JP2000266780A - Probe card and inspection device using it - Google Patents

Abstract

(57) [Summary] [PROBLEMS] To reduce the amount of overdrive that can secure the stylus pressure required for measuring and inspecting electrical characteristics using a probe needle, and prevent the probe needle from skidding on the electrode of the inspection object. However, it is possible to prevent the electrodes of the object to be inspected from being damaged or destroyed, and to realize a probe card that can cope with downsizing of the object. SOLUTION: Since an opening 22 for marking into which a tip of a marking device can be inserted is provided in a region other than an opening 21 for inspection in which a probe needle 4 protrudes, the object 7 to be inspected is reduced in size. If the inspection opening 21 is made smaller,
The length from the end of the probe needle 4 fixed to the fixing portion 5 to the bent portion is reduced. As a result, it is possible to reduce the amount of overdrive that can secure the stylus pressure required for the inspection of the electrical characteristics by the probe needle 4. The overdrive amount can also be reduced by reducing the length of the tapered portion at the tip of the probe needle 4.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a probe card and an inspection device using the same.

[0002]

2. Description of the Related Art FIGS. 12, 13 and 14 show prior art examples. FIG. 12 is a plan view of a conventional probe card, FIG. 13 is a partial cross-sectional view of the conventional probe card as viewed from a side, and FIG. 14 shows a configuration of an inspection apparatus at the time of probe inspection using a conventional probe card. FIG. 14 (a)
14 is a perspective view from obliquely above, and FIG. 14B is a side view. 12, 13, and 14, 1 is a probe card, 2 is a contact pin, 3 is a board, and 4 is a board 3.
A plurality of probe needles, 5 is a fixing portion for fixing the probe needles 4 to the board 3, 6 is a bent portion of the probe needles 4, 7 is an object to be inspected such as a semiconductor device, and 8 is an object to be inspected 7 The electrode 9 has a length from the fixed end of the probe needle 4 fixed to the fixed portion 5 to the bent portion 6 (hereinafter referred to as “protruding length of the probe needle 4”), 11 has a marking device, and 13 has an inspection circuit. The component board 14 is a wafer stage.

As shown in FIG. 12, a conventional probe card 1 comprises a routable board 3 having contact pins 2 in a peripheral portion, a probe needle 4 arranged on the board 3,
The probe needle 4 comprises a fixing portion 5 for fixing the probe needle 4 to the board 3, and the probe needle 4 projects from an opening formed in the center of the probe card 1. As shown in FIG. 13, the probe needle 4 has a bent portion 6, and the tip of the bent portion 6 comes into contact with the electrode 8 of the inspection object at the time of inspection. Further, the probe needle 4 has a tapered tip end portion of the inspection object 7 that contacts the electrode 8 (see FIG. 3). Hereinafter, the length of the tapered portion is referred to as a taper length (taper length 10 in FIG. 3).

As shown in FIG. 14, the conventional inspection apparatus using the probe card 1 fixes the probe card 1 to an inspection circuit configuration board 13 and attaches the tip of the marking device 11 to the probe of the probe card 1. The needle 4 is arranged so as to face the overhanging opening. Then, a wafer on which a large number of inspection objects 7 (here, semiconductor devices) are formed is held on the wafer stage 14, and the wafer stage 14 is moved to perform a probe inspection of each inspection object 7 sequentially. In the probe test, the tapered tip portion of the probe needle 4 is vertically contacted with the electrode 8 of the inspection object 7 from the bent portion 6 to prevent the probe needle 4 from skidding on the electrode 8, Connections are made securely and smoothly.

[0005] The inspection circuit configuration board 13 has a built-in inspection circuit that measures the electrical characteristics of the object 7 to be inspected and determines the measurement result. By fixing the probe card 1 to the inspection circuit configuration board 13, the probe needles 4 are connected to the inspection circuit in the inspection circuit configuration board 13 via the wiring and the contact pins 2 formed on the board 3. You. The inspection is performed by bringing the probe needle 4 into contact with the electrode 8 of the inspection object 7. The inspection result by the inspection circuit is output to the marking device 11. The inspection object 7 is sequentially inspected by moving the wafer stage 14, and the inspection result 7
Is marked by the marking device 11. The wafer stage 14 can be moved in the horizontal and vertical directions by a mechanism (not shown).

In performing marking on a defective inspection object 7, when the inspection object 7 is reduced in size and its surface area is reduced, a space is required for bringing the tip of the marking device 11 closer to the surface of the inspection object 7. In order to cope with this, the protruding length 9 of the probe needle 4 is increased.

[0007]

In order to reliably and smoothly measure and inspect the electrical characteristics of the probe needle 4, a needle pressure of about 10 g is required. In the above-mentioned conventional example, the tip of the probe needle 4 that comes into contact with the electrode 8 from the bent portion 6 is vertically contacted with the electrode 8 of the inspection object 7, thereby preventing the probe needle 4 from skidding on the electrode 8. Although it is intended to make the electrical connection sure and smooth, a commonly used probe needle shape (needle wire diameter:
φ250 [μm], overhang length 9: about 4.0 to 5.0 [m
m], taper length: about 4.0 to 5.0 [mm]) and about 1
To obtain a needle pressure of 0 g, an overdrive amount of about 130 [μm] is required.

The amount of overdrive is defined as the amount of overdrive when the probe 8 is brought into contact with the electrode 8 of the object 7 or the electrode 8 of the object 7 is probed. It is the amount of pressing when the needle 4 is pressed in the vertical direction. Therefore, the overdrive amount is proportional to the stylus pressure of the probe needle 4, but an increase in the overdrive amount increases a side slip amount of the probe needle 4. For example, when the probe needle 4 having the above shape is used,
Inspection object 7 at overdrive amount of 130 [μm]
The side slip length formed on the electrode 8 is about 70 [μm].
It is. The shape of the electrode 8 of a general semiconductor device or the like is at least about 80 [μm] × 80 [μm]. From this, if an attempt is made to secure a stylus pressure of 10 g or more, a needle mark of about the electrode width is formed on the electrode 8 of the inspection object 7, resulting in damage and destruction of the electrode 8 of the inspection object 7. Become.

As described above, in the conventional configuration, the inspection object 7
When the surface area of the probe is small, it is necessary to provide a space for bringing the tip of the marking device 11 close to the surface of the inspection object 7, so that the overhang length 9 of the probe needle 4 is increased, and as a result, Issues arise.

The present invention makes it possible to reduce the amount of overdrive that can secure the stylus pressure required for measuring and inspecting electrical characteristics using a probe needle, to prevent the probe needle from skidding on an electrode of an object to be inspected, An object of the present invention is to provide a probe card capable of preventing damage and destruction of an electrode of an object to be inspected and capable of responding to downsizing of the object to be inspected, and an inspection apparatus using the same.

[0011]

According to the present invention, there is provided a card body having a first opening at the center, a card body fixed to the card body facing the first opening, and bent near the center to form an electrode of the inspection object. A probe card having one or more probe needles whose leading end portions are tapered, wherein at least one second opening for marking is formed in a region other than the first opening of the card body. By providing the probe needle, the length from the portion fixed to the card body of the probe needle to the bent portion (extended length), and the length of the tapered portion of the tip of the probe needle (taper length) The above-mentioned object is achieved by shortening.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The invention according to claim 1 of the present invention is directed to a card body having a first opening in the center, fixed to the card body facing the first opening, and bent near the center. A probe card comprising one or more probe needles having a tapered tip portion for contacting an electrode of a test object, wherein a second portion for marking a region other than the first opening of the card body. A probe card provided with at least one opening.

According to this configuration, apart from the first opening through which the probe needle projects, the second opening for marking is provided.
When the inspection object is reduced in size and the surface area is reduced, the first opening is made smaller, and the length from the portion of the probe needle fixed to the card body to the bent portion is set. Length) can be shortened. As a result, it is possible to reduce the amount of overdrive that can secure the stylus pressure required for measuring and inspecting the electrical characteristics by the probe needle, prevent the probe needle from skidding on the electrode of the inspection object, and The shape of the needle mark can be reduced to prevent the electrode of the inspection object from being damaged or broken. In addition, marking of the inspection object having a defective inspection result can be reliably and easily performed through the second opening.

According to a second aspect of the present invention, in the probe card according to the first aspect, the first opening and the second opening are formed continuously. With this configuration, the same operation and effect as those of the first aspect can be obtained.

According to a third aspect of the present invention, in the probe card according to the first or second aspect, the probe needle has a length from a portion fixed to the card body to a bent portion (overhang length). ) Is 3.5 mm or less. By shortening the overhang length in this way, the amount of overdrive can be reduced, side slip of the probe needle on the electrode is prevented, and the shape of the needle mark on the electrode is reduced to reduce the overdrive. Damage and destruction of the electrode of the inspection object can be prevented.

