JP2001156498A - Method of detecting brought-back electronic component in surface-mounting machine - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of detecting a brought back electronic component in a surface-mounting machine capable of securely detecting a brought-back component (detecting whether an unmounted electronic component exists or not) by a holding member of a mounting head. SOLUTION: In surface-mounting an electronic component (b) on a specified position of a printed board (c) in a mounting unit (n) by holding the electronic component (b) in a feeding unit (m) of the surface-mounting machine A by the holding member 10 of the mounting head 8, whether the unmounted electronic component (b) is present or not in the holding member 10 is detected by a detecting means 11 in the return process of the mounting head 8 from the mounting unit (n) to the feeding unit (m) in the holding member 10 of the mounting head 8 that has finished the mounting of the electronic component (b).

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to detection of take-out of an electronic component by a holding member of a mounting head (detection of presence or absence of an electronic component).
The present invention relates to a method for detecting a take-out electronic component in a surface mount component mounting machine capable of reliably performing the electronic device.

[0002]

2. Description of the Related Art At present, electronic components mounted on a printed circuit board have been miniaturized, such as a 1005 (1.0 mm × 0.5 mm □) chip and a 0603 (0.6 mm × 0.3 mm □) chip. On the other hand, the suction nozzle which is a holding member attached to the mounting head corresponding to the electronic component also has an extremely small hole diameter.

On the other hand, the electronic components held by the suction nozzle are supposed to be mounted on the printed circuit board, but may not be mounted by the suction nozzle and are returned to the supply unit. The generation of this take-out electronic component not only causes a defective printed circuit board, but also damages the next electronic component by the electronic component brought back to the supply unit, and hinders the subsequent mounting of the electronic component on the printed circuit board. .

[0004] Therefore, in order to avoid the inconvenience, a method of visually confirming by an operator or mechanically detecting by utilizing a difference in vacuum pressure generated in a hole in a suction nozzle has been attempted. I have.

[0005] In the former case, monitoring and inspection by an operator cannot be carried out under the current situation in which electronic components are mounted at high speed and in large quantities.

In the latter case, as described above, in the current situation where the hole diameter of the suction nozzle is extremely small, for example, 06
When a suction nozzle for a 03 type chip or the like is used, there is little pressure difference between the degree of vacuum at the time of sucking the electronic component and the degree of vacuum at the time of not sucking the electronic component. A pressure difference is not generated enough to perform detection, and even in this example, a detection error occurs.

For this reason, in the art, there has been a strong demand for a means for reliably detecting the presence or absence of an electronic component held by a holding member after being mounted on a printed circuit board, even for an electronic component having a very small chip. Had been requested.

[0008]

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned demands, and an electronic component of a supply unit in a surface mount component mounting machine is held by a holding member of a mounting head, and printed on the mounting unit. In the surface mount component mounting for mounting the electronic component at a predetermined position on the substrate, the mounting head is returned from the mounting portion to the supply portion with respect to the mounting member after the mounting of the electronic component. In the surface mount component mounting machine, the detection of the presence or absence of the unmounted electronic component by the detection means can reliably detect the take-out of the electronic component by the holding member of the mounting head (detection of the presence or absence of the electronic component that is not mounted). An object of the present invention is to provide a method for detecting an electronic component.

[0009]

According to the present invention, there is provided a printing apparatus, comprising: a holding unit of a mounting head for holding an electronic component of a supply unit in a surface mount component mounting machine; In the surface mount component mounting to mount the electronic component at a predetermined position of the substrate, for the holding member of the mounting head after the mounting of the electronic component,
In a method of detecting a take-back electronic component in a surface mount component mounting machine, the detection unit detects the presence or absence of an unmounted electronic component in the holding member when the mounting head returns from the mounting unit to the supply unit.

In the surface mounting component mounting, the electronic component of the supply unit in the surface mounting component mounting machine is held by a holding member of a mounting head, and the electronic component is mounted at a predetermined position on a printed circuit board in the mounting unit. In the process of transporting the electronic component from the supply unit to the mounting unit, after detecting the electronic component held by the holding member by a detecting unit, mounting the electronic component based on the detection information, After the mounting of the component is completed, the presence / absence of an unmounted electronic component in the holding member is detected by the detection unit in the process of returning the mounting head from the mounting unit to the supply unit with respect to the holding member of the mounting head. The present invention relates to a method for detecting take-out electronic components in a surface mount component mounting machine.

