JP2000277380A - Multi-layer type multilayer ceramic capacitor - Google Patents

Abstract

[57] [Abstract] [Problem] To secure the reliability of connection between an internal electrode and an external electrode, prevent short circuit between adjacent external electrodes, and prevent intrusion of plating solution from the gap between the effective layer and the internal electrode. It is another object of the present invention to provide a highly reliable multi-layer ceramic capacitor in which the insulation resistance of each multilayer ceramic capacitor is prevented from deteriorating. SOLUTION: A plurality of parallel concave portions 5a on the same plane.
, And a plurality of dielectric ceramic layers as effective layers are alternately laminated, and a plurality of laminated ceramic capacitors 11a to 11d are juxtaposed at predetermined intervals in a parallel direction inside a single element body. In the multiple-layered multilayer ceramic capacitor, every other one of the internal electrodes 4a is arranged in a staggered manner in the longitudinal direction, and the ends of the concave portions 5a of the internal electrodes 4a are alternately opposed to each other. A plurality of pairs of external electrodes 10a which are respectively exposed on the side surfaces 9 and are electrically connected to each other so as to cover the entire exposed end portions are formed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multilayer ceramic capacitor in which a plurality of multilayer ceramic capacitors are formed in a single body.

[0002]

2. Description of the Related Art A conventional multiple-layer ceramic capacitor 27 will be described with reference to the drawings.

FIG. 11 is an exploded perspective view of a conventional green block 21 for a multiple-layer ceramic capacitor 27, FIG. 12 is a perspective view of the same green block 21, and FIG. FIG. 14 is a partially cutaway perspective view of a completed product of the multiple-layer ceramic capacitor 27, and FIG. 15 is a plan sectional view of a completed product of the multiple-layer ceramic capacitor 27. In the figure, 17 is a green sheet, 18 is an upper ineffective layer, 19 is a lower ineffective layer, 20 is an internal electrode, 22 is a cutting line, 24 is an outer surface, 25 is an external electrode, and 26a to 26d are multilayer ceramic capacitors.

First, a green sheet 17 made of a dielectric ceramic is manufactured by using a known method of manufacturing a multilayer ceramic capacitor. Next, the prepared green sheet 1
7 are stacked to form an upper ineffective layer 18 and a lower ineffective layer 19.

[0005] Next, a green sheet 17 is laminated on the lower invalid layer 19 surface, and a first layer of internal electrodes 20 is printed on the upper surface thereof as shown in FIG. 11, and then the green sheet 17 is laminated thereon. This is the first effective layer. Subsequently, a second-layer internal electrode 20 that is to be paired with the first-layer internal electrode 20 is printed on the surface with a predetermined displacement, and a green sheet 17 is further laminated thereon to form a second-layer effective layer. And Furthermore, the same third-layer internal electrode 20 as the first-layer electrode that is to be paired with the second-layer internal electrode 20 is printed on that surface, and a green sheet 17 is laminated thereon to form a third-layer internal electrode 20. An effective layer. Subsequently, after the same internal electrode 20 as the second layer is printed on the upper surface, the green sheet 17 is laminated thereon. After a plurality of green sheets 17 and internal electrodes 20 are sequentially and alternately stacked in this manner, the upper ineffective layer 18 is finally stacked under pressure to manufacture a green block 21 shown in FIG.

[0006] The green block 21 is cut along the cutting line 2.
2 along the green chip 2 shown in FIG.
After that, firing is performed at a predetermined temperature to produce a sintered body (not shown). The obtained sintered body was subjected to barrel polishing, and one end of each of the internal electrodes 20 formed inside the sintered body was exposed to the opposite outer surface 24 of the sintered body. A paste for forming the external electrodes 25 is applied so as to cover the group of internal electrodes 20 and is baked. Further, the surface of the baked external electrodes 25 is plated, and the four laminated ceramic capacitors 26a to 26d are formed as shown in FIG. Are completed in a single body to complete a multi-layered multilayer ceramic capacitor 27.

[0007]

However, as shown in FIG. 15, in the conventional multi-layer monolithic ceramic capacitor 27, as shown in FIG. The external electrode 25 is formed so as to be exposed on the same outer surface 24 of the multilayer ceramic capacitor 27 and to cover the entire exposed end. Therefore, the outer surface 24 where one end of the adjacent internal electrode 20 is exposed has a narrow contact area between the effective layers separating the multilayer ceramic capacitors 26a to 26d, and covers the entire end of the exposed internal electrode 20. When the external electrodes 25 are formed as described above, the distance between the adjacent external electrodes 25 is narrow, and short-circuits occur between the external electrodes 25. Also, when the completed product is mounted on a circuit board, a short-circuit due to a solder bridge easily occurs. This is the internal electrode 20
When the external electrode 25 is formed more narrowly, the reliability of the connection between the external electrode 25 and the internal electrode 20 is reduced, and the internal electrode 20 and the multilayer ceramic capacitors 26a to 26d are separated when the surface of the external electrode 25 is plated. There is a problem that the plating solution infiltrates through the gaps between the effective layers and deteriorates the insulation resistance between the multilayer ceramic capacitors 26a to 26d.

The present invention solves the above-mentioned conventional problems and prevents the intrusion of the plating solution between adjacent multilayer ceramic capacitors, prevents the insulation resistance from deteriorating, and ensures the reliability of the connection between the internal electrode and the external electrode. It is another object of the present invention to provide a highly reliable multilayer ceramic capacitor in which a short circuit does not occur between external electrodes.

[0009]

SUMMARY OF THE INVENTION In order to achieve the above object, the present invention provides an internal electrode having a plurality of juxtaposed concave portions on the same plane and a dielectric ceramic layer as an effective layer which is alternately laminated in a plurality of layers. In a multiple-layer monolithic ceramic capacitor in which a plurality of monolithic ceramic capacitors are juxtaposed at predetermined intervals in a parallel direction inside a single element body, the internal electrodes are arranged in a staggered manner in the longitudinal direction every other one. ,
By alternately exposing the end portions of the crimped portion of the internal electrode to the opposite outer surfaces of the element body alternately, forming a plurality of pairs of external electrodes so as to cover the entire exposed end portion However, on the outer surface where the adjacent internal electrodes are exposed, the contact area between the effective layers separating the multilayer ceramic capacitors is increased, and furthermore, the external electrodes are formed so as to cover the entire crevices of the internal electrodes exposing the external electrodes. Even if the width of the electrode is narrow, the reliability of the connection with the internal electrode is ensured, and when plating the surface of the external electrode, the plating solution is removed from the gap between the cracked portion and the effective layer separating each multilayer ceramic capacitor. It can prevent intrusion.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The invention according to claim 1 of the present invention is characterized in that a plurality of internal electrodes having a plurality of juxtaposed concave portions on the same plane and a plurality of dielectric ceramic layers as effective layers are alternately laminated, In a multiple-layered multilayer ceramic capacitor in which a plurality of multilayer ceramic capacitors are juxtaposed at a predetermined interval in a parallel direction inside a single element body, the internal electrodes are arranged in a staggered manner in the longitudinal direction every other one, A plurality of pairs of external electrodes that are electrically connected to each other by alternately exposing the end portions of the crimp portion of the internal electrode to the opposing outer surfaces of the element body alternately and alternately so as to cover the entire exposed end portion With this configuration, the adjacent internal electrodes are alternately arranged in a staggered manner in the longitudinal direction, and the ends of the rib portions are alternately exposed alternately on different outer surfaces facing each other of the element body. Crap Because the external electrodes are formed so as to cover the entire end of the external electrode, the area of contact between the effective layers separating adjacent multilayer ceramic capacitors is increased on the outer surface where the crack portion is exposed, and the width of the external electrode to be formed is reduced. Even though the connection with the internal electrodes is ensured, the narrowing prevents short-circuiting between adjacent external electrodes, and furthermore, the cracked parts exposed during plating on the surface of the external electrodes and each multilayer ceramic This has the effect that it is possible to prevent the intrusion of the plating solution from the gap with the effective layer separating the capacitor.

According to a second aspect of the present invention, the width dimension of the concave portion of the internal electrode connected to the external electrode is smaller than the width dimension of the internal electrode formed inside the element body. This is a multiple-layered multilayer ceramic capacitor, which further increases the area of contact between the effective layers that separate adjacent multilayer ceramic capacitors on the outer surface where the end of the internal electrode crack is exposed, and short-circuits the external electrodes. This makes it easier to prevent the plating solution from entering when performing plating on the surface of the external electrode.

According to a third aspect of the present invention, the width of the external electrode is formed to be wider than the width of the concave portion of the internal electrode exposed on the outer surface of the body. This is a multiple-layer ceramic capacitor, which covers the entire end of the internal electrode exposed on the outer surface of the element with the external electrode, so plating is performed from the gap between the effective layers that separate adjacent multilayer ceramic capacitors. It becomes easier to prevent the liquid from entering.

According to a fourth aspect of the present invention, a plurality of internal electrodes and a plurality of dielectric ceramic layers as effective layers are alternately stacked on the same plane, and a plurality of internal electrodes are arranged in parallel in a single element body. In a multiple-layer ceramic capacitor in which a plurality of multilayer ceramic capacitors are juxtaposed at predetermined intervals, the internal electrodes are alternately arranged in a staggered manner in the longitudinal direction, and one end of the internal electrodes is Every other one is alternately approached to the extent that it is not exposed to the opposing outer surfaces of the element body, and a notch groove is provided to intersect the end of the internal electrode from the outer surface of the element body. This is a multiple-layered multilayer ceramic capacitor in which external electrodes are formed so as to be electrically connected to the ends of the electrodes. With this structure, the entire outer surface of the element body is covered with an effective layer, and the inner surface extends from the outer surface toward the internal electrode. Exchange with the end of the electrode In order to expose the end of the internal electrode having an area sufficient to secure the connection between the external electrode and the internal electrode only inside the cut groove, it is effective to separate adjacent multilayer ceramic capacitors. As the contact area between the layers further increases, the exposed portion of the internal electrode is completely covered by the external electrode formed on the inner surface of the cut groove, ensuring the reliability of the connection between the internal electrode and the external electrode, and adjoining It is possible to reliably prevent the plating solution from entering through the gap between the effective layer separating the multilayer ceramic capacitor and the internal electrode, and to increase the distance between adjacent external electrodes, thereby preventing a short circuit from occurring. it can.

According to a fifth aspect of the present invention, a lead portion narrower than the width of the internal electrode is provided at one end of each internal electrode, and the internal electrode is connected to the outer surface of the element body through the lead portion. The exposed portion was provided with a cut groove for the exposed portion so as to intersect the internal electrode from the outer surface of the element body, and an external electrode electrically connected to an end of the internal electrode was formed on the inner surface of the cut groove. The multilayer ceramic capacitor according to claim 4, wherein the internal electrode is exposed to the outer surface of the body through the lead portion, so that the outer electrode of the body crosses the end of the internal electrode from the outer surface of the body. In addition to making it easy to position the cut groove to be cut, the cut groove is provided so as to intersect with the end of the internal electrode, so that the connection of the internal electrode and the external electrode is ensured in the subsequent formation of the external electrode. Effective layer that separates adjacent multilayer ceramic capacitors With the plating liquid from the gap between the internal electrodes becomes possible to reliably prevent the intrusion,
The interval between adjacent external electrodes is widened, and the occurrence of a short circuit can be prevented.

According to a sixth aspect of the present invention, the width of the cut groove is wider than the internal electrode lead portion and smaller than the width of the internal electrode, and the depth thereof intersects the end of the internal electrode. The multi-layered multilayer ceramic capacitor according to claim 4 or 5, wherein the width of the external electrode formed only in the cut groove is smaller than the width of the internal electrode. Since the distance between the external electrodes can be sufficiently wide, when a multiple-layer monolithic ceramic capacitor is mounted on a board, short circuits due to solder bridges between adjacent external electrodes are prevented, and the width of the cut groove is set to the internal electrode. By making the width narrower than the width, the reliability of the internal electrode and the external electrode can be ensured, and the intrusion of the plating solution can be more reliably prevented.

According to a seventh aspect of the present invention, the width of the cut groove is smaller than the interval between adjacent cut grooves.
To the multi-layered multilayer ceramic capacitor according to any one of claims 1 to 6, whereby the external electrodes formed only in the cut grooves can secure a sufficiently large distance between adjacent external electrodes. When a multiple-layered multilayer ceramic capacitor is mounted on a board, short circuits due to solder bridges between adjacent external electrodes are prevented, and the width of the cut grooves is narrowed to more reliably prevent the penetration of plating solution. It becomes possible.

According to an eighth aspect of the present invention, there is provided a multi-layer monolithic ceramic capacitor according to any one of the fourth to seventh aspects, wherein a corner portion at the bottom of the cut groove is curved. With this, it is possible to apply the external electrode paste reliably to the corners at the bottom of the cut grooves, and it is possible to suppress the entry of air bubbles that are likely to occur when applying the external electrode paste to the corners Becomes
The connection between the internal electrode and the external electrode is ensured.

According to a ninth aspect of the present invention, the bottom surface of the cut groove is curved inward toward the inside.
Wherein the paste for external electrodes can be reliably applied to the bottom surfaces of the cut grooves, and the connection between the internal electrodes and the external electrodes is ensured. .

(Embodiment) An embodiment of the present invention will be described below with reference to FIGS.

FIG. 1 is an exploded perspective view of a green block 6a of the present invention, FIG. 2 is a perspective view of the same, and FIG.
a is a cutaway perspective view of the green chip 8a, FIG. 4 is a partially cutaway perspective view of a finished product of the multiple-layered ceramic capacitor 12a, FIG. 5 is a plan sectional view of the finished product, and FIG. 7 is a perspective view of the green chip 8b obtained by cutting the green block 6b provided with the portion 5b, FIG. 7 is an exploded perspective view of the green chip 8b, and FIG. 9 is a perspective view of the completed product, and FIG. 10 is a plan sectional view of the completed product.

In the drawing, 1 is a green sheet, 2 is an upper ineffective layer, 3 is a lower ineffective layer, 4a and 4b are internal electrodes, 5a
Is a concave portion of the internal electrode 4a, 5b is a lead portion of the internal electrode 4b, 6a and 6b are green blocks, 7 is a cutting line, 8
a and 8b are green chips, 9 is an outer surface, 10a and 10
b is an external electrode, 11a to 11h are multilayer ceramic capacitors, 12a and 12b are multiple type multilayer ceramic capacitors, 13 is a sintered body, 14 is a cut groove, 15 is a corner portion of a cut groove 14, and 16 is a cut. 4 shows the bottom of the groove 14;

First, a green sheet 1 is manufactured using a slurry comprising dielectric ceramic powder, an organic binder, a plasticizer, and the like, according to a known method for manufacturing a multilayer ceramic capacitor. Next, a plurality of the produced green sheets 1 are laminated to produce an upper invalid layer 2 and a lower invalid layer 3.

Next, the green sheet 1 is laminated on the lower ineffective layer 3, and the internal electrode 4a having the first layer of the concave portion 5a as shown in FIG. Each of the internal electrodes 4a is printed alternately every other electrode so as to be arranged in a staggered manner in the longitudinal direction. A green sheet 1 is laminated thereon to form a first effective layer.

Subsequently, the first-layer internal electrode 4a
The inner electrode 4a of the second layer which forms a pair with the first layer is printed while being shifted by a predetermined length in the longitudinal direction of the inner electrode 4a of the first layer, and the green sheet 1 is further laminated thereon to form an effective layer of the second layer. And Subsequently, the same third-layer internal electrodes 4a as the first-layer internal electrodes 4a paired with the second-layer internal electrodes 4a are printed on the surface, and the green sheet 1 is laminated thereon. Effective layer. After the green sheets 1 and the internal electrodes 4a are alternately and alternately formed in a plurality of layers in this manner, the upper ineffective layer 2 is finally stacked and laminated under pressure to produce a green block 8b shown in FIG.

Thereafter, as shown in FIG. 3, the green blocks 6a are cut along the cutting lines 7 and separated to obtain green chips 8a. Each of the internal electrodes 4a of the green chip 8a is formed so as to be staggered with a predetermined size shifted in the longitudinal direction thereof, and adjacent internal electrodes 4a are alternately green at every other end of the concave portion 5a. Chip 8
a of the internal electrode 4a which is exposed on different outer surfaces 9 facing each other.
The outer surface 9 of the green chip 8a whose end is exposed is
The bonding area between the effective layers separating the adjacent multilayer ceramic capacitors 11a to 11d is increased.

Next, the green chip 8a is fired at a predetermined temperature to produce a sintered body (not shown). Barrel polishing is performed on the obtained sintered body to surely expose the end group of the concave portion 5a of the internal electrode 4a formed inside the sintered body to the outer surface 9 of the sintered body. The paste of the external electrode 10a is applied and baked so as to cover the entire group of the crevices 5a of the electrode 4a, the surface thereof is further plated, and the multiple ceramic capacitors 11a to 11d are additionally provided as shown in FIG. The multilayer ceramic capacitor 12a is completed.

The above-mentioned multiple type multilayer ceramic capacitor 12
a, as shown in FIG. 5, every other one of the internal electrodes 4a is arranged in a staggered manner by being shifted by a predetermined dimension in the longitudinal direction thereof,
Since the end portions of the crack portions 5a are alternately exposed every other one of the outer surfaces 9 facing each other, the bonding area between the effective layers for separating the adjacent multilayer ceramic capacitors 11a to 11d on the outer surface 9 is large. In addition, since the external electrode 10a is formed so as to cover the entire exposed crack portion 5a, when performing plating on the surface of the external electrode 10a, the adjacent multilayer ceramic capacitors 11a to 11
It is possible to prevent the plating solution from entering through the gap between the effective layer for separating d and the crack portion 5a. As a result, a short circuit between the external electrodes 10a of the adjacent multilayer ceramic capacitors 11a to 11d can be prevented, and a highly reliable multilayer ceramic capacitor 12a can be provided in which deterioration of insulation resistance due to infiltration of a plating solution is prevented. Becomes

Next, a cut groove 14 is provided in the outer surface 9 of the sintered body 13 shown in FIG.
0b formed in a multilayer ceramic capacitor 12b
Will be described with reference to the drawings.

A green block 6b as shown in FIG. 6 is manufactured according to a known method of manufacturing a multilayer ceramic capacitor, and then cut and separated along a cutting line 7 to manufacture a green chip 8b. As shown in FIG. 7, the green chip 8b is formed so that every other internal electrode 4b provided with a lead-out portion 5b is staggered by a predetermined distance in the longitudinal direction, and the internal electrodes 4b are connected to the lead-out portion 5b. The end portions of the lead portions 5b of the internal electrodes 4b are arranged on the same plane, and the end portions of the lead portions 5b of the internal electrodes 4b are exposed. The outer surface 9 of the green chip 8b is almost covered with the effective layer.

Next, after firing the green chip 8b at a predetermined temperature, as shown in FIG. 8, a multiple-layer ceramic capacitor 12b is formed at the position of the lead-out portion 5b on both outer surfaces 9 of the sintered body 13. Each multilayer ceramic capacitor 11e
The cut groove 14 is processed so as to intersect with the end of the internal electrode 4b for each unit of ~ 11h to expose the end of the internal electrode 4b to the inside of the cut groove 14. The width of the cut groove 14 is smaller than the width of the internal electrode 4b and wider than the width of the lead portion 5b, and the depth thereof intersects the end of the internal electrode 4b on the side of the lead portion 5b and is different from the outer surface 9 facing the same. The bottom 16 and the corner 15 of the cut groove 14 are further processed into a curved surface so as not to contact the end of the internal electrode 4b. This allows all internal electrodes 4
b can reliably expose only a part of the inner surface of the cut groove 14 necessary for securing the connection with the external electrode 10b, and when applying the paste of the external electrode 10b in the next step, Since the bottom portion 16 and the corner portion 15 of the cut groove 14 are processed so as to have a curved surface, the electrode paste can be uniformly applied to the inner surface of the cut groove 14, and the rising corner portion 15 of the cut groove 14 is formed. When it is angular, it is possible to prevent the generation of air bubbles that are easily left behind at the corners, and to ensure a good electrical connection between the internal electrode 4b and the external electrode 10b.

Thereafter, the inner surface of the cut groove 14 is formed as shown in FIG.
The external electrode 10b is provided as shown in FIG.
b is formed so as to be flush with the upper and lower planes of the sintered body 13. Since the surface of the external electrode 10b is flat, it is easy to design the size of the soldering land of the circuit board for mounting the finished product of the multi-layered multilayer ceramic capacitor 12a, and furthermore, the width of the formed external electrode 10b is reduced by the width of the internal electrode 4b. Since it is narrower than the width and narrower than the interval between the adjacent external electrodes 10 b and is provided only inside the cut groove 14, the adjacent external electrodes 1
The insulation distance from the external electrodes 10b can be sufficiently widened, and when the multiple-layer ceramic capacitor 12b is mounted on a substrate, a short circuit due to a solder bridge between adjacent external electrodes 10b can be prevented.

Further, since the internal electrodes 4b are staggered in the longitudinal direction by being shifted by a predetermined dimension in the longitudinal direction, and alternately alternately exposed inside the cut grooves 14 of the outer surface 9 opposed to each other, In the vicinity of the outer side surface 9, each multilayer ceramic capacitor 11
e to 11h, the adhesion area between the effective layers is increased, and the internal electrodes 4b covered with the external electrodes 10b
From the gap between the end portion and the effective layer can be more effective in preventing the intrusion of the plating solution. Therefore, it is possible to prevent the deterioration of the insulation resistance between the adjacent multilayer ceramic capacitors 11e to 11h and to provide a highly reliable multiple-layer ceramic capacitor 12b.

In the present embodiment, the lead-out portion 5b is provided at one end of the internal electrode 4b. However, a display that allows the position of the internal electrode 4b formed inside the sintered body 13 to be determined from the outside is provided. By doing so, it is possible to remove the drawer 5b.

[0034]

As described above, according to the present invention, a plurality of internal electrodes each having a plurality of parallel cracks on the same plane and a plurality of dielectric ceramic layers as effective layers are alternately laminated to form a parallel structure inside a single element body. In a multiple-layer ceramic capacitor in which a plurality of multilayer ceramic capacitors are juxtaposed at predetermined intervals in the direction, the internal electrodes are alternately arranged in a staggered manner in the longitudinal direction thereof, and the end of the internal electrode is formed in a staggered shape. By alternately exposing every other part to the opposing outer surfaces of the body and forming a plurality of pairs of external electrodes electrically connected to each other so as to cover the entire exposed end portion, On the outer side, the bonding area between the effective layers that separate adjacent multilayer ceramic capacitors is increased, and when plating the surface of the external electrode, the plating solution is prevented from entering through the gap between the internal electrode and the effective layer. To prevent the deterioration of the insulation resistance between adjacent multilayer ceramic capacitors, as well as to ensure the reliability of the connection between the internal electrodes and the external electrodes. It is possible to obtain a highly reliable multilayer ceramic capacitor that can prevent a short circuit between external electrodes.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view of a green block of a multiple-layer monolithic ceramic capacitor according to an embodiment of the present invention.

FIG. 2 is a perspective view of the green block.

FIG. 3 is a perspective view of a green chip of the quadruple-type multilayer ceramic capacitor obtained by cutting the green block.

FIG. 4 is a partially cutaway perspective view of a finished product of the quadruple-type multilayer ceramic capacitor.

FIG. 5 is a cross-sectional plan view of a completed product of the quadruple-type multilayer ceramic capacitor.

FIG. 6 is a perspective view of a green chip of a quadruple-type multilayer ceramic capacitor provided with a lead portion on the internal electrode.

FIG. 7 is an exploded perspective view of a green chip of a quadruple-type multilayer ceramic capacitor in which a lead portion is provided in the internal electrode.

FIG. 8 is a perspective view of a sintered body of a quadruple-type multilayer ceramic capacitor having the cut grooves.

FIG. 9 is a perspective view of a finished product of a quadruple-type multilayer ceramic capacitor having the cut grooves.

FIG. 10 is a cross-sectional plan view of a completed product of a quadruple-type multilayer ceramic capacitor having the cut grooves.

FIG. 11 is a developed perspective view of a green block of a conventional multiple-layer ceramic capacitor.

FIG. 12 is a perspective view of the green block.

FIG. 13 is a perspective view of a green chip of a quadruple-type multilayer ceramic capacitor obtained by cutting the green block.

FIG. 14 is a partially cutaway perspective view of a completed product of the quadruple-type multilayer ceramic capacitor.

FIG. 15 is a cross-sectional plan view of a completed product of the quadruple-type multilayer ceramic capacitor.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Dielectric green sheet 2 Upper ineffective layer 3 Lower ineffective layer 4a, 4b Internal electrode 5a Crack part 5b Leader 6a, 6b Green block 7 Cutting line 8a, 8b Green chip 9 Outer side surface 10a, 10b External electrode 11a, 11b, 11c , 11d, 11e, 11f, 1
1g, 11h Multilayer Ceramic Capacitor 12a, 12b Multilayer Multilayer Ceramic Capacitor 13 Sintered Body 14 Cut Groove 15 Corner of Cut Groove 16 Bottom of Cut Groove 17 Dielectric Green Sheet 18 Upper Ineffective Layer 19 Lower Ineffective Layer 20 Internal electrode 21 Green block 22 Cutting line 23 Green chip 24 Outer surface 25 External electrode 26a, 26b, 26c, 26d Multilayer ceramic capacitor 27 Multiple-layer type multilayer ceramic capacitor

 ──────────────────────────────────────────────────続 き Continued on the front page F-term (reference) MM24 MM26 PP09

Claims (9)

[Claims] 1. An internal electrode having a plurality of jutting portions arranged side by side on the same plane and a dielectric ceramic layer as an effective layer are alternately laminated in a plurality of layers, and are arranged inside a single element at predetermined intervals in a parallel direction. In a multiple-layer ceramic capacitor in which a plurality of multilayer ceramic capacitors are juxtaposed, the internal electrodes are alternately arranged every other one in a staggered manner in the longitudinal direction, and the end portions of the internal electrode are alternately alternately arranged. A multiple-layered multilayer ceramic capacitor having a plurality of pairs of external electrodes which are respectively exposed to opposing outer surfaces of a body and are electrically connected so as to cover the entire exposed end portions. 2. The multiple-layer ceramic capacitor according to claim 1, wherein the width of the concave portion of the internal electrode connected to the external electrode is smaller than the width of the internal electrode formed inside the element body. 3. The multilayer ceramic capacitor as claimed in claim 1, wherein the width of the external electrode is wider than the width of the concave portion of the internal electrode exposed on the outer surface of the element body. 4. A plurality of internal electrodes and a plurality of dielectric ceramic layers as effective layers are alternately stacked on the same plane, and a plurality of internal electrodes are arranged inside the single element at predetermined intervals in a parallel direction. In a multi-layer type multilayer ceramic capacitor in which ceramic capacitors are juxtaposed, every other one of the internal electrodes is arranged in a staggered manner in the longitudinal direction, and one end of the internal electrode is alternately opposed to the element body every other one. Approach the outer surface to the extent that it is not exposed, process a notch groove crossing the end of the internal electrode from the outer surface of the element, and electrically connect the inner surface of the notch with the end of the internal electrode. Multi-layer ceramic capacitor with external electrodes formed in such a way. 5. A lead portion is provided at one end of each internal electrode, and the internal electrode is exposed to the outer surface of the body through the lead portion, and the exposed portion intersects the internal electrode from the outer surface. 5. The multilayer ceramic capacitor according to claim 4, wherein a cut groove is provided, and an external electrode electrically connected to an end of the internal electrode is formed on an inner surface of the cut groove. 6. The width of the notch groove is wider than the lead-out portion of the internal electrode and narrower than the width of the internal electrode, and the depth thereof is provided so as to intersect the end of the internal electrode. 6. The multiple-layer monolithic ceramic capacitor according to 5. 7. The multi-layer monolithic ceramic capacitor according to claim 4, wherein a width of the cut groove is smaller than a distance between adjacent cut grooves. 8. The multiple-layer ceramic capacitor according to claim 4, wherein a corner portion at the bottom of the cut groove has a curved surface. 9. The multilayer ceramic capacitor according to claim 4, wherein a bottom surface of the cut groove is curved inward.