JP1650295S - semiconductor module - Google Patents
semiconductor moduleInfo
- Publication number
- JP1650295S JP1650295S JP2019000462F JP2019000462F JP1650295S JP 1650295 S JP1650295 S JP 1650295S JP 2019000462 F JP2019000462 F JP 2019000462F JP 2019000462 F JP2019000462 F JP 2019000462F JP 1650295 S JP1650295 S JP 1650295S
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor module
- resin case
- circuit components
- housed
- front side
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000004065 semiconductor Substances 0.000 title abstract 3
- 239000011347 resin Substances 0.000 abstract 2
- 229920005989 resin Polymers 0.000 abstract 2
Abstract
本物品は、パワー半導体素子等の回路構成部品が実装された回路基板等を、全体として直方体形状の樹脂ケース内に格納してなる半導体モジュールである。その樹脂ケースの正面側には、内部の回路構成部品に導通する複数の端子ピンを設けている。This product is a semiconductor module in which a circuit board and the like on which circuit components such as power semiconductor elements are mounted are housed in a rectangular parallelepiped resin case as a whole. On the front side of the resin case, there are provided a plurality of terminal pins electrically connected to internal circuit components.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019000462F JP1650295S (en) | 2019-01-11 | 2019-01-11 | semiconductor module |
| US29/696,618 USD942405S1 (en) | 2019-01-11 | 2019-06-28 | Semiconductor module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019000462F JP1650295S (en) | 2019-01-11 | 2019-01-11 | semiconductor module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP1650295S true JP1650295S (en) | 2020-01-20 |
Family
ID=69166493
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019000462F Active JP1650295S (en) | 2019-01-11 | 2019-01-11 | semiconductor module |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | USD942405S1 (en) |
| JP (1) | JP1650295S (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWD206651S (en) * | 2020-04-24 | 2020-08-21 | 財團法人工業技術研究院 | Power module |
| USD1039243S1 (en) * | 2021-10-08 | 2024-08-20 | Mahdi Al-Husseini | Mortarboard with electronic tube display |
| JP1713167S (en) * | 2021-11-17 | 2022-04-21 | Semiconductor module | |
| USD1078668S1 (en) * | 2023-05-22 | 2025-06-10 | Semikron Danfoss International GmbH | Semiconductor power module for vehicles |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD432096S (en) * | 1999-11-24 | 2000-10-17 | Samsung Electronics Co., Ltd. | Semiconductor module |
| JP1530505S (en) | 2014-11-28 | 2015-08-10 | ||
| USD774479S1 (en) * | 2014-11-28 | 2016-12-20 | Fuji Electric Co., Ltd. | Semiconductor module |
| JP1530503S (en) | 2014-11-28 | 2015-08-10 | ||
| JP1530504S (en) | 2014-11-28 | 2015-08-10 | ||
| USD772184S1 (en) * | 2014-12-24 | 2016-11-22 | Fuji Electric Co., Ltd. | Semiconductor module |
| WO2016203884A1 (en) | 2015-06-17 | 2016-12-22 | 富士電機株式会社 | Power semiconductor module, flow path member, and power-semiconductor-module structure |
| WO2016204257A1 (en) | 2015-06-17 | 2016-12-22 | 富士電機株式会社 | Power semiconductor module, flow path member, and power-semiconductor-module structure |
| JP6485257B2 (en) | 2015-07-01 | 2019-03-20 | 富士電機株式会社 | Semiconductor device and manufacturing method of semiconductor device |
| JP6488940B2 (en) | 2015-08-07 | 2019-03-27 | 富士電機株式会社 | Semiconductor device |
| JP6984127B2 (en) | 2016-12-28 | 2021-12-17 | 富士電機株式会社 | Semiconductor devices and methods for manufacturing semiconductor devices |
| JP1585831S (en) * | 2017-01-05 | 2017-09-11 | ||
| USD864132S1 (en) * | 2017-01-05 | 2019-10-22 | Rohm Co., Ltd. | Power semiconductor module |
| CN109673166B (en) | 2017-02-06 | 2023-01-20 | 富士电机株式会社 | Semiconductor module, electric vehicle, and power control unit |
| JP6549185B2 (en) | 2017-06-16 | 2019-07-24 | 株式会社旭ポリスライダー | injector |
| JP1603980S (en) * | 2017-09-07 | 2018-05-14 | ||
| JP1603793S (en) * | 2017-09-29 | 2018-05-14 | ||
| JP1632173S (en) * | 2018-06-01 | 2019-05-27 | ||
| JP1643134S (en) * | 2019-03-15 | 2019-10-07 | ||
| JP1643024S (en) * | 2019-03-15 | 2019-10-07 | ||
| JP1644633S (en) * | 2019-03-26 | 2019-11-05 |
-
2019
- 2019-01-11 JP JP2019000462F patent/JP1650295S/en active Active
- 2019-06-28 US US29/696,618 patent/USD942405S1/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| USD942405S1 (en) | 2022-02-01 |
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