JP2000155821A - Non-contact IC card and method of manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a non-contact IC card which can also use a paper base material and can simplify the manufacturing process, and a method for manufacturing the same. SOLUTION: The non-contact IC card according to the present invention is a non-contact IC card in which at least one layer of a paper or plastic substrate and another substrate are laminated with another substrate with or without an adhesive layer. Wherein an IC chip is mounted on the single-layer paper or plastic substrate, and
An antenna coil composed of a resin-coated conductive wire formed on the surface of the paper or plastic substrate is connected to both terminals of the C chip. Such a non-contact IC card can be manufactured by a process of mounting an IC chip on a base material and a unique method of drawing an antenna coil directly on a base material with a resin-coated conductor.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a non-contact IC card and a method for manufacturing the same. In particular, the present invention relates to a low-cost card that can be made into an integrated line in production and can use paper material, and a method for producing the card.

[0002]

2. Description of the Related Art Conventionally, a contactless IC card has an IC chip mounted on a printed circuit board or the like, wire-bonded and resin-molded, and further connected to a winding coil, for example, an inlay, an inlet and an IC component connected to a coil of a coated copper wire. A non-contact IC card was manufactured by preparing a module called a module, sandwiching the module with a plastic sheet, obtaining a plate-like module by thermocompression bonding with or without an adhesive layer, and punching out a card. However, non-contact IC cards manufactured by these methods are difficult to produce as low-cost cards because of the diversified processes and expensive raw materials, which hinders the development of IC cards for various applications. I was In addition, if it is a paper substrate, environmental problems at the time of disposal can be reduced. It should be noted that a known technique for producing a non-contact IC card at a low cost using a paper base or the like is not particularly detected. Japanese Patent Application Laid-Open No. 9-315056 introduces a technology of a non-contact type IC card in which a molten resin is injected into a label using paper or the like by injection molding to integrate them, but it requires a complicated process. This is different from the one for the purpose of a simple process as in the present invention.

[0003]

SUMMARY OF THE INVENTION Accordingly, the present invention has been made to provide a low-cost card which has the possibility of producing an integrated line in production and which can use paper materials, and a method for producing the same. . Although the present invention does not limit the card base material to paper, any non-contact IC card made of paper is suitable as a prepaid card such as a telephone card, especially as a disposable card, and has environmental problems (plastic incineration problems). ) Does not occur.

[0004]

A first aspect of the non-contact IC card according to the present invention for solving the above-mentioned problems is that at least one layer of a paper base and another base are provided via an adhesive layer or In a non-contact IC card that is stacked without interposition, an IC chip is mounted on the one-layer paper base, and both terminals of the IC chip are formed on the surface of the paper base. A non-contact IC card, wherein an antenna coil formed of a resin-coated conductor is connected. With such a non-contact IC card, the cost can be reduced and mass production is possible.

A second aspect of the non-contact IC card of the present invention for solving the above-mentioned problems is that at least one layer of a plastic substrate and another substrate are laminated with or without an adhesive layer. In this non-contact IC card, an IC chip is mounted on the one-layer plastic substrate,
In addition, there is provided a non-contact IC card in which an antenna coil composed of a resin-coated conductor formed on the surface of the plastic base material is connected to both terminals of the IC chip. Such a non-contact IC card has high durability, low cost, and high productivity.

The first aspect of the method for manufacturing a non-contact IC card according to the present invention for solving the above-mentioned problems is a step of mounting an IC chip on a flat paper base material, and using a resin-coated conductive wire. After the connection with the first terminal, the antenna coil is formed on the paper base by direct drawing using the resin-coated conductor, and the antenna coil is temporarily fixed to the paper base,
Further, there is provided a method for manufacturing a non-contact IC card, which comprises a step of connecting to another terminal of the IC chip and a step of laminating another card base material with or without an adhesive layer. Because of this manufacturing method, IC
Non-contact IC cards with chips can be mass-produced at low cost.

A second aspect of the method of manufacturing a non-contact IC card according to the present invention for solving the above-mentioned problems is a step of mounting an IC chip on a flat plastic base material, and using a resin-coated conductive wire. After connecting to the first terminal, the antenna coil is formed on the plastic substrate by direct drawing using the resin-coated conductor, and the antenna coil is temporarily fixed to the plastic substrate, and further connected to the other terminals of the IC chip. And a step of laminating another card base material with or without an adhesive layer therebetween. With this manufacturing method, non-contact IC cards having an IC chip mounted on a plastic substrate can be mass-produced at low cost.

A third aspect of the non-contact IC card of the present invention for solving the above problems is that the non-contact IC card is manufactured according to the first of the first aspects of the non-contact IC card manufacturing method of the present invention. A fourth aspect of the non-contact IC card according to the present invention is a non-contact IC card manufactured according to the second aspect of the non-contact IC card manufacturing method of the present invention.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of a non-contact IC card of the present invention and a method of manufacturing the same will be described with reference to the drawings. FIG. 1 is a view showing one embodiment of a non-contact IC card of the present invention. An example is shown in which a non-contact IC card is composed of two layers of base material. FIG. 1A shows a non-contact IC
FIG. 1B is a plan view of the card, and FIG. 1B is a cross-sectional view of a portion taken along line AA in FIG. In the plan view of FIG. 1A, since it is a non-contact IC card, it does not have an external connection terminal portion on the card surface, and nothing appears on the surface except for a printed pattern or the like in appearance. In FIG. 1A, a chain line indicates that there is a conductive wire serving as the IC chip 21 and the antenna coil 22 inside the card.

In the cross-sectional view of FIG. 1B, the two layers of card substrates 11 and 12 are adhered with an adhesive layer 15, the IC chip 21 is mounted on the substrate 11, and the upper substrate 12 is mounted. It is shown that the layers are laminated with an adhesive layer 15 interposed therebetween. That is, the IC chip is directly die-bonded to the base material 12 such as paper. In this die bonding,
An adhesive 16 such as an epoxy-based adhesive can be used. I
The C chip 21 does not form a concave portion or an opening in the paper base material,
The IC chip is simply fixed to the surface of the base material with an adhesive, so that a thin IC chip having a thickness of 50 μm or less is desirable in order not to show irregularities on the card surface.
The card base material can adopt various materials other than paper, for example,
PVC resin, polyethylene terephthalate (PE
T) Resin, polypropylene resin, polycarbonate resin, acrylic resin, polystyrene resin, ABS resin, polyamide resin, polyacetal resin and the like.

The material of the antenna coil 22 must be a resin-coated conductive wire, and a preferred example is a resin-coated copper wire. The ends of the antenna coil are both terminals (pads) 211 and 212 of the IC chip.
Connected to each other. The terminals are preferably gold bump terminals in order to form a good connection. It is preferable that both terminals of the IC chip, the connection between the antenna coil 22 and the upper surface of the IC chip 21 be molded with a sealing agent 23 such as epoxy resin which covers the chip.

An adhesive is applied to the antenna coil surface of the base material 11 formed as described above, or another card base material 12 is laminated via an adhesive layer 15 such as an adhesive sheet. However, when one or both substrates are heat-meltable, the adhesive layer may not be needed. Printed information by printing and decorative patterns can be provided on the surface of the substrate on the card surface side. In this card configuration, the base 11 can be a paper base and the base 12 can be a plastic base. Conversely, the base 11 can be a plastic base and the base 12 can be a paper base. The thickness of the substrate may be as thin as a protective coating if the substrate 11 on which the IC chip is mounted has a predetermined thickness.

Next, a method of manufacturing the non-contact IC card of the above embodiment will be described. First, a base material 11 having a thickness of about half the thickness of the card (typically 0.76 mm) is prepared. When the substrate is a paper substrate, uncoated paper is desirable. This is because coated paper, such as clay-coated paper, is liable to peel off the antenna from the coated portion when the antenna coil is temporarily fixed by a conductive wire later. From the viewpoint that delamination does not occur, the paper on the other side to be laminated is also preferably uncoated paper. As the material of the paper to be used, a paper having a strong inter-sheet strength is preferable, and examples thereof include card paper, high-quality paper, paperboard, and resin-impregnated paper. In the case of resin-impregnated paper, paper impregnated with acrylic resin, epoxy resin, or the like is preferable. It is also possible to print in advance on the front side of the card. However, it is also possible to print after finishing the card without printing in this state.

The terminals 211 and 212 of the IC chip are formed with gold bumps over a large area, so that the bonding of the covered conductor in a later step becomes easy. Normally, IC pad is 1
Although it is 00 μm square, connection (bonding) of the antenna coil 22 to be described later becomes easier if the pad area is increased to about 300 μm square by plating the passivation film.

