JP2001198075A - Cleaning sheet - Google Patents
Cleaning sheetInfo
- Publication number
- JP2001198075A JP2001198075A JP2000177963A JP2000177963A JP2001198075A JP 2001198075 A JP2001198075 A JP 2001198075A JP 2000177963 A JP2000177963 A JP 2000177963A JP 2000177963 A JP2000177963 A JP 2000177963A JP 2001198075 A JP2001198075 A JP 2001198075A
- Authority
- JP
- Japan
- Prior art keywords
- cleaning
- adhesive layer
- sensitive adhesive
- pressure
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cleaning In General (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
(57)【要約】
【課題】 本発明は、例えば、半導体、フラットパネル
ディスプレイ、プリント基板などの製造装置や検査装置
など、異物を嫌う基板処理装置のクリーニングシートを
提供する。
【解決手段】 支持体に、引張弾性率（試験法ＪＩＳ
Ｋ７１２７に準ずる）が０．９８〜４９００Ｎ／ｍｍ2
の粘着剤層がクリーニング層として設けられてなる、又
はさらに他面に通常の粘着剤層が設けられてなるクリー
ニングシートである。(57) Abstract: The present invention provides a cleaning sheet for a substrate processing apparatus that rejects foreign matter, such as a manufacturing apparatus or an inspection apparatus for semiconductors, flat panel displays, printed boards, and the like. SOLUTION: The support has a tensile modulus (test method JIS).
0.98 to 4900 N / mm 2
Is a cleaning sheet provided with a pressure-sensitive adhesive layer as a cleaning layer, or further provided with a normal pressure-sensitive adhesive layer on the other surface.
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、各種装置をクリー
ニングするシートに関し、例えば、半導体、フラットパ
ネルディスプレイ、プリント基板などの製造装置や検査
装置など、異物を嫌う基板処理装置のクリーニングシー
トに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sheet for cleaning various devices, and more particularly, to a cleaning sheet for a substrate processing apparatus which does not like foreign substances, such as a manufacturing apparatus and an inspection apparatus for semiconductors, flat panel displays and printed circuit boards.
【０００２】[0002]
【従来の技術】各種基板処理装置は、各搬送系と基板と
を物理的に接触させながら搬送する。その際、基板や搬
送系に異物が付着していると、後続の基板を次々に汚染
することになり、定期的に装置を停止させ、洗浄処理を
する必要があった。このため、稼働率低下や多大な労力
が必要になるという問題があった。これらの問題を解決
するため、粘着性の物質を固着した基板を搬送すること
により基板処理装置内の付着した異物をクリーニング除
去する方法が提案されている（例えば特開平１０−１５
４６８６号）。2. Description of the Related Art Various substrate processing apparatuses transport substrates while physically contacting each transport system with a substrate. At that time, if foreign matter is attached to the substrate or the transport system, the subsequent substrate is contaminated one after another, and it is necessary to periodically stop the apparatus and perform a cleaning process. For this reason, there has been a problem that the operation rate is reduced and a large amount of labor is required. In order to solve these problems, there has been proposed a method of cleaning and removing adhered foreign matter in a substrate processing apparatus by transporting a substrate to which an adhesive substance is adhered (for example, Japanese Patent Application Laid-Open No. H10-15).
No. 4686).
【０００３】[0003]
【発明が解決しようとする課題】粘着性の物質を固着し
た基板を搬送することにより基板処理装置内の付着した
異物をクリーニング除去する方法は、前述の課題を克服
する有効な方法である。しかしこの方法では粘着性物質
と装置接触部とが強く接着しすぎて剥れない恐れがあ
り、基板を確実に搬送できなくなる恐れがあった。 さ
らに、基板に基板形状より大きいクリーニングシートを
貼り付けた後、基板形状に沿ってクリーニングシートを
切断する場合には、発生した切削屑が基板に付着するな
どの恐れもある。本発明は、このような事情に照らし、
基板処理装置内に基板を確実に搬送できると共に、装置
内に付着している異物を簡便かつさらに確実に除去でき
るクリーニングシートを提供することを目的としてい
る。The method of cleaning and removing the adhered foreign matter in the substrate processing apparatus by transporting the substrate to which the adhesive substance is fixed is an effective method for overcoming the above-mentioned problem. However, in this method, the sticky substance and the device contact portion may be so strongly adhered that they cannot be peeled off, and the substrate may not be transported reliably. Furthermore, when a cleaning sheet larger than the substrate shape is attached to the substrate and the cleaning sheet is cut along the substrate shape, the generated cutting chips may adhere to the substrate. The present invention has been made in view of such circumstances,
It is an object of the present invention to provide a cleaning sheet that can surely transport a substrate into a substrate processing apparatus and that can easily and more reliably remove foreign substances adhering to the apparatus.
【０００４】[0004]
【課題を解決するための手段】本発明者らは、上記の目
的を達成するために、鋭意検討した結果、粘着性の物質
を固着したシートあるいはこのシートを固着した基板を
搬送することにより、基板処理装置内の付着した異物を
クリーニング除去するにあたり、そのクリーニング層と
しての粘着剤層の引張弾性率を特定範囲内にすることに
より、前記問題を生じることなく、さらに異物を簡便か
つ確実に除去できることを見出し、本発明を完成するに
至つた。Means for Solving the Problems The present inventors have conducted intensive studies in order to achieve the above object, and as a result, by transporting a sheet to which an adhesive substance is fixed or a substrate to which this sheet is fixed, In cleaning and removing the adhered foreign matter in the substrate processing apparatus, by setting the tensile elasticity of the pressure-sensitive adhesive layer as a cleaning layer within a specific range, the foreign matter can be easily and reliably removed without causing the above problem. They have found that they can do this and have completed the present invention.
【０００５】即ち、本発明は、支持体に、引張弾性率
（試験法ＪＩＳ Ｋ７１２７に準ずる）が０．９８〜４
９００Ｎ／ｍｍ2の粘着剤層がクリーニング層として設
けられてなるクリーニングシート（請求項１）、支持体
の片面に、引張弾性率（試験法ＪＩＳ Ｋ７１２７に準
ずる）が０．９８〜４９００Ｎ／ｍｍ2の粘着剤層がク
リーニング層として設けられ、他面に通常の粘着剤層が
設けられてなるクリーニングシート（請求項２）、クリ
ーニング層としての粘着剤層のシリコンウエハ（ミラー
面）に対する１８０°引き剥がし粘着力が０．２０Ｎ
（２０ｇ）／１０ｍｍ以下であるクリーニングシート
（請求項４）、通常の粘着剤層のシリコンウエハ（ミラ
ー面）に対する１８０°引き剥がし粘着力が０．２１〜
０．９８Ｎ／１０ｍｍであるクリーニングシート（請求
項５）などに係るものである。That is, according to the present invention, the support has a tensile modulus (according to the test method JIS K7127) of 0.98 to 4
A cleaning sheet provided with a pressure-sensitive adhesive layer of 900 N / mm 2 as a cleaning layer (Claim 1), a tensile elastic modulus (according to test method JIS K7127) of 0.98 to 4900 N / mm 2 on one surface of a support. (Claim 2) in which a pressure-sensitive adhesive layer is provided as a cleaning layer and a normal pressure-sensitive adhesive layer is provided on the other surface. Peeling power is 0.20N
(20 g) / 10 mm or less cleaning sheet (Claim 4), 180 ° peeling adhesive strength of a normal adhesive layer to a silicon wafer (mirror surface) is 0.21 to 0.21.
The present invention relates to a cleaning sheet having 0.98 N / 10 mm (Claim 5).
【０００６】[0006]
【発明の実施の形態】本発明のクリーニングシートは、
支持体の片面にクリーニング層が設けられ、該クリーニ
ング層は、その引張弾性率（試験法ＪＩＳ Ｋ７１２７
に準ずる）が０．９８〜４９００Ｎ／ｍｍ2、好ましく
は９．８〜３０００Ｎ／ｍｍ2の粘着剤層からなる。
本発明においては、クリーニング層の引張弾性率をかか
る特定範囲内に設計することにより、搬送トラブルを発
生することなく、異物を除去することができる。 この
引張弾性率が４９００Ｎ／ｍｍ2を超えると、搬送系上
の付着異物を除去する性能が低下し、０．９８Ｎ／ｍｍ
2未満の場合、搬送時に装置内の被クリーニング部に接
着して搬送トラブルとなる恐れがある。DESCRIPTION OF THE PREFERRED EMBODIMENTS The cleaning sheet of the present invention
A cleaning layer is provided on one side of the support, and the cleaning layer has a tensile elasticity (test method JIS K7127).
) Of 0.98 to 4900 N / mm 2 , preferably 9.8 to 3000 N / mm 2 .
In the present invention, by designing the tensile elastic modulus of the cleaning layer to fall within such a specific range, foreign substances can be removed without causing a transport trouble. When the tensile modulus exceeds 4900 N / mm 2, and reduced ability to remove adhering foreign matter on the transport system, 0.98N / mm
If it is less than 2 , there is a possibility that a transfer trouble may occur due to adhesion to a portion to be cleaned in the apparatus during transfer.
【０００７】かかる粘着剤層は、その引張弾性率が前述
の範囲内である限り、その材質等は特に限定されない
が、紫外線や熱などの活性エネルギー源により架橋反応
や硬化が促進されて、その引張弾性率を大きくできるも
のが好ましい。 さらに、かかる架橋や硬化により分子
構造が三次元網状化してその粘着力が低下したものが好
ましく、例えばシリコンウエハ（ミラー面）に対する１
８０°引き剥がし粘着力が０．２０Ｎ（２０ｇ）／１０
ｍｍ以下、好ましくは０．０１０〜０．１０Ｎ（１〜１
０ｇ）／１０ｍｍ程度である。 この粘着力が、０．２
０Ｎ（２０ｇ）／ｍｍを超えると、搬送時に装置内の被
クリーニング部に接着して、搬送トラブルとなる恐れが
ある。The material and the like of the pressure-sensitive adhesive layer are not particularly limited as long as the tensile elastic modulus is within the above-mentioned range. Those capable of increasing the tensile modulus are preferred. Further, it is preferable that the molecular structure is formed into a three-dimensional network by such crosslinking and curing to reduce the adhesive strength.
80 ° peeling adhesive strength 0.20N (20g) / 10
mm or less, preferably 0.010 to 0.10 N (1 to 1
0 g) / 10 mm. This adhesive strength is 0.2
If it exceeds 0 N (20 g) / mm, it may adhere to the portion to be cleaned in the apparatus at the time of transport, and may cause transport trouble.
【０００８】かかる粘着剤層の具体例としては、例えば
感圧接着性ポリマーに分子内に不飽和二重結合を１個以
上有する化合物を含有させてなるものが好ましい。ま
た、かかる感圧接着性ポリマーとしては、例えばアクリ
ル酸、アクリル酸エステル、メタクリル酸、メタクリル
酸エステルから選ばれる（メタ）アクリル酸及び／又は
（メタ）アクリル酸エステルを主モノマーとしたアクリ
ル系ポリマーが挙げられる。このアクリル系ポリマーの
合成にあたり、共重合モノマーとして分子内に不飽和二
重結合を２個以上有する化合物を用いるか、あるいは合
成後のアクリル系ポリマーに分子内に不飽和二重結合を
有する化合物を官能基間の反応で化学結合させるなどし
て、アクリル系ポリマーの分子内に不飽和二重結合を導
入しておくことにより、このポリマー自体も活性エネル
ギーにより重合硬化反応に関与させるようにすることも
できる。As a specific example of the pressure-sensitive adhesive layer, for example, a pressure-sensitive adhesive polymer containing a compound having at least one unsaturated double bond in a molecule is preferable. Further, as such a pressure-sensitive adhesive polymer, for example, an acrylic polymer containing (meth) acrylic acid and / or (meth) acrylic acid ester as a main monomer selected from acrylic acid, acrylic acid ester, methacrylic acid, and methacrylic acid ester Is mentioned. In synthesizing this acrylic polymer, a compound having two or more unsaturated double bonds in the molecule is used as a copolymerization monomer, or a compound having an unsaturated double bond in the molecule is synthesized from the synthesized acrylic polymer. By introducing an unsaturated double bond into the molecule of the acrylic polymer, for example, by chemically bonding through a reaction between functional groups, the polymer itself can be involved in the polymerization curing reaction by active energy. Can also.
【０００９】ここで、分子内に不飽和二重結合を１個以
上有する化合物（以下、重合性不飽和化合物という）と
しては、不揮発性でかつ重量平均分子量が１００００以
下の低分子量体であるのがよく、特に硬化時の粘着剤層
の三次元網状化が効率よくなされるように、５０００以
下の分子量を有しているのが好ましい。The compound having one or more unsaturated double bonds in the molecule (hereinafter referred to as a polymerizable unsaturated compound) is a low molecular weight compound which is nonvolatile and has a weight average molecular weight of 10,000 or less. In particular, the adhesive layer preferably has a molecular weight of 5000 or less so that the three-dimensional network of the pressure-sensitive adhesive layer at the time of curing can be efficiently formed.
