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JP2001292014A - Manufacturing method of irreversible circuit element - Google Patents

Manufacturing method of irreversible circuit element

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Publication number
JP2001292014A
JP2001292014A JP2000105074A JP2000105074A JP2001292014A JP 2001292014 A JP2001292014 A JP 2001292014A JP 2000105074 A JP2000105074 A JP 2000105074A JP 2000105074 A JP2000105074 A JP 2000105074A JP 2001292014 A JP2001292014 A JP 2001292014A
Authority
JP
Japan
Prior art keywords
resin member
elastic resin
permanent magnet
manufacturing
circuit device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000105074A
Other languages
Japanese (ja)
Inventor
Takefumi Terawaki
武文 寺脇
Manabu Yoshimoto
学 由本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Proterial Ltd
Original Assignee
Hitachi Metals Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Metals Ltd filed Critical Hitachi Metals Ltd
Priority to JP2000105074A priority Critical patent/JP2001292014A/en
Publication of JP2001292014A publication Critical patent/JP2001292014A/en
Pending legal-status Critical Current

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  • Non-Reversible Transmitting Devices (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method of an irreversible circuit element that can enhance the connection reliability, the workability and the productivity at the time of manufacturing. SOLUTION: This manufacturing method for the irreversible circuit element has an assembly provided with a magnetic yoke, a permanent magnet, a center conductor and a magnetic body, and an elastic resin member that is characterized in that an adhesive layer is provided to one major side of the permanent magnet, a compound of the permanent magnet and the elastic resin member is placed in metallic dies, vulcanization forming is applied thereto and the elastic resin member and the permanent magnet are adhered.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、高周波信号に対し
て非可逆伝送特性を有する非可逆回路素子の製造方法に
関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a non-reciprocal circuit device having a non-reciprocal transmission characteristic for a high-frequency signal.

【0002】[0002]

【従来の技術】従来、マイクロ波帯、UHF帯で使用さ
れる携帯電話、自動車電話等の送受信回路部品の一つと
してアイソレータ,サーキュレータ等の非可逆回路素子
がある。このような非可逆回路素子の構造と製造方法に
ついて以下説明する。
2. Description of the Related Art Hitherto, non-reciprocal circuit devices such as isolators and circulators have been known as one of transmission / reception circuit components used in a microwave band and a UHF band for mobile phones, automobile phones and the like. The structure and manufacturing method of such a non-reciprocal circuit device will be described below.

【0003】図5はアイソレータの構造を示す分解斜視
図で示す。このアイソレータは、上ヨーク1、磁石2、
組立体20、平板コンデンサ8、9、10、ダミー抵抗
11、樹脂ケース7、下ヨーク12から構成されてい
る。組立体20は、円板状のシールド板から放射状に3
つの中心導体4、5、6が突出した構造の導電板にフェ
ライト円板(磁性体)3を配置し、3つの中心導体4、
5、6を絶縁状態で折り曲げて重ねて構成される。
FIG. 5 is an exploded perspective view showing the structure of an isolator. This isolator has an upper yoke 1, a magnet 2,
It comprises an assembly 20, plate capacitors 8, 9, and 10, a dummy resistor 11, a resin case 7, and a lower yoke 12. The assembly 20 radially extends from the disk-shaped shield plate.
A ferrite disk (magnetic material) 3 is disposed on a conductive plate having a structure in which three center conductors 4, 5, and 6 protrude.
5 and 6 are formed by bending and overlapping in an insulating state.

