JP2000059078A - Electromagnetic wave shield plate and method of manufacturing the same - Google Patents

Abstract

(57) [Problem] To provide an electromagnetic wave shielding plate excellent in adhesion of a metal pattern layer. SOLUTION: The transparent substrate 1 has a thermoplastic resin layer 2 formed on one entire surface thereof and a metal pattern layer 3 formed on the resin layer for preventing electromagnetic waves from leaking outside. By heating at a temperature higher than the glass transition point of the resin layer, pressing from the upper surface of the metal pattern layer to bury the lower part of the metal pattern layer in the resin layer, increasing the contact area and increasing the adhesion, An electromagnetic wave shielding plate having a metal pattern layer having excellent adhesion to a resin layer can be obtained.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electromagnetic wave shielding plate having excellent adhesion of a metal pattern layer and a method of manufacturing the same.

[0002]

2. Description of the Related Art Conventionally, various measures have been proposed for preventing leakage of electromagnetic waves emitted from a gas discharge display panel used in an image display device, for example, a PDP (plasma display panel) or the like. Commonly known measures to prevent electromagnetic wave leakage include alternately depositing a silver deposited film and a dielectric film on a transparent substrate, attaching a wire mesh on the transparent substrate, and applying a metal layer on the transparent substrate. Is directly formed.

In particular, in order to manufacture an electromagnetic wave shielding plate excellent in visibility and electromagnetic wave shielding properties, a method of directly forming a metal pattern layer on a transparent substrate is excellent. There are various methods for forming a metal pattern layer on a transparent substrate, and a typical method is to form a metal layer by electroless plating or electroplating and then form a predetermined pattern by etching. How to In addition, the electroplating method
In this method, a thin metal layer is formed by a vacuum deposition method or a sputtering method, and then the thickness of the metal layer is increased by electroplating.

[0004]

However, in any of the above methods of forming a metal pattern layer directly on a transparent substrate, the adhesion of the formed metal pattern layer to the transparent substrate is weak. In order to add an anti-reflection function to the plate, a problem such as peeling of the metal pattern layer occurs in post-processing such as forming an anti-reflection layer further on the metal pattern layer formed on the transparent substrate.

[0005] Further, the metal pattern for electromagnetic wave shielding has better visibility when the line width is small and the pattern lines are close to each other, but there is a problem that the thin and fine pattern makes it easy to peel off. .

The present invention has been made in view of the above problems, and has as its object to provide an electromagnetic wave shield plate having excellent adhesion of a metal pattern layer and a method of manufacturing the same.

[0007]

In order to achieve the above object, an electromagnetic wave shielding plate of the present invention is provided with a metal pattern layer provided on a transparent base material through a thermoplastic resin layer,
The lower part of the metal pattern layer is buried in the resin layer.

[0008] The electromagnetic wave shielding plate of the present invention comprises a film layer attached to one surface of a transparent substrate, a resin layer having thermoplasticity formed on the film layer, and a metal pattern layer formed on the resin layer. And an antireflection layer formed on the upper surface of the metal pattern layer and the other surface of the transparent base material, wherein a lower portion of the metal pattern layer is buried in the resin layer.

The method for manufacturing an electromagnetic wave shielding plate of the present invention comprises:
A resin layer having thermoplasticity is formed on a transparent substrate, a metal pattern layer is formed on the resin layer, and heating is performed at a temperature higher than the glass transition point of the resin layer.

The method for manufacturing an electromagnetic wave shielding plate of the present invention comprises:
A resin layer having thermoplasticity is formed on the film, a metal pattern layer is formed on the upper surface of the resin layer to prevent leakage of electromagnetic waves to the outside, and the film on which the resin layer and the metal pattern layer are formed is transparent. After being bonded to a substrate and heated at a temperature higher than the glass transition point of the resin layer, an anti-reflection layer is formed on the upper surface of the metal pattern layer and the other surface of the transparent substrate.

The above-mentioned metal pattern layer is preferably heated at a temperature higher than the glass transition point of the resin layer, and then the upper surface of the metal pattern layer is pressed.

[0012]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of an electromagnetic wave shield plate according to the present invention. 1 to 5 show an embodiment of an electromagnetic wave shield plate and a method of manufacturing the same according to the present invention.
FIG. 1 is a cross-sectional view showing an embodiment of an electromagnetic wave shielding plate and a method of manufacturing each of the electromagnetic wave shielding plates of the present invention, FIG. 2 is a diagram showing a state where a metal pattern layer is fixed to a resin layer, and FIG. FIG. 4 is a cross-sectional configuration diagram illustrating a shield plate according to a second embodiment, FIG. 4 is a flowchart illustrating a creation flow of a creation example, and FIG. 5 is a diagram illustrating a configuration in a creation process of the creation example illustrated in FIG.

First, a first embodiment of the electromagnetic wave shielding substrate of the present invention will be described with reference to FIG.

[0014] As shown in FIG.
Transparent substrate 1 and resin layer 2 formed on one side of transparent substrate 1
And a metal pattern layer 3 formed on the resin layer 2 for preventing leakage of electromagnetic waves.

The transparent substrate 1 is formed of a highly transparent substrate such as glass or plastic so as not to lower the transparency of the electromagnetic wave shielding substrate.

The resin layer 2 has good adhesion to a substrate such as plastic or glass, and is heated at the glass transition point.
It is made of a thermoplastic resin that can be repeatedly softened and solidified by cooling.

The metal pattern layer 3 is a metal layer of a good conductor that can prevent leakage of electromagnetic waves to the outside. By providing a metal pattern layer to form an electromagnetic wave shielding member, it is possible to prevent a decrease in the transparency of the electromagnetic wave shielding plate as compared with other electromagnetic wave shielding members. The method of forming the metal pattern layer is to form a metal layer by electroless plating, or to form a metal layer by electroplating,
A resist is applied and formed into a predetermined metal pattern by etching. The thickness of the metal pattern layer is 1 μm to
The line width is preferably 15 μm and the line width is preferably 10 μm to 30 μm.

An object of the present invention is to improve the adhesion between a transparent substrate and a metal pattern layer in an electromagnetic wave shielding plate provided with a metal pattern layer on a transparent substrate to prevent leakage of electromagnetic waves generated by a PDP or the like. And

For this purpose, as shown in FIG. 2, the electromagnetic wave shielding plate is heated at a temperature higher than the glass transition point of the resin layer 2 to soften the resin layer, and the metal pattern layer is formed by its own weight. Impacted. Further, by pressing the metal pattern layer from above with a roller or the like where the resin fat layer is softened, the metal pattern layer is buried deeper in the resin layer. Therefore, the adhesion of the metal pattern layer can be further improved. Therefore, the metal pattern layer does not peel off even in post-processing such as formation of an anti-reflection layer, and a high-quality electromagnetic wave shield plate can be obtained.

The above-described first embodiment is formed by the following steps. First, a resin layer is formed on one surface of the transparent substrate 1. The resin layer is formed by a method such as coating a thermoplastic resin solution or laminating a film coated with the thermoplastic resin solution.

Next, a metal pattern layer is formed on the resin layer. The metal pattern layer is formed by forming a metal layer by electroless plating, or forming a thin metal layer by vacuum evaporation or sputtering, then forming a metal layer by electrolytic plating, and applying a resist on the metal layer to form a pattern. Exposure, development, and etching are performed to form a predetermined metal pattern. Then, in order to increase the adhesiveness between the metal pattern layer and the resin layer, heating is performed at a temperature higher than the glass transition point of the resin layer. The resin layer is softened by heating, and the metal pattern layer buries in the resin layer due to its own weight. further,
By pressing the metal pattern layer from above with a roller or the like, the metal pattern layer is buried deeper in the softened resin layer, and the adhesion of the metal pattern layer to the resin layer is further improved.

Next, a second embodiment of the electromagnetic wave shielding plate of the present invention will be described with reference to FIG. In the second embodiment shown in FIG. 3, an adhesive layer 5 formed on both surfaces of a transparent substrate 1 and a PET (Polyet) adhered to the upper surface of the adhesive layer are provided.
hlene terephthalate) film layer 4, resin layer 2 formed on the upper surface of PET film layer, metal pattern layer 3 formed on the upper surface of resin layer 2, and adhesive layer 5 formed on the upper surface of metal pattern layer 3. And an antireflection layer 6 bonded by an adhesive layer provided on the metal pattern layer and an adhesive layer provided on the lower surface of the transparent substrate.

The transparent substrate 1 according to the second embodiment has a P.sub.2 when provided on the front surface of a gas discharge panel, for example, a PDP.
A near-infrared ray absorbing agent for absorbing near-infrared rays emitted from the DP is kneaded during the formation of the transparent substrate. Thereby, the near-infrared ray emitted from the PDP can be absorbed by the transparent substrate 1, and malfunction of the remote control device, the optical communication device, or the like can be prevented.

The PET film layer 4 is a film layer of a polyethylene terephthalate resin having transparency and excellent heat resistance. The second embodiment differs from the first embodiment in that a resin layer is formed on the PET film layer 4. By forming a metal pattern layer on a PET film by electroplating, a metal pattern layer having a uniform thickness can be formed. Note that the PET film layer may be a TAC (Tri Acetyl Cellulose) film layer.

The adhesive layer 5 is formed on the transparent substrate 1 and the PET film layer 4, between the transparent substrate 1 and the antireflection layer 6, and on the metal pattern layer without contacting the antireflection layer with the metal pattern layer. This is a layer made of a transparent adhesive for bonding. As the adhesive used for the adhesive layer, a transparent adhesive is used so as not to lower the transparency of the electromagnetic wave shielding plate.

The pressure-sensitive adhesive layer for adhering the metal pattern layer and the antireflection layer provided on the upper surface thereof is provided with a predetermined thickness to flatten the unevenness between the metal pattern layer and the resin layer due to the thickness of the metal pattern layer. I have. This is because, when the antireflection agent is applied directly to the upper surface of the metal pattern layer in a state where there is unevenness due to the metal pattern layer, coating unevenness occurs and lowers the visibility and antireflection function of the electromagnetic wave shielding plate,
Further, when the antireflection film is laminated on the upper surface of the metal pattern layer in a state where there is unevenness due to the metal pattern layer, it is to prevent a problem that air bubbles are generated and the visibility and the antireflection function of the electromagnetic wave shield plate are deteriorated. . When the thickness of the metal pattern layer is large and the unevenness with the transparent substrate is severe, a flattening layer made of a transparent resin or the like may be separately provided. Further, an adhesive layer for bonding the transparent substrate 1 and the antireflection layer 6 becomes unnecessary when the antireflection agent is applied directly on the transparent substrate.

The antireflection layer 6 is a layer provided to reduce the reflectance of light incident from outside and light from a display screen such as a PDP. The antireflection layer 6 can reduce the reflectance of light to prevent problems such as a decrease in the visibility of the display screen. Further, by providing a predetermined difference in the refractive index between the adhesive layer and the adhesive used for the adhesive layer, the antireflection effect of the electromagnetic wave shielding plate can be further enhanced. The difference in the refractive index is suitably within 0.14. Further, the antireflection layer may be an antiglare layer having an effect of preventing Newton's ring generated between the PDP and the electromagnetic wave shield plate. Further, the layer may have both the antireflection function and the Newton ring prevention function.

The above-described second embodiment is generated by the following steps. First, a resin layer is formed on the PET film layer 4. The resin layer is formed by a method such as coating a thermoplastic resin solution or laminating a film coated with the thermoplastic resin solution.

Next, a metal layer is formed on the resin layer. The metal layer is formed by an electroless plating method or an electroplating method.

Next, the PET film on which the metal layer and the resin layer are formed and the transparent substrate containing the near-infrared absorbing agent are bonded together by forming an adhesive layer using an adhesive.

Next, a resist is applied to the metal layer formed on the resin layer, and pattern exposure, development, and etching are performed.
The metal layer is formed into a predetermined metal pattern.

Then, in order to increase the adhesion between the metal pattern layer and the resin layer, the resin layer is heated at a temperature higher than the glass transition point. The resin layer is softened by heating, and the metal pattern layer buries in the resin layer due to its own weight. Further, where the resin layer is softened, the metal pattern layer is pressed from above with a roller or the like, so that the metal pattern layer is buried deeper in the resin layer. Thereby, the adhesion between the resin layer and the metal pattern layer can be further enhanced.

Next, unevenness due to the thickness of the metal pattern layer is flattened by an adhesive, and the antireflection layer is bonded by the adhesive. The method of forming the antireflection layer may be either lamination of an antireflection film or application of an antireflection agent. Further, an adhesive layer made of an adhesive is formed on the surface of the transparent substrate on which the member is not provided, and the antireflection film is laminated.

In the first and second embodiments described above, a metal pattern layer is formed after a resin layer having thermoplasticity is formed on a transparent substrate or a PET film, and is higher than the glass transition point of the resin layer. By applying heat treatment at a temperature to soften the resin layer and pressing the metal pattern layer from above with a roller or the like, the lower part of the metal pattern layer buries in the resin layer, and the contact area between the metal pattern layer and the resin layer And the metal pattern layer can be formed in a stable state. Therefore, a fine metal pattern can be easily formed,
An electromagnetic wave shield plate having excellent visibility can be obtained.
Further, when performing post-processing such as formation of an anti-reflection layer, there is no problem such as peeling of the metal pattern layer and deteriorating the quality of the electromagnetic wave shielding plate.

In the second embodiment, for example, kneading and mixing of a near-infrared absorbing agent and formation of an anti-reflection layer at the time of forming a transparent base material are further added.
When an electromagnetic wave shield plate is provided on the front of the PDP, the PDP
The external light and the light from the PDP, which are inserted into the screen, are complicatedly refracted by the anti-reflection layer and the adhesive layer, thereby preventing deterioration in image quality and visibility due to reflection of external light. Further, the near infrared rays emitted from the PDP can be absorbed by the near infrared ray absorbing agent to prevent malfunctions of the remote control device, the optical communication device, and the like. Also, P
The leakage of the electromagnetic wave generated by driving the DP to the outside can be prevented by the metal pattern layer. Further, when an anti-glare layer is provided instead of the anti-reflection layer, it is possible to prevent the occurrence of Newton rings generated between the PDP and the electromagnetic wave shielding plate.

Next, the manufacturing process of the embodiment will be described with reference to the flowchart shown in FIG. 4 and the diagram showing the configuration at the stage of making in FIG. First, in step S1, a heat treatment is performed on a PET film having excellent transparency and heat resistance to stabilize the film. The heat treatment is performed at 180 ° C. for 15 minutes. Next, in step S2, a resin layer is formed on the heat-treated PET film. In this example, a thermoplastic acrylic resin solution manufactured by Mitsubishi Rayon Co., Ltd., trade name DIANAL LR-269 was used. The glass transition point of this DIANAL LR-269 is about 105 ° C. FIG. 5B shows a state where the resin layer is formed on the PET film.

Next, in step S3, 200
A copper film having a thickness of {2000} is formed by a vacuum evaporation method or a sputtering method. Then, in step S4, a copper layer is formed to a predetermined thickness by electroplating. A PET film is immersed in an aqueous solution in which 200 g / l of copper sulfate and 60 g / l of sulfuric acid are dissolved, and power is supplied to the copper film at a current density of 1 A / dm ² for 30 minutes. FIG. 5C shows a state where a copper layer is formed on the resin layer.

Next, at step S5, the P on which the copper layer is formed is formed.
Attach the ET film to the transparent substrate. Note that a near-infrared absorbing agent is kneaded into the transparent substrate when the substrate is formed.
In this preparation example, Sumipulse HA (trade name, manufactured by Sumitomo Chemical Co., Ltd.) was used as a near-infrared absorbing agent. FIG. 5D shows a state in which a PET film having a copper layer and a resin layer formed on one side is bonded to a transparent substrate.

Next, in step S6, the substrate is subjected to a heat treatment to increase the adhesion between the copper layer and the resin layer. This heat treatment is performed at 120 ° C., which is higher than the glass transition point of Dianal LR-269 used for the resin layer, for 60 seconds. Next, in step S7, a resist is applied on the copper layer. In this example, TLCR-P8008 (trade name, manufactured by Tokyo Ohka Kogyo Co., Ltd.) was used as the resist. This resist agent is dropped on a substrate fixed on a spinner and rotated at 1500 rpm for 1 minute. FIG. 5e shows a state in which a resist is applied on the copper layer.

Next, in step S8, the substrate coated with the resist is pre-baked. In the present embodiment, baking is performed by placing in a clean oven heated to 90 ° C. for 20 minutes.

Next, in step S9, a mask is superposed on the prebaked resist and exposed, and in step S10,
Immerse in a developer and develop. Exposure is 120 mj / cm
^{In step 2} , the developer is added to a 0.8% KOH aqueous solution at 25 ° C. for 1 hour.
Perform by soaking for a minute.

Next, in step S11, the exposed and developed substrate is washed with water, and in step S12, etching is performed. In this embodiment, Melstrip MN-957 (trade name, manufactured by Meltex Corporation) was used as an etching solution. Spray the etchant at 40 ° C. for 70 seconds.

Next, in step S13, the substrate on which copper is formed in a predetermined pattern is washed with water, and in step S14,
Heat again at a temperature higher than the glass transition point of the resin layer,
The resin layer is softened, and the copper pattern layer is buried in the resin layer. This heat treatment was also performed using the diamond LR-
This is performed at 120 ° C., which is higher than the glass transition point of H.269 for 60 seconds. Then, the upper surface of the copper pattern layer is pressed by a roller to increase the adhesion of the copper pattern layer to the resin layer. FIG. 5f
1 shows a state in which a copper pattern layer having high adhesion is formed on a resin layer. Then, in step S15,
An anti-reflection layer is formed on both sides of the substrate. The unevenness of the copper pattern layer with the resin layer is flattened by an adhesive for bonding the antireflection layer. In this example, ARCTP- manufactured by Asahi Glass Co., Ltd.
UR201 was used. 5 kg / cm ²
Laminate with Through the above steps, the electromagnetic wave shielding plate shown in FIG. 5G is completed.

The above embodiment is a preferred embodiment of the present invention. However, the present invention is not limited to this, and various modifications can be made without departing from the scope of the present invention.

[0045]

As is apparent from the above description, claim 1
The electromagnetic wave shield plate of the described invention is provided with a metal pattern layer via a resin layer having thermoplasticity on a transparent substrate,
Since the lower portion of the metal pattern layer is buried in the resin layer, the adhesion of the metal pattern layer to the resin layer can be improved.

According to a second aspect of the present invention, there is provided an electromagnetic wave shielding plate for preventing a transparent and thermoplastic resin layer formed on the entire upper surface of a film layer from leaking out of an electromagnetic wave formed on the resin layer. A metal pattern layer, comprising an antireflection layer formed on the upper surface of the metal pattern layer and the other surface of the transparent substrate, the lower portion of the metal pattern layer is buried in the resin layer, the metal pattern The adhesion between the layer and the resin layer can be improved.

Further, by providing the antireflection layer, P
The visibility of the screen can be improved by reducing the reflectance of the light from the DP and the external light.

According to a third aspect of the invention, there is provided a method for manufacturing an electromagnetic wave shielding plate, comprising: a resin layer having thermoplasticity on a transparent substrate;
By forming a metal pattern layer on the resin layer and heating at a temperature higher than the glass transition point of the resin layer, the resin layer is softened, the lower part of the metal pattern layer is buried in the resin layer, and the metal pattern layer and The contact area with the resin layer can be increased. Therefore, the adhesion between the metal pattern layer and the resin layer can be enhanced, and the formation of a fine metal pattern layer having a small line width on the transparent base material can be facilitated.

According to a fourth aspect of the present invention, there is provided a method for manufacturing an electromagnetic wave shielding plate, wherein a film having a thermoplastic resin layer and a metal pattern layer formed on the upper surface of the resin layer is bonded to a transparent substrate. After heating at a temperature higher than the glass transition point to soften the resin layer and bury the lower part of the metal pattern layer in the resin layer, anti-reflection is applied to the upper surface of the metal pattern layer and the other surface of the transparent substrate Forming a layer. Therefore,
In the step of forming the antireflection layer, the metal pattern layer does not peel off. Therefore, it is possible to easily manufacture a high quality electromagnetic wave shielding plate having high electromagnetic wave shielding properties.

According to a fifth aspect of the present invention, in the method for manufacturing an electromagnetic wave shielding plate, the resin layer is heated at a temperature higher than the glass transition point of the resin layer to soften the resin layer, and then the upper surface of the metal pattern layer is pressed. In addition, the adhesion between the metal pattern layer and the resin layer can be further increased. Therefore, the metal pattern layer does not peel off in a later step such as formation of the antireflection layer. Therefore, it is possible to easily manufacture a high quality electromagnetic wave shielding plate having high electromagnetic wave shielding properties.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view illustrating a configuration of an embodiment of an electromagnetic wave shield plate of the present invention.

FIG. 2 is a diagram illustrating a state of a metal pattern layer fixed on a resin layer.

FIG. 3 is a sectional view illustrating a configuration of a second embodiment of the electromagnetic wave shield plate of the present invention.

FIG. 4 is a flowchart illustrating a creation procedure of a creation example.

FIG. 5 is a diagram illustrating a configuration in a creation process of a creation example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Transparent base material 2 Resin layer 3 Metal pattern layer 4 PET film layer 5 Adhesive layer 6 Anti-reflection layer

 ──────────────────────────────────────────────────続 き Continued on the front page F-term (reference) 4F100 AB01C AJ05 AK01B AK01D AK42 AR00A AR00E BA03 BA04 BA05 BA07 BA10A BA10C BA10E DD09 EH66C EH71C EJ172 EJ422 GB41 HB00C JB16B JG10 JK06 JN01 AJ053 BB11

Claims (5)

[Claims] 1. An electromagnetic wave shield plate comprising: a metal pattern layer provided on a transparent substrate via a resin layer having thermoplasticity; and a lower portion of the metal pattern layer is buried in the resin layer. . 2. A film layer attached to one side of a transparent substrate, a resin layer having thermoplasticity formed on the film layer, a metal pattern layer formed on the resin layer, and the metal pattern An electromagnetic wave shield plate comprising: an upper surface of a layer; and an antireflection layer formed on the other surface of the transparent substrate, wherein a lower portion of the metal pattern layer is buried in the resin layer. 3. A method comprising forming a resin layer having thermoplasticity on a transparent substrate, forming a metal pattern layer on the resin layer, and heating the resin layer at a temperature higher than a glass transition point of the resin layer. Manufacturing method of an electromagnetic wave shielding plate. 4. A resin layer having thermoplasticity is formed on a film, and a metal pattern layer for preventing leakage of electromagnetic waves to the outside is formed on an upper surface of the resin layer, wherein the resin layer and the metal pattern layer are formed. After bonding the film formed on the upper surface to a transparent substrate and heating it at a temperature higher than the glass transition point of the resin layer, the light is reflected on the upper surface of the metal pattern layer and the other surface of the transparent substrate. A method for manufacturing an electromagnetic wave shielding plate, comprising forming an prevention layer. 5. The electromagnetic wave shield according to claim 3, wherein the metal pattern layer is heated at a temperature higher than a glass transition point of the resin layer, and then presses an upper surface of the metal pattern layer. Plate manufacturing method.