JP2001138230A - Method for grinding face side and reverse side of substrate, and grinding apparatus used therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a compact grinding apparatus to provide a substrate with double-side ground, with excellent flatness. SOLUTION: The grinding apparatus comprises a lower surface table provided with four chucks pivotably supported by a spindle at the positions of equal space on the concentric circle with respect to the axis of an index table which is rotatable at every 90 deg. allocated to a first zone for loading/unloading the substrate, a second zone for grinding the substrate, a third zone for inverting the substrate, and a fourth zone for grinding the substrate, and an upper surface table having two sets of fixed grinding wheels pivotably supported by a spindle head which are separately and independently provided on the chuck in the second zone of the index table and above the chuck in the second zone in a vertically elevating/lowering manner.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a magnetic head substrate made of AlTiC or the like, a Ga-As substrate, an In-P substrate, a Ga-
The present invention relates to a method of grinding a substrate such as a P substrate, an LCD glass substrate, a ceramic substrate, a semiconductor silicon wafer, etc., in which the front and back surfaces are ground one by one so that both surfaces have a matte surface, and a grinding apparatus used therefor.

[0002]

2. Description of the Related Art In order to smooth the front and back surfaces of a slicing substrate, the front and back surfaces of the substrate are ground, and both sides are matted, and the front side is mirror-finished by flat lapping or polishing.

[0003] In a glass substrate used for an LCD, the smoothness of the substrate surface greatly affects the visibility of a display screen, and if the smoothness is poor, the screen becomes extremely difficult to see due to irregular reflection of light. Further, in the case of a magnetic head substrate, the smoothness of the substrate affects the accuracy of pickup, and in the case of a semiconductor substrate, it is important for the subsequent pattern formation to be performed well.

As a method of simultaneously grinding both surfaces of a substrate, the substrate is held in a carrier, the substrate is sandwiched between a carrier plate and an upper plate, and the carrier is rotated by a belt or a driving roll. A method of simultaneously grinding the front and back surfaces of the substrate by rotating the upper and lower polishing plates with a spindle shaft and a double-head grinding device have been proposed (Japanese Patent Application Laid-Open Nos. 55-58963, 60-6335, 61-61).
No. 270078, No. 62-162456, No. 62-2
No. 82564, JP-A-1-310852, 9-26
2746, 9-248740).

In addition, the front and back surfaces of the work are rotatably supported by at least three rolls, and a pair of whetstones are opposed to the front and back surfaces of the work so that the center of the work is slightly inside the whetstones. The grindstone is moved so that the grindstone is moved, the grindstone is pressed against the front and back surfaces of the work, and the wheel rotates by the rotation of the roll and the grindstone is rotated by the rotation of the grindstone. Vertical double-headed grinding machines that slide on both sides to grind both sides have also been proposed (JP-A-10-128646, 10-15).
No. 6681, No. 10-175144, No. 10-180
No. 602, No. 10-217113, No. 10-2170
No. 79, No. 10-249687, No. 11-20575
No. 9).

However, for applications requiring higher smoothness, a double-sided grinding method using a double-headed grinding device requires
A high degree of smoothness cannot be obtained due to vertical or horizontal sway of the substrate during grinding, and it cannot be used for a GMR head substrate, a high-precision liquid crystal substrate, or a 300-mm semiconductor substrate for 256 Mb.

[0007] Therefore, for grinding substrates for these applications requiring high precision smoothness, a method of grinding the front and back sides one by one with little swing of the substrate at the time of grinding is considered to be currently the most suitable method and has been implemented. ing. FIG. 5 shows a grinding step for each side of the front and back surfaces of the substrate currently employed for the MR head substrate w and a step for lapping one side of the ground substrate. The substrate w has female screw holes 21 on the back surface. It is stored in a holder 20 having a substrate accommodating concave portion 22 on the surface (FIG. 5A), and is screwed and attached to a male screw rod 22a protruding from the surface of the disk-shaped fixed plate 22. (FIG. 5B), the fixed platen 22 is fixed vertically, and the grindstone platen 23 supported by the spindle shaft whose axial direction is located horizontally is advanced to abut the substrate surface, and the grindstone 23a is brought into contact with the substrate surface. After grinding the surface of the substrate by sliding on the upper side (FIG. 5C), the grindstone platen 23 is retracted, and then the surface-ground substrate on the fixed platen 22 is turned upside down and stored in the storage recess ( Then, the grindstone plate 23 is advanced to contact the back surface of the substrate as shown in FIG. Sliding the grinding wheel on the back face of the substrate is by grinding the back surface of the substrate (FIG. 5
E), the front and back surfaces of the substrate are ground.

The substrate whose front and back surfaces are ground is a lapping plate 2
The lapping work is carried out by rotating the lapping plate 24 by fixing the lapping plate 24 from above and fixing the lapping plate 24 from above (FIG. 5F).
26 is a conditioning ring. If one wants to know the details of the lapping device, see, for example, JP-A-11-15165.
8 and Japanese Patent Application No. 11-225231.

[0009]

In the above method for grinding the front and back surfaces of a substrate, the smoothness (TTV) is about 2 to 5 μm, and the smoothness after lapping is as high as about 1 μm.
It is suitable for an R head or the like, but in a field requiring a high smoothness of 0.1 to 0.8 μm like a GMR head, the smoothness after grinding and before lapping is insufficient.

According to the present invention, a lap-processed or polished substrate has a smoothness of 0.1 to 0.8 μm and is suitable for providing a substrate having a high smoothness. Hereinafter, the surface roughness of the substrate is Rmax 0.1 μm.
It is an object of the present invention to provide a method for grinding each side of a substrate providing a ground surface having a high smoothness of not more than m, and a grinding apparatus used therefor.

[0011]

A first aspect of the present invention is a first zone for performing substrate loading / substrate unloading.
90 instructed to the second zone for grinding the substrate, the third zone for reversing the substrate, and the fourth zone for grinding the substrate.
A lower platen having four chucks mounted on a spindle shaft at equal intervals on a concentric circle with respect to the axis of the index table; The two wheels are fixedly mounted on the chuck of the second zone of the bull and the chuck of the second zone separately and separately, and are supported on a spindle shaft head which can be moved up and down. An object of the present invention is to provide a method of grinding the front and back surfaces of a substrate in the following steps by using a grinding device including an upper surface plate.

The substrate is placed on a chuck located in the first zone. By rotating the index table 90 degrees clockwise, the chuck at the position of the first zone is replaced by the second zone, and the chuck at the position of the second zone is replaced by the third zone. The chuck located at the position of the third zone is transferred to the fourth zone, and the chuck located at the position of the fourth zone is transferred to the first zone. Next, a new substrate is placed on the chuck at the position of the first zone. On the other hand, on the chuck in the second zone, the grindstone is lowered to bring the grindstone into contact with the substrate, the spindle shaft of the chuck and the spindle of the grindstone are rotated, and the grindstone is slid on the substrate surface to grind the substrate surface. Then, when grinding is completed, raise the grinding wheel. By rotating the index table 90 degrees clockwise, the chuck at the position of the first zone is replaced by the second zone, and the chuck at the position of the second zone is replaced by the third zone. The chuck located at the position of the third zone is transferred to the fourth zone, and the chuck located at the position of the fourth zone is transferred to the first zone. Next, a new substrate is placed on the chuck at the position of the first zone. On the other hand, on the chuck of the second zone, the grindstone is lowered to bring the grindstone into contact with the substrate, the spindle shaft of the magnetic chuck and the spindle of the grindstone are rotated, and the grindstone is slid on the substrate surface so that the surface of the substrate is moved. Grind and raise the grindstone when grinding is complete. The substrate is inverted on the third zone chuck. By rotating the index table 90 degrees clockwise, the chuck at the position of the first zone is replaced by the second zone, and the chuck at the position of the second zone is replaced by the third zone. Then, the chuck located at the position of the third zone is moved to the fourth zone,
The chuck located at the position of the fourth zone is transferred to the first zone. Next, a new substrate is placed on the chuck at the position of the first zone. On the other hand, on the chuck of the second zone, the grindstone is lowered to bring the grindstone into contact with the substrate, the spindle shaft of the magnetic chuck and the spindle of the grindstone are rotated, and the grindstone is slid on the substrate surface so that the surface of the substrate is moved. Grind and raise the grindstone when grinding is complete. The substrate is inverted on the third zone chuck. On the chuck in the fourth zone, the grindstone is lowered to bring the grindstone into contact with the substrate, the spindle shaft of the chuck and the spindle of the grindstone are rotated, and the grindstone is slid on the substrate surface to grind the substrate surface. When grinding is completed, raise the grindstone. By rotating the index table 90 degrees clockwise, the chuck at the position of the first zone is replaced by the second zone, and the chuck at the position of the second zone is replaced by the third zone. Then, the chuck located at the position of the third zone is moved to the fourth zone,
The chuck located at the position of the fourth zone is transferred to the first zone. Next, after unloading the substrate whose both surfaces have been ground from the chuck at the position of the first zone, a new substrate is mounted. On the other hand, on the chuck in the second zone, the grindstone is lowered to bring the grindstone into contact with the substrate, the spindle shaft of the chuck and the spindle of the grindstone are rotated, and the grindstone is slid on the substrate surface to grind the substrate surface. Then, when grinding is completed, raise the grinding wheel. The substrate is inverted on the third zone chuck. On the chuck in the fourth zone, the grindstone is lowered to bring the grindstone into contact with the substrate, the spindle shaft of the chuck and the spindle of the grindstone are rotated, and the grindstone is slid on the substrate surface to grind the substrate surface. When grinding is completed, raise the grindstone. The following steps are repeated.

