DK158977A - POWER DEPOSIT PROCEDURE PROCEDURE - Google Patents

POWER DEPOSIT PROCEDURE PROCEDURE

Info

Publication number: DK158977A
Authority: DK; Denmark
Prior art keywords: procedure; power deposit; power; deposit; deposit procedure
Prior art date: 1976-04-08

Application number

DK158977A

Other languages

Danish (da)

Inventor

G A Butter

Cormack J F Mc

J D Williamson

R J Zeblisky

Original Assignee

Kollmorgen Tech Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1976-04-08

Filing date

1977-04-06

Publication date

1977-10-09

1977-04-06 Application filed by Kollmorgen Tech Corp filed Critical Kollmorgen Tech Corp

1977-10-09 Publication of DK158977A publication Critical patent/DK158977A/en

Classifications

- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
- C23C18/405—Formaldehyde
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1617—Purification and regeneration of coating baths
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents

Landscapes

Chemical & Material Sciences (AREA)
General Chemical & Material Sciences (AREA)
Chemical Kinetics & Catalysis (AREA)
Engineering & Computer Science (AREA)
Materials Engineering (AREA)
Mechanical Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Chemically Coating (AREA)

DK158977A 1976-04-08 1977-04-06 POWER DEPOSIT PROCEDURE PROCEDURE DK158977A (en)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
US67476676A	1976-04-08	1976-04-08
US69113176A	1976-05-28	1976-05-28

Publications (1)

Publication Number	Publication Date
DK158977A true DK158977A (en)	1977-10-09

Family

ID=27101214

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
DK158977A DK158977A (en)	1976-04-08	1977-04-06	POWER DEPOSIT PROCEDURE PROCEDURE

Country Status (13)

Country	Link
JP (1)	JPS5932542B2 (en)
AT (1)	AT351884B (en)
AU (1)	AU509685B2 (en)
CA (1)	CA1093911A (en)
CH (1)	CH633585A5 (en)
DE (1)	DE2715850C2 (en)
DK (1)	DK158977A (en)
FR (1)	FR2347453A1 (en)
GB (1)	GB1529151A (en)
IL (1)	IL51772A (en)
IT (1)	IT1115850B (en)
NL (1)	NL7703878A (en)
SE (1)	SE431351B (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS6016517B2 (en) *	1979-12-29	1985-04-25	上村工業株式会社	Electroless plating control method
NL8005024A (en) *	1980-09-05	1982-04-01	Philips Nv	METHOD FOR MANUFACTURING COPPER ALLOY LAYERS AND PATTERNS ON SUBSTRATES AND PRODUCTS MADE THEREFORE
JPS599159A (en) *	1982-07-07	1984-01-18	Kanto Kasei Kogyo Kk	Method and apparatus for adjusting concentration of electroless plating bath
JPS5993863A (en) *	1982-11-17	1984-05-30	Hitachi Chem Co Ltd	Method for supplying copper ion to electroless copper plating solution
GB2134931A (en) *	1982-12-27	1984-08-22	Ibiden Co Ltd	Non-electrolytic copper plating for printed circuit board
JPS6116950U (en) *	1984-07-05	1986-01-31	河西工業株式会社	Automotive insulator dash
JPS6118538A (en) *	1984-07-05	1986-01-27	Kasai Kogyo Co Ltd	Insulator dash for car
US4668532A (en) *	1984-09-04	1987-05-26	Kollmorgen Technologies Corporation	System for selective metallization of electronic interconnection boards
US4770788A (en) *	1985-04-25	1988-09-13	Kollmorgen Technologies Corp.	Process for removing metal complexes from waste solutions

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US2955944A (en) *	1953-07-03	1960-10-11	Gen Motors Corp	Electroless nickel plating bath control
US3046159A (en) *	1957-12-17	1962-07-24	Hughes Aircraft Co	Method of copper plating by chemical reduction
US3403035A (en) *	1964-06-24	1968-09-24	Process Res Company	Process for stabilizing autocatalytic metal plating solutions

1977
- 1977-02-21 CA CA272,215A patent/CA1093911A/en not_active Expired
- 1977-03-22 JP JP52032788A patent/JPS5932542B2/en not_active Expired
- 1977-03-24 AU AU23573/77A patent/AU509685B2/en not_active Expired
- 1977-03-29 IL IL51772A patent/IL51772A/en unknown
- 1977-04-05 GB GB14464/77A patent/GB1529151A/en not_active Expired
- 1977-04-05 SE SE7703989A patent/SE431351B/en not_active IP Right Cessation
- 1977-04-06 DE DE2715850A patent/DE2715850C2/en not_active Expired
- 1977-04-06 IT IT48842/77A patent/IT1115850B/en active
- 1977-04-06 DK DK158977A patent/DK158977A/en not_active IP Right Cessation
- 1977-04-07 AT AT245477A patent/AT351884B/en not_active IP Right Cessation
- 1977-04-07 NL NL7703878A patent/NL7703878A/en not_active Application Discontinuation
- 1977-04-07 FR FR7710553A patent/FR2347453A1/en active Granted
- 1977-04-07 CH CH444377A patent/CH633585A5/en not_active IP Right Cessation

Also Published As

Publication number	Publication date
IT1115850B (en)	1986-02-10
FR2347453A1 (en)	1977-11-04
CH633585A5 (en)	1982-12-15
FR2347453B1 (en)	1981-01-09
AU2357377A (en)	1978-09-28
GB1529151A (en)	1978-10-18
ATA245477A (en)	1979-01-15
IL51772A (en)	1979-09-30
JPS52123335A (en)	1977-10-17
NL7703878A (en)	1977-10-11
DE2715850A1 (en)	1977-10-13
AT351884B (en)	1979-08-27
SE7703989L (en)	1977-10-09
JPS5932542B2 (en)	1984-08-09
DE2715850C2 (en)	1982-12-02
CA1093911A (en)	1981-01-20
IL51772A0 (en)	1977-05-31
SE431351B (en)	1984-01-30
AU509685B2 (en)	1980-05-22

Publication	Publication Date	Title
BR7907110A (en)	1980-07-08	METALLIC CORDONEL
BR7902161A (en)	1979-12-04	CASE
SE7904964L (en)	1979-12-09	THICKNESS
PT68996A (en)	1979-01-01	ENERGY CAPTURER
IT1119577B (en)	1986-03-10	ELECTRIC TASFORMER
IT1121999B (en)	1986-04-23	HYDROGEN
FI64222B (en)	1983-06-30	ELECTRIC HOPVIKBAR MELLANVAEGG
FI782721A7 (en)	1979-03-07	STORAGE PROCEDURE
FI780386A7 (en)	1978-08-12	BATTERY
DK158977A (en)	1977-10-09	POWER DEPOSIT PROCEDURE PROCEDURE
IT1085110B (en)	1985-05-28	GENERATOR SET
FI792099A7 (en)	1980-01-04	PLASTISOLERING FOER STROEMFOERANDE PARALLEL SKENOR
ATA899178A (en)	1980-01-15	FLAT KEY
AT358500B (en)	1980-09-10	OVEN
TR20427A (en)	1981-07-02	ELECTRIC SUEPUERGES
SE7809811L (en)	1979-05-10	IRON-SILVER BATTERIES
FI790547A7 (en)	1979-08-22	ELEKTRODER FOER ELEKTRODEPOSITION OCH PRODUKTION AV NICKEL DAERPAO
IT1108457B (en)	1985-12-09	POWER STEERING GROUP
DK419777A (en)	1978-03-24	DECANING PROCEDURE
SE7810959L (en)	1979-10-24	ELECTROLYTE
AT359389B (en)	1980-11-10	FLAT KEY
NO151305C (en)	1985-03-13	DEVICES
SE7801936L (en)	1979-07-18	PLANNY KEY
KR830000040U (en)	1983-03-25	Power key holder
ATA443778A (en)	1980-04-15	REVOLVER

Legal Events

Date	Code	Title	Description
1985-12-09	AHS	Application shelved for other reasons than non-payment
1995-02-27	PBP	Patent lapsed