JP2000118175A - Semiconductor integrated circuit chip sealing method, semiconductor integrated circuit chip device, and semiconductor integrated circuit card - Google Patents
Semiconductor integrated circuit chip sealing method, semiconductor integrated circuit chip device, and semiconductor integrated circuit cardInfo
- Publication number
- JP2000118175A JP2000118175A JP29716298A JP29716298A JP2000118175A JP 2000118175 A JP2000118175 A JP 2000118175A JP 29716298 A JP29716298 A JP 29716298A JP 29716298 A JP29716298 A JP 29716298A JP 2000118175 A JP2000118175 A JP 2000118175A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor integrated
- integrated circuit
- circuit chip
- chip
- sealing resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
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- Credit Cards Or The Like (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は半導体集積回路チッ
プの封止方法、半導体集積回路チップ装置及び半導体集
積回路カードに関する。The present invention relates to a method for sealing a semiconductor integrated circuit chip, a semiconductor integrated circuit chip device, and a semiconductor integrated circuit card.
【０００２】[0002]
【従来の技術】従来の半導体集積回路カード（ＩＣカー
ド）に装填されている半導体集積回路チップ（ＩＣチッ
プ）は、樹脂のスクリーン印刷によって封止されてい
た。2. Description of the Related Art A semiconductor integrated circuit chip (IC chip) mounted on a conventional semiconductor integrated circuit card (IC card) is sealed by screen printing of a resin.
【０００３】[0003]
【発明が解決しようとする課題】かかる従来のＩＣカー
ドに装填されているＩＣチップは、樹脂のスクリーン印
刷によって封止されていたため、強度が低く、しかも、
その封止形状や封止厚のばらつきが大きいと言う欠点が
あった。ＩＣチップの強度が低いと、ＩＣカードが外圧
によって曲げられたときに、ＩＣチップが破損したり、
ＩＣチップの電極の基板の回路パターンに対する接続が
外れたりするおそれがあった。ＩＣチップの封止形状や
封止厚のばらつきが大きいと、ＩＣカードの品質や歩留
りの制御が困難となる。Since the IC chip mounted on such a conventional IC card is sealed by screen printing of a resin, the strength of the IC chip is low.
There is a drawback that the sealing shape and sealing thickness vary greatly. If the strength of the IC chip is low, when the IC card is bent by external pressure, the IC chip may be damaged,
The connection of the electrodes of the IC chip to the circuit pattern of the substrate may be disconnected. If there is a large variation in the sealing shape and sealing thickness of the IC chip, it becomes difficult to control the quality and yield of the IC card.
【０００４】かかる点に鑑み、本発明は、強度が高く、
封止形状や封止厚のばらつきの少ない半導体集積回路チ
ップ装置を得ることのできる半導体集積回路チップの封
止方法及び半導体集積回路チップ装置を提案しようとす
るものである。In view of the above, the present invention has a high strength,
An object of the present invention is to propose a method of sealing a semiconductor integrated circuit chip and a semiconductor integrated circuit chip device capable of obtaining a semiconductor integrated circuit chip device with less variation in the sealing shape and the sealing thickness.
【０００５】又、本発明は、半導体集積回路チップ装置
が破損したり、その電極の基板の回路パターンに対する
接続が外れたりするおそれがなく、しかも、品質や歩留
りの制御の容易な半導体集積回路カードを提案しようと
するものである。Further, the present invention provides a semiconductor integrated circuit card which is free from damage to a semiconductor integrated circuit chip device or disconnection of its electrode from a circuit pattern on a substrate, and which can easily control quality and yield. It is intended to propose.
【０００６】[0006]
【課題を解決するための手段】第１の本発明による半導
体集積回路チップの封止方法は、回路パターンの形成さ
れた基板上に半導体集積回路チップを接着すると共に、
その半導体集積回路チップの電極を回路パターンに接続
し、その半導体集積回路チップの上に封止用樹脂を所定
量塗布し、塗布された封止用樹脂上に補強金属板を配す
ると共に、その補強金属板を介して封止用樹脂を加圧し
て、その封止用樹脂を半導体集積回路チップの周面に流
れ込ませ、半導体集積回路チップの周面に流れ込まれた
封止用樹脂を硬化させるようにしたものである。According to a first method of sealing a semiconductor integrated circuit chip according to the present invention, a semiconductor integrated circuit chip is bonded onto a substrate having a circuit pattern formed thereon, and
The electrodes of the semiconductor integrated circuit chip are connected to a circuit pattern, a predetermined amount of a sealing resin is applied on the semiconductor integrated circuit chip, and a reinforcing metal plate is arranged on the applied sealing resin. The sealing resin is pressed through the reinforcing metal plate to flow the sealing resin into the peripheral surface of the semiconductor integrated circuit chip, and the sealing resin flowing into the peripheral surface of the semiconductor integrated circuit chip is cured. It is like that.
【０００７】かかる第１の本発明によれば、回路パター
ンの形成された基板上に半導体集積回路チップを接着す
ると共に、その半導体集積回路チップの電極を回路パタ
ーンに接続する。次に、その半導体集積回路チップの上
に封止用樹脂を所定量塗布し、塗布された封止用樹脂上
に補強金属板を配すると共に、その補強金属板を介して
封止用樹脂を加圧して、その封止用樹脂を半導体集積回
路チップの周面に流れ込ませる。次に、半導体集積回路
チップの周面に流れ込まれた封止用樹脂を硬化させる。According to the first aspect of the present invention, a semiconductor integrated circuit chip is bonded on a substrate on which a circuit pattern is formed, and electrodes of the semiconductor integrated circuit chip are connected to the circuit pattern. Next, a predetermined amount of a sealing resin is applied on the semiconductor integrated circuit chip, a reinforcing metal plate is arranged on the applied sealing resin, and the sealing resin is applied through the reinforcing metal plate. By applying pressure, the sealing resin flows into the peripheral surface of the semiconductor integrated circuit chip. Next, the sealing resin flowing into the peripheral surface of the semiconductor integrated circuit chip is cured.
【０００８】[0008]
【発明の実施の形態】第１の本発明は、回路パターンの
形成された基板上に半導体集積回路チップを接着すると
共に、その半導体集積回路チップの電極を回路パターン
に接続し、その半導体集積回路チップの上に封止用樹脂
を所定量塗布し、塗布された封止用樹脂上に補強金属板
を配すると共に、その補強金属板を介して封止用樹脂を
加圧して、その封止用樹脂を半導体集積回路チップの周
面に流れ込ませ、半導体集積回路チップの周面に流れ込
まれた封止用樹脂を硬化させることを特徴とする半導体
集積回路チップの封止方法。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first aspect of the present invention is to bond a semiconductor integrated circuit chip onto a substrate on which a circuit pattern is formed, and connect electrodes of the semiconductor integrated circuit chip to the circuit pattern. A predetermined amount of sealing resin is applied on the chip, a reinforcing metal plate is arranged on the applied sealing resin, and the sealing resin is pressed through the reinforcing metal plate to seal the chip. A sealing resin flowing into the peripheral surface of the semiconductor integrated circuit chip and curing the sealing resin flowing into the peripheral surface of the semiconductor integrated circuit chip.
【０００９】第２の本発明は、回路パターンの形成され
た基板と、その基板上に接着されると共に、電極が回路
パターンに接続された半導体集積回路チップと、補強金
属板と、半導体集積回路チップの周面を被覆すると共
に、その半導体集積回路チップ上に補強金属板を固着す
る封止用樹脂部とを有する半導体集積回路チップ装置で
ある。According to a second aspect of the present invention, there is provided a substrate having a circuit pattern formed thereon, a semiconductor integrated circuit chip bonded to the substrate and having electrodes connected to the circuit pattern, a reinforcing metal plate, and a semiconductor integrated circuit. A semiconductor integrated circuit chip device that covers a peripheral surface of the chip and has a sealing resin portion for fixing a reinforcing metal plate on the semiconductor integrated circuit chip.
【００１０】第３の本発明は、回路パターンの形成され
た基板と、その基板上に接着されると共に、電極が回路
パターンに接続された半導体集積回路チップと、補強金
属板と、半導体集積回路チップの周面を被覆すると共
に、その半導体集積回路チップ上に補強金属板を固着す
る封止用樹脂部とを有する半導体集積回路チップ装置
が、カード基板内に装填されてなる半導体集積回路カー
ドである。According to a third aspect of the present invention, there is provided a substrate having a circuit pattern formed thereon, a semiconductor integrated circuit chip bonded to the substrate and having electrodes connected to the circuit pattern, a reinforcing metal plate, and a semiconductor integrated circuit. A semiconductor integrated circuit card device comprising a chip substrate, which covers the peripheral surface of the chip, and has a sealing resin portion for fixing a reinforcing metal plate on the semiconductor integrated circuit chip. is there.
【００１１】〔発明の実施の形態の具体例〕以下に、図
面を参照して、本発明の実施の形態の具体例の半導体集
積回路チップ（ＩＣチップ）の封止方法、半導体集積回
路チップ装置（ＩＣチップ装置）及び半導体集積回路カ
ード（ＩＣカード）を説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Referring to the drawings, a method for sealing a semiconductor integrated circuit chip (IC chip) according to a specific embodiment of the present invention and a semiconductor integrated circuit chip device will be described below. (IC chip device) and a semiconductor integrated circuit card (IC card) will be described.
【００１２】先ず、図１及び図２を参照して、具体例の
ＩＣチップの封止方法及びＩＣチップ装置（図１Ｂ）を
説明する。図２Ａに示す如く、複数の回路パターンＫＰ
が形成されたフィルム基板ＦＢを用意する。図２Ｂに示
す如く、図２Ａのフィルム基板ＦＢの各回路パターンＫ
Ｐ又は各回路パターンＫＰ内のフィルム基板ＦＢ上に、
少量の接着剤ＢＤ１を塗布する。図２Ｃに示す如く、フ
ィルム基板ＦＢの各回路パターンＫＰの接着剤ＢＤ１上
に各ＩＣチップＣＰを載置し、その各ＩＣチップＣＰを
加圧すると共に、各ＩＣチップＣＰ及びフィルム基板Ｆ
Ｂを加熱して、各ＩＣチップＣＰをフィルム基板ＦＢの
各回路パターンＫＰの所定部分に接着（固着）すると共
に、各ＩＣチップＣＰの電極を、それぞれ対応する回路
パターンＫＰの所定の部分に接続する。First, a method for sealing an IC chip and an IC chip device (FIG. 1B) will be described with reference to FIGS. As shown in FIG. 2A, a plurality of circuit patterns KP
A film substrate FB on which is formed is prepared. As shown in FIG. 2B, each circuit pattern K of the film substrate FB of FIG.
P or on the film substrate FB in each circuit pattern KP,
Apply a small amount of adhesive BD1. As shown in FIG. 2C, each IC chip CP is placed on the adhesive BD1 of each circuit pattern KP of the film substrate FB, each IC chip CP is pressed, and each IC chip CP and the film substrate F
By heating B, each IC chip CP is bonded (fixed) to a predetermined portion of each circuit pattern KP of the film substrate FB, and an electrode of each IC chip CP is connected to a predetermined portion of the corresponding circuit pattern KP. I do.
【００１３】そして、図２Ｄ及び図１Ａに示す如く、Ｉ
ＣチップＣＰ上に所定量の封止用樹脂ＳＰ′（接着剤Ｂ
Ｄ２）を塗布し、その封止用樹脂ＳＰ′（接着剤ＢＤ
２）に紫外線を照射して仮硬化する。図２Ｅ並びに図１
Ａ及び図１Ｂに示す如く、ＩＣチップＣＰの上面（矩
形）と相似で、その上面より面積の広い補強金属板（矩
形）ＭＰを、仮硬化された封止用樹脂ＳＰ′（接着剤Ｂ
Ｄ２）上に配し、加圧治具を用いて、その補強金属板Ｍ
Ｐを、補強金属板ＭＰ及びＩＣチップＣＰ間の平行状態
を保持しつつ、ＩＣチップＣＰの上面に向かって均一に
加圧して、図１Ｂに示す如く封止厚を一定にすると共
に、封止用樹脂ＳＰ′（接着剤ＢＤ２）をＩＣチップＣ
Ｐの周面に流れ込ませて、補強金属板ＭＰをＩＣチップ
ＣＰの上面に接着すると共に、ＩＣチップＣＰの周面を
被覆する。そして、その封止用樹脂ＳＰ′（接着剤ＢＤ
２）に紫外線を照射して硬化して、図１Ｂに示す如き、
形状が一定で、封止厚が一定の複数のＩＣチップ装置Ｃ
ＰＤを得る。As shown in FIGS. 2D and 1A, I
A predetermined amount of sealing resin SP '(adhesive B
D2), and the sealing resin SP ′ (adhesive BD)
2) Irradiation with ultraviolet rays for temporary curing. FIG. 2E and FIG.
As shown in FIG. 1A and FIG. 1B, a reinforcing metal plate (rectangular) MP, which is similar to the upper surface (rectangular) of the IC chip CP and has a larger area than the upper surface, is temporarily cured with a sealing resin SP ′ (adhesive B).
D2) Dispose on the reinforcing metal plate M
P is uniformly pressed toward the upper surface of the IC chip CP while maintaining the parallel state between the reinforcing metal plate MP and the IC chip CP, to make the sealing thickness constant as shown in FIG. Resin SP '(adhesive BD2) for IC chip C
The reinforcing metal plate MP is caused to flow into the peripheral surface of the P and adheres to the upper surface of the IC chip CP, and also covers the peripheral surface of the IC chip CP. Then, the sealing resin SP '(adhesive BD)
2) Irradiation with ultraviolet light to cure, as shown in FIG. 1B,
A plurality of IC chip devices C having a constant shape and a constant sealing thickness
Get PD.
【００１４】この複数のＩＣチップ装置ＣＰＤは、図示
せずも、各回路パターンＫＰ毎に打ち抜かれた後、ロー
ルフィルム上に載置されると共に、その各ＩＣチップ装
置ＣＰＤ及びロールフィルム上に亘って、薄膜コーティ
ングが行われた後、加熱ローラ間を通過させて、多数の
ＩＣカードが一列に連結されたカード連結板が得られ、
このカード連結板が定尺切断されて、所定枚数のＩＣカ
ードが一列に連結された定尺カード連結板が複数得ら
れ、その定尺カード連結板が各ＩＣカード毎に打ち抜あ
れて、個別のＩＣカードが得られる。Although not shown, the plurality of IC chip devices CPD are punched out for each circuit pattern KP, and then mounted on a roll film, and extended over the respective IC chip devices CPD and the roll film. Then, after the thin film coating is performed, the thin film is passed between the heating rollers to obtain a card connecting plate in which a number of IC cards are connected in a line,
This card connecting plate is cut to a fixed length to obtain a plurality of fixed-length card connecting plates in which a predetermined number of IC cards are connected in a line, and the fixed-length card connecting plates are punched out for each IC card and individually cut out. IC card is obtained.
【００１５】次に、図３を参照して、ＩＣチップＣＰの
封入されたＩＣカード（半導体集積回路カード）の構造
を説明する。ＩＣチップ装置ＣＰＤがカード基板内に装
填されている。即ち、ＩＣチップ装置ＣＰＤが、例え
ば、エポキシ樹脂からなる充填樹脂層ＩＰ内に装填さ
れ、その充填樹脂層ＩＣＰの表裏にそれぞれ、例えば、
ポリエチレンテレフタレートからなる外装樹脂基板Ｏ
Ｐ、ＯＰが接着されて、ＩＣカードが構成される。Next, the structure of an IC card (semiconductor integrated circuit card) in which an IC chip CP is enclosed will be described with reference to FIG. An IC chip device CPD is loaded in a card substrate. That is, the IC chip device CPD is loaded in a filling resin layer IP made of, for example, an epoxy resin, and, for example, on the front and back of the filling resin layer ICP, for example,
Exterior resin substrate O made of polyethylene terephthalate
The IC card is formed by bonding P and OP.
【００１６】[0016]
【発明の効果】第１の本発明によれば、回路パターンの
形成された基板上に半導体集積回路チップを接着すると
共に、その半導体集積回路チップの電極を回路パターン
に接続し、その半導体集積回路チップの上に封止用樹脂
を所定量塗布し、塗布された封止用樹脂上に補強金属板
を配すると共に、その補強金属板を介して封止用樹脂を
加圧して、その封止用樹脂を半導体集積回路チップの周
面に流れ込ませ、半導体集積回路チップの周面に流れ込
まれた封止用樹脂を硬化させるので、半導体集積回路チ
ップ、補強金属板及び封止用樹脂が一体構造となって、
強度が高く、封止形状や封止厚のばらつきの少ない半導
体集積回路チップ装置を得ることのできる半導体集積回
路チップの封止方法を得ることができる。従って、かか
る半導体集積回路チップ装置を半導体集積回路カードに
装填して頗る好適なものとなる。According to the first aspect of the present invention, a semiconductor integrated circuit chip is bonded to a substrate on which a circuit pattern is formed, and electrodes of the semiconductor integrated circuit chip are connected to the circuit pattern. A predetermined amount of sealing resin is applied on the chip, a reinforcing metal plate is arranged on the applied sealing resin, and the sealing resin is pressed through the reinforcing metal plate to seal the chip. The semiconductor integrated circuit chip, the reinforcing metal plate, and the sealing resin are integrated into an integrated structure because the sealing resin flowing into the peripheral surface of the semiconductor integrated circuit chip and the sealing resin flowing into the peripheral surface of the semiconductor integrated circuit chip are cured. Become
A method for encapsulating a semiconductor integrated circuit chip that has high strength and can provide a semiconductor integrated circuit chip device with small variations in sealing shape and sealing thickness can be obtained. Therefore, such a semiconductor integrated circuit chip device is very suitable to be mounted on a semiconductor integrated circuit card.
【００１７】第２の本発明によれば、回路パターンの形
成された基板と、その基板上に接着されると共に、電極
が回路パターンに接続された半導体集積回路チップと、
補強金属板と、半導体集積回路チップの周面を被覆する
と共に、その半導体集積回路チップ上に補強金属板を固
着する封止用樹脂部とを有するので、半導体集積回路チ
ップ、補強金属板及び封止用樹脂が一体構造となって、
強度が高く、封止形状や封止厚のばらつきの少ない半導
体装置回路チップ装置を得ることができる。従って、か
かる半導体集積回路チップ装置を半導体集積回路カード
に装填して頗る好適なものとなる。According to the second aspect of the present invention, there is provided a substrate having a circuit pattern formed thereon, a semiconductor integrated circuit chip adhered to the substrate and having electrodes connected to the circuit pattern.
Since it has a reinforcing metal plate and a sealing resin portion for covering the peripheral surface of the semiconductor integrated circuit chip and fixing the reinforcing metal plate on the semiconductor integrated circuit chip, the semiconductor integrated circuit chip, the reinforcing metal plate and the sealing The stopping resin has an integral structure,
It is possible to obtain a semiconductor device circuit chip device having high strength and little variation in sealing shape and sealing thickness. Therefore, such a semiconductor integrated circuit chip device is very suitable to be mounted on a semiconductor integrated circuit card.
【００１８】第３の本発明によれば、回路パターンの形
成された基板と、その基板上に接着されると共に、電極
が回路パターンに接続された半導体集積回路チップと、
補強金属板と、半導体集積回路チップの周面を被覆する
と共に、その半導体集積回路チップ上に補強金属板を固
着する封止用樹脂部とを有する半導体集積回路チップ装
置が、カード基板内に装填されてなるので、その半導体
集積回路チップ装置は、その半導体集積回路チップ、補
強金属板及び封止用樹脂が一体構造となって、強度が高
く、封止形状や封止厚のばらつきが少なくなり、このた
め、半導体集積回路チップ装置が破損したり、その電極
の基板の回路パターンに対する接続が外れたりするおそ
れがなく、しかも、品質や歩留りの制御の容易な半導体
集積回路カードを得ることができる。According to the third aspect of the present invention, there is provided a substrate having a circuit pattern formed thereon, a semiconductor integrated circuit chip adhered to the substrate and having electrodes connected to the circuit pattern.
A semiconductor integrated circuit chip device having a reinforcing metal plate and a sealing resin portion for covering the peripheral surface of the semiconductor integrated circuit chip and fixing the reinforcing metal plate on the semiconductor integrated circuit chip is loaded into the card substrate. Therefore, the semiconductor integrated circuit chip device has an integrated structure of the semiconductor integrated circuit chip, the reinforcing metal plate and the sealing resin, has high strength, and has less variation in sealing shape and sealing thickness. Therefore, it is possible to obtain a semiconductor integrated circuit card in which the semiconductor integrated circuit chip device is not damaged or the connection of the electrode to the circuit pattern of the substrate is not disconnected, and the quality and the yield can be easily controlled. .
【図１】本発明の実施の形態の具体例のＩＣチップの封
止方法の具体例の主要部を示す工程図である。FIG. 1 is a process diagram showing a main part of a specific example of an IC chip sealing method according to a specific example of an embodiment of the present invention.
【図２】本発明の実施の形態の具体例のＩＣチップの封
止方法の具体例の工程図である。FIG. 2 is a process chart of a specific example of a method of sealing an IC chip according to a specific example of an embodiment of the present invention.
【図３】本発明の実施の形態の具体例のＩＣカードを示
す断面図である。FIG. 3 is a cross-sectional view showing a specific example of an IC card according to an embodiment of the present invention.
ＦＢ…フィルム基板、ＣＰ…ＩＣチップ、ＭＰ…補強金
属板、ＳＰ′…封止用樹脂、ＳＰ…封止用樹脂部、ＣＰ
Ｄ…ＩＣチップ装置、ＩＰ…充填樹脂層、ＯＰ…外装樹
脂板FB: film substrate, CP: IC chip, MP: reinforcing metal plate, SP ': sealing resin, SP: sealing resin part, CP
D: IC chip device, IP: Filled resin layer, OP: Exterior resin plate
フロントページの続き Ｆターム(参考） 2C005 NB34 PA18 PA26 4M109 AA02 BA04 CA05 CA22 EA02 EC09 ED01 EE01 GA03 5F061 AA02 BA04 CA05 CA22 CB03 CB04 FA03 Continued on the front page F term (reference) 2C005 NB34 PA18 PA26 4M109 AA02 BA04 CA05 CA22 EA02 EC09 ED01 EE01 GA03 5F061 AA02 BA04 CA05 CA22 CB03 CB04 FA03
Claims (3)
体集積回路チップを接着すると共に、該半導体集積回路
チップの電極を上記回路パターンに接続し、 該半導体集積回路チップの上に封止用樹脂を所定量塗布
し、 上記塗布された封止用樹脂上に補強金属板を配すると共
に、該補強金属板を介して上記封止用樹脂を加圧して、
該封止用樹脂を上記半導体集積回路チップの周面に流れ
込ませ、 上記半導体集積回路チップの周面に流れ込まれた上記封
止用樹脂を硬化させることを特徴とする半導体集積回路
チップの封止方法。1. A semiconductor integrated circuit chip is bonded to a substrate on which a circuit pattern is formed, electrodes of the semiconductor integrated circuit chip are connected to the circuit pattern, and a sealing resin is provided on the semiconductor integrated circuit chip. A predetermined amount is applied, and a reinforcing metal plate is arranged on the applied sealing resin, and the sealing resin is pressed through the reinforcing metal plate,
Encapsulating the semiconductor integrated circuit chip by flowing the sealing resin into the peripheral surface of the semiconductor integrated circuit chip and curing the sealing resin flowing into the peripheral surface of the semiconductor integrated circuit chip Method.
に接続された半導体集積回路チップと、 補強金属板と、 上記半導体集積回路チップの周面を被覆すると共に、該
半導体集積回路チップ上に上記補強金属板を固着する封
止用樹脂部とを有することを特徴とする半導体集積回路
チップ装置。2. A substrate having a circuit pattern formed thereon, a semiconductor integrated circuit chip bonded to the substrate and having electrodes connected to the circuit pattern, a reinforcing metal plate, and a periphery of the semiconductor integrated circuit chip. A semiconductor integrated circuit chip device having a sealing resin portion for covering the surface and fixing the reinforcing metal plate on the semiconductor integrated circuit chip.
に接続された半導体集積回路チップと、 補強金属板と、 上記半導体集積回路チップの周面を被覆すると共に、該
半導体集積回路チップ上に上記補強金属板を固着する封
止用樹脂部とを有する半導体集積回路チップ装置が、カ
ード基板内に装填されてなることを特徴とする半導体集
積回路カード。3. A substrate having a circuit pattern formed thereon, a semiconductor integrated circuit chip bonded to the substrate and having electrodes connected to the circuit pattern, a reinforcing metal plate, and a periphery of the semiconductor integrated circuit chip. A semiconductor integrated circuit chip device having a surface covered and a sealing resin portion for fixing the reinforcing metal plate on the semiconductor integrated circuit chip, the semiconductor integrated circuit chip device being loaded in a card substrate. Circuit card.
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29716298A JP2000118175A (en) | 1998-10-19 | 1998-10-19 | Semiconductor integrated circuit chip sealing method, semiconductor integrated circuit chip device, and semiconductor integrated circuit card |
| SG9905073A SG80077A1 (en) | 1998-10-19 | 1999-10-11 | Semiconductor integrated circuit card manufacturing method, and semiconductor integrated circuit card |
| CNB991231392A CN1145207C (en) | 1998-10-19 | 1999-10-19 | Method for producing semiconductor integrated circuit card and semiconductor integrated circuit card |
| HK00106727.7A HK1028842B (en) | 1998-10-19 | 2000-10-23 | Method for producing semiconductor integrated circuit card and semiconductor integrated circuit card |
| US09/413,594 US6765286B1 (en) | 1998-10-19 | 2001-07-02 | Semiconductor integrated circuit device |
| US10/790,450 US7041536B2 (en) | 1998-10-19 | 2004-02-27 | Semiconductor integrated circuit card manufacturing method, and semiconductor integrated circuit card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29716298A JP2000118175A (en) | 1998-10-19 | 1998-10-19 | Semiconductor integrated circuit chip sealing method, semiconductor integrated circuit chip device, and semiconductor integrated circuit card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000118175A true JP2000118175A (en) | 2000-04-25 |
Family
ID=17842999
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29716298A Pending JP2000118175A (en) | 1998-10-19 | 1998-10-19 | Semiconductor integrated circuit chip sealing method, semiconductor integrated circuit chip device, and semiconductor integrated circuit card |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000118175A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002110713A (en) * | 2000-09-29 | 2002-04-12 | Toppan Forms Co Ltd | IC chip protection part and method of forming the same |
| JP3319455B2 (en) | 1999-12-15 | 2002-09-03 | 日本電気株式会社 | Method for manufacturing semiconductor device |
-
1998
- 1998-10-19 JP JP29716298A patent/JP2000118175A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3319455B2 (en) | 1999-12-15 | 2002-09-03 | 日本電気株式会社 | Method for manufacturing semiconductor device |
| JP2002110713A (en) * | 2000-09-29 | 2002-04-12 | Toppan Forms Co Ltd | IC chip protection part and method of forming the same |
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