JP2001020061A - Vacuum deposition equipment - Google Patents

Abstract

[PROBLEMS] To control the surface oxidation of a magnetic layer and the internal oxidation of a magnetic layer. The vehicle travels in a fixed direction along a cooling roll,
On the vapor deposition end point side of the deposition target that passes through the deposition region 14 on which the metal vapor 13 is deposited, a gas outlet 20 is provided so as to face the metal vapor 13, and the gas-blown metal vapor 13 is discharged. A first gas introduction portion 16 provided with an eave-shaped regulating protrusion 22 for regulating the gas, and a vapor deposition region 1 traveling in a fixed direction along the cooling roll 6 to be coated with the metal vapor 13.
A second gas introduction section 51 provided on the vapor deposition starting point side of the object to be passed passing through the gas flow path 4 so as to face the gas outlet 20 to the metal vapor 13.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a vacuum vapor deposition apparatus in which a tape-shaped object is run in a vacuum chamber and a thin film is formed on the surface of the object by a vapor deposition method.

[0002]

2. Description of the Related Art Magnetic recording media are used, for example, in the fields of video tape recorders represented by high-definition video tape recorders and digital video tape recorders.
There is a strong demand for higher density recording for higher image quality. As a magnetic recording medium that meets this requirement, a so-called metal magnetic thin film type magnetic recording medium in which a magnetic layer is formed by directly applying a metal magnetic material on a nonmagnetic support is used. As a method of manufacturing a magnetic recording medium of a metal magnetic thin film type, there are a vacuum thin film forming technique such as a vacuum deposition method, a sputtering method and an ion plating method, and plating.

[0003] The magnetic recording medium of the metal magnetic thin film type has not only excellent coercive force, squareness ratio and electromagnetic conversion characteristics in a short wavelength region, but also a thin magnetic layer. As described above, since there is no need to include a non-magnetic material such as a binder in the magnetic layer, there are many advantages such as a higher packing density of the magnetic material. Above all, a vapor-deposited magnetic tape on which a magnetic layer is formed by a vacuum vapor deposition method (hereinafter referred to as a vapor-deposited tape) has already been put into practical use because of its high production efficiency and stable characteristics.

[0004] The evaporation tape is generally used in a vacuum evaporation apparatus having a cooling roll for guiding a non-magnetic support in a vacuum chamber, a magnetic material serving as an evaporation source, and heating means for heating the evaporation source. A magnetic layer is formed on the surface of a magnetic support. The vacuum evaporation apparatus converts a magnetic material serving as an evaporation source into a metal vapor by irradiation with an electron beam or the like,
A vapor-deposited film is formed by being incident on a non-magnetic support running along the outer peripheral surface of the cooling roll.

[0005] In a vapor-deposited tape, the magnetic properties of a metal magnetic thin film are greatly affected by the angle of incidence of metal particles on a non-magnetic support. Usually, the vacuum evaporation apparatus has a limited evaporation range so that metal vapor can be obliquely incident on a non-magnetic support running on a rotating cooling roll. Therefore, the vacuum evaporation apparatus is provided with a shutter near a cooling roll to cover a predetermined area of the non-magnetic support.

Further, the vacuum deposition apparatus has a slit-shaped outlet along the width direction of the non-magnetic support in order to improve the coercive force of the magnetic layer and to improve the magnetic properties such as the saturation magnetic flux density. Equipped with gas inlet pipe. The vacuum evaporation apparatus oxidizes the metal vapor appropriately by spraying an oxygen gas supplied through a gas introduction pipe onto the metal vapor. This gas introduction pipe is attached to a shutter provided with a cooling mechanism, so that thermal deformation due to high-temperature metal vapor is prevented.

[0007]

As described above, the vapor deposition tape is vapor-deposited by introducing oxygen gas into the metal vapor and oxidizing the metal vapor. However, the coercive force of the magnetic layer and the saturation magnetic flux In order to improve magnetic properties such as density, it is desirable that the metal vapor is oxidized to a predetermined amount and deposited on the non-magnetic support. Further, it is desirable that the metal oxide is uniformly distributed in the vapor deposition tape when the metal vapor forms the magnetic layer.

[0008] In the vacuum vapor deposition apparatus, the non-magnetic support is vapor-deposited while the non-magnetic support is guided by the cooling rolls and travels through the metal vapor deposition area to form a thin film. A conventional vacuum evaporation apparatus is configured such that an arbitrary point on a non-magnetic support running on a cooling roll approaches an evaporation area and one end of an evaporation area where evaporation is started is defined as a deposition start point, and the arbitrary point is a cooling roll. Assuming that the other end running above and coming out of the deposition region is a deposition end point, a gas introduction pipe is provided on the deposition end point side.