【0004】樹脂ケース7は、0.1mm程度の導体板
と耐熱性を備えたエンジニアリングプラスチックを一体
成形した構造のもので、その中央に組立体20を配置す
る円形状の凹部13aを有し、その周囲に平板コンデン
サやダミー抵抗が配置される凹部13b、13c、13
dを有する。この凹部13b、13c、13dの底部及
び組立体20が配置される凹部13a、入出力ポート1
6b、16cには、前記導体板で構成された接続電極が
形成されている。また樹脂ケース7の側壁の外面には外
部端子が形成されている。この樹脂ケース7の凹部13
b、13c、13dにそれぞれ上下面に電極が形成され
た平板コンデンサ8、9、10が挿入され、下面の電極
と凹部の底部に形成された接続電極14aとは半田接続
される。また、凹部13bにはダミー抵抗11が配置さ
れ、その一方の電極は、接続電極14aに半田接続され
る。
The resin case 7 has a structure in which a conductor plate of about 0.1 mm and an engineering plastic having heat resistance are integrally formed, and has a circular concave portion 13a in the center of which an assembly 20 is disposed. Concave portions 13b, 13c, 13 around which plate capacitors and dummy resistors are arranged
d. The bottom of these recesses 13b, 13c, 13d and the recess 13a in which the assembly 20 is arranged, the input / output port 1
The connection electrodes 6b and 16c are formed of the conductor plates. External terminals are formed on the outer surface of the side wall of the resin case 7. The recess 13 of the resin case 7
Plate capacitors 8, 9, and 10 having electrodes formed on the upper and lower surfaces are inserted into b, 13c, and 13d, respectively, and the electrodes on the lower surface and the connection electrodes 14a formed on the bottom of the concave portion are connected by soldering. The dummy resistor 11 is disposed in the recess 13b, and one electrode of the dummy resistor 11 is connected to the connection electrode 14a by soldering.

【0005】次いで、樹脂ケース7の凹部13aに、上
記した組立体20を配置する。このとき、中心導体部分
の円板状のシールド板は、接続電極14aと半田接続さ
れる。これにより、中心導体の一端はアース接続され
る。中心導体4の一端は、平板コンデンサ8の上面の電
極とダミー抵抗11の一方の端子電極に接続される。ま
た、中心導体5の一端は、平板コンデンサ9の上面の電
極と入出力ポート16bに接続される。また、中心導体
6の一端は、平板コンデンサ10の上面の電極と入出力
ポート16cに接続される。
[0005] Next, the above-described assembly 20 is disposed in the recess 13 a of the resin case 7. At this time, the disk-shaped shield plate of the central conductor is soldered to the connection electrode 14a. Thereby, one end of the center conductor is grounded. One end of the center conductor 4 is connected to an electrode on the upper surface of the plate capacitor 8 and one terminal electrode of the dummy resistor 11. One end of the center conductor 5 is connected to an electrode on the upper surface of the plate capacitor 9 and the input / output port 16b. One end of the center conductor 6 is connected to an electrode on the upper surface of the plate capacitor 10 and the input / output port 16c.

【0006】そして、下ヨーク12上に樹脂ケース7を
配置する。下ヨーク12は、樹脂ケース7の底部の凹部
18に合致する構造となっており、下ヨーク12と接続
電極14aの裏面とがはんだ接続される。ここで下ヨー
ク12と樹脂ケース7との接合、樹脂ケース7と組立体
20との接合、平板コンデンサ8,9,10、入出力ポ
ート16b、16cとの接続は、例えば所定の部位にク
リームはんだを塗布した後、リフロー炉ではんだ付けす
ることにより行われるが、この際、各構成部品間の接続
が信頼性よく行えるように、あらかじめ、押さえ治具等
で各部品を機械的に固定した状態ではんだ付けするのが
一般的である。
Then, the resin case 7 is arranged on the lower yoke 12. The lower yoke 12 has a structure that matches the concave portion 18 at the bottom of the resin case 7, and the lower yoke 12 and the back surface of the connection electrode 14a are connected by soldering. The connection between the lower yoke 12 and the resin case 7, the connection between the resin case 7 and the assembly 20, and the connection between the plate capacitors 8, 9 and 10 and the input / output ports 16 b and 16 c are performed, for example, by cream soldering at a predetermined position. Is applied and then soldered in a reflow furnace. At this time, each component is mechanically fixed with a holding jig or the like in advance so that the connection between each component can be performed reliably. Generally, soldering is performed.

【0007】各構成部品間のはんだ付けの後、磁石2を
固着した上ヨーク1の側壁の突起部100を下ヨーク1
2の切欠部101に嵌入した後、当該部位を支点として
上ヨーク1を旋回させ他の側壁に形成された突起部10
0と切欠部101を嵌合させてアイソレータを構成して
いる。
After soldering between the components, the protrusion 100 on the side wall of the upper yoke 1 to which the magnet 2 is fixed is attached to the lower yoke 1
2 is inserted into the notch 101, the upper yoke 1 is turned around the corresponding portion as a fulcrum, and the protrusion 10 formed on the other side wall is rotated.
0 and the notch 101 are fitted together to form an isolator.

【0008】[0008]

【発明が解決しようとする課題】上記の様に、従来の非
可逆回路素子の製造方法では、各構成部品間の接続が信
頼性よく行えるように、あらかじめ、押さえ治具等で各
部品を機械的に固定した状態ではんだ付する必要があ
る。このため非可逆回路素子の組立が煩雑となり、製造
に多大な工数が必要となることは言うに及ばず、生産性
向上の為の自動化をも困難にしている。そこで本発明者
等は鋭意研究するなかで、永久磁石と各構成部品間に弾
性を備えた樹脂部材を配置することにより、各部品を機
械的に固定する方法に想到した。しかしながら、昨今の
非可逆回路素子の小型化には目覚しいものがあり、その
外形寸法は5mm×5mm×1.7mmと極めて小型で
あるため、前記樹脂部材もそれに相応して小型のものが
必要である。図3は弾性樹脂部材の斜視図であるが、そ
の外形寸法は4mm×4mmであり、厚さが凸部で凡そ
0.5mm、薄肉部では0.1mm程度にすぎず、熟練
した技能者であっても、所望の位置に弾性樹脂部材50
を配置するのは大変困難であったり、また機械化する上
でも障害が多く、非可逆回路素子の小型化が進む現状に
あっては、弾性樹脂部材50を個々に取り扱うことは更
に困難となることが明らかであった。そこで本発明の目
的は、上記の問題点を解消し、各部品素子の位置ずれや
浮き上がり等を防止でき、接続の信頼性を向上するとと
もに、製造時の作業性・生産性の向上を図ることができ
る非可逆回路素子の製造方法を提供することを目的とす
る。
As described above, in the conventional method for manufacturing a non-reciprocal circuit device, each component is previously machined with a holding jig or the like so that the connection between the components can be performed with high reliability. It is necessary to solder in a fixed state. For this reason, the assembly of the non-reciprocal circuit device becomes complicated, and it goes without saying that a large number of man-hours are required for manufacturing, and automation for improving productivity is also difficult. In view of the above, the present inventors have intensively studied and came up with a method of mechanically fixing each component by disposing an elastic resin member between the permanent magnet and each component. However, there has been a remarkable reduction in the size of non-reciprocal circuit devices in recent years, and their external dimensions are extremely small, such as 5 mm x 5 mm x 1.7 mm. is there. FIG. 3 is a perspective view of the elastic resin member. Its outer dimensions are 4 mm × 4 mm, and its thickness is only about 0.5 mm in the convex portion and about 0.1 mm in the thin portion. Even if the elastic resin member 50 is located at a desired position,
It is very difficult to dispose the elastic resin members 50, and there are many obstacles in the mechanization, and in the present situation where the size of the non-reciprocal circuit device is reduced, it becomes more difficult to handle the elastic resin members 50 individually. Was evident. Therefore, an object of the present invention is to solve the above-mentioned problems, to prevent misalignment or floating of each component element, to improve connection reliability, and to improve workability and productivity during manufacturing. It is an object of the present invention to provide a method of manufacturing a non-reciprocal circuit device capable of performing the above.

【0009】[0009]

【課題を解決するための手段】本発明は、磁気ヨーク
と、永久磁石と、中心導体と磁性体を備えた組立体と、
弾性樹脂部材を有する非可逆回路素子の製造方法であっ
て、前記永久磁石の一主面に接着層を設け、金型内に前
記永久磁石と弾性樹脂部材のコンパウンドを配置し、加
硫成形を行うとともに、弾性樹脂部材と永久磁石を接着
する非可逆回路素子の製造方法である。また本発明にお
いて、前記弾性樹脂部材に凸部を備える場合には、加硫
成形において前記金型に設けた凹部により前記弾性樹脂
部材の凸部を形成するのが好ましい。また、前記弾性樹
脂部材はJIS K 6250で規定される国際ゴムか
たさが10〜100の樹脂材料を選択するのが望まし
い。
SUMMARY OF THE INVENTION The present invention provides an assembly comprising a magnetic yoke, a permanent magnet, a center conductor and a magnetic material,
A method for manufacturing a non-reciprocal circuit device having an elastic resin member, wherein an adhesive layer is provided on one main surface of the permanent magnet, a compound of the permanent magnet and the elastic resin member is arranged in a mold, and vulcanization molding is performed. A method for manufacturing a non-reciprocal circuit device for performing bonding between an elastic resin member and a permanent magnet. In the present invention, when the elastic resin member has a convex portion, it is preferable that the convex portion of the elastic resin member is formed by a concave portion provided in the mold in vulcanization molding. Preferably, the elastic resin member is a resin material having an international rubber hardness of 10 to 100 specified in JIS K 6250.

【0010】[0010]

【発明の実施の形態】図1は、本発明の一実施例による
非可逆回路素子(アイソレータ)の全体構成示す分解斜
視図であり、図2はその平面図(a)と断面図(b)で
ある。図1に示すように、本発明の一実施例によるアイ
ソレータは、上ヨーク1と下ヨーク12間に永久磁石
2、中心導体と磁性体を備えた組立体20と、前記永久
磁石2と接着された弾性樹脂部材50(シリコンゴム)
と、樹脂ケース7を有し、前記下ヨーク12の側壁には
開孔部200、201、202、203を有し、前記上
ヨーク1の側壁には前記開孔部200、201、20
2、203に嵌入する突起部204,205、206,
207(206、207は図示せず)が形成され、上下
ヨークを嵌合して構成されている。このとき前記弾性樹
脂部材50は厚み方向に弾性変形した状態となってお
り、上下ヨークを前記突起部と開孔部とで係止すると共
に、図2に示すように各部品素子を押圧して、各構成部
品に厚さ方向の力を作用させている。このように構成す
るこで、構成部品の位置ずれや浮き上がり等を防止する
とともに、接続の信頼性を向上している。永久磁石2と
弾性樹脂部材50とは組立時に接着状態が維持されてい
れば良く、上下ヨークを係止以降に永久磁石2と弾性樹
脂部材50とが分離してもかまわない。従って接着をす
る接着剤等の選定は特に要しないが、加硫成形を行うこ
と、リフロー炉ではんだ付けを行うことを勘案すれば、
アクリル系やエポキシ系の耐熱性接着剤等を用いるのが
望ましい。
FIG. 1 is an exploded perspective view showing an entire configuration of a non-reciprocal circuit device (isolator) according to an embodiment of the present invention. FIG. 2 is a plan view (a) and a sectional view (b). It is. As shown in FIG. 1, an isolator according to an embodiment of the present invention includes a permanent magnet 2 between an upper yoke 1 and a lower yoke 12, an assembly 20 having a center conductor and a magnetic body, and is bonded to the permanent magnet 2. Elastic resin member 50 (silicone rubber)
, A resin case 7, and openings 200, 201, 202, and 203 on the side wall of the lower yoke 12, and the openings 200, 201, 20 on the side wall of the upper yoke 1.
2, 203, the projections 204, 205, 206,
207 (206 and 207 are not shown) are formed, and are configured by fitting upper and lower yokes. At this time, the elastic resin member 50 is in a state of being elastically deformed in the thickness direction. The upper and lower yokes are locked by the projections and the apertures, and each component element is pressed as shown in FIG. In addition, a force in the thickness direction is applied to each component. With this configuration, misalignment and lifting of the components are prevented, and the reliability of the connection is improved. It is sufficient that the permanent magnet 2 and the elastic resin member 50 maintain an adhered state during assembly, and the permanent magnet 2 and the elastic resin member 50 may be separated after the upper and lower yokes are locked. Therefore, it is not particularly necessary to select an adhesive or the like for bonding, but in consideration of performing vulcanization molding and performing soldering in a reflow furnace,
It is desirable to use an acrylic or epoxy heat-resistant adhesive.

【0011】以下、本発明の一実施例による非可逆回路
素子の製造方法について説明するが、本実施例の非可逆
回路素子の製造方法では従来製造方法と類似する部分が
多いため、ここでは異なる部分のみ説明する。
Hereinafter, a method for manufacturing a non-reciprocal circuit device according to one embodiment of the present invention will be described. However, the method for manufacturing a non-reciprocal circuit device according to this embodiment has many similarities to the conventional manufacturing method, and thus differs therefrom. Only the part will be described.

【0012】まず下ヨーク12上に組立体20、平板コ
ンデンサ8,9,10、ダミー抵抗11が所定の位置に
挿入された樹脂ケース7を配置する。下ヨーク12と樹
脂ケース7との接合部、樹脂ケース7と組立体20との
接合部、平板コンデンサ8,9,10、入出力ポート1
6b、16cとの接続部等には、クリームはんだが塗布
されている。そして、予め準備しておいた弾性樹脂部材
50と永久磁石2とを接着一体化した構成物60を、弾
性樹脂部材50の凸部が前記樹脂ケースの凹部13b、
13c、13dと対向するように上記組立体20の上面
側に配設し、そして下ヨーク12に上ヨーク1を押し込
み、上ヨークの突起部を下ケースの開孔部に嵌入させる
とともに前記弾性樹脂部材50を弾性変形した状態とし
て、上下ケースを係止した。このように構成することに
より、永久磁石2と上ヨーク1、組立体20と樹脂ケー
ス7、樹脂ケース7と下ヨーク12を機械的に固定する
とともに、前記弾性樹脂部材の凸部で中心導体4,5,
6や平板コンデンサ8,9,10、ダミー抵抗11を押
圧して固定している。そして高温雰囲気中にてリフロー
半田付けしてアイソレータを作製した。
First, on the lower yoke 12, the resin case 7 in which the assembly 20, the plate capacitors 8, 9, 10 and the dummy resistor 11 are inserted at predetermined positions is arranged. Joint between lower yoke 12 and resin case 7, joint between resin case 7 and assembly 20, plate capacitors 8, 9, 10, input / output port 1
A cream solder is applied to the connection portions and the like with 6b and 16c. Then, the structure 60 obtained by bonding and integrating the elastic resin member 50 and the permanent magnet 2 prepared in advance is replaced with the convex portion of the elastic resin member 50, the concave portion 13b of the resin case,
13c, 13d, the upper yoke 1 is pushed into the lower yoke 12, and the projection of the upper yoke is fitted into the opening of the lower case. With the member 50 elastically deformed, the upper and lower cases were locked. With this configuration, the permanent magnet 2 and the upper yoke 1, the assembly 20 and the resin case 7, the resin case 7 and the lower yoke 12 are mechanically fixed, and the central conductor 4 is formed by the convex portion of the elastic resin member. , 5
6, the plate capacitors 8, 9, 10 and the dummy resistor 11 are pressed and fixed. Then, an isolator was manufactured by reflow soldering in a high-temperature atmosphere.

【0013】なお永久磁石2と弾性樹脂部材50の一体
化は、シリコンゴムのコンパウンドと、あらかじめ接着
剤を塗布した永久磁石を加硫用の成形金型内に配置して
加硫成形により行う。この実施例の場合には加硫処理は
150℃で5分間行うが、加硫処理条件は弾性樹脂部材
の樹脂材料や形状により適宜選択すれば良い。また前記
金型には凹部が設けられており、これにより加硫処理を
行う際に前記弾性樹脂部材の凸部を形成することが出来
る。前記弾性樹脂部材としては、JIS K 6250
で規定される国際ゴムかたさが10〜100の樹脂材料
であるのが望ましい。国際ゴムかたさが10未満、10
0超えであると、非可逆回路素子の各構成部品を機械的
かつ一体的に固定するに十分な弾性力が得られず好まし
くない。加硫工程が終了後、弾性樹脂部材の残余部分を
抜き型で切断して離型し、永久磁石と弾性樹脂部材が接
着一体化した構成物60を得る。
The integration of the permanent magnet 2 and the elastic resin member 50 is carried out by vulcanization molding with a compound of silicon rubber and a permanent magnet coated with an adhesive in a vulcanizing mold. In the case of this embodiment, the vulcanization treatment is performed at 150 ° C. for 5 minutes, but the vulcanization treatment conditions may be appropriately selected depending on the resin material and shape of the elastic resin member. In addition, the mold is provided with a concave portion, whereby a convex portion of the elastic resin member can be formed when vulcanization is performed. As the elastic resin member, JIS K 6250
It is desirable that the resin material is a resin material having an international rubber hardness of 10 to 100 as defined in the above. International rubber hardness less than 10, 10
If it exceeds 0, it is not preferable because elasticity sufficient to mechanically and integrally fix the components of the nonreciprocal circuit device cannot be obtained. After the vulcanization step is completed, the remaining portion of the elastic resin member is cut by a punching die and released to obtain a structure 60 in which the permanent magnet and the elastic resin member are bonded and integrated.

【0014】[0014]

【発明の効果】本発明によれば、各部品素子の位置ずれ
や浮き上がり等を防止でき、接続の信頼性を向上すると
ともに、製造時の作業性・生産性の向上を図ることがで
きる非可逆回路素子の製造方法を提供することができ
る。
According to the present invention, it is possible to prevent misalignment or floating of each component element, thereby improving the reliability of connection and improving the workability and productivity during manufacturing. A method for manufacturing a circuit element can be provided.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の一実施例による非可逆回路素子の全体
構成を示す分解斜視図である。
FIG. 1 is an exploded perspective view showing an entire configuration of a non-reciprocal circuit device according to one embodiment of the present invention.

【図2】(a)は本発明の一実施例による非可逆回路素
子の平面図であり、(b)は本発明の一実施例による非
可逆回路素子の断面図である。
FIG. 2A is a plan view of a non-reciprocal circuit device according to one embodiment of the present invention, and FIG. 2B is a cross-sectional view of the non-reciprocal circuit device according to one embodiment of the present invention.

【図3】弾性樹脂部材の斜視図である。FIG. 3 is a perspective view of an elastic resin member.

【図4】弾性樹脂部材と永久磁石を接着一体化した構造
物の斜視図である。
FIG. 4 is a perspective view of a structure in which an elastic resin member and a permanent magnet are bonded and integrated.

【図5】従来の非可逆回路素子の全体構成示す分解斜視
図である。
FIG. 5 is an exploded perspective view showing the entire configuration of a conventional non-reciprocal circuit device.

【符号の説明】[Explanation of symbols]

1 上ヨーク 2 磁石 3 磁性体 4,5,6 中心導体 7 樹脂ケース 8,9,10 平板コンデンサ 11 ダミー抵抗 12 下ヨーク 50 弾性樹脂部材 DESCRIPTION OF SYMBOLS 1 Upper yoke 2 Magnet 3 Magnetic body 4, 5, 6 Center conductor 7 Resin case 8, 9, 10 Plate capacitor 11 Dummy resistor 12 Lower yoke 50 Elastic resin member

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 磁気ヨークと、永久磁石と、中心導体と
磁性体を備えた組立体と、弾性樹脂部材を有する非可逆
回路素子の製造方法であって、前記永久磁石の一主面に
接着層を設け、金型内に前記永久磁石と弾性樹脂部材の
コンパウンドを配置し、加硫成形を行うとともに、弾性
樹脂部材と永久磁石を接着することを特徴とする非可逆
回路素子の製造方法。
1. A method for manufacturing a non-reciprocal circuit device having a magnetic yoke, a permanent magnet, an assembly including a center conductor and a magnetic material, and an elastic resin member, wherein the method includes bonding to a main surface of the permanent magnet. A method for manufacturing a non-reciprocal circuit device, comprising providing a layer, placing a compound of the permanent magnet and an elastic resin member in a mold, performing vulcanization molding, and bonding the elastic resin member and the permanent magnet.
【請求項2】 前記弾性樹脂部材は略板状で周縁部の少
なくとも一部に凸部を備えるものであり、加硫成形にお
いて前記金型に設けた凹部により前記弾性樹脂部材の凸
部を形成することを特徴とする請求項1に記載の非可逆
回路素子の製造方法。
2. The elastic resin member has a substantially plate shape and is provided with a convex portion on at least a part of a peripheral portion thereof, and a convex portion of the elastic resin member is formed by a concave portion provided in the mold in vulcanization molding. The method for manufacturing a non-reciprocal circuit device according to claim 1, wherein:
【請求項3】 前記弾性樹脂部材はJIS K 625
0で規定される国際ゴムかたさが10〜100の樹脂材
料であることを特徴とする請求項1又は2に記載の非可
逆回路素子の製造方法。
3. The elastic resin member according to JIS K 625.
3. The method for producing a non-reciprocal circuit device according to claim 1, wherein the resin material has an international rubber hardness of 10 to 100 defined by 0.
JP2000105074A 2000-04-06 2000-04-06 Manufacturing method of irreversible circuit element Pending JP2001292014A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000105074A JP2001292014A (en) 2000-04-06 2000-04-06 Manufacturing method of irreversible circuit element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000105074A JP2001292014A (en) 2000-04-06 2000-04-06 Manufacturing method of irreversible circuit element

Publications (1)

Publication Number Publication Date
JP2001292014A true JP2001292014A (en) 2001-10-19

Family

ID=18618506

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000105074A Pending JP2001292014A (en) 2000-04-06 2000-04-06 Manufacturing method of irreversible circuit element

Country Status (1)

Country Link
JP (1) JP2001292014A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6968609B2 (en) 2001-03-01 2005-11-29 Murata Manufacturing Co., Ltd. Nonreciprocal circuit device, communication device, and method of manufacturing nonreciprocal circuit device
US7095998B2 (en) 2001-03-08 2006-08-22 Murata Manufacturing Co., Ltd. Mixer and converter using same
KR100617623B1 (en) 2004-03-31 2006-09-08 주식회사 세모스 Irreversible Circuit Device with Excellent Device Characteristics
JP2007288701A (en) * 2006-04-20 2007-11-01 Hitachi Metals Ltd Irreversible circuit element

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6968609B2 (en) 2001-03-01 2005-11-29 Murata Manufacturing Co., Ltd. Nonreciprocal circuit device, communication device, and method of manufacturing nonreciprocal circuit device
US7095998B2 (en) 2001-03-08 2006-08-22 Murata Manufacturing Co., Ltd. Mixer and converter using same
US7292837B2 (en) 2001-03-08 2007-11-06 Murata Manufacturing Co., Ltd. Mixer and converter using same
KR100617623B1 (en) 2004-03-31 2006-09-08 주식회사 세모스 Irreversible Circuit Device with Excellent Device Characteristics
JP2007288701A (en) * 2006-04-20 2007-11-01 Hitachi Metals Ltd Irreversible circuit element

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