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HK127394A - Integrated thermal ink jet printhead and method of manufacturing - Google Patents

Integrated thermal ink jet printhead and method of manufacturing Download PDF

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Publication number
HK127394A
HK127394A HK127394A HK127394A HK127394A HK 127394 A HK127394 A HK 127394A HK 127394 A HK127394 A HK 127394A HK 127394 A HK127394 A HK 127394A HK 127394 A HK127394 A HK 127394A
Authority
HK
Hong Kong
Prior art keywords
ink
orifice plate
openings
resistors
heater resistors
Prior art date
Application number
HK127394A
Other languages
English (en)
French (fr)
Inventor
V. Bhaskar Eldurkar
A. Leban Marzio
Original Assignee
Hewlett-Packard Company
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett-Packard Company filed Critical Hewlett-Packard Company
Publication of HK127394A publication Critical patent/HK127394A/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1643—Manufacturing processes thin film formation thin film formation by plating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1601—Production of bubble jet print heads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/162—Manufacturing of the nozzle plates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1623—Manufacturing processes bonding and adhesion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1625—Manufacturing processes electroforming
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1631—Manufacturing processes photolithography
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1642—Manufacturing processes thin film formation thin film formation by CVD [chemical vapor deposition]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1646—Manufacturing processes thin film formation thin film formation by sputtering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2002/1437—Back shooter
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
    • H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
    • H01S5/223—Buried stripe structure
    • H01S5/2232—Buried stripe structure with inner confining structure between the active layer and the lower electrode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
    • H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
    • H01S5/227—Buried mesa structure ; Striped active layer
    • H01S5/2272—Buried mesa structure ; Striped active layer grown by a mask induced selective growth
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/30—Structure or shape of the active region; Materials used for the active region
    • H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
    • H01S5/323—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
    • H01S5/32308—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/30—Structure or shape of the active region; Materials used for the active region
    • H01S5/34—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers
    • H01S5/3428—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers layer orientation perpendicular to the substrate

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)

Claims (13)

