JP2000021680A - Manufacture of multilayer chip component and device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To highly precisely determine a cutting position of a ceramic laminate so as to precisely cut out the ceramic laminated by determining a cutting position for each sheet, even if there is dispersion such as deformation between the ceramic laminates. SOLUTION: A transmissive ray B is emitted to a plane of a ceramic laminate 1 by a beam emitting device 12. From an image of an inner electrode that is obtained from the transmissive ray B, a cutting position in an XY direction for cutting the ceramic laminate 1 is measured by an image analysis processing device 13. Then, a cutting device 15 is operated according to the measured data to cut the ceramic laminate 1 into ceramic laminate chips for respective components.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for manufacturing a laminated chip component which is used for cutting a ceramic laminate for obtaining a plurality of components into ceramic laminated chips for each component.

[0002]

2. Description of the Related Art In general, in order to manufacture a multilayer chip component such as a multilayer chip capacitor, a plurality of internal electrodes are arranged vertically and horizontally, and ceramic green sheets formed on the same plane are alternately positioned with the internal electrodes and laminated. A ceramic green sheet on which no internal electrode is formed is laminated on the outermost layer to form a ceramic laminate for obtaining a plurality of components.
By cutting in the Y direction, a ceramic laminate chip for each component is obtained.

The ceramic laminated chip is fed into a firing step and subjected to a firing process to be formed as a component body of a chip component, and further sent to a terminal electrode forming step to be electrically connected to alternate and alternate internal electrodes. By providing terminal electrodes at both ends of the component body, it is manufactured as a completed laminated chip component.

Conventionally, during the manufacturing process of the chip component, in order to cut the ceramic laminate for obtaining a plurality of components into ceramic laminate chips for each component, a positioning mark formed by printing in advance on the surface of the outermost ceramic sheet is used. Alternatively, assuming the position of the internal electrode based on the outer periphery of the ceramic laminate, and determining the cutting position of the ceramic laminate,
By adjusting the actual internal electrodes and the cutting position by performing several test cuttings, a specified value of the margin is ensured.

[0005] However, this not only wastes the ceramic laminate used for the test cutting, but also presupposes that the positions of the internal electrodes do not vary so much. No matter how many test cuts are made, the cutting position cannot be determined.
If the specified value of the margin is not ensured, it causes insulation failure and the like due to exposure of the internal electrodes.

[0006] Regarding the cutting of the ceramic laminate, an electric sensor such as an eddy current type, a capacitance type, or an ultrasonic type is moved on the ceramic laminate, and a voltage generated at a portion where an internal electrode is present. It has been proposed to detect a cutting position by a waveform obtained from a difference between a voltage generated at a portion where no internal electrode is present and a voltage generated at a stage of moving between the two (Japanese Patent Publication No. 7-97537).

[0007] By electrically detecting the cutting position, the cutting position must be determined from a waveform that slightly changes, and the obtained waveform is used later to control the cutting device to operate. It is also difficult, and the cutting device must be operated in response to the waveform. For this reason, a skilled technique is required, and in particular, it is difficult to cope with high-precision cutting for small chip components.

[0008]

SUMMARY OF THE INVENTION According to the present invention, the cutting position of the ceramic laminate can be determined with high accuracy, and the cutting position is determined for each sheet, so that the ceramic laminate may be displaced due to deformation or the like. It is an object of the present invention to provide a method and an apparatus for manufacturing a laminated chip component capable of accurately cutting a ceramic laminated body even if attached.

In addition, another object of the present invention is to provide a method and an apparatus for manufacturing a laminated chip component capable of determining cutting position data of a ceramic laminate with high accuracy.

Another object of the present invention is to provide a method and an apparatus for manufacturing a multilayer chip component capable of reproducing cutting position data of a ceramic laminate with high accuracy.

Another object of the present invention is to provide a method and an apparatus for manufacturing a laminated chip component capable of efficiently cutting a ceramic laminate by rationally utilizing cutting position data of the ceramic laminate.

