JP2001269631A - Substrate cleaning device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate cleaning device which can rapidly remove organic matter adhered to substrate. SOLUTION: A gaseous ozone and ozonized water mixed phase flow is formed by uniformly mixing the gaseous ozone supplied from a gaseous ozone supply source 6 as numerous fine air bubbles into the saturated and ozonized water supplied from an ozonized water supply source 53 in a mixer 30. This mixed phase flow is discharged from a discharge nozzle 20 to the main surface of the substrate W. The dissolved ozone consumed by an oxidation cracking reaction, in addition to the effect of erosion by the mixed phase flow, is immediately supplemented by the ozone existing as bubbles, by which the ozone concentration in the ozonized water may be maintained at the saturation concentration at all times, and therefore, the organic matter sticking to the substrate W can be rapidly removed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a flat panel display (FPD) such as a semiconductor substrate or a glass substrate for a liquid crystal display device.
The present invention relates to a substrate cleaning apparatus that performs a cleaning process on a surface of a substrate for a display, a glass substrate for a photomask, a substrate for an optical disk, and the like (hereinafter, simply referred to as a “substrate”), for example, a process of removing organic substances attached to the substrate.

[0002]

2. Description of the Related Art Conventionally, in a process of manufacturing the above substrate, a cleaning process of the substrate has been indispensable. As one of cleaning apparatuses for performing a cleaning process of a substrate, there is an apparatus using ozone water. This apparatus supplies ozone water to the surface of a substrate and oxidizes organic substances such as a resist with ozone to decompose and remove the organic substances to clean the surface of the substrate.
As is well known, ozone has an extremely strong oxidizing power, and the substrate is cleaned using such a strong oxidizing power of ozone.

[0003]

However, in the conventional ozone water cleaning apparatus, since ozone water is simply supplied to the surface of the substrate, removal of organic substances such as resist proceeds only by oxidative decomposition reaction of ozone water. Therefore, the removal rate cannot be increased.

[0004] The decomposition rate of organic substances by ozone water depends on the ozone concentration in the ozone water, but the solubility of ozone is uniquely determined by temperature and pressure. For this reason, even if saturated ozone water is used, the ozone concentration has a certain limit, and the organic matter removal rate cannot be made higher than a certain value.

In the oxidative decomposition reaction of ozone water, ozone near the interface between organic matter and ozone water is preferentially consumed. For this reason, the ozone concentration of the ozone water near the interface decreases, and the reaction rate of the oxidative decomposition reaction of the ozone water depends on the diffusion rate of ozone in the ozone water. That is, since the oxidative decomposition reaction by ozone water is diffusion-controlled by ozone, the organic matter removal rate is significantly restricted.

Further, on the substrate to be cleaned, the oxidative decomposition reaction proceeds sequentially from the side close to the supply port of ozone water to consume ozone. Therefore, organic substances are sequentially removed from the upstream side of the substrate when viewed from the supply port of the ozone water, and ozone water having an oxidizing power on the downstream side only after the organic substances on the upstream side are removed (ozone water in which ozone is not consumed). Is supplied to remove the organic matter on the downstream side. That is, it took a considerable time to remove the organic substances on the entire surface of the substrate.

Due to the various circumstances described above, in the conventional ozone water cleaning apparatus, the removal rate of organic substances cannot be increased to a certain level or more, and the throughput of the cleaning process is limited to a certain level or less. The problem had arisen.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and has as its object to provide a substrate cleaning apparatus capable of quickly removing organic substances attached to a substrate.

[0009]

According to a first aspect of the present invention, there is provided a substrate cleaning apparatus for performing a cleaning process on a substrate surface, comprising: holding means for holding the substrate; ozone water or pure water. Flow generating means for generating a multi-phase flow composed of ozone water and ozone gas by mixing ozone gas with the liquid, and discharging means for discharging the multi-phase flow generated by the multi-phase flow generating means to a substrate held by the holding means And

According to a second aspect of the present invention, in the substrate cleaning apparatus according to the first aspect of the present invention, the substrate cleaning apparatus further includes a pressurizing means for pressurizing the mixed phase flow to at least a pressure higher than the atmospheric pressure. A mounting table having a plane size larger than the plane size of the substrate to be mounted, and the discharging means is disposed to face the mounting table with the substrate held by the mounting table interposed therebetween, and the plane size is larger than the plane size of the substrate. Including the atmosphere blocking plate having a, the discharge of the multi-phase flow between the mounting table and the atmosphere blocking plate holding the substrate, the outer periphery than the substrate held on the mounting table, Fluid resistance applying means for suppressing the passage of fluid is provided between the mounting table and the atmosphere blocking plate.

