IL51772A0 - Electroless copper plating - Google Patents

Electroless copper plating

Info

Publication number: IL51772A0
Authority: IL; Israel
Prior art keywords: copper plating; electroless copper; electroless; plating; copper
Prior art date: 1976-04-08

Application number

IL51772A

Other versions

IL51772A (en

Original Assignee

Kollmorgen Tech Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1976-04-08

Filing date

1977-03-29

Publication date

1977-05-31

1977-03-29 Application filed by Kollmorgen Tech Corp filed Critical Kollmorgen Tech Corp

1977-05-31 Publication of IL51772A0 publication Critical patent/IL51772A0/en

1979-09-30 Publication of IL51772A publication Critical patent/IL51772A/en

Classifications

- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
- C23C18/405—Formaldehyde
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1617—Purification and regeneration of coating baths
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents

Landscapes

Chemical & Material Sciences (AREA)
General Chemical & Material Sciences (AREA)
Chemical Kinetics & Catalysis (AREA)
Engineering & Computer Science (AREA)
Materials Engineering (AREA)
Mechanical Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Chemically Coating (AREA)

IL51772A 1976-04-08 1977-03-29 Electroless copper plating IL51772A (en)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
US67476676A	1976-04-08	1976-04-08
US69113176A	1976-05-28	1976-05-28

Publications (2)

Publication Number	Publication Date
IL51772A0 true IL51772A0 (en)	1977-05-31
IL51772A IL51772A (en)	1979-09-30

Family

ID=27101214

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
IL51772A IL51772A (en)	1976-04-08	1977-03-29	Electroless copper plating

Country Status (13)

Country	Link
JP (1)	JPS5932542B2 (en)
AT (1)	AT351884B (en)
AU (1)	AU509685B2 (en)
CA (1)	CA1093911A (en)
CH (1)	CH633585A5 (en)
DE (1)	DE2715850C2 (en)
DK (1)	DK158977A (en)
FR (1)	FR2347453A1 (en)
GB (1)	GB1529151A (en)
IL (1)	IL51772A (en)
IT (1)	IT1115850B (en)
NL (1)	NL7703878A (en)
SE (1)	SE431351B (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS6016517B2 (en) *	1979-12-29	1985-04-25	上村工業株式会社	Electroless plating control method
NL8005024A (en) *	1980-09-05	1982-04-01	Philips Nv	METHOD FOR MANUFACTURING COPPER ALLOY LAYERS AND PATTERNS ON SUBSTRATES AND PRODUCTS MADE THEREFORE
JPS599159A (en) *	1982-07-07	1984-01-18	Kanto Kasei Kogyo Kk	Method and apparatus for adjusting concentration of electroless plating bath
JPS5993863A (en) *	1982-11-17	1984-05-30	Hitachi Chem Co Ltd	Method for supplying copper ion to electroless copper plating solution
GB2134931A (en) *	1982-12-27	1984-08-22	Ibiden Co Ltd	Non-electrolytic copper plating for printed circuit board
JPS6116950U (en) *	1984-07-05	1986-01-31	河西工業株式会社	Automotive insulator dash
JPS6118538A (en) *	1984-07-05	1986-01-27	Kasai Kogyo Co Ltd	Insulator dash for car
US4668532A (en) *	1984-09-04	1987-05-26	Kollmorgen Technologies Corporation	System for selective metallization of electronic interconnection boards
US4770788A (en) *	1985-04-25	1988-09-13	Kollmorgen Technologies Corp.	Process for removing metal complexes from waste solutions

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US2955944A (en) *	1953-07-03	1960-10-11	Gen Motors Corp	Electroless nickel plating bath control
US3046159A (en) *	1957-12-17	1962-07-24	Hughes Aircraft Co	Method of copper plating by chemical reduction
US3403035A (en) *	1964-06-24	1968-09-24	Process Res Company	Process for stabilizing autocatalytic metal plating solutions

1977
- 1977-02-21 CA CA272,215A patent/CA1093911A/en not_active Expired
- 1977-03-22 JP JP52032788A patent/JPS5932542B2/en not_active Expired
- 1977-03-24 AU AU23573/77A patent/AU509685B2/en not_active Expired
- 1977-03-29 IL IL51772A patent/IL51772A/en unknown
- 1977-04-05 GB GB14464/77A patent/GB1529151A/en not_active Expired
- 1977-04-05 SE SE7703989A patent/SE431351B/en not_active IP Right Cessation
- 1977-04-06 DE DE2715850A patent/DE2715850C2/en not_active Expired
- 1977-04-06 IT IT48842/77A patent/IT1115850B/en active
- 1977-04-06 DK DK158977A patent/DK158977A/en not_active IP Right Cessation
- 1977-04-07 AT AT245477A patent/AT351884B/en not_active IP Right Cessation
- 1977-04-07 NL NL7703878A patent/NL7703878A/en not_active Application Discontinuation
- 1977-04-07 FR FR7710553A patent/FR2347453A1/en active Granted
- 1977-04-07 CH CH444377A patent/CH633585A5/en not_active IP Right Cessation

Also Published As

Publication number	Publication date
IT1115850B (en)	1986-02-10
DK158977A (en)	1977-10-09
FR2347453A1 (en)	1977-11-04
CH633585A5 (en)	1982-12-15
FR2347453B1 (en)	1981-01-09
AU2357377A (en)	1978-09-28
GB1529151A (en)	1978-10-18
ATA245477A (en)	1979-01-15
IL51772A (en)	1979-09-30
JPS52123335A (en)	1977-10-17
NL7703878A (en)	1977-10-11
DE2715850A1 (en)	1977-10-13
AT351884B (en)	1979-08-27
SE7703989L (en)	1977-10-09
JPS5932542B2 (en)	1984-08-09
DE2715850C2 (en)	1982-12-02
CA1093911A (en)	1981-01-20
SE431351B (en)	1984-01-30
AU509685B2 (en)	1980-05-22

Publication	Publication Date	Title
DE2964079D1 (en)	1982-12-30	An electroless copper plating process
AU2225477A (en)	1978-08-24	Acid copper plating baths
JPS52141428A (en)	1977-11-25	Electroless nickel plating
DE3066952D1 (en)	1984-04-19	Electroless copper plating solution
AU512805B2 (en)	1980-10-30	Control ofan electroless copper plating bath
IL51772A0 (en)	1977-05-31	Electroless copper plating
JPS5370931A (en)	1978-06-23	Nonnelectrolytic copper plating method
GB1547028A (en)	1979-06-06	Electroless gold plating baths
AU501210B2 (en)	1979-06-14	Electroless copper plating bath
JPS5448646A (en)	1979-04-17	Copper electroplating
GB1555709A (en)	1979-11-14	Electroless nickel plating
AU506628B2 (en)	1980-01-17	Electroless plating
JPS5217334A (en)	1977-02-09	Electroless copper plating solution
JPS52106331A (en)	1977-09-06	Plating bath
JPS51135836A (en)	1976-11-25	Electroless copper plating solusion
HK4981A (en)	1981-02-27	Electroless copper plating solutions
ZA77431B (en)	1977-12-28	Electroless copper plating
JPS52142774A (en)	1977-11-28	Plating
JPS5285935A (en)	1977-07-16	Peeling solution for copper plating
JPS52152831A (en)	1977-12-19	Substitution copper plating solution
JPS53142328A (en)	1978-12-12	Solution for nonnelectrolytic copper plating
JPS5288227A (en)	1977-07-23	Chemical copper plating solution
JPS5221226A (en)	1977-02-17	Nonnelectric copper plating solution
JPS5277833A (en)	1977-06-30	Nonnelectrolytic copper plating solution
AU509072B2 (en)	1980-04-17	Electroless copper plating solution