-mark camera 66, and the relative phase shift of the parts camera 68 with respect to the F-mark camera 66 are detected and corrected. Is obtained. The F mark camera 66 can detect the relative position shift and the relative phase shift with respect to the mounting device main body by another method in advance. For example, at least one mark for detecting the relative position shift and the relative phase shift of the F mark camera 66 is fixedly provided on the mounting device, and the mark is
The image is taken by the mark camera 66 an appropriate number of times, and the relative position shift and the relative phase shift of the F mark camera 66 are calculated from the data of the taken image.

More specifically, for example, an F mark camera 66
Are mounted parallel to the X and Y movement directions, two straight lines passing through a plurality of F marks arranged vertically and horizontally in the image data are parallel to the X and Y axes. However, when the F mark camera 66 is mounted in a state rotated about a vertical axis, the straight lines intersect the X and Y axes. X,
The average value of the inclination of the straight line with respect to the Y axis is obtained as the inclination of the F mark camera 66 with respect to the mounting device main body.

In this embodiment, since the attitude of the inspection chip 100 sucked by the suction nozzle 62 in S23 is corrected, the chip 100 is mounted on the mounting position 102, and thus obtained in the second imaging step. The slope θ
Both the relative phase shift between the F mark camera 66 and the parts camera 68 and the rotation error of the suction nozzle 62 are included.
In contrast, S23 is skipped and the suction nozzle 62
If the inspection chip 100 sucked to the camera is mounted at the mounting position 102 without correcting the attitude, only the relative phase shift between the F mark camera 66 and the parts camera 68 can be detected. Further, the case where S23 is skipped and the case where S23 is executed are executed alternately, and the F mark camera 66 and the parts camera 68 are obtained from both detection results.
, And the rotation error of the suction nozzle 62 can be detected separately.

Further, according to the present embodiment, immediately after the operation of the electric component mounting system is started, the value between the past unique value and the latest detected value is used in order to respect the actually detected value. And get a value close to the latest detection value,
It is possible to sufficiently cope with a change in the eigenvalue due to a temperature change or the like. Furthermore, if the number of corrections increases, the past eigenvalues are respected and values close to the eigenvalues are obtained, thereby reducing the influence of the detection error included in the latest detection value when the change in the eigenvalues decreases. Can be.

On the other hand, when the variation of the eigenvalue during operation does not decrease with the passage of time and is larger than the detection error, a new eigenvalue is acquired by respecting the latest detected value from the eigenvalue acquired in the past. It is desirable to be done.

Further, in the above embodiment, the mounting accuracy of the electric component mounting system is inspected every time one printed circuit board is mounted. Alternatively, the inspection may be performed every time a fixed time elapses (strictly, at the time of the first printed circuit board replacement after the elapse of the certain time) irrespective of the number of mounted printed circuit boards. For example, when the power is supplied to the electric component mounting system and the system is started up, the inspection is performed. Thereafter, every five minutes, the first time after the lapse, the loading / unloading of the printed circuit board is performed. An inspection can be performed.

Further, in the above-described embodiment, the correction index N for correcting the past true eigenvalue based on the latest detected value is determined based on the number of times the eigenvalue has been corrected. However, the correction index N may be fixed. In this case, it is desirable that the frequency of performing the mounting accuracy detection and correcting the eigenvalue be changed according to the number of printed circuit boards 16 on which the electric components 28 are mounted and the elapsed time. For example, during the first hour from the start of operation, the eigenvalue change is large, so that the eigenvalue is frequently corrected. After that, the eigenvalue change subsides, so that the frequency of correction is reduced, which is more than necessary. That is, the correction is not performed at this time.

