JP2001053488A - Electromagnetic wave shielding material and electromagnetic wave shielding structure and display using it - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the connection of an electromagnetic wave shielding material with an external electrode for grounding by laminating or burying a geometrically patterned conductive layer upon or in a plastic substrate and electrically connecting the conductive layer with a conductive frame section. SOLUTION: A geometric pattern 2 drawn by using a conductive metal is formed on a plastic film 3 through an adhesive layer or thin metallic film 4 and a conductive frame section 1 is formed of the conductive metal of a plastic film provided with the conductive film on the outer periphery of the pattern 2. In addition, a transparent layer 5 is laminated on the frame section 1 through an adhesive layer or thin metallic film in such a way that the whole surface of the frame section 1 is not covered, but the frame section 1 is exposed. Alternatively, the frame section 1 is exposed on the plastic film 3 side by bending the frame section 1 on the film 3 side. More alternatively, the geometric pattern 2 drawn by using the conductive metal is formed on the plastic film 3 through the adhesive layer or thin metallic film 4 and the frame section 1 is formed of a conductive material 6, such as the conductive adhesive, etc., on the outer periphery of the pattern 2.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electromagnetic wave shielding material having a shielding property for electromagnetic waves generated from the front surface of a display such as a CRT, PDP (plasma), liquid crystal, EL, etc., and an electromagnetic wave shielding structure and display using this film.

[0002]

2. Description of the Related Art With the recent increase in the use of various electrical and electronic equipment, electromagnetic noise interference (Electrical
o Magnetic Interference (EMI) is also on the rise. Noise can be roughly divided into conducted noise and radiated noise. As a measure against conduction noise, there is a method using a noise filter or the like. On the other hand, as a measure against radiation noise, it is necessary to electromagnetically insulate the space,
Methods such as making the housing a metal body or a highly conductive body, inserting a metal plate between circuit boards, and winding a cable with metal foil have been adopted. With these methods, an electromagnetic wave shielding effect of a circuit or a power supply block can be expected, but it is not suitable for shielding electromagnetic waves generated from the front of a display such as a CRT or PDP because it is opaque.

As a method for achieving both the electromagnetic wave shielding property and the transparency, a method of forming a thin film conductive layer by depositing a metal or metal oxide on a transparent substrate (Japanese Patent Laid-Open No. 27880/1990).
No. 0, JP-A-5-323101). On the other hand, an electromagnetic wave shielding material in which a good conductive fiber is embedded in a transparent substrate (JP-A-5-327274,
JP-A-5-269912) or an electromagnetic wave shielding material in which a conductive resin containing metal powder or the like is directly printed on a transparent substrate (JP-A-62-57297, JP-A-2-5-5).
An electromagnetic wave shielding material in which a transparent resin layer is formed on a transparent substrate such as polycarbonate having a thickness of about 2 mm and a copper mesh pattern is formed thereon by electroless plating (see JP-A-5-283889). Further, there is an electromagnetic wave shielding structure (see Japanese Patent Application No. 9-145076) in which an adhesive film in which a geometric pattern is applied to a plastic film with a copper foil by a microlithography method is attached to a plastic plate. Proposed.

When the electromagnetic wave shielding structure is mounted on a display, it is necessary to ground the electromagnetic wave shielding structure by some method in order to reduce the leakage of the electromagnetic wave and to exhibit good shielding properties. As a configuration of the electromagnetic wave shielding structure for making a good connection with an external electrode for grounding, a conductive material such as a conductive tape is applied on the transparent conductive film bonded to both surfaces of the plastic plate or on the outer periphery of the plastic plate. A method in which the transparent conductive film is connected to the external electrode with low resistance (low impedance) by closely contacting (Japanese Unexamined Patent Publication No. 9-149)
No. 347), a method of protruding a metal net between two plastic plates and sandwiching an exposed portion of the metal net between external electrode frames for grounding or the like (see Japanese Patent Application Laid-Open No. 9-147752) has been proposed. ing.

[0005]

As a method for achieving both the electromagnetic wave shielding property and the transparency, Japanese Patent Application Laid-Open No. 1-278800 has been disclosed.
In the method of forming a thin film conductive layer by depositing a metal or metal oxide on a transparent substrate disclosed in Japanese Patent Application Laid-Open No. (100 ° -2,000 °), the surface resistance of the conductive layer becomes too large, so that even if the conductive layer is attached to a display by the connection method with an external electrode for grounding disclosed in JP-A-9-149347, sufficient shielding performance is obtained. Could not be obtained. An electromagnetic wave shielding material in which a good conductive fiber is embedded in a transparent substrate (JP-A-5-327274, JP-A-5-327274)
In Japanese Patent Application Laid-Open No. 269912/1989, if the connection to an external electrode for grounding is made by the method disclosed in Japanese Patent Application Laid-Open No. 9-147752 or the like, the shielding effect is sufficient, but the conductive material is prevented from leaking electromagnetic waves. Since the fiber diameter required for regularly arranging the conductive fibers was the thinnest at 35 μm, which was too thick, the fibers were visible (hereinafter referred to as visibility), which was not suitable for display applications. JP 6
Similarly, in the case of an electromagnetic wave shielding material in which a conductive resin containing a metal powder or the like disclosed in JP-A-2-57297 and JP-A-2-52499 is directly printed on a transparent substrate, the line width is about 100 μm due to the limit of printing accuracy. This was not suitable because visibility was developed. In addition, Japanese Patent Application No. Hei 9-14
According to the method proposed in Japanese Patent No. 5076, it is possible to achieve both the electromagnetic wave shielding property and the transparency. However, since the method is a method in which a film is attached to a plastic plate, it is difficult to connect with an external electrode for grounding. In addition, since the plastic film and the adhesive layer are insulating layers, it is difficult to directly ground. On the other hand, for example, even if the film is attached so that the conductive material drawn with the geometrical figure is on the opposite side of the plastic plate, the geometrical figure is also drawn at the part in contact with the external electrode for grounding. Therefore, the contact area between the conductive material forming the geometrical figure and the external electrode is reduced, and good shielding properties cannot be obtained. Regarding the shielding properties of electromagnetic waves generated from the front of the display, in addition to the electromagnetic wave shielding function of 30 dB or more at 30 MHz to 1 GHz, the infrared rays of 900 to 1,100 nm generated from the front of the display are used for other VTR devices controlled by remote control. It has to be shielded because it has an adverse effect. Further, not only is the visible light transmittance (visible light transmittance) large, but also in order to prevent leakage of electromagnetic waves, it is necessary that the external electrode for grounding and the electromagnetic wave shielding structure be well connected. However, there has not been obtained one that sufficiently satisfies the characteristics of electromagnetic wave shielding, infrared shielding, transparency and invisibility at the same time. In view of the foregoing, the present invention provides an electromagnetic shielding material having high electromagnetic shielding properties, infrared shielding properties, transparency and invisibility by making good connection with an external electrode for grounding, and an electromagnetic shielding structure using the same. And a display.

[0006]

The present invention relates to the following. (1) An electromagnetic wave shielding material in which a conductive layer of a geometric pattern is laminated or embedded on a plastic support, and further has a conductive frame electrically connected to the conductive layer. (2) The electromagnetic wave shielding material according to (1), wherein the frame is formed of the same material as the conductive layer of the geometric figure. (3) The electromagnetic wave shielding material according to (1) or (2), wherein all or part of the frame portion is laminated or embedded in the plastic support. (4) The electromagnetic wave shielding material according to any one of (1) to (3), wherein the frame portion is provided on all or a part of the periphery of the electromagnetic wave shielding material. (5) The conductive layer is made of a conductive metal (1) to (4)
The electromagnetic wave shielding material according to any one of the above. (6) The electromagnetic wave shielding material according to any one of (1) to (5), wherein the conductive frame portion is formed using a conductive tape. (7) Any of (1) to (6), wherein the conductive frame electrically connected to the conductive layer of the geometric figure is a conductive three-dimensional network structure formed on the outer periphery of the geometric figure. Electromagnetic wave shielding material as described. (8) The width of the conductive picture frame electrically connected to the conductive layer of the geometric figure is 1 to 40 mm.
The electromagnetic wave shielding material according to any one of (7). (9) The electromagnetic wave shielding material according to any one of (1) to (8), wherein the material of the conductive layer is copper, and at least the surface thereof is blackened. (10) The electromagnetic wave shielding material according to any one of (1) to (9), wherein the plastic support is a plastic film. (11) The electromagnetic wave shielding material according to any one of (1) to (10), wherein the conductive layer of the geometric figure has a line width of 40 μm or less, a line interval of 100 μm or more, and a line thickness of 40 μm or less. (12) The conductive layer of the geometric figure has a thickness of 0.5 to 40 μm.
m is copper, aluminum or nickel (1)-
The electromagnetic wave shielding material according to any one of (11). (13) The electromagnetic wave shielding material according to any one of (1) to (12), wherein no adhesive layer is present on the plastic support. (14) The electromagnetic wave shielding material according to any one of (1) to (13), wherein an adhesive layer is present on the plastic support. (15) The electromagnetic wave shielding material according to any one of (14), wherein a transparent layer is laminated on the conductive layer side via an adhesive layer on a portion of the geometrical figure formed by the conductive layer and a part of a frame portion continuous therewith. . (16) At least one side of the plastic plate (1)-
(15) An electromagnetic wave shielding structure obtained by laminating the electromagnetic wave shielding material according to any of (15). (17) An electromagnetic wave shielding structure obtained by laminating the electromagnetic wave shielding material according to any one of (1) to (15) on one surface of a plastic plate and laminating a plastic film on the other surface. (18) The electromagnetic wave shielding material according to any one of (1) to (15) is laminated on one surface of a plastic plate, and the conductive frame portion reaches the opposite surface of the plastic plate. Electromagnetic wave shielding structure. (19) The electromagnetic wave shielding structure according to any one of (16) to (18), wherein an antiglare treatment or an antireflection treatment is applied to a surface of the plastic support or the plastic plate of the electromagnetic wave shielding material. (20) The electromagnetic wave shielding structure according to any one of (16) to (19), wherein a frame is provided around the electromagnetic wave shielding structure so as to be in contact with a frame portion of the electromagnetic wave shielding material. (21) A display using the electromagnetic wave shielding material according to any one of (1) to (15). (22) A display using the electromagnetic wave shielding component according to any one of (16) to (20).

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail. A film is preferable as the plastic support used in the present invention. Examples of plastic materials include polyesters such as polyethylene terephthalate (PET) and polyethylene naphthalate; polyolefins such as polyethylene, polypropylene, polystyrene and EVA; vinyl resins such as polyvinyl chloride and polyvinylidene chloride; polysulfone; Examples include ether sulfone, polycarbonate, polyamide, polyimide, and acrylic resin. A plastic support, in particular, a plastic film having a total visible light transmittance of 70% or more and a thickness of 1 mm or less is preferable. These can be used as a single layer, but can also be used as a multilayer film combining two or more layers. Transparency out of plastic film,
A polyethylene terephthalate film or a polycarbonate film is preferred in terms of heat resistance, ease of handling, and price. Plastic film thickness is 5-500
μm is more preferred. If it is less than 5 μm, the handleability will be poor, and if it exceeds 500 μm, the transmittance of visible light will decrease. More preferably, the thickness is 10 to 200 μm.

The material of the conductive layer in the present invention includes a conductive paste, a conductive metal and the like. As the conductive metal, a metal such as copper, aluminum, nickel, iron, gold, silver, stainless steel, tungsten, chromium, titanium, or an alloy of a combination of two or more metals can be used. Copper, aluminum or nickel is suitable from the viewpoints of conductivity, circuit processing easiness, and price, and metal foil with a thickness of 0.1 to 40 μm, plating metal, or metal formed under vacuum such as evaporation is used. Will be When the thickness exceeds 40 μm, it is difficult to form a thin line width or the viewing angle becomes narrow. If the thickness is less than 0.1 μm, the surface resistance tends to be large, and the electromagnetic wave shielding effect tends to be inferior.

