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JP1689809S - - Google Patents

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Publication number
JP1689809S
JP1689809S JPD2020-8775F JP2020008775F JP1689809S JP 1689809 S JP1689809 S JP 1689809S JP 2020008775 F JP2020008775 F JP 2020008775F JP 1689809 S JP1689809 S JP 1689809S
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JP
Japan
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Application number
JPD2020-8775F
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Publication of JP1689809S publication Critical patent/JP1689809S/ja
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JPD2020-8775F 2019-10-30 2020-04-30 Active JP1689809S (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/711,377 USD884855S1 (en) 2019-10-30 2019-10-30 Heater pedestal

Publications (1)

Publication Number Publication Date
JP1689809S true JP1689809S (ja) 2021-07-12

Family

ID=70615523

Family Applications (1)

Application Number Title Priority Date Filing Date
JPD2020-8775F Active JP1689809S (ja) 2019-10-30 2020-04-30

Country Status (3)

Country Link
US (1) USD884855S1 (ja)
JP (1) JP1689809S (ja)
TW (1) TWD214069S (ja)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1712715S (ja) * 2020-12-08 2022-04-15 ヒータ
USD1066620S1 (en) 2021-02-12 2025-03-11 Applied Materials, Inc. Patterned heater pedestal with groove extensions
JP1725824S (ja) 2021-12-02 2022-09-28 セラミックス製ヒーター
JP1733778S (ja) 2021-12-02 2023-01-06 セラミックス製ヒーター
JP1725893S (ja) 2021-12-02 2022-09-28 セラミックス製ヒーター
JP1755440S (ja) 2021-12-02 2023-10-18 セラミックス製ヒーター
JP1733880S (ja) 2021-12-02 2023-01-06 セラミックス製ヒーター

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3347742B2 (ja) 1997-01-02 2002-11-20 シーヴイシー・プロダクツ・インコーポレーテッド 真空処理装置のための熱伝導性チャック、熱伝達装置及びチャック本体と基材との間で熱を伝達させる方法
US6278089B1 (en) 1999-11-02 2001-08-21 Applied Materials, Inc. Heater for use in substrate processing
US6544340B2 (en) 2000-12-08 2003-04-08 Applied Materials, Inc. Heater with detachable ceramic top plate
TWI281833B (en) * 2004-10-28 2007-05-21 Kyocera Corp Heater, wafer heating apparatus and method for manufacturing heater
JP5478065B2 (ja) 2005-08-17 2014-04-23 アプライド マテリアルズ インコーポレイテッド ロウ付けプレートおよび抵抗ヒーターを有する基板サポート
KR100804169B1 (ko) * 2005-12-31 2008-02-18 주식회사 아이피에스 박막증착챔버용 서셉터
TWD130500S1 (zh) * 2006-12-15 2009-08-21 東京威力科創股份有限公司 電漿處理裝置的加熱平台用遮罩
USD614593S1 (en) * 2008-07-21 2010-04-27 Asm Genitech Korea Ltd Substrate support for a semiconductor deposition apparatus
US8329575B2 (en) * 2010-12-22 2012-12-11 Applied Materials, Inc. Fabrication of through-silicon vias on silicon wafers
US9624137B2 (en) * 2011-11-30 2017-04-18 Component Re-Engineering Company, Inc. Low temperature method for hermetically joining non-diffusing ceramic materials
US9984866B2 (en) * 2012-06-12 2018-05-29 Component Re-Engineering Company, Inc. Multiple zone heater
US9673077B2 (en) * 2012-07-03 2017-06-06 Watlow Electric Manufacturing Company Pedestal construction with low coefficient of thermal expansion top
US20140251214A1 (en) * 2013-03-06 2014-09-11 Applied Materials, Inc. Heated substrate support with flatness control
USD716742S1 (en) * 2013-09-13 2014-11-04 Asm Ip Holding B.V. Substrate supporter for semiconductor deposition apparatus
KR101465640B1 (ko) * 2014-08-08 2014-11-28 주식회사 펨빅스 불화알루미늄 생성방지막이 형성된 ｃｖｄ 공정챔버 부품
US10510625B2 (en) * 2015-11-17 2019-12-17 Lam Research Corporation Systems and methods for controlling plasma instability in semiconductor fabrication
USD807481S1 (en) 2016-04-08 2018-01-09 Applied Materials, Inc. Patterned heater pedestal
US11702748B2 (en) * 2017-03-03 2023-07-18 Lam Research Corporation Wafer level uniformity control in remote plasma film deposition
USD859484S1 (en) 2017-06-12 2019-09-10 Asm Ip Holding B.V. Heater block
USD862539S1 (en) * 2017-12-04 2019-10-08 Liqua-Tech Corporation Register gear adapter plate
US11014853B2 (en) * 2018-03-07 2021-05-25 Applied Materials, Inc. Y2O3—ZrO2 erosion resistant material for chamber components in plasma environments
US10892175B2 (en) * 2018-07-26 2021-01-12 Samsung Electronics Co., Ltd. Stable heater rebuild inspection and maintenance platform

Also Published As

Publication number Publication date
TWD214069S (zh) 2021-09-21
USD884855S1 (en) 2020-05-19

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