[0012]

According to a first aspect of the present invention, there is provided a method for manufacturing a laminated chip component, wherein a plurality of internal electrodes are arranged vertically and horizontally to form a ceramic green sheet alternately with the internal electrodes. A plurality of ceramic green sheets on which no internal electrodes are formed are laminated on the outermost layer to obtain a ceramic laminate for obtaining a plurality of components, and the ceramic laminate is placed in accordance with the electrode position of the internal electrodes. In order to obtain a ceramic laminate chip for each part by cutting in the X and Y directions, a transmitted light beam is radiated toward the plane of the ceramic laminate by a light irradiation device, and the ceramic laminate is obtained from the image of the internal electrode obtained by the transmitted light beam. The cutting position in the X and Y directions for cutting the body is measured by the image analysis processing device, and the cutting device is operated based on the measured data to thereby cut the ceramic. It is adapted to cut the layers of component units ceramic laminate chips.

In the method of manufacturing a laminated chip component according to a second aspect of the present invention, the ceramic laminate is cut from the image of the internal electrode obtained by the transmitted light with reference to the coordinates in the XY directions on the plane of the ceramic laminate. The cutting position in the XY directions is measured by an image analysis processing device.

According to a third aspect of the present invention, in the method of manufacturing a laminated chip component, the ceramic laminate is placed on a transport table movable in the X and Y directions and capable of changing its direction in the θ direction, and the transport table for the ceramic laminate is provided. X above
The displacement in the Y direction is obtained by an image processing apparatus, and the displacement of the ceramic laminate is corrected by moving in the XY direction or changing the direction in the θ direction by the transfer table to determine the coordinates in the XY direction on the plane of the ceramic laminate. It has been like that.

In the method of manufacturing a laminated chip component according to a fourth aspect of the present invention, the ceramic laminate is moved in the X and Y directions on a transfer table to irradiate a transmitted light, and the transmitted light causes an overall image of the internal electrode to be formed. Is obtained by the image analysis processing device.

In the method of manufacturing a laminated chip component according to a fifth aspect of the present invention, the cutting position of the ceramic laminate measured by the image analysis processing device is recorded as cutting position data on a data recording medium. The cutting device is operated according to the cutting position data taken out.

In the apparatus for manufacturing a laminated chip component according to a sixth aspect of the present invention, a plurality of ceramic green sheets formed on the same plane by arranging a plurality of internal electrodes vertically and horizontally and alternately with the internal electrodes are stacked. At the same time, a ceramic green sheet on which no internal electrode is formed is laminated on the outermost layer to obtain a ceramic laminate for obtaining a plurality of components, and the ceramic laminate is cut in the XY directions according to the electrode position of the internal electrode. And a beam irradiation device for irradiating a transmitted light beam toward the plane of the ceramic laminate, and an XY direction for cutting the ceramic laminate from an image of the internal electrode obtained by the transmitted light. An image analysis processor for measuring the cutting position of the ceramic laminate, and a cutting device for the ceramic laminate that operates based on the measurement data. It is constituted by Rukoto.

According to a seventh aspect of the present invention, there is provided an apparatus for manufacturing a laminated chip component, wherein a light irradiation apparatus for irradiating a transmitted light beam toward a plane of the ceramic laminate and a coordinate in the XY directions on the plane of the ceramic laminate are used as a reference. And an image analysis processing device for measuring a cutting position in the XY directions for cutting the ceramic laminate from an image of the internal electrode obtained by the transmitted light, and a cutting device for the ceramic laminate that operates based on the measurement data. Have been.

In the manufacturing apparatus of a laminated chip component according to an eighth aspect of the present invention, a transfer table on which a ceramic laminate is placed and which can be moved in the XY directions and can change its direction in the θ direction, and the mounting of the ceramic laminate X on the table
The apparatus is provided with an image processing device that detects a position shift in the Y direction, corrects the position shift by drive control of the transport table, and determines reference coordinates in the XY directions on the plane of the ceramic laminate.

