ITTO991137A0 - CROSS-LINKING MONOMERS FOR PHOTORESIST AND PROCEDURE FOR THE PREPARATION OF PHOTORESIST POLYMERS USING SUCH MONOMERS. - Google Patents
CROSS-LINKING MONOMERS FOR PHOTORESIST AND PROCEDURE FOR THE PREPARATION OF PHOTORESIST POLYMERS USING SUCH MONOMERS.Info
- Publication number
- ITTO991137A0 ITTO991137A0 IT99TO001137A ITTO991137A ITTO991137A0 IT TO991137 A0 ITTO991137 A0 IT TO991137A0 IT 99TO001137 A IT99TO001137 A IT 99TO001137A IT TO991137 A ITTO991137 A IT TO991137A IT TO991137 A0 ITTO991137 A0 IT TO991137A0
- Authority
- IT
- Italy
- Prior art keywords
- photoresist
- monomers
- procedure
- preparation
- cross
- Prior art date
Links
- 239000000178 monomer Substances 0.000 title 2
- 229920002120 photoresistant polymer Polymers 0.000 title 2
- 238000004132 cross linking Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C69/00—Esters of carboxylic acids; Esters of carbonic or haloformic acids
- C07C69/52—Esters of acyclic unsaturated carboxylic acids having the esterified carboxyl group bound to an acyclic carbon atom
- C07C69/533—Monocarboxylic acid esters having only one carbon-to-carbon double bond
- C07C69/54—Acrylic acid esters; Methacrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F22/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides or nitriles thereof
- C08F22/10—Esters
- C08F22/1006—Esters of polyhydric alcohols or polyhydric phenols, e.g. ethylene glycol dimethacrylate
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Materials For Photolithography (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-1998-0063793A KR100362937B1 (en) | 1998-12-31 | 1998-12-31 | Novel photoresist crosslinkers, photoresist polymers and photoresist compositions comprising them |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| ITTO991137A0 true ITTO991137A0 (en) | 1999-12-21 |
| ITTO991137A1 ITTO991137A1 (en) | 2001-06-21 |
| IT1308679B1 IT1308679B1 (en) | 2002-01-09 |
Family
ID=19570347
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IT1999TO001137A IT1308679B1 (en) | 1998-12-31 | 1999-12-21 | RETICULATION MONOMERS FOR PHOTORESIST AND PROCEDURE FOR THE PREPARATION OF PHOTORESIST POLYMERS USING SUCH MONOMERS. |
Country Status (9)
| Country | Link |
|---|---|
| JP (1) | JP4001445B2 (en) |
| KR (1) | KR100362937B1 (en) |
| CN (1) | CN1303114C (en) |
| DE (1) | DE19960506A1 (en) |
| FR (1) | FR2788062B1 (en) |
| GB (1) | GB2345286B (en) |
| IT (1) | IT1308679B1 (en) |
| NL (1) | NL1013916C2 (en) |
| TW (1) | TWI222968B (en) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7208260B2 (en) * | 1998-12-31 | 2007-04-24 | Hynix Semiconductor Inc. | Cross-linking monomers for photoresist, and process for preparing photoresist polymers using the same |
| KR100557608B1 (en) * | 1999-02-10 | 2006-03-10 | 주식회사 하이닉스반도체 | Novel photoresist crosslinking agent and photoresist composition using same |
| KR100557609B1 (en) * | 1999-02-22 | 2006-03-10 | 주식회사 하이닉스반도체 | Novel photoresist crosslinking agent and photoresist composition using same |
| KR100647379B1 (en) | 1999-07-30 | 2006-11-17 | 주식회사 하이닉스반도체 | Novel photoresist monomers, copolymers thereof and photoresist compositions using the same |
| US6818376B2 (en) | 1999-08-23 | 2004-11-16 | Hynix Semiconductor Inc. | Cross-linker monomer comprising double bond and photoresist copolymer containing the same |
| KR100520183B1 (en) | 1999-08-23 | 2005-10-10 | 주식회사 하이닉스반도체 | Photoresist copolymer containing crosslinker which has two double bonds |
| KR100546110B1 (en) * | 2000-01-21 | 2006-01-24 | 주식회사 하이닉스반도체 | Photoresist Crosslinking Agent and Photoresist Composition Containing the Same |
| US6664022B1 (en) * | 2000-08-25 | 2003-12-16 | Shipley Company, L.L.C. | Photoacid generators and photoresists comprising same |
| KR20020082006A (en) * | 2001-04-23 | 2002-10-30 | 금호석유화학 주식회사 | Novel acid-labile polymer and formulation material using an acid-labile polymer |
| US7138218B2 (en) | 2001-12-18 | 2006-11-21 | Hynix Semiconductor Inc. | Process for forming an ultra fine pattern using a bottom anti-reflective coating film containing an acid generator |
| US7338742B2 (en) | 2003-10-08 | 2008-03-04 | Hynix Semiconductor Inc. | Photoresist polymer and photoresist composition containing the same |
| US7270937B2 (en) | 2003-10-17 | 2007-09-18 | Hynix Semiconductor Inc. | Over-coating composition for photoresist and process for forming photoresist pattern using the same |
| KR100680405B1 (en) | 2003-11-19 | 2007-02-08 | 주식회사 하이닉스반도체 | Photoresist composition for EV and photoresist pattern forming method using same |
| JP4979477B2 (en) * | 2004-03-08 | 2012-07-18 | 三菱レイヨン株式会社 | Resist polymer, resist composition, pattern manufacturing method, and resist polymer raw material compound |
| KR101266564B1 (en) * | 2005-08-03 | 2013-05-22 | 제이에스알 가부시끼가이샤 | Positive type radiation sensitive resin composition for production of plated shaped body transfer film and method for producing plated shaped body |
| KR100694412B1 (en) | 2006-02-24 | 2007-03-12 | 주식회사 하이닉스반도체 | Micro pattern formation method of semiconductor device |
| US7745339B2 (en) | 2006-02-24 | 2010-06-29 | Hynix Semiconductor Inc. | Method for forming fine pattern of semiconductor device |
| JP5233985B2 (en) * | 2007-02-26 | 2013-07-10 | Jsr株式会社 | Resin composition for forming fine pattern and method for forming fine pattern |
| EP3356450B1 (en) | 2015-09-28 | 2019-10-23 | 3M Innovative Properties Company | Patterned film article comprising cleavable crosslinker and methods |
| CN116102938B (en) * | 2021-11-09 | 2023-10-20 | 上海新阳半导体材料股份有限公司 | Bottom anti-reflection coating for deep ultraviolet lithography and preparation method and application thereof |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1275471A (en) * | 1969-06-04 | 1972-05-24 | Du Pont | Improvements relating to photo-resists |
| GB1277674A (en) * | 1969-08-04 | 1972-06-14 | Ford Motor Co | Painting of polyolefins |
| JPS5713444A (en) * | 1980-06-27 | 1982-01-23 | Tamura Kaken Kk | Photosensitive composition |
| US4329419A (en) * | 1980-09-03 | 1982-05-11 | E. I. Du Pont De Nemours And Company | Polymeric heat resistant photopolymerizable composition for semiconductors and capacitors |
| AU8662891A (en) * | 1990-10-23 | 1992-05-20 | Atomic Energy Of Canada Limited | Process for the preparation of cellulosic fibre-reinforced thermoplastic composite materials |
| KR100384746B1 (en) * | 1994-09-13 | 2003-08-25 | 제온 코포레이션 | Photosensitive Polyimide Resin Composition |
-
1998
- 1998-12-31 KR KR10-1998-0063793A patent/KR100362937B1/en not_active Expired - Fee Related
-
1999
- 1999-12-10 TW TW088121653A patent/TWI222968B/en not_active IP Right Cessation
- 1999-12-15 DE DE19960506A patent/DE19960506A1/en not_active Withdrawn
- 1999-12-15 GB GB9929650A patent/GB2345286B/en not_active Expired - Fee Related
- 1999-12-21 IT IT1999TO001137A patent/IT1308679B1/en active
- 1999-12-22 JP JP36514699A patent/JP4001445B2/en not_active Expired - Fee Related
- 1999-12-22 NL NL1013916A patent/NL1013916C2/en not_active IP Right Cessation
- 1999-12-24 CN CNB991266870A patent/CN1303114C/en not_active Expired - Lifetime
- 1999-12-29 FR FR9916643A patent/FR2788062B1/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP4001445B2 (en) | 2007-10-31 |
| KR20000047041A (en) | 2000-07-25 |
| CN1258670A (en) | 2000-07-05 |
| GB2345286A (en) | 2000-07-05 |
| GB2345286B (en) | 2004-06-30 |
| IT1308679B1 (en) | 2002-01-09 |
| CN1303114C (en) | 2007-03-07 |
| DE19960506A1 (en) | 2000-09-07 |
| FR2788062A1 (en) | 2000-07-07 |
| NL1013916A1 (en) | 2000-07-03 |
| KR100362937B1 (en) | 2003-10-04 |
| ITTO991137A1 (en) | 2001-06-21 |
| FR2788062B1 (en) | 2004-09-10 |
| NL1013916C2 (en) | 2002-12-03 |
| GB9929650D0 (en) | 2000-02-09 |
| JP2000199951A (en) | 2000-07-18 |
| TWI222968B (en) | 2004-11-01 |
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