In the above embodiment, when the mounting accuracy is inspected, the mounted inspection chip 100 is always imaged, and the coordinates (X, Y) of the center of the inspection chip 100 with respect to the center of the field of view of the F mark camera 66. ) And the inclination θ are detected. However, in the electric component mounting system of the above embodiment, the suction nozzle 62, the F mark camera 66, and the parts camera 68 are fixedly mounted on the mounting head 60 and cannot move relative to each other. Can be considered almost constant. Therefore, changes in the relative position between the suction nozzle 62 and the F mark camera 66 and the relative phase between the F mark camera 66 and the parts camera 68 are so small as to be negligible, and the center coordinates (X, Y) and the inclination θ are substantially small. The center coordinate (X, Y) and the inclination θ are assumed to be constant when the mounting accuracy is first inspected.
May be acquired, and in the subsequent mounting accuracy inspection, the value acquired first may be used. The center coordinate (X, Y) and inclination θ each time the mounting accuracy is inspected a plurality of times.
May be acquired or the frequency of acquisition may be changed. After the correction amount of the center coordinate (X, Y) and the inclination θ becomes equal to or less than a specified value, the center coordinate (X, Y) is obtained. ) And the acquisition of the inclination θ may be omitted.

In the above embodiment, when checking the mounting accuracy, the rotation center coordinates (X
_CENTER , _YCENTER ). However, in the electric component mounting system of the above embodiment, the suction nozzle 62 and the parts camera 68 are fixedly mounted on the mounting head 60 and relatively immovable, and are fixed to the X-axis slide 34. Prism 72
Therefore, it can be considered that the positional deviation of the image due to the deviation of the reflection path is negligibly small. Therefore, it is considered that the position of the suction nozzle 62 with respect to the parts camera 68 is substantially constant, and when the mounting accuracy is first inspected, the inspection chip 100 is rotated to set the rotation center coordinates (X _CENTER , Y _CENTER ). The acquired value may be used in the subsequent mounting accuracy inspection using the acquired value. The rotation center coordinates may be acquired each time the mounting accuracy is inspected a plurality of times, or the frequency of acquisition may be changed. After the correction amount of the rotation center coordinates becomes equal to or less than a specified value, the rotation center coordinates are obtained. The acquisition of the center coordinates may be omitted.

Further, the parts camera 6 of the suction nozzle 62
It is not indispensable to acquire the relative position with respect to the 8 and F mark camera 66, and only the relative position and relative phase between the parts camera 68 and the F mark camera 66 may be detected using the inspection chip 100 as a medium. In that case, the inspection chip 100 is imaged once by the parts camera 68 and the parts camera 68 at the center of the inspection chip 100 is taken.
The coordinates and phase in the coordinate plane are obtained, the posture and the like of the inspection chip 100 are corrected, and the chip is mounted on the mounting position. In this case, the chip 100 for inspection should be placed so that the center of the chip 100 for inspection corresponds to the center of the field of view of the F mark camera 66 and the phase becomes ideal. The deviation of the center position and the phase deviation of the captured image of the inspection chip 100 are deviations from the relative position and relative phase between the parts camera 68 and the F mark camera 66 among the past true eigenvalues set immediately before. Will be. Since the position shift based on the relative position shift of the suction nozzle 62 is absorbed by the relative position shift between the parts camera 68 and the F mark camera 66,
This method also makes it possible to inspect the mounting accuracy.

In the above embodiment, the mounting accuracy inspection program is executed independently of the main program (that is, the electric component mounting program). On the other hand, the mounting accuracy inspection program may be incorporated in the main program, or a part of the mounting accuracy inspection program, for example, a portion for monitoring the timing of starting the accuracy inspection may be incorporated in the main program. ,
The accuracy inspection program may be executed based on a signal output from the portion.

In the electric component mounting system of the above embodiment, one suction nozzle 62 is provided on the mounting head 60, and the relative positions of the suction nozzle 62, the parts camera 68 and the F mark camera 66 are acquired. Mounting head 6
0, a rotary table is provided, and a plurality of suction nozzles 62 are provided on the rotary table at a fixed distance from the center of rotation thereof at equal angular intervals. The relative position with respect to the F mark camera 66 may be obtained.