It is preferable that the conductive metal is copper or silver and at least the surface thereof has been subjected to a blackening treatment because the contrast is high. Further, it is possible to prevent the conductive metal from being oxidized with time and discolored. The blackening process may be performed before and after the formation of the geometrical figure. However, after the formation, the blackening process can be performed using a method used in the field of printed wiring boards. For example, sodium chlorite (31 g /
1), an aqueous solution of sodium hydroxide (15 g / l) and trisodium phosphate (12 g / l) at 95 ° C. for 2 minutes. In addition, it is preferable that the conductive metal is a paramagnetic metal because of excellent magnetic field shielding properties. The simplest method for bringing the conductive metal into close contact with the plastic support is to attach it via an adhesive layer mainly composed of an acrylic resin, an epoxy resin, or the like and flowing by heating or pressing. In addition, one or two or more of thin film forming techniques such as a vacuum deposition method, a sputtering method, an ion plate method, a chemical vapor deposition method, an electroless plating method, and an electroplating method can be used in combination. This is preferable because the thickness of the conductive layer of the conductive metal can be easily reduced. The thickness of the conductive metal is 0.1
The thickness is preferably from 40 to 40 μm, and the thinner the thickness, the wider the viewing angle of the display is, and it is preferable as an electromagnetic wave shielding material. In the plating method, it is preferable to form a thin layer of a conductive metal such as silver, copper, or aluminum on a plastic support by a vacuum evaporation method, a sputtering method, an ion plate method, or the like for plating.

The geometric figures drawn with the conductive metal of the present invention include triangles such as equilateral triangles, isosceles triangles, right triangles, etc., squares, rectangles, rhombuses, parallelograms, trapezoids, etc., and (positive) hexagons. It is a pattern combining (positive) n-gons (n is a positive integer) such as square, (positive) octagon, (positive) dodecagon, (positive) octagon, etc., circle, ellipse, star, etc. ,
These units can be used alone or in combination of two or more. From the viewpoint of electromagnetic wave shielding, a triangle is most effective, but from the viewpoint of visible light transmission, if the number of (positive) n-gons is larger, the numerical aperture increases as the number of n increases. From the viewpoint, the aperture ratio is preferably 50% or more. The aperture ratio is 60%
The above is more preferred. The aperture ratio is a percentage of the ratio of the area obtained by subtracting the area of the conductive metal of the geometric figure drawn with the conductive metal from the effective area to the effective area of the electromagnetic wave shielding material. When the area of the display screen is defined as the effective area of the electromagnetic wave shielding material, the ratio of the screen becomes visible. Preferably, the conductive layer of the geometrical figure is conductive.

As a method for forming such a geometric figure, a conductive metal layer formed on a plastic support is etched by a microlithography method, a screen printing method, an intaglio offset printing method or the like. After forming the pattern, there is a method of etching the conductive metal. These methods are effective in terms of circuit processing accuracy and circuit processing efficiency. As a method of etching, there is a chemical etching method or the like. Chemical etching is a method of dissolving and removing unnecessary conductors other than conductor portions protected by an etching resist with an etching solution. Examples of the etchant include an aqueous ferric chloride solution, an aqueous cupric chloride solution, and an alkaline etchant. Among these, an aqueous solution of ferric chloride or cupric chloride which is low in pollution and can be reused is preferable. Although the concentration of the etching solution depends on the thickness of the object to be etched and the processing speed, it is usually 150 μm.
２５０250 g / l. The liquid temperature is 60-8
A range of 0 ° C. is preferred. The method of exposing the object to be etched to the etching solution includes immersing the object to be etched in the etching solution, showering the object to be etched in the etching solution, and exposing the object to be etched in the vapor phase of the etching agent. is there. From the stability of etching accuracy, showering to the object to be etched in the etching solution is preferable.

A method utilizing the microlithography method is as follows.
A photosensitive layer that is exposed to active electromagnetic waves is provided on a conductive metal layer of a laminate including a transparent base material, an adhesive layer, and a conductive metal layer. Then, the conductive metal is etched to form a geometric pattern of the conductive metal, and finally, the resist is removed. Microlithography includes photolithography, X-ray lithography, electron beam lithography,
There is an ion beam lithography method and the like. Among these, the photolithographic method is the most efficient in terms of its simplicity and mass productivity. Above all, a photolithography method using a chemical etching method is most preferable in terms of its simplicity, economy, circuit processing accuracy, and the like.

In the screen printing method or the intaglio offset printing method, an etching resist ink is printed on a conductive metal layer surface of a laminate including a transparent base material, an adhesive and a conductive metal layer, cured, and then subjected to an etching process. There is a method in which a geometric pattern of a conductive metal is formed, and thereafter, the resist is removed. In screen printing, a mesh plate made by adding an emulsion to the mesh and forming the desired pattern holes in the emulsion,
In general, a pattern is printed using a squeegee on a conductive metal layer through a plate such as a meshless metal plate prepared by applying an emulsion to a meshless metal plate and forming a desired pattern hole in the emulsion. is there.

As the etching resist ink, any one can be used as long as the cured product has resistance to the etching treatment of the conductive metal, and commonly used ones can be used. Examples of the etching resist ink include a negative photoresist composition, a photosensitive resin composition, and a thermosetting resin composition.

Some negative-working photoresist compositions contain a resin soluble in an aqueous alkali solution, an amino resin and an acid generator. After printing and drying, the activity of ultraviolet rays, far ultraviolet rays, X-rays, electron beams, etc., is reduced. Irradiation,
Further, if necessary, the composition can be cured by heating. The resin soluble in an aqueous alkali solution is not particularly limited as long as it is a resin soluble in an aqueous alkali solution, but a novolak resin obtained by condensing phenols and aldehydes is preferable. Examples of the acid generator include a halogen-containing compound, a quinonediazide compound, a sulfonic acid ester compound, and an onium salt.

In these formulations, the acid generator is preferably contained in an amount of 5 to 40 parts by weight, and the amino resin is preferably contained in an amount of 3 to 50 parts by weight based on 100 parts by weight of the aqueous alkali-soluble resin. The solvent is usually used in an amount of 200 to 20 parts by weight per 100 parts by weight of the aqueous alkali solution-soluble resin.
It is used in the range of 00 parts by weight. Examples of the solvent include ketone solvents such as acetone, diethyl ketone, methyl amyl ketone and cyclohexanone; aromatic solvents such as toluene and xylene; cellosolve solvents such as methyl cellosolve, methyl cellosolve acetate and ethyl cellosolve acetate; and ethyl lactate. Ester solvents such as butyl acetate, isoamyl acetate, propylene glycol methyl ether acetate, propylene glycol ethyl ether acetate, methyl pyruvate, ethyl pyruvate, propyl pyruvate, methanol, ethanol, propanol, propylene glycol methyl ether, propylene glycol ethyl Alcohol solvents such as ether and propylene glycol propyl ether can be used alone or in combination of two or more.

The photosensitive resin composition includes a binder resin containing a polymerizable monomer and a photoinitiator. Examples of the binder resin include the following. Natural rubber, polyisoprene, poly-1,2-butadiene, polyisobutene, polybutene, poly-2-heptyl-1,3-butadiene, poly-2-t-butyl-
(Di) enes such as 1,3-butadiene, poly-1,3-butadiene, polyethers such as polyoxyethylene, polyoxypropylene, polyvinyl ethyl ether, polyvinyl hexyl ether, polyvinyl butyl ether, polyvinyl acetate, and polyvinyl propylene Polyesters such as pionate, polyurethane, ethyl cellulose, polyvinyl chloride, polyacrylonitrile, polymethacrylonitrile, polysulfone, polysulfide, polyethyl acrylate, polybutyl acrylate, poly-2-ethylhexyl acrylate, poly-t-butyl acrylate, poly -3-ethoxypropyl acrylate, polyoxycarbonyltetramethacrylate, polymethylacrylate, polyisopropylmethacrylate, polydodecylmethacrylate Acrylate, poly tetradecyl methacrylate, poly -n- propyl methacrylate, poly-3,3,5-trimethyl cyclohexyl methacrylate, polyethyl methacrylate, poly-2-nitro -
Poly (meth) acrylates such as 2-methylpropyl methacrylate, poly-1,1-diethylpropyl methacrylate, and polymethyl methacrylate, or copolymers thereof can be used.

As the polymerizable monomer, an acrylic monomer, epoxy acrylate, urethane acrylate, polyether acrylate, polyester acrylate and the like can be used. In particular, urethane acrylate, epoxy acrylate, and polyether acrylate are excellent from the viewpoint of adhesion to a support. Examples of epoxy acrylate include 1,6-hexanediol diglycidyl ether, neopentyl glycol diglycidyl ether, and allyl alcohol Glycidyl ether, resorcinol diglycidyl ether, diglycidyl adipate, diglycidyl phthalate, polyethylene glycol diglycidyl ether, trimethylolpropane triglycidyl ether, glycerin triglycidyl ether, pentaerythritol tetraglycidyl ether, sorbitol tetraglycidyl ether, etc. (Meth) acrylic acid adducts. Polymers having a hydroxyl group in the molecule, such as epoxy acrylate, are effective for improving the adhesion to the support. These can be used by dissolving them in a general-purpose solvent or stirring and mixing with a metal dispersant or the like without using any solvent.

As the thermosetting resin, a phenol resin,
Melamine resin, epoxy resin, xylene resin and the like can be applied.
More than one kind may be copolymerized, and two or more kinds may be blended and used. These can be used usually by dissolving them in a general-purpose solvent or stirring and mixing with a metal dispersant or the like without a solvent. The photosensitive resin composition can also be used for producing a photosensitive layer when performing a microlithographic method.

In these compositions used in the present invention, if necessary, in addition to a dispersant, a thixotropic agent,
Additives such as an antifoaming agent, a leveling agent, a diluent, a plasticizer, an antioxidant, a metal deactivator, a coupling agent and a filler may be added.

The following adhesives are representative of the adhesive layer. It is preferable that the adhesive layer be one which flows by heating or pressurization and has an adhesive function. The electromagnetic wave shielding material of the present invention,
There is an adhesive layer on the plastic film, on which a geometric figure drawn with a conductive metal is formed. The adhesive layer adheres the plastic film and the geometric figure drawn by the conductive metal, and further adheres to the display, plastic plate, plastic film,
When adhering to a glass plate or the like, the adhesive layer flows through a space where no geometrical figure is formed and adheres to the adherend. For this reason, it is preferable that the adhesive layer flows by heating or pressing. Also, when the bonding surface of the conductive metal is roughened to form a geometric figure and improve the adhesiveness, the roughened surface is transferred to the adhesive layer, and light is irregularly reflected on the roughened surface. However, when the adhesive layer flows, the transfer shape of the roughened surface is eliminated by the flow, and the light transmittance can be improved.
For these reasons, the adhesive layer needs to flow by heating and pressurizing, and an adhesive composition such as a thermoplastic, thermosetting, or actinic ray-curable resin is preferable.

As these adhesives, bisphenol A
Epoxy resin, bisphenol F epoxy resin, tetrahydroxyphenylmethane epoxy resin, novolak epoxy resin, resorcin epoxy resin, polyalcohol / polyglycol epoxy resin, polyolefin epoxy resin, alicyclic and halogenated bisphenol, etc. Epoxy resin can be used. Other than epoxy resin, natural rubber, polyisoprene, poly-
1,2-butadiene, polyisobutene, polybutene, poly-2-heptyl-1,3-butadiene, poly-2-t
(Di) enes such as -butyl-1,3-butadiene, poly-1,3-butadiene, polyethers such as polyoxyethylene, polyoxypropylene, polyvinyl ethyl ether, polyvinyl hexyl ether, and polyvinyl butyl ether; polyvinyl acetate , Polyesters such as polyvinyl propionate, polyurethane,
Examples include ethyl cellulose, polyvinyl chloride, polyacrylonitrile, polymethacrylonitrile, polysulfone, polysulfide, and phenoxy resin.
These exhibit a suitable visible light transmittance.

