JP2000061683A - Solder plating wire - Google Patents
Solder plating wireInfo
- Publication number
- JP2000061683A JP2000061683A JP10241846A JP24184698A JP2000061683A JP 2000061683 A JP2000061683 A JP 2000061683A JP 10241846 A JP10241846 A JP 10241846A JP 24184698 A JP24184698 A JP 24184698A JP 2000061683 A JP2000061683 A JP 2000061683A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- wire
- tin
- plating
- silver
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Coating With Molten Metal (AREA)
Abstract
Description
【発明の詳細な説明】
【０００１】
【産業上の利用分野】本発明ははんだめっき線に関する
もので、特には、はんだ付け性およびはんだ接続部の耐
熱強度が改善され、鉛成分を含有しないはんだめっき線
に関するものである。
【０００２】
【従来の技術】従来から、はんだめっき線としては、金
属素線の外周に錫−鉛合金はんだめっき層を設けたもの
が、はんだめっき作業性やはんだ接続作業性に優れるこ
とから電気機器や電子機器用の部材として一般に広く使
用されている。しかし、近時、電気機器や電子機器の低
価格化に伴って製造コストの引下げ（工数削減）が必要
となり、今まで以上に短時間で接続できるはんだ濡れ性
に優れたはんだめっき線が要求されるようになってい
る。また、電気機器や電子機器の小型化、高性能化に伴
い、機器内が高温環境となることが多くなり、高温環境
下における機器の信頼性を高める目的からはんだ接続部
の耐熱強度の向上が求められるようになり、はんだめっ
き線についても耐熱強度の優れたものが要求されるよう
になってきている。また、電気機器や電子機器の生産が
急増するのに伴い、産業廃棄物として処分される電気機
器や電子機器の数量も増大しており、これら廃棄処分さ
れた機器から散失する有害物質による環境汚染の問題が
指摘されるようになり、電気機器や電子機器には有害物
質を含有しないはんだめっき線の使用が要求されるよう
にもなってきた。
【０００３】
【発明が解決しようとする課題】従来より多用されてい
る錫−鉛合金はんだめっき線は、はんだ接続作業性には
優れているが、近時要求の強いはんだ接続作業時間短縮
に対してははんだ濡れ性が十分でなかった。また、錫−
鉛合金はんだめっき線は、特性上の問題としてはんだ接
続部の耐熱強度の点で信頼性に劣っており、殊に高温環
境で使用した場合に錫−鉛合金はんだめっき線と他の部
材とのはんだ接続部において熱的クリープ現象を生じ易
く、はんだめっき線がはんだ接続部から抜け落ちるとい
う大きな欠点があった。一方、環境上の問題として、産
業廃棄物として処分された錫−鉛合金はんだめっき線か
ら鉛が酸性雨等によって地下水中に溶出して環境を汚染
し、更にはこれが人体内に摂取される危険性が指摘され
ている。即ち、鉛は体内に摂取されると、貧血、腹部疝
痛、急性脳症、末梢神経障害、腎障害といった中毒症状
を引き起こす要因となるため、人体に有害な鉛を含有し
ないはんだめっき線の開発が要望されていた。
【０００４】そこで本発明の目的は、はんだ濡れ性（接
続作業性）に優れ、高温環境下においても熱的クリープ
現象を生じ難く耐熱強度に優れ、有害な鉛を含有しない
はんだめっき線を提供することにある。
【０００５】
【課題を解決するための手段】上記目的を達成するた
め、本発明のはんだめっき線は、ビスマスが1.0 〜30.0
重量％、銀が0.5 〜10.0重量％、銅が0.01〜2.0 重量
％、残部が錫および不可避的不純物からなる組成のめっ
き層３を金属素線２外周に設けたことを構成上の特徴と
するものである。
【０００６】
【作用】本発明の錫−ビスマス−銀−銅合金はんだめっ
き線は、めっき層に適量含有されたビスマスにより、は
んだ濡れ性が改善され、はんだ接続作業性が向上する。
本発明の錫−ビスマス−銀−銅合金はんだめっき線によ
る作用、効果を図３により具体的に説明する。図3(a)
は、本発明のはんだめっき線１をプリント基板14のスル
ーホール15へろう材５で接合した状態を示す断面図で、
スルーホール15へ挿入されたはんだめっき線１はプリン
ト基板14の銅張り層16とろう材５によりはんだ付けされ
る。図3(b)は同図(a) のはんだめっき線１の錫−ビスマ
ス−銀−銅合金めっき層３とろう材５との接合部分Ａの
拡大図である。例えば、ろう材５に錫−鉛合金はんだを
用いた場合は、ろう接過程ではんだめっき線１の錫−ビ
スマス−銀−銅合金めっき層３が融けだし、めっき層３
中の銀が接合部分Ａのろう材５中へ拡散するとともにめ
っき層３中の錫が接合部分Ａのろう材５中へ溶出し、接
合部分Ａには耐熱強度を向上させる銀と錫の含有量が増
加し、耐熱強度を低下させる鉛の含有量の減少した層４
が形成される。この結果、錫−ビスマス−銀−銅合金は
んだめっき線１とろう材５との接合部Ａは、銀と錫成分
が増加して耐熱強度の向上した層が厚く形成され、耐熱
クリープ特性も向上することになる。一方、ろう材５に
錫−銀合金ろう材を用いた場合には、接合部分Ａには耐
熱強度を低下させる鉛成分を含有しない層が形成される
ので、錫−ビスマス−銀−銅合金はんだめっき線１とろ
う材５との接合部Ａの耐熱強度は一層高まりクリープ特
性も一段と向上することになる。
【０００７】また、本発明の錫−ビスマス−銀−銅合金
はんだめっき線１は、合金はんだめっき層３に鉛を含有
していないので、健康面や環境に有害な影響をおよぼす
ことがない。
【０００８】次に、発明の錫−ビスマス−銀−銅合金は
んだめっき線１において、合金はんだめっき層３のビス
マスの含有量を1.0 ％〜30.0％に限定した理由は、ビス
マスの含有量が1.0 ％未満でははんだ濡れ性向上の効果
がみられず、合金はんだの溶融温度も下がらないためで
ある。また、ビスマスの含有量が30.0％より多くなる
と、合金はんだめっき層３が硬く脆くなり、曲げ加工時
のめっき表面に割れが生じ易くなる欠点があるためであ
る。銀の含有量を0.5 ％〜10.0％に限定した限定した理
由は、銀の含有量が0.5 ％未満では耐熱クリープ特性向
上の効果が見られず、銀の含有量が10.0％より多くなる
と、耐熱クリープ特性は向上するものの合金はんだの融
点が高くなりすぎて溶融めっき性に劣る上、めっき線１
の材料コストが高くなる欠点があるためである。また、
本合金はんだめっき層３に銅成分を添加するのは、合金
はんだめっき線１の光沢や表面滑らかさ等のめっき外観
特性を向上させるためと合金はんだの溶融温度を下げ溶
融めっき作業をし易くするためである。銅の含有量を0.
01％〜2.0 ％に限定する理由は、銅の含有量が0.01％未
満ではめっき外観特性向上の効果が少なく、合金はんだ
の溶融温度も下がらないためであり、銅の含有量が2.0
％より多くなると溶融めっき浴中に銅−錫合金が沈澱し
てきて、これがめっき層３の表面に付着してめっき外観
を悪化させる原因となるためである。
【０００９】
【実施例】以下、本発明を実施例に基づいて説明する。
なお、これにより本発明が限定されるものではない。図
１は、はんだめっき線１の断面図である。錫−ビスマス
−銀−銅合金はんだめっき線１は、銅線或いは銅合金線
等の金属素線２と、金属素線２の外周に形成したビスマ
スが1.0 〜30.0重量％、銀が0.5〜10.0重量％、銅が0.0
1〜2.0 重量％、残部が錫および不可避的不純物からな
る組成の溶融錫−ビスマス−銀−銅合金はんだめっき層
３とからなる。
【００１０】次に、はんだめっき線１の製造工程を図２
により説明する。溶融錫−ビスマス−銀−銅合金はんだ
めっき浴槽６は、溶融錫−ビスマス−銀−銅合金はんだ
めっき液７の入っためっき液部と、溶融はんだめっき液
７の液面より上部に設けた金属素線２の導入口11と不活
性ガス導入口10と、溶融はんだめっき液７の液面垂直上
方に設けた錫−ビスマス−銀−銅合金はんだめっき線１
の導出口12とを有し、溶融はんだめっき液７の液面上方
全体が不活性ガス８の雰囲気層で覆われた構成となって
いる。かかる構成の溶融錫−ビスマス−銀−銅合金はん
だめっき浴槽６内に、ビスマス8.5 ％、銀3.5 ％、銅0.