It is to be noted that the first imaging step can be performed in another mode. In this aspect, in the first imaging step, the mounting head 60 is stopped at the first imaging position, and the inspection chip 100 is rotated 90 degrees four times at that position, and an image is taken at each rotation position. In this case, the imaging timing at which the inspection chip 100 is imaged by the parts camera 68 is controlled by, for example, an electronic shutter. Here, the electronic shutter is for erasing the electric charge when the electric charge is charged in each imaging element. The electronic shutter erases all the electric charges charged in each imaging element at the start of each imaging, and performs exposure for a certain time (1/100 second in this embodiment) to image the electric component. . The details will be described below.

[0069] As shown in FIG. 12, whether the first imaging flag F ₁ is 0 is determined in S110, S11
In 1, it is determined whether or not the number n of times of imaging, which is the number of times of the current imaging, in the first imaging step is 4 or less. In this execution, if the number of times of imaging n is 1, S111
Is YES, and the n-th (in this case, n = 1) imaging is performed in S112. Next, in S113, the image acquired by the n-th imaging is the image data n
Is stored in the RAM 116 of the computer. S1
At 14, the image data n is processed and the inspection chip 10 is processed.
The center coordinates (X _n , Y _n ) of 0 are obtained.

In S115, the suction nozzle 62 is rotated by 90 degrees, and in S116, 1 is added to the number of times of imaging n to obtain a new number of times of imaging n. This completes one execution of the program. Steps S112 to S116 are repeatedly executed, and the inspection chip 100 is imaged four times. Next time the program is executed the determination of S111 is first image pickup flag F ₁ is 1 in the negative (NO) S117, thereafter S111 to S117 is skipped.

Further, in the electric component mounting system of the embodiment, the mounting head 60, the part camera 68, and the F mark camera 66 are integrally movable in the X and Y directions. Is X axis slide 3
The present invention can also be applied to an electric component mounting system fixedly provided in the apparatus 4. FIG. 13 shows an example of the electric component mounting system of this embodiment. A suction nozzle 62 is held by a mounting head 200 via a holder 64, and an F mark camera 66 is immovably mounted. The X-axis slide 34 has a set of reflecting mirrors 20 as a reflecting device.
2, 204 are fixed by brackets (not shown). One reflecting mirror 202 is tilted by about 45 degrees with respect to a vertical plane including the center line of the suction nozzle 62 just below the moving path of the mounting head 200 in the Y-axis direction,
The end closer to the shaft slide 34 has a reflecting surface 206 positioned below. On the other hand, the other reflecting mirror 204 is
On the opposite side of the X-axis slide 34, there is provided a reflection surface 208 that is inclined symmetrically with respect to the reflection surface 206 of the reflection mirror 202 and the vertical plane, and whose end near the X-axis slide 34 is located below. These reflecting mirrors 202 and 204 are provided with an X-axis slide 34.
At a position above the ball screw 40 for moving the feeder-type electric component supply device 20 and the printed board,
And it is provided at a position between the tray-type electric component supply device 22 and the printed board. At a position opposite to the side on which the mounting head 200 of the X-axis slide 34 is provided and facing the reflecting surface 208 of the reflecting mirror 204,
A parts camera 210 that images the inspection chip 100 held by the suction nozzle 62 is fixed.

In such an electric component mounting system, the relative position of the parts camera 210 in the Y-axis direction with respect to the suction nozzle 62 and the F mark camera 66 is not fixed, and the relative position may change with time. There is. For this reason, in the present embodiment, the suction nozzle 62
It is desirable to periodically detect a relative position with respect to the parts camera 210.

Further, as shown in FIG. 14, a parts camera 250 is fixedly and upwardly provided on the base 10, and the suction nozzle 62 and the F mark camera 66 can be integrally moved in the X and Y axis directions. May be. Also in that case, since the relative positions of the parts camera 250 with respect to the suction nozzle 62 and the F mark camera 66 are not fixed,
The same can be said for the above embodiment.

Further, the present invention can be applied to an electric component mounting system of another aspect. For example, FIG.
As shown in FIG. 5, the electric components are held by suction nozzles 62 supported on an index table provided rotatably and immovably about a vertical axis, and the circuit base material is moved onto the surface of the circuit base material by the base material moving device. The mounting accuracy can be inspected even in a so-called index mounting system in which the electric component is mounted at an arbitrary position on the circuit board by being moved in a parallel direction. Hereinafter, the index type wearing system will be briefly described.

