JP2001093770A - Surface mount type electronic components - Google Patents

Abstract

(57) [Summary] In a surface mount electronic component to be solder-mounted, a solder pool protruding from an outer peripheral portion is eliminated, and a mounting interval with another electronic component mounted in the same mounting substrate is narrowed, so that a mounting substrate is provided. It is an object of the present invention to provide a surface-mounted electronic component that can contribute to high-density mounting in a limited area. SOLUTION: In a multilayer ceramic capacitor 11 to be solder-mounted on a land 15 of a mounting board 14, a mounting board 1 is provided.
The flat surface 8 facing the mounting surface of the substrate 4 is recessed into a concave surface, and a pair of external electrodes 12 are formed inside the concave of the concave surface at a predetermined interval to form a pair of external electrodes 12 so as to be mounted on the same mounting substrate 14. Thus, a surface mounting type electronic component that can contribute to high-density mounting in a limited area of the mounting board 14 with a narrow mounting interval with other electronic components is obtained.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multilayer ceramic capacitor,
The present invention relates to a surface mount electronic component such as a chip resistor, a chip inductor, and a chip filter.

[0002]

2. Description of the Related Art Conventional surface mount electronic components are disclosed in
The one described in Japanese Patent No. 349667 is known.
As shown in FIGS. 10, 11 and 12, each internal electrode 3 formed inside the multilayer ceramic capacitor 30 is formed.
A pair of external electrodes are provided at one end of one of the electrodes and alternately exposed at opposite ends of the side surface 33 alternately, and electrically connected to the exposed part of the extracted electrode 32. 34 are formed. A mounting board 35 is used in which lands 36 for fixing external electrodes 34 of the multilayer ceramic capacitor 30 to a mounting board 35 with solder 37 are extended outward from the outer edge of the multilayer ceramic capacitor 30.

[0003] Further, the one described in JP-A-11-111556 is known. As shown in FIG. 13 and FIG.
Are formed inside the outer side of the side surface 33 that is in contact with the surface of the mounting board 35 and at a predetermined interval from each other.
According to this, it is not necessary to make the land 36 of the mounting board 35 wider than the multilayer ceramic capacitor 30. Therefore, the solder fillet 38 generated when the multilayer ceramic capacitor 30 is fixed to the mounting board 35 with the solder 37 does not protrude from the multilayer ceramic capacitor 30 to the side.

[0004]

However, in the prior art disclosed in Japanese Patent Application Laid-Open No. 6-349667, when the multilayer ceramic capacitor 30 is fixed to the circuit board 35 by soldering, as shown in FIG. 30 solder fillet 38 outside the outer edge
In order to protrude, it is necessary to separate both the other electronic components mounted on the same circuit board 35 and the lands 36 from the solder fillet 38, and the electronic components are placed in the circuit board 35 having a limited area. This hinders high-density mounting.

[0005] Further, in the device disclosed in Japanese Patent Application Laid-Open No. 11-111556, a multilayer ceramic capacitor 30 is disclosed.
When solder is fixed to the land 36 of the circuit board 35 and the amount of the solder 37 is large, a solder fillet 38 is formed outside the multilayer ceramic capacitor 30 and the land 36 as shown in FIG. It is not preferable because a short circuit occurs between the component and the land 36 thereof.

An object of the present invention is to solve the above-mentioned conventional problems, and an object of the present invention is to provide a surface-mount type electronic component capable of high-density mounting and preventing a short circuit with an adjacent electronic component or land. is there.

[0007]

SUMMARY OF THE INVENTION In order to achieve the above object, the present invention provides a surface mount type electronic component which is mounted by soldering and fixing to a land portion of a mounting substrate. This is a surface-mounted electronic component in which a concave surface is provided on the surface of the component body and a pair of external electrodes are provided at a predetermined distance inside the concave surface.