  1. Sich selbst abstimmendes Verfahren zum Herstellen eines thermischen Tintenstrahldruckkopfes, umfassend die Schritte:
    a. Bereitstellen eines wiederverwendbaren Substrates (10);
    b. Bilden einer Düsenplatte (18) auf dem Substrat;
    c. Bilden einer ersten Sperrschicht (20) auf der Düsenplatte;
    d. Bilden von Heizwiderständen (22) auf der ersten Sperrschicht in einer vorbestimmten Konfiguration und in vorbestimmtem Abstand relativ zu den Öffnungen (16) in der Düsenplatte;
    e. Bilden von Leitern (24, 26, 28), welche mit den Widerständen (22) verbunden sind, um einen Stromfluß durch diese zu ermöglichen;
    f. Bilden einer Zweiten Sperrschicht (30) auf der ersten Sperrschicht (20) über die Heizwiderstände (22) zum Schützen der Heizwiderstände gegen Tintenkorrosion und Gravitations-Verschleiß;
    g. Bilden einer Tintenreservoire eingrenzenden Schicht (38) auf der zweiten Sperrschicht (30) mit mehreren Tintenreservoiröffnungen (40, 42), die auf Öffnungen (16) in der Düsenplatte (18) ausgerichtet sind;
    h. Schaffen von Durchlässen (44, 46) durch die erste und die zweite Sperrschicht (20, 30), die sich von den Reservoiren (40, 42) zu Öffnungen (16) in der Düsenplatte (18) erstrecken, wodurch die Tintenreservoirschicht (38) an einer Tintenspeisekammer (48) zum Speisen von Tinte zu den Tintenreservoiren gesichert wird; und
    i. Entfernen des wiederverwendbaren Substrats (10) von der Düsenplatte.
  2. Verfahren nach Anspruch 1, umfassend das Befestigen einer Tintenspeisekammer (48) zu der tintenreservoirbildenden Schicht (38) zum Führen von Tinte zu jedem der Reservoire aus einer gemeinsamen Quelle für Tinte.
  3. Verfahren nach einem der Ansprüche 1 oder 2, welches das Bilden von Heizwiderständen (22) einstückig mit den Leitern (24, 26, 28) auf der Oberfläche auf der ersten Sperrschicht (20) und das Kontrollieren des Widerstand-/Leiterwiderstandes durch Kontrollieren der Querschnittsfläche des Widerstand-/Leitermaterials umfaßt.
  4. Verfahren zum Herstellen eines Tintenstrahlschreibers, umfassend:
    a. Bilden einer Düsenplatte (18) auf einem wiederverwendbaren Substrat (10);
    b. Bilden einer Dünnschicht-Transducer-Struktur auf der Düsenplatte (18) einschließlich von Leitern (24, 26, 28), die in Heizwiderstände (22) in vorbestimmten Abstand relativ zu Öffnungen (16) in der Düsenplatte (18) führen;
    c. Bilden von tintenreservoirbegrenzenden Wänden (38) benachbart den Transducern (22);
    d. Entfernen des Substrats (10);
    e. Anbonden der Wände an einen Tintenspeisebehälter (48); und
    f. elektrisches Verbinden der Leiter mit dazu fluchtenden Leitern an dem Behälter zum Stromversorgen der Transducer.
  5. Verfahren nach Anspruch 4, bei dem die tintenreservoirbildenden Wände (38) in einem Muster auf der Dünnschicht-Transducer-Struktur elektrogeformt und anschließend an dem Tintenspeisebehälter (48) angebondet werden.
  6. Verfahren nach Anspruch 5, bei dem Düsenöffnungen (16) in der Dünnfilm-Transducer-Struktur durch selektives Elektroformen auf der Oberseite des wiederverwendbaren Subtrates (10) geformt werden.
  7. Verfahren nach Anspruch 4, bei dem die Transducer durch Ablagern mehrerer Widerstände (22) in teilweise einkreisender Geometrie, umgebend eine entsprechende Anzahl von Düsen (16) in der Dünnfilm-Transducer-Struktur, ausgebildet und einteilig mit mehreren Leitern (24, 26, 28) verbunden werden.
