JP2000058568A - Semiconductor device manufacturing method and semiconductor device manufacturing apparatus - Google Patents

Abstract

(57) [Summary] [PROBLEMS] To enable the height from a tape carrier to the tip of a nozzle to be always set to an optimum constant value with high accuracy.
To enable sealing with excellent work stability. Each time a resin 21 is applied to a tape carrier 11 to which a semiconductor chip 20 is bonded from a tip of a nozzle 3 disposed above the tape carrier 11 and the semiconductor chip 20 is sealed with a resin, the resin 21 is applied. Prior to the application, the tape carrier 11 is pressed from above by the clamper 5 to be tightly fixed to the processing table 4 and the height of the tape carrier 11 is measured by the measuring means 6 in this state. The height position of the tip of the nozzle 3 is adjusted based on the height of the tape carrier 11 obtained by measurement.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device manufacturing method and a semiconductor device manufacturing apparatus, and more particularly to a TAB manufacturing method.
The present invention relates to a method of manufacturing a semiconductor device applied to a resin encapsulation step in manufacturing a semiconductor device using (Tape Automated Bonding) technology, and a manufacturing apparatus for a semiconductor device used in the method.

[0002]

2. Description of the Related Art Conventional semiconductor devices (semiconductor packages)
As a manufacturing method of the method, for example, a manufacturing method using a TAB technique is known. In this manufacturing method, first, FIG.
As shown in FIGS. 3A and 3B, a metal reinforcing plate 18 is adhered to one element unit of the tape carrier 11 prepared in advance via an adhesive 17, and then the tape as shown in FIG. A semiconductor chip (semiconductor element) 20 is mounted on the carrier 11.
Are connected (bonded).

The tape carrier 11 is formed by forming a conductive pattern 13 made of a copper circuit on an insulating organic film 12 such as polyimide. In the organic film 12, a rectangular through hole (device hole) 14 is formed in a mounting portion of the semiconductor chip 20, and a hole 15 for taking out the conductive pattern 13 as an external electrode is formed. Further, from the conductive pattern 13, an inner lead 16 is formed to extend inside the periphery of the through hole 14.

The reinforcing plate 18 has a rectangular hole 19 formed in a mounting portion of the semiconductor chip 20 and is adhered to the conductive pattern 13 side of the tape carrier 11 via an adhesive 17. Then, the semiconductor chip 20 is arranged at the positions of the through hole 14 of the tape carrier 11 and the hole 19 of the reinforcing plate 18, and the inner leads 16 are bonded to the electrode pads (not shown) formed on the upper surface of the semiconductor chip 20.

After the semiconductor chip 20 is bonded to the tape carrier 11, at least the upper surface of the semiconductor chip 20 and the entire inner leads 16 are covered with an epoxy resin or the like in order to protect the semiconductor chip 20 from moisture and dust in the external environment. A process of resin sealing and packaging is performed. As a resin sealing method, for example, a method of pouring a liquid resin is known. In this method, a copper outer frame holding a tape carrier 11 is fixed on a table, and a liquid resin 21 is discharged from a nozzle 3 at a constant pressure as shown in FIG. This is a method of applying a coating so as to cover the entire lead 16 and curing it by a heat treatment or the like to seal it. Since liquid resin has less resin waste compared to transfer molding and has a high degree of freedom in coating method, BGA (Ball Grid)
It is widely used in the manufacture of semiconductor devices for high-density packaging such as Arrays and CSPs (Chip Size Packages).

[0006]

In the above-described conventional method for manufacturing a semiconductor device, the resin is discharged at a constant pressure in order to obtain a stable resin coating amount and coating state in the resin sealing step. Therefore, the height from the tape carrier to the tip of the nozzle, specifically, the height from the semiconductor chip bonded to the tape carrier to the tip of the nozzle, and the height from the inner lead bonded to the electrode pad of the semiconductor chip to the tip of the nozzle It is necessary to keep the height constant with high precision. In particular, it is essential to keep the height from the inner lead to the tip of the nozzle constant with high precision. Therefore, conventionally, before applying the resin, the tip of the nozzle is set to a certain height at which the coating operation can be performed most stably with reference to the upper surface of the outer frame holding each tape carrier or the upper surface of the polyimide of the tape carrier. You have set.

However, on the tape carrier side to which the semiconductor chip is bonded, the tape carrier is fixed on the base by the outer frame holding the tape carrier.
There is a problem that the height of the tape carrier is not stable. In other words, since the tape carrier itself is held on the outer frame only by the hanging portions formed at the four corners, the reinforcement that becomes the lowermost surface of the tape carrier is provided on the base for fixing the tape carrier via the outer frame. The back surface of the plate or the back surface of the semiconductor chip does not adhere with high precision. Therefore,
Subtle deformation of the suspension portion of the tape carrier easily causes the tape carrier to float, and the height of the tape carrier is not stable.

Since the height of the tape carrier is not stable, the height from the semiconductor chip to the tip of the nozzle or the height from the inner lead after bonding to the tip of the nozzle varies for each tape carrier. There have been problems such as the inability to perform a stable sealing operation and the deterioration of the quality of a resin-sealed semiconductor device.

[0009] Under such circumstances, in the resin sealing step in the manufacture of a semiconductor device, the height from the semiconductor chip to the tip of the nozzle and the height from the inner lead after bonding to the tip of the nozzle are optimally set to a constant value. There is a strong need for a technology that can be set with high accuracy.

[0010]

Therefore, in order to solve the above-mentioned problems, a method of manufacturing a semiconductor device according to the present invention uses a tape carrier to which a semiconductor chip is bonded.
Each time the resin is applied from the tip of the nozzle arranged above the tape carrier and the semiconductor chip is sealed with resin, before applying the resin, the tape carrier is pressed down from above and tightly fixed to the processing table. In this state, the height of the tape carrier is measured, and then the step of adjusting the height position of the tip of the nozzle based on the measured height of the tape carrier is performed.

In the above invention, since the tape carrier is tightly fixed to the processing table by pressing it from above, the height of the tape carrier can be accurately measured without floating the tape carrier from the processing table as in the related art. Becomes possible. In addition, every time the semiconductor chip is sealed with resin, that is, the height of the tape carrier is measured for each element unit, and the height position of the tip of the nozzle is adjusted based on the measurement result. Even if the height varies, the height from the tape carrier to the tip of the nozzle without reflecting this variation, that is, the height from the inner lead after bonding to the tip of the nozzle, or the height from the semiconductor chip to the tip of the nozzle. The height can always be set to an optimal constant value. In addition, if the resin is discharged from the nozzle while the tape carrier is kept in close contact with the processing table, the resin can be accurately applied to the set amount and state of application of the resin.

According to another aspect of the present invention, there is provided a manufacturing apparatus for a semiconductor device, wherein a semiconductor chip is bonded to a semiconductor chip of a tape carrier having a semiconductor chip bonded to the semiconductor chip from a tip of a nozzle disposed above the tape carrier. Is used to seal the object to be processed by applying a resin, a processing table for mounting the tape carrier, and pressing the tape carrier from above when the tape carrier is mounted on the processing table. And a measuring means for measuring the height of the tape carrier when placed on the processing table.

In the above invention, there are provided fixing means for pressing the tape carrier from above and closely fixing the tape carrier to the processing table, and measuring means for measuring the height of the tape carrier when placed on the processing table. Therefore, it is possible to measure the height of the tape carrier in a state where the tape carrier is closely fixed to the processing table by the fixing means. Therefore, the height of the tape carrier is always accurately measured.

[0014]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of a method for manufacturing a semiconductor device and a device for manufacturing a semiconductor device according to the present invention will be described below with reference to the drawings. FIG. 1 is an explanatory diagram showing a schematic configuration diagram of an embodiment of a semiconductor device manufacturing apparatus (hereinafter, simply referred to as a manufacturing apparatus) according to the present invention. The manufacturing apparatus 1 includes a tape carrier 1 to which a semiconductor chip 20 is bonded.
1, the semiconductor chip 20 and the tape carrier 11
A liquid resin 21 such as an epoxy resin is applied from the tip of the nozzle 3 disposed above the semiconductor chip 20 to seal the semiconductor chip 20, and the present invention is applied to a conventional coating apparatus. .