Examples of the curing agent for the adhesive include amines such as triethylenetetramine, xylenediamine and diaminodiphenylmethane; and acids such as phthalic anhydride, maleic anhydride, dodecylsuccinic anhydride, pyromellitic anhydride, and benzophenonetetracarboxylic anhydride. Anhydride, diaminodiphenyl sulfone, tris (dimethylaminomethyl) phenol, polyamide resin, dicyandiamide, alkyl-substituted imidazole, and the like can be used. These may be used alone or as a mixture of two or more.
Also, it is not necessary to use it. These curing agents (crosslinking agents)
Is added to the polymer in an amount of 0.1 to 100 parts by weight.
It is preferable to select 50 parts by weight, preferably 1 to 30 parts by weight. If this amount is less than 0.1 part by weight, curing will be insufficient, and if it exceeds 50 parts by weight, excessive crosslinking will occur,
Adhesion may be adversely affected. The adhesive used in the present invention may optionally contain additives such as a diluent, a plasticizer, an antioxidant, an ultraviolet absorber, a filler and a tackifier. Then, this adhesive layer is applied to the surface of the plastic film, and a conductive metal is bonded to form a plastic film with a conductive metal.

As a method of forming a geometric figure using the conductive material, there is a method of drawing a geometric figure by a printing method using a conductive paste on a plastic support.

The above-mentioned conductive paste is a mixture of a conductive filler, a binder and, if necessary, an organic solvent. As the conductive filler, metal, metal oxide, amorphous carbon powder, graphite, and metal-plated filler can be used. As metal,
Copper, aluminum, nickel, iron, gold, silver, platinum, tungsten, chromium, titanium, tin, lead, palladium, etc., and alloys such as stainless steel and solder containing one or a combination of two or more thereof are also used. can do. Silver, copper or nickel is suitable in terms of conductivity, ease of printing, and price. On the other hand, as the metal forming the conductive paste, paramagnetic metals such as iron, nickel,
When cobalt is used, it is also possible to improve the shielding property of a magnetic field in addition to the electric field. The shape of these metals and the like may be any of scaly, resinous, spherical, amorphous,
It can also be treated with a lubricant or the like. The preferred particle size is 50
If the particle size is less than μm, the conductivity will be reduced.
Although the ratio of the metal in the conductive paste can be arbitrarily adjusted, good shielding properties are exhibited only in the case of 3%.
It is 0% by weight or more, particularly preferably 50% by weight or more.

Examples of the conductive paste binder include the following. Natural rubber, polyisoprene, poly-1,2-butadiene, polyisobutene, polybutene, poly-2-heptyl-1,3-butadiene, poly-2-t-butyl-1,3-butadiene, poly-1,
(Di) enes such as 3-butadiene, polyethers such as polyoxyethylene, polyoxypropylene, polyvinyl ethyl ether, polyvinyl hexyl ether, and polyvinyl butyl ether; polyvinyl acetate;
Polyesters such as polyvinyl propionate, polyurethane, ethyl cellulose, polyvinyl chloride, polyacrylonitrile, polymethacrylonitrile, polysulfone, polysulfide, polyethyl acrylate, polybutyl acrylate, poly-2-ethylhexyl acrylate, poly-t-butyl acrylate , Poly-3-ethoxypropyl acrylate, polyoxycarbonyl tetramethacrylate, polymethyl acrylate, polyisopropyl methacrylate, polytodecyl methacrylate, polytetradecyl methacrylate, poly-n-propyl methacrylate, poly-3,3,5-trimethylcyclohexyl methacrylate , Polyethyl methacrylate, poly-2-nitro-2-methylpropyl methacrylate, poly-1,1 Poly (meth) acrylates such as diethyl propyl methacrylate and polymethyl methacrylate can be used. Epoxy acrylates, urethane acrylates, polyether acrylates, polyester acrylates can be used as copolymerizable monomers between acrylic resins and non-acrylic resins. Etc. can also be used. In particular, urethane acrylate, epoxy acrylate, and polyether acrylate are excellent from the viewpoint of adhesion to a support. Examples of epoxy acrylate include 1,6-hexanediol diglycidyl ether, neopentyl glycol diglycidyl ether, and allyl alcohol. Diglycidyl ether, resorcinol diglycidyl ether, adipic acid diglycidyl ester, phthalic acid diglycidyl ester, polyethylene glycol diglycidyl ether, trimethylolpropane triglycidyl ether, glycerin triglycidyl ether, pentaerythritol tetraglycidyl ether, sorbitol tetraglycidyl ether, etc. (Meth) acrylic acid adduct. Polymers having a hydroxyl group in the molecule, such as epoxy acrylate, are effective for improving the adhesion to the support. In addition to these,
Phenol resin, melamine resin, epoxy resin, xylene resin, etc. can be applied, and these polymers may be copolymerized as needed, or two or more kinds may be blended and used. is there.

These binder polymers can be used by dissolving them in a general-purpose solvent or by stirring and mixing with a metal together with a metal dispersant or the like without using any solvent. If necessary for the composition used for the conductive paste, in addition to the dispersant, a thixotropic agent, an antifoaming agent, a leveling agent, a diluent, a plasticizer, an antioxidant, and a metal deactivator Further, additives such as a coupling agent and a filler may be blended.

As a method of blackening the conductive paste, there are a method of adding a black pigment to the binder polymer and a method of using a black additive such as carbon black. When carbon black is used as the black additive, it is preferable because the conductivity of the conductive paste does not decrease. These black additives are usually based on 100 parts by weight of the binder polymer.
The addition of 0.001 part by weight or more can improve the contrast, but the addition of 0.01 part by weight or more is more preferable. As a printing method used when drawing a geometric figure in the present invention, an intaglio offset printing method, a flat plate offset printing method, a screen printing method, or the like can be applied.
The intaglio offset printing method is excellent in high-precision printability of 50 μm or less as compared with the screen printing method and the lithographic offset printing method. The intaglio offset printing method is a method in which a conductive paste is packed in a concave portion of a plate, temporarily transferred to a blanket, and then printed on a transparent plastic support. After printing of the conductive paste, heating and drying or heating and curing are appropriately performed.
The obtained geometric figure by the conductive paste can be plated with a conductive metal thereon. The method may be in accordance with a conventional method.

As a method of forming a geometric figure with the above-mentioned conductive material, a method of using a conductive paste in the form of a plastic support having grooves of the geometric figure with a doctor blade, a method of using a roll coater, or the like is used. There is a method in which the grooves are filled and the conductive paste is heated, dried or cured. The shape of the plastic support having a groove of a geometric figure can be formed by a method of irradiating a laser beam to the plastic support or a method of performing resin etching. It is preferable that the depth, width, and aperture ratio of the groove correspond to a geometric figure.

The line width of such a geometric figure is 40 μm.
m or less, line spacing is 100 μm or more, line thickness is 4
It is preferable that the thickness be in the range of 0 μm or less. Further, from the viewpoint of invisibility of the geometric figure, the line width is more preferably 25 μm or less, and the line interval is more preferably 120 μm or more and the line thickness is 18 μm or less from the viewpoint of visible light transmittance. Line width is 40μ
m or less, preferably 25 μm or less, and if it is too small and thin, the surface resistance becomes too large and the shielding effect is inferior. Line thickness is 4
0 μm or less is preferable. If the thickness is too small, the surface resistance becomes too large and the shielding effect is inferior.
Or more, more preferably 1 μm or more.
The aperture ratio increases as the line interval increases, and the visible light transmittance increases. When used on the front of the display as described above, the aperture ratio is preferably 50% or more, more preferably 60% or more. If the line spacing becomes too large,
The line spacing is 100
It is preferably set to 0 μm (1 mm) or less. When the line interval is complicated by a combination of geometric figures and the like, the area is converted into the area of a square on the basis of the repeating unit, and the length of one side is set as the line interval.

In the present invention, the conductive frame portion is formed on the same surface as the geometrical figure drawn by the conductive metal, and is formed in a frame shape around the geometrical figure by the conductive material. . The frame is electrically connected to a geometric figure drawn with a conductive material, and is well connected to an external electrode for grounding. FIG. 1A is a plan view showing an example of the electromagnetic wave shielding material according to the present invention. A conductive picture frame (1) is formed on the outer periphery of a geometric figure (2) drawn with a conductive metal. Hereinafter, the configuration of the electromagnetic wave shielding material will be exemplified by a cross-sectional view of the electromagnetic wave shielding material. As shown in FIG. 1B, the structure of the electromagnetic wave shielding material is made of a conductive metal through an adhesive layer or a conductive metal thin film (4) such as silver, copper, or aluminum on a plastic film (3). A drawn geometric figure (2) is formed, and a conductive frame (1) is formed on the outer periphery thereof. Further, as shown in FIG. 1 (c), a geometrical figure (2) drawn with a conductive metal is formed on the plastic film (3) via an adhesive layer or a metal thin film (4), and its outer periphery is formed. The conductive frame portion (1) is exposed. The structure in which the frame portion (1) is exposed can be formed by removing a part or all of an adhesive layer or a metal thin film or a plastic film that supports the frame portion of the electromagnetic wave shielding material. As a method for removing a part or the whole of the adhesive layer, the metal thin film, or the plastic film, it can be easily performed by using a laser or a sandblast through a shielding jig. In the case of laser, the shielding jig is formed by processing a metal plate to provide a penetrating portion in the shape of a frame portion, placing the penetrating portion on the plastic surface of the electromagnetic wave shielding material in accordance with the position of the frame portion, and placing the metal plate. Is used as a laser shield. On the other hand, in the case of sandblasting, similarly, rubber, photoresist, or the like, which is a wear-resistant material, is used as a shield. In order to form the conductive frame (1), a metal foil, a conductive tape, and a conductive three-dimensional mesh structure forming the frame are formed around the geometric figure drawn with the conductive metal. It can also be performed by providing. The electrical connection between the conductive metal of the geometric figure and the frame is made by bonding the metal foil or the like to the frame using an adhesive layer of an electromagnetic wave shielding material or a metal thin film as a frame. The connection may be made by contact with a geometrical figure, or a soldering paste may be applied to a geometrical figure of a metal foil or a conductive metal and then heated and melted. Further, bonding with a conductive adhesive may be used.

The plastic plate used in the present invention is a plate made of plastic, specifically, a polystyrene resin, an acrylic resin, a polymethyl methacrylate resin,
Polycarbonate resin, polyvinyl chloride resin, polyvinylidene chloride resin, polyethylene resin, polypropylene resin, polyamide resin, polyamideimide resin, polyetherimide resin, polyetherketone resin, polyarylate resin, polyacetal resin, polybutylene terephthalate resin, polyethylene terephthalate Thermoplastic polyester resin such as resin, cellulose acetate resin, fluororesin, polysulfone resin, polyethersulfone resin,
Thermoplastic resins and thermosetting resins such as polymethylpentene resin, polyurethane resin and diallyl phthalate resin are exemplified. Among these, a polystyrene resin, an acrylic resin, a polymethyl methacrylate resin, a polycarbonate resin, a polyvinyl chloride resin, a polyethylene terephthalate resin, and a polymethyl pentene resin having excellent transparency are preferably used. The thickness of the plastic plate used in the present invention is from 0.5 mm to 5 mm for protection and strength of the display,
It is preferable from the viewpoint of handling.