[0011]

Embodiments of the present invention will be described below in detail with reference to the drawings.

<1. First Embodiment> FIG. 1 is a view showing the entire configuration of a substrate cleaning apparatus according to a first embodiment of the present invention.
This substrate cleaning apparatus is a cleaning apparatus that removes organic substances such as a resist attached to a substrate by discharging an ozone water-ozone gas mixed phase flow onto the substrate, and mainly includes a spin base 10 for holding the substrate W, an ozone The apparatus includes a mixer 30 for generating a multiphase flow composed of water and ozone gas, and a discharge nozzle 20 for discharging the multiphase flow.

The spin base 10 is a disk-shaped member, and a plurality of holding pins 15 erected on the upper surface of the spin base 10 hold one substrate W in a substantially horizontal posture by gripping the edge of the substrate W. Hold. Note that three or four holding pins 15 are provided upright on the upper surface of the spin base 10 (only two of them are shown in FIG. 1).

The center of the lower surface of the spin base 10 is connected to the motor shaft 11 of the motor 12. Accordingly, the motor 12 can rotate the spin base 10, and by rotating the spin base 10, the substrate W held on the spin base 10 can be rotated in a substantially horizontal plane about the vertical direction as an axis. . In addition,
The spin base 10 is not limited to a mode in which the edge of the substrate W is mechanically gripped, but may be a mode in which the substrate W is held by vacuum suction. In addition, the substrate W is not limited to the configuration in which the substrate W is held in a substantially horizontal position, and may be a configuration in which the substrate W is tilted or held in a substantially vertical position.

The mixer 30 mixes the ozone water supplied via the pipe 41 with the ozone gas supplied via the pipe 41 as bubbles, thereby forming a two-phase mixed flow of ozone water and ozone gas. Generate. The term “multi-phase flow” generally refers to a flow in which two or more different phases of a gas phase, a liquid phase, and a solid phase are mixed, and the multi-phase flow in the present invention is a gas-liquid multi-phase flow. This is a fluid in which a large number of ozone gas bubbles are mixed in ozone water. In this specification, the term “multi-phase flow” refers to an ozone gas-ozone water multi-phase flow. Hereinafter, generation of a multiphase flow in the mixer 30 will be described.

By opening the ozone gas valve 60 and operating a pump 61 which is a means for pressurizing and sending the ozone gas under pressure, a pipe 41 from the ozone gas supply source 62 is turned on.
The ozone gas is supplied to the mixer 30 via the. On the other hand, by opening the ozone water valve 50 and operating the pump 52, the ozone water is supplied from the ozone water supply source 53 to the mixer 30 via the pipe 42. In the present embodiment, the ozone water supplied from the ozone water supply source 53 is saturated ozone water. The mixer 30 generates a multiphase flow by mixing ozone gas with the saturated ozone water. When the ozone water is supplied from the pipe 42, the pure water valve 54 and the chemical liquid valve 57 are closed. However, these may be appropriately mixed depending on the treatment. Further, the ozone water supplied to the mixer 30 may be heated by operating the heater 51.

FIG. 2 is a cross-sectional view for explaining generation of a multiphase flow inside the mixer 30. The mixer 30 in the present embodiment is of a so-called ejector type. As shown by the arrow A21, a high-speed ozone water flow is sent from the pipe 42, and the ozone water flow flows into the pipe 40 from the tip of the pipe 42 at a high speed. On the other hand, the mixer 30
Ozone gas is supplied from a pipe 41 into the inside of the. Here, the ozone water flows from the tip of the pipe 42 to the pipe 40
When the ozone water flows into the mixer 30 at high speed, the rear side of the ozone water flow becomes negative pressure, and the ozone gas inside the mixer 30 is turned into an arrow A23.
As shown by, it is sucked into the pipe 40 and uniformly mixed as countless fine bubbles in the ozone water flow. A mixed phase flow in which ozone gas is mixed into the ozone water generated in this way flows through the pipe 40 as indicated by an arrow A24.