For forming the antenna coil, 2-5 μm is required.
It is preferable to use a resin-coated wire having a diameter of about 50 to 100 μm, which is resin-coated with a thickness of about m. Copper is most preferable as the conductive wire material from the viewpoint of conductivity and cost. The paper substrate can absorb the undulations of the conductive wire having a considerable diameter, but the hard plastic substrate has a certain limitation because the embedding in the substrate described later is reduced. The resin-coated wire is preferable because, when forming an antenna coil loop on the card base material surface, if an ultrasonic welder is used, the resin can be melted and the conductor wire can be temporarily fixed to the base material. The coating resin may be a commonly used enamel resin or urethane resin, but may be another resin. The diameter of the conducting wire needs to be adjusted not only according to the characteristics of the base material but also according to the characteristics of the IC chip and the number of turns of the coil. Although it depends on the characteristics of the IC chip, in the case of a 100 μm diameter copper wire,
So-called ISO1 corresponding to 13.56 MHz frequency
In an IC conforming to the 4443 standard, good results can be obtained with a coil having three to four turns.

FIG. 2 shows a state in which an antenna coil is drawn on a card base material. First, ultrasonic bonding of a coated conductive wire to one of a terminal (usually made of aluminum) of an IC chip or a gold bump terminal of the IC chip is performed by a capillary. This is performed by supplying a resin-coated conductor through the capillary of the ultrasonic weld bonder 44 to the tip where ultrasonic waves oscillate, and pressing the end of the conductor against the IC chip terminal to apply ultrasonic waves. At this time, since the coating resin is melted and removed, the metal of the terminal metal and the metal of the conductive wire are melted and joined, thereby enabling electrical conduction. After connecting the conductor and the terminal, the conductor is pulled out from the tip of the capillary by pulling the conductor along the scheduled loop line 22s while pressing the conductor on the paper surface with the tip of the capillary as it is. In this state, the antenna coil 22 can be formed by continuing the ultrasonic weld bonding. In the case of paper, the conducting wire is in a state where about half of its diameter is embedded in the paper. In addition, in this state, the coating resin is slightly melted, and the conductor is temporarily fixed to the paper, so that the subsequent steps can be performed stably. Although it depends on the shape of the tip of the weld bonder, it is possible to draw a coil having a pitch of about 0.5 mm in the case of a winding shape. If the substrate is plastic,
Although the amount of embedding is small, the conductor is temporarily fixed to the base material because the coating resin is melted.

FIG. 3 shows a state in which the antenna coil has been drawn on the card base material. After drawing the last turn of the coil (drawing the coil wire), it crosses over its own wire turn previously drawn, that is, draws like a jumper wire, and terminates bonding to other terminals of the IC chip. . If the welder is routed without applying ultrasonic waves to the portion that will become the jumper wire 222, an electrical short is not formed, but even if welding is performed by applying ultrasonic waves, it must be as high as when connecting to a terminal. If the coating resin does not completely disappear, there is no short circuit.

In order to improve the moisture resistance of the IC and to reinforce the bonding strength, a sealant 2 is provided on the IC chip.
It is effective to drop potting 3 and cure it. However, in the case of an IC chip on which gold bump processing has been performed, the moisture resistance is relatively high, and this resin dropping step can be omitted.
When the substrate is a paper substrate or the like, the other card substrate 12 to be laminated
An adhesive is applied to the surface of the adhesive layer 15 and the IC
The card substrate 11 on which the mount and the coil are formed is overlapped, pressed and bonded. Thereafter, a non-contact IC card having a predetermined thickness is obtained by punching the card into the card dimensions (the antenna coil 22 is naturally within the card inner dimensions). Regarding the card substrate coated with adhesive,
Can be printed. In the case of a paper substrate, the printed surface can be protected by printing on the surface that will be the front side of the card, and in the case of a transparent plastic sheet, by printing on the adhesive layer side. In the case of a vinyl chloride resin sheet, since the sheets are bonded by heat fusion under heating and pressure, they can be laminated without using an adhesive.

FIG. 4 is a diagram showing another embodiment of the non-contact IC card of the present invention. The cross section in the case where the non-contact IC card is composed of three layers of card base materials is shown. In this case, for example, the base material 11 serving as the center is a slightly thinner base material than in the case of two layers, and the base material 1 thinner than that is provided above and below it.
A card can be formed in a signed witch state by using 2,13. The attachment of the IC chip to the card base 11 and the drawing of the antenna coil are the same as in the case of the two-layer configuration. However, in this case, since the card base material 11 becomes thinner, weld drawing of the coated conductive wire on the base material becomes easier. That is, because the stage that fixes the card base is usually a robust material such as ceramic,
This is because the thinner the base material, the less the cushioning property and the easier the drawing.

Similarly, as shown in FIG.
It can be a layer configuration. In this case, the center sheets 11 and 12 are used as the centers, and the oversheets 13 and 14 are stacked above and below the center sheet. It is suitable when printing is provided on the outer surface side of the card of the center sheet to protect the printing layer with a transparent oversheet. In these card configurations, the base 11 can be a paper base and the bases 12, 13, and 14 can be plastic bases. Conversely, the base 11 can be a plastic base and the bases 12, 13, and 14 can be a paper base. It can also be a substrate. The thickness of the base material to be the oversheet may be a thin layer having a thickness of about a protective coating, or may be provided by an application step.

As described above, in the method for manufacturing a non-contact IC card according to the present invention, the formation of the antenna coil can be continuously drawn using the bonding tool, and the connection between the IC chip and the antenna can be performed. Since the same tool can be used for bonding, there is no need to prepare a substrate on which an antenna coil pattern is formed or a winding coil for an antenna in advance, and continuous processing can be performed on the same base material. May be consistent. Conventionally, printed wiring and photo-etching techniques have been required to form antenna patterns, and the preparation of various materials and the complexity of the processes have been a major obstacle to reducing the cost of non-contact IC cards. In addition, the present manufacturing method has a possibility of eliminating those obstacles. Furthermore, in the present manufacturing method, a paper or plastic card base material can be manufactured without a substantial difference whether it is in the form of a sheet or a continuous roll. Found.

[0022]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a contactless IC card according to an embodiment of the present invention; FIG. (Example 1) An example of a non-contact IC card composed of two layers of paper material and a method of manufacturing the same will be described. Fine paper without a coat layer having a thickness of 0.40 mm was used as the paper substrates 11 and 12. An IC chip for a non-contact IC card having a thickness of 0.05 mm was mounted on the IC chip mounting portion of the paper base material 11 and the chip bottom was fixed using an epoxy adhesive 16. The terminal pads of the IC chip were subjected to gold bump processing in advance so that the terminal size was 300 μm × 300 μm square.

The antenna coil 22 has a diameter of 100 μm.
A copper wire having a thickness of 3 μm and an enamel coating having a thickness of 3 μm was used. This copper wire is passed through the capillary of the ultrasonic weld bonder 44 rated 28 KHz and output 100 W,
The tip of the copper wire 221 was pressed against one of the gold bumps of the IC chip and bonded by applying ultrasonic waves. After bonding to the bumps, the weld bonder was pressed against the paper as it was, and then drawn on the paper along the predetermined antenna loop line, and finally bonded to the other gold pump to complete the antenna coil 22 (FIG. 3). The pitch between the antenna coils was 1.0 mm. The coil was formed into a rectangular shape of approximately 45 mm × 60 mm on the surface of the base material and formed into four turns. Note that no ultrasonic wave was applied to the portion serving as the jumper wire 222 for a width of 5 mm.
Finally, a copper wire was bonded to the other terminal of the IC chip. The antenna coil was fixed with the enamel melted and temporarily fixed to the paper.

After the antenna coil was formed, epoxy resin was dropped by potting, cured and molded so as to cover the connection between the terminals 211 and 212 of the IC chip and the antenna coil 22 and the upper surface of the IC chip 21. A vinyl acetate-based adhesive was applied to one side of the other paper substrate (high quality paper) to be laminated to a thickness of 10 μm. The adhesive-coated surface and the IC chip of the card base material 11 were mounted and the antenna coil surface was faced to each other and lightly adhered. Finally,
A non-contact IC card was punched out to the card dimensions to complete it. As a result, a 0.80 mm-thick card having a smooth surface with no copper wire irregularities or the like on its surface was completed (FIG. 1B).

(Embodiment 2) An embodiment of a non-contact IC card composed of three layers of paper material and a method of manufacturing the same will be described (FIG. 4). Thickness 0.3 as the paper base material 11 as the center
mm acrylic resin impregnated paper was used. Upper and lower paper base 1
Similarly, acrylic resin-impregnated paper having a thickness of 0.25 mm was used as 2 and 13. An IC chip for a non-contact IC card having a thickness of 0.05 mm was mounted on the IC chip mounting portion of the paper base material 11 and fixed using an epoxy adhesive. The terminal pads of the IC chip were subjected to gold bump processing in advance so that the terminal size was 300 μm × 300 μm square.

The antenna coil 22 has a diameter of 100 μm.
A copper wire having a thickness of 3 μm and a urethane resin coating having a thickness of 3 μm was used. This copper wire was rated at 28 KH in the same manner as in Example 1.
Bonding was performed using an ultrasonic weld bonder having a power of 100 W in z. After bonding to the bump, with the weld bonder pressed against the paper as it is, draw it on the paper along the antenna loop scheduled line and finally bond it to the other gold bump to make the antenna coil approximately 40 mm
It was formed into three turns in a rectangular shape of × 60 mm. The pitch between the coils was 1.0 mm. The antenna coil was fixed with the enamel melted and temporarily fixed to the paper.

After the antenna coil was formed, the upper surface of the IC chip was potted and cured with epoxy resin in the same manner as in Example 1, and was molded. A vinyl acetate-based adhesive was applied to each of the upper and lower paper substrates to be laminated to a thickness of 10 μm. The adhesive-coated surface and the IC chip of the card base were mounted and the antenna coil side was faced, and a paper base was also applied to the lower surface to bond them with light pressure. Finally, the non-contact IC card was punched out to the card size to complete. As a result, a 0.80 mm-thick card having no copper wire irregularities on the surface was completed.

(Embodiment 3) An embodiment of a non-contact IC card composed of two layers of vinyl chloride resin sheets and a method of manufacturing the same will be described. Thickness 0.6 as card base material 11
mm white hard vinyl chloride resin sheet was used. The other card base material 12 to be laminated has a thickness of 0.6 m.
m of white hard vinyl chloride resin sheet. An IC chip for a non-contact IC card having a thickness of 0.05 mm was mounted on the IC chip mounting portion and fixed using an epoxy adhesive. The terminal pads of the IC chip were subjected to gold bump processing in advance so that the terminal size was 300 μm × 300 μm square.

For the antenna coil 22, the diameter is 50 μm.
And a copper wire coated with a urethane resin having a thickness of 3 μm. This copper wire was rated at 28 KH in the same manner as in Example 1.
Bonding was performed using an ultrasonic weld bonder having a power of 100 W in z. After bonding to the lead terminal 211 at one end, the weld bonder is pressed as it is against the surface of the vinyl chloride base material, and the surface of the PVC is drawn along the antenna loop expected line, and finally bonded to the other lead terminal 212 to form an antenna coil. Is approximately 45mm x 60mm
And formed into four turns in a rectangular shape. The pitch between the coils was 1.0 mm. The antenna coil was fixed by temporarily fixing the urethane resin to the surface of the PVC sheet base material (FIG. 3).

After forming the antenna coil, the card base material 11,
12 are laminated, sandwiched between metal plates having mirror surfaces, introduced into a press machine, and subjected to heat pressure (140 ° C., 25 kgf / cm ² , 15
Min) and pressed to form an integral card substrate. Finally, the non-contact IC card was punched out to the card size to complete. As a result, a card having a thickness of 1.2 mm and having no copper wire irregularities on the surface thereof was completed.

[0031]

According to the non-contact IC card of the present invention, the IC chip can be directly mounted on the card base material, and the antenna coil can be drawn directly on the card base material. It is possible to reduce costs. In particular, when a paper substrate is used, environmental problems can be solved, and the cost can be further reduced. In the method for manufacturing a non-contact IC card according to the present invention, since a unique method is used for forming an antenna coil and connecting the antenna coil to the IC chip, there is a possibility that a non-contact IC card is manufactured in a consistent line. Mass production of cards is possible.

[Brief description of the drawings]

FIG. 1 is a diagram showing one embodiment of a non-contact IC card of the present invention.

FIG. 2 shows a state in which an antenna coil is drawn on a card base material.

FIG. 3 shows a state in which an antenna coil has been drawn on a card base material.

FIG. 4 is a diagram showing another embodiment of the non-contact IC card of the present invention.

FIG. 5 is a view showing still another embodiment of the non-contact IC card of the present invention.

[Explanation of symbols]

 11, 12, 13, 14 Card base material 15 Adhesive layer 16 Adhesive 19 Card finish line 21 IC chip 22 Antenna coil 23 Sealant 25 Mold resin 44 Ultrasonic weld bonder 211, 212 Terminal 221 Conductor 222 Jumper wire

Claims (24)

[Claims] 1. A non-contact I comprising at least one layer of a paper substrate and another substrate laminated with or without an adhesive layer.
In the C card, an IC chip is mounted on the one-layer paper base material, and both terminals of the IC chip are provided with an antenna coil formed of a resin-coated conductive wire formed on the surface of the paper base material. A non-contact IC card which is connected. 2. The method according to claim 1, wherein the other base material is one or more paper base materials, and the other one paper base material is laminated via an adhesive layer with the paper base material on which the antenna coil is formed. The non-contact IC card according to claim 1, wherein: 3. The non-contact IC card according to claim 1, wherein the paper substrate on which the antenna coil is formed is uncoated paper. 4. The non-contact IC card according to claim 1, wherein the paper substrate on which the antenna coil is formed is a resin-impregnated paper. 5. The non-contact IC card according to claim 1, wherein the conductor is a copper wire. 6. The non-contact IC card according to claim 1, wherein the conductive wire coated with the resin is temporarily fixed to the paper substrate by a molten coating resin. 7. The other base material is one or a plurality of plastic base materials, and the other one plastic base material is laminated with or without an adhesive layer on a paper base material on which an antenna coil is formed. The non-contact IC card according to claim 1, wherein 8. The non-contact IC card according to claim 1, wherein the terminals of the IC chip are subjected to gold bump processing. 9. A non-contact IC card in which at least one layer of a plastic substrate and another substrate are laminated with or without an adhesive layer, wherein an IC chip is provided on the one layer of the plastic substrate. And the IC
A non-contact IC card, wherein both terminals of the chip are connected to an antenna coil formed of a resin-coated conductor formed on the surface of the plastic substrate. 10. The other substrate is one or more plastic substrates, and the other one plastic substrate is laminated with or without an adhesive layer on a plastic substrate on which an antenna coil is formed. The non-contact IC card according to claim 9, wherein: 11. A plastic base material comprising a resin selected from vinyl chloride resin, polyethylene terephthalate resin, polypropylene resin, polycarbonate resin, acrylic resin, polystyrene resin, ABS resin, polyamide resin, and polyacetal resin. The contactless IC card according to claim 9. 12. The non-contact IC card according to claim 9, wherein the conductive wire is a copper wire. 13. The non-contact IC card according to claim 9, wherein the resin-coated conductive wire is temporarily fixed to the plastic base material by a molten coating resin. 14. The other base material is one or a plurality of paper base materials, and the other one paper base material is laminated with a plastic base material on which an antenna coil is formed via an adhesive layer. The non-contact IC card according to claim 9, wherein: 15. The non-contact IC card according to claim 9, wherein the terminals of the IC chip are subjected to gold bump processing. 16. A step of mounting an IC chip on a flat paper base material, connecting an IC chip to one terminal of the IC chip using a resin-coated conductor, and forming an antenna coil by direct drawing using the resin-coated conductor. A step of temporarily fixing an antenna coil to a paper base at the same time as forming it on a paper base, and further connecting to another terminal of the IC chip, and a step of laminating another card base with or without an adhesive layer A method for manufacturing a non-contact IC card, comprising: 17. The method for manufacturing a non-contact IC card according to claim 16, wherein the paper substrate forming the antenna coil is uncoated paper. 18. The method for manufacturing a non-contact IC card according to claim 16, wherein the paper substrate forming the antenna coil is a resin-impregnated paper. 19. A step of mounting an IC chip on a flat plastic base material, after connecting to one terminal of the IC chip using a resin-coated conductor, and forming an antenna coil by direct drawing using the resin-coated conductor. A step of temporarily fixing an antenna coil to a plastic substrate at the same time as forming it on a plastic substrate and connecting it to another terminal of an IC chip, and a step of laminating another card substrate with or without an adhesive layer A method for manufacturing a non-contact IC card, comprising: 20. The method for manufacturing a non-contact IC card according to claim 16, wherein the resin-coated conductor is a copper wire coated with a resin. 21. The method for manufacturing a non-contact IC card according to claim 16, wherein the terminals of the IC chip are subjected to gold bump processing. 22. Before laminating the other card substrate,
21. The method according to claim 16, further comprising a step of coating a liquid resin by dropping a liquid resin on an upper surface of the C chip terminal and a connecting portion between the IC chip terminal and the resin-coated conductor, and curing the resin. A method for manufacturing a non-contact IC card. 23. A non-contact IC manufactured by the method for manufacturing a non-contact IC card according to claim 16. Description:
C card. 24. A non-contact IC manufactured by the method for manufacturing a non-contact IC card according to claim 19.
C card.