[go: up one dir, main page]

IT1160061B - Struttura per il montaggio di chip a circuito integrato e relativo processo di fabbricazione - Google Patents

Struttura per il montaggio di chip a circuito integrato e relativo processo di fabbricazione

Info

Publication number
IT1160061B
IT1160061B IT29674/78A IT2967478A IT1160061B IT 1160061 B IT1160061 B IT 1160061B IT 29674/78 A IT29674/78 A IT 29674/78A IT 2967478 A IT2967478 A IT 2967478A IT 1160061 B IT1160061 B IT 1160061B
Authority
IT
Italy
Prior art keywords
installation
integrated circuit
manufacturing process
circuit chips
related manufacturing
Prior art date
Application number
IT29674/78A
Other languages
English (en)
Other versions
IT7829674A0 (it
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Publication of IT7829674A0 publication Critical patent/IT7829674A0/it
Application granted granted Critical
Publication of IT1160061B publication Critical patent/IT1160061B/it

Links

Classifications

    • H10W74/019—
    • H10P72/74—
    • H10W72/50—
    • H10W90/701—
IT29674/78A 1977-11-18 1978-11-10 Struttura per il montaggio di chip a circuito integrato e relativo processo di fabbricazione IT1160061B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US85277977A 1977-11-18 1977-11-18

Publications (2)

Publication Number Publication Date
IT7829674A0 IT7829674A0 (it) 1978-11-10
IT1160061B true IT1160061B (it) 1987-03-04

Family

ID=25314194

Family Applications (1)

Application Number Title Priority Date Filing Date
IT29674/78A IT1160061B (it) 1977-11-18 1978-11-10 Struttura per il montaggio di chip a circuito integrato e relativo processo di fabbricazione

Country Status (3)

Country Link
EP (1) EP0002166A3 (it)
JP (1) JPS5843909B2 (it)
IT (1) IT1160061B (it)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4551192A (en) * 1983-06-30 1985-11-05 International Business Machines Corporation Electrostatic or vacuum pinchuck formed with microcircuit lithography
US5917707A (en) * 1993-11-16 1999-06-29 Formfactor, Inc. Flexible contact structure with an electrically conductive shell
US5476211A (en) 1993-11-16 1995-12-19 Form Factor, Inc. Method of manufacturing electrical contacts, using a sacrificial member
US5829128A (en) 1993-11-16 1998-11-03 Formfactor, Inc. Method of mounting resilient contact structures to semiconductor devices
US5170245A (en) * 1988-06-15 1992-12-08 International Business Machines Corp. Semiconductor device having metallic interconnects formed by grit blasting
US4896464A (en) * 1988-06-15 1990-01-30 International Business Machines Corporation Formation of metallic interconnects by grit blasting
US5243133A (en) * 1992-02-18 1993-09-07 International Business Machines, Inc. Ceramic chip carrier with lead frame or edge clip
US7200930B2 (en) 1994-11-15 2007-04-10 Formfactor, Inc. Probe for semiconductor devices
US7073254B2 (en) 1993-11-16 2006-07-11 Formfactor, Inc. Method for mounting a plurality of spring contact elements
US7084656B1 (en) 1993-11-16 2006-08-01 Formfactor, Inc. Probe for semiconductor devices
US6835898B2 (en) 1993-11-16 2004-12-28 Formfactor, Inc. Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures
US6336269B1 (en) 1993-11-16 2002-01-08 Benjamin N. Eldridge Method of fabricating an interconnection element
KR100355972B1 (ko) * 1994-11-15 2002-10-12 폼팩터, 인크. 팁 구조물을 제조하는 방법
EP0792519B1 (en) * 1994-11-15 2003-03-26 Formfactor, Inc. Interconnection elements for microelectronic components
EP0792517B1 (en) * 1994-11-15 2003-10-22 Formfactor, Inc. Electrical contact structures from flexible wire
US6727579B1 (en) 1994-11-16 2004-04-27 Formfactor, Inc. Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures
US20100065963A1 (en) 1995-05-26 2010-03-18 Formfactor, Inc. Method of wirebonding that utilizes a gas flow within a capillary from which a wire is played out
JP3058919B2 (ja) * 1995-05-26 2000-07-04 フォームファクター，インコーポレイテッド 犠牲基板を用いた相互接続部及び先端の製造
US8033838B2 (en) 1996-02-21 2011-10-11 Formfactor, Inc. Microelectronic contact structure

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3757271A (en) * 1971-10-04 1973-09-04 Ibm Integrated circuit package
US3959874A (en) * 1974-12-20 1976-06-01 Western Electric Company, Inc. Method of forming an integrated circuit assembly

Also Published As

Publication number Publication date
EP0002166A3 (fr) 1979-08-08
JPS5473566A (en) 1979-06-12
IT7829674A0 (it) 1978-11-10
JPS5843909B2 (ja) 1983-09-29
EP0002166A2 (fr) 1979-05-30

Similar Documents

Publication Publication Date Title
IT1160061B (it) Struttura per il montaggio di chip a circuito integrato e relativo processo di fabbricazione
IT7824893A0 (it) Processo di fabbricazione di dispositivi semiconduttori a circuito integrato.
KR910016234A (ko) 반도체 집적회로
IT1158723B (it) Processo di fabbricazione di dispositivi semiconduttori
IT1110275B (it) Struttura vetro-ceramica per substrati circuitali e relativo processo di fabbricazione
DE69030129D1 (de) Herstellungsverfahren einer integrierten Halbleiterschaltung
KR860004457A (ko) 반도체 집적회로장치 및 그의 제조방법과 제조장치
KR880701461A (ko) 반도체 소자 제조공정
BR8704508A (pt) Processo para fabricacao de circuito integrado
KR860006137A (ko) 반도체 집적회로
JPS5591856A (en) Semiconductor integrated circuit chip structure
KR860002862A (ko) 반도체장치의 제조방법
KR860004469A (ko) 메모리를 내장한 반도체 집적회로 장치
IT1140065B (it) Circuito integrato a semiconduttori
IT1202764B (it) Processo di fabbricazione di circuiti semiconduttori integrati
DE3581754D1 (de) Integrierte halbleiterschaltung fuer taktimpulsverteilung.
KR850007157A (ko) 반도체 집적 회로장치
IT1184402B (it) Dispositivo a circuito integrato a semiconduttori e procedimento per la produzione di esso
DE3851204D1 (de) Herstellungsverfahren einer integrierten Halbleiterschaltungsanordnung.
KR860005437A (ko) 반도체장치의 제조방법
IT1115356B (it) Processo per la fabbricazione di microcircuiti
IT1141374B (it) Circuito integrato a semiconduttori
FR2553542B1 (fr) Circuit integre a semi-conducteurs
BR8707876A (pt) Processo de fabricacao de dispositivos semicondutores
KR860005450A (ko) 반도체 집적 회로장치 및 그의 제조방법