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JP1741185S - semiconductor element - Google Patents

semiconductor element

Info

Publication number
JP1741185S
JP1741185S JP2022023715F JP2022023715F JP1741185S JP 1741185 S JP1741185 S JP 1741185S JP 2022023715 F JP2022023715 F JP 2022023715F JP 2022023715 F JP2022023715 F JP 2022023715F JP 1741185 S JP1741185 S JP 1741185S
Authority
JP
Japan
Prior art keywords
semiconductor element
called
sbds
electrodes
shapes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022023715F
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2022023715F priority Critical patent/JP1741185S/en
Application granted granted Critical
Publication of JP1741185S publication Critical patent/JP1741185S/en
Priority to US29/874,879 priority patent/USD1043594S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Abstract

この意匠に係る物品は、いわゆるＳＢＤ（Ｓｃｈｏｔｔｋｙ Ｂａｒｒｉｅｒ Ｄｉｏｄｅ）と称されることのある半導体素子である。本物品は、電極の一部を複数の略山形状に形成することにより、従来のＳＢＤと比べ、順方向電圧を低くすることができる。An article according to this design is a semiconductor device sometimes called a so-called SBD (Schottky Barrier Diode). The present article can lower the forward voltage compared to conventional SBDs by forming part of the electrodes in a plurality of substantially mountain-like shapes.

JP2022023715F 2022-11-01 2022-11-01 semiconductor element Active JP1741185S (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2022023715F JP1741185S (en) 2022-11-01 2022-11-01 semiconductor element
US29/874,879 USD1043594S1 (en) 2022-11-01 2023-04-26 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2022023715F JP1741185S (en) 2022-11-01 2022-11-01 semiconductor element

Publications (1)

Publication Number Publication Date
JP1741185S true JP1741185S (en) 2023-04-06

Family

ID=85777486

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022023715F Active JP1741185S (en) 2022-11-01 2022-11-01 semiconductor element

Country Status (2)

Country Link
US (1) USD1043594S1 (en)
JP (1) JP1741185S (en)

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06173081A (en) * 1992-12-03 1994-06-21 Murata Mfg Co Ltd Electronic parts
USD406822S (en) * 1997-03-06 1999-03-16 Siemens Aktiengesellschaft Carrier element for a semiconductor chip for integration into a chipcard, or a chipcard module
TW473882B (en) * 1998-07-06 2002-01-21 Hitachi Ltd Semiconductor device
JP3842444B2 (en) * 1998-07-24 2006-11-08 富士通株式会社 Manufacturing method of semiconductor device
USD456367S1 (en) * 2000-12-15 2002-04-30 Protek Devices, Lp Semiconductor chip
USD480371S1 (en) * 2001-11-30 2003-10-07 Kabushiki Kaisha Toshiba Semiconductor device
USD475355S1 (en) * 2002-03-11 2003-06-03 Kabushiki Kaisha Toshiba Semiconductor device
TWD101174S1 (en) * 2002-03-11 2004-11-01 東芝股份有限公司 Semiconductor Components (IV)
USD475982S1 (en) * 2002-03-11 2003-06-17 Kabushiki Kaisha Toshiba Semiconductor device
USD489338S1 (en) * 2003-07-28 2004-05-04 Semiconductor Components Industries, L.L.C. Packaged semiconductor device
USD509810S1 (en) * 2003-07-30 2005-09-20 Delta Electronics Inc. Molding structure of electric element
JP4294405B2 (en) * 2003-07-31 2009-07-15 株式会社ルネサステクノロジ Semiconductor device
USD510728S1 (en) * 2004-08-11 2005-10-18 Semiconductor Components Industries Llc Semiconductor device package
USD504874S1 (en) * 2004-08-11 2005-05-10 Semiconductor Components Industries, Llc Semiconductor device package
USD648290S1 (en) * 2010-06-08 2011-11-08 Miyoshi Electronics Corporation Semiconductor device
USD756317S1 (en) * 2014-08-26 2016-05-17 Féinics Amatech Teoranta Layout for contact pads and connection bridges of a transponder chip module
USD768115S1 (en) * 2015-02-05 2016-10-04 Armen E. Kazanchian Module
JP1577498S (en) * 2016-09-30 2017-05-29
JP1580899S (en) * 2016-11-15 2017-07-10
JP1577511S (en) * 2016-11-15 2017-05-29
JP1584883S (en) * 2017-01-31 2017-08-28
JP1584651S (en) * 2017-01-31 2017-08-28
USD887998S1 (en) * 2017-02-17 2020-06-23 Stat Peel Ag Chip
USD853978S1 (en) * 2017-02-28 2019-07-16 Infineon Technologies Ag High-performance semiconductor module
JP1695980S (en) * 2021-03-09 2021-09-27

Also Published As

Publication number Publication date
USD1043594S1 (en) 2024-09-24

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