Accordingly, since the surface-mount type electronic component has a pair of external electrodes formed inside the concave surface, when soldered and fixed to the mounting board, the excess solder always flows inward of the concave surface. Therefore, the solder does not protrude outside the outer edge of the electronic component body. Therefore, a short circuit with another adjacent electronic component or its land is prevented, and high-density mounting can be performed on the same mounting substrate. Also, it is possible to prevent the element standing phenomenon of the surface mount electronic component due to the stress at the time of solder solidification. Further, the concave gap between the electronic component and the mounting board has an effect of reducing the stray capacitance.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The invention according to claim 1 of the present invention is directed to a surface-mount type electronic component mounted by soldering and fixing to a land portion of a mounting substrate, wherein the component facing the mounting surface of the mounting substrate is provided. A surface-mounted electronic component having a concave surface on the surface of the main body and a pair of external electrodes provided at a predetermined distance inside the concave surface, the surface-mounted electronic component being a pair of external electrodes. Is formed inside the concave surface, so if soldered and fixed to the mounting board, excess solder will always flow inward of the concave surface, so that the solder will protrude outside the outer edge of the electronic component body Is gone. Therefore, a short circuit with another adjacent electronic component or its land is prevented, and high-density mounting can be performed on the same mounting substrate. Also, it is possible to prevent the element standing phenomenon of the surface mount electronic component due to the stress at the time of solder solidification. Further, the concave gap between the electronic component and the mounting board has an effect of reducing the stray capacitance of the electronic component.

According to a second aspect of the present invention, there is provided the surface-mounted electronic component according to the first aspect, wherein each surface and the ridge of the component main body are chamfered.
Due to the frequency of collision with the chamfering medium, there is a difference in the amount of wear between the front side surface and the ridge, so that the front side surface can be reliably processed into a concave surface.

According to a third aspect of the present invention, there is provided the surface-mounted electronic component according to the first or second aspect, wherein each corner of the external electrode is curved. When soldering and fixing to the land portion of the substrate, it is possible to prevent stringing and solder pooling phenomena that are likely to occur at the corners of the external electrode when the molten solder solidifies.

According to a fourth aspect of the present invention, there is provided the surface-mounted electronic component according to any one of the first to third aspects, wherein the surface of the external electrode is plated with solder. When soldering and fixing to the land part of the mounting board,
The solder plating portion on the surface of the external electrode and the melted solder are easily compatible, and the electronic component can be securely soldered and fixed to the land portion.

According to a fifth aspect of the present invention, there is provided the surface-mounted electronic component according to the first aspect, wherein the concave surface is depressed into a square shape, and the electronic component sintered body facing the mounting substrate is specified. Machined on the side plane of, and has the effect of reducing the stray capacitance generated between the external electrodes of the electronic component by recessing it into a rectangular shape with a predetermined depth between the electronic component and the circuit board. is there.

According to a sixth aspect of the present invention, there is provided the surface-mounted electronic component according to the fifth aspect, wherein the square bottom corner is curved. When the external electrode paste is applied to the base material, the electrode paste has an effect of facilitating the application of the electrode paste to the bottom corner portion and removing bubbles which are easily taken into the corner portion.

According to a seventh aspect of the present invention, there is provided the surface-mounted electronic component according to the first aspect, wherein the concave surface is depressed in an arc shape. The side surface portion of the sintered body can be polished in an arc shape on the inner side of the sintered body by the collision of the chamfering media and can be depressed, thereby ensuring a gap between the mounting board and the opposing electronic component surface. Can be formed. The depth of the dent can be controlled by the chamfering time, and has the effect of controlling the stray capacitance generated between the electronic component and the mounting board by the depth of the dent.

The invention according to claim 8 of the present invention is the surface mount type electronic component according to claim 1, wherein the surface of the concave surface is roughened, and the concave surface of the electronic component is roughened by sandblasting or the like. The surface processing has the effect of increasing the fixing force of the external electrode formed inside and inside.

According to a ninth aspect of the present invention, there is provided the surface-mounted electronic component according to the first aspect, wherein a pair of external electrodes are provided at a predetermined distance in a longitudinal direction of the component body. This has the effect of increasing the insulation distance between the external electrodes and preventing migration of the electrode material.

According to a tenth aspect of the present invention, a plurality of internal electrodes are formed in parallel with a concave surface provided with a pair of external electrodes inside a component body, and a dielectric material is provided between the external electrodes. The surface-mounted electronic component according to claim 1, wherein the multilayer ceramic capacitor element has a dielectric material interposed therebetween, wherein the dielectric material is interposed between the external electrode and the internal electrode. A low-capacitance capacitor is formed which is proportional to the dielectric constant and its overlapping area. Since this capacitor can be formed without electrically connecting the external electrode and the internal electrode of the electronic component, it has an effect that the series equivalent resistance of the electronic component in a high-frequency range can be further reduced.

According to an eleventh aspect of the present invention, there is provided a surface-mounted electronic component according to the capacitance 10, wherein the capacitance is adjusted by adjusting the depth of a concave portion provided with a pair of external electrodes. ,
The side plane of the electronic component is recessed into a concave surface by machining or chamfering, and the depth of the dielectric material interposed between the external electrode and the internal electrode is controlled at this depth, which occurs between a pair of external electrodes and the internal electrode This has the effect that the capacitance can be easily adjusted.

According to a twelfth aspect of the present invention, there is provided the surface-mounted electronic component according to the tenth aspect, wherein a part of the pair of external electrodes is removed to adjust the capacitance. By removing a part of the surface with a laser or the like and adjusting the overlapping area with the internal electrode, it is possible to easily adjust the capacitance generated between the external electrode and the internal electrode to a desired value. Have

According to a thirteenth aspect of the present invention, the distance between the pair of external electrodes is made larger than the thickness of the dielectric material interposed between the external electrodes and the internal electrodes. This is a component, whereby the dielectric breakdown and the leak phenomenon when a high voltage is applied between the external electrodes occur in the dielectric material between the external electrode and the internal electrode having a short insulation distance. Therefore, it has the function of preventing the breakdown voltage and the leak generation voltage between the external electrodes from being lowered.

According to a fourteenth aspect of the present invention, a plurality of internal electrodes having a plurality of dielectric layers interposed perpendicularly to a concave surface provided with a pair of external electrodes are formed inside a component body. 2. The surface-mounted electronic component according to claim 1, wherein a lead-out electrode exposed on the concave surface of the component is provided at an end of the internal electrode, and the multilayer ceramic capacitor element is further connected to the lead-out electrode and an external electrode. By processing the side plane facing the component mounting board into a concave surface, the ends of each of the lead terminal electrodes of the plurality of internal electrodes formed inside are reliably exposed to the concave surface, and between the internal electrodes. With the interposed dielectric layer, it is possible to obtain a high-capacity multilayer ceramic capacitor, and it is possible to reliably and electrically connect the extraction terminal electrode and the external electrode.

According to a fifteenth aspect of the present invention, there is provided the surface-mounted electronic component according to the fourteenth aspect, wherein the distance between the pair of external electrodes is larger than the thickness of the dielectric layer interposed between the internal electrodes. As a result, the dielectric breakdown when a high voltage is applied between the external electrodes occurs in the dielectric layer between the internal electrodes, which has a short insulation distance, and the dielectric breakdown voltage between the external electrodes can be prevented from lowering. Have

In the invention according to claim 16 of the present invention, the other surface opposite to the concave surface on which the pair of external electrodes is provided is depressed to form a pair of external electrodes inside the concave surface. The surface-mounted electronic component according to claim 1, wherein the pair of external electrodes are formed on the concave surfaces of the opposing side planes, respectively. Since there is no need to make a selection, there is an effect that the mounting becomes easy.

According to a seventeenth aspect of the present invention, the concave surface between the pair of external electrodes on the surface of the component body is covered with a material having an insulation resistivity higher than the surface insulation resistivity of the component body. Wherein the surface insulation resistance between the external electrodes facing each other can be increased, and an effect that migration between the external electrodes can be prevented can be prevented. .

The invention according to claim 18 of the present invention is the surface mount electronic component according to claim 1, wherein the concave surface between the pair of external electrodes on the surface of the component body is covered with a high resistivity material. With this, it is possible to easily carry out the suction movement when mounting the electronic component on the circuit board, and it is possible to reliably mount the electronic component at a predetermined position, and to reduce the number of assembly steps. is there.

According to a nineteenth aspect of the present invention, there is provided the surface mounting device according to the first aspect, wherein the width dimension of the surface on which the pair of external electrodes of the component body are provided is different from the thickness dimension of the opposite surface. This is a type electronic component, which facilitates identification of a position where an external electrode is to be formed with respect to the electronic component, has an effect that it can be correctly formed at a predetermined position, and can reduce the number of manufacturing steps.

According to a twentieth aspect of the present invention, there is provided the surface-mounted electronic component according to the first aspect, wherein a width dimension of the component body is a flat type larger than a thickness dimension. The thickness direction is easily identified, and the concave surface on which the external electrodes of the component body are formed can be securely mounted on the mounting surface of the mounting board.

(Embodiment 1) Hereinafter, a surface mount electronic component according to an embodiment of the present invention will be described with reference to the drawings, taking a multilayer ceramic capacitor as an example.