According to a ninth aspect of the present invention, there is provided an apparatus for manufacturing a multilayer chip component, comprising: a transfer table on which a ceramic laminate is placed and which moves in the X and Y directions; And an image analysis processing device for obtaining an overall image of the electrode.

According to a tenth aspect of the present invention, there is provided an apparatus for manufacturing a laminated chip component, comprising: a data recording medium for recording a cutting position of a ceramic laminate measured by an image analysis processing device as cutting position data; And a cutting device for the ceramic laminate that is operated based on the cutting position data to be taken out.

[0022]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Referring to the accompanying drawings, the illustrated embodiment is an apparatus for manufacturing chip components such as a multilayer ceramic capacitor. It is applied for cutting into laminated chips. The ceramic laminate 1, which is an object to be cut, has a plurality of internal electrodes arranged vertically and horizontally, and ceramic green sheets formed on the same plane are alternately positioned and laminated with the internal electrodes. The sheet can be manufactured as usual by laminating the sheet on the outermost layer and pressing under pressure.

In the apparatus for manufacturing a laminated chip component, as shown in FIG. 1, a transfer table 10 for mounting and transferring the ceramic laminate 1 on a table, an image processing apparatus 11 for correcting a displacement of the ceramic laminate 1, A light beam irradiation device 12 for irradiating a transmitted light beam toward the plane of the ceramic laminate 1 and an image analysis processing device 13 for measuring a cutting position in the X and Y directions for cutting the ceramic laminate from an image of the internal electrode obtained by the transmitted light beam are cut. It is provided as a means for determining the position.

In addition to the step of determining the cutting position of the ceramic laminate 1, the image analysis processing device 13 uses the cutting position in the X and Y directions as measurement data in order to efficiently cut a plurality of ceramic laminates 1 collectively. A data recording medium 14 for storing is provided. This data recording medium 1
With the use of 4, the measurement data can be input to the terminal 15a, and the cutting device 15 can be driven and controlled so that the cutting machine 15b operates with the measurement data output from the terminal 15a. In this cutting step, a transport table 16 for placing the ceramic laminate 1 on the table and sending the ceramic laminate 1 to the cutting device 15 and an image processing device 17 for correcting misalignment of the ceramic laminate 1 on the table in the X and Y directions are provided. Have been.

The transport table 10 is provided as a transport means for placing the ceramic laminate 1 on the table and sequentially sending the ceramic laminate 1 to the respective zones of the image processing device 11 and the transmitted light irradiation device 12. .
The transfer table 10 is provided with a so-called XY table as means for placing the ceramic laminate 1 and feeding it in the XY directions and changing the direction in the θ direction.
Further, a stock box 18 for accommodating a plurality of ceramic laminates 1 and a ceramic box 1
Suction picking head 1 that transfers one by one to the table from 8
9 are provided.

The image processing apparatus 11 includes a plurality of imaging cameras 1
1a and 11b, and an imaging operation processing unit 11c connected to the imaging cameras 11a and 11b via a cable. As shown in FIG. 2, the image processing apparatus 11 captures the target marks 2a to 2d printed in advance on the surface of the ceramic sheet, which is the outermost layer of the ceramic laminate 1, or the outer periphery of the ceramic laminate 1 with the imaging cameras 11a, 1
1b, it is provided as a means for determining the coordinates X and Y in the XY directions on the plane of the ceramic laminate 1 by the imaging arithmetic processing unit 11c.

X in the plane of the ceramic laminate 1
The coordinates X and Y in the Y direction are determined as a reference for measuring a cutting position of the ceramic laminate 1 described later, and a reference of the measurement data stored in the data storage medium 14 and the transfer table 16 of the ceramic laminate 1. This is because the data is set to match the placement position above. However, in order to determine the coordinates X and Y in the XY directions, since there is a variation in the mounting position of the ceramic laminate 1 on the transport table 10, the XY and θ directions in the transport table 10 of the ceramic laminate 1 are determined. It is necessary to correct the displacement.

As shown in FIGS. 3A to 3C, the position shift is corrected by, for example, the center of gravity of the ceramic laminate 1 in the X and Y directions from the images of the target marks 2a to 2d which can be taken by the imaging cameras 11a and 11b (see FIG. 1). give the coordinate axes X _1, Y ₁ position G, coordinate axes X ₁ of the center of gravity position G, Y ₁
And the coordinate axes X ₂ and Y ₂ of the origin position O in the XY directions of the transport table 10 determined in advance.

The transfer table 1 of the ceramic laminate 1
When there is a displacement in the θ direction at 0, the transport table 10 is rotated in the θ direction as shown in FIG.
As shown by, the angle correction is performed so that the coordinate axes X ₁ and Y 1 at the center of gravity G of the ceramic laminate ₁ and the coordinate axes X ₂ and Y _{2 at} the predetermined origin O of the transfer table 10 are parallelized. Next, as shown in FIG. 3C, the transfer table 10 is moved in the X direction and the Y direction by pitches, respectively, and the coordinate axes X ₁ and Y ₁ of the ceramic laminate ₁ are set to the transfer table 1.
The position deviation can be corrected by matching the coordinate axes X ₂ and Y ₂ with 0.

The transmitted light irradiating device 12 is provided as means for irradiating the plane of the ceramic laminate 1 with the transmitted light B in order to obtain, as an image, the internal electrodes of the ceramic laminate 1 which have been subjected to the positional deviation correction. . The transmitted light B includes a ceramic laminate 1 such as an infrared ray, an X-ray, an ultrasonic ray, or the like.
Can be used as long as an image of the internal electrode can be obtained by transmitting light.

The image analysis processing unit 13 measures the cut position of the ceramic laminate 1 from the transmitted light condensing camera 13b including the transmitted light detecting device 13a and the image of the internal electrode by the transmitted light captured by the condensing camera 13b. And an image calculation processing unit 13c. In the image analysis processing device 13, as shown in FIG. 4, the image of the internal electrode 1a can be clearly represented by a black pattern, and the ceramic portion 1b without the internal electrode 1a can be clearly distinguished by a white pattern. For this reason, as described later, the cutting position of the ceramic laminate 1 can be obtained stably with high accuracy from a clear image of the internal electrode.

The image is obtained as an overall image of the internal electrodes 1a formed on the same plane by moving the ceramic laminate 1 in the X and Y directions by the above-described transfer table 10 and arranging the ceramic laminates 1 vertically and horizontally. Using this image, the coordinate axes f ₁ , f ₂ , f ₃ , f at the edges of the adjacent internal electrodes 1a are used.
₄ as the coordinates C ₁ and C _{2 in} the X and Y directions at the center position of the ceramic portion 1 b obtained from the image analysis processing device 1.
It can be calculated by 3.

The coordinates C ₁ and C ₂ in the XY direction at the center position of the ceramic portion 1b are used as the cutting position data of the ceramic laminate 1 and the coordinates X and X in the XY direction on the plane of the ceramic laminate 1 as shown in FIG. Based on Y, it can be obtained as distance data separated from the coordinates X and Y in the XY directions. The cutting position data is stored in a data recording medium 14 such as a floppy disk provided in the image analysis processing device 13 as data including coordinates X and Y in the XY directions on the plane of the ceramic laminate 1. Further, the data recording medium 14 stores the number of the ceramic laminate 1 corresponding to the cutting position data to be stored.