Therefore, in a conventional vacuum deposition apparatus,
A high-concentration oxygen gas is blown into the metal vapor on the vapor deposition end point side to have a composition containing a large amount of metal oxide. Also, in a vacuum deposition apparatus, since the oxygen gas to be blown does not sufficiently pass through the metal vapor to reach the vapor deposition start point, the vapor vapor at the vapor deposition start side has a larger metal oxide than the vapor vapor at the vapor deposition end point. Is a composition having a small proportion of

That is, in a conventional vacuum vapor deposition apparatus having a gas introduction pipe, a metal vapor having a small oxidizing component is applied to a non-magnetic support running on a cooling roll in an initial stage of vapor deposition. In addition, a thin film is formed by depositing a metal vapor containing a large amount of an oxidizing component at the end of the vapor deposition. Therefore,
The vapor deposition tape has a magnetic layer formed by applying a metal vapor on a non-magnetic support, and contains almost no metal oxide inside,
The surface was a non-uniform film layer containing an excessive amount of metal oxide. As a result, the vapor deposition tape has a problem that it is difficult to obtain good magnetic properties such as a coercive force and a saturation magnetic flux density of the magnetic layer, and it becomes a metal magnetic thin film having unstable electromagnetic conversion characteristics.

Accordingly, the present invention is to solve the above-mentioned problems of the conventional vacuum vapor deposition apparatus, and to provide a vacuum vapor deposition apparatus capable of controlling surface oxidation and internal oxidation and forming a uniform magnetic layer. With the goal.

[0012]

According to the present invention, there is provided a vacuum vapor deposition apparatus for achieving the above object, comprising: a vacuum chamber, a supply roll for supplying a tape-shaped object to be deposited, and running the object to an outer peripheral portion. A cooling roll to be wound, a take-up roll for winding the object to be deposited that has been subjected to the evaporation process, an evaporation source for generating metal vapor, a heating means for heating the evaporation source, and a part of the outer peripheral portion of the cooling roll. A shutter member that constitutes a deposition site by facing the evaporation source, and a gas introduction unit that is disposed near the deposition site and introduces gas into the metal vapor, and travels around the outer periphery of the cooling roll. In the vacuum evaporation apparatus for forming a metal thin film on the surface of the object to be deposited, the gas introduction unit includes an introduction pipe main body having a gas flow path formed therein, and a gas flowing through the gas flow path connected to the introduction pipe main body. Supply gas supply pipe An outlet having a blowout port for discharging a gas to the metal vapor, provided in the introduction pipe body facing the deposition end point side of the deposition target with respect to the deposition portion of the cooling roll, and An eave-shaped regulating projection for regulating the vapor deposition of the metal vapor on the object to be vapor-deposited is provided.

[0013] The vacuum deposition apparatus further includes an introduction pipe main body having a gas flow path formed therein, a gas supply pipe connected to the introduction pipe main body to supply gas to the gas flow path, And a blow-out unit provided at a position facing the outer peripheral portion of the cooling roll and having a blow-out opening for blowing gas to the metal vapor, wherein the second gas-introducing unit includes the blow-off unit Is provided on the vapor deposition starting point side of the vapor deposition site of the cooling roll opposite to the first gas introduction unit. Further, the second gas introduction unit is incorporated in a support member in which the gas supply pipe is rotatably supported at one end, and the corresponding position of the outlet with respect to the vapor deposition unit of the cooling roll is adjusted. The gas injection into the metal vapor is adjusted. Further, the support,
It is assumed that a cooling mechanism is provided.

In the vacuum vapor deposition apparatus according to the present invention having the above-described structure, the eave-shaped restricting projection provided on the first gas introduction section is provided near the gas outlet of the first gas introduction pipe. Thus, the deposition of the metal vapor containing a gas in excess of the surrounding metal vapor on the object is regulated. Further, by providing the second gas introducing section, the vacuum vapor deposition apparatus can sufficiently disperse the gas into the metal vapor on the vapor deposition starting point side.

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of a vacuum deposition apparatus according to the present invention will be described in detail with reference to the drawings. As shown in FIGS. 1 and 2, a vacuum deposition apparatus 1 according to a first embodiment to which the present invention is applied has, for example, a vapor deposition apparatus on a surface of a tape-shaped nonmagnetic support 2. A metal magnetic thin film is formed by a method.

The vacuum evaporation apparatus 1 includes a supply roll 4, a take-up roll 5, a cooling roll 6, and rotating rolls 7, 8 in a vacuum tank 3, and an evaporation source filled in a crucible 9. 10
Is heated by an electron beam 12 irradiated from an electron gun 11 to form a metal vapor 13, and the metal vapor 13 is vapor-deposited on the non-magnetic support 2 in the range of the vapor deposition region 14.

The vacuum chamber 3 is constructed so that the assembled state of each part is not affected by the deformation of the tank wall due to evacuation or the like, and the inside thereof is about 10 ^-3 to 1 by a vacuum pump (not shown).
It is kept in a high vacuum state of about 0 ^-4 Pa.

The supply roll 4 and the take-up roll 5 are cylindrical and have a length substantially equal to the width of the non-magnetic support 2, and supply and take up the non-magnetic support 2. The nonmagnetic support 2 is a vacuum chamber 3
Are rotatably mounted on support shafts 4a and 5a supported on
It is unwound from the supply roll 4 and is sequentially wound up on the winding roll 5 via the cooling roll 6.

The cooling roll 6 has a cylindrical shape having substantially the same length as the width of the nonmagnetic support 2, is rotatably mounted on a support shaft 6 a supported by the vacuum chamber 3, and has a supply roll 4 and a winding roll. The diameter of the roll 5 is larger than the diameter of the roll. Cooling roll 6
In this method, the outer peripheral surface is mirror-polished, and the non-magnetic support 2 is run on the outer peripheral surface at a constant speed. A cooling device (not shown) is provided inside the cooling roll 6. The cooling roll 6 suppresses thermal deformation of the non-magnetic support 2 due to vapor deposition by causing the non-magnetic support 2 on which the metal vapor 13 is vapor-deposited to run at a constant speed while cooling.

The rotating rolls 7 and 8 have a cylindrical shape having substantially the same length as the width of the non-magnetic support 2, and are rotatably mounted on support shafts 7a and 8a supported on the vacuum chamber 3. The rotating roll 7 is located between the supply roll 4 and the cooling roll 6, and the rotating roll 8 is located between the cooling roll 6 and the winding roll 5, and the non-magnetic support 2 hung on the cooling roll 6 is cooled by the cooling roll 6. A predetermined tension is applied in such a direction as to be pressed against the substrate. The non-magnetic support 2 is configured to sequentially travel on the cooling roll 6 by the rotating rolls 7 and 8 without bending.

The crucible 9 has substantially the same length as the width of the non-magnetic support 2, and is filled with a metal magnetic material as an evaporation source 10. An electron gun 11 for heating and evaporating the evaporation source 10 filled in the crucible 9 is provided on the side wall of the vacuum chamber 3. The electron gun 11 transmits the electron beam 12 to the crucible 9.
And the light is emitted to the evaporation source 10 at an angle. The crucible 9 is disposed at a position where the evaporation source 10 heated and evaporated by the electron beam 12 becomes a metal vapor 13 and can be evaporated with a predetermined evaporation area 14 on the nonmagnetic support 2 running on the cooling roll 6. Has been established.

Accordingly, the vacuum vessel 3 has the crucible 9 and the electron gun 11 disposed therein as described above, so that the heated and vaporized metal vapor 13 travels at a constant speed along the outer peripheral surface of the cooling roll 6. The light is incident on the non-magnetic support 2 to be formed and is deposited as a magnetic layer.

Further, the vacuum tank 3 is provided with a deposition-preventing plate 15 so as to cover a part of the non-magnetic support 2 running at a constant speed along the outer peripheral surface of the cooling roll 6. Excessive adhesion of metal vapor 13 to the deposited magnetic layer is regulated. The attachment-preventing plate 15 is curved so that the surface facing the cooling roll 6 has substantially the same curvature as the cooling roll 6, and the non-magnetic support 2 that travels at a constant speed along the outer peripheral surface of the cooling roll 6. The predetermined area is covered. A first oxygen gas introduction unit 16 for supplying oxygen gas from outside the vacuum chamber 3 and blowing the oxygen gas onto the metal vapor 13 is attached to the deposition prevention plate 15.

The first oxygen gas introducing section 16 is provided in FIG.
As shown in FIG. 4 and FIG. 4, the oxygen flow path forming part 17, the oxygen flow path lid 18, the oxygen gas supply pipe 19, and the gas outlet 20
, And an eave-shaped restricting projection 22 having a substantially rectangular parallelepiped shape. The length in the longitudinal direction is substantially the same as the width of the nonmagnetic support 2. The first oxygen gas introducing section 16 includes an oxygen flow path forming section 17
And the oxygen flow path cover 18 are fixed by a plurality of bolts 24 via a copper packing 23,
Are assembled without gaps so as to be sandwiched between the oxygen flow path forming part 17 and the oxygen flow path lid part 18.

Further, the first oxygen gas introducing portion 16 is provided in the vapor deposition region 14 where an arbitrary portion on the non-magnetic support 2 running on the cooling roll 6 approaches the vapor deposition region 14 to start vapor deposition.
Is defined as one end of the vapor deposition, and the other end of the arbitrary portion traveling on the cooling roll and exiting from the vapor deposition region 14 is defined as the vapor deposition end. Oxygen gas is blown against the metal vapor 13. The first oxygen gas introduction unit 16
The metal vapor 13 surrounding the gas outlet 20 and containing an excessive amount of metal oxide is regulated by an eave-shaped regulating projection 22. At the final stage of vapor deposition, the metal vapor 13 containing an excessive amount of metal oxide Are adhered on the non-magnetic support 2 to suppress formation of an oxide layer on the surface of the non-magnetic support 2.