According to a fourth aspect of the present invention, in the probe card according to the first or second aspect, the protruding length of the probe needle is 3.0 mm or less. By reducing the overhang length in this way, the amount of overdrive can be further reduced, and the probe needle can be prevented from skidding on the electrode of the test object, and the shape of the needle mark on the electrode can be further reduced. Thus, damage and destruction of the electrode of the inspection object can be further prevented.

According to a fifth aspect of the present invention, in the probe card according to the first or second aspect, the protruding length of the probe needle is 2.5 mm or less. By shortening the overhang length in this way, the overdrive amount can be further reduced, and the probe needle can be further prevented from skidding on the electrode of the inspection object, and the shape of the needle mark on the electrode can be reduced. It is possible to further reduce the damage and destruction of the electrode of the object to be inspected.

According to a sixth aspect of the present invention, in the probe card according to the first, second, third, fourth or fifth aspect, the probe needle has a length (taper length) of a tapered portion at a tip portion. ) Is 4.0 mm or less. By shortening the taper length in this way,
It can reduce the amount of overdrive, prevent the probe needle from skidding on the electrode of the test object, and reduce the shape of the needle mark on the electrode to prevent damage and destruction of the electrode on the test object. it can.

According to a seventh aspect of the present invention, in the probe card according to the first, second, third, fourth or fifth aspect, the probe needle has a taper length of 3.5 mm or less. . By shortening the taper length in this manner, the overdrive amount can be further reduced, the side slip of the probe needle on the electrode of the object to be inspected is further prevented, and the shape of the needle mark on the electrode is further reduced. Damage and destruction of the electrode of the inspection object can be further prevented.

According to an eighth aspect of the present invention, in the probe card according to the first, second, third, fourth or fifth aspect, the probe needle has a taper length of 3.0 mm or less. . By reducing the taper length in this manner, the amount of overdrive can be further reduced, the side slip of the probe needle on the electrode of the test object is further prevented, and the shape of the needle mark on the electrode is further reduced. Thus, damage and destruction of the electrode of the inspection object can be further prevented.

According to a ninth aspect of the present invention, the probe card according to the first, second, third, fourth, fifth, sixth, seventh or eighth aspect has a built-in circuit for inspecting an electrical characteristic of an object to be inspected. Affixed to the inspection circuit configuration board, the tip of the marking device that performs marking according to the inspection result of the inspection circuit is arranged facing the second opening of the probe card,
After the test object is positioned at the first opening of the probe card and the probe is brought into contact with the electrode of the test object to perform the test, the test object is positioned at the second opening of the probe card and the test result of the test object is obtained. An inspection apparatus is characterized in that marking is performed when a defect is found.

According to this configuration, claims 1, 2, 3, 4,
Inspection using the probe card described in 5, 6, 7, or 8 can be performed, the amount of overdrive that can secure the necessary stylus pressure during the inspection can be reduced, and the probe needle can be used on the electrode of the inspection object. Can be prevented, the shape of the needle mark on the electrode can be reduced, and the electrode of the inspection object can be prevented from being damaged or broken. Further, marking of the inspection object having a defective inspection result can be reliably and easily performed through the second opening.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(First Embodiment) FIG. 1 shows a first embodiment of the present invention.
FIG. 2 is a plan view of a part of the probe card according to the first embodiment viewed from the side, and FIG. 3 is an enlarged view of a tip of the probe needle 4 of FIG. . 1, 2 and 3, 1A is the first
In the embodiment of the present invention, 2 is a contact pin, 3 is a board, 4 is a plurality of probe needles arranged on the board 3, 5 is a fixing portion for fixing the probe needles 4 to the board 3, and 6 is a probe needle 4 , A test object 7 such as a semiconductor device, 8 an electrode of the test object 7, 9 a length from the fixed end of the probe needle 4 fixed to the fixing portion 5 to the bent portion 6 The overhang length of the probe needle 4)
Reference numeral 0 denotes the length of the tapered portion of the tip of the probe needle 4 (hereinafter referred to as “taper length”). Reference numeral 21 denotes an inspection opening provided at the center of the probe card 1A and over which the probe needle 4 projects. (First opening) and 22 are marking openings (second openings) provided in predetermined regions other than the inspection opening 21. In the present embodiment, the inspection opening 21 and the marking opening 22 are formed continuously. The card body includes a board 3 having the contact pins 2 and a fixing unit 4.

