JP1770547S - Electrostatic Chuck - Google Patents
Electrostatic ChuckInfo
- Publication number
- JP1770547S JP1770547S JP2023023904F JP2023023904F JP1770547S JP 1770547 S JP1770547 S JP 1770547S JP 2023023904 F JP2023023904 F JP 2023023904F JP 2023023904 F JP2023023904 F JP 2023023904F JP 1770547 S JP1770547 S JP 1770547S
- Authority
- JP
- Japan
- Prior art keywords
- electrostatic chuck
- adsorbing
- wafer
- article
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Abstract
本物品は、半導体製造工程においてウェハーを吸着すること、又は基板を支持することができる静電チャックである。The article is an electrostatic chuck capable of adsorbing a wafer or supporting a substrate in a semiconductor manufacturing process.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US202329893602 | 2023-05-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP1770547S true JP1770547S (en) | 2024-05-16 |
Family
ID=91031424
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023023904F Active JP1770547S (en) | 2023-05-31 | 2023-11-20 | Electrostatic Chuck |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP1770547S (en) |
| TW (1) | TWD233182S (en) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWD135511S1 (en) | 2008-10-03 | 2010-06-21 | 日本碍子股份有限公司 | Electrostatic chuck |
-
2023
- 2023-11-20 JP JP2023023904F patent/JP1770547S/en active Active
- 2023-11-24 TW TW112306074F patent/TWD233182S/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TWD233182S (en) | 2024-08-21 |
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