JP2008060249A - Component mounting method and surface mounter - Google Patents

Abstract

The accuracy of foreign matter confirmation on a substrate is improved.
The surface mounter includes a head that is movable relative to a substrate, and the component is held by the head so that the component is mounted at a predetermined mounting position on the substrate. Has been. And the surface mounter has the control apparatus 20 which performs the foreign material confirmation with respect to the mounting position on a board | substrate just before mounting of components. In addition, the control device 20 compares the board recognition camera 17 for imaging various marks on the board, a reference image captured in advance prior to component mounting, and an image captured immediately before component mounting. Thus, main control means 21 for determining the presence / absence of foreign matter with respect to the mounting position of the component is included.
[Selection] Figure 3

Description

  The present invention relates to a component mounting method and surface of a surface mounter configured to take out an electronic component from a component supply unit and mount it on a substrate to be mounted by a movable head unit on which a component mounting head is mounted. It relates to a mounting machine.

  Conventionally, an electronic component such as an IC is sucked from a component supply unit by a head unit having a component suction head, and the component is transported and mounted (mounted) on a printed circuit board positioned at a predetermined work position. Such a surface mounter is generally known.

In a component mounting system including this type of surface mounter, a substrate is inspected using an inspection device or the like after completion of a printing operation such as soldering on the substrate by a printing device (for example, Patent Document 1). By this inspection, this is confirmed when foreign matter is adhered on the substrate.
JP-A-8-292018

  However, in the method as disclosed in Patent Document 1, as the mounting order on the surface mounting machine becomes the rear part, the interval between the foreign matter confirmation and the start of mounting of the part becomes longer. Falls on the substrate, and foreign matter is easily disposed at the mounting position of the component on the substrate. Then, component mounting is performed without recognizing the foreign matter such as the fallen object, so that the foreign matter may be interposed between the board and the component in the mounted state, and the connection failure of the component may occur.

  The present invention has been made in view of the above-described problems, and has an object to prevent poor connection of components due to foreign matters.

  In order to achieve the above object, a component mounting method according to a first aspect of the present invention includes a component that is held by a head that is relatively movable with respect to the substrate, and the component is placed at a predetermined mounting position on the substrate. A component mounting method for mounting, wherein foreign matter confirmation is performed on the mounting position on a substrate immediately before mounting the component.

  In the component mounting method according to claim 1, as described above, the interval between the confirmation of the foreign matter and the start of the mounting of the component is performed by confirming the foreign matter with respect to the mounting position of the component immediately before the mounting of the component. Therefore, it is possible to prevent foreign matter from being interposed between the substrate and the component in the mounted state. Thereby, it is possible to suppress the occurrence of poor connection between the component and the circuit of the board due to the foreign matter.

  Note that “immediately before mounting a component” refers to any point in time from when the component immediately before the component is mounted on the board to when the component is mounted.

  In the component mounting method according to the first aspect of the present invention, it is preferable that foreign matter confirmation is performed only at a mounting position of a component designated in advance (Claim 2). According to such a method, the time required for foreign object confirmation can be shortened. If a relatively large part such as BGA (Ball Grid Array) or QFP (Quad Flat Package) is selected as the designated part, the foreign object is completely covered after mounting, and it is difficult to find the foreign object. Since the foreign matter confirmation before mounting can be performed only for such components, the efficiency is high.

  3. The component mounting method according to claim 1, wherein a mounting position on the substrate is imaged immediately before mounting the component using a substrate recognition camera for imaging various marks on the substrate, and based on the image. It is preferable to determine the presence or absence of foreign matter. According to such a method, since the presence / absence of foreign matter can be determined using the board recognition camera provided in the apparatus for executing the component mounting method, a mechanism for determining the presence / absence of foreign matter is required separately. And not.

  In this case, the presence / absence of a foreign object at the mounting position of the component may be determined by comparing a reference image captured in advance before mounting the component with an image captured immediately before mounting the component. Good (Claim 4). In this way, it is possible to easily and accurately determine the presence / absence of a foreign object simply by obtaining the difference between the reference image and the image immediately before mounting.

  In this case, the image data of the predetermined area including the mounting position of the component obtained by processing the image captured immediately before mounting the component is compared with the reference data stored in advance, thereby You may make it discriminate | determine the presence or absence of the foreign material with respect to a mounting position (Claim 5).

  According to a sixth aspect of the present invention, the surface mounter includes a head that is movable relative to the substrate, and the component is held by the head and the component is mounted at a predetermined mounting position on the substrate. In the surface mounting machine configured to do so, it has a confirmation means for confirming the foreign matter with respect to the mounting position on the substrate immediately before mounting the component.

  In the surface mounter according to the sixth aspect of the present invention, as described above, the confirmation means is configured to confirm the foreign matter with respect to the mounting position of the component immediately before mounting the component. Since the interval until the mounting is started can be shortened, it is possible to prevent foreign matter from being interposed between the board and the component in the mounted state. Thereby, it is possible to suppress the occurrence of poor connection between the component and the circuit of the board due to the foreign matter.

  In the surface mounter according to the sixth aspect, preferably, the confirmation unit is configured to perform foreign matter confirmation only on a mounting position of a component designated in advance (Claim 7). If comprised in this way, the time which foreign substance confirmation requires can be shortened.

  8. The surface mounter according to claim 6 or 7, wherein the confirmation means includes an image pickup means for picking up images of various marks on the substrate and an image pick-up using the image pickup means prior to mounting of components. It is preferable to include a determination unit that determines whether or not there is a foreign object with respect to the mounting position of the component by comparing the reference image that has been recorded with the image captured by the imaging unit immediately before mounting the component. 8). If comprised in this way, since presence-and-absence discrimination | determination can be performed using imaging means, such as the board | substrate recognition camera with which the said apparatus is equipped, the mechanism for determining the presence or absence of a foreign material is not required separately. . Further, according to the above configuration, it is possible to easily and accurately determine the presence / absence of a foreign object only by obtaining a difference between a reference image and an image immediately before mounting.

  According to the component mounting method and the surface mounter of the present invention, the interval between the foreign matter confirmation and the start of mounting of the component is shortened by performing the foreign matter confirmation on the mounting position of the component immediately before the mounting of the component. Therefore, it is possible to prevent foreign matter from interposing between the substrate and the component in the mounted state. As a result, it is possible to suppress the occurrence of connection failure between the component and the circuit of the board due to the foreign matter.

  A preferred embodiment of the present invention will be described with reference to the drawings.

  1 and 2 schematically show a surface mounter, FIG. 1 is a plan view of a state where a cover is removed, and FIG. 2 shows the surface mounter in the same front view.

  As shown in the figure, a conveyor 2 extending in the X-axis direction is disposed on the base 1 of the surface mounting machine, and the substrate P is conveyed to the conveyor 2 and stopped at a predetermined mounting work position (shown position). It has come to be. Although not shown, a positioning mechanism for the substrate P is provided at the mounting work position. When the substrate P is loaded along the conveyor 2, the positioning mechanism is activated to bring the substrate P to the mounting work position. It is comprised so that positioning may be fixed.

  Component supply units 4 are arranged on both sides of the conveyor 2, and multiple rows of tape feeders 4a capable of supplying small chip components such as ICs, transistors and capacitors are arranged in these component supply units 4. Yes.

  A head unit 6 for mounting components is provided above the base 1. The head unit 6 is movable over the component supply unit 4 and the substrate P at the mounting work position, and can move in the X-axis direction and the Y-axis direction.

  That is, a fixed rail 7 in the Y-axis direction and a ball screw shaft 8 that is rotationally driven by a Y-axis servomotor 9 are disposed on the base 1, and a support member for the head unit 6 is disposed on the fixed rail 7. 11 is arranged, and a nut portion 12 provided on the support member 11 is screwed into the ball screw shaft 8. The support member 11 is provided with a guide member 13 in the X-axis direction and a ball screw shaft 14 driven by an X-axis servo motor 15, and the head unit 6 is movably held by the guide member 13. A nut portion (not shown) provided on the head unit 6 is screwed onto the ball screw shaft 14. The support member 11 is moved in the Y-axis direction by the operation of the Y-axis servo motor 9, and the head unit 6 is moved in the X-axis direction with respect to the support member 11 by the operation of the X-axis servo motor 15. ing.

  A plurality of mounting heads 16 for mounting components are mounted on the head unit 6. In this embodiment, six mounting heads 16 are mounted in a line at equal intervals in the X-axis direction. Yes. Each mounting head 16 can move in the Z-axis direction and rotate around the R-axis (nozzle center axis) with respect to the frame of the head unit 6 and is driven by a lift drive mechanism and a rotary drive mechanism (not shown). It is like that. Each mounting head 16 is provided with a nozzle 16a at the tip (lower end) thereof, and the negative pressure is supplied to the tip of the nozzle 16a from a negative pressure supply means (not shown) to hold the component by suction. It is like that.

  A substrate recognition camera 17 is further mounted on the head unit 6. The substrate recognition camera 17 is composed of a CCD camera or the like equipped with an illumination device, and various marks (fiducial marks and bad marks) on the substrate P positioned at the mounting work position as the head unit 6 moves. Etc.). In the present embodiment, the substrate recognition camera 17 functions as an “imaging unit” according to the present invention.

  A component recognition camera 18 is disposed on the base 1. Similarly to the board recognition camera 17, the component recognition camera 18 is composed of a CCD camera or the like equipped with an illumination device, and picks up the parts adsorbed to each mounting head 16 of the head unit 6 from below. It is supposed to be.

  With the configuration as described above, in this surface mounter, the head unit 6 moves from the component supply unit 4 to the component supply unit 4 by each mounting head 16 while moving between the component supply unit 4 and the substrate P positioned at the mounting work position. The component is sucked and the sucked component is transported and mounted on the substrate P. Detailed mounting operation will be described later.

  Next, the control system of the surface mounter will be described with reference to FIG.

  This figure shows only the functional components related to the present invention in the functional configuration of the controller 20 of the surface mounter in a block diagram.

  The control device 20 shown in the figure includes a well-known CPU that executes logical operations, a ROM that stores various programs for controlling the CPU in advance, a RAM that temporarily stores various data during the coating operation, and various data. And an HDD or the like for storing software. The functional configuration includes a main control means 21, a program storage means 22, various data storage means 23, an image processing means 24, and an actuator control means 25. In the present embodiment, the control device 20 corresponds to the “confirming means” according to the present invention.

  The main control means 21 comprehensively controls the drive of the apparatus so as to proceed with a series of component mounting operations in accordance with a program stored in the program storage means 22, and performs various arithmetic processes associated with the operations.

  The main control means 21 recognizes various marks formed on the board P based on the image data of the board recognition camera 17, as well as an image and various data immediately before mounting the component mounting position by the board recognition camera 17. Compared with a reference image stored in advance in the storage means 23, the presence / absence of a foreign object is determined, and in the present embodiment, the main control means 21 functions as the “determination means” according to the present invention. The above-mentioned reference image indicates an image in a normal state in which there is no unexpected foreign object or the like at the component mounting position, and is disposed on the upstream side of the surface mounter in the component mounting system as an example. An image captured after the printing operation by the printing apparatus is completed.

  The program storage means 22 stores various programs related to the mounting work as described above.

  The various data storage means 23 stores various data necessary for work on the surface mounter. The various data storage means 23 includes, for example, component-related data (component type, shape, dimensions, etc.) and substrate-related data (substrate type, component mounting position data, coordinates of various marks formed on the substrate). Position data, shape data, etc.) are stored, and in this embodiment, a reference image of a predetermined area including the mounting position of the component is further stored.

  The image processing unit 24 performs predetermined image processing on the image data output from the cameras 17 and 18, and the main control unit 21 performs various marks formed on the substrate that is the object based on the image data. And recognition of foreign matter on the substrate and various determinations and calculations based on the recognition.

  The actuator control means 25 controls the drive of an actuator such as a servo motor that drives the conveyor 2, the head unit 6, each head 16, and the like.

  Next, the mounting operation control of the surface mounter by the control device 20 will be described using a flowchart.

  FIG. 4 is a flowchart showing the mounting operation control of the surface mounter by the control device 20. When production is started in this surface mounting machine, first, the conveyor 2 is driven, and the board P on which printing processing such as solder is performed is carried into the apparatus and positioned at the mounting work position. Then, the head unit 6 is driven, and a substrate recognition camera 17 captures and recognizes an unillustrated fiducial mark on the substrate P, thereby obtaining a positional deviation of the substrate P and obtaining the correction data from the main control means 21. Calculate by

  Based on the recognition result, the following component mounting process is executed. That is, the head unit 6 and the like are driven and controlled by the main control means 21 in order to mount (mount) components on the board P.

  First, the head unit 6 is moved to the component supply unit 4 and components are taken out by each mounting head 16 (step S1). Specifically, the head unit 6 is moved above the component supply unit 4 and a predetermined mounting head 16 to which the component is to be sucked is moved up and down to pick up the component while being picked up from the tape feeder 4a. At this time, if possible, the components are picked up simultaneously by the plurality of mounting heads 16.

  When the suction of the components by all the mounting heads 16 is completed, the head unit 6 is moved above the component recognition camera 18 to image the suction components by the mounting heads 16, and based on the imaging results, The adsorption state is recognized (step S2).

  Next, it is determined whether or not the component to be mounted from now is a designated component (for example, BGA or QFP) (step S3). If it is determined that the component to be mounted is not the designated component, the head unit 6 is moved onto the board P and disposed above the mounting position of the component, and then the mounting head 16 is moved up and down. Thus, the suction component is mounted on the substrate P (step S8).

  On the other hand, when it is determined that the component to be mounted is the designated component, the following foreign object inspection is executed before mounting the component (immediately before mounting the component). That is, the head unit 6 is moved onto the board P, and the board recognition camera 17 is placed above the mounting position of the designated part to be inspected for foreign matter (steps S4 and S5), and a predetermined area including the part mounting position is defined. Take an image.

  The obtained image immediately before mounting the predetermined area is processed by the image processing means 24, and the main control means 21 stores the image immediately before mounting the predetermined area and the predetermined area S previously stored in the various data storage means 23. The reference image is compared (step S6). Specifically, processing for obtaining a difference between binarized light and dark data of two captured images is performed.

  Next, as a result of the comparison of these two images, it is determined whether or not there is a foreign object at the component mounting position (step S7). If it is determined that no foreign matter is present at the component mounting position, the head unit 6 is placed above the component mounting position on the substrate P, and then the mounting head 16 is moved up and down to move the suction component to the substrate P. It is mounted on top (step S8).

  On the other hand, if it is determined as a result of the image comparison that there is a foreign object at the component mounting position, that is, the main control means 21 acquires in advance an image of the predetermined area S immediately before component mounting (see FIG. 5A). As a result of comparison with the reference image of the predetermined area S (see FIG. 5B), if a difference due to the foreign matter T is recognized in the brightness data of the two captured images, the component mounting process is suspended. A warning by a patrol light, a buzzer or the like is given (step S9).

  Then, error information indicating that a foreign object exists in a predetermined area including the mounting position of the component for which the mounting process has been suspended (suspended component) is stored in the various data storage means 23 (step S10), and the foreign object has been copied. The NG image is stored in various data storage means 23 (step S11).

  In addition, various data storage means 23 from the RAM of the control device 20 for the image of the location corresponding to the NG image on the substrate P immediately before the substrate P on which the mounting process is currently performed (or a plurality of substrates up to immediately before). Are transferred and stored (step S12). Thus, after the mounting operation by the surface mounter is completed, the above-described NG image and the images of the substrate P before and after the NG image are compared with each other, so that the cause of the foreign matter placed on the substrate P can be easily pursued. . It should be noted that the image corresponding to the NG image may be stored at the time of processing the next substrate.

  When the process for the first component is completed in this way, it is determined whether there is a component to be mounted next (step S13). If there is a part to be mounted, the process returns to step S2, the suction state of the next part is recognized, and it is determined whether or not the part is a designated part (step S3).

  When the mounting of the suction components by the mounting heads 16 is finished in this way, it is determined whether or not all the components have been mounted, that is, whether or not all the components have been mounted on the substrate P, although not shown in the flowchart. If NO is determined here, the process returns to step S1, the head unit 6 is moved to the component supply unit 4, and each process such as component suction is repeatedly executed.

  On the other hand, if it is determined that the mounting of all the components has been completed, it is determined whether or not there is a component that is determined to have a foreign object at the component mounting position by the foreign object inspection (step S14). If there is no part determined as having a foreign object, the conveyor 2 is driven to carry the board P out of the apparatus, thereby completing a series of mounting processes on the board P.

  On the other hand, if there is a component that is determined to have foreign matter at the component mounting position in the foreign matter inspection (that is, a component whose mounting operation has been suspended), error information about the component is displayed on a display panel (not shown) ( Step S15). Then, the conveyor 2 is driven to carry the board P out of the apparatus, remove foreign matters on the board P, and then the mounting process of the reserved parts onto the board P is performed again by the surface mounter.

  As described above, in this surface mounter, the interval between the confirmation of foreign matter and the start of mounting of the component can be shortened by confirming the foreign matter with respect to the mounting position of the component immediately before mounting the component. Therefore, it is possible to prevent foreign matter from being interposed between the substrate P and the component in the mounted state. Thereby, it is possible to suppress the occurrence of connection failure between the component and the circuit of the board P due to the foreign matter. Note that “immediately before mounting a component” refers to any point in time from when the previous component is mounted on the board P to when the component is mounted.

  In addition, since the foreign matter confirmation is performed only on the mounting position of the component designated in advance, the time required for the foreign matter confirmation can be shortened. If a relatively large part such as BGA (Ball Grid Array) or QFP (Quad Flat Package) is selected as the designated part, the foreign object is completely covered after mounting, and it is difficult to find the foreign object. Since the foreign matter confirmation before mounting can be performed only for such components, the efficiency is high.

  Also, the mounting position on the board P is imaged immediately before mounting the components using the board recognition camera 17 for imaging various marks on the board P, and the presence / absence of foreign matter is determined based on the image. Therefore, a mechanism for determining the presence or absence of a foreign object is not required separately, and the apparatus can be prevented from becoming complicated.

  In addition, by comparing the reference image captured in advance prior to the mounting of the component with the image captured immediately before mounting the component, the presence / absence of a foreign object with respect to the mounting position of the component is determined. By simply obtaining the difference between the reference image and the image immediately before mounting, it is possible to easily and accurately determine the presence / absence of a foreign object.

  The surface mounter described above is an example of a preferred embodiment of a surface mounter according to the present invention (a surface mounter to which the component mounting method according to the present invention is applied), and its specific configuration is Modifications can be made as appropriate without departing from the scope of the present invention.

  For example, in the above-described embodiment, an example in which the presence / absence of a foreign object with respect to a mounting position of a component is determined by comparing an image immediately before mounting the component with a reference image captured in advance is not limited thereto. The solder area and position data in the image data obtained by processing the image immediately before component mounting is compared with the reference solder area and position data stored in advance in various data storage means 23. Thus, the presence / absence of a foreign object relative to the component mounting position may be determined.

  In the above embodiment, the foreign matter inspection is performed only on the mounting position of the designated component. However, the foreign matter inspection may be performed on the mounting positions of all the components to be mounted.

It is a top view which shows an example of the surface mounting machine which concerns on this invention (The surface mounting machine to which the component mounting method which concerns on this invention is applied). It is a front view which shows a surface mounting machine. It is a block diagram which shows the control system of a surface mounting machine. It is a flowchart figure which shows an example of the mounting operation control in a surface mounting machine. It is an image including a component mounting position to be compared in the foreign substance inspection, (a) is an image immediately before component mounting, and (b) is a reference image captured in advance.

Explanation of symbols

16 Head 17 Board recognition camera (imaging means)
20 Control device (confirmation means)
21 Main control means (discrimination means)
P substrate

Claims (8)

A component mounting method for holding a component with a head movable relative to the substrate and mounting the component at a predetermined mounting position on the substrate,
A component mounting method, wherein foreign matter confirmation is performed on the mounting position on a substrate immediately before mounting the component.   The component mounting method according to claim 1, wherein foreign matter confirmation is performed only at a mounting position of a component designated in advance.   2. A mounting position on a substrate is imaged immediately before component mounting using a substrate recognition camera for imaging various marks on the substrate, and the presence or absence of foreign matter is determined based on the image. Or the component mounting method described in 2 above.   The comparison between a reference image captured in advance prior to component mounting and an image captured immediately before component mounting is performed to determine the presence / absence of a foreign object with respect to the component mounting position. 4. The component mounting method according to 3.   Presence or absence of foreign matter with respect to the mounting position of the component by comparing image data of a predetermined area including the mounting position of the component obtained by processing an image captured immediately before mounting the component with reference data stored in advance The component mounting method according to claim 3, wherein the determination is performed. In a surface mounter that includes a head that is movable relative to a substrate, and that is configured to hold the component by the head and mount the component at a predetermined mounting position on the substrate,
A surface mounting machine characterized by comprising confirmation means for confirming foreign matter at the mounting position on a substrate immediately before mounting the component.   The surface mounting machine according to claim 6, wherein the confirmation unit performs foreign matter confirmation only on a mounting position of a component designated in advance. The confirmation means includes
Imaging means for imaging various marks on the substrate;
By comparing a reference image previously captured using the imaging unit prior to component mounting with an image captured by the imaging unit immediately before component mounting, the presence / absence of foreign matter at the mounting position of the component is compared. The surface mounter according to claim 6, further comprising: a determination unit that performs determination.

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