[0011] The detecting means may include a supply section and a mounting section,
Either a configuration mounted so as to be able to move integrally with the mounting head or a configuration provided on the body side of the surface mount component mounting machine is used.

[0012]

Next, an embodiment of a method for detecting a take-out electronic component in a surface mount component mounting machine according to the present invention will be described with reference to the drawings. In FIGS. 1 and 2, reference numeral A denotes a surface mount component mounting machine for receiving an electronic component b such as a chip component or an IC component from its supply unit m, transferring it to a mounting unit n, and mounting it at a predetermined position on a printed circuit board c. A printed circuit board c is positioned and mounted on the mounting portion n, and a number of electronic components b necessary for mounting are prepared at various positions of the supply portion m.

The printed circuit board c is a surface mount component mounting machine A
Is transported from one side to the other side by the transporting means 2 provided on the body 1 in the above, and in the mounting portion n, accurate positioning and fixing are performed by positioning and fixing means (not shown).

As shown in FIGS. 1 and 2, the surface mounting component mounting machine A has an advance / retreat body 4 attached to the body 1 and arbitrarily moved in the front-rear direction (Y-axis) by advance / retreat means 3, Attached to the body 4 and moved in the left and right direction (X
The mounting head 8 is arbitrarily moved to the movable body 6 by an elevating means 7 so that the mounting head 8 can move up and down freely. ), And each means 3 and 5, 7, and 9 rotate the X-axis, Y-axis, Z-axis and θ-axis using a numerically controllable servomotor or the like. It is operated arbitrarily and with high precision, and is appropriately controlled by the control means 12 described later.

The mounting head 8 includes an electronic component b.
A holding member 10 such as a suction pad type for sucking the upper surface of the device or a chuck type for gripping the outer periphery thereof is attached, and the mounting head 8 may be a single head, as shown in FIG. If a plurality of heads are used, the mounting efficiency and the like are improved, and the holding member 10 in this embodiment is shown as a suction pad type. The holding member 10 is a suction nozzle having a suction hole in the vertical direction.

The electronic component b sucked and held by the holding member 10 of the mounting head 8 is detected by the detecting means 11, and the overall size of the sucked and held electronic component b and the overall size of the electronic component b in the front-rear and left-right directions are detected. Checking of position, lead pitch, lead bending, number of leads, etc., or holding member 1
It obtains information such as whether or not the electronic component b is sucked and held at 0 (the presence or absence of the electronic component b with respect to the holding member 10). The position is set to match the center of the mounting position on the printed circuit board c, that is, the determined correct position. After the electronic component b is mounted, if there is an unmounted component based on the detection information, it is collected. To the member t,
If the electronic component b does not exist, the process returns to the supply unit m to receive the next electronic component b.

The detecting means 11 includes a supply section m and a mounting section n.
Are mounted so as to be able to move integrally with the mounting head 8, or are provided on the body 1 side of the surface mount component mounting machine A.

The structure of the detecting means 11 when moving integrally with the mounting head 8 is such that the substantially horizontal mounting body 14 which is advanced and retreated by the reciprocating means 13 which is controlled by a numerically controllable servomotor or the like, It is attached to the mounting head 8 (the movable body 6 in this embodiment), and the mounting body 14 is provided with a visual sensor 15, a light image incident means 16, and a light source 17.

The above-mentioned visual sensor 1
Numeral 5 is disposed on one side of the electronic component b held by the mounting head 8 and uses a conventional CCD camera, which recognizes and captures an image of the electronic component b,
This detection signal is transmitted to the control means 12 described later.

The light image incident means 16 is provided on the other side of the mounting body 14 corresponding to the visual sensor 15 so as to pass directly below the electronic component b held by the mounting head 8.
And a prism or mirror whose light-emitting surface forms a 45 ° angle. The light-emitting surface is provided by a visual sensor 15 and an electronic component held by the mounting head 8. b corresponds to the lower surface.

The light source 17 is connected to the electronic component b of the mounting head 8 and the visual sensor 15 through the light image incident means 16.
In order to stabilize the image pickup by the visual sensor 15, a coaxial epi-illumination type or the like which includes a large number of light emitting diodes and has the same optical axis as the visual sensor 15 is used.

In this detecting means 11, the position detecting member 1 for regulating the light emitting position and the light emitting time of the light source 17 is used.
8, a photoelectric tube, a proximity switch, or the like is used. A detector 19 of the light emitting position of the light source 17 is attached to the movable body 6 so as to correspond to each mounting head 8. The detection body 20 corresponding to 19 is attached to the mounting body 1.
4.

The control means 12 receives the detection signal in cooperation with the detection means 11 and performs an operation based on predetermined data.
Alternatively, the reciprocating means 13 and the suction source (not shown) of the holding member 10 are individually and arbitrarily controlled, and a conventional computer is used.

Accordingly, the operation of the embodiment of the method for detecting take-out electronic components in the surface mount component mounting machine according to the present invention will be described below with reference to the flowchart shown in FIG. In the mounting work on the printed circuit board c, the set values and the operation order for this processing are programmed in advance as the respective data determined in the control means 12.

When the electronic component b is mounted, the reciprocating means 3, the moving means 5, the elevating means 7, and the rotating means 9 are operated, whereby the mounting head 8 moves to the supply part m of the electronic component b. The supply part m
Is received and held.

A holding member 1 holding an electronic component b by suction.
0 moves toward the mounting portion n. At this time,
During the movement process between the supply unit m and the mounting unit n, the holding information and the image information regarding the electronic component b held by the holding member 10 are continuously detected.

That is, the reciprocating means 13 provided on the movable body 6
Operates, and the detecting means 11 moves in the left-right direction (the Y-axis direction in FIG. 1) with respect to the mounting head 8. When the detecting body 20 of the position detecting member 18 corresponds to the detector 19 of the light source 17, the illumination light from the light source 17 is applied to the mounting head 8.
The lower surface of the electronic component b held by the holding member 10 is irradiated for a certain period of time, and the reflected light is captured as image information by the visual sensor 15 via the light image incident means 16,
It is transmitted to the control means 12. In the control means 12, an arithmetic operation is performed based on the signal obtained by the imaging and data input in advance, and image information processing of the electronic component b is performed to obtain a correction value.

In this way, in the case of a plurality of mounting heads 8, 8,.
The correction process is performed in
After the holding member 10 of the mounting head 8 sucks and holds the electronic component b in the supply section m, the entire process is completed in the process of moving the mounting head 8 to the mounting section n in the machine body 1, and the mounting section n
Is reached, the electronic component b can be immediately mounted on the printed circuit board c, so that there is no loss in tact time. After the predetermined correction for the electronic component b is completed, the mounting of the electronic component b on the printed circuit board c is started.

Next, when the mounting is completed, the mounting head 8 returns to the supply section m in order to prepare for mounting the next electronic component b again.

At this time, the electronic component b of the holding member 10
There is a case where it cannot be mounted on the printed circuit board c due to mechanical reasons or the like and remains as it is being sucked and held by the holding member 10 as it is. Therefore, it is necessary to confirm with each holding member 10 whether the electronic component b exists.

That is, according to the present embodiment, the holding member 10 of each mounting head 8 is raised by the elevating means 7 and the movable body 6 supporting each mounting head 8 is moved by the moving means 5 and the moving means 5. In the course of this movement, the detection means 11 is operated by the reciprocating means 13 so that the holding members 10, 10 are moved.
.. Are moved by the detecting means 11 in the left-right direction (the X-axis direction in FIG. 1) with respect to the mounting head 8.

In this detection, when the detection body 20 of the position detecting member 18 corresponds to the detector 19 of the light source 17, the light source 17 irradiates the holding member 10 of the mounting head 8 for a certain period of time and the reflected light Is captured as image information by the visual sensor 15 via the light image incident means 16,
It is transmitted to the control means 12. The control unit 12 performs an operation based on the signal obtained by the imaging and data input in advance, and determines whether or not the electronic component b is present in the holding member 10.

At this time, when it is determined that the electronic component b is present on the holding member 10, the mounting head 8 is moved to the collecting member t provided at an appropriate position of the body 1, and the electronic component b is operated by operating an air source or the like. Is collected in the collecting member t. In addition,
At this time, the presence / absence of the electronic component b in the holding member 10 may be detected again by the detection means 11, and when the unmounted electronic component b is detected, the mounting head 8 is moved to the collection member t again, The part b is put into the collection member t and collected.

When the collection of the electronic component b is completed, the mounting head 8 moves to the supply section m and prepares for mounting the next electronic component on the printed circuit board c.

By using a visual sensor 15 such as a CCD camera for the detecting means 11 for detecting the presence or absence of the electronic component b in the holding member 10, 1005 chips or 060
It is possible to reliably detect the presence / absence of the minimum electronic component b such as a three-chip, and it is possible to sufficiently cope with the miniaturization of the electronic component b.

If the detection by the detecting means 11 determines that the holding member 10 has no electronic component b, the mounting head 8 immediately moves to the supply section m and moves to the printed circuit board c. Prepare for the next electronic component mounting.

The detecting means 11 used in the method for detecting the take-out electronic component b in the surface mount component mounting machine A can be employed only for detecting the take-out electronic component b. In detecting the electronic component b received from the unit m, a component provided at an appropriate position on the body 1 may be used, and the detecting unit 11 includes a light source 17 having the same configuration as the detecting unit 11 in the above-described example. C with
A visual sensor 15 such as a CD camera is employed. Further, when a plurality of mounting heads 8 are provided, a series of information is obtained by continuously moving the mounting head 8 in the X-axis direction shown in FIG.

In the detection of the take-out electronic component b, if the detecting means 11 is provided on the body 1 side of the surface mount component mounting machine A, the mounting of the electronic component b on the printed circuit board c is performed. Is completed, the holding member 10 of each mounting head 8 is raised by the elevating means 7, and the movable body 6 supporting each mounting head 8 is moved to the supply section m by the operation of the advance / retreat means 3 and the moving means 5. Move towards. In this moving process, the detecting means 1 provided on the body 1
1, the mounting head 8 is continuously moved in the X-axis direction shown in FIG. 1 by the operation of the moving means 5, and the presence or absence of the electronic component b of the holding member 10 is determined by the visual sensor 15. You.

[0039]

As described above, the method for detecting a take-back electronic component in the surface mount component mounting machine according to the present invention is not limited to the process of mounting the electronic component on the printed circuit board and returning to the supply unit from the mounting unit. By detecting the presence / absence of mounted electronic components by the detection means, the mounting time can be used effectively, shortening the tact time and improving the accuracy of determining the presence / absence of electronic components, and improving the mounting accuracy and stability. Can be done. The detection of the electronic component received from the supply unit and held by the holding member in the mounting head and the detection of the presence / absence of an unmounted electronic component in the holding member after mounting are performed by the same detection means, and the process of moving the mounting head is performed. , The time loss for each of the detections can be reduced as much as possible, and an improvement in productivity can be expected. And so on.

[Brief description of the drawings]

FIG. 1 is a plan view schematically showing a surface mount component mounting machine used for a method of detecting a take-out electronic component in the surface mount component mounter.

FIG. 2 is an enlarged side view of a main part of a mounting head, schematically illustrating an embodiment of the surface mount component mounting machine in FIG. 1;

FIG. 3 is a flowchart showing the mounting operation of the electronic component in FIG. 1;

[Explanation of symbols]

 A surface mount component mounting machine b electronic component c printed circuit board m supply unit n mounting unit 8 mounting head 10 holding member 11 detecting means

Claims (3)

[Claims] An electronic component in a supply unit of a surface mount component mounting machine is held by a holding member of a mounting head, and the electronic component is mounted at a predetermined position on a printed circuit board in the mounting unit. In the process of returning the mounting head from the mounting section to the supply section with respect to the holding member of the mounting head after the mounting of the electronic component, the presence / absence of an unmounted electronic component in the holding member is detected by a detection unit. A method for detecting a take-out electronic component in a surface-mount component mounting machine. 2. A surface mount component mounting apparatus according to claim 1, wherein the electronic component of the supply unit in the surface mount component mounting machine is held by a holding member of a mounting head, and the electronic component is mounted at a predetermined position on a printed circuit board in the mounting unit. In the process of transporting the electronic component from the supply unit to the mounting unit, after detecting the electronic component held by the holding member by a detection unit, mounting the electronic component based on the detection information, After the mounting of the component is completed, the presence / absence of an unmounted electronic component in the holding member is detected by the detection unit in the process of returning the mounting head from the mounting unit to the supply unit with respect to the holding member of the mounting head. A method for detecting a take-out electronic component in a surface-mount component mounting machine. 3. The detecting means has a structure in which the supply unit and the mounting unit are mounted so as to be able to move integrally with the mounting head, or a structure provided on the body side of the surface mount component mounting machine. The method for detecting a take-out electronic component in a surface mount component mounting machine according to claim 1 or 2, wherein: