JP2001168144A - Bonding component for electronic component, method of connecting electronic component using the bonding component, and method of manufacturing bonding component for electronic component - Google Patents

Abstract

(57) Abstract: A connection component for an electronic component that can stably connect between connection terminals of the electronic component with a low conductor resistance value. SOLUTION: A connection component for an electronic component is formed from a sphere 60 made of an insulating resin and a conductor pillar 70 made of a low melting point metal formed in a through hole 62 passing through a center point of the sphere.
Both ends of the conductor pillar 70 protrude from the opening end of the through hole 62 to the outside of the sphere 60. Then, the connection component is interposed between the connection terminals of the electronic component, and the conductor pillar 7 of the electronic component is provided.
0 and the sphere 60 are heated and reflowed, and the connection terminals of the electronic components are connected by the conductor pillars 70, and the electronic components near the connection terminals are joined by the insulating resin formed by reflowing the sphere 60. It can be so.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a joint component for an electronic component, which is used for connecting between connection terminals of the electronic component by a flip chip bonding method, a method for connecting an electronic component using the joint component, and a method for connecting the electronic component. And a method for manufacturing a joint component for an electronic component for forming the joint component.

[0002]

2. Description of the Related Art Conventionally, when a connection terminal of a semiconductor chip is connected to a connection terminal of a printed circuit board on which the semiconductor chip is mounted by a flip chip bonding method, the connection terminal of the semiconductor chip or the printed circuit board is generally used. Solder balls are formed on the connection terminals. Next, the top of the solder ball is pressed flat to make the height of the top of the solder ball uniform. Next, a solder ball having a uniform top height is applied to a connection terminal of a printed circuit board or a connection terminal of a semiconductor chip for electrically connecting the connection terminal on which the solder ball is formed, to the connection terminal. Temporary joining is performed using the joining force of the obtained flux. Next, the solder ball is heated and reflowed. Then, using the reflowed solder balls,
The connection terminals of the semiconductor chip are soldered to the connection terminals of the printed circuit board. After that, an underfill material made of a low-viscosity insulating resin material having permeability and being filled between the semiconductor chip to which the connection terminals are soldered and the printed circuit board is filled. Then, the semiconductor chip and the printed circuit board are joined via the underfill material. Here, as described above, the reason why the semiconductor chip and the printed circuit board are bonded via the underfill material is that the semiconductor chip and the printed circuit board are both placed between the semiconductor chip and the printed circuit board due to heat generated by the semiconductor chip. When a stress based on the difference in the coefficient of thermal expansion is applied, the stress separates the soldered connection terminals between the semiconductor chip and the printed circuit board, resulting in a good electrical connection between the connection terminals. This is to prevent the connectivity from being impaired.

[0003]

However, as described above, the connection terminal of the semiconductor chip is connected to the connection terminal of the printed circuit board by the flip chip bonding method, and the semiconductor chip is mounted on the printed circuit board. As described above, a solder ball is formed on a connection terminal of a semiconductor chip or a wiring circuit board, and the top of the solder ball is pressed flat or an underfill material is placed between the semiconductor chip and the wiring circuit board. Need to be filled,
The work of mounting the semiconductor chip on the printed circuit board requires many steps, and the mounting work requires a great deal of work and time.

To solve such a problem, as shown in FIG. 12, a large number of small-diameter solder pillars 20 are vertically and horizontally arranged at a small pitch through a resin sheet 10 made of an underfill material through the resin sheet. A bonding sheet 30 provided side by side has been conventionally developed, and is used when one electronic component 40 such as a semiconductor chip is mounted on the other electronic component 40 such as a printed circuit board. According to the bonding sheet 30, as shown in FIG. 12, the bonding sheet 30 is heated and reflowed with the bonding sheet 30 interposed between the one and the other electronic components 40, Between the connection terminals 42 of one electronic component and the connection terminals 42 of the other electronic component, using the solder pillars 20 provided on the joint sheet 30 interposed between the connection terminals 42 of one electronic component and the connection terminals 42 of the other electronic component. Can be soldered. At the same time, one and the other electronic components 40 can be joined using the resin sheet 10 made of the underfill material.

However, when one of the electronic components 40 is mounted on the other electronic component 40 by using the bonding sheet 30, the connection terminals 42 of the one and the other electronic components are connected.
Are electrically connected to each other through a small number of small-diameter solder pillars 20 with high conductor resistance, so that a high-frequency signal or the like is transmitted between one of the connection terminals 42 of the other electronic component. I couldn't tell much. At the same time, the connection between the connection terminal 42 of one of the electronic components and the connection terminal 42 of the other electronic component could not be reliably performed with electrical stability.

[0006] The present invention can solve such problems.
The connection terminal of one electronic component such as a semiconductor chip can be easily and quickly stably connected to the connection terminal of the other electronic component such as a printed circuit board by a flip chip bonding method without trouble. A joining part for an electronic part (which can be connected, and can firmly join one electronic part and the other electronic part near the connected connection terminal with an insulating resin without filling with an underfill material ( It is an object of the present invention to provide a joining component), a method for connecting electronic components using the joining component, and a method for manufacturing the joining component.

In order to achieve the above object, a joint part according to the present invention is characterized in that a sphere made of an insulating resin is provided with a through-hole passing through the center point of the sphere, and the through-hole is made of a conductor pillar made of a low melting point metal. Is formed, and both ends of the conductor pillar project from the opening end of the through hole to the outside of the sphere.

Further, a method of connecting an electronic component according to the present invention includes the following steps. a. The connection terminal of one electronic component is superimposed on the connection terminal of the other electronic component electrically connected to the connection terminal via the bonding component of the present invention, and is made of a low melting point metal of the bonding component. Both ends of the conductor pillar are superimposed on the connection terminal of the one electronic component and the connection terminal of the other electronic component, respectively, and both ends of the conductor pillar are respectively attached to the connection terminals of the one and the other electronic components. A step of temporarily joining using the joining force of the flux applied to the connection terminals. b. The joint component is heated to reflow the conductor pillar made of the low melting point metal and the sphere made of insulating resin, and both ends of the conductor pillar are connected to the connection terminals of the one and the other electronic components, respectively. The insulating resin formed by reflowing the sphere covers the periphery of the connection terminal of the one and the other electronic components and the periphery of the conductor pillar connected thereto, and, through the insulating resin, of the one and the other electronic components. The step of joining the spaces.

[0009] By connecting the connecting terminals of the electronic component by the connecting method of the electronic component according to the present invention by using the joining component of the present invention, an interposition is provided between the connecting terminal of one of the electronic components and the connecting terminal of the other electronic component. By heating the joined parts and reflowing the conductive pillar made of the low melting point metal of the bonding material and the sphere made of the insulating resin, one end and the other of the two ends of the conductive pillar were overlapped and temporarily joined. Can be connected to the connection terminals of the electronic components. At the same time, the insulating resin formed by reflowing the sphere can continuously cover the periphery of the connection terminal of one and the other electronic components and the periphery of the conductor pillar connected thereto, and through the insulating resin, One and the other electronic components near the connection terminal can be joined. The difference in thermal expansion coefficient between the one and the other electronic components due to the heat generated by one of the electronic components such as a semiconductor chip due to the insulating resin joining the one and the other electronic components. When a stress based on the electronic component is applied, it is possible to reliably prevent the connection terminal connected to one and the other electronic components from separating due to the stress.

[0010] A method of manufacturing a joined part according to the present invention is characterized by including the following steps. a. A predetermined amount of insulating resin in a heated and softened state,
Discharging the liquid from a nozzle introduced into the liquid into which the insulating resin is not likely to be dissolved. b. A step of forming the insulating resin released into the liquid into a sphere in the liquid by utilizing a surface tension effect generated in the insulating resin, and cooling and hardening the sphere made of the insulating resin by the liquid. c. Removing the hardened sphere from the liquid, and covering the surface of the sphere with a resin layer that can be removed by dissolving with a dissolving solution that does not dissolve the sphere. d. A step of providing a through-hole passing through the center of the sphere in the sphere whose surface is covered with the resin layer. e. Forming a low-melting-point metal layer on the surface of the resin layer, filling the through-hole with a low-melting-point metal, and forming a conductor pillar made of the low-melting-point metal in the through-hole. f. Dissolving the resin layer in the solution, and removing the resin layer from the surface of the sphere together with the low melting point metal layer formed on the surface of the resin layer; g. Flattening both ends of the conductor pillar protruding outside of the sphere from which the resin layer has been removed, to make the distance between both ends of the conductor pillar uniform.

In this method of manufacturing a joined part, a predetermined amount of the insulating resin discharged from the nozzle into the liquid is easily formed into a precise sphere in the liquid by utilizing the surface tension effect generated in the insulating resin. it can.

At this time, by bringing the specific gravity of the liquid closer to the specific gravity of the insulating resin, the insulating resin released from the nozzle can be kept floating in the liquid for a long time. Then, the insulating resin can be accurately formed into a sphere in the liquid.
In addition, since a liquid that does not dissolve the insulating resin is used for the liquid, it is possible to prevent the insulating resin released into the liquid from being eluted into the liquid and lost.

The sphere is immersed in a low-melting-point metal plating solution, and the sphere is subjected to electroless low-melting-point metal plating, whereby a low-melting-point metal layer is accurately formed on the surface of the resin layer covering the surface of the sphere. Alternatively, a low-melting-point metal is buried in the through-hole of the sphere, and a conductor pillar made of the low-melting-point metal can be accurately formed in the through-hole.

Further, by dissolving the resin layer covering the surface of the sphere in a dissolving solution and removing the resin layer from the surface of the sphere together with the low melting point metal layer formed on the surface of the resin layer,
Both ends of the conductor pillar can be accurately projected outside the sphere by at least the thickness of the resin layer.

Further, by flat pressing both ends of the conductor pillar protruding outside the sphere from which the resin layer has been removed, the distance between both ends of the conductor pillar can be made uniform. Then, when the joining components are interposed between the plurality of connection terminals of the one and the other electronic components, and the plurality of joining components are heated and reflowed, the distance between both ends is made uniform. Each of the plurality of conductor pillars made of the melting point metal can uniformly and accurately connect each of the plurality of connection terminals of one and the other electronic components.

[0016]

FIG. 1 shows a preferred embodiment of a joint component according to the present invention, and FIG. 1 is a front sectional view thereof. Hereinafter, this joining component will be described.

In the joint part shown in the figure, a through hole 62 passing through the center point of the sphere is provided in a sphere 60 made of an insulating resin. A low-melting-point metal such as solder plating is embedded in the through-hole 62.
0 is formed. Both ends of the conductor pillar 70 protrude outside the sphere 60 from the open end of the through hole 62.

The joint component shown in FIG. 1 is configured as described above.

Next, a preferred embodiment of a method for connecting electronic components according to the present invention, which is a method for connecting between connection terminals of electronic components by a flip-chip bonding method using the joining components, will be described. . 2 and 3 are explanatory diagrams of the process. Hereinafter, a method of connecting the electronic components will be described.

As shown in FIG. 2, the connection terminal 42 of one electronic component is placed on the connection terminal 42 of the other electronic component for electrically connecting the connection terminal.
0 is superimposed. At the same time, both ends of the conductor pillar 70 made of a low melting point metal such as solder plating of the joint component 200 are overlapped with the connection terminal 42 of one electronic component and the connection terminal 42 of the other electronic component, respectively. Then, both ends of the conductor pillar 70 are temporarily joined to the connection terminals 42 of one and the other electronic components by using the bonding force of the flux (not shown) applied to the connection terminals 42. I have. Then, step a of the method for connecting electronic components of the present invention is performed.

Next, the joint component 200 is heated to form a conductor column 70 made of a low melting point metal and a sphere 60 made of an insulating resin.
And reflow. And, as shown in FIG.
Both ends of the conductor column 70 made of the low melting point metal are connected by soldering or the like to the connection terminals 42 of one and the other electronic components, which are overlapped and temporarily joined. At the same time, as shown in FIG.
Around the connection terminal 42 of one and the other electronic components and the periphery of the conductor pillar 70 connected to the one and the other are continuously covered with the insulating resin 100, and are connected through the insulating resin 100. One and the other electronic components 40 near the terminal 42 are joined. Then, step b of the method for connecting electronic components of the present invention is performed.

The method of connecting electronic components shown in FIGS. 2 and 3 includes the above steps.

According to this method of connecting electronic components, if the connection terminals 42 of one and the other electronic components are connected by using the bonding component 200 shown in FIG. 1, the connection terminals of the one and the other electronic components are connected. By heating the joint component 200 interposed between the resin components 42 and reflowing the conductor pillar 70 made of a low melting point metal such as solder plating and the sphere 60 made of the insulating resin 100, the conductor pillar 200 is heated. Both ends of 60 can be connected by soldering or the like to connection terminals 42 of one and the other electronic components, which are overlapped and temporarily joined together. At the same time, the periphery of the connection terminal 42 of one and the other electronic components and the periphery of the conductor pillar 60 connected thereto can be continuously covered by the insulating resin 100 obtained by reflowing the spherical body 60, and the insulating resin 100, one and the other electronic components 40 near the connection terminal 42
Can be joined firmly. And, by the insulating resin 100 joining between the one and the other electronic components 40,
When a stress based on the difference in thermal expansion coefficient between the one and the other electronic components 40 is applied between the one and the other electronic components 40 due to heat or the like generated by one or the other electronic component 40 such as a semiconductor chip, the stress causes the one and the other Separation between the connection terminals 42 connected by soldering or the like of the other electronic component 40 can be reliably prevented.

Next, a preferred embodiment of the method for manufacturing the joint component of the present invention, which is the joint component shown in FIG. 1, will be described. 4 to 11 are explanatory diagrams of the manufacturing process. Hereinafter, a method for manufacturing the joined component will be described.

As shown in FIG. 4, a predetermined amount of the insulating resin 100 which has been heated and softened is placed in a liquid 110 in which the insulating resin is not likely to be dissolved. Released from. Specifically, as shown in FIG. 4, a predetermined amount of the heated and softened insulating resin 100 filled in the cylinder 130 is injected into the nozzle 1 introduced into the lower end of the liquid 110 by the piston 140.
From 20, it is extruded into the liquid 110. Then, the step a of the method for manufacturing a joined component of the present invention is performed.

Next, as shown in FIG. 4, a predetermined amount of the insulating resin 100 released into the liquid 110 is removed by utilizing the surface tension effect generated in the insulating resin.
The sphere 60 is formed inside. At the same time, the sphere 60 made of the insulating resin 100 is cooled and hardened by the liquid 110. Then, a spherical body 60 made of the insulating resin 100 as shown in FIG. 5 is formed. In this case, using a liquid having a specific gravity slightly larger than the specific gravity of the insulating resin 100 as the liquid 110, the sphere 60 made of the insulating resin 100 is slowly raised in the liquid 110, To ensure cooling and hardening. Then, step b of the method for manufacturing a joined component of the present invention is performed.

As the liquid 110, a liquid having a specific gravity slightly smaller than the specific gravity of the insulating resin 100 may be used. In that case, a predetermined amount of the insulating resin 100 is contained in the liquid 110.
From the nozzle 120 introduced at the upper end of the liquid 110. Then, the insulating resin 100 released into the liquid 110 is formed into a sphere 60 in the liquid 110 by utilizing a surface tension effect generated in the insulating resin, and the sphere 60 made of the insulating resin 100 is 11
It is preferable that the liquid is slowly cooled down and hardened in the liquid 110 by slowly lowering the inside of the liquid.

Next, the sphere 60 cured in the liquid 110 is taken out of the liquid 110. Then, as shown in FIG. 6, the surface of the sphere 60 is
The spheres 60 made of 00 are continuously covered with a resin layer 80 that can be dissolved and removed by a dissolving solution (not shown) that is unlikely to dissolve. At this time, the sphere 60 is immersed in a heated and softened resin liquid for forming the resin layer 80. Next, the spherical body 60 is taken out from the resin liquid, and the spherical body 60 is cooled. The resin layer 80 is continuously formed on the surface of the sphere 60. And the c process of the manufacturing method of the joined component of this invention is performed.

Next, as shown in FIG. 7, a through hole 62 passing through the center of the sphere is provided in the sphere 60 whose surface is covered with the resin layer 80. At this time, as shown in FIG. 8, the lower part of the sphere 60 whose surface is covered with the resin layer 80 is fitted into a hole 152 having a smaller diameter than the sphere 60 provided on the positioning plate 150. The sphere 60 is positioned so as not to move to a predetermined portion of the positioning plate 150. Next, the positioned spherical body 60 is irradiated with laser light 160 from above the spherical body 60. Then, the sphere 60 is generated by the laser light 160.
In addition, a through hole 62 passing through the center of the sphere is provided through the resin layer 80. And the d process of the manufacturing method of the joined component of this invention is performed.

Next, as shown in FIG. 9, a low melting point metal layer 90 made of solder plating or the like is formed on the surface of the resin layer 80 covering the surface of the sphere 60. At the same time, a low melting point metal such as solder plating is embedded in the through hole 62 of the sphere,
A conductor column 70 made of a low melting point metal is formed in the through hole 62 so as to be continuous with the low melting point metal layer 90. At this time, the sphere 80 whose surface is covered with the resin layer 80 is immersed in a low-melting metal plating solution (not shown) such as a solder plating solution, and the sphere 60 is coated with an electroless low-melting point such as solder plating. Metal plating is applied. Then, a low melting point metal layer 90 made of solder plating or the like is formed on the surface of the resin layer 80, and a low melting point metal such as solder plating is embedded in the through hole 62 of the sphere. The conductive pillar 70 is formed. Then, the step e of the method for manufacturing a joined component of the present invention is performed.

Next, the resin layer 80 formed on the surface of the sphere 60 is dissolved in the above-mentioned solution. Then, as shown in FIG. 10, the resin layer 80 is removed from the surface of the sphere 60 together with the low melting point metal layer 90 formed on the surface of the resin layer. At this time, the sphere 60 having the low melting point metal layer 90 and the resin layer 80 formed on the surface is immersed in the above-mentioned solution. Then, the low melting point metal layer 90 and the resin layer 80 are dissolved in the solution. And FIG.
As shown in FIG. 5, a spherical body 60 is formed in which both ends of the conductor pillar 70 protrude outside the spherical body 60. Then, the step f of the method for manufacturing a joined component of the present invention is performed.

Thereafter, as shown in FIG.
The two ends of the conductor pillar 70 protruding outside the sphere 60 from which 0 has been removed are pressed flat by a pair of press plates 180 or the like. The distance between both ends of the conductor pillar 70 is made uniform. And the g process of the manufacturing method of the joined component of this invention is performed.

The method for manufacturing the joined parts shown in FIGS. 4 to 11 comprises the above steps.

In this method for manufacturing a joined part, a predetermined amount of the insulating resin 100 discharged from the nozzle 120 into the liquid 110 is converted into a precise sphere in the liquid 110 by utilizing the surface tension effect generated in the insulating resin. 60 can be easily formed.

At this time, by bringing the specific gravity of the liquid 110 close to the specific gravity of the insulating resin 100, the insulating resin 100 released from the nozzle 120 can be kept floating in the liquid 110 for a long time. And the insulating resin 100
Can be accurately formed in the sphere 60 in the liquid 110. Also,
Since a liquid that does not dissolve the insulating resin 100 is used for the liquid 110, the insulating resin 100 released into the liquid 110 can be prevented from being eluted and lost in the liquid 110.

The sphere 110 is immersed in a low-melting-point metal plating solution such as a solder plating solution, and the sphere 60 is subjected to an electroless low-melting-point metal plating such as solder plating. A low melting point metal layer 90 made of solder plating or the like is accurately formed on the surface of the layer 80, or a low melting point metal such as solder plating is embedded in the through hole 62 of the sphere, and the through hole 62 is made of a low melting point metal. Conductor pillar 70
Can be accurately formed.

Further, the resin layer 80 formed on the surface of the sphere 60 is dissolved in a solution, and the resin layer 80 is removed from the surface of the sphere 60 together with the low melting point metal layer 90 formed on the surface of the resin layer. By doing so, both ends of the conductor pillar 70 can be accurately projected outside the sphere 60 by the thickness of the resin layer 80 or more.

Further, by flattening both ends of the conductor pillar 70 protruding outside the sphere 60 after the resin layer 80 is removed, the distance between both ends of the conductor pillar 70 can be made uniform. When the joining component 200 is interposed between the plurality of connection terminals 42 of one and the other electronic components, and the joining component 200 is heated and reflowed,
The distance between both ends of the conductor pillar 70 of the plurality of joint parts can be made uniform. Each of the plurality of conductor pillars 70 made of a low-melting-point metal having a constant distance between both ends is used to accurately connect the plurality of connection terminals 42 of one and the other electronic components by soldering or the like. it can.

[0039]

As described above, by using the joint component of the present invention and connecting the connection terminals of one and the other electronic components by the method of connecting the electronic component of the present invention, one of the connection terminals is connected to the other. The connection terminals of the electronic components can be reliably connected to each other by soldering or the like with a low conductor resistance value and stably via a large-diameter thick conductor column made of a low-melting-point metal. Then, it becomes possible to efficiently transmit a high-frequency signal or the like between the connection terminals of the one and the other electronic components with little transmission loss.

Also, one and the other electronic components near the connection terminal can be firmly joined via an insulating resin. When heat generated by one or the other electronic component such as a semiconductor chip causes a stress between the one and the other electronic component based on a difference in a coefficient of thermal expansion between the one and the other, the stress causes the one and the other. To ensure that the connection terminals connected to each other by soldering of the electronic components are separated, and that the good electrical characteristics between the connection terminals of one and the other electronic components are not impaired. Can be. As a result, it is possible to eliminate the troublesome and troublesome work of joining the one and the other electronic components with the underfill material.

Further, according to the method for manufacturing a joint part of the present invention, the joint part of the present invention can be formed easily and accurately without trouble.

[Brief description of the drawings]

FIG. 1 is a front sectional view of a joint component of the present invention.

FIG. 2 is an explanatory diagram of a method for connecting electronic components according to the present invention.

FIG. 3 is an explanatory diagram of a method for connecting electronic components according to the present invention.

FIG. 4 is an explanatory view of a manufacturing process of the method for manufacturing a joined component according to the present invention.

FIG. 5 is an explanatory view of a manufacturing process of the method for manufacturing a joined component according to the present invention.

FIG. 6 is an explanatory view of a manufacturing process of the method for manufacturing a joined component according to the present invention.

FIG. 7 is an explanatory view of a manufacturing process of the method for manufacturing a joined component according to the present invention.

FIG. 8 is an explanatory view of a manufacturing process of the method for manufacturing a joined component according to the present invention.

FIG. 9 is an explanatory view of a manufacturing process of the method for manufacturing a joined component according to the present invention.

FIG. 10 is an explanatory view of a manufacturing process of the method for manufacturing a joined component according to the present invention.

FIG. 11 is an explanatory view of a manufacturing process of the method for manufacturing a joined component according to the present invention.

FIG. 12 is an explanatory diagram of a conventional electronic component mounting method.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Resin sheet 20 Solder pillar 30 Joining sheet 40 Electronic component 42 Electronic component connection terminal 60 Sphere 62 Through hole 70 Conductor pillar 80 Resin layer 90 Low melting metal layer 100 Insulating resin 110 Liquid 120 Nozzle 150 Positioning plate 152 Hole 180 Press plate 200 Joined parts

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 5E319 AA03 AB05 AC01 BB01 BB04 CC33 CC61 CD15 CD25 5F044 LL01 LL11 QQ02 QQ03 QQ04 RR17 RR18 RR19

Claims (3)

[Claims] 1. A sphere made of an insulating resin is provided with a through-hole passing through a center point of the sphere, and a conductor pillar made of a low melting point metal is formed in the through-hole. Characterized in that it protrudes outside the sphere from the opening end of the electronic component. 2. A method for connecting electronic components, comprising the following steps. a. A connection terminal of one electronic component is superimposed on a connection terminal of the other electronic component which is electrically connected to the connection terminal via the joint component according to claim 1, and a low melting point metal of the joint component is provided. Ends of the conductor pillar made of, respectively, the connection terminal of the one electronic component and the connection terminal of the other electronic component, and the both ends of the conductor pillar are respectively connected to the connection terminals of the one and the other electronic components. And temporarily bonding using the bonding force of the flux applied to the connection terminal. b. The joint component is heated to reflow the conductor pillar made of the low melting point metal and the sphere made of insulating resin, and both ends of the conductor pillar are connected to the connection terminals of the one and the other electronic components, respectively. The insulating resin formed by reflowing the sphere covers the periphery of the connection terminal of the one and the other electronic components and the periphery of the conductor pillar connected thereto, and, through the insulating resin, of the one and the other electronic components. The step of joining the spaces. 3. A method for manufacturing a joined component for an electronic component, comprising the following steps. a. A predetermined amount of insulating resin in a heated and softened state,
Discharging the liquid from a nozzle introduced into the liquid into which the insulating resin is not likely to be dissolved. b. A step of forming the insulating resin released into the liquid into a sphere in the liquid by utilizing the surface tension effect generated in the insulating resin, and cooling and hardening the sphere made of the insulating resin by the liquid. c. Removing the hardened sphere from the liquid, and covering the surface of the sphere with a resin layer that can be removed with a solution that does not cause the sphere to dissolve; d. A step of providing a through-hole passing through the center of the sphere in the sphere whose surface is covered with the resin layer. e. Forming a low-melting-point metal layer on the surface of the resin layer and forming a conductor pillar made of a low-melting-point metal in the through hole; f. Dissolving the resin layer in the solution, and removing the resin layer from the surface of the sphere together with the low melting point metal layer formed on the surface of the resin layer; g. Flattening both ends of the conductor pillar protruding outside the sphere from which the resin layer has been removed, to make the distance between both ends of the conductor pillar uniform.