【００１０】また、粘着剤層に添加される重合開始剤
は、特に限定されず公知のものを使用でき、例えば活性
エネルギー源に熱を用いる場合は、ベンゾイルパーオキ
サイド、アゾビスイソブチロニトリルなどの熱重合開始
剤、また光を用いる場合は、ベンゾイル、ベンゾインエ
チルエーテル、シベンジル、イソプロピルベンゾインエ
ーテル、ベンゾフェノン、ミヒラーズケトンクロロチオ
キサントン、ドデシルチオキサントン、ジメチルチオキ
サントン、アセトフェノンジエチルケタール、ベンジル
ジメチルケタール、α−ヒドルキシシクロヒキシルフェ
ニルケトン、２−ヒドロキシジメチルフェニルプロパ
ン、２，２−ジメトキシ−２−フェニルアセトフェノン
などの光重合開始剤が挙げられる。また粘着剤層の厚さ
は特に限定されないが、通常５〜１００μｍ程度であ
る。The polymerization initiator to be added to the pressure-sensitive adhesive layer is not particularly limited, and known polymerization initiators can be used. For example, when heat is used as an active energy source, benzoyl peroxide, azobisisobutyronitrile, etc. Benzoyl, benzoin ethyl ether, cibenzyl, isopropyl benzoin ether, benzophenone, Michler's ketone chlorothioxanthone, dodecylthioxanthone, dimethylthioxanthone, acetophenone diethyl ketal, benzyl dimethyl ketal, α- Examples include photopolymerization initiators such as droxycyclohexyl phenyl ketone, 2-hydroxydimethylphenylpropane, and 2,2-dimethoxy-2-phenylacetophenone. The thickness of the pressure-sensitive adhesive layer is not particularly limited, but is usually about 5 to 100 μm.
【００１１】本発明は、支持体の片面に、上記の特定の
粘着剤層がクリーニング層として設けられ、他面に通常
の粘着剤層が設けられたクリーニングシートも提供す
る。この他面側の粘着剤層は、粘着機能を満たす限りそ
の材質などは特に限定されず、通常の粘着剤（例えばア
クリル系、ゴム系など）を用いることができる。かかる
構成とすることにより、クリーニングシートを通常の粘
着剤層により各種基板や他のテープ・シートなどの搬送
部材に貼り付けて、クリーニング機能付き搬送部材（請
求項６）として装置内に搬送して、被洗浄部位に接触さ
せてクリーニングすること（請求項７）もできる。The present invention also provides a cleaning sheet in which the above-mentioned specific pressure-sensitive adhesive layer is provided as a cleaning layer on one side of a support, and a normal pressure-sensitive adhesive layer is provided on the other side. The material of the pressure-sensitive adhesive layer on the other side is not particularly limited as long as it satisfies the pressure-sensitive adhesive function, and a normal pressure-sensitive adhesive (for example, acrylic or rubber-based) can be used. With this configuration, the cleaning sheet is attached to a transport member such as various substrates or other tapes / sheets with a normal adhesive layer, and is transported into the apparatus as a transport member with a cleaning function (Claim 6). Alternatively, cleaning can be performed by contacting the part to be cleaned (claim 7).
【００１２】本発明において上記の基板などの搬送部材
を再利用するために、クリーニング後に基板をかかる粘
着剤層から剥がす場合は、かかる通常の粘着剤層の粘着
力は、シリコンウエハ（ミラー面）に対する１８０°引
き剥がし粘着力が０．２１〜０．９８Ｎ／１０ｍｍ（請
求項５）、特に０．４０〜０．９８Ｎ／１０ｍｍ程度で
あれば、搬送中に剥離することなく、かつクリーンニン
グ後に容易に再剥離できるので好ましい。In the present invention, when the substrate is peeled off from the pressure-sensitive adhesive layer after cleaning in order to reuse the transfer member such as the substrate, the adhesive force of the normal pressure-sensitive adhesive layer is determined by a silicon wafer (mirror surface). 180 ° peeling strength to 0.21 to 0.98 N / 10 mm (Claim 5), especially about 0.40 to 0.98 N / 10 mm, without peeling during transportation and after cleaning It is preferable because it can be easily removed again.
【００１３】またクリーニング層の支持体としては特に
限定されないが、例えばポリエチレン、ポリエチレンテ
レフタレート、アセチルセルロース、ポリカーボネー
ト、ポリプロピレン、ポリアミドなどのプラスチックフ
ィルムなどが挙げられる。 その厚みは通常１０〜１０
０μｍ程度である。The support for the cleaning layer is not particularly limited, and examples thereof include plastic films such as polyethylene, polyethylene terephthalate, acetylcellulose, polycarbonate, polypropylene and polyamide. Its thickness is usually 10 to 10
It is about 0 μm.
【００１４】クリーニングシートが貼り付けられる搬送
部材としては特に限定されないが、例えば半導体ウエ
ハ、ＬＣＤ、ＰＤＰなどのフラットパネルディスプレイ
用基板、その他コンパクトディスク、ＭＲヘッドなどの
基板などが挙げられる。The transport member to which the cleaning sheet is adhered is not particularly limited, and examples thereof include semiconductor wafers, substrates for flat panel displays such as LCDs and PDPs, and other substrates such as compact disks and MR heads.
【００１５】[0015]
【実施例】以下、本発明を実施例に基づいて説明する
が、本発明はこれらに限定されるものではない。 な
お、以下、部とあるのは重量部を意味するものとする。 実施例 アクリル酸−２−エチルヘキシル７５部、アクリル酸メ
チル２０部、及びアクリル酸５部からなるモノマ―混合
液から得たアクリル系ポリマー（重量平均分子量７０
万）１００部に対して、ポリエチレングリコ―ルジメタ
クリレ―ト５０部、ウレタンアクリレ―ト５０部、ベン
ジルジメチルケタール３部、及びジフエニルメタンジイ
ソシアネ―ト３部を均一に混合し、紫外線硬化型の粘着
剤溶液とした。一方、上記粘着剤からベンジルジメチル
ケタールを除いた以外は、上記と同様にして得た粘着剤
溶液を、幅２５０ｍｍ、厚み２５μｍのポリエステル製
支持フィルムの片面に、乾燥後の厚みが１０μｍになる
ように塗布して通常の粘着剤層を設け、その表面に厚さ
３８μｍのポリエステル系剥離フィルムを貼った。 支
持フィルムのもう一方の側に、前記の紫外線硬化型粘着
剤溶液を乾燥後の厚みが４０μｍになるように塗布して
クリーニング層としての粘着剤層を設け、その表面に同
様の剥離フィルムを貼った。このシートに中心波長３６
５ｎｍの紫外線を積算光量１０００ｍＪ／ｃｍ2照射し
て、本発明のクリーニングシートを得た。 このクリー
ニングシートのクリーニング層の粘着剤層の紫外線硬化
後の引張弾性率は４９Ｎ／ｍｍ2であった。ここで引張
弾性率は、試験法ＪＩＳ Ｋ７１２７に準じて測定し
た。また、クリーニング層側の粘着剤層をシリコンウエ
ハのミラー面に幅１０ｍｍで貼り付け、ＪＩＳ Ｚ０２
３７に準じてシリコンウエハに対する１８０°引き剥が
し粘着力を測定した結果、０．０７８Ｎ（８ｇ）／１０
ｍｍであった。また、他面側の通常の粘着剤層のシリコ
ンウエハ（ミラー面）に対する１８０°引き剥がし粘着
力を上記と同様に測定した結果、０．２５Ｎ／１０ｍｍ
であった。EXAMPLES The present invention will be described below with reference to examples, but the present invention is not limited to these examples. Hereinafter, “parts” means “parts by weight”. Example An acrylic polymer (weight average molecular weight 70) obtained from a monomer mixture consisting of 75 parts of 2-ethylhexyl acrylate, 20 parts of methyl acrylate, and 5 parts of acrylic acid
100 parts), uniformly mix 50 parts of polyethylene glycol dimethacrylate, 50 parts of urethane acrylate, 3 parts of benzyl dimethyl ketal, and 3 parts of diphenylmethane diisocyanate, and cure by ultraviolet light. A mold-type adhesive solution was obtained. On the other hand, a pressure-sensitive adhesive solution obtained in the same manner as described above, except that benzyldimethyl ketal was removed from the pressure-sensitive adhesive, was coated on one surface of a polyester support film having a width of 250 mm and a thickness of 25 μm so that the thickness after drying was 10 μm. To form a normal pressure-sensitive adhesive layer, and a 38 μm-thick polyester-based release film was stuck on the surface of the layer. On the other side of the support film, the above-mentioned UV-curable pressure-sensitive adhesive solution was applied so that the thickness after drying became 40 μm to provide a pressure-sensitive adhesive layer as a cleaning layer, and a similar release film was stuck on the surface thereof. Was. The center wavelength 36
The cleaning sheet of the present invention was obtained by irradiating a 5 nm ultraviolet ray with an integrated light quantity of 1000 mJ / cm 2 . The tensile elastic modulus of the pressure-sensitive adhesive layer of the cleaning layer of the cleaning sheet after ultraviolet curing was 49 N / mm 2 . Here, the tensile modulus was measured according to the test method JIS K7127. Further, the pressure-sensitive adhesive layer on the cleaning layer side is adhered to the mirror surface of the silicon wafer with a width of 10 mm, and is adhered to JIS Z02.
As a result of measuring the 180 ° peel adhesion to the silicon wafer according to 37, 0.078N (8 g) / 10
mm. In addition, as a result of measuring the 180 ° peeling adhesive force of the normal adhesive layer on the other surface side to the silicon wafer (mirror surface) in the same manner as described above, it was 0.25 N / 10 mm.
Met.
【００１６】このクリーニングシートの通常の粘着剤層
側の剥離フィルムを剥がし、８ｉｎｃｈのシリコンウエ
ハの裏面（ミラー面）にハンドローラで貼り付け、クリ
ーニング機能付き搬送用クリーニングウエハを作製し
た。The release film on the normal pressure-sensitive adhesive layer side of the cleaning sheet was peeled off and affixed to the back surface (mirror surface) of an 8-inch silicon wafer with a hand roller to produce a transport cleaning wafer having a cleaning function.
【００１７】一方、基板処理装置のウエハステージを２
つ取り外し、レーザー式異物測定装置で、０．３μｍ以
上の異物を測定したところ、８ｉｎｃｈウエハサイズの
エリア内で１つは２５０００個、もう一つは２２０００
個であった。On the other hand, the wafer stage of the substrate processing apparatus is
When a foreign substance having a size of 0.3 μm or more was measured using a laser type foreign substance measuring apparatus, one was 25,000 pieces and the other was 22000 pieces in an 8-inch wafer size area.
Was individual.
【００１８】次いで前記で得た搬送用クリーニングウエ
ハのクリーニング層側の剥離フィルムを剥がし、上記の
２５０００個の異物が付着していたウエハステージを持
つ基板処理装置内に搬送したところ、支障なく搬送でき
た。 その後にウエハステージを取り外し、レーザー式
異物測定装置で０．３μｍ以上の異物を測定したとこ
ろ、８ｉｎｃｈウエハサイズ内で６２００個であり、ク
リーニング前に付着していた異物数の３／４以上を除去
することができた。Next, the release film on the cleaning layer side of the cleaning wafer for transport obtained above was peeled off, and was transported into a substrate processing apparatus having a wafer stage to which the above-mentioned 25,000 foreign substances had adhered. Was. Thereafter, the wafer stage was removed, and a foreign substance having a size of 0.3 μm or more was measured with a laser type foreign substance measuring apparatus. We were able to.
【００１９】比較例 実施例において、中心波長３６５ｎｍの紫外線を積算光
量５ｍＪ／ｃｍ2照射した以外は、実施例と同様にクリ
ーニングシートを作製し、同様にクリーニング層の引張
弾性率を測定したところ、０．６７Ｎ／ｍｍ2であっ
た。 またクリーニング層の粘着剤層の対シリコンウエ
ハ粘着力を測定したところ、０．３３Ｎ（３４）ｇ／１
０ｍｍであった。このクリーニングシートから実施例と
同じ方法で作製した搬送用クリーニングウエハを、２２
０００個の異物が付着しているウエハステージを持つ基
板処理装置内を搬送したところ、ウエハステージに固着
し、搬送できなくなった。Comparative Example A cleaning sheet was prepared in the same manner as in the example, except that ultraviolet light having a central wavelength of 365 nm was irradiated with an integrated light amount of 5 mJ / cm 2 , and the tensile modulus of the cleaning layer was measured. It was 0.67 N / mm 2 . When the adhesive strength of the adhesive layer of the cleaning layer to the silicon wafer was measured, it was 0.33 N (34) g / 1.
It was 0 mm. From this cleaning sheet, a cleaning wafer for conveyance manufactured by the same method as that of the embodiment was used.
When the wafer was transported in a substrate processing apparatus having a wafer stage to which 000 foreign substances had adhered, it was fixed to the wafer stage and could not be transported.
【００２０】[0020]
【発明の効果】以上のように本発明のクリーニングシー
トによれば、基板処理装置内を確実に搬送できると共
に、装置内に付着している異物を簡便かつ確実に除去で
きる。As described above, according to the cleaning sheet of the present invention, the inside of the substrate processing apparatus can be reliably transported, and the foreign substances adhering to the apparatus can be easily and reliably removed.
Claims (7)
Ｋ７１２７に準ずる）が０．９８〜４９００Ｎ／ｍｍ2
の粘着剤層がクリーニング層として設けられてなるクリ
ーニングシート。1. A support having a tensile modulus (test method JIS)
0.98 to 4900 N / mm 2
Cleaning sheet provided with the pressure-sensitive adhesive layer as a cleaning layer.
ＩＳ Ｋ７１２７に準ずる）が０．９８〜４９００Ｎ／
ｍｍ2の粘着剤層がクリーニング層として設けられ、他
面に通常の粘着剤層が設けられてなるクリーニングシー
ト。2. A support having a tensile modulus (test method J
0.98 to 4900 N / (according to IS K7127)
A cleaning sheet in which a pressure-sensitive adhesive layer of mm 2 is provided as a cleaning layer, and a normal pressure-sensitive adhesive layer is provided on the other surface.
性エネルギーにより硬化されてなる請求項１又は２記載
のクリーニングシート。3. The cleaning sheet according to claim 1, wherein the pressure-sensitive adhesive layer as the cleaning layer is cured by activation energy.
コンウエハ（ミラー面）に対する１８０°引き剥がし粘
着力が０．２０Ｎ（２０ｇ）／１０ｍｍ以下である請求
項１〜３いずれか記載のクリーニングシート。4. The cleaning sheet according to claim 1, wherein the pressure-sensitive adhesive layer serving as a cleaning layer has an adhesive force of 180 ° peeling off to a silicon wafer (mirror surface) of 0.20 N (20 g) / 10 mm or less.
ー面）に対する１８０°引き剥がし粘着力が０．２１〜
０．９８Ｎ／１０ｍｍである請求項２〜４いずれか記載
のクリーニングシート。5. An adhesive layer having a 180 ° peeling adhesive force of 0.21 to a silicon wafer (mirror surface) of a normal adhesive layer.
The cleaning sheet according to claim 2, wherein the thickness is 0.98 N / 10 mm.
のクリーニングシートが、通常の粘着剤層により設けら
れたクリーニング機能付き搬送部材。6. A transport member with a cleaning function, wherein the cleaning sheet according to claim 2 is provided on the transport member by a normal pressure-sensitive adhesive layer.
送部材を、被洗浄部位に搬送接触させることを特徴とす
るクリーニング方法。7. A cleaning method, wherein the transfer member with a cleaning function according to claim 6 is brought into contact with a portion to be cleaned.
Priority Applications (15)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000177963A JP2001198075A (en) | 1999-11-09 | 2000-06-14 | Cleaning sheet |
| DE2001629687 DE60129687T2 (en) | 2000-06-06 | 2001-05-08 | CLEANING ELEMENT |
| EP20100011696 EP2266717A2 (en) | 2000-06-06 | 2001-05-08 | Cleaning member |
| EP01926156A EP1286792B1 (en) | 2000-06-06 | 2001-05-08 | Cleaning member |
| EP07004040.7A EP1782894A3 (en) | 2000-06-06 | 2001-05-08 | Process for preparing a conveying member with a cleaning function and cleaning sheet for use in the process |
| TW90111082A TW550688B (en) | 1999-04-28 | 2001-05-08 | Cleaning sheet, conveying member using the same, and substrate processing equipment cleaning method using them |
| CNB018106811A CN100400185C (en) | 2000-06-06 | 2001-05-08 | Cleaning sheet, transport member using the cleaning sheet, and method of cleaning substrate processing apparatus using the cleaning sheet and the transport member |
| KR1020027016584A KR100786437B1 (en) | 2000-06-06 | 2001-05-08 | Cleaning sheet, conveying member using same, and cleaning method of substrate processing apparatus using these |
| US10/297,173 US7713356B2 (en) | 2000-06-06 | 2001-05-08 | Cleaning sheet, conveying member using the same, and substrate processing equipment cleaning method using them |
| MYPI20012130A MY135752A (en) | 2000-06-06 | 2001-05-08 | Cleaning member |
| EP20100011695 EP2266716A2 (en) | 2000-06-06 | 2001-05-08 | Cleaning member |
| PCT/JP2001/003848 WO2001094036A1 (en) | 2000-06-06 | 2001-05-08 | Cleaning sheet, conveying member using the same, and substrate processing equipment cleaning method using them |
| US11/014,779 US7793668B2 (en) | 2000-06-06 | 2004-12-20 | Cleaning sheet, conveying member using the same, and substrate processing equipment cleaning method using them |
| US11/229,586 US20060105164A1 (en) | 2000-06-06 | 2005-09-20 | Cleaning sheet, conveying member using the same, and substrate processing equipment cleaning method using them |
| US12/851,797 US20100319151A1 (en) | 2000-06-06 | 2010-08-06 | Cleaning sheet, conveying member using the same, and substrate processing equipment cleaning method using them |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11-317681 | 1999-11-09 | ||
| JP31768199 | 1999-11-09 | ||
| JP2000177963A JP2001198075A (en) | 1999-11-09 | 2000-06-14 | Cleaning sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2001198075A true JP2001198075A (en) | 2001-07-24 |
Family
ID=26569103
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000177963A Pending JP2001198075A (en) | 1999-04-28 | 2000-06-14 | Cleaning sheet |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001198075A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003112128A (en) * | 2001-10-05 | 2003-04-15 | Nitto Denko Corp | Particle removal tape and cleaning method using the same |
| JP2003115522A (en) * | 2001-10-05 | 2003-04-18 | Nitto Denko Corp | Metal impurity removing tape and metal impurity removing method using the same |
| JP2009138027A (en) * | 2007-12-03 | 2009-06-25 | Nitto Denko Corp | Manufacturing method of pressure-sensitive adhesive layer, pressure-sensitive adhesive sheet, cleaning sheet, transport member with cleaning function, and cleaning method |
| US7615288B2 (en) | 2003-06-26 | 2009-11-10 | Nitto Denko Corporation | Cleaning member and cleaning method |
| US20150320293A1 (en) * | 2013-01-25 | 2015-11-12 | Nitto Denko Corporation | Sticky cleaner for removing organic dirt |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07142440A (en) * | 1993-11-19 | 1995-06-02 | Fujitsu Ltd | Semiconductor manufacturing apparatus having particle removing method and particle removing means |
| JPH08115897A (en) * | 1994-10-13 | 1996-05-07 | Nitto Denko Corp | Adhesive tape for removing foreign matter adhering to semiconductor wafer and removal method |
| JPH10154686A (en) * | 1996-11-22 | 1998-06-09 | Toshiba Corp | Cleaning method for semiconductor substrate processing apparatus |
-
2000
- 2000-06-14 JP JP2000177963A patent/JP2001198075A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07142440A (en) * | 1993-11-19 | 1995-06-02 | Fujitsu Ltd | Semiconductor manufacturing apparatus having particle removing method and particle removing means |
| JPH08115897A (en) * | 1994-10-13 | 1996-05-07 | Nitto Denko Corp | Adhesive tape for removing foreign matter adhering to semiconductor wafer and removal method |
| JPH10154686A (en) * | 1996-11-22 | 1998-06-09 | Toshiba Corp | Cleaning method for semiconductor substrate processing apparatus |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003112128A (en) * | 2001-10-05 | 2003-04-15 | Nitto Denko Corp | Particle removal tape and cleaning method using the same |
| JP2003115522A (en) * | 2001-10-05 | 2003-04-18 | Nitto Denko Corp | Metal impurity removing tape and metal impurity removing method using the same |
| US7615288B2 (en) | 2003-06-26 | 2009-11-10 | Nitto Denko Corporation | Cleaning member and cleaning method |
| JP2009138027A (en) * | 2007-12-03 | 2009-06-25 | Nitto Denko Corp | Manufacturing method of pressure-sensitive adhesive layer, pressure-sensitive adhesive sheet, cleaning sheet, transport member with cleaning function, and cleaning method |
| US20150320293A1 (en) * | 2013-01-25 | 2015-11-12 | Nitto Denko Corporation | Sticky cleaner for removing organic dirt |
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