  8. Verfahren nach Anspruch 7, bei dem die Wände so elektrogeformt werden, daß sie die Widerstände (22) teilweise umgeben und einen Tintenfluß dorthin zulassen.
  9. Integrierter thermischer Tintenstrahldruckkopf umfassend:
    a. eine Düsenplatte (18) mit mehreren Öffnungen (16) darin;
    b. eine Dünnschicht-Struktur, welche auf der Düsenplatte (18) ausgebildet ist und umfaßt:
    c. eine erste Sperrschicht (20), die auf der Düsenplatte ausgebildet ist;
    d. mehrere Heizwiderstände (22), die in vorbestimmter Anordnung auf der ersten Sperrschicht (20) gruppiert und benachbart den Öffnungen (16) in der Düsenplatte angeordnet sind;
    e. Leiter (24, 26, 28), welche mit den Widerständen (22) für deren Stromdurchfluß verbunden sind;
    f. eine zweite Sperrschicht (30), welche auf der ersten Sperrschicht (20) angeordnet ist und die Heizwiderstände (22) abdeckt und diese vor Tintenkorrosion und Gravitationsverschleiß schützt; und
    g. eine tintenreservoirbildende Schicht (38), welche auf der zweiten Sperrschicht (30) angeordnet ist und mehrere Tintenreservoire (40, 42) darin eingrenzt, welche auf die Öffnungen (16) in der Düsenplatte ausgerichtet sind;
    h. wobei die erste und die zweite Sperrschicht (20, 30) Durchlässe (44, 46) bei jeder Öffnung in der Düsenplatte haben, um einen Tintenstrompfad aus den Reservoiren (40, 42) in der reservoirbildenden Schicht und durch die Öffnungen (16) in der Düsenplatte zu schaffen, wobei die tintenreservoirbildende Schicht (38) an einer Tintenspeisekammer (48) oder einem Gehäuse zum Speisen von Tinte gesichert ist, um Tinte zu den Reservoiren (40, 42) und durch die Öffnungen (16) in der Düsenplatte (18) während eines Tintenstrahldruckvorganges zu speisen.
  10. Struktur nach Anspruch 9, umfassend eine Tintenspeisekammer (48), die an der tintenreservoirbildenden Schicht (38) befestigt ist, um Tinte aus einer gemeinsamen Quelle eines Tintenvorrats zu jedem der Reservoire (40, 42) zu speisen.
  11. Struktur nach Anspruch 9 oder 10, bei der die Heizwiderstände (22) einstückig mit den Leitern (24, 26, 28) geformt sind, wobei deren Widerstand über deren Herstellquerschnittsflächen gesteuert ist.
  12. Tintenstrahlschreiber, der in Kombination aufweist:
    a. eine Düsenplatte (18) mit mehreren Öffnungen (16) darin;
    b. eine Dünnschicht-Transducer-Struktur, welche auf der Düsenplatte (18) ausgebildet ist und Leiter (24, 26, 28) darin enthält, welche zu Heizwiderständen (22) führen, welche ihrerseits die Öffnungen (16) teilweise umgeben;
    c. Ringwände (38) benachbart der Widerstände, welche Tintenreservoire (40, 42) bilden, wobei die Wände (38) mit Tintenstromöffnungen elektrogeformt sind, um Tinte zu den Widerständen (22) zu leiten;
    d. einen Tintenbehälter (48), der an die Ringwände (38) angebondet ist; und
    e. Mittel (50, 52) an dem Behälter zum Schaffen einer externen elektrischen Verbindung zu den Leitern auf der Dünnschicht-Transducer-Struktur.
  13. Schreiber nach Anspruch 12, bei den die Heizwiderstände (22) einteilig mit den Leitern (24, 26, 28) verbunden sind.
HK127394A 1987-12-17 1994-11-17 Integrated thermal ink jet printhead and method of manufacturing HK127394A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/134,135 US4847630A (en) 1987-12-17 1987-12-17 Integrated thermal ink jet printhead and method of manufacture

Publications (1)

Publication Number Publication Date
HK127394A true HK127394A (en) 1994-11-25

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Application Number Title Priority Date Filing Date
HK127394A HK127394A (en) 1987-12-17 1994-11-17 Integrated thermal ink jet printhead and method of manufacturing

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Country Link
US (1) US4847630A (de)
EP (1) EP0321075B1 (de)
JP (1) JP2716174B2 (de)
KR (1) KR910007328B1 (de)
CA (1) CA1302160C (de)
DE (1) DE3889087T2 (de)
HK (1) HK127394A (de)

Families Citing this family (101)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5210549A (en) * 1988-06-17 1993-05-11 Canon Kabushiki Kaisha Ink jet recording head having resistor formed by oxidization
US5858197A (en) * 1988-06-17 1999-01-12 Canon Kabushiki Kaisha Process for manufacturing substrate for ink jet recording head using anodic oxidation
US5400063A (en) * 1988-12-14 1995-03-21 Mannesmann Aktiengesellschaft Method for optimizing a conductor-path layout for a print head of an ink printing device, and a conductor-path layout for such a print head
US4999650A (en) * 1989-12-18 1991-03-12 Eastman Kodak Company Bubble jet print head having improved multiplex actuation construction
US5016024A (en) * 1990-01-09 1991-05-14 Hewlett-Packard Company Integral ink jet print head
JPH0733091B2 (ja) * 1990-03-15 1995-04-12 日本電気株式会社 インクジェット記録方法及びそれを用いたインクジェットヘッド
US5760804A (en) * 1990-05-21 1998-06-02 Eastman Kodak Company Ink-jet printing head for a liquid-jet printing device operating on the heat converter principle and process for making it
US5291226A (en) * 1990-08-16 1994-03-01 Hewlett-Packard Company Nozzle member including ink flow channels
DE69111936T2 (de) * 1990-08-16 1996-04-11 Hewlett Packard Co Photo-ablatierte Bauteile für Farbstrahldruckkopf.
US5305015A (en) * 1990-08-16 1994-04-19 Hewlett-Packard Company Laser ablated nozzle member for inkjet printhead
US5469199A (en) * 1990-08-16 1995-11-21 Hewlett-Packard Company Wide inkjet printhead
US5442384A (en) * 1990-08-16 1995-08-15 Hewlett-Packard Company Integrated nozzle member and tab circuit for inkjet printhead
US5229785A (en) * 1990-11-08 1993-07-20 Hewlett-Packard Company Method of manufacture of a thermal inkjet thin film printhead having a plastic orifice plate
AU657930B2 (en) * 1991-01-30 1995-03-30 Canon Kabushiki Kaisha Nozzle structures for bubblejet print devices
US5815173A (en) * 1991-01-30 1998-09-29 Canon Kabushiki Kaisha Nozzle structures for bubblejet print devices
US6019457A (en) * 1991-01-30 2000-02-01 Canon Information Systems Research Australia Pty Ltd. Ink jet print device and print head or print apparatus using the same
EP0498291B1 (de) * 1991-01-30 1996-04-10 Canon Information Systems Research Australia Pty Ltd. Düsenstrukturen für Tintenstrahldrucker
AU657931B2 (en) * 1991-01-30 1995-03-30 Canon Kabushiki Kaisha An integrally formed bubblejet print device
DE69214853T2 (de) * 1991-01-30 1997-05-28 Canon Information Syst Res Strahldrucker mit Bläschen für Bildaufzeichnungsvorrichtung
US5450113A (en) * 1992-04-02 1995-09-12 Hewlett-Packard Company Inkjet printhead with improved seal arrangement
US5594481A (en) * 1992-04-02 1997-01-14 Hewlett-Packard Company Ink channel structure for inkjet printhead
US5648806A (en) * 1992-04-02 1997-07-15 Hewlett-Packard Company Stable substrate structure for a wide swath nozzle array in a high resolution inkjet printer
US5638101A (en) * 1992-04-02 1997-06-10 Hewlett-Packard Company High density nozzle array for inkjet printhead
US5297331A (en) * 1992-04-03 1994-03-29 Hewlett-Packard Company Method for aligning a substrate with respect to orifices in an inkjet printhead
US5568171A (en) * 1992-04-02 1996-10-22 Hewlett-Packard Company Compact inkjet substrate with a minimal number of circuit interconnects located at the end thereof
US5648805A (en) * 1992-04-02 1997-07-15 Hewlett-Packard Company Inkjet printhead architecture for high speed and high resolution printing
US5300959A (en) * 1992-04-02 1994-04-05 Hewlett-Packard Company Efficient conductor routing for inkjet printhead
US5563642A (en) * 1992-04-02 1996-10-08 Hewlett-Packard Company Inkjet printhead architecture for high speed ink firing chamber refill
US5604519A (en) * 1992-04-02 1997-02-18 Hewlett-Packard Company Inkjet printhead architecture for high frequency operation
US5278584A (en) * 1992-04-02 1994-01-11 Hewlett-Packard Company Ink delivery system for an inkjet printhead
US5420627A (en) * 1992-04-02 1995-05-30 Hewlett-Packard Company Inkjet printhead
DE4214555C2 (de) * 1992-04-28 1996-04-25 Eastman Kodak Co Elektrothermischer Tintendruckkopf
US5598189A (en) * 1993-09-07 1997-01-28 Hewlett-Packard Company Bipolar integrated ink jet printhead driver
US5565900A (en) * 1994-02-04 1996-10-15 Hewlett-Packard Company Unit print head assembly for ink-jet printing
US6305786B1 (en) 1994-02-23 2001-10-23 Hewlett-Packard Company Unit print head assembly for an ink-jet printer
US5534901A (en) * 1994-06-06 1996-07-09 Xerox Corporation Ink jet printhead having a flat surface heater plate
US6003986A (en) * 1994-10-06 1999-12-21 Hewlett-Packard Co. Bubble tolerant manifold design for inkjet cartridge
US5852460A (en) * 1995-03-06 1998-12-22 Hewlett-Packard Company Inkjet print cartridge design to decrease deformation of the printhead when adhesively sealing the printhead to the print cartridge
US5736998A (en) * 1995-03-06 1998-04-07 Hewlett-Packard Company Inkjet cartridge design for facilitating the adhesive sealing of a printhead to an ink reservoir
US5905517A (en) * 1995-04-12 1999-05-18 Eastman Kodak Company Heater structure and fabrication process for monolithic print heads
JPH10502030A (ja) * 1995-04-12 1998-02-24 イーストマン コダック カンパニー モノリシック印刷ヘッド及びその製造工程
AUPN234695A0 (en) * 1995-04-12 1995-05-04 Eastman Kodak Company Heater structure for monolithic lift print heads
EP0772525A1 (de) * 1995-04-12 1997-05-14 Eastman Kodak Company Verfahren zum bauen und herstellen von thermisch aktivierten druckköpfen
US6183064B1 (en) 1995-08-28 2001-02-06 Lexmark International, Inc. Method for singulating and attaching nozzle plates to printheads
US6120131A (en) * 1995-08-28 2000-09-19 Lexmark International, Inc. Method of forming an inkjet printhead nozzle structure
US5909231A (en) * 1995-10-30 1999-06-01 Hewlett-Packard Co. Gas flush to eliminate residual bubbles
US5718044A (en) * 1995-11-28 1998-02-17 Hewlett-Packard Company Assembly of printing devices using thermo-compressive welding
US6758552B1 (en) 1995-12-06 2004-07-06 Hewlett-Packard Development Company Integrated thin-film drive head for thermal ink-jet printer
US5883650A (en) * 1995-12-06 1999-03-16 Hewlett-Packard Company Thin-film printhead device for an ink-jet printer
US6239820B1 (en) 1995-12-06 2001-05-29 Hewlett-Packard Company Thin-film printhead device for an ink-jet printer
US6310639B1 (en) 1996-02-07 2001-10-30 Hewlett-Packard Co. Printer printhead
US6000787A (en) * 1996-02-07 1999-12-14 Hewlett-Packard Company Solid state ink jet print head
US6113221A (en) * 1996-02-07 2000-09-05 Hewlett-Packard Company Method and apparatus for ink chamber evacuation
US6003977A (en) * 1996-02-07 1999-12-21 Hewlett-Packard Company Bubble valving for ink-jet printheads
US5901425A (en) 1996-08-27 1999-05-11 Topaz Technologies Inc. Inkjet print head apparatus
JPH11129483A (ja) 1997-07-03 1999-05-18 Canon Inc 液体吐出ヘッド用オリフィスプレートの製造方法、オリフィスプレート、該オリフィスプレートを有する液体吐出ヘッド及び液体吐出ヘッドの製造方法
US5966154A (en) * 1997-10-17 1999-10-12 Eastman Kodak Company Graphic arts printing plate production by a continuous jet drop printing with asymmetric heating drop deflection
US6322201B1 (en) 1997-10-22 2001-11-27 Hewlett-Packard Company Printhead with a fluid channel therethrough
US6303274B1 (en) 1998-03-02 2001-10-16 Hewlett-Packard Company Ink chamber and orifice shape variations in an ink-jet orifice plate
EP1057638B1 (de) * 1999-06-04 2007-01-31 Canon Kabushiki Kaisha Flüssigkeitsausstosskopf und Flüssigkeitsausstossvorrichtung
US6132032A (en) * 1999-08-13 2000-10-17 Hewlett-Packard Company Thin-film print head for thermal ink-jet printers
US6986566B2 (en) 1999-12-22 2006-01-17 Eastman Kodak Company Liquid emission device
US6482574B1 (en) * 2000-04-20 2002-11-19 Hewlett-Packard Co. Droplet plate architecture in ink-jet printheads
KR100374788B1 (ko) 2000-04-26 2003-03-04 삼성전자주식회사 버블 젯 방식의 잉크 젯 프린트 헤드, 그 제조방법 및잉크 토출방법
EP1172212B1 (de) 2000-07-11 2007-02-28 Samsung Electronics Co., Ltd. Tintenstrahldruckkopf des mit Bläschen angetrieben Typs
KR100397604B1 (ko) 2000-07-18 2003-09-13 삼성전자주식회사 버블 젯 방식의 잉크 젯 프린트 헤드 및 그 제조방법
KR100413677B1 (ko) * 2000-07-24 2003-12-31 삼성전자주식회사 버블 젯 방식의 잉크 젯 프린트 헤드
KR20020009281A (ko) * 2000-07-25 2002-02-01 윤종용 잉크젯 프린터 헤드
KR100406939B1 (ko) 2000-07-25 2003-11-21 삼성전자주식회사 잉크젯 프린터 헤드
US6409318B1 (en) 2000-11-30 2002-06-25 Hewlett-Packard Company Firing chamber configuration in fluid ejection devices
US6675476B2 (en) * 2000-12-05 2004-01-13 Hewlett-Packard Development Company, L.P. Slotted substrates and techniques for forming same
JP3851812B2 (ja) * 2000-12-15 2006-11-29 三星電子株式会社 インクジェットプリントヘッド及びその製造方法
KR100506082B1 (ko) 2000-12-18 2005-08-04 삼성전자주식회사 반구형 잉크 챔버를 가진 잉크 젯 프린트 헤드의 제조 방법
KR100668294B1 (ko) 2001-01-08 2007-01-12 삼성전자주식회사 반구형 잉크 챔버를 가진 잉크 젯 프린트 헤드 및 그제조방법
US6471340B2 (en) * 2001-02-12 2002-10-29 Hewlett-Packard Company Inkjet printhead assembly
KR100552660B1 (ko) 2001-08-09 2006-02-20 삼성전자주식회사 버블 젯 방식의 잉크 젯 프린트 헤드
KR100429844B1 (ko) 2001-10-25 2004-05-03 삼성전자주식회사 일체형 잉크 젯 프린트헤드 및 그 제조방법
KR100552662B1 (ko) 2001-10-29 2006-02-20 삼성전자주식회사 다중 배열 구조를 가진 고밀도 잉크 젯 프린트 헤드
US7125731B2 (en) * 2001-10-31 2006-10-24 Hewlett-Packard Development Company, L.P. Drop generator for ultra-small droplets
US6627467B2 (en) 2001-10-31 2003-09-30 Hewlett-Packard Development Company, Lp. Fluid ejection device fabrication
KR100438709B1 (ko) 2001-12-18 2004-07-05 삼성전자주식회사 잉크 젯 프린트 헤드
US6747684B2 (en) 2002-04-10 2004-06-08 Hewlett-Packard Development Company, L.P. Laser triggered inkjet firing
US6871942B2 (en) * 2002-04-15 2005-03-29 Timothy R. Emery Bonding structure and method of making
US7083250B2 (en) * 2002-06-07 2006-08-01 Hewlett-Packard Development Company, L.P. Fluid ejection and scanning assembly with photosensor activation of ejection elements
US6705701B2 (en) * 2002-06-07 2004-03-16 Hewlett-Packard Development Company, L.P. Fluid ejection and scanning system with photosensor activation of ejection elements
US7104623B2 (en) * 2002-06-07 2006-09-12 Hewlett-Packard Development Company, L.P. Fluid ejection system with photosensor activation of ejection element
US6799819B2 (en) 2002-06-07 2004-10-05 Hewlett-Packard Development Company, L.P. Photosensor activation of an ejection element of a fluid ejection device
KR100428793B1 (ko) * 2002-06-26 2004-04-28 삼성전자주식회사 잉크젯 프린터 헤드 및 그 제조 방법
KR100499148B1 (ko) 2003-07-03 2005-07-04 삼성전자주식회사 잉크젯 프린트헤드
US7040016B2 (en) * 2003-10-22 2006-05-09 Hewlett-Packard Development Company, L.P. Method of fabricating a mandrel for electroformation of an orifice plate
US6857727B1 (en) * 2003-10-23 2005-02-22 Hewlett-Packard Development Company, L.P. Orifice plate and method of forming orifice plate for fluid ejection device
US7172269B2 (en) * 2003-11-13 2007-02-06 Avago Technologies Fiber Ip (Singapore) Pte. Ltd. Resistor shapes for heating devices on an integrated circuit
KR100537522B1 (ko) 2004-02-27 2005-12-19 삼성전자주식회사 압전 방식의 잉크젯 프린트헤드와 그 노즐 플레이트의제조 방법
US7569250B2 (en) * 2004-05-17 2009-08-04 Hewlett-Packard Development Company, L.P. Method, system, and apparatus for protective coating a flexible circuit
JP4274555B2 (ja) * 2004-07-16 2009-06-10 キヤノン株式会社 液体吐出素子基板の製造方法および液体吐出素子の製造方法
US7213908B2 (en) 2004-08-04 2007-05-08 Eastman Kodak Company Fluid ejector having an anisotropic surface chamber etch
KR101313946B1 (ko) * 2008-08-29 2013-10-01 캐논 가부시끼가이샤 액체 토출 헤드용 기판, 그 제조 방법 및 액체 토출 헤드
US8297742B2 (en) * 2010-03-19 2012-10-30 Fujifilm Corporation Bonded circuits and seals in a printing device
JP5350429B2 (ja) * 2011-02-10 2013-11-27 キヤノン株式会社 インクジェット記録ヘッドの製造方法
US11014359B2 (en) * 2018-09-21 2021-05-25 Fujifilm Dimatix, Inc. Internal print head flow features
US11161351B2 (en) 2018-09-28 2021-11-02 Canon Kabushiki Kaisha Liquid ejection head

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4528577A (en) * 1982-11-23 1985-07-09 Hewlett-Packard Co. Ink jet orifice plate having integral separators
US4513298A (en) * 1983-05-25 1985-04-23 Hewlett-Packard Company Thermal ink jet printhead
US4535343A (en) * 1983-10-31 1985-08-13 Hewlett-Packard Company Thermal ink jet printhead with self-passivating elements
US4578687A (en) * 1984-03-09 1986-03-25 Hewlett Packard Company Ink jet printhead having hydraulically separated orifices
US4746935A (en) * 1985-11-22 1988-05-24 Hewlett-Packard Company Multitone ink jet printer and method of operation
US4716423A (en) * 1985-11-22 1987-12-29 Hewlett-Packard Company Barrier layer and orifice plate for thermal ink jet print head assembly and method of manufacture
US4680859A (en) * 1985-12-06 1987-07-21 Hewlett-Packard Company Thermal ink jet print head method of manufacture

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EP0321075A2 (de) 1989-06-21
JPH022010A (ja) 1990-01-08
KR890009620A (ko) 1989-08-03
JP2716174B2 (ja) 1998-02-18
CA1302160C (en) 1992-06-02
US4847630A (en) 1989-07-11
DE3889087T2 (de) 1994-11-03
EP0321075B1 (de) 1994-04-13
DE3889087D1 (de) 1994-05-19
KR910007328B1 (ko) 1991-09-25
EP0321075A3 (en) 1990-10-17

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