In FIG. 1D, a geometrical figure (2) drawn with a conductive metal is formed on a plastic film (3) through an adhesive layer or a metal thin film (4), and a conductive figure is formed on the outer periphery thereof. A conductive frame (1) is formed of a conductive metal of a plastic film with a conductive metal, and a transparent layer (5) is provided on the geometric figure via an adhesive layer or a thin metal film. An example in which the frame portion is exposed so as not to be covered is shown. The transparent layer (5) is a plastic film, a plastic plate, a glass plate, or the like. In this configuration, the transparent layer (5) can be installed directly on the display or via a jig. FIG. 1E shows a conductive frame (1).
Is bent toward the plastic film (3) side to expose a frame portion on the plastic film side. FIG.
(F), a geometrical figure (2) drawn with a conductive metal is formed on a plastic film (3) via an adhesive layer or a metal thin film (4), and a conductive adhesive or a conductive This is an example in which a frame portion (1) is formed of a conductive material (6) such as a tape. In FIG. 1 (g), a geometrical figure (2) drawn with a conductive metal is formed on a plastic film (3) via an adhesive layer or a metal thin film (4), and a three-dimensional conductive figure is formed on the outer periphery thereof. This is an example in which a frame portion (1) is formed by a mesh structure (7). FIGS. 1A to 1G show examples of the electromagnetic wave shielding material of the present invention, but the present invention is not limited to these configurations. In the configuration of FIG. 1B, since the conductive metal forming the frame portion is connected to the conductive metal of the geometrical figure, the connection resistance with the external electrode for grounding is low and good electromagnetic wave shielding properties are obtained. Can be expressed. In the configuration shown in FIG. 1B, when a surface of a geometric figure drawn with a conductive metal on a plastic plate is bonded using the adhesive layer or a separate adhesive, the surface is located below the frame portion. Since the adhesive layer or the plastic film becomes the insulating layer, it becomes difficult to electrically connect to the external electrode for grounding. The solution to this problem is the configuration of FIG. 1 (e). When the surface of the geometrical figure (2) drawn with a conductive metal is bonded to a plastic plate, the frame portion is bent, so that the outer layer side is formed. There is a frame portion serving as an electrode for grounding, which facilitates electrical connection. As for the bending method, the four corners may be folded as they are, but the four corners are bulky. Alternatively, the bent portion may be fixed by attaching a double-sided adhesive tape to the plastic film where the frame portion is formed. On the other hand, similarly, in the configuration of FIG. 1C, when the surface of the geometrical figure (2) drawn with a conductive metal is bonded to the plastic plate, the external electrode for grounding is exposed because the frame portion is exposed. Electrical connection with the device becomes easy. In the configuration shown in FIG. 1D, when the plastic film (3) side is bonded to a display or a plastic plate, the geometrical figure serving as the outer layer is protected by the transparent layer (5), and the outer side is connected to the external electrode for grounding. The frame is exposed for easy connection. The plastic film (3) or the transparent layer (5) to be bonded may have an infrared shielding function, an antiglare function, and an antireflection function. In the configurations shown in FIGS. 1F and 1G, in order to reduce the connection resistance between the geometrical figure and the external electrode for grounding, a conductive material (6) such as a conductive adhesive or a conductive tape, or the like. Since the conductive frame (1) is formed on the conductive metal of the geometrical figure by the conductive three-dimensional network structure (7), it is easily controlled without being restricted by the size of the equipment to be used. A frame can be formed. In this configuration, the frame portion can be bent as shown in FIG. The width of the above-mentioned frame portion is preferably 1 to 40 mm in order to improve the connection with an external electrode for grounding. If it exceeds 20 mm, the width of the frame portion is too wide and the occupied area becomes large, so that the width is preferably 5 to 15 mm. In the case of bending as shown in FIG. 1 (e), the width of the frame can be made wider.

The electromagnetic wave shielding structure of the present invention has a structure in which the electromagnetic wave shielding material having the structure shown in FIGS. 1A to 1G is provided on at least one surface of a plastic plate. In addition, the electromagnetic wave shielding material is provided on the plastic plate with the surface on which the conductive geometrical pattern is drawn through an adhesive layer or a separate adhesive, and the plastic is formed on the other surface with the adhesive layer or a separate adhesive. It is an electromagnetic wave shielding structure provided with a film. Such an electromagnetic wave shielding component is preferably brought into contact with an external electrode for grounding in order to suppress leakage of electromagnetic waves and obtain good electromagnetic wave shielding properties. If the connection resistance between the external electrode for grounding and the electromagnetic wave shielding structure is high, or if the adhesion is insufficient, sufficient electromagnetic wave shielding properties cannot be obtained. In FIG. 1, the adhesive layer or the metal thin film (4) may not be provided.

FIG. 2A is a perspective view of the electromagnetic wave shielding structure according to the present invention. An electromagnetic wave shielding material, more specifically, an electromagnetic wave shielding film (8) is provided on one surface of the plastic plate (11), and a plastic film is provided on the other surface of the plastic plate (11) via an adhesive layer or a separate adhesive (12). This is a configuration example in which (13) is attached. FIGS. 2B to 2E are cross-sectional views of the electromagnetic wave shielding structure. In the configuration of FIG. 2B, a plastic plate (11) has a surface on which a geometric figure of an electromagnetic wave shielding material (8) is drawn on one surface and an adhesive layer or a separate adhesive (12) on the other surface. A plastic film (13) is adhered through. In the configuration of FIG. 2C, the plastic film (3) of the electromagnetic wave shielding material (8) is bonded to one side of the plastic plate (11) via an adhesive layer (12), and the other side of the plastic plate (11). A plastic film (13) is bonded to the surface via an adhesive layer (12). When the electromagnetic wave shielding structure is brought into contact with an external electrode for grounding, in order to improve the adhesion between the electromagnetic wave shielding structure and the external electrode for grounding, a conductive tape or a conductive three-dimensional network structure is used. It is preferable that the cushioning conductive material (6) is formed on the frame portion of the electromagnetic wave shielding structure (FIGS. 2D and 2E). FIG. 3 is an example in which a conductive frame (21) is provided in the frame of the electromagnetic wave shielding structure illustrated in FIG. The frame body (21) connects the conductive picture frame (1) electrically connected to the geometrical figure (2) drawn with the conductive metal and the external electrode for grounding, and provides an aesthetic appearance. Improve. In order to connect to external electrodes, the surface of the frame must be conductive, such as by plating metal or plastic where necessary, such as aluminum or brass. A material in which conductive materials such as fibers are dispersed may be used. It is preferable that the cross section of the frame has a U-shape because it can be fitted into and fixed to the electromagnetic wave shielding structure. For fixing, a restoring force due to deformation of the frame body may be used, or a screw, a screw, or an adhesive may be used. By inserting a metal foil such as copper foil inside the concave part of the frame body when the cross section of the frame is U-shaped, and fitting it around the outer periphery of the geometric figure drawn with conductive metal on the whole surface This is preferable because the metal foil of the frame can be pressed against the geometric figure. In this case, the metal foil in contact with the geometric figure becomes the frame.

FIG. 3A is a perspective view of the electromagnetic wave shielding structure when a frame (21) is provided, and FIG.
(G) is a sectional view thereof. FIG. 3A shows a frame (2) attached to a conductive frame provided on the outer periphery of the electromagnetic wave shielding material.
This is an electromagnetic wave shielding structure in which 1) is fitted and fixed. FIG.
(B) shows an example in which the frame (21) is fitted into and contacted with the entire exposed frame portion, and (c) shows an example in which the frame (2) is attached to a part of the frame portion.
This is an example in which 1) is fitted and brought into contact. FIG. 3D shows a configuration in which the frame body (21) is formed in an “L” shape and the frame body is provided only on the frame portion of the electromagnetic wave shielding material and the end side surface of the plastic plate. When the contact between the frame and the conductive part of the frame is not sufficient, place a metal powder that is slightly harder than the frame or the frame on the conductive frame and let the metal powder bite into the frame or the frame. It is also effective to increase the reliability of the contact conduction. The side surface of the end of the plastic plate and the frame were fixed with an adhesive. FIG. 3E shows an example in which a frame (21) is provided in the electromagnetic wave shielding structure of FIG. 2C. FIG.
A transparent layer (5) is provided on the surface on which the geometrical figure of the electromagnetic wave shielding material (8) of (d) is formed, and a plastic plate (11) is provided on the plastic film (3) side via an adhesive layer (12). This is an example in which a frame is provided on an electromagnetic wave shielding structure (10) in which a plastic film (13) is attached to the other surface of a plastic plate via an adhesive layer (12) via a laminate on one side of the plastic plate. The above-mentioned frame (21) is not limited to this, and may be made of a conductive material such as a metal foil, a conductive adhesive, or a conductive tape. The above configuration is an example, and there are many combinations.

On any surface of the above-mentioned electromagnetic wave shielding material or electromagnetic wave shielding structure, a layer having an infrared ray shielding property, a layer having an anti-reflection treatment, a layer having an anti-glare treatment, and having abrasion resistance having high surface hardness. Layers can be formed. These are examples and can be used in other forms.
An electromagnetic wave shielding material may be adhered to one surface of the glass plate, and the glass plate may be attached to the front surface of the display so that the glass surface is outside the display device.

In the present invention, it is preferable that the adhesive layer and / or the plastic film supporting the conductive frame portion is removed by a laser so that at least a part of the frame portion is exposed. Lasers are YAG laser, carbon dioxide laser,
There are TEA carbon dioxide laser, argon ion laser, excimer laser, etc.
Since the PET film and the adhesive layer, if present, must be removed at a depth of 50 μm or more when combined, and since it is necessary to process in the shortest possible time in terms of mass productivity, a YAG laser, a carbon dioxide gas laser, T
An EA carbon dioxide laser is preferred. To form a conductive frame that is electrically connected to the geometrical figure drawn with conductive metal on the outer periphery of the electromagnetic wave shielding material, the frame portion is processed when the laser output of the processing surface processed from the plastic film side is small. The removal of the plastic film and the adhesive layer in the portion is insufficient, and if it is too large, the conductive metal in the frame portion is broken.
0-40 W is more preferable.

In the present invention, in order to form the frame, the adhesive layer and / or the plastic film which support the conductive frame is removed by sandblasting to expose at least a part of the frame. Sand blasting is performed by spraying an abrasive onto unmasked portions to selectively etch the non-masked portions. As a blast material used for sand blasting, fine particles having a particle size of about 0.1 to 150 μm such as glass beads, alumina, silica, silicon carbide, and zirconium oxide are used. In the present invention, a part or the whole other than the frame is covered with a mask material, and the plastic film and the adhesive in the frame are removed. The mask material is not limited as long as it can be protected from being damaged in the sandblasting process, such as rubber, photoresist, plastic film, plastic plate, metal, ceramic, and wood.

In the present invention, a conductive three-dimensional network structure in which a conductive frame electrically connected to a geometric figure drawn with a conductive metal is formed on the outer periphery of the geometric figure may be used. it can. The conductive three-dimensional network structure is prepared by pretreating a synthetic resin foam having a three-dimensional network structure such as urethane foam with an electroless metal plating catalyst or the like, and electrolessly forming a metal layer such as nickel or copper in a plating tank. Plating is used in combination with electroplating to increase the thickness of the plated metal, followed by baking to decompose and burn the resin, and transferring the shape of the foamed resin to a three-dimensional mesh structure of an electrodeposited metal or urethane foam. A synthetic resin foam having a three-dimensional network structure is immersed in a slurry prepared by mixing a metal powder, a thickening polymer, and a solvent, and the metal powder is applied to a skeleton of the foam, and then heat-treated to form a synthetic resin foam. Adhesive is applied to a synthetic resin foam having an open-cell structure, such as a three-dimensional network structure of a metal produced by transferring the shape of a foamed resin by decomposing and burning the metal powder and sintering the metal powder, and urethane foam. After impregnating and drying the liquid, the metal powder is attached to the synthetic resin foam by shaking, and then fired to decompose and burn off the resin, and sinter the metal powder to transfer the shape of the foamed resin. it can.

In the electromagnetic wave shielding film and the electromagnetic wave shielding structure of the present invention, the plastic film of the electromagnetic wave shielding material provided on the plastic plate or the surface of the plastic plate or the plastic film is subjected to an antiglare treatment or an antireflection treatment. Is preferred. Hereinafter, forming these processes on a plastic film will be described as a typical example. The same can be applied to a plastic plate or the like. The antireflection treatment refers to increasing the transmittance of visible light by preventing the reflection of visible light. In this antireflection treatment, the minimum reflection wavelength is defined by the coating thickness of the antireflection layer and the refractive index, and nd = (m + 1 /
2) λ / 2 (n: refractive index, d: coating thickness, λ: wavelength, m
= 0, 1, 2, 3,?). That is, n
Is determined by the substance, the wavelength of the minimum reflectance (maximum transmittance) can be selected by adjusting the film thickness.
Further, the antireflection layer includes a single-layer structure having a refractive index different from that of the plastic film or a multilayer structure having two or more layers. In the case of a single-layer structure, a material having a smaller refractive index than a plastic film is selected. On the other hand, in the case of a multi-layer structure that is superior in anti-reflection treatment, a material layer having a larger refractive index than a plastic film is provided, and a material layer having a smaller refractive index is provided thereon. Although the materials have different indices, it is more preferable that the outermost layer has a multilayer structure of three or more layers in which the refractive index of the outermost layer is smaller than a virtual refractive index adjacent thereto.
As a material for constituting such an antireflection layer, any known material may be used.
_{CaF 2, MgF 2, NaAlF 6} , Al 2 O 3, SiOx (x = 1~2), ThF 4, ZrO
₂ , a dielectric such as Sh ₂ O ₃ , Nd ₂ O ₃ , SnO ₂ , TiO _2, etc., and the refractive index and the film thickness are appropriately selected so as to satisfy the above relationship.

The anti-glare treatment is intended to prevent flickering of the display and eyestrain, and any known material may be used as a material for forming such an anti-glare treatment layer. Preferably, it is a layer containing inorganic silica. Such an inorganic silica layer is formed of an epoxy resin such as a bisphenol A epoxy resin, a bisphenol F epoxy resin, a novolak epoxy resin, a diene resin such as polyisoprene, poly-1,2-butadiene, polyisobutene, polybutene, and ethyl acrylate. Butyl acrylate, 2-ethylhexyl acrylate, t
-Polyacrylate copolymers such as butyl acrylate, polyvinyl acetate, polyester resins such as polyvinyl propionate, polyethylene,
A cured film dispersed and bound in a curable resin such as a polyolefin resin such as polypropylene, polystyrene, and EVA and a silicone resin is preferably used as the antiglare treatment layer.

In forming the film of the antiglare treatment layer,
First, a composition in which various additives such as an antistatic agent and a polymerization initiator are added according to need by mixing silica particles in a resin,
Usually, an antiglare treatment agent having a solid content of about 20 to 80% by weight after dilution with a solvent is prepared. The silica particles used here are amorphous and porous, and a typical example thereof is silica gel. The average particle diameter is usually 30μ.
m or less, preferably about 2 to 15 μm.
The mixing ratio is preferably such that the silica particles are 0.1 to 10 parts by weight with respect to 100 parts by weight of the resin.
If the amount is too small, the antiglare effect will be poor, and if it is too large, the visible light transmittance and the film strength will be reduced. The anti-glare treatment agent is applied to one surface of the plastic film by a suitable means, for example, a gravure coater, a reverse coater, a spray coater or the like, which is a general solution coating means, so that the film thickness after drying is usually about 5 to 30 μm. After drying by heating, it is preferable to cure by ultraviolet irradiation, electron beam irradiation or heating. The anti-glare treatment layer composed of the silica particle-containing coating obtained in this way, when a plastic film having this treatment layer is bonded to a plastic substrate, imparts a good anti-glare property to the substrate, and Since the hardness of the film is high and the scratch resistance is excellent, it greatly contributes to the improvement of the abrasion resistance of the plastic. Prior to the formation of such an anti-glare treatment layer, the surface to be adhered, that is, the surface of the plastic film may be subjected to a corona discharge treatment, a plasma treatment, a sputter etching treatment, or an easy adhesion treatment as a pretreatment. Thereby, the adhesion between the plastic film and the anti-glare treatment layer can be improved.

In the present invention, it is preferable that an electromagnetic wave shielding material, an electromagnetic wave shielding material such as a plastic film and an adhesive layer provided on a plastic plate, contain an infrared absorbing agent. The infrared absorber is 900
It is preferable that the infrared absorption in the region of about 1,100 nm is high, and metal oxides such as iron oxide, cerium oxide, tin oxide, and antimony oxide, or indium-tin oxide (hereinafter, ITO), tungsten hexachloride, and tin chloride An organic infrared absorber such as cupric sulfide, cupric sulfide, chromium-cobalt complex salt, thiol-nickel complex or aminium compound, diimonium compound (manufactured by Nippon Kayaku Co., Ltd.), etc. Or a composition dispersed in a binder resin and applied to one surface of plastic. Among these infrared absorbing compounds, those having the effect of absorbing infrared rays most effectively are organic infrared absorbing agents such as cupric sulfide, ITO, aminium compound and diimonium compound. What should be noted here is the particle size of the primary particles of these compounds. If the particle size is too large than the wavelength of infrared light, the shielding efficiency will be improved, but irregular reflection will occur on the particle surface and the haze will increase, resulting in lower transparency. On the other hand, if the particle size is too small compared to the wavelength of infrared rays, the shielding effect will be reduced. Preferred particle size is 0.01 to 5μ
m is more preferably 0.1 to 3 μm. The infrared absorber is uniformly dispersed in the adhesive or binder resin of the adhesive layer. The optimal amount of the compounding is 0.01 to 10 parts by weight of the infrared absorber with respect to 100 parts by weight of the adhesive or the binder resin, and more preferably 0.1 to 5 parts by weight.
If the amount is less than 0.01 part by weight, the infrared ray shielding effect is small, and
If the amount is more than 10 parts by weight, the transparency is impaired. In the case of a binder resin composition, it is applied to at least one surface of a plastic film in a thickness of 0.1 to 10 μm. The applied composition containing an infrared absorber may be cured using heat or UV. An adhesive layer can also be formed on the binder resin. It is preferable in terms of manufacturing simplicity that the infrared absorber is directly mixed with the adhesive composition to be the adhesive layer and used.

The electromagnetic shielding material of the present invention has a conductive frame. When the electromagnetic shielding material is laminated to an electromagnetic shielding body or a display, the electromagnetic shielding material corresponds to the frame of the electromagnetic shielding material. The presence of a conductive frame on the body or display also provides better electromagnetic wave shielding. If there is a small gap, the electromagnetic wave generated by the alternating current has a property of leaking out of the gap, so that the frame is very important to prevent the leakage of the electromagnetic wave. In this sense, it is most preferable that the frame portion is provided at the edge of the electromagnetic wave shielding material without any gap.

[0046]

EXAMPLES Next, the present invention will be specifically described with reference to examples, but the present invention is not limited to these examples. <Electromagnetic wave shielding material production example 1; Example> A polyethylene terephthalate film (diahard EX-2) having a thickness of 50 μm and having been subjected to an antiglare treatment as a plastic film.
05; trade name, manufactured by Reiko Co., Ltd.), and an electrolytic copper foil having a thickness of 18 μm, which is a conductive metal, was formed thereon via an adhesive composition having a thickness of 20 μm to be an adhesive layer to be described later. At 180 ° C, 30 kgf /
PE with copper foil by heat laminating and bonding under the condition of cm
A T film was obtained. Using a geometric film and a negative film having a 10 mm wide frame on the outer periphery of the geometric figure, a photolithography process (resist film sticking-exposure-development-chemical etching-resist) is applied to the obtained PET film with copper foil. After film peeling), line width 25
A copper grid pattern having a frame part with a line spacing of 250 μm was formed on a PET film, and then sodium chlorite 31 g / l and trisodium phosphate 12 g /
1 in an aqueous solution of sodium hydroxide 15 g / l at 95 ° C 2
After that, the surface of the copper was blackened to obtain an electromagnetic wave shielding material 1 (the configuration of FIG. 1B).

<Electromagnetic shielding material production example 2; Example>
Using a IMPACT L500 (trade name, manufactured by Sumitomo Heavy Industries, Ltd.), the frame portion of the electromagnetic wave shielding material 1 was viewed from the PET film side at a voltage of 20 kV and a frequency of 150 H.
Laser processing was performed under the conditions of z and a scan speed of 200 mm / min, and the PET film and the adhesive layer at the frame were removed to obtain an electromagnetic wave shielding material 2 (the configuration of FIG. 1C).

<Electromagnetic Wave Shielding Material Production Example 3; Example>
PET film with anti-reflection treatment
00: a product name of Nippon Yushi Co., Ltd., having a thickness of 50 μm), which is not subjected to the antireflection treatment, and has a dry coating thickness of 2 using the adhesive composition used in the electromagnetic wave shielding material preparation example 1.
An adhesive film prepared by applying so as to be 0 μm
On the geometric figure of the electromagnetic wave shielding material 1, heat lamination is performed under the condition of 180 ° C. and 30 kgf / cm so as not to cover all the frame portions, and is adhered.
Was obtained (the configuration of FIG. 1D).

<Example 4 of making electromagnetic wave shielding material; Example>
On a transparent PET film having a thickness of 25 μm,
A thickness of 25 μm via the adhesive composition to be a 0 μm adhesive layer.
A μm aluminum foil was adhered. This PET with aluminum foil
An aluminum lattice pattern having a line width of 25 μm, a line interval of 250 μm, and a frame portion of 30 mm was formed through a photolithography process similar to that of the electromagnetic wave shielding material production example 1 using a negative film having a frame portion with a width of 30 mm on the outer periphery of the film. It was formed on a PET film, and the frame was folded toward the PET film to obtain an electromagnetic wave shielding material 4 (FIG. 1).
(E) Configuration).

<Electromagnetic Wave Shielding Material Production Example 5; Example>
On a PET film having a thickness of 50 μm, a nickel grid pattern having a line width of 12 μm, a line interval of 500 μm, and a thickness of 2 μm was formed on the PET film by forming electroless nickel plating in a lattice shape using a mask layer.
Conductive tape (CHO-
FOIL CCH (trade name of Taiyo Wire Mesh Co., Ltd.) width 1
A 5 mm-thick frame was formed to obtain an electromagnetic wave shielding material 5 (the configuration shown in FIG. 1F).

<Electromagnetic Wave Shielding Material Production Example 6; Example>
Using a negative film having only a geometric figure on the PET film with copper foil obtained in the electromagnetic wave shielding material production example 1,
Through a photolithography process similar to that of the electromagnetic wave shielding adhesive film production example 1, the line width is 25 μm, and the line interval is 250 μm.
m copper grid pattern is formed on a PET film, and foamed metal copper (manufactured by Hitachi Chemical Co., Ltd., thickness: 5 mm) using polyurethane foam as a base skeleton is formed on the outer periphery of the surface having the geometrical figure at room temperature and 5 kgf / At a pressure of cm2,
A frame portion was formed by pasting the film to a width of 15 mm, and an electromagnetic wave shielding material 6 was obtained (the configuration of FIG. 1 (g)).

<Adhesive composition> In a 500 cm3 three-necked flask, 200 cm3 of toluene, 50 g of methyl methacrylate (MMA), 5 g of ethyl methacrylate (EA), 2 g of acrylamide (AM), and 250 mg of AIBN were placed.
The mixture was stirred at 100 ° C. for 3 hours under reflux while bubbling with nitrogen. The polymer obtained by reprecipitation with methanol was filtered, and then dried under reduced pressure. The yield of the polyacrylate obtained was 75%. This was used as the main component of the adhesive composition. Polyacrylate (MMA / EA / AM = 88/9/3, Mw = 700,000) 100 parts by weight Toluene 450 parts by weight Ethyl acetate 10 parts by weight

<Composition of Infrared Shielding Layer> Byron UR-1400 (trade name, manufactured by Toyobo Co., Ltd .; saturated polyester resin, Mn = 40,000) 100 parts by weight IRG-022 (infrared absorbent: Nippon Kayaku Co., Ltd.) Product name; aminium compound) 1.2 parts by weight MEK 285 parts by weight Cyclohexanone 5 parts by weight

Example 1 Preparation of Electromagnetic Wave Shielding Structure PET Film (REALK 130
No. 0; trade name of Nippon Yushi Co., Ltd.) having an infrared shielding property obtained by applying the composition for forming the above-mentioned infrared shielding layer to a surface having not been subjected to the antireflection treatment so as to have a dry coating thickness of 10 μm. The adhesive surface of the adhesive film and the surface on which the geometric figure of the electromagnetic wave shielding material 2 is drawn are connected to a commercially available acrylic plate (como glass; Kuraray Co., Ltd., thickness 3 mm)
Then, an electromagnetic wave shielding component obtained by heating and pressing using a hot press machine at 110 ° C., 30 kgf / cm ² for 30 minutes was used as Example 1 (the configuration of FIG. 2B).

Example 2 Preparation of Electromagnetic Wave Shielding Construct PE of Electromagnetic Shield Material 1 with No Geometric Drawing
The above-mentioned adhesive composition on the T film side has a dry coating thickness of 10
μm, and a composition which forms the above-mentioned infrared shielding layer on the non-reflection-treated surface of an anti-reflection-treated PET film (Realok 1300; trade name of NOF Corporation). Was applied to a dry coating thickness of 10 μm, and the adhesive surface of an adhesive film having infrared shielding properties was obtained using a roll laminator, and a commercially available acrylic plate (como glass; trade name, manufactured by Kuraray Co., Ltd., thickness 3 mm) ), An electromagnetic wave shielding component obtained by heating and pressing under the conditions of 110 ° C. and 20 kgf / cm ² was used as Example 2 (the configuration of FIG. 2C).

Example 3 Preparation of Electromagnetic Wave Shielding Structure An electromagnetic wave shielding structure obtained in the same manner as in Example 2 except that the electromagnetic wave shielding material 5 was used was referred to as Example 3 (FIG. 2).
(D) Configuration).

Example 4 Preparation of Electromagnetic Wave Shielding Structure An electromagnetic wave shielding structure obtained in the same manner as in Example 2 except that the electromagnetic wave shielding material 6 was used was designated as Example 4 (FIG. 2).
(E) Configuration).

Example 5 Production of Electromagnetic Wave Shielding Structure The film of the electromagnetic wave shielding structure obtained in Example 1 on which the frame portion, the side of the acrylic plate and the infrared shielding layer were formed was 23 m wide.
An electromagnetic wave shielding structure obtained by covering in a frame shape with m conductive tapes (CHO-FOIL CCH; trade name, manufactured by Taiyo Seimitsu Co., Ltd.) was used as Example 5 (FIG. 3B).

Example 6 Preparation of Electromagnetic Wave Shielding Structure In place of the conductive tape, a three-dimensional network structure having a width of 23 m was used.
Example 1 was made of foamed metal copper (manufactured by Hitachi Chemical Co., Ltd.) having a base skeleton of polyurethane foam having a thickness of 5 mm and a thickness of 5 mm.
The electromagnetic wave shielding structure obtained by covering the frame on which the frame portion of the electromagnetic wave shielding structure and the side of the acrylic plate obtained in the above and the infrared shielding layer were formed in a frame shape and crimping at room temperature and 5 kgf / cm ² was used. 6.

Example 7 Preparation of Electromagnetic Wave Shielding Structure Electromagnetic wave shielding obtained in the same manner as in Example 5 except that the conductive tape of Example 5 was covered so as to expose the metal of the frame portion by 5 mm. The structure was Example 7 (FIG. 3C).

Example 8 Production of Electromagnetic Wave Shielding Structure An electromagnetic wave shielding structure obtained by sticking the conductive tape of Example 5 so as to cover only the frame portion and the side portion of the acrylic plate was used. (FIG. 3D).

Example 9 Production of Electromagnetic Wave Shielding Structure Using the electromagnetic wave shielding structure obtained in Example 2, a film on which a frame portion of the electromagnetic wave shielding structure, a side portion of an acrylic plate, and an infrared shielding layer were formed was formed. 23mm wide conductive tape (CHO-
An electromagnetic wave shielding component obtained by covering in a frame shape with FOIL CCH (trade name of Taiyo Wire Mesh Co., Ltd.) was used as Example 9 (FIG. 3 (e)).

Example 10 Production of Electromagnetic Wave Shielding Structure
An electromagnetic wave shielding component obtained in the same manner as in Example 9 except that the electromagnetic wave shielding material 3 was used was used as Example 10 (FIG. 3 (f)).

Example 11 Preparation of Electromagnetic Wave Shielding Structure
An electromagnetic wave shielding component obtained in the same manner as in Example 5 except that the electromagnetic wave shielding material 4 was used was used as Example 11 (FIG. 3 (g)).

Example 12 Production of Electromagnetic Wave Shielding Structure
An electromagnetic wave shielding structure obtained in the same manner as in Example 5 except that the line width was changed from 25 μm to 35 μm was used as Example 12.

Example 13 Production of Electromagnetic Shielding Structure
The thirteenth embodiment was an electromagnetic wave shielding structure obtained by changing the line width from 25 μm to 12 μm and performing the same operation as in the fifth embodiment.

Example 14 Production of Electromagnetic Wave Shielding Structure
An electromagnetic wave shielding component obtained in the same manner as in Example 5 except that the line interval was changed from 250 μm to 500 μm was used as Example 14.

Example 15 Production of Electromagnetic Wave Shielding Structure
An electromagnetic wave shielding structure obtained in the same manner as in Example 5 except that the line interval was changed from 250 μm to 150 μm was used as Example 15.

Example 16 Production of Electromagnetic Wave Shielding Structure
Example 16 An electromagnetic wave shielding structure obtained in the same manner as in Example 5 except that a regular triangular repetitive pattern was manufactured instead of the lattice pattern formed in Electromagnetic wave shielding material manufacturing example 2 was used as Example 16. Note that the equilateral triangle is as shown in FIG.

Example 17 Production of Electromagnetic Wave Shielding Structure
Example 17 An electromagnetic wave shielding component obtained in the same manner as in Example 5 except that a repetitive pattern consisting of a regular octagon and a square was manufactured instead of the lattice pattern formed in Example 2 of manufacturing the electromagnetic wave shielding material was set as Example 17. Note that the regular octagon and square repetition patterns are as shown in FIG.

(Comparative Example 1) In place of copper foil, an ITO deposited PET in which an ITO film was entirely deposited at 2,000Å was used.
Without forming a pattern, an adhesive composition having a thickness of 5 μm is applied to a film on the opposite side to the deposition surface, and a commercially available acrylic plate (como glass; manufactured by Kuraray Co., Ltd., 3 mm in thickness)
A conductive tape having a width of 23 mm was formed on the frame part and the side part and the peripheral part of the acrylic plate obtained by heat-pressing using a hot press machine at 110 ° C., 30 kgf / cm ² for 30 minutes. An electromagnetic wave shielding component obtained by covering in a frame shape with CHO-FOIL CCH (trade name of Taiyo Wire Mesh Co., Ltd.) was used as Comparative Example 1.

Comparative Example 2 In the same manner as in Comparative Example 1, an adhesive composition having a thickness of 5 μm was applied to the film on the opposite side of the deposition surface without forming a pattern with the entire surface being aluminum deposited (200 °) instead of ITO. An electromagnetic wave shielding component obtained in the same manner as in Comparative Example 1 was used as Comparative Example 2.

(Comparative Example 3) Electromagnetic wave shielding material production example 1
The electromagnetic wave shielding component obtained in the same manner as in Example 2 was used as Comparative Example 3 except that a negative film having only a geometric figure was used as the PET film with a copper foil obtained in Step 2.

The aperture ratio, electromagnetic wave shielding property, visible light transmittance, invisibility, infrared ray shielding rate, and adhesive strength of the mesh of the electromagnetic wave shielding component obtained as described above were measured. The results are shown in Tables 1 and 2.

The electromagnetic wave shielding properties were measured by using a spectrum analyzer MS2601B and a standard signal generator MG3.
602B, measuring cell MA8602B (trade name of ADVANTEST CORPORATION), frequency range 10 MH
The electromagnetic wave shielding property between z to 1 GHz was measured and 100
The values of MHz and 1 GHz are shown as representative values. The visible light transmittance was measured using a double beam spectrophotometer (Hitachi, Ltd., Model 200-10) for 400 to 700 n.
The average value of the transmittance in the region of m was used. The invisibility is evaluated by visually observing the electromagnetic wave shielding component in which an electromagnetic wave shielding material is attached to an acrylic plate from a distance of 0.5 m, and evaluating whether or not the geometric figure formed of the conductive metal can be recognized. Those that could not be evaluated were rated good, and those that could be recognized were rated NG. The measurement of the infrared shielding factor was performed using a double beam spectrophotometer (U-3410, Hitachi, Ltd.).
The average value of the infrared shielding factor in the range of 0 to 1, 100 nm was used. The adhesive force was measured using a tensile tester (trade name, Tensilon UTM-4-100, manufactured by Toyo Baldwin Co., Ltd.) at a width of 10 mm, a direction of 90 °, and a peeling speed of 50 mm / min.

[0076]

[Table 1]

[0077]

[Table 2]

A conductive picture frame having a geometrical figure drawn by the conductive metal of the present invention and having a conductive figure electrically connected to the geometrical figure is formed around the geometrical figure drawn by the conductive metal. The example having a better electromagnetic wave shielding property than the comparative example 3 having no frame portion. In the embodiment, FIG.
In Examples 1, 2, 3, and 4 corresponding to the configurations of (b), (c), (d), and (e), respectively, the electromagnetic wave shielding property was 35.
Although it is about 42 dB, Examples 5 to 11 of the configuration shown in FIG. 3 in which the frame is provided have the same aperture ratio and visible light transmittance, and the electromagnetic wave shielding property is 42 to 52 dB, which is excellent in the shielding effect. The line width of the geometric figure of Example 12 is 25 μm
When the thickness is reduced to 35 μm from (Example 5), the aperture ratio is reduced from 81% to 74%, and the visible light transmittance is also reduced from 62% to 56%. I do. Similarly, in Example 13, the line width is set to 25.
When the thickness is changed from μm (Example 5) to 12 μm, the aperture ratio is 81%.
To 91%, and the visible light transmittance from 62% to 70%
However, since the area of the conductive metal is reduced, the electromagnetic wave shielding property is reduced. Example 14 has a line spacing of 250
μm (Example 5) to 500 μm,
The aperture ratio and the light transmittance are improved, but the electromagnetic wave shielding performance is reduced. Similarly, in Embodiment 15, the line interval is set to 25.
0 μm (Example 5) to 125 μm,
The aperture ratio and the light transmittance are reduced, and the electromagnetic wave shielding property is improved. As described above, the tendency was exhibited by changing the line width and the line interval drawn with the conductive metal. However, the geometric figure of the electromagnetic wave shielding material has a line width of 4 mm.
A conductive metal having a line thickness of 0 μm or less, a line interval of 100 μm or more, and a line thickness of 40 μm or less showed preferable values. Comparative Examples 1 and 2 are cases where ITO or Al was deposited.
Poor electromagnetic shielding. The present invention, as shown in FIG. 2, has a geometrical figure drawn with a conductive metal, and electrically connects to the geometrical figure around the geometrical figure drawn with the conductive metal. The electromagnetic wave shielding property is excellent by having the frame part having the property, and the electromagnetic wave shielding property is further improved by covering the frame part with the frame part as shown in FIG.

<Electromagnetic Wave Shielding Film Production Example 7; Example> A polyethylene terephthalate film (Diahard EX-205; trade name, manufactured by Reiko Co., Ltd.) having a thickness of 50 μm and subjected to an antiglare treatment was used as a plastic film. On this film, a thickness of 0.
A 5 μm silver thin film was formed, and then a 10 μm thick copper layer was formed by electrolytic plating. P with copper foil obtained
On the copper layer of the ET film, a screen printing machine [LS, with alignment device, manufactured by Neurong Seimitsu Kogyo Co., Ltd.]
-34GX), nickel alloy meshless metal plate (manufactured by Mesh Kogyo Co., Ltd., thickness 50 μm, pattern size 8 mm × 8 mm) and permalex metal squeegee (Tome Kogyo Co., Ltd. import product)]. (Trade name, RAYCAST)
The grid pattern (line width 40 μm, line pitch 250 μm)
Then, after baking at 90 ° C. for 10 minutes, ultraviolet rays were irradiated at 70 mJ / cm 2 using a high-pressure mercury lamp. Thereafter, through a process of chemical etching of the metal layer and a resist stripping process, a geometric pattern having a line width of 25 μm and a line interval of 250 μm and a copper lattice pattern having a 10 mm width frame on the outer periphery of the geometric pattern are formed. PET)
Formed on film. Then, sodium chlorite 3
In an aqueous solution of 1 g / l, trisodium phosphate 12 g / l, and sodium hydroxide 15 g / l, the surface of copper was blackened by treating at 95 ° C. for 2 minutes to obtain an electromagnetic wave shielding film 7 (FIG. 1 ( Configuration of b)).

<Embodiment 8 of Electromagnetic Wave Shielding Film: Example> The frame portion of the electromagnetic wave shielding film 1 was measured from the PET film side using IMPACT500 (trade name, manufactured by Sumitomo Heavy Industries, Ltd.) at a voltage of 20 kV and a frequency of 15
Perform laser processing under the conditions of 0 Hz and scan speed of 200 mm / min to remove the PET film on the frame,
An electromagnetic wave shielding film 8 was obtained (the configuration of FIG. 1C).

<Example 9 of Producing Electromagnetic Wave Shielding Film; Example> PET film subjected to antireflection treatment (Realak 1300; trade name, manufactured by NOF CORPORATION, thickness: 50 μm)
An adhesive film prepared by applying the adhesive composition used in Example 7 for preparing an electromagnetic wave shielding film so as to have a dry coating thickness of 20 μm on the surface not subjected to the antireflection treatment of the electromagnetic wave shielding film 1 180 ° C, 30kg so as not to cover all the frame on the geometric figure
The laminate was heated and laminated under the condition of f / cm, and bonded to obtain an electromagnetic wave shielding film 9 (the configuration of FIG. 1D).

<Electromagnetic Wave Shielding Film Production Example 10: Example> A 0.2 μm thick aluminum thin film was formed on a 25 μm thick transparent PET film by vapor deposition, and then a 15 μm thick copper layer was formed by electrolytic plating. Formed. 30 m width on the outer periphery of the obtained PET film with copper foil
A copper grid pattern (conducting) having a line width of 25 μm, a line interval of 250 μm, and a frame portion of 30 mm was formed on the PET film in the same manner as in Example 7 of producing an electromagnetic wave shielding film so that a frame portion of m could be formed. P for picture frame
Electromagnetic wave shielding film 1 folded to ET film side
0 was obtained (the configuration of FIG. 1 (e)).

<Electromagnetic Wave Shielding Film Production Example 11: Example> An electroless nickel plating was formed in a grid pattern on a 50 μm thick PET film using a mask layer to form a line having a width of 12 μm, a line interval of 200 μm, and a thickness of 2 μm.
A nickel grid pattern of μm was formed on a PET film, and a conductive tape (C
HO-FOIL CCH; trade name of Taiyo Wire Mesh Co., Ltd.)
Was pasted at a width of 15 mm to form a frame portion, and an electromagnetic wave shielding film 11 was obtained (the configuration of FIG. 1F). The nickel lattice pattern itself and the nickel lattice pattern are electrically connected to the frame.

<Example 12 of Producing Electromagnetic Wave Shielding Film; Example> Using the PET film with copper foil obtained in Example 7 of producing electromagnetic wave shielding film, using a negative film having only a geometrical figure without a frame portion, an electromagnetic wave shielding film was produced. In the same manner as in Example 7, the line width is 25 μm, and the line interval is 2
A copper grid pattern of 50 μm was formed on a PET film, and a foamed metal copper (manufactured by Hitachi Chemical Co., Ltd., thickness: 5 mm) having a polyurethane skeleton as a base skeleton was formed on the periphery of the surface having the geometrical figure at room temperature and 5 kgf / At a pressure of cm 2, the frame was formed by pasting to a width of 15 mm to obtain an electromagnetic wave shielding film 12 (the configuration of FIG. 1 (g)).

Example 18 Preparation of Electromagnetic Wave Shielding Structure
PET film with anti-reflection treatment
00; trade name of Nippon Yushi Co., Ltd.) having an infrared shielding property obtained by applying the above-mentioned composition for forming an infrared shielding layer to a surface not subjected to the antireflection treatment so as to have a dry coating thickness of 10 μm. A commercially available acrylic plate (como glass; Kuraray Co., Ltd., 3 m thick)
m), by applying heat and pressure using a hot press under the conditions of 110 ° C., 30 kgf / cm ² , and 30 minutes, to obtain an electromagnetic wave shielding component (the configuration of FIG. 2B).

(Example 19: Production of electromagnetic wave shielding structure)
A surface of the electromagnetic wave shielding film 7 where the above-described adhesive composition is applied to the PET film side where the geometrical figure is not drawn so that the dry application thickness is 10 μm, and a PET film (Realok 1300; The composition which forms the above-mentioned infrared shielding layer on the surface of the non-reflection-treated surface of Nippon Yushi Co., Ltd., which has not been subjected to an anti-reflection treatment, has a dry coating thickness of 10
Using a roll laminator with the adhesive surface of the adhesive film having infrared shielding properties obtained by applying so as to be μm,
110 ° C., 20 kgf / c on both sides of a commercially available acrylic plate (como glass; trade name of Kuraray Co., Ltd., thickness 3 mm)
electromagnetic shielding structure was heated and pressed under the conditions of m ² (FIG. 2
(Configuration (c)) was obtained.

Example 20 Production of Electromagnetic Wave Shielding Structure
Except that the electromagnetic wave shielding film 11 was used, an electromagnetic wave shielding structure (the structure of FIG. 2D) was obtained in the same manner as in Example 19.

Example 21 Production of Electromagnetic Shielding Structure
Except that the electromagnetic wave shielding film 12 was used, an electromagnetic wave shielding structure (the structure of FIG. 2E) was obtained in the same manner as in Example 19.

Example 22 Production of Electromagnetic Wave Shielding Structure
The film on which the frame portion of the electromagnetic wave shielding structure obtained in Example 18, the side portion of the acrylic plate, and the infrared shielding layer were formed was formed to have a width of 2
It was covered in a frame with a 3 mm conductive tape (CHO-FOIL CCH; trade name, manufactured by Taiyo Mesh Co., Ltd.) to obtain an electromagnetic wave shielding structure (FIG. 3B).

Example 23 Production of Electromagnetic Shielding Structure
23m width which is a three-dimensional network structure instead of conductive tape
Example 1 was made of foamed metal copper (manufactured by Hitachi Chemical Co., Ltd.) having a base skeleton of polyurethane foam having a thickness of 5 mm and a thickness of 5 mm.
The frame of the electromagnetic wave shielding structure obtained in the above, the side of the acrylic plate, and the film on which the infrared shielding layer was formed were covered in a frame shape, and pressed at room temperature and 5 kgf / cm ² to obtain an electromagnetic wave shielding structure.

Example 24 Production of Electromagnetic Shielding Structure
An electromagnetic wave shielding component (the configuration of FIG. 3C) was obtained in the same manner as in Example 22 except that the conductive tape of Example 22 was covered so as to expose the metal of the frame portion by 5 mm.

(Example 25: Preparation of electromagnetic wave shielding structure)
The conductive tape of Example 22 was adhered so as to cover only the frame portion and the side portion of the acrylic plate to form an electromagnetic wave shielding structure (FIG. 3).
(D).

Example 26 Production of Electromagnetic Wave Shielding Structure
Using the electromagnetic wave shielding structure obtained in Example 19, a film on which the frame portion of the electromagnetic wave shielding structure, the side portion of the acrylic plate, and the infrared shielding layer were formed was electrically conductive tape (CH) having a width of 23 mm.
It was covered with O-FOIL CCH (trade name, manufactured by Taiyo Mesh Co., Ltd.) in a frame shape to obtain an electromagnetic wave shielding structure (the structure of FIG. 3E).

Example 27 Production of Electromagnetic Shielding Structure
Except that the electromagnetic wave shielding film 9 was used, an electromagnetic wave shielding structure (the structure of FIG. 3F) was obtained in the same manner as in Example 26.

Example 28 Production of Electromagnetic Wave Shielding Structure
Except that the electromagnetic wave shielding film 10 was used, an electromagnetic wave shielding structure (the structure of FIG. 3 (g)) was obtained in the same manner as in Example 22.

Example 29 Production of Electromagnetic Wave Shielding Structure
An electromagnetic wave shielding member was obtained in the same manner as in Example 22 except that the line width was changed from 25 μm to 35 μm.

Example 30 Production of Electromagnetic Wave Shielding Structure
An electromagnetic wave shielding component was obtained in the same manner as in Example 22 except that the line width was changed from 25 μm to 12 μm.

Example 31 Production of Electromagnetic Wave Shielding Structure
An electromagnetic wave shielding member was obtained in the same manner as in Example 22 except that the line interval was changed from 250 μm to 300 μm.

Example 32 Production of Electromagnetic Wave Shielding Structure
An electromagnetic wave shielding structure was obtained in the same manner as in Example 22 except that the line interval was changed from 250 μm to 150 μm.

Example 33 Production of Electromagnetic Shielding Structure
An electromagnetic wave shielding structure was obtained in the same manner as in Example 22 except that a regular triangular repeating pattern was manufactured instead of the lattice pattern formed in the electromagnetic wave shielding film manufacturing example 8. Note that the equilateral triangle is as shown in FIG. The conductive layer is conductive.

Example 34 Production of Electromagnetic Wave Shielding Structure
An electromagnetic wave shielding structure was obtained in the same manner as in Example 22 except that a repetitive pattern consisting of a regular octagon and a square was manufactured instead of the lattice pattern formed in the electromagnetic wave shielding film manufacturing example 8. Note that the regular octagon and square repetition patterns are as shown in FIG. The conductive layer is conductive.

(Comparative Example 4) Instead of the aluminum vapor-deposited layer and the copper-plated layer, ITO-deposited PET in which an ITO film was entirely deposited at 2,000Å was used.
An adhesive composition having a thickness of 5 μm is applied to the film on the side opposite to the vapor-deposited surface, and is applied to a commercially available acrylic plate (como glass; Kuraray Co., Ltd., thickness 3 mm) at 110 ° C. and 30 kgf / c.
A conductive tape (CHO-FO) having a width of 23 mm was applied to the frame portion and the side and peripheral portion of the electromagnetic wave shielding structure and the acrylic plate obtained by thermocompression bonding using a hot press under the conditions of m ² and 30 minutes.
(ILCCH; trade name, manufactured by Taiyo Wire Mesh Co., Ltd.) to obtain an electromagnetic wave shielding structure.

(Comparative Example 5) As in Comparative Example 4, instead of ITO, a 5 μm-thick adhesive composition was applied to the film on the opposite side to the deposition surface without forming a pattern while aluminum deposition (200 °) was performed on the entire surface. Thus, an electromagnetic wave shielding component was obtained in the same manner as in Comparative Example 4.

(Comparative Example 6) The electromagnetic wave shielding structure was the same as in Example 19 except that the PET film with the copper foil obtained in Production Example 7 of the electromagnetic wave shielding film was formed with a geometric figure so as not to have a frame portion. I got a body.

The aperture ratio, electromagnetic wave shielding property, visible light transmittance, invisibility, and infrared ray shielding rate of the mesh of the electromagnetic wave shielding structure obtained as described above were measured. The results are shown in Tables 3 and 4.

The electromagnetic wave shielding properties were measured by using a spectrum analyzer MS2601B and a standard signal generator MG3.
602B, measuring cell MA8602B (trade name of ADVANTEST CORPORATION), frequency range 10 MH
The electromagnetic wave shielding property between z to 1 GHz was measured and 100
The values of MHz and 1 GHz are shown as representative values. The visible light transmittance was measured using a double beam spectrophotometer (Hitachi, Ltd., Model 200-10) for 400 to 700 n.
The average value of the transmittance in the region of m was used. The non-visibility is evaluated by seeing the electromagnetic wave shielding film on the acrylic plate from a place 0.5 m away and recognizing the geometrical figure formed of the conductive metal. Those were NG. The measurement of the infrared shielding factor is performed using a double beam spectrophotometer (Hitachi, Ltd., U.S.A.)
-3410), the average value of the infrared shielding ratio in the region of 900 to 1,100 nm was used.

[0107]

[Table 3]

[0108]

[Table 4]

A geometrical figure drawn with the conductive metal of the present invention has a conductive frame electrically connected to the geometrical figure around the geometrical figure drawn with the conductive metal. The example having a better electromagnetic wave shielding property than the comparative example 6 having no frame portion. In the embodiment, FIG.
In Examples 18 to 21 corresponding to the configurations of (b), (c), (d), and (e), the electromagnetic wave shielding properties were 35 to 4 respectively.
Although it is about 2 dB, Examples 22 to 28 having the structure shown in FIG. 3 provided with the frame have the same aperture ratio and visible light transmittance, and have excellent electromagnetic wave shielding properties of 42 to 52 dB, which is excellent in the shielding effect. When the line width of the geometric figure of Example 29 is changed from 25 μm (Example 22) to 35 μm, the aperture ratio is changed from 81% to 7%.
The visible light transmittance also decreases from 62% to 56%, but the electromagnetic wave shielding property improves as the area of the conductive metal increases. Similarly, in Example 30, the line width was 25 μm.
m (Example 22) to 12 μm results in an aperture ratio of 81%
To 91%, and the visible light transmittance from 62% to 70%
However, since the area of the conductive metal is reduced, the electromagnetic wave shielding property is reduced. In Example 31, the line interval is set to 250.
In the case where the thickness is changed from μm (Example 22) to 300 μm, the aperture ratio and the light transmittance are improved, but the electromagnetic wave shielding property is reduced. Similarly, in Example 32, the line interval was set to 2
In this case, the aperture ratio and the light transmittance are reduced, and the electromagnetic wave shielding property is improved. Thus, by changing the line width and the line interval drawn by the conductive metal, the tendency was shown, but the geometric figure of the electromagnetic wave shielding film has a line width of 40 μm or less, a line interval of 100 μm or more, A conductive metal having a line thickness of 40 μm or less showed a preferable value. Comparative Examples 3 and 4, in which ITO and Al were deposited, were inferior in electromagnetic wave shielding properties. The present invention, as shown in FIG. 2, has a geometrical figure drawn with a conductive metal, and electrically connects to the geometrical figure around the geometrical figure drawn with the conductive metal. The electromagnetic wave shielding property is excellent by having the frame part having the property, and the electromagnetic wave shielding property is further improved by covering the frame part with the frame part as shown in FIG.

[0110]

The electromagnetic wave shielding material obtained by the present invention increases the contact area with the external electrode for grounding, improves the connection with the external electrode for grounding, and has excellent adhesion. There is no electromagnetic wave leakage and the shielding function is particularly good over a wide frequency band. In addition, it is preferable that the frame portion is formed of a conductive metal because the contact resistance between the geometrical figure drawn with the conductive metal and the conductive frame portion located on the outer periphery of the geometrical figure can be reduced. Also, by exposing at least a part of the frame,
It is possible to provide an electromagnetic wave shielding film that can be grounded from the side of the plastic support, and the connection method has a higher tolerance. Also, if a laser is used to remove part or all of the plastic support, it will be excellent in workability and mass productivity,
And since it is a dry process, the process can be simplified. Further, if at least a part of the frame portion is exposed, part or all of the plastic film is formed by using sandblasting, so that workability and mass productivity are excellent.

By laminating a transparent layer on at least a part of the geometrical figure and the frame, the geometrical figure can be protected. By bending the frame part to expose the conductive layer of the frame part on the plastic support side,
The connection with the external electrode for grounding can be improved by a simple method. By attaching a conductive tape to the outer periphery of the geometric figure to form a frame, it is possible to increase the contact area with the external electrode for grounding and improve the connection with the external electrode for grounding. it can. By forming a conductive three-dimensional network structure on the outer periphery of the geometric figure and forming a frame, the contact area with the external electrode for grounding is increased, and the connection with the external electrode for grounding is improved. Can be By setting the width of the frame portion in the range of 1 to 40 mm, it is possible to make a good connection with an external electrode for grounding.

By forming a geometric figure formed of a conductive metal on a plastic support with a conductive metal on a surface of a plastic support by providing a conductive metal by using a screen printing method, the processability is excellent. . Since the material of the conductive layer is made of copper and at least the surface thereof is blackened, it is possible to provide an electromagnetic wave shielding material having low fading and high contrast. By using a plastic support as a plastic film, in particular, a polyethylene terephthalate film or a polycarbonate film, an electromagnetic shielding film having excellent transparency, low cost, good heat resistance, excellent handling properties, and excellent infrared shielding properties and an infrared shielding property. Can be provided. By setting the line width of the geometrical figure drawn by the conductive metal to 40 μm or less, the line interval to 100 μm or more, and the line thickness to 40 μm or less, an electromagnetic wave shield excellent in transparency and invisibility can be obtained. By using copper, aluminum or nickel having a thickness of 0.5 to 40 μm for the conductive layer, the workability and the adhesion are excellent, and the electromagnetic wave shielding property and the invisibility are also excellent. By including an infrared absorbing agent in any of the layers constituting the electromagnetic wave shielding material, the layer can have infrared shielding properties.

By providing the above-mentioned electromagnetic wave shielding material on at least one surface of the plastic plate, it is possible to produce an electromagnetic wave shielding structure which is excellent in transparency and invisibility and has little warpage. Transparency and invisibility by providing the plastic plate with the surface on which the conductive geometric figure of the electromagnetic wave shielding material is drawn on one side of the plastic plate, and providing the plastic film on the other side via an adhesive layer It is possible to produce an electromagnetic wave shielding component having excellent warpage and less warpage. The electromagnetic wave shielding film is provided on one surface of a plastic plate, and the conductive frame is deformed so as to be bent, so that the frame reaches the opposite surface of the plastic plate. Excellent in properties and less warpage. By applying conductive tape to a part of the frame of the electromagnetic wave shielding material of the electromagnetic wave shielding structure, it is possible to reduce electromagnetic wave leakage due to good contact with external electrodes for grounding, to have a simple installation and to have an excellent appearance. An electromagnetic shielding structure can be made. By making the conductive three-dimensional network structure contact at least the frame part of the electromagnetic wave shielding material of the electromagnetic wave shielding structure, it is possible to reduce electromagnetic wave leakage due to good contact with an external electrode for grounding, and to simplify the operation. It is possible to produce an electromagnetic wave shielding component having an excellent appearance. Electromagnetic wave shielding material, plastic plate,
By using an electromagnetic wave shielding structure containing an infrared absorber in at least one of the plastic films,
It can have an electromagnetic wave shielding property and an infrared ray shielding property. An anti-glare or anti-reflection treatment can be applied to the surface of the plastic support or the surface of the plastic plate or plastic film of the electromagnetic wave shielding material provided on the plastic plate constituting the electromagnetic wave shielding structure, thereby imparting anti-glare or anti-reflection properties. . By providing the electromagnetic wave shielding structure in which a frame is provided around the periphery of the electromagnetic wave shielding structure so as to be in contact with the frame portion, leakage of the electromagnetic wave can be prevented, the electromagnetic wave shielding property is excellent, and the appearance can be improved.

By using the electromagnetic wave shielding material of the present invention for a display, it has electromagnetic wave shielding properties and transparency, reduces electromagnetic wave leakage, has excellent infrared ray shielding properties, and is well connected to external electrodes for grounding. Can be made. By using the electromagnetic wave shielding structure of the present invention for a display, it has electromagnetic wave shielding properties and transparency, reduces leakage of electromagnetic waves, has excellent infrared shielding properties, and can be well connected to external electrodes for grounding. A display that can be manufactured can be manufactured. The electromagnetic wave shielding film and the electromagnetic wave shielding structure of the present invention,
Because of its excellent electromagnetic shielding properties and transparency, it is required to have transparency, especially windows and housings that can be used to generate electromagnetic waves in addition to displays, or to protect the inside of measuring equipment, measuring instruments, and manufacturing equipment. It can be used by providing it in a part like a window.

[Brief description of the drawings]

FIG. 1 shows an electromagnetic wave shielding material of the present invention, wherein (a)
Is a front view of the electromagnetic wave shielding film, and (b) to (g).
Shows a sectional view.

FIG. 2 shows an electromagnetic wave shielding structure of the present invention, wherein (a) is a perspective view and (b) to (e) are cross-sectional views.

3A and 3B show an electromagnetic wave shielding structure of the present invention, wherein FIG. 3A is a perspective view, and FIGS. 3B to 3G are cross-sectional views.

FIGS. 4A and 4B are explanatory diagrams of a geometric figure drawn with a conductive metal of the present invention.

[Explanation of symbols]

 1. 1. conductive frame 2. Geometric figures drawn with conductive metal Plastic film4. 4. adhesive layer or metal thin film Transparent layer 6. Conductive material 7. 7. Conductive three-dimensional network structure Electromagnetic wave shielding film 10. Electromagnetic wave shielding structure 11. Plastic plate 12. 12. layer of adhesive Plastic film 21. Frame

 ──────────────────────────────────────────────────の Continuing on the front page (72) Inventor Hiroyuki Hagiwara 1500 Ogawa Ogawa, Shimodate City, Ibaraki Prefecture Inside the Hitachi Chemical Co., Ltd. F term in the company research institute (reference) 5E321 AA04 BB23 BB41 BB44 BB53 CC16 GG01 GG05 GG07 GH01 5G435 AA00 AA12 AA16 AA17 BB02 BB05 BB06 BB12 GG33 GG34 HH02 HH12 KK07

Claims (22)

[Claims] 1. An electromagnetic wave shielding material comprising a plastic support, on which a conductive layer of a geometric pattern is laminated or buried, and further comprising a conductive frame electrically connected to the conductive layer. 2. The electromagnetic wave shielding material according to claim 1, wherein the frame portion is formed of the same material as the conductive layer of the geometric figure. 3. The electromagnetic wave shielding material according to claim 1, wherein all or a part of the frame portion is laminated or embedded in the plastic support. 4. The electromagnetic wave shielding material according to claim 1, wherein the frame portion is provided on all or a part of the periphery of the electromagnetic wave shielding material. 5. The conductive layer according to claim 1, wherein the conductive layer is made of a conductive metal.
5. The electromagnetic wave shielding material according to any one of items 1 to 4. 6. The electromagnetic wave shielding material according to claim 1, wherein the conductive frame portion is formed using a conductive tape. 7. The conductive three-dimensional network structure according to claim 1, wherein the conductive frame electrically connected to the conductive layer of the geometric figure is a conductive three-dimensional network formed on the outer periphery of the geometric figure. Electromagnetic wave shielding material as described. 8. The width of a conductive frame electrically connected to a conductive layer of a geometric figure is 1 to 40 mm.
8. The electromagnetic wave shielding material according to any one of 1 to 7. 9. The electromagnetic wave shielding material according to claim 1, wherein the material of the conductive layer is copper, and at least the surface thereof is blackened. 10. The electromagnetic wave shielding material according to claim 1, wherein the plastic support is a plastic film. 11. The conductive layer of a geometric figure has a line width of 40.
μm or less, line spacing 100 μm or more, line thickness 40
The electromagnetic wave shielding material according to any one of claims 1 to 10, which has a thickness of not more than μm. 12. The conductive layer of a geometric figure has a thickness of 0.5 to 0.5.
The electromagnetic wave shielding material according to any one of claims 1 to 11, wherein the material is 40 µm of copper, aluminum, or nickel. 13. The electromagnetic wave shielding material according to claim 1, wherein no adhesive layer is present on the plastic support. 14. The electromagnetic wave shielding material according to claim 1, wherein a layer of an adhesive is present on the plastic support. 15. The electromagnetic wave according to claim 14, wherein a transparent layer is laminated on the conductive layer side with an adhesive layer interposed between a portion of the geometrical figure formed by the conductive layer and a part of a frame portion continuous with the portion. Shield material. 16. An electromagnetic wave shielding structure obtained by laminating the electromagnetic wave shielding material according to claim 1 on at least one surface of a plastic plate. 17. The method according to claim 1, wherein one side of the plastic plate is provided.
5. An electromagnetic wave shielding structure obtained by laminating the electromagnetic wave shielding material according to any one of items 5 and a plastic film on the other surface. 18. The method according to claim 1, wherein one side of the plastic plate is provided.
5. An electromagnetic wave shielding structure, wherein the electromagnetic wave shielding material according to any one of the above items 5 is laminated, and the conductive frame portion thereof reaches the opposite surface of the plastic plate. 19. The electromagnetic wave shielding structure according to claim 16, wherein the surface of the plastic support or the plastic plate of the electromagnetic wave shielding material is subjected to an antiglare treatment or an antireflection treatment. 20. The electromagnetic wave shielding structure according to claim 16, wherein a frame is provided around the electromagnetic wave shielding structure so as to be in contact with the frame of the electromagnetic wave shielding material. 21. A display using the electromagnetic wave shielding material according to claim 1. 22. A display using the electromagnetic wave shielding structure according to any one of claims 16 to 20.