The data storage medium 14 can be carried to a plurality of cutting devices together with a plurality of ceramic laminates on which data is recorded, and a cutting operation can be performed for each data storage medium. In each cutting device 15, the operation of the cutting machine 15b is controlled based on the cutting position data input to the terminal 15a from the data recording medium 14 and taken out from the terminal 15a, and one sheet of the ceramic laminate 1 is transferred by the transfer table 16 described above. The cutting process can be performed by feeding each one.

The ceramic laminate 1 is transferred to the transfer table 1
When the ceramic laminate 1 is sent to the cutting device 15 in step 6, the placement of the ceramic laminate 1 on the transfer table 16 varies. 1
7b, the displacement of the ceramic laminated body 1 in the XY direction and the θ direction is corrected by the movement control of the transport table 16 by the imaging calculation processing unit 17c, whereby the transfer table 16 of the ceramic laminated body 1 is corrected.
X and Y coordinates in the X and Y directions above and the data recording medium 14
Match with the saved cutting position data.

The ceramic laminate 1 is pitch-fed by the transfer table 16 in each of the XY directions, and the coordinates C ₁ and C ₂ in the XY directions at the center of the ceramic portion 1b are moved directly below the straight blade provided in the cutting machine 15b. It is sufficient to control the output by the terminal device 15a so that the straight blade is activated when it is done. In addition, this cutting operation may be performed for each of the X and Y directions, and may be performed in a later step so as to apply to a strip-shaped ceramic laminate in which the internal electrodes are arranged in a line.

By cutting the ceramic laminate 1 in this manner, the cutting position of the ceramic laminate can be determined with high precision from the image of the internal electrode, and since the cutting position is determined for each sheet, the ceramic laminate is cut. The ceramic laminate 1 can be cut accurately even if there is a variation due to deformation or the like. For this reason, as shown in FIG. 6, the ceramic laminated body chip 1 ′ cut into parts can be obtained as one that secures margins 1c and 1d of specified values.

In the above-described embodiment, the explanation has been given based on the case where a plurality of ceramic laminates 1 are collectively cut and processed in a separate step, separately from the step of determining the cutting position of the ceramic laminate 1. By directly operating the cutting device 15 based on the cutting position data obtained by the analysis processing device 13, it is possible to cut the ceramic laminate for obtaining a plurality of components into ceramic laminate chips for each component.

[0039]

As described above, according to the method and apparatus for manufacturing a laminated chip component according to claims 1 and 6 of the present invention,
An image of the internal electrode is obtained as a clear black-and-white image by the transmitted light irradiated by the light irradiation device toward the plane of the ceramic laminate, and the cutting position of the ceramic laminate is determined from the clear image of the internal electrode by an image analysis processing device. Since the measurement is performed, the cutting position of the ceramic laminate can be measured stably and with high accuracy.

In addition, since the ceramic laminate is cut into parts by operating the cutting device based on the measured data, the ceramic laminate can be accurately cut as a ceramic laminate chip having a specified margin. Further, since the cutting position is determined for each sheet, even if there is a variation between the ceramic laminates due to deformation or the like, the ceramic laminate can be cut accurately and the yield can be improved.

According to the method and the apparatus for manufacturing a multilayer chip component according to claims 2 and 7 of the present invention, the image of the internal electrode obtained by the transmitted light with reference to the coordinates in the XY directions on the plane of the ceramic laminate. The cutting position in the X and Y directions for cutting the ceramic laminate is measured by the image analysis processing device. Therefore, even if the cutting operation of the ceramic laminate is performed separately from the determination of the cutting position, the cutting position data of the ceramic laminate can be accurately obtained. It can be regenerated and the ceramic laminate can be cut accurately.

According to the method and the apparatus for manufacturing a laminated chip component according to claims 3 and 8 of the present invention, the positional deviation of the ceramic laminated body in the XY direction on the transfer table is corrected, and the XY plane in the plane of the ceramic laminated body is corrected. Since the coordinates of the directions are determined, the cutting position data can be accurately obtained even from the ceramic laminates sequentially fed by the transfer table, and the work efficiency can be improved, and the ceramic laminates can be accurately cut.

According to the method and the apparatus for manufacturing a laminated chip component according to the fourth and ninth aspects of the present invention, the entirety of the internal electrode is formed by moving the ceramic laminated body in the XY directions on the transfer table and irradiating the transmitted light. Since a typical image is obtained by the image analysis processing device, the entire ceramic laminate can be accurately cut by the measurement data of the cutting position obtained from the entire image of the internal electrode, and the yield can be improved.

According to the method and the apparatus for manufacturing a laminated chip component according to the fifth and tenth aspects of the present invention, the determination of the cutting position of the ceramic laminate and the cutting of the ceramic laminate are separately managed in a centralized manner. Therefore, the cutting operation of the ceramic laminate can be efficiently performed, and the productivity can be improved.

[Brief description of the drawings]

FIG. 1 is an explanatory view schematically showing an apparatus for manufacturing a laminated chip component according to an embodiment of the present invention.

FIG. 2 is an explanatory diagram showing coordinates in the XY directions on a plane of a ceramic laminate used in the method for manufacturing a laminated chip component according to the present invention.

FIG. 3A is an explanatory diagram showing a state before correcting a positional shift in the XY direction on a transfer table of a ceramic laminate performed in the method for manufacturing a laminated chip component according to the present invention.

FIG. 3B is an explanatory view showing a state after correcting a positional shift in the θ direction in the transfer table of the ceramic laminate of FIG. 3A.

FIG. 3C is an explanatory view showing a step of performing position shift correction in the XY direction from position shift correction in the θ direction in the transfer table of the ceramic laminate in FIG. 3B.

FIG. 4 is an explanatory view partially showing a step of obtaining a cutting position of a ceramic laminate from an image of an internal electrode in the method for manufacturing a laminated chip component according to the present invention.

FIG. 5 is a diagram illustrating a method for manufacturing a multilayer chip component according to the present invention, with reference to coordinates in the XY directions on the plane of the ceramic multilayer body;
It is an explanatory view showing the whole process of obtaining a cutting position of a ceramic layered product from an image of an internal electrode.

FIG. 6 is an explanatory view showing a ceramic green chip obtained by the method for manufacturing a laminated chip component according to the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Ceramic laminated body 1 'Ceramic laminated body chip 10 Carrying table 11 Image processing device 12 Transmitted light irradiation device 13 Image analysis processing device 14 Data recording medium 15 Cutting device B Transmitted light X Reference coordinates in X direction Reference coordinates in Y direction

Continued on the front page (72) Inventor Shigehiko Shirai 1-13-1 Nihonbashi, Chuo-ku, Tokyo FDC term in TDK Corporation (reference) 2F065 AA03 AA17 AA20 BB01 BB17 BB27 CC25 DD06 FF01 FF04 JJ03 JJ05 JJ19 JJ26 NN20 PP12 QQ23 QQ31 RR06 TT02 2G001 AA07 BA11 CA07 FA11 GA13 HA01 HA07 HA13 HA20 JA13 LA11 PA01 PA11 2G051 AA61 AB06 AC04 AC21 CB02 DA01 DA06 EA12 ED04 ED12 5E082 AA01 AB03 BC38 BC40 FG06 FG26 HH43 MM01 MM03 MM01 MM01

Claims (10)

[Claims] A plurality of ceramic green sheets formed on the same plane by arranging a plurality of internal electrodes vertically and horizontally are alternately positioned with the internal electrodes, and a plurality of the ceramic green sheets are laminated. It is laminated on the outer layer to obtain a ceramic laminated body for taking out a plurality of parts, and the ceramic laminated body is XY-shaped according to the position of the internal electrode.
A method for manufacturing a laminated chip component, in which a ceramic laminated chip for each component is obtained by cutting in a direction, a transmitted light is irradiated by a light irradiation device toward a plane of the ceramic laminated body, and an inner part obtained by the transmitted light is obtained. The cutting position in the X and Y directions for cutting the ceramic laminate from the image of the electrode is measured by an image analysis processing device, and the cutting device is operated based on the measurement data to cut the ceramic laminate into ceramic laminate chips in component units. A method for manufacturing a laminated chip component, comprising: 2. An XY direction cutting position for cutting a ceramic laminate from an image of an internal electrode obtained by transmitted light is measured by an image analysis processing device based on coordinates in the XY direction on a plane of the ceramic laminate. The method for manufacturing a multilayer chip component according to claim 1, wherein 3. The ceramic laminate is placed on a transfer table movable in the XY directions and capable of changing its direction in the θ direction, and the positional deviation of the ceramic laminate on the transfer table in the XY directions is determined by an image processing apparatus. 3. The apparatus according to claim 1, wherein the displacement of the ceramic laminate is corrected by movement in the XY direction or a change in the direction of the .theta. Direction by the transfer table to determine the coordinates in the XY direction on the plane of the ceramic laminate. 3. The method for producing a multilayer chip component according to item 1. 4. The XY transfer of the ceramic laminate on a transfer table
The laminated chip according to any one of claims 1 to 3, wherein the chip is moved in the direction to irradiate a transmitted light beam, and the entire image of the internal electrode is obtained by the image analysis processing device by the transmitted light beam. The method of manufacturing parts. 5. The cutting position of a ceramic laminate measured by an image analysis processing device is recorded as cutting position data on a data recording medium, and the cutting device is operated based on the cutting position data taken out from the data recording medium. The method for manufacturing a laminated chip component according to any one of claims 1 to 4, wherein 6. A plurality of ceramic green sheets formed on the same plane by arranging a plurality of internal electrodes vertically and horizontally and alternately positioned with the internal electrodes, and laminating a plurality of ceramic green sheets on which no internal electrodes are formed. To obtain a ceramic laminated body for obtaining a plurality of parts, and to cut the ceramic laminated body in the XY directions in accordance with the positions of the internal electrodes to obtain a ceramic laminated body chip for each part. An apparatus for irradiating transmitted light toward a plane of a ceramic laminate, and an image analysis for measuring a cutting position in an XY direction for cutting the ceramic laminate from an image of an internal electrode obtained by the transmitted light. A processing device and a device for cutting a ceramic laminate which is operated based on the measurement data. Up parts of the manufacturing equipment. 7. A light irradiation device for irradiating a transmitted light beam toward a plane of a ceramic laminate, and a ceramic laminate based on an image of an internal electrode obtained by a transmitted light with reference to coordinates in the XY directions on the plane of the ceramic laminate. X to cut
The apparatus for manufacturing a multilayer chip component according to claim 6, further comprising: an image analysis processing device that measures a cutting position in the Y direction; and a ceramic laminate cutting device that operates based on the measurement data. 8. A transfer table on which a ceramic laminate is placed and movable in the XY directions and capable of changing its direction in the θ direction, and a displacement in the XY directions of the ceramic laminate on the mounting table is detected, and this displacement is detected. Is corrected by drive control of the transfer table, and XY in the plane of the ceramic laminate is corrected.
The apparatus for manufacturing a laminated chip component according to claim 6, further comprising an image processing device that determines a reference coordinate of the direction. 9. A transfer table on which a ceramic laminate is placed and moved in the X and Y directions, and an image analysis processing device for obtaining an overall image of the internal electrodes from transmitted light rays emitted as the transfer table moves. An apparatus for manufacturing a laminated chip component according to any one of claims 6 to 8, wherein: 10. A data recording medium for recording, as cutting position data, a cutting position of a ceramic laminate measured by an image analysis processing device, and a cutting device for a ceramic laminate that operates based on cutting position data extracted from the data recording medium. The apparatus for manufacturing a multilayer chip component according to any one of claims 6 to 9, comprising: