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HK1261295B - 用於制造芯片卡模块的方法和芯片卡 - Google Patents

用於制造芯片卡模块的方法和芯片卡 Download PDF

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Publication number
HK1261295B
HK1261295B HK19121252.1A HK19121252A HK1261295B HK 1261295 B HK1261295 B HK 1261295B HK 19121252 A HK19121252 A HK 19121252A HK 1261295 B HK1261295 B HK 1261295B
Authority
HK
Hong Kong
Prior art keywords
wire
chip
substrate
module
antenna
Prior art date
Application number
HK19121252.1A
Other languages
German (de)
English (en)
French (fr)
Other versions
HK1261295A1 (zh
Inventor
Eric Eymard
Original Assignee
Linxens Holding
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Linxens Holding filed Critical Linxens Holding
Publication of HK1261295A1 publication Critical patent/HK1261295A1/zh
Publication of HK1261295B publication Critical patent/HK1261295B/zh

Links

HK19121252.1A 2016-01-26 2017-01-25 用於制造芯片卡模块的方法和芯片卡 HK1261295B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR20160050587 2016-01-26

Publications (2)

Publication Number Publication Date
HK1261295A1 HK1261295A1 (zh) 2019-12-27
HK1261295B true HK1261295B (zh) 2021-03-19

Family

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