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IN2012DN03251A - - Google Patents

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Publication number
IN2012DN03251A
IN2012DN03251A IN3251DEN2012A IN2012DN03251A IN 2012DN03251 A IN2012DN03251 A IN 2012DN03251A IN 3251DEN2012 A IN3251DEN2012 A IN 3251DEN2012A IN 2012DN03251 A IN2012DN03251 A IN 2012DN03251A
Authority
IN
India
Prior art keywords
substrate
core
terminals
coupled
layers
Prior art date
Application number
Other languages
English (en)
Inventor
Qing Ma
Chuan Hu
Patrick Morrow
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Publication of IN2012DN03251A publication Critical patent/IN2012DN03251A/en

Links

Classifications

    • H10W70/685—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H05K3/4605—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated made from inorganic insulating material
    • H10W20/40—
    • H10W40/22—
    • H10W70/05—
    • H10W70/095—
    • H10W70/635—
    • H10W70/65—
    • H10W70/69—
    • H10W72/20—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/096—Vertically aligned vias, holes or stacked vias
    • H10W70/656—
    • H10W72/07236—
    • H10W72/877—
    • H10W90/724—
    • H10W90/736—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Ceramic Engineering (AREA)
  • Combinations Of Printed Boards (AREA)
  • Materials Engineering (AREA)
  • Geometry (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
IN3251DEN2012 2009-12-17 2010-11-01 IN2012DN03251A (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/653,722 US9420707B2 (en) 2009-12-17 2009-12-17 Substrate for integrated circuit devices including multi-layer glass core and methods of making the same
PCT/US2010/054931 WO2011084216A2 (fr) 2009-12-17 2010-11-01 Substrat pour dispositifs à circuit intégré incluant un noyau de verre multicouche et procédés de réalisation associés

Publications (1)

Publication Number Publication Date
IN2012DN03251A true IN2012DN03251A (fr) 2015-10-23

Family

ID=44149499

Family Applications (1)

Application Number Title Priority Date Filing Date
IN3251DEN2012 IN2012DN03251A (fr) 2009-12-17 2010-11-01

Country Status (9)

Country Link
US (2) US9420707B2 (fr)
JP (2) JP2013512583A (fr)
KR (1) KR101466582B1 (fr)
CN (2) CN102656685B (fr)
DE (1) DE112010004888B4 (fr)
GB (1) GB2488265B (fr)
IN (1) IN2012DN03251A (fr)
TW (1) TWI467717B (fr)
WO (1) WO2011084216A2 (fr)

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GB2488265B (en) 2014-04-30
CN105977234B (zh) 2020-03-06
TW201138033A (en) 2011-11-01
CN102656685A (zh) 2012-09-05
DE112010004888T5 (de) 2012-10-18
JP2013512583A (ja) 2013-04-11
KR101466582B1 (ko) 2014-11-28
US20160322290A1 (en) 2016-11-03
CN102656685B (zh) 2016-08-17
WO2011084216A2 (fr) 2011-07-14
US9761514B2 (en) 2017-09-12
US20110147059A1 (en) 2011-06-23
KR20120095420A (ko) 2012-08-28
JP2015043438A (ja) 2015-03-05
GB201208343D0 (en) 2012-06-27
WO2011084216A3 (fr) 2011-09-09
US9420707B2 (en) 2016-08-16
CN105977234A (zh) 2016-09-28
DE112010004888B4 (de) 2019-02-07
TWI467717B (zh) 2015-01-01
GB2488265A (en) 2012-08-22

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