FIG. 1 is a development view of the green chip 6 of the multilayer ceramic capacitor 11, FIG. 2 is a perspective view of the green chip 6, and FIG.
4 is a perspective view of the multilayer ceramic capacitor 11, FIG. 5 is a cross-sectional view of the multilayer ceramic capacitor 11, and FIG. 6 is a cross-sectional view showing a state where the multilayer ceramic capacitor 11 is mounted on a mounting board 14. It is.

In the figure, 1 is a ceramic green sheet, 2 is an upper dielectric layer, 3 is a lower dielectric layer, 4 is an intermediate dielectric layer, 5 is an internal electrode, 8 is a plane, 9 is a side surface, 10 is an end surface, 12 is an external electrode, 13 is an insulating material having a high insulation resistance such as acrylic resin, 14 is a mounting board, 15 is a land, 1
Reference numeral 6 denotes solder, and reference numeral 17 denotes a gap.

First, using a known doctor blade method,
A ceramic green sheet 1 made of a ceramic dielectric is manufactured using a ceramic dielectric material having a dielectric constant of 1000.

Next, an upper dielectric layer 2, a lower dielectric layer 3, and an intermediate dielectric layer 4 are produced by laminating a plurality of the produced ceramic green sheets 1.

Next, the ceramic green sheet 1 is laminated on the surface of the lower dielectric layer 3, the first internal electrode 5 is printed on the surface, the intermediate dielectric layer 4 is laminated thereon, and then the The ceramic green sheet 1 is laminated on the second layer, the second layer internal electrode 5 similar to the first layer internal electrode 5 is printed, and finally the upper dielectric layer 2 is laminated by pressure and laminated. (Not shown).

Thereafter, the laminated green block is cut into a predetermined shape to produce a green chip 6 shown in FIG. The size of the cut green chip 6 after sintering is 1.6 × width.
The thickness was adjusted to be 1.0 × 3.2 mm in length.

Next, the green chip 6 is fired at a predetermined temperature to produce a sintered body (not shown).

Next, the sintered body was converted into an alumina ball (φ
2), chamfering was performed together with the ceramic powder and water by a barrel polishing machine to produce a sintered body 7 chamfered as shown in FIG. Since the flat surface 8 has a larger surface area than the side surface 9 and the end surface 10, the surface is polished more than the side surface 9 and the end surface 10 by barrel polishing media, and has a concave shape in an arc. Subsequently, after the chamfered sintered body 7 was dried, the surface of the flat surface 8 was further roughened by sandblasting.

Thereafter, as shown in FIG. 4, a gap wider than the thickness of the upper dielectric layer 2 and the lower dielectric layer 3 is formed on the inner side of the flat surface 8 of the sintered body 7 which is concave in an arc shape. And a pair of external electrodes 1 are applied and baked to form a pair of external electrodes 1.
After forming No. 2, the surface was further subjected to solder plating. Instead of barrel polishing, a method in which the plane 8 is depressed into an arc shape or a square shape by machining may be used.

Next, the resistivity between the external electrodes 12 is higher than that of the multilayer ceramic capacitor 11 body, and the volume resistivity is 4 ×.
An insulating material 13 made of an acrylic resin having a thickness of 10 ¹⁴ Ωcm is applied and dried, and a flat shape having a width of 1.6 × a thickness of 1.0 × 3.2 mm in a length is formed so that the space between the external electrodes 12 is flat.
A 5 pF multilayer ceramic capacitor 11 was completed.
In addition, as shown in FIG. 4, each of the corners of the external electrode 12 was curved outwardly because the multilayer ceramic capacitor 11 was soldered and mounted on the land 15 of the mounting board 14. This is to prevent stringing or pooling of the solder 16 which is likely to occur at the corners. The reason why the surface of the external electrode 12 is plated with solder is that the external electrode 12 and the solder 16
This is to improve the compatibility with the user.

The reason why the surface of the flat surface 8 is roughened is to further increase the fixing force between the external electrode 12 and the sintered body 7. Further, forming the insulating material 13 film made of an acrylic resin between the external electrodes 12 increases the surface insulation resistance of the multilayer ceramic capacitor 11 to prevent the occurrence of migration between the external electrodes 12 and to reduce the occurrence of migration between the external electrodes 12. This is for facilitating suction and movement when the capacitor 11 is mounted on the mounting board 14 and for reliably mounting the multilayer ceramic capacitor 11 at a predetermined position. The high resistivity material is not limited to acrylic resin.

The capacitance of the multilayer ceramic capacitor 11 is generated in accordance with the overlapping area of the internal electrode 5 and the external electrode 12 with the upper dielectric layer 2 or the lower dielectric layer 3 interposed therebetween. By removing a part with a laser or the like and adjusting the overlapping area with the internal electrode 5, the capacitance can be easily adjusted to a desired value. Further, the thickness of the upper dielectric layer 2 and the lower dielectric layer 3 interposed between the external electrode 12 and the internal electrode 5, that is, the depth of the depression of the plane 8 can be easily changed by controlling the chamfering time. In the method of adjusting the time, the capacitance can be easily adjusted to a desired value. Further, since the interval between the external electrodes 12 is made larger than the thicknesses of the upper dielectric layer 2 and the lower dielectric layer 3, when a high voltage is applied between the external electrodes 12, the dielectric breakdown and the leakage phenomenon may occur with the external electrodes 12. It occurs between the internal electrodes 5 and does not cause dielectric breakdown between the external electrodes 12.

When this multilayer ceramic capacitor 11 is placed on a land 15 of a mounting substrate 14 with a solder paste applied thereon as shown in FIG. 6, and the mounting substrate 14 is heated to 240 ° C., the solder 16 is melted and formed into an arc shape. In the direction of the space 17 created between the recessed plane 8 and the mounting substrate 14, the external electrode 12
Flows along. Therefore, the surplus solder 16 does not protrude to the outer peripheral portion of the multilayer ceramic capacitor 11. Accordingly, a short circuit between another electronic component mounted adjacent to the same mounting substrate 14 and the land 15 is prevented, and high-density mounting is enabled. In addition, the multilayer ceramic capacitor 11 can prevent an element standing phenomenon caused by stress at the time of solidification of the solder 16. Further, the entire stray capacitance can be reduced by the recessed space 17 generated between the multilayer ceramic capacitor 11 and the mounting board 14. Further, the multilayer ceramic capacitor 11 has the external electrodes 12 formed inside and inside the opposing main planes 8, and furthermore, the insulating material 13 is applied between the external electrodes 12 so as to be flat and flat. Since the direction can be easily identified, and the adsorption and movement of the multilayer ceramic capacitor 11 can be facilitated, and the main plane 8 on which the external electrodes 12 are formed can be reliably and efficiently mounted on the mounting substrate 14, so that the number of mounting steps is reduced. Becomes possible.

(Embodiment 2) Hereinafter, a surface mount electronic component according to Embodiment 2 of the present invention will be described with reference to the drawings, taking a multilayer ceramic capacitor as an example.

FIG. 7 is a development view of a green chip of the multilayer ceramic capacitor 26 of the second embodiment, FIG. 8 is a perspective view of a sintered body 23 of the multilayer ceramic capacitor 26 provided with a rectangular recess, and FIG. Multilayer ceramic capacitor 26
1 is a cross-sectional view showing a state where is mounted on a mounting board 14.

In the drawing, 18 is an effective layer, 19 and 20 are ineffective layers, 21 is an internal electrode, 22 is a lead terminal electrode, 2
Numeral 4 indicates a square depression provided on the main plane, and numeral 25 indicates a corner of the square depression 24.

First, the ceramic green sheet 1 manufactured in the first embodiment is used, and a plurality of the green sheets are laminated to form an ineffective layer 1.
9 and 20 are prepared.

Next, as shown in FIG. 7, the effective layer 18 is laminated on the surface of the invalid layer 20, and the internal electrode 21 having the first-layer lead terminal electrode 22 is printed on that surface. The layer 18 is laminated, and printing of the second-layer internal electrode 21 that is paired with the first-layer internal electrode 21 is performed. After repeating the above operation 17 times alternately in this manner, finally, the invalid layer 19 is overlaid and pressure-laminated to produce a laminated green block (not shown).

Next, the green block is cut into a predetermined shape to produce a green chip (not shown).
The size of the cut green chip after sintering is 1.6 x width.
Ends of the lead terminal electrodes 22 are alternately exposed on both sides of both sides perpendicular to the laminating direction of the internal electrodes 21 so as to have a thickness of 1.0 × 3.2 mm in length, with the effective layer 18 interposed therebetween. It has a structure.

Thereafter, the green chip is fired at a predetermined temperature to produce a sintered body (not shown).

Next, on the side surface of the sintered body where the end of the extraction terminal electrode 22 is exposed, as shown in FIG. The end of the electrode 22 was completely exposed. Note that the end of the lead terminal electrode 22 may be exposed by barrel polishing in the same manner as in the first embodiment instead of machining. Subsequently, the surface of the rectangular recess 24 was roughened by sandblasting so that the bonding strength of the external electrode 12 formed in a subsequent step was increased.

Next, a pair of external electrodes 12 is formed by applying and baking an electrode paste on the corner portions 25 where the ends of the lead terminal electrodes 22 of the rectangular recesses 24 are exposed, and then a surface is further soldered. A plating process was performed. Next, the resistivity between the external electrodes 12 is higher than that of the body of the multilayer ceramic capacitor 26, and the volume resistivity is 4 × 10 ¹⁴ Ωcm.
Is applied and dried to make the space between the external electrodes 12 flat so as to have a width of 1.6 ×
A flat multilayer ceramic capacitor 26 having a thickness of 1.0 × a length of 3.2 mm and a capacitance of 10 nF was completed.

In the obtained multilayer ceramic capacitor 26, since the external electrode 12 is formed at the corner 25 of the rectangular recess 24, the formed external electrode 12 and the sintered body 23 are formed.
No air bubbles are present at the joints. Further, since the lead terminal electrode 22 is completely exposed at the corner of the rectangular recess 24 and is connected to the external electrode 12, the internal electrode 21
There is no problem in electrical connection between the electrode and the external electrode 12.

This multilayer ceramic capacitor 26 is shown in FIG.
As shown in FIG. 5, solder 16 paste is applied on the land 15 of the mounting board 14 in the same manner as in the first embodiment so that the internal electrodes 21 are perpendicular to the mounting surface of the mounting board 14, and the temperature is set to 240 ° C. When the mounting substrate is heated, the solder 16 is melted and flows along the external electrode 12 in the direction of the space 17 created between the rectangular recess 24 and the mounting substrate 14. Therefore, the surplus solder 16 does not protrude to the outer peripheral portion of the multilayer ceramic capacitor 26. Therefore, a short circuit between another electronic component mounted adjacent to the same substrate and the land 15 is prevented, and high-density mounting is enabled. In addition, the multilayer ceramic capacitor 26 can prevent an element standing phenomenon due to stress at the time of solidification of the solder 16. Further, the entire stray capacitance can be reduced by the rectangular recess 24 generated between the multilayer ceramic capacitor 26 and the mounting substrate 14. In the second embodiment, 10 nF is manufactured by laminating 17 layers of the internal electrodes 21, but the number of layers and the capacitance are not limited.

[0054]

As described above, according to the present invention, in a surface mount type electronic component mounted by soldering and fixing to a land portion of a mounting substrate, a concave surface is formed on a surface of the component body opposite to a mounting surface of the mounting substrate. And a pair of external electrodes provided with a pair of external electrodes at a predetermined distance inside the concave surface. The external electrodes extend along the inside of the recess formed in the plane of the electronic component. When soldering and fixing to the mounting board, the excess solder always flows inward along the external electrodes, so that the solder does not protrude around the outer periphery of the electronic component. In addition, it is possible to prevent a short circuit between other electronic components to be mounted and their lands, thereby enabling high-density mounting, and also prevent an element standing phenomenon due to stress at the time of solidification of solder. In addition, the space between the electronic component plane and the mounting substrate reduces the stray capacitance of the electronic component, and particularly, the reliability is high as a low-capacity multilayer ceramic capacitor in a high frequency band.

[Brief description of the drawings]

FIG. 1 is a development view of a green chip of a multilayer ceramic capacitor according to an embodiment of the present invention.

FIG. 2 is a perspective view of the green chip.

FIG. 3 is a perspective view of a sintered body of the multilayer ceramic capacitor in which the same plane is chamfered to form an arc-shaped depression.

FIG. 4 is a perspective view of the multilayer ceramic capacitor.

FIG. 5 is a sectional view of the multilayer ceramic capacitor.

FIG. 6 is a sectional view showing a state in which the multilayer ceramic capacitor is mounted on a circuit board.

FIG. 7 is a development view of a green chip of the multilayer ceramic capacitor according to the second embodiment.

FIG. 8 is a perspective view of a sintered body of a multilayer ceramic capacitor in which a rectangular recess is formed on the same plane.

FIG. 9 is a sectional view showing a state in which the multilayer ceramic capacitor is mounted on a circuit board.

FIG. 10 is a development view of a green chip of a conventional multilayer ceramic capacitor.

FIG. 11 is a perspective view of the multilayer ceramic capacitor.

FIG. 12 is a sectional view showing a state where the multilayer ceramic capacitor is mounted on a circuit board.

FIG. 13 is a perspective view of another conventional multilayer ceramic capacitor.

FIG. 14 is a sectional view showing a state in which another conventional multilayer ceramic capacitor is mounted on a circuit board.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 ceramic green sheet 2 upper dielectric layer 3 lower dielectric layer 4 intermediate dielectric layer 5, 21 internal electrode 6 green chip 7 chamfered sintered body 8 plane 9 side face 10 end face 11, 26 multilayer ceramic capacitor 12 external electrode DESCRIPTION OF SYMBOLS 13 Insulating material 14 Mounting board 15 Land 16 Solder 17 Space 18 Effective layer 19 Invalid layer 20 Invalid layer 22 Leader terminal electrode 23 Sintered body subjected to square processing 24 Square dent 25 Corner of square dent

Continued on front page F-term (reference)

Claims (20)

[Claims] In a surface mount type electronic component mounted by soldering and fixing to a land portion of a mounting substrate, a concave surface is provided on a surface of a component body opposite to a mounting surface of the mounting substrate, and the concave surface of the concave surface is provided. A surface-mounted electronic component provided with a pair of external electrodes at a predetermined distance inside and inside. 2. The surface-mounted electronic component according to claim 1, wherein each surface and the ridge of the component body are chamfered. 3. The surface-mounted electronic component according to claim 1, wherein each corner of the external electrode is curved. 4. The electronic component according to claim 1, wherein the surface of the external electrode is plated with solder. 5. The surface-mounted electronic component according to claim 1, wherein the concave surface is depressed into a square shape. 6. The surface-mounted electronic component according to claim 5, wherein the square bottom corner is curved. 7. The surface-mounted electronic component according to claim 1, wherein the concave surface is depressed in an arc shape. 8. The surface-mounted electronic component according to claim 1, wherein the surface of the concave surface is roughened. 9. The surface-mounted electronic component according to claim 1, wherein a pair of external electrodes is provided at a predetermined distance in a longitudinal direction of the component body. 10. A multilayer ceramic capacitor element in which a plurality of internal electrodes are formed in parallel with a concave surface provided with a pair of external electrodes inside a component body, and a dielectric material is interposed between the external electrodes and the internal electrodes. The surface-mounted electronic component according to claim 1. 11. The surface-mounted electronic component according to claim 10, wherein the capacitance is adjusted by adjusting the depth of the concave surface provided with the pair of external electrodes. 12. The surface-mounted electronic component according to claim 10, wherein a part of the pair of external electrodes is removed to adjust the capacitance. 13. The surface-mounted electronic component according to claim 10, wherein a distance between the pair of external electrodes is larger than a thickness of a dielectric material interposed between the external electrodes and the internal electrodes. 14. A component main body is formed with a plurality of internal electrodes having a plurality of dielectric layers interposed perpendicularly to a concave surface provided with a pair of external electrodes therein, and the end of the internal electrode is provided with a plurality of internal electrodes. The surface-mounted electronic component according to claim 1, wherein a lead-out electrode exposed on the concave surface is provided, and the lead-out electrode and an external electrode are connected to form a multilayer ceramic capacitor element. 15. The surface mount electronic component according to claim 14, wherein a distance between the pair of external electrodes is larger than a thickness of a dielectric layer interposed between the internal electrodes. 16. The surface-mounted electronic device according to claim 1, wherein the other surface opposite to the concave surface on which the pair of external electrodes is provided is concavely concave to provide a pair of external electrodes inside the concave surface. parts. 17. The surface mount electronic component according to claim 1, wherein the concave surface between the pair of external electrodes on the surface of the component main body is covered with a material having an insulation resistivity higher than the surface insulation resistivity of the component main body. 18. The surface mount electronic component according to claim 1, wherein the concave surface between the pair of external electrodes on the surface of the component body is covered with a high resistivity material. 19. The surface mount electronic component according to claim 1, wherein a width dimension of a surface of the component body on which the pair of external electrodes is provided is different from a thickness dimension of a surface facing the pair of external electrodes. 20. The surface mount electronic component according to claim 1, wherein the width of the component body is a flat type larger than the thickness dimension.