As shown in FIG. 1, a probe card 1A according to the present embodiment has a routable board 3 having contact pins 2, a probe needle 4 arranged on the board 3, and a probe needle 4 attached to the board 3. And a fixing portion 5 for fixing. Further, this probe card 1A is provided with a marking device 11 (although it is formed continuously here) separately from the inspection opening 21 from which the probe needle 4 is projected.
(FIG. 7) Marking opening 22 into which the tip can be inserted.
Is provided.

As shown in FIG. 2, the probe needle 4 has a bent portion 6, and the tip of the bent portion 6 comes into contact with the electrode 8 of the inspection object 7 at the time of inspection. All the probe needles 4 have a short overhang length 9 and a taper length 10 (FIG. 3) as compared with the conventional one.
Is short, or both the overhang length 9 and the taper length 10 are short. In addition,
In the probe needle 4, the bent portion 6 may be located outside the tapered portion formed in the tapered shape, or may be located inside the tapered portion. That is, the tapered portion of the probe needle 4 may be formed between the distal end portion in contact with the electrode 8 and the bent portion 6, or may be formed beyond the bent portion 6 from the distal end portion in contact with the electrode 8. In some cases. The probe needle 4 is made of tungsten or a tungsten alloy (for example, tungsten rhenium).
And having a needle wire diameter of φ250 [μm].

FIGS. 4 and 5 are diagrams (measurement results) showing the relationship between the overdrive amount and the stylus pressure due to the difference in the protruding length 9 of the probe needle 4, and FIG. 4 shows that the taper length 10 is 3.0.
FIG. 5 shows a case where the taper length 10 is 4.0 mm.
Is the case. 2.5 mm described in FIGS. 4 and 5,
3.5 mm, 4.0 mm, and 5.0 mm indicate that the overhang length was measured. Also,
FIG. 6 is a diagram (measurement results) showing the relationship between the overdrive amount and the stylus pressure due to the difference in the taper length 10 (when the overhang length is 2.5 mm). 3.0 mm described in FIG. 6,
4.0 mm indicates that the taper length was measured. As described in the conventional example, generally, a needle pressure of about 10 g is required for the evaluation of the electrical characteristics using the probe needle 4, and the needle pressure increases with an increase in the overdrive amount. This leads to an increase in the shape of the needle mark formed on the electrode 8, resulting in damage and destruction of the electrode 8 of the inspection object 7.

4, 5 and 6 that the overdrive amount depends on the overhang length 9 and the taper length 10. Therefore, the probe needle 4 and the inspection object 7
The overdrive amount required for the stylus pressure (about 10 g) for obtaining good contact characteristics with the electrode 8 can be reduced as the overhang length 9 is shorter, and the overdrive amount is smaller.
Can be reduced as the length is shorter.

Here, a conventional probe card generally used (overhang length: 5.0 mm, taper length: 4.0 m)
m) and a probe card (protrusion length 2.5 mm, taper length 3.m), which is a specific example of the present embodiment, in which both the overhang length 9 and the taper length 10 of the probe needle 4 are shorter than before.
0 mm), the overdrive amounts for securing the needle pressure of 10 g are about 130 μm and about 65 μm, respectively.
m, and the overdrive amount of the probe card of the present embodiment comprising the probe needle 4 having both the overhang length 9 and the taper length 10 shorter than that of the conventional probe card is about ２. . Thereby, the electrode 8 of the inspection object 7 is
The needle mark shape formed on the top is about 20%
In addition, the contact characteristic failure of the probe needle 4 to the electrode 8 is reduced by about 4%.

Further, a conventional probe card (overhang length: 5.0 mm, taper length: 4.0 mm) and a probe which is a specific example of the present embodiment and in which the overhang length 9 of the probe needle 4 is shorter than in the past. Compared with the card (2.5 mm overhang length, 4.0 mm taper length), the overdrive amount for securing 10 g of stylus pressure is about 130 μ each.
m, about 80 μm, compared to the conventional probe card
The overdrive amount of the probe card according to the present embodiment including the probe needle 4 having the short overhang length 9 is about 2
/ 3. As a result, the shape of the needle mark formed on the electrode 8 of the inspection object 7 is reduced by about 15% as compared with the conventional one, and the contact characteristic failure of the probe needle 4 with the electrode 8 is reduced by about 4%.

Further, although all of them are specific examples of this embodiment, the first probe card (extending length 2.5 mm,
When a taper length of 4.0 mm) is compared with a second probe card (protrusion length 2.5 mm, taper length 3.0 mm) having a shorter taper length 10 of the probe needle 4 than this,
The overdrive amounts for securing the stylus pressure of 10 g are about 80 μm and about 65 μm, respectively, and the second probe card composed of the probe needle 4 having a taper length of 10 is shorter than the first probe card. The drive amount becomes about ／. Accordingly, the shape of the needle mark formed on the electrode 8 of the inspection object 7 is reduced by about 12% in the second probe card as compared with the first probe card.

FIG. 7 shows a probe card 1A according to the present embodiment.
7A is a diagram showing a configuration of an inspection apparatus at the time of probe inspection using FIG. 7A, and FIG.
(B) is a side view. 7, reference numeral 11 denotes a marking device, 13 denotes an inspection circuit configuration board, and 14 denotes a wafer stage, which are the same as those in FIG.

In the inspection device using the probe card 1A, the probe card 1A is fixed to the inspection circuit configuration board 13, and the tip of the marking device 11 is arranged so as to face the marking opening 22 of the probe card 1A. I do. A wafer on which a large number of inspection objects 7 (here, semiconductor devices) are formed is held on the wafer stage 14, and the wafer stage 14 is moved in the direction of the arrow α to perform a probe inspection of each inspection object 7. Are sequentially performed. In the probe inspection, the tapered tip portion of the probe needle 4 from the bent portion 6 is brought into perpendicular contact with the electrode 8 of the inspection object 7 with respect to the inspection object 7 positioned in the inspection opening 21. In addition, the probe needle 4 is prevented from slipping on the electrode 8, and the electrical connection is performed reliably and smoothly.

The inspection result by the inspection circuit built in the inspection circuit configuration board 13 is output to the marking device 11. The inspection object 7 is sequentially inspected by moving the wafer stage 14 in the direction of the arrow α, and for the inspection object 7 having a defective inspection result, the defective inspection object 7 is
Marking is performed by the marking device 11 when moving to the position 2. When this marking is performed, inspection of the inspection object 7 after the inspection object 7 marked at the inspection opening 21 is performed.

As described above, according to this embodiment, since the marking opening 22 for marking is provided separately from the inspection opening 21 through which the probe needle 4 projects, the inspection object If the surface area is reduced by reducing the size of 7, the opening 21 for inspection is reduced, and the overhang length 9 of the probe needle 4 is shortened. Accordingly, the amount of overdrive that can secure the needle pressure required for measuring and inspecting the electrical characteristics by the probe needle 4 can be reduced, and the probe needle 4 can be prevented from skidding on the electrode 8 of the inspection object 7. In addition, the shape of the needle mark on the electrode 8 can be reduced to prevent the electrode 8 of the inspection object 7 from being damaged or broken. In addition, the marking of the inspection object 7 having a defective inspection result can be reliably and easily performed through the marking opening 22. In this way, it is possible to cope with downsizing of the inspection object 7, and marking can be performed reliably and easily.

Also, by reducing the taper length of the probe needle 4, the overdrive amount can be reduced, and the probe needle 4 can be prevented from skidding on the electrode 8 of the object 7 to be inspected. The shape of the upper needle mark can be further reduced, so that the damage and destruction of the electrode 8 of the inspection object 7 can be further prevented.

The overhang length 9 of the probe needle 4 is preferably 3.5 mm or less, more preferably 3.0 mm or less, and more preferably 2.5 mm or less in order to reduce the amount of overdrive. Is even more preferred. Further, the taper length 10 of the probe needle 4 is preferably set to 4.0 mm or less, more preferably 3.5 mm or less, and more preferably 3.0 mm or less in order to reduce the amount of overdrive.
mm is even more preferred. Therefore,
Most preferably, the overhang length 9 is 2.5 mm or less and the taper length 10 is 3.0 mm or less.

The lower limits of the protruding length 9 and the taper length 10 of the probe needle 4 can be set to the limits of the processing capability, and as the processing capability increases, the lower limits become smaller. At present, the lower limit of each of the overhang length 9 and the taper length 10 is limited to 1 mm from the viewpoint of processing capacity.

Further, since the shape of the electrode 8 can be reduced by reducing the shape of the needle mark formed on the electrode 8 of the inspection object 7, the size of the inspection object 7 can be reduced. This leads to a reduction in the manufacturing cost of the inspection object 7.