The oxygen flow path forming section 17 includes the oxygen flow path forming section 1
An oxygen flow path 25 formed as a narrow groove is provided on the surface where the cover 7 and the oxygen flow path cover 18 are fixed.

The oxygen flow path 25 is formed as a narrow groove reaching the gas outlet 20 through a plurality of branch points. That is, one end of the narrow groove serving as the oxygen flow path 25 is connected to the end of the oxygen gas supply pipe 19 for supplying oxygen gas from the outside, and the other end thereof extends in the longitudinal direction of the first oxygen gas introduction section 16. It is branched and extended in two directions. Oxygen flow path 25
The other end which is branched and extended in two directions is bent and extended in the direction of the gas blowing part 21 on the way. The oxygen flow path 25 extends from the bent portion to the first oxygen gas introduction portion 1.
6 is again branched and extended in two directions along the longitudinal direction. The oxygen flow path 25 branched and extended in two directions further repeats branching and extension, and finally is divided into 16 narrow tubes, and the oxygen flow paths 25 are equally spaced from each other, and the oxygen flow path is formed. It communicates with an oxygen reservoir 26 in section 17.

The oxygen reservoir 26 is a space formed by fixing the oxygen flow path forming part 17 and the oxygen flow path lid part 18 and assembling the gas blowing part 21, and comprises a first oxygen gas introducing part. 16 extending in the longitudinal direction,
1 to the gas outlet 20. Oxygen pool 2
6, the above-described 16 oxygen flow paths 25 are electrically connected to each other at equal intervals in the longitudinal direction of the first oxygen gas introduction section 16.

When the oxygen gas is supplied to the oxygen flow path 25 from the oxygen gas supply pipe 19, the oxygen gas is supplied at an equal pressure to each of the oxygen flow paths extending in two directions from each branch point. The oxygen gas is supplied to the oxygen reservoir 26 from the 16 oxygen channels 25 at a uniform pressure. As a result, oxygen gas is blown out from the gas outlet 20 to the metal vapor 13 at a uniform pressure in the longitudinal direction.

In the case where the oxygen flow path 25 has a structure in which the oxygen gas supplied from the oxygen gas supply pipe 19 is directly led to the oxygen reservoir 26 without repeating bending and extension as described above, The pressure drops remarkably at both ends of the oxygen reservoir 26 in the longitudinal direction, so that the pressure is unevenly blown out from the gas outlet 20.

The oxygen flow path forming section 17 has a first refrigerant flow path 27. The first refrigerant flow path 27 is formed as a wide groove on a surface opposite to the surface on which the oxygen flow path 25 is formed, and the oxygen flow path forming portion 17 and the heat shield plate 28 are combined. It is formed.

In the first oxygen gas introducing section 16, the oxygen flow path cover 18 has a convex member 29, and the oxygen flow path cover 18
The surface has an uneven structure so that deposits deposited on the surface of the oxygen flow path cover 18 during vapor deposition do not fall. Further, the oxygen channel cover 18 has a second refrigerant channel 30.

The second refrigerant flow path 30 has a refrigerant supply pipe 31 and a refrigerant discharge pipe 32, and is connected to the first refrigerant flow path 27 via a connection pipe 33. In addition, the second refrigerant flow path 3
0 is an oxygen flow path forming unit in which a refrigerant supplied from an external cooling device (not shown) circulates through the first refrigerant flow path 27 and the second refrigerant flow path 30 via the connection pipe 33. 17 and the oxygen channel cover 18 can be cooled to a desired temperature. Further, in the first oxygen gas introducing section 16, the gas blowout section 21 includes a first blowout port forming plate 34, a second blowout port forming plate 35, as shown in FIGS.
A plurality of connecting pins 36 for connecting the first outlet forming plate 34 and the second outlet forming plate 35, and the first outlet forming plate 34 and the second outlet forming plate 35 are separated by a predetermined distance. And a spacer 37 disposed at a portion connected by the connection pin 36 to keep the distance. When the first outlet forming plate 34 and the second outlet forming plate 35 are abutted at a predetermined interval, the first oxygen gas inlet 1
6, a slit-shaped gas outlet 20 extending in the longitudinal direction is formed.

The gas outlet 20 has substantially the same size as the width of the nonmagnetic support 2 so that oxygen gas can be uniformly blown over the width of the nonmagnetic support 2. Gas outlet 21
Has a width and a length substantially the same as those of the front surface formed by combining the above-described oxygen flow path forming section 17 and the oxygen flow path lid section 18. For this reason, the gas blowing section 21 is attached to the oxygen flow path forming section 17 and the oxygen flow path cover 18 without any gap.

As shown in FIG. 5, the first air outlet forming plate 34 and the second air outlet forming plate 35 are formed with inclined surfaces 38 and 39 formed at predetermined angles, respectively. ing. For this reason, the gas outlet 20 is formed at a predetermined angle with respect to the front surface of the first oxygen gas inlet 16.

More specifically, the first outlet forming plate 34
The second outlet forming plate 35 is made of, for example, stainless steel, and is formed by cutting a substantially rectangular parallelepiped stainless steel. This cutting is performed at a predetermined angle parallel to the longitudinal direction of the stainless steel. As a result, inclined surfaces 38 and 39 are formed on the first outlet forming plate 34 and the second outlet forming plate 35, respectively.

The inclined surfaces 38 and 39 formed on the first outlet forming plate 34 and the second outlet forming plate 35, respectively.
A first outlet forming plate 34 and a second outlet forming plate 35
Are parallel to each other in a state where they are exactly butted against each other. Thereby, the interval between the gas outlets 20 formed by abutting the inclined surfaces 38 and 39 can be made uniform in the width direction of the gas outlets 20.

The gas outlet 21 has a gas outlet 2
In order to set the interval of 0 to a predetermined value, the first outlet forming plate 3
A spacer 37 is disposed between the fourth and the second outlet forming plate 35. The spacer 37 is connected to the first outlet port forming plate 34 and the second outlet port forming plate 35 by a connecting pin 36.
And has a predetermined thickness. The spacer 37 is inserted between the inclined surface 38 and the inclined surface 39 to partially shield the inside of the gas outlet 20, and to prevent the introduction of oxygen gas from becoming uneven, The structure is such that the width gradually narrows in both opening directions of the outlet 20. Further, the gas blowing unit 21 has a plurality of connection pins 36 for fixing the first outlet forming plate 34 and the second outlet forming plate 35. The connection pins 36 are press-fitted into holes 40 formed in the first blowout port forming plate 34 and the second blowout port forming plate 35, so that the first blowout port forming plate 34 and the second blowout port The forming plate 35 is fixed.

The hole 40 into which the connection pin 36 is press-fitted
Are formed in a state where the air outlet forming plate 34 and the second air outlet forming plate 35 are accurately assembled. At this time, the hole 40 into which the connection pin 36 is pressed is formed with a diameter slightly smaller than the diameter of the connection pin 36. For this reason, the connection pin 36 is press-fitted into the hole 40, and the first outlet forming plate 34 and the second outlet forming plate 35 are securely fixed.

The gas blowing section 21 configured as described above
Is mounted without a gap by a plurality of blow-off section mounting bolts 41 so as to be sandwiched between the oxygen flow path forming section 17 and the oxygen flow path cover section 18. The plurality of outlet mounting bolts 41 are connected to the oxygen flow path cover 18 and the oxygen flow path forming section 17.
Each is tightened from the side. Therefore, the oxygen flow path forming section 1
7. The oxygen passage lid 18 and the gas outlet 21 are threaded at their corresponding positions to tighten the outlet mounting bolts 41. In other words, in the first oxygen gas introducing section 16, the gas blowing section 21 is detachable from the introduction pipe main body by the plurality of blowing section mounting bolts 41.

The vacuum vapor deposition apparatus 1 having the above-described structure is used to deposit the metal vapor on the non-magnetic support 2 in the final stage of vapor deposition, which is around the gas outlet 20 and contains an excessive amount of metal oxide. 13 is regulated by being attached to the eave-shaped regulating protrusion 22 provided in the first oxygen gas introducing portion 16, and a non-uniform magnetic layer having an excessive amount of metal oxide on the surface is formed. Is preventing that.

Next, as a second embodiment, a vacuum deposition apparatus 50 shown in FIGS. 8 and 9 has the same basic structure as the vacuum deposition apparatus 1 shown in FIG. It is characterized in that it includes the part 51. Therefore, the same components as those of the vacuum vapor deposition apparatus 1 previously shown in FIG.

The vacuum deposition apparatus 50 includes a vacuum tank 3, a supply roll 4, a take-up roll 5, a cooling roll 6, rotating rolls 8 and 9, and a second oxygen gas introducing section 51. An evaporation source 10 filled in a crucible 9 is heated by an electron beam 12 irradiated from an electron gun 11 to be a metal vapor 13, and the metal vapor 13 is evaporated on the non-magnetic support 2 in a range of an evaporation region 14. It is.

As shown in FIGS. 8 to 12, the second oxygen gas introducing section 51 of the vacuum deposition apparatus 50 is provided at an arbitrary position on the non-magnetic support 2 running on the cooling roll 6 so as to cover the deposition region 14. Assuming that one end of the vapor deposition region 14 where the vapor deposition is started in close proximity to the vapor deposition start point and the other end of the arbitrary portion traveling on the cooling roll and leaving the vapor deposition region 14 is the vapor deposition end point, the vapor deposition end point is closer to the vapor deposition end point. In addition, it is installed in the support bracket 52 and disposed.

The support bracket 52 is rotatable like a pendulum along a guide plate 53 with a bracket support shaft 52a supported on the vacuum chamber 3 as a fulcrum. The support bracket 52 is tightened with the fixing screw 54,
It can be fixed at any position within the range permitted by the guide plate 53, and by adjusting the position corresponding to the vapor deposition region 14 on the cooling roll 6, gas injection into the metal vapor 13 can be adjusted. Further, the support bracket 52 is provided in a high-temperature region close to the electron beam 12 emitted from the electron gun 11. Therefore, the support bracket 52
Is formed with a coolant channel 55. This refrigerant channel 5
The flow of the refrigerant in 5 is regulated by reinforcing ribs 56.

The refrigerant flow path 55 is connected to a refrigerant supply pipe 57 and a refrigerant discharge pipe 58 for an external refrigerant supply device (not shown).
Are connected via Second oxygen gas introduction unit 51
Is cooled to a desired temperature by the refrigerant circulating in the refrigerant channel 55.

In the vacuum evaporation apparatus 50 having the above-described configuration, the second oxygen gas introduction section 51 includes an oxygen gas supply pipe 59 to which oxygen gas is supplied, and an oxygen gas supply pipe 59.
Are connected, an oxygen flow path forming portion 61 having an oxygen flow path 60 serving as a flow path of the oxygen gas supplied from the oxygen gas supply pipe 59, and an oxygen flow path 60 on the oxygen flow path forming section 61 are formed. The outlet / flow path cover 6 that is fixed to the cut surface and constitutes the second oxygen gas introduction section 51 together with the oxygen flow path forming section 61
2, the oxygen flow path forming portion 61 and the outlet / flow path lid 62
And a copper packing 63 disposed between them.

Further, the second oxygen gas introducing portion 51 is connected to the oxygen flow channel 60 on the oxygen flow channel forming portion 61 so that the second oxygen gas introducing portion 51 can be stably fixed to the guide plate 53 by the fixing screw 54.
A fixing plate 64 is provided on the surface opposite to the surface on which the is formed.
The second oxygen gas introduction part 51 has a substantially rectangular parallelepiped overall shape, and has a gas outlet 65 in the longitudinal direction. The gas outlet 65 has substantially the same size as the width of the non-magnetic support 2 to be vapor-deposited, so that oxygen gas can be uniformly blown to the width of the non-magnetic support 2.

The second oxygen gas introducing section 51 is formed by fixing the oxygen flow path forming section 61 and the outlet / flow path lid 62 with a plurality of fixing bolts 66 via a copper packing 63. I have. In the second oxygen gas introducing section 51, the oxygen flow path forming section 61 has an oxygen flow path 60 formed as a narrow groove on the surface where the oxygen flow path forming section 61 and the outlet / flow path lid 62 are fixed. Prepare. The oxygen flow path forming section 61 has an oxygen flow path 60 formed therein. Therefore, the oxygen flow path 60 is formed as a highly airtight flow path by attaching the copper packing 63 to the oxygen flow path forming portion 61.

The oxygen flow path 60 is formed as a narrow groove reaching the gas outlet 65 through a plurality of branch points. That is, one end of the narrow groove serving as the oxygen flow path 60 is connected to an end on the side of the oxygen gas supply pipe 59 for supplying oxygen gas from the outside, and the other end is formed in the longitudinal direction of the first oxygen gas introduction section 16. It is branched and extended in two directions along the direction. Oxygen channel 60
The other end which is branched and extended in two directions is bent at 90 degrees on the way, respectively, and is again branched and extended in two directions along the longitudinal direction of the introduction pipe main body from the bent portion. The oxygen flow path 60 branched and extended in two directions repeats branching and extension further, and is finally divided into 16 narrow tubes, which are also connected to the oxygen reservoir in the oxygen flow path forming part 61.

The oxygen reservoir 67 is formed by fixing and assembling the oxygen flow path forming section 61 and the outlet / flow path lid 62, and extends in the longitudinal direction of the second oxygen gas introducing section 51. It is formed as a part. That is, the above-described 16 oxygen flow paths 60 are electrically connected to the oxygen reservoir 67 so as to extend in the longitudinal direction of the second oxygen gas introducing portion 51 at equal intervals. When the oxygen flow channel 60 is supplied with oxygen gas from the oxygen gas supply pipe 59, the oxygen gas is supplied from each branch point to each of the oxygen flow channels extending in two directions at an equal pressure. The oxygen gas here is supplied to 16 oxygen channels 6
The oxygen is supplied to the oxygen reservoir 67 at a uniform pressure from zero. The oxygen reservoir 67 is connected to the gas outlet 65. That is, the oxygen gas supplied into the oxygen reservoir 67 is pushed in the direction of the gas outlet 65 and is blown out from the gas outlet 65. At this time, as described above, the oxygen gas is supplied to the oxygen reservoir 67 from the oxygen flow channel 60 branched into 16 at a uniform pressure. As a result, oxygen gas is blown out from the gas outlet 65 at a uniform pressure in the longitudinal direction.

In the second oxygen gas introducing section 51, the same outlet port / flow path cover 62 as the gas outlet section 21 used in the first embodiment can be used. The first embodiment and the second embodiment differ from each other only in the mounting direction, and a detailed description of the configuration of the outlet / flow path lid 62 will be omitted.

The vacuum deposition apparatus 50 constructed as described above
The one end of the vapor deposition region 14 where an arbitrary portion on the non-magnetic support 2 running on the cooling roll 6 approaches the vapor deposition region 14 to start vapor deposition is set as a vapor deposition start point, and the arbitrary portion is located on the cooling roll. , And the other end that deviates from the vapor deposition region 14 is the vapor deposition end point, oxygen gas can be blown from the vapor deposition start point side as well. Therefore, the oxygen gas can be sufficiently dispersed also in the metal vapor 13 forming the inside of the magnetic layer deposited in the initial stage of the vapor deposition, and the metal oxide on the surface of the magnetic layer and the metal oxide on the inside of the magnetic layer can be dispersed. It is possible to make the ratio constant.

The vacuum deposition apparatus to which the present invention is applied is not limited to the use in the first embodiment and the second embodiment, but may be, for example, on a disc-shaped non-magnetic support. It is also effective when depositing a metal thin film.

In the first and second embodiments, the ferromagnetic metal material that can be used as the evaporation source 10 is a metal such as Fe, Co, Ni, or Co—N.
i-based alloy, Co-Pt-based alloy, Co-Pt-Ni-based alloy, Fe-Co-based alloy, Fe-Ni-based alloy, Fe-Co
-Ni-based alloy, Fe-Ni-B-based alloy, Fe-Co-B
Alloys, Fe-Co-Ni-B alloys and Co-Cr alloys.

Examples of the nonmagnetic support 2 include polyesters such as polyethylene terephthalate, polyolefins such as polyethylene and polypropylene, cellulose derivatives such as cellulose triacetate, cellulose diacetate and cellulose acetate butyrate, polyvinyl chloride, and polyvinyl chloride. Vinyl resins such as vinylidene, plastics such as polycarbonate, polyimide, polyamide, and polyamideimide can be used.

Specifically, when the degree of oxidation of the magnetic layer of the magnetic recording medium manufactured by applying the vacuum evaporation apparatus according to the present invention was measured by Auger analysis, the results shown in FIGS. 13 and 14 were obtained. . The magnetic recording medium manufactured here is obtained by forming a magnetic layer on a so-called tape raw material manufactured based on the first embodiment. It was produced by cutting into a tape having a width.

13 and 14, the vertical axis indicates the relative concentration of oxidation, and the horizontal axis indicates the thickness direction of the film. In the magnetic recording medium shown in FIG. 14 manufactured using the current oxygen gas inlet tube, a peak indicating an oxide layer appears on the surface of the magnetic layer. On the other hand, in the magnetic recording medium manufactured using the oxygen gas introducing pipe according to the present invention shown in FIG. 13, no peak indicating an oxide layer was observed on the surface of the magnetic layer, and it was apparent that the surface oxide layer was reduced. It is.

[0059]

According to the vacuum deposition apparatus of the present invention, surface oxidation and internal oxidation can be controlled, and a uniform magnetic layer can be formed. Thereby, the magnetic properties such as the coercive force and the saturation magnetic flux density of the magnetic layer are improved, and the spacing loss between the recording / reproducing device and the magnetic recording medium is reduced, so that the electromagnetic conversion characteristics are improved. Further, by adjusting the amount of oxygen gas supplied to the metal vapor, it becomes possible to control magnetic properties such as coercive force and saturation magnetic flux density of the formed metal magnetic thin film.

[Brief description of the drawings]

FIG. 1 is a schematic diagram showing a configuration of a vacuum evaporation apparatus shown as a first embodiment of the present invention.

FIG. 2 is an enlarged view of a main part of the vacuum evaporation apparatus shown as the first embodiment of the present invention.

FIG. 3 is a longitudinal sectional view of a first oxygen gas introduction unit.

FIG. 4 is a plan view showing the oxygen flow path cover of the first oxygen gas introduction part with a part cut away.

FIG. 5 is a longitudinal sectional view of a gas blowing section.

FIG. 6 is a cross-sectional view taken along AA ′ of the gas blowing section.

FIG. 7 is a plan view of a gas blowing section.

FIG. 8 is a schematic diagram showing a configuration of a vacuum evaporation apparatus shown as a second embodiment of the present invention.

FIG. 9 is an enlarged view of a main part of a vacuum evaporation apparatus shown as a second embodiment of the present invention.

FIG. 10 is a longitudinal sectional view of a second oxygen gas introduction part.

FIG. 11 is a cross-sectional view showing an oxygen flow path of a second oxygen gas introduction section so as to be clarified.

FIG. 12 is a cross-sectional view showing a refrigerant flow path of a second oxygen gas introduction part so as to be clear.

FIG. 13 is an Auger analysis result diagram of a magnetic tape formed by using the vacuum evaporation apparatus shown as an embodiment of the present invention.

FIG. 14 is an Auger analysis result diagram of a magnetic tape formed by using a conventional vacuum evaporation apparatus.

[Explanation of symbols]

1 vacuum evaporation device, 2 non-magnetic support, 3 vacuum chamber, 4
Supply roll, 5 take-up roll, 6 cooling roll, 7,
Reference Signs List 8 rotating roll, 9 crucible, 10 vapor deposition source, 11 electron gun, 12 electron beam, 13 metal vapor, 14 vapor deposition area, 15 deposition prevention plate, 16 first oxygen gas introduction section, 17
Oxygen flow path forming part, 18 Oxygen flow path lid, 19 Oxygen gas supply pipe, 20 Gas outlet, 21 Gas outlet, 22
Eave-shaped regulating projection, 50 vacuum vapor deposition device, 51 second gas introduction unit, 52 support bracket, 53 guide plate, 54 fixing screw, 55 refrigerant channel, 61 oxygen channel forming unit, 62 outlet / channel lid

 ──────────────────────────────────────────────────続 き Continuing from the front page (72) Inventor Yuichi Arisaka 6-7-35 Kita-Shinagawa, Shinagawa-ku, Tokyo Inside Sony Corporation (72) Inventor Junichi Tachibana 6-35, Kita-Shinagawa, Shinagawa-ku, Tokyo Sony Corporation F term (reference) 4K029 AA11 AA25 CA02 DA00 DA06 JA10 5D112 AA05 AA22 FA02 FB05 FB20 FB24 FB25 FB28 GA02

Claims (5)

[Claims] 1. A vacuum tank, a supply roll for supplying a tape-shaped object to be deposited, a cooling roll for moving the object to be moved to an outer peripheral portion, and a winding-up device for winding up the object to be vapor-deposited A roll, an evaporation source that generates a metal vapor, a heating unit that heats the evaporation source, a shutter member that constitutes a deposition site by allowing a part of an outer peripheral portion of the cooling roll to face the evaporation source, and A gas introduction unit that is disposed near a deposition site and introduces a gas into the metal vapor, a vacuum deposition apparatus that forms a metal thin film on the surface of the deposition target that travels around the outer periphery of the cooling roll, The gas introduction unit includes an introduction pipe main body having a gas flow path formed therein, a gas supply pipe connected to the introduction pipe main body to supply gas to the gas flow path, and a deposition target for a deposition part of the cooling roll. Facing the end point of vapor deposition And an outlet having an outlet for blowing a gas to the metal vapor, the outlet being provided in the inlet pipe body, wherein the blowing restricts deposition of the metal vapor into which the gas has been blown onto the object to be deposited. A vacuum evaporating apparatus characterized in that an eave-shaped regulating projection is provided. 2. An introduction pipe main body having a gas flow path formed therein, a gas supply pipe connected to the introduction pipe main body to supply gas to the gas flow path, and an outer peripheral portion of a cooling roll of the introduction pipe main body. A second gas introduction section comprising a blowout section having a blowout port that blows a gas to the metal vapor and is provided at an opposed portion, wherein the second gas introduction section is configured such that the blowout section is a first gas introduction section. The vacuum evaporation apparatus according to claim 1, wherein the vacuum evaporation apparatus is provided at a position on the side of a vapor deposition start point of a vapor deposition portion of the cooling roll facing the cooling roll. 3. The second gas introduction unit is incorporated in a support member having the one end rotatably supported by the gas supply pipe, and the position of the outlet corresponding to the vapor deposition unit of the cooling roll is adjusted. 3. The vacuum vapor deposition apparatus according to claim 2, wherein the gas injection into said metal vapor is adjusted by adjusting the temperature. 4. The vacuum deposition apparatus according to claim 3, wherein the support has a cooling mechanism. 5. A vacuum vessel, a supply roll, a take-up roll, a cooling roll, an evaporation source for generating metal vapor, a heating means for heating the evaporation source, and a second gas for introducing gas to the metal vapor. 1 gas introduction part, and a second gas introduction pipe for introducing gas into the metal vapor, wherein the first gas introduction part travels in a fixed direction along the cooling roll and deposits the metal vapor. The vapor outlet is provided on the vapor deposition end point side of the object to be vapor-deposited so as to face the metal vapor, and the second gas introduction unit is provided with a gas passage formed therein. A pipe main body, a gas supply pipe connected to the introduction pipe main body to supply gas to the gas flow path, and a gas blown out to the metal vapor provided at a portion of the introduction pipe main body opposed to an outer peripheral portion of a cooling roll. And a blow-off section having a blow-off port. On the side of the deposition starting point of the object to be deposited, which travels in a fixed direction along the metallization and passes through the deposition region where the metal vapor is deposited, and the outlet is provided so as to face the metal vapor. Characteristic vacuum deposition equipment.