In the figure, reference numeral 302 denotes an electric component mounting device, and 304 denotes an electric component supply device. The electric component mounting apparatus 302 includes an index table 306 that rotates intermittently about a vertical axis. The index table 306 holds the plurality of suction heads 62 at equal angular intervals, and is intermittently rotated by an intermittent rotation device including an index servomotor, a cam, a cam follower, and a rotating shaft (not shown), and the suction heads 62 are sequentially rotated. It is moved to an operation position such as a component supply position (component removal position), a component posture detection position, a component posture correction position, or a component mounting position. The plurality of suction heads 62 are sequentially positioned at the operation position and perform various operations necessary for mounting the electric component on the printed circuit board 16.

The electric component supply device 304 has a feeder support 330 and a plurality of electric component feeders 24 mounted thereon. A plurality of electric component feeders 24
Are supported by the feeder support 330 in a state where the component supply units are arranged along one straight line (the direction of this straight line is defined as an X direction) in a horizontal plane. The feeder support 330 is
When the ball screw 334 is rotated by the X-axis servomotor 336, the ball screw 334 is moved in the X-axis direction along the pair of guide rails 338, whereby the component supply section of the electric component feeder 24 is selectively moved to the component supply position. Moved. The ball screw 334, the X-axis servo motor 336, and the like constitute a support base moving device 340.

The printed board 16 has an XY table 350
Printed circuit board positioning and supporting device 352 having
X, which is supported by a positioning support device 352).
It is moved to an arbitrary position in the Y plane. The positioning support device 352 is provided on the base 354 together with the electric component mounting device 302 and the electric component supply device 304. The positioning support device 352 receives the printed circuit board 16 from a carry-in device (not shown). Deliver to device. Each of the carry-in device and the carry-out device has a belt conveyor, and conveys the printed circuit board 16 in the X direction. The XY table 350 is configured to rotate the ball screw 356 provided on the base 354 by the X-axis servomotor 358 so that the pair of guide rails 36
X table 36 that is linearly moved in the X direction along 0
And a Y table 370 provided on the X table 362 and linearly moved in the Y axis direction along the pair of guide rails 368 by rotating the ball screw 364 by the Y axis servo motor 366. ing. A plurality of mounting positions 102 are provided on the Y table 370 at positions not interfering with the printed circuit board 16. The servo motor as a drive source is an electric rotary motor capable of controlling the rotation angle with high accuracy, and a step motor may be used instead of the servo motor. Further, a linear motor may be used instead of the electric rotary motor. The F mark camera 372 is fixedly attached to the apparatus main body so as to face vertically downward.

In this embodiment, parts camera 380
Is fixedly provided at a position corresponding to the component posture detection position of the suction nozzle 62 by a support device (not shown).
Specifically, a light guide device 382 is provided immediately below the stop position of the suction nozzle 62, and the light guide device 382 is aligned with the rotation center of the index table 306 and a straight line passing through the suction nozzle 62 at the component posture detection position. It is provided horizontally. Although not shown, the light guide device 382 includes a pair of reflectors, and the input-side reflector is formed so as to be located directly below the suction nozzle 62, and the output-side reflector is located outside the index table 306. Is formed. The light guide device 382 is configured to output image forming light vertically upward from the output side by the pair of reflecting mirrors. A parts camera 380 is disposed vertically above the output side of the light guide device 382. Since the parts camera 380 obtains an image reflected by the pair of reflecting mirrors, it is possible to obtain an image similar to that obtained by directly capturing an image at a position facing the suction nozzle 62. Moreover, since the light guide device 382 is provided along one ray, it is possible to capture an image in a direction corresponding to the direction in a state where the suction nozzle 62 has reached the component mounting position. The component posture detection position is set between the component supply position and the component mounting position, and is relatively close to the component supply position. Inspection chip 100
Is captured by the part camera 380 at the part posture detection position, the image processing is completed before the part posture correction position is reached.

In this electric component mounting system, the relative positions of the suction nozzles 62 and the parts camera 68 are not fixed as in the previous embodiment.
Is constantly changed in its relative position with respect to the parts camera 380. For this reason, in the present embodiment, in the inspection of the mounting accuracy, the inspection chip 100 sucked by each suction nozzle 62 is rotated a plurality of times, an image is taken at each rotation position, and the relative position between the suction nozzle 62 and the part camera 380 is determined. Is inspected.

Further, since the index table 306 is immovably provided, the mounting position of the suction nozzle 62 at which the electric component is mounted on the printed circuit board 16 is fixedly determined. The XY table 350 is moved and mounted so that the mounting positions on the printed circuit board 16 to be mounted face each other. Similarly, the test chip 100 is placed at the mounting position 102.
The XY table 350 is moved so that the mounting position 102 faces the suction head, and the test chip 100 is mounted. Therefore, in the electrical component mounting system according to the present embodiment, the mounting accuracy cannot be inspected in parallel with the unloading / loading operation of the printed circuit board 16 as a circuit base material. When one of the components of the component feeder 24 is lost and the table is replaced with another feeder support table, or when the setup of the electric circuit such as a printed circuit board to be assembled is changed, the mounting accuracy inspection is performed. In other words, the mounting operation is interrupted and the inspection is performed.

Although some of the embodiments of the present invention have been described in detail above, this is an exemplification, and the present invention is not limited to the above-described embodiment. [Effects of the Invention], and various modifications and improvements can be made based on the knowledge of those skilled in the art.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a part of an electric component mounting system according to a first embodiment of the present invention.

FIG. 2 is a side view of the electric component mounting system of FIG. 1;

FIG. 3 is a plan view of the electric component mounting system of FIG. 1;

FIG. 4 is an enlarged side sectional view showing a mounting head of the electric component mounting system.

FIG. 5 is a block diagram showing a control device of the electric component mounting system.

FIG. 6 is a diagram showing an image captured by a part camera of the electric system.

FIG. 7 is a diagram showing an image captured by an F mark camera of the electric system.

FIG. 8 is a flowchart illustrating an inspection start determination portion of a mounting accuracy inspection program executed by the control device.

FIG. 9 is a flowchart illustrating a first imaging step of the mounting accuracy inspection program.

FIG. 10 is a flowchart showing a first relative position acquisition and correction portion of the mounting accuracy inspection program.

FIG. 11 is a flowchart showing a second imaging step and second image processing of the mounting accuracy inspection program.

FIG. 12 is a flowchart illustrating a first imaging step in a mounting accuracy inspection program according to another aspect.

FIG. 13 is a side sectional view corresponding to FIG. 4 of an electric component mounting system according to another embodiment.

FIG. 14 is a plan view corresponding to FIG. 3 of an electric component mounting system according to yet another embodiment.

FIG. 15 is a plan view of an electric component mounting system according to still another embodiment.

[Explanation of symbols]

16: Printed circuit board 18: Board conveyor 28:
Electrical component 30: Electrical component mounting device 32: Guide rail 34: X-axis slide 36: Guide block 38: Nut 40: Ball screw 42: X
Axis servo motor 44: Y axis slide 48: Ball screw 50: Nut 52: Y axis servo motor 58: Guide rail 60: Mounting head 62: Suction nozzle 6
6: F mark camera 68: Parts camera 10
0: Test chip 102: Placement position

Claims (9)

[Claims] 1. A component holder for holding an electric component, a substrate supporting device for supporting a circuit substrate, a first imaging device for imaging at least a part of the electric component held by the component holder, A second imaging device for imaging at least a part of the circuit substrate supported by the substrate supporting device, the accuracy of a portion related to the mounting accuracy of an electrical component mounting system for mounting an electrical component on the circuit substrate. A method for inspecting, comprising: holding an inspection chip in the component holder, imaging at least a part of the inspection chip held in the component holder by the first imaging device, The inspection chip is mounted on the mounting position, and at least a part of the mounted inspection chip is imaged by the second imaging device,
The component holder, the first imaging device, and the second imaging device are used based on the imaging result of the first imaging device and the imaging result of the second imaging device.
An accuracy inspection method for an electric component mounting system, comprising a step of detecting a relative position shift of at least one of two other imaging devices with respect to one of the imaging devices. 2. The method according to claim 1, wherein a relative displacement between the inspection chip and at least one of the component holder and the first image pickup device is obtained from an image pickup result of the first image pickup device. The accuracy inspection method according to claim 1, further comprising a step of acquiring a relative displacement between the second imaging device and the mounted inspection chip from the result. 3. The component holder, the first imaging device and the second imaging device.
3. The accuracy inspection method according to claim 1, wherein the step of detecting a relative position shift of the imaging device includes a step of detecting a relative position shift of at least one of the component holder of the second imaging device and the first imaging device. 4. . 4. An electric component is held by a component holder, and the component holder is moved in a direction parallel to a surface of a circuit substrate fixedly supported by a substrate supporting device, so that the electric component is mounted on a circuit board. A method for inspecting the accuracy of an electrical component mounting system for mounting on a material, wherein during the operation of the electrical component mounting system, a delay occurs in a currently performed mounting operation among components of the electrical component mounting system. An accuracy inspection method for an electrical component mounting system, wherein an accuracy inspection of a portion related to the mounting accuracy of an electrical component of the electrical component mounting system is performed by using a component that can be used without causing an error. 5. The component holder according to claim 1, wherein the mounting of the electric component to one of the circuit substrates is completed, and the carrying out of the circuit substrate after the completion of the mounting and the carrying in of the next circuit substrate are performed. 5. The accuracy inspection method according to claim 4, wherein the inspection of the accuracy of the electrical component mounting system is performed by mounting the inspection chip at the mounting position according to (1), and acquiring the mounting position error. 6. 6. A method for inspecting the accuracy of an electric component mounting system for mounting an electric component on a circuit substrate while holding the electric component by a component holder, comprising: A method for inspecting the accuracy of an electric component mounting system, wherein a plurality of detected eigenvalues are detected at intervals and integrated to process a plurality of acquired eigenvalues into a true eigenvalue. 7. The accuracy inspection method according to claim 6, wherein each of the plurality of detections of the eigenvalue is performed with an operation of mounting the electric component on the circuit substrate therebetween. 8. In an electric component mounting system for mounting an electric component on a circuit substrate while holding an electric component by a component holder, an inspection program for inspecting a portion related to the mounting accuracy of the electric component mounting system by a computer. A holding step of holding the inspection chip on the component holder; a first imaging step of causing the first imaging device to image at least a part of the held inspection chip; A mounting step of moving the test chip to the mounting position and mounting the test chip; a second imaging step of imaging at least a part of the mounted test chip by a second imaging device; A relative displacement between the inspection chip and at least one of the component holder and the first imaging device is obtained based on the obtained image data. A first image processing step, and a second image processing step of acquiring a relative displacement between the inspection chip and the second imaging device based on image data obtained by the second imaging device. A recording medium on which a program is recorded so as to be readable by a computer. 9. A component holder for holding an electric component, and a moving device for relatively moving the component holder and a circuit substrate on which the electric component is to be mounted in a direction parallel to a surface of the circuit substrate. A first imaging device capable of imaging at least a part of an electric component held by the component holder, a second imaging device capable of imaging at least a portion of the circuit substrate, the component holder, and a moving device , First imaging device and second imaging device
A control device for mounting the electric component on the circuit substrate by controlling an imaging device, wherein the control device causes the component holder to hold a test chip, and the test chip After the first imaging device captures an image of at least a part of the inspection chip, the inspection chip is mounted on the component holder at a predetermined mounting position, and at least a part of the mounted inspection chip is mounted on the second holder. The imaging device is caused to take an image, and based on the data of the image acquired by the first imaging device, a relative displacement between the inspection chip and at least one of the component holder and the first imaging device is acquired, and the second position is acquired. An electric component mounting system, comprising: an inspection control unit that acquires a displacement between an inspection chip and a second imaging device based on image data acquired by an imaging device.