Further, in manufacturing a probe card having a plurality of probe needles 4, the protruding length 9 and the taper length 10 of the probe needles 4 can be set and managed to predetermined lengths, and a uniform needle pressure can be obtained. Probe card can be easily manufactured.

The probe card 1A according to the present embodiment has one or more probe needles.
When the inspection object 7 is, for example, a vertical diode element and one electrode 8 is on the wafer surface and the other electrode is on the back surface of the wafer, a probe card provided with one probe needle 4 Inspection is performed by bringing one probe needle 4 into contact with one electrode 8 on the wafer surface.

(Second Embodiment) FIG. 8 shows a second embodiment of the present invention.
It is a top view of a probe card in an embodiment.
In FIG. 8, reference numeral 1B denotes a probe card according to the second embodiment, and other parts that are the same as those in FIG. 1 are given the same reference numerals.

While the probe card 1A of the first embodiment has one marking opening 22, the probe card 1B of the present embodiment has two marking openings 22. The other configuration is the same as that of the first embodiment, and the description is omitted. In the present embodiment, two marking openings 22 are provided so as to sandwich the inspection opening 21 provided at the center, and the inspection opening 21 and the two marking openings 22 are linearly arranged. ing.
In this embodiment, the inspection opening 21 and the two marking openings 22 are formed continuously.

In the inspection apparatus using the probe card 1B, similarly to FIG. 7, the probe card 1B is fixed to the inspection circuit configuration board 13, and the tip of the marking device 11 is marked on one of the two probe cards 1B. The wafer stage 14 is moved in the direction of the arrow α to sequentially perform the probe inspection of each of the inspection objects 7 in the same row. Performs marking when the defective inspection object 7 moves to the marking opening 22 in which the marking device 11 is arranged. Then, the probe inspection of the inspection object 7 in one row is completed, and for example, the inspection object 7 in the next row is completed.
When performing the probe inspection, the wafer stage 14 is moved in the direction of the arrow β by disposing the front end of the marking device 11 so as to face the other marking opening 22 of the two probe cards 1B. The probe inspection of each inspection object 7 in the row is sequentially performed, and marking can be performed on the defective inspection object 7.

As described above, according to the present embodiment, the first
In addition to the effects of the embodiment, since two marking openings 22 are provided, when the tip of the marking device 11 is arranged in one of the marking openings 22,
The wafer stage 14 is moved in the α direction to perform probe inspection and marking, and the other marking opening 22
When the tip of the marking device 11 is arranged at the position, the wafer stage 14 can be moved in the β direction to perform probe inspection and marking. Thus, it is possible to cope with the case where the inspection object 7 is transferred by moving the wafer stage 14 in two directions (reciprocation) at the time of performing the inspection,
Inspection and marking can be performed on the outward and return paths, so that the inspection efficiency increases.

In the first and second embodiments,
Although the inspection opening 21 and the marking opening 22 are formed continuously, they may be formed separately.

(Third Embodiment) FIG. 9 shows a third embodiment of the present invention.
FIG. 10 is a plan view of the probe card according to the embodiment.
FIG. 8 is a partial cross-sectional view of a probe card according to a third embodiment as viewed from the side. 9 and 10, 1C
Denotes a probe card according to the second embodiment, and the same functional portions as in FIGS. 1 and 2 are denoted by the same reference numerals.

The main difference between the probe card 1C of the present embodiment and the probe card 1A of the first embodiment is that the marking opening 22 is provided separately from the inspection opening 21 and all the probes are provided. That is, the overhang lengths 9 of the needles 4 are equalized. In addition, all the probe needles 4 have a short overhang length 9 and a taper length 10
(FIG. 3) is similar to the first embodiment in that it has the characteristics of either a short overhang length or a short overhang length 9 and a short taper length 10.
The length of each of the taper lengths 10 is as described in the first embodiment. Further, in the first embodiment, the overdrive amount is compared with a specific example of the overhang length 9 and the taper length 10, but the same is true in the present embodiment.

An inspection apparatus using the probe card 1C is the same as that of the first embodiment. As shown in FIG. 7, the probe card 1C is fixed to the inspection circuit configuration board 13 and the tip of the marking apparatus 11 is fixed. Part of probe card 1C
The wafer stage 14 is moved in the direction of the arrow α to sequentially perform the probe inspection of each of the inspection objects 7, and the inspection object 7 having a defective inspection result is disposed.
In contrast, the defective inspection object 7 is
Marking is performed when the mark 1 moves to the marking opening 22 where the mark 1 is arranged.

As described above, according to the present embodiment, the first
The same effect as that of the embodiment can be obtained. Further, by separating the inspection opening 21 and the marking opening 22, the protruding lengths 9 of all the probe needles 4 that protrude from the inspection opening 21 can be made equal. The stylus pressure can be made uniform in all the probe needles 4, and the contact characteristics between the probe needles 4 and the electrodes 8 of the inspection object 7 can be improved.

Further, the overhang length 9 of all the probe needles 4
, And by making the taper lengths 10 of all the probe needles 4 equal,
Therefore, the contact pressure between the probe needle 4 and the electrode 8 of the inspection object 7 can be further improved.

(Fourth Embodiment) FIG. 11 is a plan view of a probe card according to a fourth embodiment of the present invention. In FIG. 11, reference numeral 1D denotes a probe card according to the fourth embodiment, and the same functional portions as those in FIG. 9 are denoted by the same reference numerals.

The probe card 1C of the third embodiment has one marking opening 22, whereas the probe card 1D of the present embodiment has two marking openings 22. The other configuration is the same as that of the third embodiment, and the description is omitted. In the present embodiment, two marking openings 22 are provided so as to sandwich the inspection opening 21 provided at the center, and the inspection opening 21 and the two marking openings 22 are linearly arranged. ing.
In this embodiment, the inspection opening 21 and the two marking openings 22 are formed continuously.

In the inspection apparatus using the probe card 1D, similarly to the inspection apparatus using the probe card 1B according to the second embodiment, in FIG. The wafer stage 1 is arranged so as to face one of the marking openings 22.
4 can be moved in the direction of the arrow α to perform probe inspection and marking, and the tip of the marking device 11 is arranged so as to face the other marking opening 22 of the two probe cards 1D, and the wafer stage 14 is moved. Probe inspection and marking can be performed by moving the probe in the direction of the arrow β.

As described above, according to the present embodiment, the third
In addition to the effects of the second embodiment, similarly to the second embodiment, it is possible to cope with the case where the transfer of the inspection object 7 at the time of the inspection is performed by moving the wafer stage 14 in two directions (reciprocation). Inspection and marking can be performed on the return path, and the inspection efficiency increases.

In the first to fourth embodiments, the configuration of the probe card for performing the probe inspection of the inspection object 7 one by one has been described. Inspection efficiency can be improved as a configuration that is performed simultaneously. For example, when two probe inspections of the inspection object 7 are performed at the same time, it is assumed that two inspection objects 7 arranged in a direction perpendicular to the paper surface of FIG. Is, for example, an opening in which the number of probe needles necessary for the inspection of the two inspected objects 7 are extended so as to correspond to the positions of the respective electrodes 8 of the two inspected objects 7. In this case, since two inspection openings 21 are inspected simultaneously, they are larger than those in the first to fourth embodiments in which inspection is performed one by one. And opening 2 for marking
9 may be provided in the direction of movement α (see FIG. 7) of the wafer stage 14 with respect to the opening 21 for inspection as shown in FIG. 9, or may be provided with respect to the opening 21 for inspection as shown in FIG. 14 may be provided on the reciprocating movement directions α and β (see FIG. 7). In any case, the marking opening 22 provided on one of the α side and the β side is
May be provided side by side in a size that is possible to mark a mark (the same size as in the first to fourth embodiments), but it is possible to mark two inspected objects 7. Providing one large size is more advantageous in processing. Also,
The same applies to a configuration in which three or more probe inspections of the inspection object 7 are performed simultaneously.

In the above description, a semiconductor device (wafer) has been described as an example of the object 7 to be inspected, but other electronic components (eg, chip resistors) may also be used. That is, the inspection object 7 is not limited to the one in which the inspection objects (semiconductor devices) are united like a wafer, but may be any one in which a plurality of inspection objects are regularly arranged. Good.

[0058]

As described above, according to the present invention, since the second opening for marking is provided separately from the first opening through which the probe needle projects, the object to be inspected can be reduced in size. If the surface area is reduced, the first opening can be made smaller and the protruding length of the probe needle can be shortened. This allows
The amount of overdrive that can secure the needle pressure required for measuring and inspecting electrical characteristics with the probe needle can be reduced, preventing the probe needle from skidding on the electrode on the electrode, and the shape of the needle mark on the electrode And the damage and destruction of the electrode of the inspection object can be prevented. Further, marking of the inspection object having a defective inspection result can be reliably and easily performed through the second opening.

Further, by shortening the taper length of the probe needle, the overdrive amount can be further reduced, and the probe needle can be prevented from skidding on the electrode, and the shape of the needle mark on the electrode can be reduced. And the damage and destruction of the electrode of the inspection object can be further prevented.

Further, since the shape of the electrode can be reduced by reducing the shape of the needle mark formed on the electrode of the inspection object, the size of the inspection object can be reduced, and the size of the inspection object can be reduced. This leads to lower manufacturing costs.

Further, in manufacturing a probe card having a plurality of probe needles, a probe card having a uniform stylus pressure can be easily manufactured by controlling the protruding length and the taper length of the probe needles.

[Brief description of the drawings]

FIG. 1 is a plan view of a probe card according to a first embodiment of the present invention.

FIG. 2 is a cross-sectional view of the probe card according to the first embodiment of the present invention as viewed from the side.

FIG. 3 is an enlarged view of a tip portion of a probe needle.

FIG. 4 is a diagram showing a relationship between an overdrive amount and a stylus pressure depending on a difference in a protruding length of a probe needle.

FIG. 5 is a diagram showing a relationship between an overdrive amount and a stylus pressure depending on a difference in a protruding length of a probe needle.

FIG. 6 is a diagram illustrating a relationship between an overdrive amount and a stylus pressure due to a difference in a taper length of a probe needle.

FIG. 7 is a diagram showing a configuration of an inspection device using a probe card according to the first embodiment of the present invention.

FIG. 8 is a plan view of a probe card according to a second embodiment of the present invention.

FIG. 9 is a plan view of a probe card according to a third embodiment of the present invention.

FIG. 10 is a cross-sectional view of a probe card according to a third embodiment of the present invention as viewed from a side.

FIG. 11 is a plan view of a probe card according to a fourth embodiment of the present invention.

FIG. 12 is a plan view of a conventional probe card.

FIG. 13 is a cross-sectional view of a conventional probe card viewed from the side.

FIG. 14 is a diagram showing a configuration of an inspection apparatus using a conventional probe card.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1A, 1B, 1C, 1D Probe card 2 Contact pin 3 Board 4 Probe needle 5 Fixed part 6 Bend of probe needle 7 Inspection object 8 Electrode of inspection object 9 Overhang length 10 Taper length 11 Marking device 13 Inspection circuit Configuration board 14 Wafer stage 21 Inspection opening 22 Marking opening

Claims (9)

[Claims] A card body having a first opening in the center; a card body fixed to the card body facing the first opening, and a tip portion which is bent near the center and comes into contact with an electrode of the object to be inspected is tapered. A probe card comprising one or more processed probe needles, wherein at least one second opening for marking is provided in a region other than the first opening of the card body. Features probe card. 2. The probe card according to claim 1, wherein the first opening and the second opening are formed continuously. 3. The probe card according to claim 1, wherein the length of the probe needle from the portion fixed to the card body to the bent portion is 3.5 mm or less. 4. The probe card according to claim 1, wherein the length of the probe needle from the portion fixed to the card body to the bent portion is 3.0 mm or less. 5. The probe card according to claim 1, wherein the length of the probe needle from the portion fixed to the card body to the bent portion is 2.5 mm or less. 6. The probe card according to claim 1, wherein the length of the tapered tip portion of the probe needle is 4.0 mm or less. 7. The probe card according to claim 1, wherein the length of the tapered tip portion of the probe needle is 3.5 mm or less. 8. The probe card according to claim 1, wherein the length of the tapered tip portion of the probe needle is 3.0 mm or less. 9. A probe card according to claim 1, 2, 3, 4, 5, 6, 7 or 8, wherein said probe card is fixed to an inspection circuit configuration board having a built-in inspection circuit for electrical characteristics of an object to be inspected. A tip of a marking device that performs marking in accordance with the inspection result of the inspection circuit is arranged facing a second opening of the probe card, and the object to be inspected is positioned at a first opening of the probe card. After the probe is brought into contact with the electrode of the inspection object and inspected, the inspection object is positioned at the second opening of the probe card, and marking is performed when the inspection result of the inspection object is defective. An inspection apparatus characterized in that: