JP2001185260A - Anisotropic conductive sheet, inspection device and connector using the same - Google Patents

Abstract

(57) Abstract: An anisotropic conductive sheet having excellent non-adhesiveness, which prevents an object from sticking to an object even when the object is pressed against the surface thereof, It is to provide an inspection device used. The anisotropic conductive sheet is made of an elastic polymer material, a plurality of conductive path forming portions are insulated from each other by an insulating portion, and one surface of the anisotropic conductive sheet main body. And an anti-adhesion film stacked so as to cover the insulating portion. An inspection device uses the anisotropic conductive sheet.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an anisotropic conductive sheet used for an inspection apparatus for a circuit device such as a semiconductor integrated circuit, an inspection apparatus therefor, and a connector.

[0002]

2. Description of the Related Art An anisotropic conductive sheet is a sheet having conductivity only in a thickness direction or a pressurized conductive portion having conductivity only in the thickness direction when pressed in the thickness direction. Yes, compact electrical connection can be achieved without using means such as soldering or mechanical fitting, and soft connection is possible by absorbing mechanical shock and strain Utilizing such features, circuit devices such as printed circuit boards and leadless chip carriers, liquid crystal panels, etc., in the fields of electronic calculators, electronic digital watches, electronic cameras, computer keyboards, etc. It is widely used as a connector for achieving an electrical connection between the two.

In an electrical inspection of a circuit device such as a printed circuit board or a semiconductor integrated circuit, an electrode to be inspected formed on one surface of a circuit substrate to be inspected,
In order to achieve electrical connection with the test electrodes formed on the surface of the test circuit board, an anisotropic connection between the test electrode area of the test circuit board and the test electrode area of the test circuit board is required. It has been practiced to interpose a conductive sheet.

Conventionally, as such an anisotropic conductive sheet, those having various structures are known.
JP-A-1-93393 discloses an anisotropic conductive sheet obtained by uniformly dispersing metal particles in an elastomer, and JP-A-53-147772 discloses a conductive magnetic particle. By distributing unevenly in the elastomer, a number of conductive path forming portions extending in the thickness direction,
An anisotropic conductive sheet comprising an insulating portion for insulating them from each other is disclosed.
No. 906 discloses an anisotropic conductive sheet in which a step is formed between the surface of the conductive path forming portion and the insulating portion. In these anisotropic conductive sheets, conductive particles are contained in a base material made of an elastic polymer material in a state of being aligned in the thickness direction, and a conductive path is formed by a chain of a large number of conductive particles. Have been.

[0005] Such an anisotropic conductive sheet is formed, for example, by molding a polymer material in which conductive particles exhibiting magnetism are contained in a polymer material forming material which is cured to become an elastic polymer material. It can be manufactured by injecting into a space to form a polymer material layer and applying a magnetic field to the polymer material layer to perform a hardening treatment.

[0006] However, the conventional anisotropic conductive sheet has the following problems. For example, in an electrical inspection of a semiconductor integrated circuit, a test (burn-in test) in a high-temperature environment is performed to develop a potential defect of the semiconductor integrated circuit. Thus, in the anisotropic conductive sheet, an uncured component or an oil component of the elastic polymer substance constituting the base material remains on the surface thereof, and in the test, it is exposed to a high temperature environment. Since the circuit board to be tested is in a state of being pressed against the anisotropic conductive sheet by applying a load, the anisotropic conductive sheet and the circuit board to be tested are joined and both are stuck, that is, It becomes an adhesion state. For this reason, for example, by using means such as suction, the circuit board to be inspected after the test cannot be easily and reliably transferred, and as a result, the circuit board to be inspected is smoothly and automatically transported during the inspection. There is a problem that you can not.

Also, in a test conducted at room temperature, if the circuit board to be inspected is repeatedly transferred many times by means such as suction, the anisotropic conductive sheet and the circuit board to be inspected may be in an adhesive state. As a result, during the inspection, there is a problem that the circuit board to be inspected cannot be smoothly transferred.

[0008]

DISCLOSURE OF THE INVENTION The present invention has been made based on the above circumstances, and its object is to provide:
It is an object of the present invention to provide an anisotropic conductive sheet having an excellent non-adhesive property, even when an object is pressed against the surface thereof, so as to prevent the object from sticking to the object. Another object of the present invention is that even when pressed against an object to be inspected, the object to be inspected can be smoothly transferred without being in an adhesive state.
An object of the present invention is to provide an inspection apparatus having high inspection efficiency.

[0009]

The anisotropic conductive sheet of the present invention is made of an elastic polymer material, and has a plurality of conductive path forming portions insulated from each other by insulating portions. It is characterized by being constituted by an anti-adhesion film stacked on one surface of the anisotropic conductive sheet main body so as to cover the insulating portion.

In the anisotropic conductive sheet of the present invention, the anti-adhesion film has a peel strength of 10 g obtained by thermocompression bonding at a temperature of 150 ° C. under a load of 10 kg / cm ² for 24 hours on a surface made of gold. / Cm or less.

In the anisotropic conductive sheet according to the present invention, each conductive path forming portion of the anisotropic conductive sheet main body has at least one surface with a protruding portion protruding in the thickness direction, and the anti-adhesion film is formed of each conductive path. It has an insertion through-hole formed corresponding to the path forming portion, and in the insertion through-hole, the anti-adhesive film is anisotropically conductive in a state where the protruding portion of the anisotropic conductive sheet body is inserted. It is preferable to be stacked on the sheet body.

Further, the anisotropic conductive sheet of the present invention may be one in which the anisotropic conductive sheet main body and the anti-adhesion film are integrally joined.

Further, it is preferable that the anti-adhesion film is made of a resin having heat resistance, and the outer surface that is not in contact with the anisotropic conductive sheet body may be roughened. .

It is preferable that the height of the protrusion in the conductive path forming portion is 100 μm or less, and the thickness of the anti-adhesion film is smaller than the height of the protrusion.

According to the inspection apparatus of the present invention, there is provided an inspection circuit board having on its surface inspection electrodes arranged corresponding to each of a plurality of electrodes to be inspected arranged on one surface of a circuit board to be inspected, On the front side of the circuit board for the, having the above anisotropic conductive sheet disposed so that the anti-adhesion film is the outer surface, the anisotropic conductive sheet, each in the anisotropic conductive sheet body The conductive path forming portion is arranged so as to be located on each inspection electrode in the inspection circuit board, and each of the electrodes to be inspected in the inspection target circuit board to be inspected is provided on the anisotropic conductive sheet. It is characterized by being arranged so as to be located on the conductive path forming portion of the anisotropic conductive sheet.

[0016] A connector of the present invention comprises the above-described anisotropic conductive sheet.

[0017]

According to the anisotropic conductive sheet of the present invention, the anti-adhesion film is stacked on the anisotropic conductive sheet main body so as to cover the insulating portion of the anisotropic conductive sheet main body. Because the surface of the anisotropic conductive sheet main body that indicates is covered, even when an object is pressed against the surface,
The state in which the object is adhered and the two are adhered to each other, that is, a tacky state or an adhesive state is prevented, and excellent non-adhesiveness is obtained. Since the portion covered with the anti-adhesion film is the surface of the insulating portion in the anisotropic conductive sheet main body, the characteristics in the use of the anisotropic conductive sheet using the conductive path formed in the conductive path forming portion are used. Is not impaired.

[0018]

Embodiments of the present invention will be described below in detail. FIG. 1 is an enlarged cross-sectional view illustrating the configuration of the anisotropic conductive sheet of the present invention, and FIG. 2 is a plan view illustrating the anisotropic conductive sheet in FIG. The anisotropic conductive sheet 10 includes an anisotropic conductive sheet main body 11,
It is a laminate in which the anti-adhesion film 12 is stacked. The anisotropic conductive sheet main body 11 includes a plurality of columnar conductive path forming portions 14 that are densely filled with conductive particles and extend in the thickness direction, and insulates the conductive path forming portions 14 from each other. It is constituted by an insulating portion 15 in which particles are not or hardly present. Here, the conductive path forming portion 14 has protruding portions 14 a and 14 b protruding outward in the thickness direction from the front surface (upper surface in FIG. 1) and the back surface (lower surface in FIG. 1) of the insulating portion 15. The electrodes to be connected arranged on the side, for example, are arranged along the surface direction in accordance with the pattern corresponding to the pattern (not shown) of the electrode to be inspected of the inspected circuit board to be inspected. It is formed so as to surround each of these conductive path forming portions 14.

On the surface of the anisotropic conductive sheet main body 11 (the upper surface in FIG. 1), anti-adhesion films 12 are arranged in a stack. This anti-adhesion film 12
In each of the conductive path forming portions 14, an insertion through hole 12a having an inner diameter larger than the outer diameter of the protrusion 14a is formed at a position corresponding to the protrusion 14a in each of the conductive path forming portions 14. The corresponding projections 14a are inserted with their peripheral surfaces not in contact with the inner surfaces of the insertion through holes 12a.
The surface of a is protruded from the surface of the anti-adhesion film 12 (the upper surface in FIG. 1).

As the insulating elastic high molecular substance used for the conductive path forming portion 14, a high molecular substance having a crosslinked structure is preferable. Various materials can be used as the curable polymer substance forming material that can be used to obtain the crosslinked polymer substance, and specific examples thereof include polybutadiene rubber, natural rubber, polyisoprene rubber, and styrene-
Conjugated diene rubbers such as butadiene copolymer rubber and acrylonitrile-butadiene copolymer rubber and hydrogenated products thereof, and block copolymers such as styrene-butadiene-diene block copolymer rubber and styrene-isoprene block copolymer Rubber and their hydrogenated products,
Examples include chloroprene, urethane rubber, polyester rubber, epichlorohydrin rubber, silicone rubber, ethylene-propylene copolymer rubber, and ethylene-propylene-diene copolymer rubber. In the above, when the obtained anisotropic conductive sheet 10 is required to have weather resistance, it is preferable to use a material other than the conjugated diene rubber. In particular, from the viewpoint of moldability and electrical characteristics, silicone rubber is used. Preferably, it is used.

As the silicone rubber, those obtained by crosslinking or condensing a liquid silicone rubber are preferable. The liquid silicone rubber preferably has a viscosity of 10 ⁵ poise or less at a strain rate of 10 ⁻¹ sec, and may be any of condensation type, addition type, and those containing a vinyl group or a hydroxyl group. Good. Specifically, dimethylsilicone raw rubber, methylvinylsilicone raw rubber, methylphenylvinylsilicone raw rubber and the like can be mentioned.

Among them, liquid group-containing silicone rubber (vinyl group-containing polydimethylsiloxane)
Is usually obtained by subjecting dimethyldichlorosilane or dimethyldialkoxysilane to hydrolysis and condensation reaction in the presence of dimethylvinylchlorosilane or dimethylvinylalkoxysilane, for example, followed by fractionation by repeated dissolution-precipitation. Also,
The liquid silicone rubber containing vinyl groups at both ends is anionically polymerized with a cyclic siloxane such as octamethylcyclotetrasiloxane in the presence of a catalyst, and uses, for example, dimethyldivinylsiloxane as a polymerization terminator and other reaction conditions (for example, , The amount of the cyclic siloxane and the amount of the polymerization terminator). Here, as a catalyst for anionic polymerization, alkali such as tetramethylammonium hydroxide and n-butylphosphonium hydroxide or a silanolate solution thereof can be used. The reaction temperature is, for example, 80 to 130 ° C. Such a vinyl group-containing polydimethylsiloxane preferably has a molecular weight Mw (weight average molecular weight in terms of standard polystyrene; the same applies hereinafter) of 10,000 to 40,000. In addition, from the viewpoint of heat resistance of the obtained conductive path element, the molecular weight distribution index (the value of the ratio Mw / Mn between the standard polystyrene-equivalent weight average molecular weight Mw and the standard polystyrene-equivalent number average molecular weight Mn; the same applies hereinafter) is 2. 0.0 or less is preferable.

On the other hand, a liquid silicone rubber containing hydroxyl groups (hydroxyl group-containing polydimethylsiloxane) is usually prepared by hydrolyzing dimethyldichlorosilane or dimethyldialkoxysilane in the presence of dimethylhydrochlorosilane or dimethylhydroalkoxysilane. And condensation reaction, for example,
It is obtained by performing fractionation by repeating precipitation.
Further, cyclic siloxane is anionically polymerized in the presence of a catalyst, and dimethylhydrochlorosilane, methyldihydrochlorosilane or dimethylhydroalkoxysilane is used as a polymerization terminator, and other reaction conditions (for example, the amount of the cyclic siloxane and the polymerization termination) are used. Amount of agent)
Can also be obtained by appropriately selecting Here, as a catalyst for anionic polymerization, alkali such as tetramethylammonium hydroxide and n-butylphosphonium hydroxide or a silanolate solution thereof can be used. The reaction temperature is, for example, 80 to 130 ° C. Such hydroxyl group-containing polydimethylsiloxane is,
It is preferable that the molecular weight Mw is 10,000 to 40,000. Further, from the viewpoint of obtaining excellent heat resistance, those having a molecular weight distribution index of 2.0 or less are preferable. In the conductive path forming section 14 according to the present invention, either one of the above-mentioned vinyl group-containing polydimethylsiloxane and hydroxyl group-containing polydimethylsiloxane can be used, or both can be used in combination.

The conductive particles used in the conductive path forming portion 14 are made of a conductive magnetic material from the viewpoint that the particles can be easily oriented in the thickness direction of the anisotropic conductive sheet main body 11 by a method of applying a magnetic force. It is preferable to use body particles. Specific examples of the conductive magnetic particles include particles of a metal exhibiting magnetism such as nickel, iron, and cobalt, or particles of an alloy thereof, or particles containing these metals, or particles containing these metals as core particles. The core particles are obtained by plating the surface of a core particle with a metal having good conductivity such as gold, silver, palladium, and rhodium, or inorganic particles or polymer particles such as nonmagnetic metal particles or glass beads as core particles. Examples thereof include a particle obtained by plating the surface of a particle with a conductive magnetic material such as nickel and cobalt, and a particle obtained by coating a core particle with both a conductive magnetic material and a metal having good conductivity. Among them, it is preferable to use nickel particles as core particles, the surfaces of which are plated with a metal having good conductivity such as gold or silver. Means for coating the surface of the core particles with a conductive metal is not particularly limited,
For example, chemical plating or electroless plating can be used.

When the conductive particles are formed by coating the surface of a core particle with a conductive metal, from the viewpoint of obtaining good conductivity, the coverage of the conductive metal on the particle surface (core particle) Is preferably 40% or more, more preferably 45% or more, and particularly preferably 47 to 95%. Further, the coating amount of the conductive metal is 0.5 to
It is preferably 50% by weight, more preferably 1 to
The content is 30% by weight, more preferably 3 to 25% by weight, particularly preferably 4 to 20% by weight. When the conductive metal to be coated is gold, the coating amount is from 2.5 to 2.5
It is preferably 30% by weight, more preferably 3 to
It is 20% by weight, more preferably 3.5 to 15% by weight, particularly preferably 4 to 10% by weight. When the conductive metal to be coated is silver, the coating amount is preferably 3 to 50% by weight of the core particles, more preferably 4 to 40% by weight, and further preferably 5 to 30% by weight. weight%,
Particularly preferably, it is 6 to 20% by weight.

Further, the particle size of the conductive particles is 1 to 10
00 μm, more preferably 2 to 5 μm.
The thickness is 00 μm, more preferably 5 to 300 μm, and particularly preferably 10 to 200 μm. Further, the particle size distribution (Dw / Dn) of the conductive particles is preferably 1 to 10, more preferably 1.01 to 7, further preferably 1.05 to 5, and particularly preferably 1.1 to 1. 4. By using conductive particles that satisfy such conditions,
The obtained conductive path forming portion 14 is easily deformed under pressure, and sufficient electrical contact between the conductive particles is obtained in the conductive path forming portion 14. The shape of the conductive particles is not particularly limited. However, spherical particles, star-shaped particles, or secondary particles formed by agglomeration of these particles can be easily dispersed in a polymer material. Is preferable.

The water content of the conductive particles is preferably at most 5%, more preferably at most 3%, further preferably at most 2%, particularly preferably at most 1%. By using the conductive particles satisfying such conditions, it is possible to prevent or suppress bubbles from being generated in the polymer material layer when the polymer material layer is cured.

As the conductive particles, those whose surfaces have been treated with a coupling agent such as a silane coupling agent can be appropriately used. When the surface of the conductive particles is treated with the coupling agent, the adhesion between the conductive particles and the elastic polymer material is increased, and as a result, the obtained conductive path forming portion 14 has a durability in repeated use. It becomes high. The amount of the coupling agent used is appropriately selected within a range that does not affect the conductivity of the conductive particles. However, the coverage of the coupling agent on the surface of the conductive particles (the ratio of the coupling agent to the surface area of the conductive core particles). (The ratio of the coating area) is preferably 5% or more, more preferably 7 to 100%, further preferably 10 to 100%, and particularly preferably 20 to 10%.
The amount is 0%.

Such conductive particles are formed in the conductive path forming portion 1.
4 to 20 to 60% by volume fraction, preferably 25 to 40
% Is preferable. If this ratio is less than 20%, the conductive path forming portion 14 having a sufficiently small electric resistance value may not be obtained. On the other hand, when this ratio exceeds 60%, the obtained conductive path forming portion 14 tends to be fragile, and the elasticity required for the conductive path forming portion 14 may not be obtained in some cases.

The insulating portion 15 of the anisotropic conductive sheet main body 11 is made of an elastic polymer material having an insulating property. Curable polymer material forming materials that can be used to obtain such an elastic polymer material include polybutadiene rubber, natural rubber, polyisoprene rubber, styrene-butadiene copolymer rubber, acrylonitrile-butadiene copolymer rubber, and the like. Conjugated diene rubbers and hydrogenated products thereof, styrene-butadiene-diene block copolymer rubbers, block copolymer rubbers such as styrene-isoprene block copolymers and hydrogenated products thereof, chloroprene, urethane rubber, polyester System rubber, epichlorohydrin rubber, silicone rubber, ethylene-propylene copolymer rubber, ethylene-propylene-
When an anisotropic conductive sheet to be obtained is required to have weather resistance, it is preferable to use a material other than a conjugated diene rubber.

As the elastic polymer material forming the insulating portion 15, the same type or different type of the elastic polymer material forming the conductive path forming portion 14 can be used. Further, the insulating section 15 may be integrated with the conductive path forming section 14 or may be separate.

As the anti-adhesion film 12, specifically, the anti-adhesion film 12 is applied to a surface of a substrate made of gold at a temperature of 150 ° C. under a load of 10 kg / cm ² .
The peel strength of the pressed body obtained by thermocompression bonding for 4 hours is 10 g
/ Cm, preferably 1 g / cm or less, particularly preferably 0.1 g / cm or less.

Here, the peel strength is defined as
It is indicated by a value indicated by the magnitude of the force required for peeling (peeling force g / cm) by peeling off the anti-adhesion film 12 in the pressure-bonded body while keeping the angle of 90 degrees using a tensile tester. is there. When the peel strength of the anti-adhesion film 12 is 10 g / cm or less, a desired non-adhesive property is obtained in the anisotropic conductive sheet 10 in a normal operation. In addition, the anisotropic conductive sheet 10 composed of the anti-adhesion film 12 has high reliability of having excellent non-adhesion even when an object is pressed against the surface in a high-temperature environment. Can be

Specific examples of the film used as the anti-adhesion film 12 include polyimide resin, aramid resin, ethylene tetrafluoride resin, epoxy resin, liquid crystal polymer, vinyl ester resin, phenol resin, polyamide resin, polycarbonate resin, and polyether. Polyarylate resins such as sulfone resins, and those composed of resins having heat resistance at 150 ° C. such as polyetherketone resins, preferably polyimide resins, aramid resins, tetrafluoroethylene resins, polyetherketone resins, Polyether sulfone resin and liquid crystal polymer, particularly preferably polyimide resin, aramid resin, ethylene tetrafluoride resin, and liquid crystal polymer are exemplified.

The surface (upper surface in FIG. 1) of the anti-adhesion film 12 which is to be the outer surface, for example, part or all of the surface in contact with the circuit board to be inspected is subjected to a roughening treatment. May be used. Also,
The anti-adhesion film 12 may be one that satisfies the above-mentioned peel strength by being subjected to the roughening treatment.