Returning to FIG. 1, the ozone gas-ozone water mixed phase flow generated in the mixer 30 and sent through the pipe 40 is substantially in the vicinity of the center of the main surface of the substrate W held on the spin base 10. It is discharged from the discharge nozzle 20 in the vertical direction. The discharge nozzle 20 may be a straight type nozzle that discharges a multiphase flow in a bar shape, or a shower type nozzle that discharges a multiphase flow in a shower shape. Further, the discharge nozzle 20 is not limited to a form in which the discharge is performed in a substantially vertical direction.
A form in which the liquid is ejected in a tilted or substantially horizontal direction may be used.

In FIG. 1, it is possible to supply pure water or a chemical solution from the pipe 42 in addition to ozone water. That is, by opening the pure water valve 54 and operating the pump 55, pure water is supplied from the pure water supply source 56 to the mixer 30 via the pipe 42. By opening the chemical liquid valve 57 and operating the pump 58, the chemical liquid is supplied from the chemical liquid supply source 59 to the mixer 30 via the pipe 42. When pure water or a chemical solution is supplied to the mixer 30, the ozone water valve 50 and the ozone gas valve 60 are closed, and the supply of the ozone gas and the ozone water to the mixer 30 is stopped. However, these may be appropriately mixed depending on the treatment.

The pure water or the chemical supplied to the mixer 30 from the pipe 42 flows through the pipe 40 as it is, and
0, and the liquid is discharged from the discharge nozzle 20 onto the substrate W. The reason why the pure water is discharged to the substrate W is to perform a rinsing process of washing the surface of the substrate W with the pure water, and the purpose that the chemical solution is discharged to the substrate W is to perform the substrate surface treatment. In other words, in the substrate cleaning apparatus of FIG. 1, by controlling the opening and closing of the ozone water valve 50, the ozone gas valve 60, the pure water valve 54, and the chemical solution valve 57, the cleaning process using the multi-phase flow and the pure water can be used. Rinse treatment and surface treatment with a chemical solution can be performed.

In this embodiment, the spin base 10 corresponds to a holding unit, the mixer 30 corresponds to a multiphase flow generating unit, and the discharge nozzle 20 corresponds to a discharging unit.

In the substrate cleaning apparatus having the above-described structure, the ozone gas-ozone water mixed-phase flow generated by the mixer 30 is discharged from the discharge nozzle 20 onto the main surface of the substrate W, thereby adhering to the surface of the substrate W. Organic substances such as the resist can be decomposed and removed. FIG. 7 is a diagram schematically illustrating a state in which the main surface of the substrate W is cleaned by the multiphase flow.

The high-speed multiphase flow MP is applied to the surface of the substrate W to which the organic substance such as the resist R is attached (that is, the upper surface of the resist R)
Flows, erosion by the multiphase flow MP occurs in addition to the oxidative decomposition reaction by the ozone water OW. That is, if the ozone water is simply supplied to the surface of the substrate W as in the related art, the resist R is removed only by the oxidative decomposition reaction by ozone. However, the mixed phase obtained by mixing the ozone water OW with the ozone gas OG is used. By causing the flow MP to flow on the surface of the substrate W, friction pressure due to the kinetic energy of the fluid is applied to the resist R, and as a result, a part of the resist R is peeled off (designated by RP in the figure). Since such erosion by the multiphase flow MP is mechanical removal of organic substances, the removal rate is remarkably higher than that of the oxidative decomposition reaction which is removal of chemical organic substances, and the resist R and the like adhered to the substrate W are removed. Organic substances can be quickly removed.