7 ％、残部錫からなる組成の溶融錫−ビスマス−銀−銅
合金はんだめっき液７を液温250 ℃に保持し、また不活
性ガス導入口10から不活性ガス８として窒素ガスを導入
し、溶融錫−ビスマス−銀−銅合金はんだめっき液７の
液面上方全体を窒素ガス雰囲気層で覆っている。次に、
外径0.5mm の軟銅線２を銅線導入口11より溶融錫−ビス
マス−銀−銅合金はんだめっき液７中に導入し、溶融錫
−ビスマス−銀−銅合金はんだめっき液７内にて滑車13
で走行方向を転換し溶融錫−ビスマス−銀−銅合金はん
だめっき液７の液面から垂直上方へと引き出し、錫−ビ
スマス−銀−銅合金はんだめっき線導出口12から導出、
大気冷却して、めっき厚さ10μm 、仕上り外径0.52mmの
錫−ビスマス−銀−銅合金はんだめっき線１を得た。
【００１１】なお、この溶融錫−ビスマス−銀−銅合金
はんだめっき浴槽６では、錫−ビスマス−銀−銅合金は
んだめっき線１を溶融錫−ビスマス−銀−銅合金はんだ
めっき液７から垂直上方へ引き出すことにより、仕上り
ダイスを用いることなく、めっき線速を制御するだけで
所望のめっき厚さに調整することができる。
【００１２】上記実施例では、金属素線２に断面円形状
の軟銅線を用いたが、金属素線２の形状は、用途に応じ
断面長方形状或いは断面正方形状の軟銅線であってもよ
く、また金属素線２の材質は銅合金であっても、何ら本
発明を逸脱するものでないことは勿論である。
【００１３】上記により製造した本発明の錫−ビスマス
−銀−銅合金はんだめっき線１について、はんだ濡れ性
と耐熱クリープ特性およびめっき表面硬さの評価試験を
行った結果を以下に記す。
【００１４】−はんだ濡れ性試験−
本発明の実施例試料には、上述の製造工程により製造し
ためっき厚さ10μm 、仕上り外径0.52mmの錫−ビスマス
−銀−銅合金はんだめっき線１を用いた。なお、従来例
試料として、外径0.52mmの軟銅線に鉛37％−錫63％合金
をめっき厚さ10μm に溶融めっきした仕上り外径0.52mm
の錫−鉛合金はんだめっき銅線を用いた。試料としては
実施例，従来例とも各５本を用意した。はんだ濡れ性試
験は、はんだ濡れ性試験機を使用し、メニスグラフ法に
より測定した。使用したはんだは230 ℃の溶融した鉛37
％−錫63％合金で、各試料ともロジン35％含有したイソ
プロピルアルコールのフラックスを塗布して試験を行
い、はんだ濡れ時間を測定し、その結果を表１に示し
た。なお、表１のはんだ濡れ時間は試料５本の平均値で
ある。この結果から明らかなように、本発明の錫−ビス
マス−銀−銅合金はんだめっき線１は、はんだ濡れ時間
が短く、はんだ濡れ性に優れることが確認された。
【００１５】
【００１６】−耐熱クリープ特性試験−
本発明の実施例試料には、上記はんだ濡れ性試験に用い
たと同じ構造のめっき厚さ10μm 、仕上り外径0.52mmの
錫−ビスマス−銀−銅合金はんだめっき線１を用いた。
なお、従来例試料には、外径0.50mmの軟銅線に鉛37％−
錫63％合金をめっき厚さ10μm に溶融めっきした仕上り
外径0.52mmの錫−鉛合金はんだめっき銅線を用いた。試
料は実施例試料、従来例試料とも各５本を用意した。試
験方法は、図４に図示するように、銅張りプリント基板
14の穴径１mmのスルホール15に試料Ｗを通し、鉛37％−
錫63％合金ろう材17にて各試料Ｗをプリント基板14には
んだ付けした後、試料Ｗの端末に１kgの荷重を吊るした
状態で温度130 ℃の恒温槽内に入れる。そして、恒温槽
に入れてから試料Ｗがプリント基板14のスルホール15か
ら抜け落ちるまでの経過時間を測定した。この経過時間
をもって耐熱クリープ特性の評価とし、その結果を表２
に示した。なお、表２の測定時間は試料５本の平均値で
ある。この結果から明らかなように、本発明の錫−ビス
マス−銀−銅合金はんだめっき線１は、耐熱クリープ特
性に優れ、はんだ接続部の耐熱強度が向上していること
がわかる。
【００１７】
【００１８】−めっき表面硬さ試験−
本発明の実施例試料には、上記はんだ濡れ性試験に用い
たと同じ構造のめっき厚さ10μm 、仕上り外径0.52mmの
錫−ビスマス−銀−銅合金はんだめっき線１を用いた。
なお、従来例試料には、外径0.50mmの軟銅線に鉛37％−
錫63％合金をめっき厚さ10μm に溶融めっきした仕上り
外径0.52mmの錫−鉛合金はんだめっき銅線を用いた。試
料は実施例試料、従来例試料とも各５本を用意した。め
っき硬さ試験は、ビッカース硬度測定器を使用して測定
し、測定荷重は10gで行った。その結果を表３に示し
た。なお、表３のビッカース硬度は試料５本の平均値で
ある。この結果から、本発明の錫−ビスマス−銀−銅合
金はんだめっき線１は、めっき表面が硬くなることが確
認される。
【００１９】
【００２０】
【発明の効果】本発明の錫−ビスマス−銀−銅合金はん
だめっき線は、電子機器等の接続線として用いたとき次
のような効果を奏する。(1) はんだ濡れ性が向上するた
め、はんだ接続作業性が向上し、電子機器等の製造工数
が削減される。(2) はんだ付け部における耐熱強度が向
上し、高温雰囲気に置かれた場合にも熱的クリープ現象
を生じ難くなり、はんだめっき線がはんだ付け部から脱
落する事故がなくなってはんだ接続部の信頼性が向上す
る。(3) めっき表面が硬くなり、傷がつき難くくはんだ
めっき線の外観不良が減少する。(4) 人体に有害な鉛成
分を含有していないので、健康面、環境面の安全性が確
保される。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder-plated wire, and more particularly to a solder having improved solderability and heat-resistant strength of a solder joint and containing no lead component. It relates to a plated wire. 2. Description of the Related Art Conventionally, a solder-plated wire provided with a tin-lead alloy solder-plated layer on the outer periphery of a metal wire has been used because of its excellent workability of solder plating and solder connection. It is generally and widely used as a member for equipment and electronic equipment. However, recently, as the price of electric and electronic devices has decreased, it has become necessary to reduce manufacturing costs (reduce man-hours), and solder-plated wires with excellent solder wettability that can be connected in a shorter time than ever have been required. It has become so. In addition, with the miniaturization and high performance of electrical and electronic equipment, the interior of the equipment often becomes a high-temperature environment.In order to increase the reliability of the equipment in a high-temperature environment, the heat resistance of the solder connection has been improved. As a result, solder-plated wires having excellent heat resistance have been required. Also, with the rapid increase in production of electrical and electronic equipment, the quantity of electrical and electronic equipment that is disposed of as industrial waste is increasing, and environmental pollution due to harmful substances lost from these disposed equipment is also increasing. As a result, the use of solder-plated wires that do not contain harmful substances has been required for electric and electronic devices. [0003] The tin-lead alloy solder-plated wire, which has been widely used in the past, is excellent in the workability of the solder connection. The solder wettability was insufficient. In addition, tin
Lead alloy solder-plated wires are inferior in reliability in terms of heat resistance of solder joints as a problem in characteristics, and especially when used in a high-temperature environment, the tin-lead alloy solder-plated wires may not be connected to other members. The thermal creep phenomenon tends to occur in the solder connection part, and there is a major drawback that the solder plating wire falls off from the solder connection part. On the other hand, as an environmental problem, lead elutes from the tin-lead alloy solder plated wire disposed as industrial waste into groundwater due to acid rain and the like, polluting the environment, and furthermore, the danger of this being taken into the human body. Sex is pointed out. That is, when lead is taken into the body, it causes toxic symptoms such as anemia, abdominal colic, acute encephalopathy, peripheral nervous disorder, and renal disorder.Therefore, there is a demand for the development of a solder plating wire that does not contain harmful lead. It had been. Accordingly, an object of the present invention is to provide a solder plating wire which is excellent in solder wettability (connection workability), hardly causes a thermal creep phenomenon even in a high temperature environment, has excellent heat resistance, and does not contain harmful lead. It is in. [0005] In order to achieve the above object, the solder plated wire of the present invention has a bismuth content of 1.0 to 30.0%.
In particular, a plating layer 3 having a composition consisting of 0.5% to 10.0% by weight of silver, 0.01% to 2.0% by weight of copper, 0.01% to 2.0% by weight of copper and the balance of tin and unavoidable impurities is provided on the outer periphery of the metal wire 2. Things. In the tin-bismuth-silver-copper alloy solder plated wire of the present invention, the solder wettability is improved by the bismuth contained in the plating layer in an appropriate amount, and the workability of solder connection is improved.
The operation and effect of the tin-bismuth-silver-copper alloy solder plating wire of the present invention will be specifically described with reference to FIG. Fig. 3 (a)
Is a cross-sectional view showing a state in which the solder plating wire 1 of the present invention is joined to the through hole 15 of the printed circuit board 14 with the brazing material 5,
The solder plating wire 1 inserted into the through hole 15 is soldered to the copper clad layer 16 of the printed circuit board 14 with the brazing material 5. FIG. 3 (b) is an enlarged view of a joining portion A between the tin-bismuth-silver-copper alloy plating layer 3 and the brazing material 5 of the solder plating wire 1 of FIG. 3 (a). For example, when a tin-lead alloy solder is used for the brazing material 5, the tin-bismuth-silver-copper alloy plating layer 3 of the solder plating wire 1 begins to melt during the brazing process, and the plating layer 3
The silver contained therein diffuses into the brazing material 5 at the joining portion A, and the tin in the plating layer 3 elutes into the brazing material 5 at the joining portion A, and the joining portion A contains silver and tin which improve heat resistance. Layer 4 with increased lead and reduced lead content which reduces heat resistance
Is formed. As a result, in the joint A between the tin-bismuth-silver-copper alloy solder-plated wire 1 and the brazing material 5, a layer having an increased heat-resistant strength due to an increase in silver and tin components is formed, and the heat-resistant creep characteristics are also improved. Will do. On the other hand, when a tin-silver alloy brazing material is used for the brazing material 5, a layer containing no lead component that lowers the heat resistance is formed at the joint A, so that the tin-bismuth-silver-copper alloy solder is used. The heat resistance of the joint A between the plated wire 1 and the brazing material 5 is further increased, and the creep characteristics are further improved. In addition, the tin-bismuth-silver-copper alloy solder-plated wire 1 of the present invention does not have any detrimental effect on health or the environment since the alloy solder plating layer 3 does not contain lead. Next, in the tin-bismuth-silver-copper alloy solder plating wire 1 of the invention, the reason why the bismuth content of the alloy solder plating layer 3 is limited to 1.0% to 30.0% is that the bismuth content is 1.0% to 30.0%. %, The effect of improving the solder wettability is not seen, and the melting temperature of the alloy solder does not decrease. On the other hand, if the content of bismuth is more than 30.0%, the alloy solder plating layer 3 becomes hard and brittle, and there is a disadvantage that cracks easily occur on the plating surface during bending. The reason for limiting the silver content to 0.5% to 10.0% is that the effect of improving the heat-resistant creep characteristics is not seen when the silver content is less than 0.5%, and the heat-resistant creep property is not increased when the silver content is more than 10.0%. Although the creep characteristics are improved, the melting point of the alloy solder becomes too high, resulting in inferior hot-dipability.
This is because there is a disadvantage that the material cost is high. Also,
The addition of the copper component to the present alloy solder plating layer 3 is to improve the plating appearance characteristics such as the gloss and surface smoothness of the alloy solder plating wire 1 and to lower the melting temperature of the alloy solder to facilitate the hot-dip plating operation. That's why. Reduce copper content to 0.
The reason for limiting the content to 01% to 2.0% is that if the copper content is less than 0.01%, the effect of improving the plating appearance characteristics is small and the melting temperature of the alloy solder does not decrease.
%, The copper-tin alloy precipitates in the hot-dip plating bath, which adheres to the surface of the plating layer 3 and deteriorates plating appearance. Hereinafter, the present invention will be described with reference to examples.
Note that the present invention is not limited by this. FIG. 1 is a sectional view of the solder plating wire 1. The tin-bismuth-silver-copper alloy solder-plated wire 1 comprises a metal wire 2 such as a copper wire or a copper alloy wire, bismuth formed on the outer periphery of the metal wire 2 being 1.0 to 30.0% by weight, and silver being 0.5 to 10.0%. Wt%, copper is 0.0
1 to 2.0% by weight, with the balance being a tin-bismuth-silver-copper alloy solder plating layer 3 having a composition consisting of tin and unavoidable impurities. Next, the manufacturing process of the solder plating wire 1 is shown in FIG.
This will be described below. The molten tin-bismuth-silver-copper alloy solder plating bath 6 includes a plating solution portion containing a molten tin-bismuth-silver-copper alloy solder plating solution 7 and a metal provided above the liquid surface of the molten solder plating solution 7. Tin-bismuth-silver-copper alloy solder plating wire 1 provided at the inlet 11 of the strand 2, the inert gas inlet 10, and vertically above the molten solder plating solution 7.
, And the entire upper surface of the molten solder plating solution 7 is covered with an inert gas 8 atmosphere layer. In the molten tin-bismuth-silver-copper alloy solder plating bath 6 having such a configuration, 8.5% of bismuth, 3.5% of silver, and 0.5% of copper.
A molten tin-bismuth-silver-copper alloy solder plating solution 7 having a composition of 7% and the balance of tin was maintained at a liquid temperature of 250 ° C., and nitrogen gas was introduced as an inert gas 8 from an inert gas inlet 10. The entire upper surface of the molten tin-bismuth-silver-copper alloy solder plating solution 7 is covered with a nitrogen gas atmosphere layer. next,
A soft copper wire 2 having an outer diameter of 0.5 mm is introduced into a molten tin-bismuth-silver-copper alloy solder plating solution 7 from a copper wire inlet 11 and a pulley is formed in the molten tin-bismuth-silver-copper alloy solder plating solution 7. 13
The running direction is changed to draw vertically upward from the liquid surface of the molten tin-bismuth-silver-copper alloy solder plating solution 7 and lead out from the tin-bismuth-silver-copper alloy solder plating wire outlet 12.
After cooling in air, a tin-bismuth-silver-copper alloy solder plated wire 1 having a plating thickness of 10 μm and a finished outer diameter of 0.52 mm was obtained. In the molten tin-bismuth-silver-copper alloy solder plating bath 6, the tin-bismuth-silver-copper alloy solder plating wire 1 is vertically moved from the molten tin-bismuth-silver-copper alloy solder plating solution 7. By drawing it out, it is possible to adjust to a desired plating thickness only by controlling the plating linear velocity without using a finished die. In the above embodiment, a soft copper wire having a circular cross section is used as the metal wire 2, but the shape of the metal wire 2 may be a soft copper wire having a rectangular cross section or a square cross section depending on the application. Of course, even if the material of the metal strand 2 is a copper alloy, it does not deviate from the present invention at all. With respect to the tin-bismuth-silver-copper alloy solder-plated wire 1 of the present invention produced as described above, the results of evaluation tests of solder wettability, heat-resistant creep characteristics and plating surface hardness are described below. -Solder wettability test- For a sample of the present invention, a tin-bismuth-silver-copper alloy soldered wire 1 having a plating thickness of 10 µm and a finished outer diameter of 0.52 mm manufactured by the above-described manufacturing process was used. Was. In addition, as a conventional example, a finished outer diameter of 0.52 mm was obtained by hot-dip coating a 37% lead-63% tin alloy on a 0.52 mm outer diameter soft copper wire to a plating thickness of 10 μm.