In the anisotropic conductive sheet 10,
As shown in FIG. 3, the thickness t1 of the insulating portion 15 of the anisotropic conductive sheet main body 11 is 0.1 to 2 mm, particularly 0.2 to 1 m.
m is preferable. The projecting height of the conductive path forming portion 14 from the surface of the insulating portion 12, that is, the projecting portion 14a
Has a height t2 of 500 μm or less, preferably 20 μm.
To 300 μm, more preferably 30 to 200 μm, and particularly preferably 50 to 150 μm. The height t3 of the protrusion 14b is 500 μm or less, preferably 20 to 300 μm, and more preferably 50 to 150 μm.
It is. When the height t2 of the protruding portion 14a is 500 μm or less, the reliability of the conductive path formed in the conductive path forming section 14 can be made sufficient.

On the other hand, the thickness t4 of the anti-adhesion film 12
Although not particularly limited, the elasticity and strength of the anisotropic conductive sheet 10 and the protrusion 1 of the conductive path forming portion 14
From the viewpoint of conduction reliability of 4a, the thickness is preferably 10 to 500 μm, more preferably 20 to 300 μm,
Particularly preferably, it is 25 to 200 μm.

The outer diameter of the conductive path forming portion 14 is 0.05 to 1
mm, particularly preferably 0.1 to 0.5 mm.
Further, the inner diameter of the insertion through-hole 12a of the anti-adhesion film 12 is deformed so that the conductive path forming portion 14 is pressed in the thickness direction so as to have sufficient conductivity, and is compressed so as to extend in the surface direction. For example, when the protrusion height of the protrusion 14a is 50 μm, the outer diameter of the protrusion 14a of the conductive path forming portion 14 is set at 10 μm.
It is preferably at least 3%, more preferably 105 to 200%.
%, Particularly preferably 110 to 150%.
The gap between the peripheral surface of the protruding portion 14a and the inner surface of the insulating portion 12 is preferably 10 μm or more, more preferably 15 to 200 μm, and particularly preferably 20 to 100 μm.

Such an anisotropic conductive sheet can be manufactured, for example, as follows. FIG. 4 is an explanatory cross-sectional view illustrating a configuration of an example of a mold used for manufacturing the anisotropic conductive sheet of the present invention. This mold is configured such that an upper mold 50 and a lower mold 55 paired with the upper mold 50 are arranged so as to face each other via a frame-shaped spacer 54, and a lower surface of the upper mold 50 and an upper surface of the lower mold 55 are formed. A molding space is formed between them. In the upper die 50, a ferromagnetic layer 52 is formed on the lower surface of the ferromagnetic substrate 51 in accordance with a pattern opposite to the intended arrangement pattern of the conductive path forming portions 14 of the anisotropic conductive sheet main body 11. A non-magnetic layer 53 having a thickness larger than the thickness of the ferromagnetic layer 52 is formed in a portion other than the ferromagnetic layer 52. On the other hand, in the lower mold 55, on the upper surface of the ferromagnetic substrate 56,
Conductive path forming portion 1 of desired anisotropic conductive sheet body 11
The ferromagnetic layer 57 is formed according to the same pattern as the arrangement pattern of FIG.
A nonmagnetic layer 58 having a thickness larger than the thickness of the ferromagnetic layer 57 is formed.

As the material forming the ferromagnetic substrates 51 and 56 in each of the upper mold 50 and the lower mold 55, a ferromagnetic metal such as iron, iron-nickel alloy, iron-cobalt alloy, nickel, or cobalt is used. Can be. The ferromagnetic substrates 51 and 56 preferably have a thickness of 0.1 to 50 mm, and have a smooth surface, are chemically degreased, and are mechanically polished. preferable.

The materials forming the ferromagnetic layers 52 and 57 in each of the upper mold 50 and the lower mold 55 include:
Iron, iron-nickel alloy, iron-cobalt alloy, nickel,
A ferromagnetic metal such as cobalt can be used. The ferromagnetic layers 52 and 57 preferably have a thickness of 10 μm or more.

As a material for forming the nonmagnetic layers 53 and 58 in each of the upper mold 50 and the lower mold 55, a nonmagnetic metal such as copper, a heat-resistant polymer material, or the like can be used. In view of the fact that the nonmagnetic layers 53 and 58 can be easily formed by a photolithography technique, it is preferable to use a polymer substance cured by radiation, for example, an acrylic dry film resist. , Epoxy liquid resist,
A photoresist such as a polyimide-based liquid resist can be used. The thickness of the nonmagnetic layers 53 and 58 is determined by the thickness of the ferromagnetic layers 52 and 57, the height of the conductive path forming portion 14 of the target anisotropic conductive sheet body 11, that is, the protrusions 14a and 14b. It is set according to.

Then, the anisotropic conductive sheet main body 11 is manufactured using the above-mentioned mold as follows. First, a flowable polymer material in which conductive particles exhibiting magnetism are dispersed in a polymer material forming material is prepared, and as shown in FIG. To form a polymer material layer 11A. Next, the upper mold 5
For example, a pair of electromagnets are arranged on the upper surface of the ferromagnetic substrate 51 at 0 and the lower surface of the ferromagnetic substrate 56 at the lower mold 55, and by operating the electromagnets, a parallel magnetic field having an intensity distribution, that is, the upper mold 50 is formed. Ferromagnetic layer 52
And a ferromagnetic layer 57 of the lower mold 55 corresponding thereto, a parallel magnetic field having a large intensity is applied to the polymer material layer 1.
1A acts in the thickness direction. As a result, in the high molecular material layer 11A, as shown in FIG. 6, the conductive particles dispersed in the high molecular material layer 11A correspond to the ferromagnetic layer 52 of the upper mold 50 and the corresponding conductive particles. The lower die 55 and the ferromagnetic layer 57 of the lower die 55 assemble in a portion 14A to be a conductive path forming portion and are oriented so as to be arranged in the thickness direction.

In this state, the polymer material layer 11A is hardened to be disposed between the ferromagnetic layer 52 of the upper die 50 and the corresponding ferromagnetic layer 57 of the lower die 55. Further, a conductive path forming portion 14 in which conductive particles are densely filled in an elastic polymer material, and an insulating portion 1 made of an elastic polymer material having no or almost no conductive particles.
5 is manufactured.

In the above description, the curing treatment of the polymer material layer 11A can be performed with the parallel magnetic field applied, but can also be performed after the parallel magnetic field is stopped. It is preferable that the intensity of the parallel magnetic field applied to the polymer material 11A be in a range of 200 to 10000 Gauss on average. As a means for applying a parallel magnetic field to the polymer material layer 11A, a permanent magnet can be used instead of an electromagnet. As a permanent magnet, Alnico (Fe
-Al-Ni-Co based alloy), ferrite and the like. The curing treatment of the polymer material layer 11A is appropriately selected depending on the material to be used.
The heat treatment is performed. The specific heating temperature and heating time are appropriately selected in consideration of the type of the polymer material constituting the polymer material layer 11A, the time required for the movement of the conductive particles, and the like.

Then, the obtained anisotropic conductive sheet main body 1
The anti-adhesion film 12 in which the insertion through-holes 12a are formed, preferably by laser processing, is superimposed on the surface having the protrusions 14a in 1 at a position corresponding to the arrangement pattern of the protrusions 14a. At this time, the anti-adhesion film 12 is inserted into each of the insertion through-holes 12a of the anti-adhesion film 12 such that the protrusions 14a do not contact the inner surface of the insertion through-hole 12a.
The surface of the protruding portion 14 a is arranged so as to protrude from the surface of the anti-adhesion film 12.

Here, as a method of integrally stacking the anisotropic conductive sheet main body 11 and the anti-adhesion film 12,
Although not particularly limited, for example, the anisotropic conductive sheet body 1
The anti-adhesion film 12 may be bonded on the substrate 1 via a solvent-based, hot-melt-based, two-component mixed-type adhesive, or both may be bonded by physical means such as heat welding or high frequency processing. May be.

Further, in the obtained anisotropic conductive sheet 10, for example, positioning through-holes 12b (see FIG. 2) having an appropriate inner diameter are formed at four corners, for example, by laser processing, and as shown in FIG. Anisotropic conductive sheet 1 as shown
0 is produced.

The anisotropic conductive sheet 10 of the present invention can be suitably used for electrical inspection of a circuit device such as a semiconductor integrated circuit. Specifically, for example, in an inspection apparatus for performing a burn-in test, the package having a ceramic substrate to be inspected is appropriately inspected by mounting the anisotropic conductive sheet 10 of the present invention in the test socket. Can be. FIG. 7 is an explanatory cross-sectional view showing an outline of the configuration of an example of the inspection apparatus of the present invention, together with a circuit device to be inspected. This inspection apparatus is for performing an electrical inspection of a circuit device, and has an inspection electrode 6 arranged in accordance with a pattern opposite to an electrode 2 to be inspected of a circuit board 1 to be inspected on a surface (an upper surface in FIG. 7). 7) is provided, and an anisotropic conductive sheet 10 is provided on the surface of the inspection circuit board 5 on which the anti-adhesion film 12 is stacked (see FIG. 7). Top)
Each of the conductive path forming portions 14 is arranged on the inspection electrode 6 so as to be electrically connected to the surface (the lower surface in FIG. 7) of the protruding portion 14b. Further, the anisotropic conductive sheet 10 is provided with the positioning through hole 1.
2b and a positioning pin 9 inserted into the positioning through-hole 12b, and is fixed at a predetermined position. Further, the circuit board 1 to be inspected is also fixed at a predetermined position by the positioning pins 9.

When an electrical inspection of a circuit device is performed by the inspection apparatus, first, the circuit board 1 to be inspected is placed on the anisotropic conductive sheet 10 by means of automatic conveyance such as suction. Are arranged on the corresponding conductive path forming portions 14 of the anisotropic conductive sheet 10. Next, for example, by moving the circuit board 5 for inspection in a direction approaching the circuit board 1 to be inspected, the anisotropic conductive sheet 10 is pressed by the circuit board 1 for inspection and the circuit board 5 for inspection. As a result, the electrical connection between the electrode 2 to be inspected of the circuit board 1 to be inspected and the inspection electrode 6 of the circuit board 5 to be inspected is achieved through each conductive path forming portion 14. Then, in order to develop a potential defect in the circuit board 1 to be inspected, the environmental temperature is raised to a predetermined temperature, for example, 150 ° C., and in this state, a required electrical inspection is performed on the circuit board 1 to be inspected.

In the above, the surface of the anisotropic conductive sheet 10 (the upper surface in FIG. 7) and the surface of the circuit board 1 to be inspected (FIG. (The lower surface in FIG. 1) is in a state of close contact at least during the inspection. Thus, according to the anisotropic conductive sheet 10 of the present invention, the anisotropic conductive sheet main body 11 is provided with the anti-adhesion film 12 having excellent peel strength and the circuit to be inspected in the anisotropic conductive sheet main body 11. By stacking so as to cover the insulating portion 15 on the surface (upper surface in FIG. 7) that is in contact with the substrate 1, the uncured component or the oil component of the elastic polymer substance remains, and thus the adhesiveness difference is exhibited. The surface of the one side conductive sheet main body 11 is covered, and a portion other than the electrode 2 to be inspected on the circuit board 1 to be inspected comes into contact with the surface of the anti-adhesion film 12. However, since the anti-adhesion film 12 has a specific peel strength, even when the circuit board 1 to be inspected is pressed against the surface of the anisotropic conductive sheet 10, the anisotropic conductive sheet 10 And the circuit board to be inspected 1 are prevented from being in an adhesive state, and excellent non-adhesiveness is obtained. Therefore, the circuit board 1 to be inspected brought into a state of being in close contact with the anisotropic conductive sheet 10 by pressure contact does not become in an adhered state even in a burn-in test, for example, and can be easily and reliably transferred by using means such as suction. Therefore, in the inspection device of the present invention, the circuit board 1 to be inspected is smoothly transferred, and as a result, the inspection can be performed with high efficiency.

The portion covered with the anti-adhesion film 12 is the insulating portion 15 of the anisotropic conductive sheet main body 11.
Of the test electrode 2 and the test electrode 6 by the conductive path formed in the conductive path forming portion 14.
A reliable electrical connection with the device is obtained, and a required electrical test is performed.

The anisotropic conductive sheet of the present invention is not limited to the above embodiment, but can be variously modified. (1) The anti-adhesion film 12 and the anisotropic conductive sheet main body 11 need not be integrated, but may be separate bodies. When the anti-adhesion film 12 and the anisotropic conductive sheet main body 11 are separate bodies, the anti-adhesion film 12 and the anisotropic conductive sheet main body 11 can be appropriately combined depending on the use state. In addition, it is preferable in that each can be recycled. Further, for example, an adhesive layer or the like may be interposed between the anti-adhesion film 12 and the anisotropic conductive sheet main body 11.

(2) The anisotropic conductive sheet 10 may be one in which anti-adhesion films 12 are stacked on both surfaces of the anisotropic conductive sheet main body 11 according to the state of use. (3) As shown in FIG. 8, the anisotropic conductive sheet 10 with a support whose peripheral edge is supported by the frame plate-like support 21 can be formed. Such an anisotropic conductive sheet 1
Reference numeral 0 denotes a mold for manufacturing the anisotropic conductive sheet main body 11 that has a space region for a support arrangement in which the support 21 can be arranged in the molding space, and is used in the molding space of the mold. The support 21 can be manufactured by arranging the support 21 in the space region for arranging the support, and injecting and curing the polymer material in this state as described above.

(4) The anisotropic conductive sheet 10 of the present invention
For example, it may be provided integrally on the surface of the inspection circuit board 5 as shown in FIG. As such an anisotropic conductive sheet 10, as a mold for manufacturing the anisotropic conductive sheet main body 11, a mold having a space region for board arrangement in which the inspection circuit board 5 can be arranged in a molding space is used. The inspection circuit board 5 is arranged in a space area for board arrangement in the molding space of the mold, and in this state, as described above,
It can be manufactured by injecting a polymer material and performing a curing treatment.

(5) As shown in FIG. 9, the conductive path forming portion 1
For example, even if the surface of each protrusion 14 a is located on the same plane as the surface of the anti-adhesion film 12, the protrusions 14 a of the fourth 4 are not formed so as to protrude from the surface of the anti-adhesion film 12. Good. (6) The anisotropic conductive sheet main body 11 is
The protrusion 14b may not be formed, and the back surface may be flat. (7) The anisotropic conductive sheet main body 11 can have a so-called dispersion type or non-uniform configuration in which conductive particles are contained in an elastic polymer substance in a state of being uniformly distributed in a plane direction. .

(8) As shown in FIG. 10, the anti-adhesion film 12 is provided on the insulating portion 15 of the anisotropic conductive sheet main body 11.
Of the anisotropic conductive sheet main body 11, the protruding portions 14a of the anisotropic conductive sheet main body 11 are arranged instead of the insertion through holes 12a corresponding to the respective protruding portions 14a of the anisotropic conductive sheet main body 11. For example, a rectangular through-hole 12c may be provided in the region where it is formed. Moreover, it is not necessary to use only one sheet of the anti-adhesion film 12 in one anisotropic conductive sheet main body 11, and a plurality of anti-adhesion films 12 can be appropriately used. When a plurality of anti-adhesion films 12 are used, different types of films can be used.

<Experimental Example> In the anisotropic conductive sheet 10 shown in FIG. 1, a polyimide film having a size of 10 mm in length and 10 mm in width as an anti-adhesion film 12 was overlapped with a gold-plated flat plate. 10 kg / cm ² under the environment temperature of 150 ° C.
, A thermocompression bonding was performed for 24 hours to obtain a press-bonded body. Then, with respect to the press-bonded body, the sample in the press-bonded body was peeled off at an angle of 90 degrees using a tensile tester, and the magnitude of the force required for peeling (peeling force g / cm) was measured as the peel strength. . The surface of the sample whose surface was roughened was pressed against a gold-plated flat plate. As a result, there was no adhesion to the gold-plated flat plate, and the plate could be easily peeled off.

[0059]

According to the anisotropic conductive sheet of the present invention, the anti-adhesion film is stacked on the anisotropic conductive sheet main body so as to cover the insulating portion of the anisotropic conductive sheet main body. Since the surface of the anisotropically conductive sheet body exhibiting adhesiveness is covered, even when an object is pressed against the surface, it is prevented from being in an adhesive state with the object, and excellent non-adhesiveness is obtained. can get.

According to the inspection apparatus of the present invention, even if the inspection object is pressed against the inspection object, the inspection object can be smoothly transferred without being in an adhesive state, and therefore, high inspection efficiency can be obtained.

[Brief description of the drawings]

FIG. 1 is an enlarged cross-sectional view illustrating a configuration of an example of an anisotropic conductive sheet of the present invention.

FIG. 2 is an explanatory plan view of the anisotropic conductive sheet in FIG.

FIG. 3 is an enlarged cross-sectional view illustrating a part of the anisotropic conductive sheet of the present invention in an enlarged manner.

FIG. 4 is an explanatory cross-sectional view showing a configuration of an example of a mold used for manufacturing the anisotropic conductive sheet of the present invention.

FIG. 5 is an explanatory cross-sectional view showing a state in which a polymer material layer is formed in the mold shown in FIG. 2;

FIG. 6 is an explanatory cross-sectional view showing a state in which conductive particles in a polymer material layer are gathered in a portion serving as a conductive path forming portion in the polymer material layer.

FIG. 7 is an explanatory cross-sectional view showing a schematic configuration of an example of the inspection apparatus of the present invention, together with a circuit device to be inspected.

FIG. 8 is an enlarged cross-sectional view illustrating the configuration of another example of the anisotropic conductive sheet of the present invention.

FIG. 9 is an enlarged cross-sectional view illustrating the configuration of still another example of the anisotropic conductive sheet of the present invention.

FIG. 10 is an explanatory plan view of another example of the anisotropic conductive sheet of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Inspection circuit board 2 Inspection electrode 5 Inspection circuit board 6 Inspection electrode 9 Positioning pin 10 Anisotropic conductive sheet 11 Anisotropic conductive sheet main body 11A Polymer material layer 12 Anti-adhesive film 12a Penetration for insertion Hole 12b Positioning through hole 12c Through hole 14 Conductive path forming portion 14a, 14b Projecting portion 14A A portion to be a conductive portion 15 Insulating portion 21 Support 50 Upper mold 51 Ferromagnetic substrate 52 Ferromagnetic layer 53 Nonmagnetic layer 54 Spacer 55 Lower mold 56 Ferromagnetic substrate 57 Ferromagnetic layer 58 Non-magnetic layer

Claims (9)

[Claims] 1. An anisotropic conductive sheet main body made of an elastic polymer material and having a plurality of conductive path forming portions insulated from each other by an insulating portion, and one surface of the anisotropic conductive sheet main body covers the insulating portion. An anisotropic conductive sheet comprising an anti-adhesion film stacked as described above. 2. The anti-adhesion film is characterized in that a peel strength of a pressure-bonded body obtained by thermocompression bonding to a surface made of gold at a temperature of 150 ° C. under a load of 10 kg / cm ² for 24 hours is 10 g / cm or less. The anisotropic conductive sheet according to claim 1. 3. Each of the conductive path forming portions of the anisotropic conductive sheet main body has a protruding portion protruding in a thickness direction on at least one surface, and an anti-adhesion film is formed corresponding to each of the conductive path forming portions. In the insertion through hole, the anti-adhesion film is stacked on the anisotropic conductive sheet main body in a state where the protruding portion of the anisotropic conductive sheet main body is inserted. The anisotropic conductive sheet according to claim 1, wherein: 4. The anisotropically conductive sheet according to claim 1, wherein the anisotropically conductive sheet body and the anti-adhesion film are integrally joined. 5. The anisotropic conductive sheet according to claim 1, wherein the anti-adhesion film is made of a resin having heat resistance. 6. The anti-adhesion film according to claim 1, wherein an outer surface that is not in contact with the anisotropic conductive sheet main body is subjected to a roughening treatment. Anisotropic conductive sheet. 7. The height of the projecting portion in the conductive path forming portion is 1
The thickness of the anti-adhesion film is less than or equal to 00 μm, and the thickness of the anti-adhesion film is smaller than the height of the protrusion.
The anisotropic conductive sheet according to claim 6. 8. A circuit board for inspection having on its surface inspection electrodes arranged corresponding to each of a plurality of electrodes to be inspected arranged on one surface of a circuit board to be inspected, and a surface of the circuit board for inspection. The anisotropic conductive sheet according to any one of claims 1 to 7, wherein the anti-adhesion film is disposed on the side so as to be an outer surface, and the anisotropic conductive sheet is anisotropically conductive. Each conductive path forming portion in the conductive sheet main body is disposed so as to be positioned on each test electrode in the test circuit board, and on the anisotropic conductive sheet, the test target circuit board to be tested is An inspection apparatus, wherein each of the electrodes to be inspected is arranged so as to be located on a conductive path forming portion of the anisotropic conductive sheet. 9. A connector comprising the anisotropic conductive sheet according to any one of claims 1 to 7.