JP2000048156A - Method of forming antenna for non-contact IC module - Google Patents

Abstract

(57) Abstract: An antenna is formed with a metal vapor-deposited layer without being affected by the surface shape of a holding base, and an antenna with low cost and high sensitivity is obtained. An adhesive is applied to a metal-deposited layer of the metal-deposited sheet, and the metal-deposited sheet is die-cut into an antenna shape in a state where the metal-deposited sheet is releasably covered with a release paper so as to cover the antenna-shaped metal-deposited sheet. After the tack sheet is overlaid on the release paper 10 and the transfer substrate is removed, the antenna-shaped metal vapor-deposited layer 8 and the covering member 5 are attached to each other.
Was peeled off from the covering member 5 and the metal vapor-deposited layer 8 to form the antenna 4 made of the metal vapor-deposited layer of the metal vapor-deposited layer 8 on the joint surface side of the covering member 5 with the holding base.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method for forming an antenna for a non-contact IC module.

[0002]

In recent years, as disclosed in JP-A-5-166018 and JP-A-8-216570, a transmission medium is provided between a holding base and a covering member. 2. Description of the Related Art A non-contact type IC card has been proposed in which an antenna for transmitting and receiving electromagnetic wave data and a module including an IC chip having a function of writing, holding, rewriting and erasing the data are sandwiched. In this non-contact type IC card, it is necessary to make the antenna connected to the IC module thin. In forming the antenna, a vapor deposition method of directly performing metal vapor deposition on the holding base of the IC module, An etching method in which a thin metal layer is formed in advance and etched, a coil bonding method in which a separately formed coil is bonded to a holding base, and a conductive ink printed on the holding base in an antenna shape to form an antenna. The antenna was formed by a conductive ink printing method or the like.

[0003] However, among the above-described antenna forming methods, the sensitivity of the formed antenna is relatively high by the metal deposition method. If the unevenness is present, the unevenness is formed on the metal-deposited surface directly under the influence of the surface condition, so that the disturbance of the electromagnetic field distribution is increased and the sensitivity of the antenna is reduced. In addition, the above-mentioned etching method is a method for easily forming an antenna shape arbitrarily, but involves many work steps such as application of a resist agent, pattern formation on the resist agent, and etching with an etching solution, which requires expensive equipment work. The environment is also required, raising the production cost. Then, it is necessary to safely treat a large amount of waste liquid generated during the etching step. Although the antenna formed by the coil bonding method has excellent sensitivity, the workability is poor because the metal coil is directly bonded to the surface of the holding base. In addition, there is a problem that there are many difficulties in securely bonding the metal coil to the holding base, and the productivity is poor. In the conductive ink printing method, the antenna shape can be arbitrarily formed using a printing method and the workability is good, but there is a problem that the antenna sensitivity is inferior because a non-conductive substance such as an ink vehicle is mixed. Was. Therefore, the present inventors focused on the point that a metal-deposited layer having a smooth surface can be obtained by performing metal vapor deposition on a smooth base material,
In this regard, the present invention has been made in view of the above-described circumstances, and has as an object to form an antenna with a metal-deposited layer without being affected by the surface shape of the holding base, and to obtain a low-cost and highly sensitive antenna. Aim.

[0004]

SUMMARY OF THE INVENTION The present invention has been made in consideration of the above problems, and is directed to a method of forming an antenna comprising a metal deposition layer via an adhesive on a holding base for disposing a non-contact IC module. Then, an adhesive is applied to the metal deposition layer of the metal deposition transfer sheet formed by metal deposition on the deposition surface of the transfer base material, and the metal deposition transfer sheet is die-cut into an antenna shape. The transfer sheet is bonded to the holding base via the adhesive, the transfer base is peeled off after the adhesive is cured, and the metal-deposited layer is transferred to the holding base in the antenna-shaped pattern. It is an object of the present invention to provide a method for forming an antenna for a non-contact IC module to solve the above-mentioned problem.

[0005]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described in detail with reference to the embodiments shown in FIGS. In the drawing, reference numeral 1 denotes a non-contact type IC card, in which a non-contact type IC module 3 and an antenna 4 connected to the non-contact type IC module 3 are arranged on the surface of a holding base 2, and a covering member 5 is superposed thereon. Have been. In the present invention for forming the antenna 4 in the non-contact type IC card 1, a metal deposition sheet 6 shown in FIG. 2 is used. The metal-deposited sheet 6 is obtained by forming a metal-deposited layer 8 by depositing a conductive metal on a smooth deposition surface 7 a of a base 7. Then, an adhesive 9 is applied to the entire surface (the lower surface in the figure) of the metal-deposited layer 8 in the metal-deposited sheet 6, and the adhesive 9 is releasably covered with a release paper 10. Next, the metal-deposited sheet 6 is cut into an antenna shape at a depth that does not divide the release paper 10 in the form of a laminated sheet in which the metal-deposited sheet 6 and the release paper 10 are superimposed and bonded together. Is removed from the release paper 10 and the transfer base material 7 is separated from the metal deposition transfer sheet 6 in the antenna formation area (see FIG. 4).

The covering member 5 for obtaining the non-contact type IC card is constituted by a tack sheet provided with an adhesive 11 on one side on the holding base 2 side. Is bonded to the release paper 10 so as to cover the metal deposition 8 (FIG. 5). Thereafter, the release paper 10 is coated with the metal deposition layer 8 and the coating member 5.
And peeled off. By peeling off the release paper 10,
As shown in FIG. 6, the adhesives 9 and 11 between the metal deposition layer 8 and the covering member 5 are exposed, and the metal deposition layer 8 can be stuck. The attached covering member 5 is also in a state where it can be attached. As described above, since the covering member 5 itself is formed from the tack sheet provided with the adhesive 11, and the antenna-shaped metal vapor-deposited layer 8 is attached with the adhesive 9 exposed, Antenna 4 consisting of metal-deposited layer 8 of layer 8
Is formed in a state where it can be arranged between the covering member 5 and the holding base 2. Then, as described above, the covering member 5 in a state where the antenna 4 is formed is superimposed on and bonded to the holding base 2 via the adhesive 11, and the metal deposition layer 8 is also bonded via the adhesive 9. Stick it to 2. Thus, FIG.
As shown in FIG. 5, a non-contact type IC in which an antenna 4 is arranged between a covering member 5 and a holding base 2 by bonding the covering member 5 and the holding base 2 to each other.
You get a card. Although not shown, related components such as an IC module are connected after the sheet-shaped metal-deposited sheet is cut into an antenna shape.

As described above, since the antenna 4 is bonded to the surface of the holding base 2 via the adhesive 9 when forming the antenna 4, even if there is unevenness on the surface of the holding base 2, The adhesive 9 which is sometimes in a soft state is attached to the holding base 2 side with a certain thickness (application thickness), so that the shape of the unevenness is leveled. The smoothness of the layer 8 is not lost. Further, even if the metal deposition layer 8 itself is formed by vapor deposition, the metal deposition layer 8 is deposited on a smooth base material. The surface is smooth.

[0008]

As described above, the present invention relates to a method for forming an antenna comprising a metal-deposited layer via an adhesive on a holding base for disposing a non-contact IC module,
An adhesive is applied to the metal-deposited layer of the metal-deposited transfer sheet formed by metal-depositing the transfer-deposited base material, the metal-deposited transfer sheet is die-cut into an antenna shape, and the die-cut metal-deposited transfer sheet is removed. The method is characterized in that the transfer substrate is peeled off after the adhesive is cured and the adhesive is cured, and the metal-deposited layer is transferred to the support substrate in the antenna-shaped pattern. . As described above, since the metal-deposited sheet in the form of an antenna is used and bonded to the holding base via an adhesive, the antenna is formed by the metal-deposited sheet, and the unevenness of the surface of the holding base is reduced. The influence of the unevenness due to the absorption by the adhesive does not appear on the metal deposition layer side. Also,
Even if it is in the metal deposition layer itself, it is deposited on a smooth deposition surface of the base material with a uniform thickness, and the surface is smooth,
The present invention has an effect that is excellent in practicality, such that an antenna having a smooth surface that does not disturb the electromagnetic field distribution can be easily formed on the holding base.

[Brief description of the drawings]

FIG. 1 is an explanatory view showing an example of a non-contact type IC card provided with an antenna formed by a method for forming an antenna for a non-contact type IC module according to the present invention in an exploded state.

FIG. 2 is an explanatory view showing a cross section of a metal vapor-deposited sheet stuck to release paper.

FIG. 3 is an explanatory view showing a state in which a metal vapor-deposited sheet is cut into an antenna shape in an example of a method of forming an antenna for a non-contact IC module according to the present invention.

FIG. 4 is an explanatory view showing a cross section of the metal vapor-deposited sheet similarly cut out.

FIG. 5 is an explanatory view showing a state in which a covering member is attached to a metal deposition layer in a cross section.

FIG. 6 is an explanatory diagram showing a cross section of a state where a release paper is peeled off.

FIG. 7 is an explanatory view showing a state in which a covering member is attached to a holding base in a cross section.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Non-contact IC card 2 ... Holding base 3 ... Non-contact IC module 4 ... Antenna 5 ... Coating member 6 ... Metal vapor deposition sheet 7 ... Base material 8 ... Metal vapor deposition layer 10 ... Release paper

Claims (1)

[Claims] 1. A method for forming an antenna comprising a metal deposition layer via an adhesive on a holding base for arranging a non-contact IC module, comprising: An adhesive is applied to the metal-deposited layer of the sheet, the metal-deposited transfer sheet is die-cut into an antenna shape, and the die-cut metal-deposited transfer sheet is attached to a holding base via the adhesive, and the adhesive is formed. A method for forming an antenna for a non-contact IC module, wherein the transfer base material is peeled off after curing, and the metal deposition layer is transferred to a holding base in a pattern of the antenna shape.