The tape carrier 11 to be sealed by the manufacturing apparatus 1 of the present embodiment has a rectangular reinforcing plate 18 bonded to the conductive pattern 13 side of the tape carrier 11 via an adhesive 17 as in the conventional case. Along with
The semiconductor chip 20 is disposed in the through hole (device hole) 14 of the tape carrier 11 and the hole 19 of the reinforcing plate 18, and the inner lead 16 of the tape carrier 11 is bonded to an electrode pad (not shown) on the upper surface of the semiconductor chip 20. It is made of a state of being in a state. FIG. 1 shows a state in which such a tape carrier 11 is arranged in the manufacturing apparatus 1 and a resin 21 is applied.

That is, the manufacturing apparatus 1 of this embodiment applies resin to each element, that is, to each semiconductor chip 20 of the tape carrier 11 to which a plurality of semiconductor chips 20 are bonded. It comprises a syringe 2, a processing table 4, a clamper 5, a measuring means 6, a clamper driving means 7, a moving means 8 and a control means 9 having the same. The syringe 2 is formed by temporarily storing a liquid resin therein, and is disposed above the processing table 4 with the nozzle 3 facing downward.

The processing table 4 is for mounting the tape carrier 11 to which the semiconductor chip 20 is bonded, with the reinforcing plate 18 side facing the processing table 4, and is fitted to the outer shape of the tape carrier 11 for each element. Concave size 4a
The has been adherable designing the rear surface of the reinforcing plate 18 to the bottom surface 4a ₁ of the recess 4a with high accuracy. That is, the concave portion 4a has a substantially rectangular shape in plan view having an area substantially equal to the outer shape of the reinforcing plate 18, and is formed to a depth equal to or less than a value obtained by adding the thickness of the reinforcing plate 18 and the thickness of the adhesive 17. The bottom 4a ₁ of the concave portion 4a has a flat surface with high accuracy.

The clamper 5 serves as a fixing means of the present invention. When the tape carrier 11 is placed on the processing table 4, the semiconductor chip is sealed from the organic film 12 side of the tape carrier 11 of one element unit to be sealed. The entirety of the tape carrier 11 except for the peripheral portion of the tape carrier 20 is pressed uniformly, and is tightly fixed to the processing table 4. Therefore, clamper 5
Is formed in a rectangular frame shape whose inner peripheral edge is larger than the peripheral edge of the through hole 14 of the tape carrier 11 and whose outer peripheral edge is larger than the outer peripheral edge of the tape carrier 11. In addition, clamper 5
As described later, the tape carrier 11 is always pressed by the clamper driving means 7 with a constant pressure.

The measuring means 6 measures the height of the tape carrier 11 when the tape carrier 11 is placed on the processing table 4. In the present embodiment, for example, a sensor 6a provided on the lower surface of the clamper 5 to detect a pressure applied from the tape carrier 11 by pressing the clamper 5, and a calculation for obtaining the height of the tape carrier 11 based on the detection result from the sensor 6a 6b, and the tape carrier 11
The height of the inner lead 16 is determined from the height of the tape carrier 11.

The sensor 6a is composed of, for example, a piezoelectric element, detects the pressure applied from the tape carrier 11, converts the pressure into an electric signal, and outputs a detection result composed of the electric signal to the arithmetic unit 6b. On the other hand, the information of the correlation between the electric signal obtained from the sensor 6a when the tape carrier 11 is pressed with a constant pressure and the thickness of the entire tape carrier 11 is input to the arithmetic unit 6b in advance, and The thickness information of the organic film 12 in the carrier 11 is input. Therefore, the calculation unit 6b calculates the thickness of the entire tape carrier 11 based on the detection result from the sensor 6a, and calculates the height of the inner lead 16 of the tape carrier 11 by subtracting the thickness of the organic film 12 from this thickness. It has become. Then, the determined height of the inner lead 16 is output to the control means 9.

The clamper driving means 7 drives the clamper 5 to move the clamper 5 in the vertical direction and to always press the tape carrier 11 with a constant pressure when the clamper 5 is moved in the downward direction. The start and end of pressing of the clamper 5 are controlled by the control means 9. The moving means 8 is for moving the tip of the nozzle 3 up and down, and is configured to move the tip of the nozzle 3 up and down by driving the syringe 2 up and down.

The control means 9 calculates the optimum height position of the tip of the nozzle 3 for applying the resin 21 to the semiconductor chip 20 of the tape carrier 11 based on the height of the inner lead 16 determined by the calculation unit 6b of the measuring means 6. The moving means 8 is controlled so that the obtained height position is located at the tip of the nozzle 3. The control means 9 is composed of, for example, a microcomputer, and inputs and stores optimum height information of the tip of the nozzle from the height position of the inner lead, which is experimentally obtained in advance. Therefore, the control means 9 includes the arithmetic unit 6b
The moving means 8 is arranged so that the tip of the nozzle 3 is located at a value obtained by adding the height of the optimum tip of the nozzle from the height position of the inner lead stored in advance to the height of the inner lead 16 obtained in step (1). Is controlled.

The control means 9 controls the resin 2 in the syringe 2
Before applying 1 to the semiconductor chip 20, the height of the inner lead 16 is measured, the position of the tip of the nozzle 3 is adjusted, and then a program of a series of processing procedures for applying the resin 21 to the semiconductor chip 20 is input. Based on this, the clamper driving means 7 and the moving means 8 are controlled.

The manufacturing apparatus 1 configured as described above measures the height of the inner lead 16 of the tape carrier 11, adjusts the position of the tip of the nozzle 3, and applies the resin 21. The clamper 5 and the syringe 2 move on the tape carrier 11 to be processed, or the tape carrier 11 itself moves so that the tape carrier 11 to be processed next is placed on the processing table 4.

Next, an embodiment of a method for manufacturing a semiconductor device according to the present invention will be described, taking as an example a case where a semiconductor device is manufactured using the manufacturing apparatus 1 described above. FIGS. 2A to 2D
FIG. 4 is a sectional side view of a main part showing one embodiment of a method for manufacturing a semiconductor device according to the present invention in the order of steps. Before carrying out the method of the present embodiment, the bonding step of the reinforcing plate 18 and the bonding step of the inner leads 16 are performed by using the conventional technology described with reference to FIGS.
As shown in FIG. 2A, a tape carrier 11 to which a semiconductor chip 20 is bonded is prepared.

After the tape carrier 11 is prepared, the tape carrier 11 for each element is placed in the recess 4a of the processing table 4 of the manufacturing apparatus 1 shown in FIG. In this embodiment, the resin 21 is applied and sealed.
Prior to the application of No. 1, a measuring step of measuring the height of the tape carrier 11 placed on the processing table 4 is first performed.

In the measuring step, the tape carrier 11 is inserted into the recess 4 of the processing table 4 with the reinforcing plate 18 facing the processing table 4.
2a, the clamper 5 is lowered, and the whole of the tape carrier 11 except for the periphery of the semiconductor chip 20 is pressed from the organic film 12 side with a constant pressure as shown in FIG. 11 is closely fixed to the processing table 4. Then, in this state, the measuring means 6 of the manufacturing apparatus 1 calculates the thickness of the inner lead 16 from the thickness of the tape carrier 11.
Accurately measure the height of

Next, an adjustment step is performed to adjust the tip of the nozzle 3 to an optimum height position based on the measured height of the inner lead 16. As described above, in the manufacturing apparatus 1, when the measuring unit 6 measures the height of the inner lead 16, the control unit 9 transmits the measured inner lead 1.
The height of the tip of the nozzle 3 that is optimal for applying the resin 21 to the tape carrier 11 is determined from the height of the nozzle 6, and the moving unit 8 is controlled so that the determined height is the tip of the nozzle 3. Therefore, the tip of the nozzle 3 is automatically adjusted by the manufacturing apparatus 1 to a height position that is optimal for applying the resin 21 to the tape carrier 11.

After performing the above-described measurement step and adjustment step, the resin 21 is applied from the nozzle 3 to the upper surface of the semiconductor chip 20 and the entire inner lead 16, and the applied resin 21 is cured by heat treatment or the like. As shown in b), the upper surface of the semiconductor chip 20 and the entire inner lead 16 are sealed. The application of the resin 21 is performed while the tape carrier 11 is tightly fixed to the processing table 4 by the clamper 5. As a result, it is possible to apply with high accuracy the set application amount and application state.

In the manufacturing apparatus 1, after the resin 21 is applied to the tape carrier 11, the clamper 5 is once moved up, and the tape carrier 11 to be subsequently sealed is placed on the processing table 4. Alternatively, the clamper 5 rises and moves on the tape carrier 11 to be sealed next, and the above-described measurement, adjustment, and coating operations are repeated.

After the resin sealing is performed as described above, the tape carrier 11 is subjected to processes such as cover plate bonding, external electrode formation, and outer shape cutting as in the conventional case. That is, as shown in FIG. 2C, a metal cover plate 23 is bonded to the reinforcing plate 18 and the back surface of the semiconductor chip 20 with the adhesive 22 and the die bonding agent 26 or the like. Next, as shown in FIG.
A plurality of solder ball electrodes 24 serving as external electrodes are formed on one organic film 12. At this time, the solder balls 24 are formed so as to be electrically connected to the conductive patterns 13 through the holes 15 of the organic film 12.

Thereafter, as shown in FIG. 2E, the semiconductor device 25 is manufactured by cutting the tape carrier 11 to the outer shape of the semiconductor device. Note that the steps after resin encapsulation are merely examples, and it goes without saying that various steps in different orders can be applied.

As described above, according to the manufacturing method of the present embodiment, the tape carrier 11 is pressed down from above to be tightly fixed to the processing table 4, and then the height of the inner leads 16 is determined from the height of the tape carrier 11 in this state. Since the measurement is performed, the height of the inner lead 16 can be always accurately measured without the tape carrier 11 floating from the processing table 4 unlike the related art.

The height of the inner lead 16 is measured for each element unit, and the height position of the tip of the nozzle 3 is adjusted based on the measurement result. Even if there is, the inner lead 1 after bonding is not reflected
The height from 6 to the tip of the nozzle 3 can always be set to an optimum constant value with high accuracy.

Furthermore, since the resin 21 is discharged from the nozzle 3 while the tape carrier 11 is fixed to the processing table 4 in close contact, the resin 21 can be applied with high precision in the set resin application amount and application state. Accordingly, a sealing operation with excellent operation stability can be performed, and a high-quality semiconductor device 25 can be stably manufactured.

Further, according to the manufacturing apparatus 1 of this embodiment, the clamper 5 for pressing the tape carrier 11 from above and closely fixing the tape carrier 11 to the processing table 4, and the inner of the tape carrier 11 mounted on the processing table 4. Since the measuring device 6 for measuring the height of the lead 16 is provided, the method of the present embodiment can be reliably performed. In addition, inner lead 16
Of the height of the nozzle 3 and adjustment of the tip of the nozzle 3 to the optimum height position are automatically performed under the control of the control means 9.
In addition to preventing human error and variation in measurement results for each worker, even if the height of the inner lead 16 is measured for each element and the position of the tip of the nozzle 3 is adjusted, the yield is hardly affected. There is no advantage.

In the manufacturing apparatus according to the present embodiment, an example has been described in which the calculation section of the measurement means is provided separately from the control means. However, the control means may have the function of the calculation section of the measurement means. However, the present invention is not limited to this example.

Further, in the manufacturing apparatus and the manufacturing method of the present embodiment, the case where the measuring means measures only the height of the inner lead of the tape carrier has been described, but the height of the inner lead of the tape carrier and the height of the semiconductor chip are different. May be measured. It is also possible to adjust the height position of the tip of the nozzle with reference to these height positions.

When measuring the height of a semiconductor chip,
When the tape carrier is pressed by the clamper, the concave portion is formed such that the back surface of the semiconductor chip closely adheres to the bottom surface of the concave portion of the processing table with high precision. The value obtained by subtracting the necessary amount of the organic film of the tape carrier, the conductive pattern, and the adhesive thickness between the conductive pattern and the reinforcing plate from the thickness of the entire tape carrier detected by the sensor of the measuring means is the height of the semiconductor chip. The optimum height of the tip of the nozzle from the height of the semiconductor chip is added to this value to set the optimum height of the tip of the nozzle for coating. Then, the height of the nozzle tip is determined in consideration of both the set value and the optimum height of the nozzle tip set from the height of the inner lead.

[0040]

As described above, according to the method of manufacturing a semiconductor device according to the present invention, the height of the tape carrier is measured in this state after the tape carrier is pressed from above and closely fixed to the processing table. Therefore, the height of the tape carrier can always be accurately measured. Also, since the height of the tip of the nozzle is adjusted by measuring the height of the tape carrier for each element unit, even if the height of the tape carrier varies between element units, this variation is not reflected,
The height from the tape carrier to the tip of the nozzle can always be set to an optimum constant value with high accuracy. Therefore, a sealing operation with excellent operation stability can be performed, and a high-quality semiconductor device can be stably manufactured.

Further, according to the semiconductor device manufacturing apparatus of the present invention, the fixing means for pressing the tape carrier from above to fix it tightly to the processing table, and measuring the height of the tape carrier mounted on the processing table. Therefore, the method for manufacturing a semiconductor device according to the present invention can be reliably performed. Therefore, the same effect as the manufacturing method of the present invention can be obtained.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram showing a schematic configuration diagram of an embodiment of a semiconductor device manufacturing apparatus according to the present invention.

FIGS. 2A to 2E are cross-sectional views of a main part showing one embodiment of a method of manufacturing a semiconductor device according to the present invention in the order of steps.

3 (a) to 3 (c) are cross-sectional side views of a main part showing an example of a process up to inner lead bonding of a conventional method of manufacturing a semiconductor device by TAB technology.

FIG. 4 is a diagram illustrating a coating process in a conventional method for manufacturing a semiconductor device.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Manufacturing apparatus, 3 ... Nozzle, 4 ... Processing table, 5 ... Clamper, 6 ... Measuring means, 6a ... Sensor, 6b ... Calculation part, 8 ...
Moving means, 9: control means, 11: tape carrier, 16
... inner lead, 20 ... semiconductor chip, 21 ... resin,
25 ... Semiconductor device

Claims (6)

[Claims] 1. A method of manufacturing a semiconductor device in which a resin is applied to a semiconductor chip of a tape carrier to which a semiconductor chip is bonded from a tip of a nozzle disposed above the tape carrier and the semiconductor chip is sealed with a resin. In each of the above steps, each time the semiconductor chip is sealed with a resin, prior to applying the resin, the tape carrier is pressed from above to be tightly fixed to a processing table, and the height of the tape carrier is measured in this state. And a step of adjusting the height position of the tip of the nozzle based on the height of the tape carrier obtained in the measuring step. 2. The method according to claim 1, wherein, in the measuring step, at least a height of the inner lead among the height of the inner lead of the tape carrier and a height of the semiconductor chip is measured from the height of the tape carrier. Item 2. A method for manufacturing a semiconductor device according to Item 1. 3. The method of manufacturing a semiconductor device according to claim 1, wherein when applying the resin, the application is performed in a state where the tape carrier is in close contact with the processing table. 4. A semiconductor device used for applying a resin to a semiconductor chip of a tape carrier to which a semiconductor chip is bonded from a tip of a nozzle arranged above the tape carrier and sealing the semiconductor chip with the resin. A processing table for mounting the tape carrier, and for pressing and fixing the tape carrier from above when the tape carrier is mounted on the processing table, for tightly fixing the tape carrier to the processing table. An apparatus for manufacturing a semiconductor device, comprising: fixing means; and measuring means for measuring a height of a tape carrier when the tape carrier is mounted on the processing table. 5. A sensor provided on the fixing means for detecting a pressure applied from the tape carrier by pressing the fixing means, and a height of the tape carrier based on a detection result from the sensor. 5. The manufacturing device for a semiconductor device according to claim 4, further comprising: an operation unit for obtaining the following. 6. A nozzle for applying a resin to a semiconductor chip of a tape carrier mounted on the processing table, a moving unit for moving the nozzle in a vertical direction, and a tape carrier measured by the measuring unit. Control means for determining a height position of the tip of the nozzle optimal for applying the resin to the tape carrier from the height, and controlling the moving means so that the height position is the tip of the nozzle. 5. The apparatus for manufacturing a semiconductor device according to claim 4, wherein: