JP2000148949A - Non-contact IC card and method of manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a non-contact IC card which can also use a paper base material and can simplify the manufacturing process, and a method for manufacturing the same. SOLUTION: The non-contact IC card according to the present invention is a non-contact IC card in which at least one layer of a paper or plastic substrate and another substrate are laminated with another substrate with or without an adhesive layer. , A concave cavity is formed on a surface on which the one-layer paper or plastic substrate and another substrate are laminated, and an IC chip is mounted, and both terminals of the IC chip are mounted on the paper or plastic substrate. A non-contact IC card is connected to an antenna coil formed of a resin-coated conductor formed on the surface of a material. Such a non-contact IC card can be manufactured by a process of forming a concave cavity on a base material and a unique method of directly drawing an antenna coil on a base material with a resin-coated conductor.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a non-contact IC card and a method for manufacturing the same. In particular, the present invention relates to a low-cost card that can be made into an integrated line in production and can use paper material, and a method for producing the card.

[0002]

2. Description of the Related Art Conventionally, a contactless IC card has an IC chip mounted on a printed circuit board or the like, wire-bonded and resin-molded, and further connected to a winding coil, for example, an inlay, an inlet and an IC component connected to a coil of a coated copper wire. A non-contact IC card was manufactured by preparing a module called a module, sandwiching the module with a plastic sheet, obtaining a plate-like module by thermocompression bonding with or without an adhesive layer, and punching out a card. However, non-contact IC cards manufactured by these methods are difficult to produce as low-cost cards because of the diversified processes and expensive raw materials, which hinders the development of IC cards for various applications. I was In addition, if it is a paper substrate, environmental problems at the time of disposal can be reduced. It should be noted that a known technique for producing a non-contact IC card at a low cost using a paper base or the like is not particularly detected. Japanese Patent Application Laid-Open No. 9-315056 introduces a technology of a non-contact type IC card in which a molten resin is injected into a label using paper or the like by injection molding to integrate them, but it requires a complicated process. This is different from the one for the purpose of a simple process as in the present invention.

[0003]

SUMMARY OF THE INVENTION Accordingly, the present invention has been made to provide a low-cost card which has the possibility of producing an integrated line in production and which can use paper materials, and a method for producing the same. . Although the present invention does not limit the card base material to paper, any non-contact IC card made of paper is suitable as a prepaid card such as a telephone card, especially as a disposable card, and has environmental problems (plastic incineration problems). ) Does not occur.

[0004]

A first aspect of the non-contact IC card according to the present invention for solving the above-mentioned problems is that at least one layer of a paper base and another base are provided via an adhesive layer or In a non-contact IC card which is laminated without interposition, a concave cavity is formed on a surface of the one-layer paper substrate laminated with another substrate, and an IC chip is mounted thereon. A non-contact IC card is characterized in that an antenna coil made of a resin-coated conductor formed on the surface of the paper base is connected to both terminals of the chip. With such a non-contact IC card, the cost can be reduced and mass production is possible.

A second aspect of the non-contact IC card of the present invention for solving the above-mentioned problems is that at least one layer of a plastic substrate and another substrate are laminated with or without an adhesive layer. In this non-contact IC card, a concave cavity is formed on a surface of the one-layer plastic substrate laminated with another substrate, and an IC chip is mounted thereon.
In addition, there is provided a non-contact IC card in which an antenna coil composed of a resin-coated conductor formed on the surface of the plastic base material is connected to both terminals of the IC chip. Such a non-contact IC card has high durability, low cost, and high productivity.

A first aspect of the method for manufacturing a non-contact IC card according to the present invention for solving the above problems is a step of forming a concave cavity for mounting an IC chip on a paper base material, and bonding inside the concave cavity. Fixing the IC chip with the agent, connecting the terminal to one terminal of the IC chip using the resin-coated conductor, forming the antenna coil on the paper base by direct drawing using the resin-coated conductor, and simultaneously forming the antenna coil on the paper base. A step of temporarily fixing an antenna coil to a material and further connecting to another terminal of the IC chip, and a step of laminating the other card base material with or without an adhesive layer. IC card manufacturing method. With this manufacturing method, non-contact IC cards in which an IC chip is mounted on a paper base can be mass-produced at low cost.

A second aspect of the method for manufacturing a non-contact IC card according to the present invention for solving the above-mentioned problems is a step of forming a concave cavity for mounting an IC chip on a plastic substrate, and bonding in the concave cavity. Fixing the IC chip with the agent, connecting one terminal of the IC chip using the resin-coated conductor, forming the antenna coil on the plastic substrate by direct drawing using the resin-coated conductor, and simultaneously forming the antenna coil on the plastic substrate. Temporarily fix the antenna coil to the material,
Further, there is provided a method for manufacturing a non-contact IC card, which includes a step of connecting to another terminal of the IC chip and a step of laminating the other card base with or without an adhesive layer. With this manufacturing method, non-contact IC cards having an IC chip mounted on a plastic substrate can be mass-produced at low cost.

A third aspect of the non-contact IC card of the present invention for solving the above problems is that the non-contact IC card is manufactured according to the first of the first aspects of the non-contact IC card manufacturing method of the present invention. A fourth aspect of the non-contact IC card according to the present invention is a non-contact IC card manufactured according to the second aspect of the non-contact IC card manufacturing method of the present invention.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of a non-contact IC card of the present invention and a method of manufacturing the same will be described with reference to the drawings. FIG. 1 is a view showing one embodiment of a non-contact IC card of the present invention. An example is shown in which a non-contact IC card is composed of two layers of base material. FIG. 1A shows a non-contact IC
FIG. 1B is a plan view of the card, and FIG. 1B is a cross-sectional view of a portion taken along line AA in FIG. In the plan view of FIG. 1A, since it is a non-contact IC card, it does not have an external connection terminal portion on the card surface, and nothing appears on the surface except for a printed pattern or the like in appearance. In FIG. 1A, a chain line indicates that there is a conductive wire serving as the IC chip 21 and the antenna coil 22 inside the card.

In the sectional view of FIG. 1B, the space between the two card bases 11 and 12 is adhered by an adhesive layer 15, and the IC chip 21 is inserted into the concave cavity 18 provided in one base 11. It is shown that they are inserted and fixed to the bottom of the concave portion with the adhesive 16. That is, the IC chip is directly die-bonded to a base material such as paper. As the card base material, various materials other than paper can be adopted, for example, vinyl chloride resin, polyethylene terephthalate (PET) resin,
Examples include a polypropylene resin, a polycarbonate resin, an acrylic resin, a polystyrene resin, an ABS resin, a polyamide resin, and a polyacetal resin.

The material of the antenna coil 22 must be a resin-coated conductive wire, and a preferred example is a resin-coated copper wire. The ends of the antenna coil are both terminals (pads) 211 and 212 of the IC chip.
Connected to each other. The terminals are preferably gold bump terminals in order to form a good connection. It is preferable that both terminals of the IC chip, the connection between the antenna coil 22 and the upper surface of the IC chip 21 be molded with a sealing agent 23 such as epoxy resin which covers the chip.

An adhesive is applied to the antenna coil surface of the base material 11 formed as described above, or another card base material 12 is laminated via an adhesive layer 15 such as an adhesive sheet. However, when one or both substrates are heat-fusible, an adhesive layer may not be necessary. Printed information by printing and decorative patterns can be provided on the surface of the substrate on the card surface side. In this card configuration, the base 11 can be a paper base and the base 12 can be a plastic base. Conversely, the base 11 can be a plastic base and the base 12 can be a paper base. The thickness of the substrate may be as thin as a protective coating if the substrate 11 on which the IC chip is loaded has a predetermined thickness.

Next, a method of manufacturing the non-contact IC card of the above embodiment will be described. First, a base material 11 having a thickness of about half the thickness of the card (typically 0.76 mm) is prepared. When the substrate is a paper substrate, uncoated paper is desirable. This is because coated paper, such as clay-coated paper, is liable to peel off the antenna from the coated portion when the antenna coil is temporarily fixed by a conductive wire later. From the viewpoint that delamination does not occur, the paper on the other side to be laminated is also preferably uncoated paper. As the material of the paper to be used, a paper having a strong inter-sheet strength is preferable, and examples thereof include card paper, high-quality paper, paperboard, and resin-impregnated paper. In the case of resin-impregnated paper, paper impregnated with acrylic resin, epoxy resin, or the like is preferable. It is also possible to print in advance on the front side of the card. However, it is also possible to print after finishing the card without printing in this state.

FIG. 2 shows a state in which a concave cavity is formed in the card base material. Next, a concave cavity 18 into which the IC chip 21 is inserted is provided in the base material 11. For this, a method using a cutting tool or a stamp die can be adopted. In the case of cutting, a concave shape having a circular shape or a shape close to a circle is easily formed, but a rectangular shape or the like can be formed if cutting takes time. For stamp molds,
In the case of paper, not only a circular shape but also a square shape similar to an IC chip can be provided by one stamp. For example, I
If the C chip is 1.5 mm square, a concave cavity having a depth of about 0.2 mm can be formed by pressing a 2 mm square stamping die. When the card base material is plastic, it is only cutting engraving, and it is difficult to press the stamp. FIG. 2A shows a state in which a square-shaped concave cavity 181 is formed by a stamp die 41, FIG. 2B shows a circular concave cavity 182 formed by a cutting tool 42, and FIG. In which a substantially rectangular cavity 183 is formed by the cutting tool 43 of FIG. In addition,
In FIG. 2, the chain-shaped outer frame indicates a card finishing line 19.

When the concave cavity is formed in the substrate,
The IC chip 21 is fixed in the cavity using the adhesive 16. An epoxy adhesive or the like can be used as the adhesive. The terminals 211 and 212 of the IC chip are subjected to gold bump processing over a wide area to facilitate bonding of the covered conductor in a later step. Normally, IC pad is 1
Although it is 00 μm square, connection (bonding) of the antenna coil 22 to be described later becomes easier if the pad area is increased to about 300 μm square by plating the passivation film.

For forming the antenna coil, 2-5 μm is required.
It is preferable to use a resin-coated wire having a diameter of about 50 to 100 μm, which is resin-coated with a thickness of about m. Copper is most preferable as the conductive wire material from the viewpoint of conductivity and cost. The paper substrate can absorb the undulations of the conductive wire having a considerable diameter, but the hard plastic substrate has a certain limitation because the embedding in the substrate described later is reduced. The resin-coated wire is preferable because, when forming an antenna coil loop on the card base material surface, if an ultrasonic welder is used, the resin can be melted and the conductor wire can be temporarily fixed to the base material. The coating resin may be a commonly used enamel resin or urethane resin, but may be another resin. The diameter of the conducting wire needs to be adjusted not only according to the characteristics of the base material but also according to the characteristics of the IC chip and the number of turns of the coil. Although it depends on the characteristics of the IC chip, in the case of a 100 μm diameter copper wire,
So-called ISO1 corresponding to 13.56 MHz frequency
In an IC conforming to the 4443 standard, good results can be obtained with a coil having three to four turns.

FIG. 3 shows a state in which an antenna coil is drawn on a card base material. First, ultrasonic bonding of a coated conductive wire to one of a terminal (usually made of aluminum) of an IC chip or a gold bump terminal of the IC chip is performed by a capillary. This is performed by supplying the resin-coated conductor 221 to the tip end of the ultrasonic wave transmitted through the capillary of the ultrasonic weld bonder 44 and applying the ultrasonic wave by pressing the end of the conductor against the IC chip terminal. At this time, since the coating resin is melted and removed, the metal of the terminal metal and the metal of the conductive wire are melted and joined, thereby enabling electrical conduction. After connecting the conductor and the terminal, press the conductor on the paper surface with the tip of the capillary as it is, and as the coil loop line 2
If drawn along 2s, the conducting wire 221 is extended from the tip of the capillary. In this state, the antenna coil 22 can be formed by continuing the ultrasonic weld bonding. In the case of paper, the conducting wire is in a state where about half of its diameter is embedded in the paper. In addition, in this state, the coating resin is slightly melted, and the conductor is temporarily fixed to the paper, so that the subsequent steps can be performed stably. Although it depends on the shape of the tip of the weld bonder, it is possible to draw a coil having a pitch of about 0.5 mm in the case of a winding shape. When the base material is plastic, the amount of embedding is small, but since the coating resin is melted, the conductive wire and the base material are temporarily fixed.

FIG. 4 shows a state where the antenna coil has been drawn on the card base material. After drawing the last turn of the coil (drawing the coil wire), it crosses over its own wire turn previously drawn, that is, draws like a jumper wire, and terminates bonding to other terminals of the IC chip. . If the welder is routed without applying ultrasonic waves to the portion that will become the jumper wire 222, an electrical short is not formed, but even if welding is performed by applying ultrasonic waves, it must be as high as when connecting to a terminal. If the coating resin does not completely disappear, there is no short circuit. In the case of printed wiring, it is necessary to perform wiring of this portion to the other surface of the base material through the through hole, but the process can be simplified in this regard.

In order to improve the moisture resistance of the IC and to reinforce the bonding strength, a sealant 2 is provided on the IC chip.
It is effective to drop potting 3 and cure it. However, in the case of an IC chip on which gold bump processing has been performed, the moisture resistance is relatively high, and this resin dropping step can be omitted.
When the substrate is a paper substrate or the like, the other card substrate 12 to be laminated
An adhesive is applied to the surface of the adhesive layer 15 and the IC
The card substrate 11 on which the mount and the coil are formed is overlapped, pressed and bonded. Thereafter, a non-contact IC card having a predetermined thickness is obtained by punching the card into the card dimensions (the antenna coil 22 is naturally within the card inner dimensions). Regarding the card substrate coated with adhesive,
Can be printed. In the case of a paper substrate, the printed surface can be protected by printing on the surface that will be the front side of the card, and in the case of a transparent plastic sheet, by printing on the adhesive layer side. In the case of a vinyl chloride resin sheet, since the sheets are bonded by heat fusion under heating and pressure, they can be laminated without using an adhesive.

FIG. 8 is a diagram showing another embodiment of the non-contact IC card of the present invention. This figure shows a stacked state when a non-contact IC card is constituted by three layers of card base materials. In this case, for example, the card is formed by setting the base material 11 at the center to be a slightly thinner base material than in the case of two layers, and using the thinner base materials 12 and 13 on the upper and lower sides in a signed witch state. be able to. The formation of the concave portion in the card base material 11, the mounting of the IC chip, and the drawing of the antenna coil are performed in 2 steps.
This is the same as in the case of the layer configuration. However, in this case, since the card base material 11 becomes thinner, weld drawing of the coated conductive wire on the base material becomes easier. That is, since the stage on which the card base material is fixed is usually made of a robust material such as ceramic, a thin base material has less cushioning property and facilitates drawing.

Similarly, as shown in FIG.
It can be a layer configuration. In this case, the center sheets 11 and 12 are used as the centers, and the oversheets 13 and 14 are stacked above and below the center sheet. It is suitable when printing is provided on the outer surface side of the card of the center sheet to protect the printing layer with a transparent oversheet. In these card configurations, the base material 11 can be a paper base material and the base material 12 can be a plastic base material. Conversely, the base material 11 can be a plastic base material and the base material 12 can be a paper base material. The thickness of the base material to be the oversheet may be a thin layer having a thickness of about a protective coating, or may be provided by an application step.

In the above description, a manufacturing method using a so-called bare chip as an IC chip used for an IC card is described. However, a method using a module packaged in advance with a resin is also possible. Hereinafter, the manufacturing method will be described with reference to the drawings. FIG. 5 is a diagram showing an IC module packaged with a resin. FIG. 5A is a perspective view thereof, and FIG.
3A shows an enlarged layer cross section taken along line AA of FIG. As shown in FIG. 5, the IC chip 21 is die-bonded to the die pad portion of the lead frame 32 made of a tin-plated thick copper plate. The two terminals 211 and 212 are wire-bonded 24 to the lead frame terminals 321 and 322, transfer-molded by a mold, and packaged with a mold resin 25 such as an epoxy resin. Both terminals are punched out from both ends of the package as leads (Fig. 5
(B)). Since the resin package portion usually has a thickness of about 400 μm, it is necessary to form a concave cavity deeper in the base material than in the case of a bare chip.

FIG. 6 shows a manufacturing process of a non-contact IC card using a resin package IC module. FIG.
FIG. 6 shows a cross section of the completed non-contact IC card in the same case, and FIG.
2 shows a cross section taken along the line AA when the substrate in FIG. When the resin package IC module 21 is used, a cavity having a depth that allows the module to be embedded in a slightly thicker card base material is formed by cutting engraving. The size and shape are adjusted to the resin part of the package. An adhesive is dropped into the recessed cavity, and the package resin portion is housed in the cavity and fixed. Lead both terminals 32
1 and 322 are placed so as to be positioned on the card base material surface.
The antenna coil is formed by bonding a resin-coated conductor to one of the leads at both ends in the same manner as in the previous embodiment, then drawing the antenna coil 22 on the card base material and bonding the other end to the lead terminal. I do. The other card base material is bonded via an adhesive layer or by heat fusion or the like, and punched into a card shape to complete a non-contact IC card.

As described above, in the method of manufacturing a non-contact IC card according to the present invention, the formation of the antenna coil can be continuously drawn by using the bonding tool, and the connection between the IC chip and the antenna can be performed. Since the same tool can be used for bonding, there is no need to prepare a substrate on which an antenna coil pattern is formed or a winding coil for an antenna in advance, and continuous processing can be performed on the same base material. May be consistent. Conventionally, printed wiring and photo-etching techniques have been required to form antenna patterns, and the preparation of various materials and the complexity of the processes have been a major obstacle to reducing the cost of non-contact IC cards. In addition, the present manufacturing method has a possibility of eliminating those obstacles. Furthermore, in the present manufacturing method, a paper or plastic card base material can be manufactured without a substantial difference whether it is in the form of a sheet or a continuous roll. Found.

[0025]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a contactless IC card according to an embodiment of the present invention; FIG. (Example 1) An example of a non-contact IC card composed of two layers of paper material and a method of manufacturing the same will be described. As the paper bases 11 and 12, high-quality paper having a thickness of 0.4 mm without a coat layer was used. A stamping die is pressed against the IC chip mounting portion of the paper base 11 with a pressure of 50 kg (FIG. 2A), and a concave cavity 18 of approximately 1.5 mm square is formed to a depth of 0.2 m.
m. 0.15mm thickness in this cavity
And the bottom of the chip was fixed using an epoxy adhesive 16. In addition, IC
The terminal pads of the chip were preliminarily subjected to gold bump processing so that the terminal size was 300 μm × 300 μm square.

The antenna coil 22 has a diameter of 100 μm.
A copper wire having a thickness of 3 μm and an enamel coating having a thickness of 3 μm was used. This copper wire is passed through the capillary of the ultrasonic weld bonder 44 rated 28 KHz and output 100 W,
The tip of the copper wire 221 was pressed against one of the gold bumps of the IC chip and bonded by applying ultrasonic waves. After bonding to the bump, the antenna loop scheduled line 22S is drawn on the paper with the weld bonder pressed against the paper as it is.
And finally bonded to the other gold pump to complete the antenna coil 22 (FIG. 4). The pitch between the antenna coils was 1.0 mm. The coil has a rectangular shape of approximately 45 mm x 60 mm on the substrate surface.
It was formed into a turn. In addition, the jumper wire 22
No ultrasonic wave was applied to the portion of No. 2 for a width of 5 mm. Finally, a copper wire was bonded to the other terminal of the IC chip. The antenna coil was fixed with the enamel melted and temporarily fixed to the paper.

After the antenna coil was formed, epoxy resin was dropped by potting and cured so as to cover the connection portions between the terminals 211 and 212 of the IC chip and the antenna coil 22 and the upper surface of the IC chip 21. A vinyl acetate-based adhesive was applied to one side of the other paper substrate (high quality paper) to be laminated to a thickness of 10 μm. The adhesive-coated surface and the IC chip of the card base material 11 were mounted and the antenna coil surface was faced to each other and lightly adhered. Finally,
A non-contact IC card was punched out to the card dimensions to complete it. As a result, a 0.80 mm-thick card having a smooth surface with no copper wire irregularities or the like on its surface was completed (FIG. 1B).

(Embodiment 2) An embodiment of a non-contact IC card composed of three layers of paper material and a method of manufacturing the same will be described (FIG. 8). Thickness 0.3 as the paper base material 11 as the center
mm acrylic resin impregnated paper was used. Upper and lower paper base 1
Similarly, acrylic resin-impregnated paper having a thickness of 0.25 mm was used as 2 and 13. A stamping die was pressed against the IC chip mounting portion of the paper substrate 11 with a pressure of 50 kg to form a concave cavity 18 of approximately 1.5 mm square with a depth of 0.2 mm. A 0.15 mm thick non-contact I
An IC chip for a C card was mounted and fixed in the cavity using an epoxy adhesive. The terminal pads of the IC chip are preliminarily subjected to gold bump processing, and the terminal size is 3
It was formed so as to have a size of 00 μm × 300 μm square.

The antenna coil 22 has a diameter of 100 μm.
A copper wire having a thickness of 3 μm and a urethane resin coating having a thickness of 3 μm was used. This copper wire was rated at 28 KH in the same manner as in Example 1.
Bonding was performed using an ultrasonic weld bonder having a power of 100 W in z. After bonding to the bump, with the weld bonder pressed against the paper as it is, draw it on the paper along the antenna loop scheduled line and finally bond it to the other gold bump to make the antenna coil approximately 40 mm
It was formed into three turns in a rectangular shape of × 60 mm. The pitch between the coils was 1.0 mm. The antenna coil was fixed with the enamel melted and temporarily fixed to the paper.

After the formation of the antenna coil, the upper surface of the IC chip was potted with epoxy resin, cured and molded in the same manner as in Example 1. A vinyl acetate-based adhesive was applied to each of the upper and lower paper substrates to be laminated to a thickness of 10 μm. This adhesive-coated surface and the IC chip of the card base were mounted, the antenna coil side was faced, and the paper base 13 was applied to the lower surface, and the surface was adhered by applying light pressure. Finally,
A non-contact IC card was punched out to the card dimensions to complete it. As a result, a 0.8 mm thick card having a smooth surface with no copper wire unevenness or the like on the surface was completed.

(Embodiment 3) An embodiment of a non-contact IC card composed of two layers of vinyl chloride resin sheets and a method of manufacturing the same will be described. Thickness 0.6 as card base material 11
mm white hard vinyl chloride resin sheet was used. The other card base material 12 to be laminated has a thickness of 0.6 m.
m of white hard vinyl chloride resin sheet. The IC chip used was one in which an IC chip was die-bonded to a lead frame obtained by applying tin plating to a copper plate having a thickness of 80 μm, two terminals were wire-bonded to the lead frame, and packaged by transfer molding with an epoxy resin. Module size is 0.4mm high and 5m wide
m and a length of 20 mm (including the lead portion).

A rectangular recess cavity 18 having a depth of 0.32 mm, a width of 6 mm and a length of 10 mm was formed in the IC chip mounting portion of the core sheet 11 using a cutting tool 43.
An IC module previously packaged with a resin was loaded into the cavity, and fixed using an epoxy adhesive.

For the antenna coil 22, the diameter is 50 μm.
And a copper wire coated with a urethane resin having a thickness of 3 μm. This copper wire was rated at 28 KH in the same manner as in Example 1.
Bonding was performed using an ultrasonic weld bonder having a power of 100 W in z. After bonding to the lead terminal 322 at one end, the weld bonder is pressed against the surface of the vinyl chloride base material as it is, and the surface of the PVC is drawn along the antenna loop expected line, and finally bonded to the other lead terminal 321 to form an antenna coil. Was formed into four turns in a rectangular shape of approximately 45 mm × 60 mm. The pitch between the coils was 1.0 mm. The antenna coil was fixed by temporarily fixing the urethane resin to the surface of the PVC sheet substrate by melting (FIG. 6).

After forming the antenna coil, the card base material 11,
12 are laminated, sandwiched between metal plates having mirror surfaces, introduced into a press machine, and subjected to heat pressure (140 ° C., 25 kgf / cm ² , 15
Min) and pressed to form an integral card substrate. Finally, a non-contact IC card was punched out to the size of the card (FIG. 7). As a result, a card having a thickness of 1.2 mm and having no copper wire irregularities on the surface thereof was completed.

[0035]

According to the non-contact IC card of the present invention, the IC chip can be directly mounted on the card base material, and the antenna coil can be drawn directly on the card base material. Can be reduced.
In particular, when a paper substrate is used, environmental problems can be solved, and the cost can be further reduced. In the method for manufacturing a non-contact IC card according to the present invention, since a unique method is used for forming an antenna coil and connecting the antenna coil to the IC chip, there is a possibility that a non-contact IC card is manufactured in a consistent line. Mass production of cards is possible.

[Brief description of the drawings]

FIG. 1 is a diagram showing one embodiment of a non-contact IC card of the present invention.

FIG. 2 shows a state in which a concave cavity is formed in a card base material.

FIG. 3 shows a state in which an antenna coil is drawn on a card base material.

FIG. 4 shows a state in which an antenna coil has been drawn on a card base material.

FIG. 5 is a diagram showing an IC module packaged with a resin.

FIG. 6 shows a manufacturing process of a non-contact IC card using a resin package IC module.

FIG. 7 shows a cross section of a completed non-contact IC card when a resin package IC module is used.

FIG. 8 is a diagram showing another embodiment of the non-contact IC card of the present invention.

FIG. 9 is a view showing still another embodiment of the non-contact IC card of the present invention.

[Explanation of symbols]

 11, 12, 13, 14 Card base material 15 Adhesive layer 16 Adhesive 18 Recessed cavity 19 Card finishing line 21 IC chip 22 Antenna coil 22S Antenna loop scheduled line 23 Sealant 24 Wire bonding 25 Mold resin 31 IC chip 32 Metal Lead Frame 41 Stamp Die 42 Cutting Tool 43 Small Diameter Cutting Tool 44 Ultrasonic Weld Bonder 211, 212 Terminal 221 Conductor 222 Jumper Wire 321, 322 Lead Frame Terminal

Claims (28)

[Claims] 1. A non-contact I comprising at least one layer of a paper substrate and another substrate laminated with or without an adhesive layer.
In the C card, a concave cavity is formed on a surface of the one-layer paper base material laminated with another base material, and an IC chip is mounted thereon. A non-contact IC card to which an antenna coil formed of a resin-coated conductor formed on the surface of a material is connected. 2. The method according to claim 1, wherein the other base material is one or more paper base materials, and the other one paper base material is laminated via an adhesive layer with the paper base material on which the antenna coil is formed. The non-contact IC card according to claim 1, wherein: 3. The non-contact IC card according to claim 1, wherein the paper substrate on which the antenna coil is formed is uncoated paper. 4. The non-contact IC card according to claim 1, wherein the paper substrate on which the antenna coil is formed is a resin-impregnated paper. 5. The non-contact IC card according to claim 1, wherein the conductor is a copper wire. 6. The non-contact IC card according to claim 1, wherein the conductive wire coated with the resin is temporarily fixed to the paper substrate by a molten coating resin. 7. The other base material is one or a plurality of plastic base materials, and the other one plastic base material is laminated with or without an adhesive layer on a paper base material on which an antenna coil is formed. The non-contact IC card according to claim 1, wherein 8. The non-contact IC card according to claim 1, wherein both terminals of the IC chip are subjected to gold bump processing. 9. The non-contact IC card according to claim 1, wherein the IC chip is packaged and has external leads to be connected to a conductive wire. 10. A non-contact IC card in which at least one layer of a plastic substrate and another substrate are laminated with or without an adhesive layer, the other substrate of the one layer of plastic substrate A concave cavity is formed on the surface on which the IC chip is mounted, and the IC chip is mounted thereon.
A non-contact IC card, wherein an antenna coil formed of a resin-coated conductor formed on the surface of the plastic substrate is connected to both terminals of the C chip. 11. The other substrate is one or a plurality of plastic substrates, and the other one plastic substrate is laminated with a plastic substrate on which an antenna coil is formed with or without an adhesive layer. The non-contact IC card according to claim 10, wherein: 12. A plastic base material comprising a resin selected from vinyl chloride resin, polyethylene terephthalate resin, polypropylene resin, polycarbonate resin, acrylic resin, polystyrene resin, ABS resin, polyamide resin, and polyacetal resin. The contactless IC card according to claim 10. 13. The non-contact IC card according to claim 10, wherein the conductor is a copper wire. 14. The non-contact IC card according to claim 10, wherein the resin-coated conductive wire is temporarily fixed to the plastic substrate by a molten coating resin. 15. The method according to claim 15, wherein the other substrate is one or more paper substrates, and the other one paper substrate is laminated via an adhesive layer with the plastic substrate on which the antenna coil is formed. The non-contact IC card according to claim 10, wherein: 16. The terminal according to claim 10, wherein both terminals of the IC chip are subjected to gold bump processing.
The non-contact IC card described in the above. 17. The non-contact IC card according to claim 10, wherein the IC chip is packaged and has external leads to be connected to a conductive wire. 18. A step of forming a concave cavity for mounting an IC chip in a paper base, a step of fixing an IC chip in the concave cavity with an adhesive, and one terminal of the IC chip using a resin-coated conductor. After connecting, the antenna coil is formed on the paper base by direct drawing using the resin-coated conductor, and the antenna coil is temporarily fixed to the paper base at the same time,
A method for manufacturing a non-contact IC card, further comprising a step of connecting to another terminal of the IC chip and a step of laminating the other card base with or without an adhesive layer. 19. The method for manufacturing a non-contact IC card according to claim 18, wherein the paper substrate forming the antenna coil is uncoated paper. 20. The method for manufacturing a non-contact IC card according to claim 18, wherein the paper substrate forming the antenna coil is a resin-impregnated paper. 21. A step of forming a concave cavity for mounting an IC chip in a plastic substrate, a step of fixing an IC chip in the concave cavity with an adhesive, and one terminal of the IC chip using a resin-coated conductor. After forming the antenna coil on the plastic substrate by direct drawing using the resin-coated conductor, the antenna coil is temporarily fixed to the plastic substrate, and further connected to other terminals of the IC chip. A step of laminating the card base material with or without an adhesive layer. 22. The method for manufacturing a non-contact IC card according to claim 18, wherein the resin-coated conductive wire is a copper wire coated with a resin. 23. The method of manufacturing a non-contact IC card according to claim 18, wherein the terminals of the IC chip are subjected to gold bump processing. 24. The method for manufacturing a non-contact IC card according to claim 18, wherein the IC chip is packaged and has external leads to be connected to a conductive wire. 25. Before laminating the other card substrate,
22. The method according to claim 18, further comprising a step of coating the upper surface of the C chip terminal, the connection portion between the IC chip terminal and the resin-coated conductor by dropping a liquid resin, and curing the resin. A method for manufacturing a non-contact IC card. 26. The method according to claim 1, wherein the formation of the concave cavity is performed by a pressing stamp or a cutting tool.
The method for manufacturing a non-contact IC card according to any one of claims 8 to 22. 27. A non-contact IC manufactured by the method for manufacturing a non-contact IC card according to claim 18.
C card. 28. A non-contact IC manufactured by the method for manufacturing a non-contact IC card according to claim 21.
C card.