Further, in the substrate cleaning apparatus of the present embodiment, in addition to the erosion by the multi-phase flow MP, the multi-phase flow M
Needless to say, the organic substances such as the resist R attached to the substrate W are also removed by the oxidative decomposition reaction using the ozone water OW constituting P. At this time, as described above, conventionally, ozone near the interface between the organic matter and the ozone water is preferentially consumed, and the oxidative decomposition reaction by the ozone water is diffusion-limited by ozone as described above. On the other hand, as in the present embodiment, a multiphase flow M in which ozone water OW is mixed with ozone gas OG is used.
If P is used, a large amount of ozone gas O is contained in the ozone water OW.
Since the bubbles of G are mixed, the resist R and the ozone water O
The dissolved ozone consumed near the interface with W is converted from ozone gas OG existing as bubbles around the dissolved ozone water.
It is immediately supplemented by dissolution in W. as a result,
The saturated ozone concentration is always maintained even near the interface between the resist R and the ozone water OW, and the removal rate of the organic substances such as the resist R attached to the substrate W does not decrease.

The substrate W is viewed from the supply port of the multi-phase flow MP.
Even if ozone dissolved in the ozone water OW is consumed in order from the upper upstream side (directly below the discharge nozzle 20 on the substrate W), the concentration of the ozone gas OG mixed as bubbles in the ozone water OW decreases. Since the dissolved ozone is immediately supplemented by being dissolved in the ozone water OW, the saturated ozone water OW is quickly supplied to the downstream side. As a result, ozone water OW having a saturated ozone concentration is supplied almost simultaneously to the entire surface of the substrate W, and the substrate W
Organic substances such as the resist R are quickly removed from the entire surface of the substrate.

As described above, by operating the heater 51, the ozone water supplied to the mixer 30 can be heated. In such a case, the generated multi-phase flow MP is also at a high temperature, and the oxidative decomposition reaction of organic matter by the ozone water OW is promoted. As a result, organic substances such as the resist R attached to the substrate W can be more quickly removed.

<2. Second Embodiment> Next, the second embodiment of the present invention
An embodiment will be described. FIG. 3 is a diagram illustrating a main configuration of a substrate cleaning apparatus according to a second embodiment of the present invention. The substrate cleaning apparatus according to the second embodiment is also a cleaning apparatus that removes organic substances such as a resist adhered to the substrate W by discharging an ozone water-ozone gas mixed phase flow onto the substrate. And a labyrinth mechanism 80 as a fluid resistance applying means is provided between the spin base 10 and the atmosphere blocking plate 25.

Spin base 10 as holding means for substrate W
Is a mounting table having a plane size larger than the plane size of the substrate W to be held, and similarly to the first embodiment, the edge of the substrate W is gripped by the plurality of holding pins 15 erected on the upper surface thereof. Thus, one substrate W is held in a substantially horizontal posture. In addition, the spin base 10 has a motor shaft 11
Via a motor (not shown), and is rotatable in a substantially horizontal plane.

The atmosphere shielding plate 25 is a hollow plate-shaped member that is disposed to face the spin base 10 with the substrate W held by the spin base 10 therebetween and has a plane size larger than the plane size of the substrate W. The atmosphere blocking plate 25 is connected to the mixer 30 via the pipe 40 (the same as that shown in FIG. 1).
And a number of small holes 26 are provided at the bottom thereof. The mixed-phase flow sent from the mixer 30 flows inside the atmosphere blocking plate 25, and is discharged from a number of small holes 26 into a space between the spin base 10 holding the substrate W and the atmosphere blocking plate 25.

The labyrinth mechanism 80 includes the spin base 10
Is provided on the outer periphery of the substrate W held between the spin base 10 and the atmosphere blocking plate 25. The labyrinth mechanism 80 is provided on the spin base 10.
Two fixed plates 81 and two fixed plates 82 provided below the atmosphere shielding plate 25 are alternately combined. As shown in FIG. 3, although the space between the atmosphere blocking plate 25 and the spin base 10 is communicated with the external space, the labyrinth mechanism 80 exists as a passage obstacle that suppresses the passage of the fluid. That is, the multi-phase flow supplied from the small holes 26 to the space between the spin base 10 and the atmosphere blocking plate 25 passes through the labyrinth mechanism 80 and flows out, and the labyrinth mechanism 80 causes the fluid resistance to the multi-phase flow. It is. The labyrinth mechanism 80 may be replaced with a thin tube, for example, as long as it can be a fluid resistance.

In the second embodiment, the mixer 3
Ozone water to be fed to the pump 0
The pressure is increased to about a, and the ozone gas to be fed to the mixer 30 is also increased to about 0.3 MPa by the pump 61. Thereby, the mixed phase flow generated in the mixer 30 is pressurized to at least a pressure higher than the atmospheric pressure. That is,
The pump 52 and the pump 61 correspond to a pressurizing unit that pressurizes the multi-phase flow to at least a pressure higher than the atmospheric pressure.

The configuration other than the above (for example, the mixer 30) is the same as that of the first embodiment, and a description thereof will be omitted.

Also in the second embodiment, the ozone gas / ozone water mixed-phase flow generated by the mixer 30 is discharged from the atmosphere blocking plate 25 to the main surface of the substrate W to remove resist or the like adhering to the surface of the substrate W. Organic substances can be decomposed and removed. At this time, the multi-phase flow is
5 through the small holes 26, the spin base 10 and the atmosphere blocking plate 25.
Is discharged into the space between The discharged multiphase flow is the substrate W
Flows in the direction toward the outer circumference on the surface of the labyrinth mechanism 80
And flows out to the outside.

In the second embodiment, in addition to the effect obtained by using the same ozone gas-ozone water mixed phase flow as in the first embodiment, the labyrinth mechanism 80 has a fluid resistance, so that the labyrinth mechanism 80 The liquid volume of the multi-phase flow supplied from the atmosphere barrier plate 25 is temporarily larger than the liquid volume of the multi-phase flow flowing out of the apparatus from the outside, and the space between the spin base 10 and the atmosphere barrier plate 25 is mixed. The flow is filled. Then, when the multi-phase flow is further supplied from the atmosphere blocking plate 25, a pressure higher than the atmospheric pressure is applied to the space between the spin base 10 and the atmosphere blocking plate 25.

Therefore, the solubility of ozone gas can be increased in a high pressure state, so that the ozone concentration of the ozone water in the multiphase flow in the space between the spin base 10 and the atmosphere blocking plate 25 can be increased. Therefore, the first
The oxidative decomposition reaction can be performed with ozone water having a higher ozone concentration than in the embodiment, and organic substances such as a resist attached to the substrate W can be more quickly removed.

Further, since the multi-phase flow itself discharged from the atmosphere blocking plate 25 is also pressurized to at least a pressure higher than the atmospheric pressure, the space between the spin base 10 and the atmosphere blocking plate 25 causes As the ozone gas bubbles expand, the multiphase flow flows on the surface of the substrate W. Due to the expansion of ozone gas bubbles in such a multiphase flow,
The effect of the erosion due to the multiphase flow becomes stronger, and organic substances such as a resist attached to the substrate W can be more quickly removed.

<3. Third Embodiment> Next, the third embodiment of the present invention
An embodiment will be described. In the above-described first and second embodiments, a so-called single-wafer type substrate cleaning apparatus that processes substrates one by one is used. In the third embodiment, a plurality of substrates are processed collectively. This is a so-called batch type substrate cleaning apparatus.

FIG. 4 is a view showing the entire configuration of a substrate cleaning apparatus according to a third embodiment of the present invention. The substrate drying apparatus according to the third embodiment includes a cleaning tank 70 for roughly performing a cleaning process, and a mechanism for supplying an ozone gas-ozone water mixed phase flow to the cleaning tank 70. FIG. 5 is a side view of a cleaning tank 70 constituting the substrate drying apparatus according to the third embodiment.

Inside the bottom of the cleaning tank 70, a discharge means 2 is provided.
A multi-phase flow supply nozzle 71 is provided. Each of the two multi-phase flow supply nozzles 71 is a hollow cylindrical member arranged with its longitudinal direction being substantially horizontal. A plurality of discharge holes 71a are formed in the multi-phase flow supply nozzle 71 (see FIG. 5). The multi-phase flow supply nozzle 71 has a pipe 40
The ozone gas-ozone water mixed phase flow is supplied from the mixer 30 via the. Note that the mechanism for supplying the multiphase flow is the same as that of the first embodiment, and is denoted by the same reference numerals as in FIG. 1, and description thereof will be omitted. Further, the multi-phase flow supply nozzle 7
1 is not limited to two, and a plurality of them may be added at different positions as needed.

In the third embodiment, a plurality of substrates W are held by three holding rods 72a, 72b, 72 as holding means.
c. Three holding rods 72a, 72
Each of b and 72c is provided with a plurality of holding grooves arranged at predetermined intervals for holding the substrate W in an upright posture by fitting the outer edge portion of the substrate W. And three holding rods 7
The lifters 2a, 72b, and 72c are fixed to the lifter arm 73 such that their longitudinal directions are substantially horizontal (parallel to the multiphase flow supply nozzle 71). The lifter arm 73 is connected to a lifter (not shown). With such a configuration, a lifter (not shown) is provided with three holding rods 72.
The plurality of substrates W, which are stacked and held in parallel with each other by a, 72b, and 72c, are moved up and down between a position where the substrates W are immersed in the liquid stored in the cleaning tank 70 and a position where the substrates W are pulled up from the liquid. be able to. Although the plurality of substrates W are held substantially vertically, the present invention is not limited to this, and the plurality of substrates W may be held inclined or substantially horizontally.

In the substrate cleaning apparatus of the third embodiment having the above-described structure, the ozone gas / ozone water mixed phase flow generated by the mixer 30 is also supplied to the multiphase flow supply nozzle 71.
By discharging to the substrate W in the cleaning tank 70, organic substances such as a resist attached to the surface of the substrate W can be decomposed and removed. At this time, the multi-phase flow is supplied from the plurality of discharge holes 71a of the multi-phase flow supply nozzle 71 to three holding rods 72a,
It is discharged between each of the plurality of substrates W held by 72b and 72c, and flows on the surface of the substrate W.

Also in this case, the same effect can be obtained by using the ozone gas-ozone water mixed phase flow as in the first embodiment. That is, in addition to the effect of erosion due to the multiphase flow, dissolved ozone consumed by the oxidative decomposition reaction is immediately supplemented by the ozone gas present as bubbles, and the effect that the ozone concentration in the ozone water can always be maintained at the saturated concentration. can get. As a result, the substrate W
As described in the first embodiment, it is possible to quickly remove an organic substance such as a resist adhered to the substrate.

<4. Modifications> While the preferred embodiments of the present invention have been described above, the present invention is not limited to the above-described examples. For example, in each of the above embodiments,
Saturated ozone water was supplied from the ozone water supply source 53 to the mixer 30. However, the present invention is not limited to this. Ozone water having a solubility (saturation ozone concentration or less) is supplied from the ozone water supply source 53 to the mixer 30. Alternatively, a multi-phase flow may be generated by mixing ozone water as bubbles into such ozone water that is less than saturated. Further, pure water is supplied from the pure water supply source 56 to the mixer 30 in place of the ozone water supply source 53, and the pure water is mixed with ozone gas (part of the ozone gas is dissolved in the pure water to become ozone water). ) To generate a multiphase flow. However, when the ozone gas is mixed with the saturated ozone water as in each of the above-described embodiments, the multi-phase flow can be easily generated and the organic matter decomposition rate on the substrate W can be increased.

In each of the above embodiments, an ejector type mixer (FIG. 2) is used as the mixer 30. However, the present invention is not limited to this. For example, a mixer as shown in FIG. 6 may be used. . In FIG. 6, a pipe 41 to which ozone gas is supplied and a pipe 42 to which ozone water is supplied.
An air cylinder 90 is provided at a connection portion with the air cylinder 90. When the piston 91 of the air cylinder 90 is lowered, the pipe 41 and the pipe 42 are shut off, and the ozone gas does not mix with the ozone water. On the other hand, the piston 91
When the pressure is rising, the pipe 41 and the pipe 42 are communicated, and the ozone gas is mixed into the ozone water. However, with such a simple mixing method, it is difficult to uniformly mix fine ozone gas bubbles in ozone water as in an ejector type, and as a result, the effect of erosion or the like due to a multiphase flow is reduced. Therefore, in FIG. 6, a plurality of spherical fillers 92 are provided in the pipe 42 as remixing means. The ozone water mixed with the ozone gas is remixed by passing through such a plurality of spherical packings 92, and the ozone gas is uniformly dispersed as fine bubbles in the ozone water, and as a result, similar to the ejector type, It is possible to obtain a multiphase flow in which fine ozone gas bubbles are uniformly mixed in ozone water. As the remixing means, in addition to the spherical filler, a rotating blade type, a fixed blade type, or a twisted plate can be used.

In addition, other than the above, a spray nozzle type or the like can be used as the mixer 30, and a multi-phase flow can be obtained by uniformly mixing ozone gas as innumerable fine bubbles in ozone water. Anything can be used.

[0046]

As described above, according to the first aspect of the present invention, since the multiphase flow composed of the ozone water and the ozone gas is discharged to the substrate, the erosion due to the multiphase flow occurs and is consumed. Since the dissolved ozone is immediately replenished with the ozone gas and the ozone concentration of the ozone water is maintained at a high level, the organic substances attached to the substrate can be quickly removed.

According to the second aspect of the present invention, since the fluid resistance imparting means for suppressing the passage of the fluid is provided, the ozone concentration of the ozone water can be increased, and the action of the erosion due to the expansion of the ozone gas. And organic substances attached to the substrate can be more quickly removed.

[Brief description of the drawings]

FIG. 1 is a diagram illustrating an overall configuration of a substrate cleaning apparatus according to a first embodiment of the present invention.

FIG. 2 is a cross-sectional view illustrating generation of a multiphase flow inside a mixer of the substrate cleaning apparatus of FIG. 1;

FIG. 3 is a diagram illustrating a main configuration of a substrate cleaning apparatus according to a second embodiment of the present invention.

FIG. 4 is a diagram illustrating an overall configuration of a substrate cleaning apparatus according to a third embodiment of the present invention.

FIG. 5 is a side view of a cleaning tank of the substrate cleaning apparatus of FIG.

FIG. 6 is a diagram showing another example of the mixer.

FIG. 7 is a diagram schematically showing a state in which a main surface of a substrate is cleaned by a multiphase flow.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Spin base 20 Discharge nozzle 25 Atmosphere shut-off plate 30 Mixer 52, 61 Pump 71 Multi-phase flow supply nozzle 72a, 72b, 72c Holding rod 80 Labyrinth mechanism W Substrate

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H01L 21/304 642 H01L 21/304 642F 643 643A 647 647Z F-term (reference) 2H088 FA21 FA30 MA20 2H090 HC18 JB02 JC19 3B201 AA02 AA03 AB34 AB42 AB44 BB02 BB03 BB33 BB38 BB62 BB88 BB90 CD31 4K053 PA17 QA04 RA07 RA13 SA09 XA07 XA21 XA22 XA31 YA04

Claims (2)

[Claims] 1. A substrate cleaning apparatus for performing a cleaning process on a substrate surface, comprising: holding means for holding the substrate; and mixing ozone gas with ozone water or pure water to generate a multiphase flow composed of ozone water and ozone gas. A substrate cleaning apparatus, comprising: a multi-phase flow generating unit configured to generate a multi-phase flow generated by the multi-phase flow generating unit; 2. The substrate cleaning apparatus according to claim 1, further comprising a pressurizing unit configured to pressurize the mixed phase flow to at least a pressure higher than the atmospheric pressure, wherein the holding unit has a plane larger than a plane size of the substrate to be held. A mounting table having a size, wherein the discharge unit includes an atmosphere blocking plate that is disposed to face the mounting table with the substrate held by the mounting table therebetween and has a plane size larger than the plane size of the substrate. Discharging the mixed-phase flow between the mounting table and the atmosphere shielding plate, wherein the multi-phase flow is discharged between the mounting table and the atmosphere shielding plate, and between the mounting table and the atmosphere shielding plate. A substrate cleaning apparatus, further comprising a fluid resistance applying means for suppressing passage of a fluid.