Since the substrate is placed in the horizontal direction and the grinding is performed one surface at a time, the smoothness is 1 compared with the conventional double-head grinding method.
A substrate having a high flatness of about 2 μm is obtained.

The second aspect of the present invention relates to a method of loading a substrate.
Every 90 degrees indicated to the first zone for substrate unloading, the second zone for substrate grinding, the third zone for substrate reversal, and the fourth zone for substrate grinding. A lower platen provided with four chucks mounted on a spindle shaft at equal intervals on a concentric circle with respect to the axis of the index table; Two grindstones are fixed on a spindle shaft head which is provided separately and separately on the magnetic chuck of the second zone and the magnetic chuck of the second zone, and which can be moved up and down. An object of the present invention is to provide a method of grinding the front and back surfaces of a substrate in the following steps (1) to (9) using a grinding device including an upper surface plate.

(1) The substrate is placed on the chuck located in the first zone. (2) By rotating the index table 90 degrees clockwise, the chuck located at the first zone position is replaced by the second zone, and the chuck located at the second zone position is replaced by the second zone. Three zones
The chuck located at the position of the third zone is transferred to the fourth zone, and the chuck located at the position of the fourth zone is transferred to the first zone. Next, a new substrate is placed on the chuck at the position of the first zone. On the other hand, on the chuck in the second zone, the grindstone is lowered to bring the grindstone into contact with the substrate, the spindle shaft of the chuck and the spindle of the grindstone are rotated, and the grindstone is slid on the substrate surface to grind the substrate surface. Then, when grinding is completed, raise the grinding wheel. (3) By rotating the index table 90 degrees clockwise, the chuck located at the first zone is replaced by the second zone, and the chuck located at the second zone is removed by the second zone. Three zones
And the chuck located at the third zone position to the fourth zone.
And the chuck located at the position of the fourth zone is transferred to the first zone. Next, a new substrate is placed on the chuck at the position of the first zone. On the other hand, on the chuck in the second zone, the grindstone is lowered to bring the grindstone into contact with the substrate, the spindle shaft of the chuck and the spindle of the grindstone are rotated, and the grindstone is slid on the substrate surface to grind the substrate surface. Then, when grinding is completed, raise the grinding wheel. The substrate is inverted on the third zone chuck. (4) By rotating the index table 90 degrees clockwise, the chuck located at the first zone position is replaced by the second zone, and the chuck located at the second zone position is replaced by the second zone. Three zones
The chuck located at the position of the third zone is transferred to the fourth zone, and the chuck located at the position of the fourth zone is transferred to the first zone. Next, a new substrate is placed on the chuck at the position of the first zone. On the other hand, on the chuck in the second zone, the grindstone is lowered to bring the grindstone into contact with the substrate, the spindle shaft of the chuck and the spindle of the grindstone are rotated, and the grindstone is slid on the substrate surface to grind the substrate surface. Then, when grinding is completed, raise the grinding wheel. The substrate is inverted on the third zone chuck. On the chuck in the fourth zone, the grindstone is lowered to bring the grindstone into contact with the substrate, the spindle shaft of the chuck and the spindle of the grindstone are rotated, and the grindstone is slid on the substrate surface to grind the substrate surface. When grinding is completed, raise the grindstone. (5) The index table is rotated 270 degrees in the counterclockwise direction, and the chuck located at the first zone is moved to the second zone and the chuck is moved to the second zone. The chuck located at the position of the third zone is transferred to the fourth zone, and the chuck located at the position of the fourth zone is transferred to the first zone. Next, after unloading the substrate whose both surfaces have been ground from the chuck at the position of the first zone, a new substrate is mounted. On the other hand, on the chuck in the second zone, the grindstone is lowered to bring the grindstone into contact with the substrate, the spindle shaft of the chuck and the spindle of the grindstone are rotated, and the grindstone is slid on the substrate surface to grind the substrate surface. Then, when grinding is completed, raise the grinding wheel. The substrate is inverted on the third zone chuck. On the chuck in the fourth zone, the grindstone is lowered to bring the grindstone into contact with the substrate, the spindle shaft of the chuck and the spindle of the grindstone are rotated, and the grindstone is slid on the substrate surface to grind the substrate surface. When grinding is completed, raise the grindstone. (6) By rotating the index table 90 degrees clockwise, the chuck at the position of the first zone is replaced by the second zone, and the chuck at the position of the second zone is replaced by the second. Three zones
The chuck located at the position of the third zone is transferred to the fourth zone, and the chuck located at the position of the fourth zone is transferred to the first zone. Then, after unloading the substrate whose both surfaces have been ground from the chuck at the position of the first zone,
Place a new board. On the other hand, on the chuck in the second zone, the grindstone is lowered to bring the grindstone into contact with the substrate, the spindle shaft of the chuck and the spindle of the grindstone are rotated, and the grindstone is slid on the substrate surface to grind the substrate surface. Then, when grinding is completed, raise the grinding wheel. The substrate is inverted on the third zone chuck. On the chuck in the fourth zone, the grindstone is lowered to bring the grindstone into contact with the substrate, the spindle shaft of the chuck and the spindle of the grindstone are rotated, and the grindstone is slid on the substrate surface to grind the substrate surface. When grinding is completed, raise the grindstone. (7) By rotating the index table 90 degrees clockwise, the chuck at the position of the first zone is replaced by the second zone, and the chuck at the position of the second zone is replaced by the second. Three zones
The chuck located at the position of the third zone is transferred to the fourth zone, and the chuck located at the position of the fourth zone is transferred to the first zone. Then, after unloading the substrate whose both surfaces have been ground from the chuck at the position of the first zone,
Place a new board. On the other hand, on the chuck in the second zone, the grindstone is lowered to bring the grindstone into contact with the substrate, the spindle shaft of the chuck and the spindle of the grindstone are rotated, and the grindstone is slid on the substrate surface to grind the substrate surface. Then, when grinding is completed, raise the grinding wheel. The substrate is inverted on the third zone chuck. On the chuck in the fourth zone, the grindstone is lowered to bring the grindstone into contact with the substrate, the spindle shaft of the chuck and the spindle of the grindstone are rotated, and the grindstone is slid on the substrate surface to grind the substrate surface. When grinding is completed, raise the grindstone. (8) By rotating the index table 90 degrees clockwise, the chuck located at the first zone position is replaced by the second zone, and the chuck located at the second zone position is replaced by the second zone. Three zones
The chuck located at the position of the third zone is transferred to the fourth zone, and the chuck located at the position of the fourth zone is transferred to the first zone. Then, after unloading the substrate whose both surfaces have been ground from the chuck at the position of the first zone,
Place a new board. On the other hand, on the chuck in the second zone, the grindstone is lowered to bring the grindstone into contact with the substrate, the spindle shaft of the chuck and the spindle of the grindstone are rotated, and the grindstone is slid on the substrate surface to grind the substrate surface. Then, when grinding is completed, raise the grinding wheel. The substrate is inverted on the third zone chuck. On the chuck in the fourth zone, the grindstone is lowered to bring the grindstone into contact with the substrate, the spindle shaft of the chuck and the spindle of the grindstone are rotated, and the grindstone is slid on the substrate surface to grind the substrate surface. When grinding is completed, raise the grindstone. (9) Hereinafter, the index table of (5) to (8) is rotated 270 degrees in the counterclockwise direction, 90 degrees in the clockwise direction, 90 degrees in the clockwise direction, and 90 degrees in the clockwise direction. And unloading the substrate at each zone.
The steps of substrate loading (first zone), substrate grinding (second zone), substrate inversion (third zone) and substrate grinding (fourth zone) are repeated. .

There is no need to use a complicated index table structure using a rotary joint or the like in order to prevent the wiring of the electric system from being twisted.

According to a third aspect of the present invention, there is provided a substrate loading / loading device.
Every 90 degrees indicated to the first zone for substrate unloading, the second zone for substrate grinding, the third zone for substrate reversal, and the fourth zone for substrate grinding. A lower platen having four magnetic chucks mounted on a spindle shaft at equal intervals on a concentric circle with respect to the axis of the index table; and an index table. And two whetstones which are separately provided on the magnetic chuck of the second zone and the magnetic chuck of the second zone and which are supported independently by a spindle shaft head which is vertically movable. And a grinding device comprising an upper surface plate.

Since the grinding apparatus uses the index table method, the front surface grinding and the back surface grinding can be performed simultaneously in parallel, and the throughput time of the substrate is reduced.

According to a fourth aspect of the present invention, in the grinding device, the chuck is an electromagnetic chuck or a vacuum chuck. An electromagnetic chuck is used for the MGR head, the Ga-As substrate, the Ga-P substrate, and the In-P substrate. Vacuum chucks are used for semiconductor silicon wafers and LED glass substrates.

According to a fifth aspect of the present invention, in the method of grinding a substrate, the rotational direction of the grindstone in the second zone and the fourth
And the rotation direction of the chuck in the second zone and the rotation direction of the chuck in the fourth zone are the same.

According to a sixth aspect of the present invention, in the method of grinding a substrate, the rotational direction of the grindstone in the second zone and the fourth
The rotation direction of the grindstone in the second zone is the opposite direction, and the rotation direction of the chuck in the second zone is the same as the rotation direction of the chuck in the fourth zone.

The thickness distribution of the front and back ground substrates is good.

According to a seventh aspect of the present invention, there is provided a substrate loading method.
A magnetic chuck mounted on a spindle shaft on an index table which can be rotated every 180 degrees as directed to a first zone for inverting and unloading the substrate and a second zone for grinding the substrate. The lower table is provided at two positions symmetrical with respect to the axis of the index table, and the magnetic table is provided on the magnetic chuck of the second zone of the index table, and is provided so as to be vertically movable. An object of the present invention is to provide a method for grinding the front and back surfaces of a substrate in the following steps using a grinding device including an upper surface plate having a grindstone supported on a spindle shaft provided.

The substrate is placed on the magnetic chuck located in the first zone.

By rotating the index table by 180 degrees, the magnetic chuck at the position of the second zone is used as the first zone, and the magnetic chuck at the position of the first zone is used as the second zone. - Next, a new substrate is placed on the electromagnetic chuck at the position of the first zone. On the other hand, on the magnetic chuck of the second zone, the grindstone is lowered to bring the grindstone into contact with the substrate, the spindle shaft of the magnetic chuck and the spindle of the grindstone are rotated, and the grindstone is slid on the surface of the substrate. Is ground, and when the grinding is completed, the grinding wheel is raised.

By rotating the index table by 180 degrees, the magnetic chuck at the position of the second zone is used as the first zone, and the magnetic chuck at the position of the first zone is used as the second zone. - Next, the substrate whose surface has been ground on the magnetic chuck located in the first zone is inverted and placed on the magnetic chuck such that the back surface of the substrate faces upward. On the other hand, on the magnetic chuck of the second zone, the grindstone is lowered to bring the grindstone into contact with the substrate, the spindle shaft of the magnetic chuck and the spindle of the grindstone are rotated, and the grindstone is slid on the surface of the substrate. Is ground, and when the grinding is completed, the grinding wheel is raised.

By rotating the index table by 180 degrees, the magnetic chuck at the position of the second zone is used as the first zone, and the magnetic chuck at the position of the first zone is used as the second zone. - Next, the substrate whose surface has been ground on the magnetic chuck located in the first zone is inverted and placed on the magnetic chuck. On the other hand, on the magnetic chuck of the second zone, the grindstone is lowered to bring the grindstone into contact with the substrate, and the spindle shaft of the magnetic chuck and the spindle of the grindstone are rotated to slide the grindstone on the backside of the substrate, and the backside of the substrate is rotated. Is ground, and when the grinding is completed, the grinding wheel is raised.

By rotating the index table by 180 degrees, the magnetic chuck at the position of the second zone is used as the first zone, and the magnetic chuck at the position of the first zone is used as the second zone. - Next, the back-ground substrate on the magnetic chuck located in the first zone is unloaded and a new substrate is mounted. On the other hand, on the magnetic chuck of the second zone, the grindstone is lowered to bring the grindstone into contact with the substrate, and the spindle shaft of the magnetic chuck and the spindle of the grindstone are rotated to slide the grindstone on the backside of the substrate, and the backside of the substrate is rotated. Grinding,
When grinding is completed, raise the grindstone.

By rotating the index table by 180 degrees, the magnetic chuck at the position of the second zone is replaced by the first zone, and the magnetic chuck at the position of the first zone is replaced by the second zone. - Next, the back-ground substrate on the magnetic chuck located in the first zone is unloaded and a new substrate is mounted. On the other hand, on the magnetic chuck of the second zone, the grindstone is lowered to bring the grindstone into contact with the substrate, the spindle shaft of the magnetic chuck and the spindle of the grindstone are rotated, and the grindstone is slid on the surface of the substrate. Grinding,
When grinding is completed, raise the grindstone. Hereinafter, the above steps are repeated.

The grinding apparatus can be made compact and a descending substrate having excellent flatness can be obtained.

According to an eighth aspect of the present invention, there is provided a method for grinding the front and back surfaces of a substrate, comprising the steps of:
It is characterized in that rotation every 0 degree is alternately performed 180 degrees clockwise and then 180 degrees clockwise. The universal rotation joint does not have to be used because the reversal of the rotation of the index table every 90 degrees in the forward and reverse directions does not cause twisting of the wiring of the electric system or the piping of the water supply system.

According to a ninth aspect of the present invention, there is provided a method of loading a substrate,
A magnetic chuck mounted on a spindle shaft on an index table which can be rotated every 180 degrees as directed to a first zone for inverting and unloading the substrate and a second zone for grinding the substrate. The lower table is provided at two positions symmetrical with respect to the axis of the index table, and the magnetic table is provided on the magnetic chuck of the second zone of the index table, and is provided so as to be vertically movable. The present invention provides a grinding device comprising an upper surface plate having a grindstone supported on a spindle shaft provided. The device becomes compact.

[0033]

BEST MODE FOR CARRYING OUT THE INVENTION

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in more detail with reference to the drawings. FIG. 1 is a simplified plan view of a grinding device and a lapping device used for grinding both sides of a substrate of the present invention one by one. FIG. 2 is a front view showing the substrate grinding device of the present invention. FIG. 4 is a front view of a polishing apparatus, and FIG. 4 is a simplified plan view of a grinding apparatus and a lap processing apparatus used to grind both sides of a substrate of the present invention one side at a time.

1 and 2, 1 is a grinding device,
w is a substrate, 2 is a chuck table, and four are 2a, 2b, 2
c and 2d, which are arranged at equal intervals on a concentric circle of the center of the spindle shaft 3a of the index table 3. The index table 3 is designated by four zones. The first zone s1 performs substrate loading / unloading, the second zone s2 performs substrate grinding, the third zone s3 performs substrate inversion, and the second zone s3 performs substrate grinding. Four zones s4. The index table 3 is rotated 90 degrees at a time by a drive motor 14 described later. Preferably, each zone is partitioned by a wall having a height of a gap through which the substrate can pass from the surface of the index table.

4 is a drive motor for chuck table, 5 is a grindstone head, 6 is a cup type wheel grindstone, 6a
Is a grindstone blade, 7 is a spindle shaft, 8 is a spindle shaft drive motor, 9 is a ball screw, 10 is a servo motor,
11 is a sliding portion, 12 is a fixing member, 13 is a screwed body, 1
4 is an index table drive motor, 15 is a substrate storage cassette, 16 is a double arm type transfer robot, 17 is a substrate reversing and transfer robot, 18 is a transfer robot, and 19 is a cleaning device.

100 is a lapping device, 101 is a rotary table, 101 'is a polisher (surface plate), and 102 is a processing stage.
The working station is held and moved on the rotary table by the station positioning mechanism. 103 is a roller for rotating the work of the working station, and 104 is a working station provided with a frame 105 'of the work holding member 105. 10
6 is an operation panel, 107 is a fixed clamp, 108 is a handle, 109 is a conditioner capable of rotating and reciprocating on a polisher, 110 is a conditioner-positioning mechanism,
110 'is a roller.

In the polishing apparatus 200 shown in FIG. 3, reference numeral 201 denotes a polishing head (polishing head) having a platen 202 on which a polishing cloth is stuck on a mounting plate. A spindle shaft 203 supports the head. 204
Is a motor, 205 is a gear, 206 is a pulley, 207
Is a gear, 208 is a head lifting / lowering mechanism, 209 is a chuck mechanism, 210 is a spindle shaft, 211 is a slide member holding a spindle shaft, 212 is a guide rail, and 213 is a guide rail.
Is an abrasive supply pipe.

In FIG. 4, 1 is a grinding device, 3 is an index table, 3a is a spindle shaft, 6 is a grindstone, 6a
Is a grindstone blade, 7 is a spindle shaft, 300 is a partition wall, 100
Is a lapping device, 101 is a rotary table, 101 'is a polisher, 102 is a machining station positioning mechanism, 105
Is a work holding member, and 109 is a conditioner.
The work holding member 105 has a substrate w attached to the lower surface of the mounting plate,
The board surface is brought into contact with the polisher surface, and a weight is placed on the mounting plate. A hot melt adhesive such as wax or polyethylene, an adhesive tape, an ultraviolet curable adhesive, or the like is used for the attachment.

The shape of the conditioner 11 may be a disk shape or a ring shape.
In order to increase the effective utilization rate of the abrasive used for polishing the substrate, the abrasive is preferably ring-shaped. The diameter of the conditioner is 1 to 20% greater than the width of the polisher surface (the length obtained by subtracting the diameter of the central cavity from the outer radius of the polisher), and the height is 20 to 50 mm.

There are two methods for grinding the front and back surfaces of the substrate one by one using the grinding apparatus shown in FIGS. 1 and 2, depending on the manner of rotation of the index table.

One method is to grind the front and back surfaces of the substrate in the following steps in which the index table 3 is rotated in the clockwise direction or counterclockwise direction by 90 degrees every 90 degrees.

The substrate is transferred from the cassette 15 by one arm of the double-arm transfer robot 16, and the substrate w is placed on the chuck 2a located in the first zone s1.

By driving the motor 14 to rotate the index table 3 by 90 degrees, the chuck 2a at the position of the first zone is moved to the second zone s2 and the second zone s2 is moved. Of the chuck 2b located at the position of the third zone s3 and the third zone s3.
The chuck 2c located at the position of the fourth zone is transported to the fourth zone s4, and the chuck 2d located at the position of the fourth zone is transported to the first zone. Next, the substrate is transferred from the cassette 15 by one arm of the double arm type transfer robot 16, and the new substrate w is placed on the chuck 2d at the position of the first zone s1.
Put. On the other hand, on the chuck 2a of the second zone, the grindstone 6 is lowered to bring the grindstone into contact with the substrate, and the spindle shaft of the chuck 2a and the spindle shaft 7 of the grindstone are rotated to slide the grindstone on the substrate surface. The substrate surface is ground, and when the grinding is completed, the grindstone is raised.

By rotating the index table by 90 degrees, the chuck 2d at the position of the first zone is moved to the second zone.
The chuck 2a at the position of the second zone is at the third zone, the chuck 2b at the position of the third zone at the fourth zone, and the position of the fourth zone. Is transferred to the first zone. Next, a new substrate is placed on the chuck 2c at the position of the first zone. On the other hand, the second zone
On the chuck 2d of the chuck, the grindstone is lowered to bring the grindstone into contact with the substrate, the spindle shaft of the chuck 2d and the spindle shaft of the grindstone are rotated, and the grindstone is slid on the substrate surface to grind the substrate surface. When finished, raise the whetstone. The substrate is turned over on the chuck 2a of the third zone by using the turnover / transport robot 17.

By rotating the index table by 90 degrees, the chuck 2c located at the position of the first zone is moved to the second zone.
The chuck 2d at the position of the second zone is located at the third zone, the chuck 2a at the position of the third zone is located at the fourth zone, and the position of the fourth zone is located at the fourth zone. Is transferred to the first zone. Next, a new substrate is placed on the chuck 2b at the position of the first zone. On the other hand, the second zone
On the chuck 2c of the chuck, the grindstone is lowered to bring the grindstone into contact with the substrate, the spindle shaft of the chuck and the spindle shaft of the grindstone are rotated, and the grindstone is slid on the substrate surface to grind the substrate surface. Then raise the whetstone. Third zone
The substrate is inverted on the chuck 2d. On the chuck 2a in the fourth zone, the grindstone is lowered to bring the grindstone into contact with the substrate, and the spindle shaft of the chuck and the spindle of the grindstone are rotated to slide the grindstone on the substrate surface to grind the substrate surface. When grinding is completed, raise the grinding wheel.

By rotating the index table by 90 degrees, the chuck 2b located at the position of the first zone is moved to the second zone.
The chuck 2c at the position of the second zone is located at the third zone, the chuck 2d at the position of the third zone is located at the fourth zone, and the position of the fourth zone is located at the fourth zone. Is transferred to the first zone. Next, the substrate whose both surfaces have been ground from the chuck 2a at the position of the first zone is double-arranged.
After being unloaded by the other arm of the arm-type transfer robot 16, it is transferred to the cleaning device 19, and a new substrate is placed on the double-arm type transfer robot 16 using an exclusive arm. On the other hand, on the chuck 2b of the second zone, the grindstone is lowered to bring the grindstone into contact with the substrate, the spindle shaft of the chuck and the spindle of the grindstone are rotated, and the grindstone is slid on the surface of the substrate. Grind and raise the grindstone when grinding is complete. The substrate is inverted on the chuck 2c of the third zone. On the chuck 2d of the fourth zone, the grindstone is lowered to bring the grindstone into contact with the substrate, and the spindle shaft of the chuck and the grindstone are rotated to slide the grindstone on the substrate surface to grind the substrate surface. When grinding is completed, raise the grinding wheel. The following steps are repeated.

The other is that the index table 3 is rotated clockwise or counterclockwise three times at 90 degrees, 90 degrees, 90 degrees, and then once at 270 degrees in the opposite direction. This is a method of grinding the front and back surfaces of the substrate in the following steps (1) to (9).

(1) The substrate is taken out of the cassette 15 by one arm of the double arm type transfer robot 16 and placed on the chuck 2a located in the first zone.

(2) The index table 3 is rotated clockwise by 90 degrees, the chuck 2a located at the position of the first zone s1 is moved to the second zone s2, The chuck 2b at the position is located at the third zone s3, the chuck 2c at the third zone is located at the fourth zone s4, and the chuck 2d at the fourth zone is located at the fourth zone s3. Transfer to one zone s1. Then, the chuck 2 at the position of the first zone
Place a new substrate on d. On the other hand, on the chuck 2a of the second zone, the grindstone 6 is lowered to bring the grindstone into contact with the substrate.
By rotating the spindle axis of the chuck and the spindle axis of the grinding wheel, the grinding wheel is slid on the substrate surface to grind the substrate surface,
When grinding is completed, raise the grindstone.

(3) By rotating the index table 90 degrees clockwise (forward), the chuck 2d located at the position of the first zone is moved to the second zone, and the second zone is moved to the second zone. The chuck 2a located at the third zone is located at the third zone, the chuck 2b located at the third zone is located at the fourth zone, and the chuck 2c located at the fourth zone is located at the first zone. Transfer to zone. Next, a new substrate is placed on the chuck 2c at the position of the first zone. On the other hand, on the chuck 2d of the second zone, the grindstone is lowered to bring the grindstone into contact with the substrate, the spindle shaft of the chuck and the spindle of the grindstone are rotated, and the grindstone is slid on the surface of the substrate so that the surface of the substrate is reduced. Grind and raise the grindstone when grinding is complete. The substrate is reversed by the reversing / transfer robot 17 on the chuck 2a of the third zone.

(4) By rotating the index table 90 degrees clockwise, the chuck 2c located at the position of the first zone is moved to the second zone, and the chuck 2c is moved to the position of the second zone. Chuck 2d in the third zone, chuck 2a in the third zone position in the fourth zone, and chuck 2b in the fourth zone position in the first zone. Transfer. Next, a new substrate is placed on the chuck 2b at the position of the first zone. On the other hand, on the chuck 2c of the second zone, the grindstone is lowered to bring the grindstone into contact with the substrate, the spindle shaft of the chuck and the spindle of the grindstone are rotated, and the grindstone is slid on the surface of the substrate so that the surface of the substrate is reduced. Grind and raise the grindstone when grinding is complete. The substrate is turned over on the chuck 2d of the third zone. On the chuck 2a in the fourth zone, the grindstone is lowered to bring the grindstone into contact with the substrate, and the spindle shaft of the chuck and the spindle of the grindstone are rotated to slide the grindstone on the substrate surface to grind the substrate surface. When grinding is completed, raise the grinding wheel.

(5) The index table is rotated 270 degrees in a direction opposite to the clockwise direction so that the chuck 2b at the position of the first zone is moved to the second zone and the second zone is moved to the second zone. The chuck 2c at the third zone is located at the third zone, the chuck 2d at the third zone is located at the fourth zone, and the chuck 2a at the fourth zone is located at the first zone. Transfer to zone.
Next, the substrate having both surfaces ground from the chuck at the position of the first zone is unloaded by using the other arm of the double arm type transfer robot 16, and then transferred to the cleaning device 19, Double arm type transfer robot 16
A new substrate is placed using the arm for loading. on the other hand,
On the chuck 2b of the second zone, the grindstone is lowered to bring the grindstone into contact with the substrate, the spindle shaft of the chuck and the spindle shaft of the grindstone are rotated, and the grindstone is slid on the substrate surface to grind the substrate surface. When grinding is completed, raise the grinding wheel.
The substrate is inverted on the chuck 2c of the third zone. On the chuck 2d of the fourth zone, the grindstone is lowered to bring the grindstone into contact with the substrate, and the spindle shaft of the chuck and the grindstone are rotated to slide the grindstone on the substrate surface to grind the substrate surface. When grinding is completed, raise the grinding wheel.

(6) By rotating the index table 90 degrees clockwise, the chuck 2a at the position of the first zone is moved to the second zone, and the chuck 2a is moved to the position of the second zone. The chuck 2b is located in the third zone, the chuck 2c located in the third zone is located in the fourth zone, and the chuck 2d located in the fourth zone is located in the first zone. Transfer. Then, the substrate whose both surfaces have been ground from the chuck 2d at the position of the first zone is transferred to the other arm of the double arm type transfer robot 16.
After unloading using the arm, the wafer is transferred to the cleaning device 19, unloaded using the loading arm of the double-arm transfer robot 16, and a new substrate is placed thereon. On the other hand, on the chuck 2a of the second zone, the grindstone is lowered to bring the grindstone into contact with the substrate, the spindle shaft of the chuck and the spindle of the grindstone are rotated, and the grindstone is slid on the surface of the substrate to cause the surface of the substrate to slide. Grind and raise the grindstone when grinding is complete. The substrate is turned over on the chuck 2b of the third zone. On the chuck 2c of the fourth zone, the grindstone is lowered to bring the grindstone into contact with the substrate, and the spindle shaft of the chuck and the grindstone are rotated to slide the grindstone on the substrate surface to grind the substrate surface. When grinding is completed, raise the grinding wheel.

(7) By rotating the index table 90 degrees clockwise, the chuck 2d at the position of the first zone is moved to the second zone, and the chuck 2d is moved to the position of the second zone. The chuck 2a is transferred to the third zone, the chuck 2b at the third zone position is transferred to the fourth zone, and the chuck 2c at the fourth zone position is transferred to the first zone. I do. Then, the substrate whose both surfaces have been ground from the chuck 2c at the position of the first zone is unloaded by using the other arm of the double arm type transfer robot 16, and then transferred to the cleaning device 19. After unloading using the loading arm of the double arm type transfer robot 16, a new substrate is placed. On the other hand, on the chuck 2d of the second zone, the grindstone is lowered to bring the grindstone into contact with the substrate, the spindle shaft of the chuck and the spindle of the grindstone are rotated, and the grindstone is slid on the surface of the substrate so that the surface of the substrate is reduced. Grind and raise the grindstone when grinding is complete. The substrate is turned over on the chuck 2a of the third zone. On the chuck 2b of the fourth zone, the grindstone is lowered to bring the grindstone into contact with the substrate, and the spindle shaft of the chuck and the grindstone are rotated to slide the grindstone on the substrate surface to grind the substrate surface. When grinding is completed, raise the grinding wheel.

(8) The index table 3 is rotated clockwise by 90 degrees so that the chuck 2c located at the first zone position is moved to the second zone and the chuck 2c is moved to the second zone position. The existing chuck 2d is located in the third zone, the chuck 2a located in the third zone is located in the fourth zone, and the chuck 2b located in the fourth zone is located in the first zone. Transfer. Then, the substrate whose both surfaces are ground from the chuck 2b at the position of the first zone is transferred to the other arm of the double arm type transfer robot 16.
After unloading using the arm, the wafer is transferred to the cleaning device 19, unloaded using the loading arm of the double-arm transfer robot 16, and a new substrate is placed thereon. On the other hand, on the chuck 2c of the second zone, the grindstone is lowered to bring the grindstone into contact with the substrate, the spindle shaft of the chuck and the spindle of the grindstone are rotated, and the grindstone is slid on the surface of the substrate so that the surface of the substrate is reduced. Grind and raise the grindstone when grinding is complete. The substrate is turned over on the chuck 2d of the third zone. On the chuck 2a in the fourth zone, the grindstone is lowered to bring the grindstone into contact with the substrate, and the spindle shaft of the chuck and the spindle of the grindstone are rotated to slide the grindstone on the substrate surface to grind the substrate surface. When grinding is completed, raise the grinding wheel.

(9) Hereinafter, the index table 3 of (5) to (8) is shifted by 270 degrees in a direction opposite to the clockwise direction.
Rotated 90 degrees clockwise, 90 degrees clockwise, and 90 degrees clockwise, substrate unloading / substrate loading (first zone) and substrate grinding in each zone. (Second zone), reversal of the substrate (third zone) and grinding of the substrate (fourth zone) are repeated.

The type of the chuck 2 is such that a vacuum chuck is used for a substrate such as a semiconductor wafer or a glass substrate, and a GMR is used.
Head substrate, MR head substrate, Ga-P substrate, Ga-A
An electromagnetic chuck is preferable for a magnetic material such as an s substrate. Both the magnetic chuck and the vacuum chuck are preferably finished plates having a surface flatness of 1 μm or less, preferably 0.1 μm or less.

The direction of rotation of the grindstone 6 in the second zone s2,
When the rotation direction of the grindstone 6 in the fourth zone s4 is the same, even if the rotation direction of the chuck in the second zone is the same as the rotation direction of the chuck in the fourth zone. , May be in the opposite direction. The opposite direction is preferable for the thickness distribution of the substrate.

The substrate cleaned by the cleaning device 19 is unlocked.
It is stored in a cassette 15 'for loading and is subjected to the next lapping or polishing. Wrap device 10
At 0, the substrate is affixed to the mounting plate with an adhesive, the substrate is placed in contact with the polisher 101 ', and the weight 105 is placed. The load on the substrate varies depending on the use of the substrate and the degree of flatness of the substrate, but is from 10 g / cm ² to 10 kg / cm ^2.
Is preferred. When lapping the substrate, polisher 10
An abrasive is supplied on 1 '. The type of abrasive varies depending on the use of the substrate, but includes diamond slurry, alumina slurry, cerium oxide slurry, boehmite slurry.
Are used. For hard substrates such as AlTiC, diamond slurry is optimal.

The rotation speed of the polisher 101 ′ is 1 to 30 rpm and the rotation speed of the conditioner 109 is 1 to 60 rpm, although it varies depending on the type and use of the substrate.
The swing width of the fixing member 107 of the station 102 is 5 to 60 m.
m, the oscillation speed is 1 to 25 rpm.

The substrate is polished by, for example, a polishing apparatus 200 shown in FIG.
Is placed on a vacuum chuck 209, sucked and fixed, the platen 202 is lowered by an elevating mechanism 208 to make contact with the substrate, and the abrasive slurry is supplied from the supply pipe 213 onto the substrate while the spindle shaft 203 is in contact with the substrate. This is performed by sliding the platen over the substrate surface by rotating 210. At the time of polishing, it is preferable that the slide 211 holding the head 201 is reciprocated by 5 to 50 mm on the guide rail 212 in the front-rear direction in the drawing.

As another embodiment of the present invention for grinding the front and back surfaces of a substrate one by one, an example using a grinding device and a lapping device shown in FIG. 4 will be described below. Grinding device 1 shown in FIG.
The index table 3 is divided into two indices, a first zone s1 for loading / unloading / unloading the substrate and a second zone s2 for grinding the substrate. The negative electrode is divided by a wall 300 having a height of a gap through which the substrate can pass from the surface position of the index table. Two electromagnetic chucks 2a and 2b are provided for comparison with the spindle axis of the index table 3, and a grindstone 6 supported by a spindle 7 is separated on the electromagnetic chuck of the second zone. It is provided.

The step of grinding the front and back surfaces of the substrate using such a grinding apparatus is performed in the following steps. The substrate w is placed on the magnetic chuck 2a located in the first zone s.
Put. By rotating the index table 3 clockwise by 180 degrees, the magnetic chuck 2b located at the second zone position
Is transferred to the first zone, and the magnetic chuck 2a located at the position of the first zone is transferred to the second zone. Next, a new substrate is placed on the electromagnetic chuck 2b at the position of the first zone.
On the other hand, on the magnetic chuck 2a of the second zone, the grindstone 6 is lowered to bring the grindstone into contact with the substrate, and the spindle shaft of the magnetic chuck and the spindle shaft 7 of the grindstone are rotated to slide the grindstone on the substrate surface. To grind the substrate surface, and when the grinding is completed, raise the grindstone 6.

By rotating the index table 180 degrees in the counterclockwise direction, the magnetic chuck 2a located at the second zone is moved to the first zone, and the position of the first zone is shifted to the first zone. Is transferred to the second zone.
Then, the substrate whose surface has been ground on the magnetic chuck 2a located in the first zone is inverted and placed on the magnetic chuck 2a such that the back surface of the substrate faces upward. On the other hand, on the magnetic chuck 2b of the second zone, the grindstone 6 is lowered to bring the grindstone into contact with the substrate, and the spindle shaft of the magnetic chuck and the grindstone spindle 7 are rotated to slide the grindstone on the substrate surface. To grind the substrate surface, and when the grinding is completed, raise the grindstone. By rotating the index table 180 degrees clockwise, the magnetic chuck 2b at the position of the second zone is used as the first zone, and the magnetic chuck 2a at the position of the first zone is used. Transfer to the second zone. Next, the substrate whose surface has been ground on the magnetic chuck 2b located in the first zone is inverted and placed on the magnetic chuck 2b. On the other hand, on the magnetic chuck 2a of the second zone, the grindstone is lowered to bring the grindstone into contact with the substrate, and the spindle shaft of the magnetic chuck and the spindle shaft 7 of the grindstone 6 are rotated to slide the grindstone on the back surface of the substrate. To grind the back surface of the substrate, and raise the grindstone when the grinding is completed.

By rotating the index table 180 degrees in the counterclockwise direction, the magnetic chuck 2a located at the second zone is moved to the first zone, and the position of the first zone is shifted to the first zone. Is transferred to the second zone.
Next, the back-ground substrate on the magnetic chuck 2a located in the first zone is unloaded, and a new substrate w
Put. On the other hand, on the magnetic chuck 2b of the second zone, the grindstone is lowered to bring the grindstone into contact with the substrate, and the spindle shaft of the magnetic chuck and the spindle shaft 7 of the grindstone 6 are rotated to slide the grindstone on the back surface of the substrate. To grind the back surface of the substrate, and raise the grindstone when the grinding is completed.

By rotating the index table 180 degrees clockwise, the magnetic chuck 2b at the position of the second zone is used as the first zone, and the magnetic chuck 2b at the position of the first zone is used. The chuck 2a is transferred to the second zone. Next, the back-ground substrate on the magnetic chuck 2b located in the first zone is unloaded and a new substrate is mounted. On the other hand, on the magnetic chuck 2a of the second zone, the grindstone is lowered to bring the grindstone into contact with the substrate, and the spindle shaft of the magnetic chuck and the spindle shaft 7 of the grindstone 6 are rotated to slide the grindstone on the substrate surface. To grind the substrate surface, and when the grinding is completed, raise the grindstone. Hereinafter, the above steps are repeated.

The rotation of the index table 3 is 180 degrees.
It is preferable to repeat the clockwise, positive, and negative directions of -180, 180, and -180 degrees in the clockwise direction because the wiring of the electric system and the piping of the water system become easy. If a universal rotary joint is used, the rotation of the index table 3
The repetition may be 180 degrees, 180 degrees, 180 degrees, and 180 degrees in the clockwise positive direction. Also, -180
Degrees, -180 degrees, -180 degrees, and -180 degrees may be repeated in a direction opposite to the clockwise direction.

The substrate whose both surfaces have been ground is lapped by using the lapping device 100 as described above.

[0069]

The substrate of which both surfaces are ground by the method of grinding the front and back surfaces of the substrate one by one according to the present invention has flatness (T).
TV) is 1 μm or less, and the surface roughness is 0.1 μm or less, which is excellent in flatness. The grinding device is also compact.

[Brief description of the drawings]

FIG. 1 is a simplified plan view of a grinding device and a lapping device used for grinding both sides of a substrate of the present invention one by one.

FIG. 2 is a front view showing a substrate grinding apparatus of the present invention.

FIG. 3 is a front view of the polishing apparatus.

FIG. 4 is a simplified plan view showing a grinding device and a lapping device used for grinding both sides of a substrate of the present invention, which shows another aspect, one by one.

FIG. 5 is a simplified plan view of a conventional grinding device and a lapping device used for grinding both surfaces of a substrate one by one.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Grinding device w Work 2 Chuck 2a Chuck 2b Chuck 2c Chuck 2d Chuck s1 First zone s2 Second zone s3 Third zone s4 Fourth zone 15, 15 'Cassette 16 Double arm Die transfer robot 17 Reversing / transfer robot 18 Transfer robot 19 Cleaning device 100 Lapping device 200 Polishing device

 ────────────────────────────────────────────────── ─── Continued on the front page F term (reference) 3C058 AA04 AA07 AA18 AA19 AB01 AB03 AB08 AB09 AC01 CA01 CB01

Claims (9)

[Claims] 1. A first zone for performing substrate loading / unloading, a second zone for performing substrate grinding, a third zone for performing substrate inversion, and a second zone for performing substrate grinding. Four zones
A lower platen provided with four chucks mounted on a spindle shaft at equidistant positions on a concentric circle with respect to the axis of the index table, on an index table rotatable at every 90 degrees indicated on the index table. , And a grinding wheel supported on a spindle shaft head which is independently provided on the chuck of the second zone of the index table and the chuck of the second zone and which is vertically movable. A method of grinding the front and back surfaces of a substrate in the following steps using a grinding device including an upper surface plate for fixing two units. The substrate is placed on the chuck located in the first zone. Rotate the index table 90 degrees,
The chuck in the second zone is located in the second zone, the chuck in the second zone is located in the third zone, and the chuck located in the third zone is located in the fourth zone. And the chuck located at the position of the fourth zone is transferred to the first zone. Next, a new substrate is placed on the chuck at the position of the first zone. On the other hand, on the magnetic chuck of the second zone, the grindstone is lowered to bring the grindstone into contact with the substrate, the spindle shaft of the chuck and the spindle of the grindstone are rotated, and the grindstone is slid on the surface of the substrate to cause the surface of the substrate to slide. Grind and raise the grindstone when grinding is complete. Rotate the index table 90 degrees,
The chuck in the second zone is located in the second zone, the chuck in the second zone is located in the third zone, and the chuck located in the third zone is located in the fourth zone. And the chuck located at the position of the fourth zone is transferred to the first zone. Next, a new substrate is placed on the chuck at the position of the first zone. On the other hand, on the chuck in the second zone, the grindstone is lowered to bring the grindstone into contact with the substrate, the spindle shaft of the chuck and the spindle of the grindstone are rotated, and the grindstone is slid on the substrate surface to grind the substrate surface. Then, when grinding is completed, raise the grinding wheel. The substrate is inverted on the third zone chuck. Rotate the index table 90 degrees,
The chuck in the second zone is located in the second zone, the chuck in the second zone is located in the third zone, and the chuck located in the third zone is located in the fourth zone. And the chuck located at the position of the fourth zone is transferred to the first zone. Next, a new substrate is placed on the chuck at the position of the first zone. On the other hand, on the chuck in the second zone, the grindstone is lowered to bring the grindstone into contact with the substrate, the spindle shaft of the chuck and the spindle of the grindstone are rotated, and the grindstone is slid on the substrate surface to grind the substrate surface. Then, when grinding is completed, raise the grinding wheel. The substrate is inverted on the third zone chuck.
On the chuck in the fourth zone, the grindstone is lowered to bring the grindstone into contact with the substrate, the spindle shaft of the chuck and the spindle of the grindstone are rotated, and the grindstone is slid on the substrate surface to grind the substrate surface. When grinding is completed, raise the grindstone. Rotate the index table 90 degrees,
The chuck in the second zone is located in the second zone, the chuck in the second zone is located in the third zone, and the chuck located in the third zone is located in the fourth zone. And the chuck located at the position of the fourth zone is transferred to the first zone. Next, after unloading the substrate whose both surfaces have been ground from the chuck at the position of the first zone, a new substrate is mounted.
On the other hand, on the chuck in the second zone, the grindstone is lowered to bring the grindstone into contact with the substrate, the spindle shaft of the chuck and the spindle of the grindstone are rotated, and the grindstone is slid on the substrate surface to grind the substrate surface. Then, when grinding is completed, raise the grinding wheel. The substrate is turned over on the magnetic chuck of the third zone. On the chuck in the fourth zone, the grindstone is lowered to bring the grindstone into contact with the substrate, the spindle shaft of the chuck and the spindle of the grindstone are rotated, and the grindstone is slid on the substrate surface to grind the substrate surface. When grinding is completed, raise the grindstone. The following steps are repeated. 2. A first zone for substrate loading / unloading, a second zone for substrate grinding, a third zone for substrate reversal, and a third zone for substrate grinding. Four zones
An index table rotatable at every 90 degrees indicated on the index table, and four magnetic chucks mounted on a spindle shaft are provided concentrically at equal intervals with respect to the axis of the index table. The disk and the chuck of the second zone of the index table and the chuck of the second zone are separately provided separately from each other and are supported by a spindle shaft head which is provided so as to be able to move up and down. Whetstone 2
A method of grinding the front and back surfaces of a substrate in the following steps (1) to (9) using a grinding device including an upper surface plate for fixing a base. (1) The substrate is placed on the chuck located in the first zone. (2) By rotating the index table 90 degrees clockwise, the chuck located at the first zone position is replaced by the second zone, and the chuck located at the second zone position is replaced by the second zone. Three zones
The chuck located at the position of the third zone is transferred to the fourth zone, and the chuck located at the position of the fourth zone is transferred to the first zone. Next, a new substrate is placed on the chuck at the position of the first zone. On the other hand, on the chuck in the second zone, the grindstone is lowered to bring the grindstone into contact with the substrate, the spindle shaft of the chuck and the spindle of the grindstone are rotated, and the grindstone is slid on the substrate surface to grind the substrate surface. Then, when grinding is completed, raise the grinding wheel. (3) By rotating the index table 90 degrees clockwise, the chuck located at the first zone is replaced by the second zone, and the chuck located at the second zone is removed by the second zone. Three zones
The chuck located at the position of the third zone is transferred to the fourth zone, and the chuck located at the position of the fourth zone is transferred to the first zone. Next, a new substrate is placed on the chuck at the position of the first zone. On the other hand, on the chuck in the second zone, the grindstone is lowered to bring the grindstone into contact with the substrate, the spindle shaft of the chuck and the spindle of the grindstone are rotated, and the grindstone is slid on the substrate surface to grind the substrate surface. Then, when grinding is completed, raise the grinding wheel. The substrate is inverted on the third zone chuck. (4) By rotating the index table 90 degrees clockwise, the chuck located at the first zone position is replaced by the second zone, and the chuck located at the second zone position is replaced by the second zone. Three zones
The chuck located at the position of the third zone is transferred to the fourth zone, and the chuck located at the position of the fourth zone is transferred to the first zone. Next, a new substrate is placed on the chuck at the position of the first zone. On the other hand, on the chuck in the second zone, the grindstone is lowered to bring the grindstone into contact with the substrate, the spindle shaft of the chuck and the spindle of the grindstone are rotated, and the grindstone is slid on the substrate surface to grind the substrate surface. Then, when grinding is completed, raise the grinding wheel. The substrate is inverted on the third zone chuck. On the chuck in the fourth zone, the grindstone is lowered to bring the grindstone into contact with the substrate, the spindle shaft of the chuck and the spindle of the grindstone are rotated, and the grindstone is slid on the substrate surface to grind the substrate surface. When grinding is completed, raise the grindstone. (5) The index table is rotated 270 degrees in the counterclockwise direction, and the chuck located at the first zone is moved to the second zone and the chuck is moved to the second zone. The chuck at the position of the third zone is transferred to the fourth zone, and the chuck at the position of the fourth zone is transferred to the first zone. Then, after unloading the substrate whose both surfaces have been ground from the chuck at the position of the first zone, a new substrate is mounted. On the other hand, on the chuck of the second zone, the grindstone is lowered to bring the grindstone into contact with the substrate,
By rotating the spindle axis of the chuck and the spindle axis of the grinding wheel, the grinding wheel is slid on the substrate surface to grind the substrate surface,
When grinding is completed, raise the grindstone. The substrate is inverted on the third zone chuck. On the chuck in the fourth zone, the grindstone is lowered to bring the grindstone into contact with the substrate, the spindle shaft of the chuck and the spindle of the grindstone are rotated, and the grindstone is slid on the substrate surface to grind the substrate surface. When grinding is completed, raise the grindstone. (6) By rotating the index table 90 degrees clockwise, the chuck at the position of the first zone is replaced by the second zone, and the chuck at the position of the second zone is replaced by the second. Three zones
And the chuck located at the third zone position to the fourth zone.
And the chuck located at the position of the fourth zone is transferred to the first zone. Then, after unloading the substrate whose both surfaces have been ground from the chuck at the position of the first zone,
Place a new board. On the other hand, on the chuck in the second zone, the grindstone is lowered to bring the grindstone into contact with the substrate, the spindle shaft of the chuck and the spindle of the grindstone are rotated, and the grindstone is slid on the substrate surface to grind the substrate surface. Then, when grinding is completed, raise the grinding wheel. The substrate is inverted on the third zone chuck. On the chuck in the fourth zone, the grindstone is lowered to bring the grindstone into contact with the substrate, the spindle shaft of the chuck and the spindle of the grindstone are rotated, and the grindstone is slid on the substrate surface to grind the substrate surface. When grinding is completed, raise the grindstone. (7) By rotating the index table 90 degrees clockwise, the chuck at the position of the first zone is replaced by the second zone, and the chuck at the position of the second zone is replaced by the second. Three zones
And the chuck located at the third zone position to the fourth zone.
And the chuck located at the position of the fourth zone is transferred to the first zone. Then, after unloading the substrate whose both surfaces have been ground from the chuck at the position of the first zone,
Place a new board. On the other hand, on the chuck in the second zone, the grindstone is lowered to bring the grindstone into contact with the substrate, the spindle shaft of the chuck and the spindle of the grindstone are rotated, and the grindstone is slid on the substrate surface to grind the substrate surface. Then, when grinding is completed, raise the grinding wheel. The substrate is inverted on the third zone chuck. On the chuck of the fourth zone, the grindstone is lowered to bring the grindstone into contact with the substrate, the spindle shaft of the chuck and the spindle of the grindstone are rotated, and the grindstone is slid on the substrate surface to grind the substrate surface. When grinding is completed, raise the grindstone. (8) By rotating the index table 90 degrees clockwise, the chuck located at the first zone position is replaced by the second zone, and the chuck located at the second zone position is replaced by the second zone. Three zones
And the chuck located at the third zone position to the fourth zone.
And the chuck located at the position of the fourth zone is transferred to the first zone. Then, after unloading the substrate whose both surfaces have been ground from the chuck at the position of the first zone,
Place a new board. On the other hand, on the chuck in the second zone, the grindstone is lowered to bring the grindstone into contact with the substrate, and the spindle shaft of the chuck and the grindstone are rotated to slide the grindstone on the substrate surface to grind the substrate surface. Then, when the grinding is completed, the grinding wheel is raised. The substrate is turned over on the third zone chuck. On the chuck of the fourth zone, the grindstone is lowered to bring the grindstone into contact with the substrate, the spindle shaft of the chuck and the spindle of the grindstone are rotated, and the grindstone is slid on the substrate surface to grind the substrate surface. When grinding is completed, raise the grindstone. (9) Hereinafter, the index tables of (5) to (8) are rotated 270 degrees in the counterclockwise direction, 90 degrees in the clockwise direction, 90 degrees in the clockwise direction, and 90 degrees in the clockwise direction. And then unloading the substrate at each zone.
The steps of loading the substrate (first zone), grinding the substrate (second zone), reversing the substrate (third zone), and grinding the substrate (fourth zone) are repeated. . 3. A first zone for performing substrate loading / unloading, a second zone for performing substrate grinding, a third zone for performing substrate inversion, and a third zone for performing substrate grinding. Four zones
An index table rotatable at every 90 degrees indicated on the index table, and four magnetic chucks mounted on a spindle shaft are provided concentrically at equal intervals with respect to the axis of the index table. The bearings are provided on the magnetic chuck of the second zone and the magnetic chuck of the second zone of the table and the index table and separately provided on the magnetic chucks of the second zone and independently movable up and down. Grinding machine consisting of an upper surface plate for fixing two grindstones. 4. The grinding device according to claim 3, wherein the chuck is an electromagnetic chuck. 5. The rotation direction of the grinding wheel in the second zone is the same as the rotation direction of the grinding wheel in the fourth zone, and the rotation direction of the chuck in the second zone is the same as the rotation direction of the fourth zone. The grinding method according to claim 1, wherein the rotation directions of the chucks in the negative direction are the same. 6. A rotating direction of the grinding wheel in the second zone and a rotating direction of the grinding wheel in the fourth zone are opposite to each other. 3. The grinding method according to claim 1, wherein the rotation directions of the chuck in the zone are the same. 7. An index table rotatable every 180 degrees designated to a first zone for performing substrate loading, substrate inversion and substrate unloading, and a second zone for performing substrate grinding. Then, two magnetic chucks supported by a spindle shaft are separated from each other on a lower platen provided at a position symmetrical with respect to the axis of the index table and on a magnetic chuck of a second zone of the index table. A method of grinding the front and back surfaces of a substrate in the following steps using a grinding device comprising an upper surface plate having a grindstone supported on a spindle shaft provided and capable of moving up and down. The substrate is placed on the magnetic chuck located in the first zone. By rotating the index table by 180 degrees, the magnetic chuck at the position of the second zone is set to the first zone, and the magnetic chuck at the position of the first zone is set to the second zone. Transfer. Next, a new substrate is placed on the electromagnetic chuck at the position of the first zone. On the other hand, on the magnetic chuck of the second zone, the grindstone is lowered to bring the grindstone into contact with the substrate, the spindle shaft of the magnetic chuck and the spindle of the grindstone are rotated, and the grindstone is slid on the surface of the substrate. Is ground, and when the grinding is completed, the grinding wheel is raised. By rotating the index table by 180 degrees, the magnetic chuck at the position of the second zone is set to the first zone, and the magnetic chuck at the position of the first zone is set to the second zone. Transfer. Next, the substrate whose surface has been ground on the magnetic chuck located in the first zone is inverted and placed on the magnetic chuck such that the back surface of the substrate faces upward. On the other hand, on the magnetic chuck of the second zone, the grindstone is lowered to bring the grindstone into contact with the substrate, the spindle shaft of the magnetic chuck and the spindle of the grindstone are rotated, and the grindstone is slid on the surface of the substrate. Is ground, and when the grinding is completed, the grinding wheel is raised. By rotating the index table by 180 degrees, the magnetic chuck at the position of the second zone is set to the first zone, and the magnetic chuck at the position of the first zone is set to the second zone. Transfer. Next, the substrate whose surface has been ground on the magnetic chuck located in the first zone is inverted and placed on the magnetic chuck. On the other hand, on the magnetic chuck of the second zone, the grindstone is lowered to bring the grindstone into contact with the substrate, and the spindle shaft of the magnetic chuck and the spindle of the grindstone are rotated to slide the grindstone on the backside of the substrate, and the backside of the substrate is rotated. Is ground, and when the grinding is completed, the grinding wheel is raised. By rotating the index table by 180 degrees, the magnetic chuck at the position of the second zone is set to the first zone, and the magnetic chuck at the position of the first zone is set to the second zone. Transfer. Next, the back-ground substrate on the magnetic chuck located in the first zone is unloaded and a new substrate is mounted. On the other hand, on the magnetic chuck of the second zone, the grindstone is lowered to bring the grindstone into contact with the substrate, and the spindle shaft of the magnetic chuck and the spindle of the grindstone are rotated to slide the grindstone on the backside of the substrate, and the backside of the substrate is rotated. Is ground, and when the grinding is completed, the grinding wheel is raised. By rotating the index table by 180 degrees, the magnetic chuck at the position of the second zone is set to the first zone, and the magnetic chuck at the position of the first zone is set to the second zone. Transfer. Next, the back-ground substrate on the magnetic chuck located in the first zone is unloaded and a new substrate is mounted. On the other hand, on the magnetic chuck of the second zone, the grindstone is lowered to bring the grindstone into contact with the substrate, the spindle shaft of the magnetic chuck and the spindle of the grindstone are rotated, and the grindstone is slid on the surface of the substrate. Is ground, and when the grinding is completed, the grinding wheel is raised. Hereinafter, the above steps are repeated. 8. The substrate according to claim 7, wherein the rotation of the index table by 180 degrees is alternately performed by 180 degrees clockwise and then by 180 degrees clockwise. How to grind the front and back. 9. An index table rotatable at every 180 degrees designated to a first zone for performing substrate loading, substrate inversion and substrate unloading, and a second zone for performing substrate grinding. Then, two magnetic chucks supported by a spindle shaft are separated from each other on a lower platen provided at a position symmetrical with respect to the axis of the index table and on a magnetic chuck of a second zone of the index table. And an upper surface plate having a grindstone mounted on a spindle shaft provided to be able to move up and down.