Used was a tin-lead alloy solder-plated copper wire. Five samples were prepared for each of the examples and the conventional examples. The solder wettability test was measured by a menisgraph method using a solder wettability tester. The solder used was 230 ° C molten lead37
A test was conducted by applying a flux of isopropyl alcohol containing 35% rosin to each sample with a 63% alloy of 63% and tin, and the solder wetting time was measured. The results are shown in Table 1. In addition, the solder wetting time in Table 1 is an average value of five samples. As is clear from these results, it was confirmed that the tin-bismuth-silver-copper alloy solder-plated wire 1 of the present invention had a short solder wetting time and was excellent in solder wettability. [0015] -Heat creep property test-The sample of the present invention has a tin-bismuth-silver-copper alloy solder plating having the same structure as that used in the solder wettability test described above and having a plating thickness of 10 µm and a finished outer diameter of 0.52 mm. Line 1 was used.
Note that the conventional sample had a lead of 37% on soft copper wire with an outer diameter of 0.50 mm.
A tin-lead alloy solder-plated copper wire having a finished outer diameter of 0.52 mm, which was obtained by hot-dip coating a 63% tin alloy to a plating thickness of 10 μm, was used. Five samples were prepared for each of the example sample and the conventional example sample. As shown in Fig. 4, the test method was a copper-clad printed circuit board.
Pass the sample W through the through hole 15 with a hole diameter of 1 mm and lead 37%
After soldering each sample W to the printed circuit board 14 with a tin 63% alloy brazing material 17, the sample W is placed in a thermostat at a temperature of 130 ° C. while a load of 1 kg is hung on the end of the sample W. Then, an elapsed time from when the sample W was put in the thermostat to when the sample W dropped out from the through hole 15 of the printed circuit board 14 was measured. The elapsed time was used to evaluate the heat-resistant creep characteristics, and the results were shown in Table 2.
It was shown to. The measurement time in Table 2 is an average value of five samples. As is clear from the results, the tin-bismuth-silver-copper alloy solder-plated wire 1 of the present invention has excellent heat-resistant creep characteristics and improved heat-resistant strength of the solder joint. [0017] -Plating Surface Hardness Test- Examples of the present invention include a tin-bismuth-silver-copper alloy solder having a plating thickness of 10 μm and a finished outer diameter of 0.52 mm having the same structure as that used in the above solder wettability test. Plating wire 1 was used.
Note that the conventional sample had a lead of 37% on soft copper wire with an outer diameter of 0.50 mm.
A tin-lead alloy solder-plated copper wire having a finished outer diameter of 0.52 mm, which was obtained by hot-dip coating a 63% tin alloy to a plating thickness of 10 μm, was used. Five samples were prepared for each of the example sample and the conventional example sample. The plating hardness test was measured using a Vickers hardness tester, and the measurement load was 10 g. Table 3 shows the results. The Vickers hardness in Table 3 is an average value of five samples. From this result, it is confirmed that the tin-bismuth-silver-copper alloy solder plated wire 1 of the present invention has a hardened plating surface. [0019] The tin-bismuth-silver-copper alloy solder-plated wire of the present invention has the following effects when used as a connection wire for electronic equipment and the like. (1) Since the solder wettability is improved, the workability of solder connection is improved, and the man-hours for manufacturing electronic devices and the like are reduced. (2) The heat resistance of the soldered part is improved, and the thermal creep phenomenon is less likely to occur even when the soldered part is placed in a high-temperature atmosphere. The performance is improved. (3) The plating surface is hardened, hardly scratched, and the appearance defect of the solder plated wire is reduced. (4) Since it does not contain lead components that are harmful to the human body, health and environmental safety is ensured.
【図面の簡単な説明】
【図１】はんだめっき線の構成を示す断面図である。
【図２】はんだめっき線の製造工程の１例を示す説明図
である。
【図３】はんだめっき線をプリント基板へろう接した状
態の説明図であり、同図(a) は接合状態を示す断面図、
同図(b) は同図(a) のＡ部拡大図である。
【図４】耐熱クリープ特性試験の試験方法を示す説明図
である。
【符号の説明】
１ 錫−ビスマス−銀−銅合金はんだめっき線
２ 金属素線
３ 錫−ビスマス−銀−銅合金はんだめっき層
４ 錫、銀拡散層
５ ろう材
６ 錫−ビスマス−銀−銅合金はんだめっき浴槽
７ 錫−ビスマス−銀−銅合金はんだめっき液
８ 不活性ガス
９ 不活性ガス雰囲気層
10 不活性ガス導管
11 金属素線導入口
12 錫−ビスマス−銀−銅合金はんだめっき線導出口
13 滑車
14 プリント基板
15 スルーホール
16 銅張り層BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a sectional view showing a configuration of a solder plating wire. FIG. 2 is an explanatory view showing one example of a manufacturing process of a solder plated wire. FIG. 3 is an explanatory view of a state where a solder plating wire is soldered to a printed circuit board, and FIG.
FIG. 3B is an enlarged view of a portion A in FIG. FIG. 4 is an explanatory view showing a test method of a heat resistance creep property test. [Description of Signs] 1 Tin-bismuth-silver-copper alloy solder plating wire 2 metal strand 3 tin-bismuth-silver-copper alloy solder plating layer 4 tin / silver diffusion layer 5 brazing material 6 tin-bismuth-silver-copper Alloy solder plating bath 7 Tin-bismuth-silver-copper alloy solder plating solution 8 Inert gas 9 Inert gas atmosphere layer 10 Inert gas conduit 11 Metal wire inlet 12 Tin-bismuth-silver-copper alloy solder plating wire Exit 13 Pulley 14 Printed circuit board 15 Through hole 16 Copper clad layer
───────────────────────────────────────────────────── フロントページの続き (72)発明者 坂 研二 長野県上田市大字大屋300番地 東京特殊 電線株式会社上田工場内 Ｆターム(参考） 4K027 AA06 AA25 AB08 AB50 AE03 ────────────────────────────────────────────────── ─── Continuation of front page (72) Inventor Kenji Saka 300 Oya, Ueda-shi, Nagano Prefecture Tokyo Special Inside the Ueda Factory of Electric Wire Co., Ltd. F term (reference) 4K027 AA06 AA25 AB08 AB50 AE03
Claims (1)
〜10.0重量％、銅が0.01〜2.0 重量％、残部が錫および
不可避的不純物からなるはんだめっき層３を金属素線２
外周に設けたことを特徴とするはんだめっき線。Claims: 1. A bismuth content of 1.0 to 30.0% by weight and a silver content of 0.5%
To 10.0% by weight, 0.01 to 2.0% by weight of copper, and the balance consisting of tin and unavoidable impurities.
A solder plating wire provided on the outer periphery.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10241846A JP2000061683A (en) | 1998-08-27 | 1998-08-27 | Solder plating wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10241846A JP2000061683A (en) | 1998-08-27 | 1998-08-27 | Solder plating wire |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000061683A true JP2000061683A (en) | 2000-02-29 |
Family
ID=17080386
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10241846A Pending JP2000061683A (en) | 1998-08-27 | 1998-08-27 | Solder plating wire |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000061683A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1284301A1 (en) * | 2001-08-14 | 2003-02-19 | Marjan, Inc. | Tin-silver coatings |
| KR100431090B1 (en) * | 2001-06-20 | 2004-05-12 | 정재필 | Lead free solder plated with low-melting-pointed alloy |
| KR100743190B1 (en) | 2005-12-26 | 2007-07-27 | 재단법인 포항산업과학연구원 | Low melting point lead-free solder and manufacturing method thereof |
| CN111020443A (en) * | 2019-12-26 | 2020-04-17 | 无锡市斯威克科技有限公司 | Low-melting-point photovoltaic welding strip special for welding ultrathin photovoltaic cell piece and preparation method and application thereof |
-
1998
- 1998-08-27 JP JP10241846A patent/JP2000061683A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100431090B1 (en) * | 2001-06-20 | 2004-05-12 | 정재필 | Lead free solder plated with low-melting-pointed alloy |
| EP1284301A1 (en) * | 2001-08-14 | 2003-02-19 | Marjan, Inc. | Tin-silver coatings |
| US6924044B2 (en) | 2001-08-14 | 2005-08-02 | Snag, Llc | Tin-silver coatings |
| US7147933B2 (en) | 2001-08-14 | 2006-12-12 | Snag, Llc | Tin-silver coatings |
| KR100743190B1 (en) | 2005-12-26 | 2007-07-27 | 재단법인 포항산업과학연구원 | Low melting point lead-free solder and manufacturing method thereof |
| CN111020443A (en) * | 2019-12-26 | 2020-04-17 | 无锡市斯威克科技有限公司 | Low-melting-point photovoltaic welding strip special for welding ultrathin photovoltaic cell piece and preparation method and application thereof |
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