HK1241148B - Enhanced amplifier efficiency through cascode current steering - Google Patents
Enhanced amplifier efficiency through cascode current steeringInfo
- Publication number
- HK1241148B HK1241148B HK18100587.9A HK18100587A HK1241148B HK 1241148 B HK1241148 B HK 1241148B HK 18100587 A HK18100587 A HK 18100587A HK 1241148 B HK1241148 B HK 1241148B
- Authority
- HK
- Hong Kong
- Prior art keywords
- amplifier
- power
- common
- peak
- carrier
- Prior art date
Links
Description
相关申请的交叉引用CROSS-REFERENCE TO RELATED APPLICATIONS
本申请要求享有于2015年2月15日提交的、标题为“ENHANCED AMPLIFIEREFFICICIENCY THROUGH CASCODE CURRENT STEERING”的第62/116,464号美国临时申请的优先权,通过引用将其公开明确地全部并入本文。This application claims priority to U.S. Provisional Application No. 62/116,464, filed on February 15, 2015, entitled “ENHANCED AMPLIFIEREFFICICIENCY THROUGH CASCODE CURRENT STEERING,” the disclosure of which is expressly incorporated herein by reference in its entirety.
技术领域Technical Field
本申请涉及射频(RF)应用中的功率放大器。The present application relates to power amplifiers for radio frequency (RF) applications.
背景技术Background Art
功率放大器(PA)被广泛地用在网络中,以便设置携带信息的信号的发射功率电平。例如,PA被用于设置光网络中的激光器的脉冲发射能量。PA还包括在诸如基站和移动设备这样的各种无线网络设备中,以便设置射频(RF)信号的发射功率电平。PA也用在局域网中,以便允许各种设备的有线连接和无线连接。Power amplifiers (PAs) are widely used in networks to set the transmit power level of information-carrying signals. For example, PAs are used to set the pulsed energy of lasers in optical networks. PAs are also used in various wireless network devices, such as base stations and mobile devices, to set the transmit power level of radio frequency (RF) signals. PAs are also used in local area networks to allow both wired and wireless connections between various devices.
在使用电池的移动设备中管理PA操作很重要,因为PA的功耗往往对电池寿命具有实质的影响。然而,满足功耗目标可能对诸如影响数据包中的信号完整性和差错控制的线性度这样的其他目标有害。Managing PA operation in battery-powered mobile devices is important because PA power consumption often has a substantial impact on battery life. However, meeting power consumption targets can be detrimental to other goals, such as signal integrity in data packets and linearity in error control.
一些设备(诸如无线设备)利用多尔蒂(Doherty)放大器以提高PA效率。在多数情况下,多尔蒂放大器相对于传统的单端放大器具有效率优点。Some devices, such as wireless devices, utilize Doherty amplifiers to improve PA efficiency. In most cases, Doherty amplifiers have efficiency advantages over traditional single-ended amplifiers.
一些使用峰均比(peak to average ratio)的高级调制方案要求放大器以距离它们的最大饱和输出功率(Psat)若干dB的方式进行操作,以维持线性度。因为多尔蒂放大器具有距离Psat约6dB的效率峰值,所以可以提高其线性效率。此外,由于RF输入分离器/移相器和输出组合器,多尔蒂放大器给PA增加了复杂度。Some advanced modulation schemes that use peak-to-average ratios require amplifiers to operate several dB below their maximum saturated output power ( Psat ) to maintain linearity. Because Doherty amplifiers have an efficiency peak of approximately 6 dB above Psat , their linear efficiency can be improved. Furthermore, Doherty amplifiers add complexity to the PA due to the RF input splitter/phase shifter and output combiner.
发明内容Summary of the Invention
根据多种实现方式,本申请涉及一种功率放大器(PA),其包括:共发射极,被配置为接收射频(RF)信号。所述PA还包括:载波放大器,其耦接到所述共发射极以形成载波共射共基(cascode)配置,对所述载波放大器的集电极提供第一电源电压。所述PA还包括:峰值放大器,其耦接到所述共发射极以形成峰值共射共基配置,对所述峰值放大器的集电极提供大于所述第一电源电压的第二电源电压。According to various implementations, the present application relates to a power amplifier (PA) comprising: a common emitter configured to receive a radio frequency (RF) signal. The PA further comprises: a carrier amplifier coupled to the common emitter to form a carrier cascode configuration, a first power supply voltage being provided to a collector of the carrier amplifier. The PA further comprises: a peaking amplifier coupled to the common emitter to form a peak cascode configuration, a second power supply voltage greater than the first power supply voltage being provided to a collector of the peaking amplifier.
在一些实现方式中,对所述载波放大器和峰值放大器中的每个提供偏压,以允许相应的放大器接通和关闭。In some implementations, a bias voltage is provided to each of the carrier amplifier and the peaking amplifier to allow the corresponding amplifier to be switched on and off.
在一些实现方式中,当所述PA的输出功率(Pout)小于所选择的值时,通过将所述载波放大器的偏压设置为高电平,接通所述载波放大器,并且通过将所述峰值放大器偏压设置为地电平,关闭所述峰值放大器。在一些实现方式中,所述PA的基本上全部的集电极电流从所述第一电源电压获得,以便以所述输出功率产生最大的或增加的效率。In some implementations, when the output power (Pout) of the PA is less than a selected value, the carrier amplifier is turned on by setting the bias voltage of the carrier amplifier to a high level, and the peak amplifier is turned off by setting the bias voltage of the peak amplifier to a ground level. In some implementations, substantially all of the collector current of the PA is obtained from the first supply voltage to produce maximum or increased efficiency at the output power.
在一些实现方式中,当Pout大于所选择的值时,通过将所述载波放大器的偏压设置为所述地电平,关闭所述载波放大器,并且通过将所述载波放大器的偏压设置为所述高电平,接通所述峰值放大器。在一些实现方式中,所述PA的基本上全部的集电极电流从所述第二电源电压获得,以产生最大输出功率的增加。In some implementations, when Pout is greater than a selected value, the carrier amplifier is turned off by setting the bias voltage of the carrier amplifier to the ground level, and the peak amplifier is turned on by setting the bias voltage of the carrier amplifier to the high level. In some implementations, substantially all of the collector current of the PA is derived from the second supply voltage to produce an increase in maximum output power.
在一些实现方式中,所选择的值是饱和功率电平(Psat)减去3dB。In some implementations, the selected value is the saturation power level (Psat) minus 3dB.
在一些实现方式中,所述载波共射共基配置和所述峰值共射共基配置在任何一个配置中基本上保留所述PA的增益。In some implementations, the carrier cascode configuration and the peak cascode configuration substantially preserve the gain of the PA in either configuration.
在一些实现方式中,在所述第一电源电压与第二电源电压之间的过渡期间,所述PA具有在幅度到幅度(AM-AM)响应中的最小化或减小的不连续性。In some implementations, the PA has a minimized or reduced discontinuity in amplitude-to-amplitude (AM-AM) response during a transition between the first and second supply voltages.
在一些实现方式中,本申请涉及一种射频(RF)模块,其包括:封装基板,被配置为容纳多个部件。所述RF模块还包括:功率放大器(PA),实现在所述封装基板上,所述PA包括被配置为接收RF信号的共发射极,所述PA还包括耦接到所述共发射极以形成载波共射共基配置的载波放大器,对所述载波放大器的集电极提供第一电源电压,所述PA还包括耦接到所述共发射极以形成峰值共射共基配置的峰值放大器,对所述峰值放大器的集电极提供大于所述第一电源电压的第二电源电压。In some implementations, the present application relates to a radio frequency (RF) module, comprising: a packaging substrate configured to accommodate a plurality of components. The RF module further comprises: a power amplifier (PA) implemented on the packaging substrate, the PA comprising a common emitter configured to receive an RF signal, the PA further comprising a carrier amplifier coupled to the common emitter to form a carrier cascode configuration, a first power supply voltage being provided to a collector of the carrier amplifier, the PA further comprising a peaking amplifier coupled to the common emitter to form a peak cascode configuration, a second power supply voltage greater than the first power supply voltage being provided to a collector of the peaking amplifier.
在一些实现方式中,所述RF模块是前端模块(FEM)。根据一些实现方式,所述RF模块的PA包括在本文中所描述的任何PA和/或放大系统的功能和/或特征。In some implementations, the RF module is a front-end module (FEM).According to some implementations, the PA of the RF module includes the functionality and/or features of any PA and/or amplification system described herein.
根据一些教导,本申请涉及一种射频(RF)设备,其包括:收发器,其生成RF信号。所述RF设备还包括与所述收发器通信的前端模块(FEM),所述FEM包括被配置为容纳多个部件的封装基板,所述FEM还包括实现在所述封装基板上的功率放大器(PA),所述PA包括被配置为接收RF信号的共发射极,所述PA还包括耦接到所述共发射极以形成载波共射共基配置的载波放大器,对所述载波放大器的集电极提供第一电源电压,所述PA还包括耦接到所述共发射极以形成峰值共射共基配置的峰值放大器,对所述峰值放大器的集电极提供大于所述第一电源电压的第二电源电压。所述RF设备还包括与所述FEM通信的天线,所述天线被配置为发射经放大的RF信号。According to some teachings, the present application relates to a radio frequency (RF) device comprising: a transceiver that generates an RF signal. The RF device also includes a front-end module (FEM) in communication with the transceiver, the FEM including a packaging substrate configured to house multiple components, the FEM also including a power amplifier (PA) implemented on the packaging substrate, the PA including a common emitter configured to receive the RF signal, the PA also including a carrier amplifier coupled to the common emitter to form a carrier cascode configuration, a first power supply voltage being provided to the collector of the carrier amplifier, the PA also including a peaking amplifier coupled to the common emitter to form a peak cascode configuration, a second power supply voltage greater than the first power supply voltage being provided to the collector of the peaking amplifier. The RF device also includes an antenna in communication with the FEM, the antenna configured to transmit the amplified RF signal.
在一些实现方式中,所述RF设备包括无线设备。在一些实现方式中,所述无线设备包括基站、中继器、移动电话、智能电话、计算机、膝上型计算机、平板计算机和外围设备中的至少一个。根据一些实现方式,所述FEM模块的PA包括在本文中所描述的任何PA和/或放大系统的功能和/或特征。In some implementations, the RF device includes a wireless device. In some implementations, the wireless device includes at least one of a base station, a repeater, a mobile phone, a smartphone, a computer, a laptop, a tablet computer, and a peripheral device. According to some implementations, the PA of the FEM module includes the functionality and/or features of any PA and/or amplification system described herein.
出于概述本申请的目的,已经在这里描述了本发明的某些方面、优点和新颖特征。应当理解,根据本发明的任何具体实施例,可以不必实现所有这样的优点。因此,可以以实现或优化在本文中所教导的一个优点或一组优点的方式来实施或实现本发明,而不必实现可能在本文中所教导或暗示的其他优点。For the purpose of summarizing this application, certain aspects, advantages and novel features of the present invention have been described herein. It should be understood that, according to any specific embodiment of the present invention, it is not necessary to realize all such advantages. Therefore, the present invention can be implemented or realized in a manner that realizes or optimizes one or a group of advantages taught herein, without realizing other advantages that may be taught or implied herein.
附图说明BRIEF DESCRIPTION OF THE DRAWINGS
为了能够更详细地理解本申请,可以通过参考各种实现方式的特征进行更具体的描述,其中一些实现方式在附图中例示。然而,附图仅例示本申请的更相关的特征,因此不应被视为是限制性的,因为描述可以准许加入其他有效特征。In order to enable a more detailed understanding of the present application, a more particular description may be given by reference to the features of various implementations, some of which are illustrated in the accompanying drawings. However, the drawings only illustrate the more relevant features of the present application and are therefore not to be considered restrictive, as the description may allow for the inclusion of other effective features.
图1是根据一些实现方式的无线系统或结构的框图。FIG1 is a block diagram of a wireless system or structure according to some implementations.
图2是根据一些实现方式的放大系统的框图。2 is a block diagram of an amplification system according to some implementations.
图3A至图3E示出根据一些实现方式的功率放大器的示意图。3A-3E illustrate schematic diagrams of power amplifiers according to some implementations.
图4是根据一些实现方式的放大系统的框图。4 is a block diagram of an amplification system according to some implementations.
图5是根据一些实现方式的电流导引(current steering)共射共基放大器的示意图。5 is a schematic diagram of a current steering cascode amplifier according to some implementations.
图6示出根据一些实现方式的共射共基偏压控制的示例曲线图。FIG6 illustrates an example graph of cascode bias control according to some implementations.
图7示出根据一些实现方式的图5中的电流导引共射共基放大器的示例电流路径。7 illustrates example current paths for the current steering cascode amplifier of FIG. 5 , according to some implementations.
图8示出根据一些实现方式的图5中的电流导引共射共基放大器的另外的示例电流路径。8 illustrates additional example current paths of the current steering cascode amplifier of FIG. 5 , according to some implementations.
图9根据一些实现方式示出根据一些实现方式的载波放大器和峰值放大器的示例响应。FIG. 9 illustrates example responses of a carrier amplifier and a peaking amplifier according to some implementations.
图10示出根据一些实现方式的电流导引共射共基放大器的示例性能曲线图。10 illustrates an example performance graph of a current steering cascode amplifier according to some implementations.
图11是根据一些实现方式的示例射频(RF)模块的示意图。11 is a schematic diagram of an example radio frequency (RF) module according to some implementations.
图12是根据一些实现方式的示例RF设备的示意图。12 is a schematic diagram of an example RF device according to some implementations.
根据惯例,在附图中所例示的各个特征可能不是按比例绘制的。相应地,为了清楚,各个特征的尺寸可以任意地扩大或缩小。另外,一些附图可能未图示给定系统、方法或设备的所有部件。最后,贯穿说明书和附图,相同的标号可以用于标记相同的特征。As is customary, the various features illustrated in the accompanying drawings may not be drawn to scale. Accordingly, the dimensions of the various features may be arbitrarily expanded or reduced for clarity. In addition, some of the accompanying drawings may not illustrate all components of a given system, method, or apparatus. Finally, throughout the specification and drawings, the same reference numerals may be used to identify the same features.
具体实施方式DETAILED DESCRIPTION
在本文中所提供的标题(如果有)仅仅是为了方便,而未必影响所要求保护的发明的范围或含义。The headings provided herein, if any, are for convenience only and do not necessarily affect the scope or meaning of the claimed invention.
参照考图1,本申请的一个或多个特征一般地涉及具有放大系统52的无线系统或结构50。在一些实施例中,放大系统52可以实现为一个或多个设备,并且可以在无线系统/结构50中利用这样的设备。在一些实施例中,无线系统/结构50可以实现在例如便携式无线设备中。在本文中描述这样的无线设备的示例。1 , one or more features of the present application generally relate to a wireless system or structure 50 having an amplification system 52. In some embodiments, the amplification system 52 can be implemented as one or more devices, and such devices can be utilized in the wireless system/structure 50. In some embodiments, the wireless system/structure 50 can be implemented, for example, in a portable wireless device. Examples of such wireless devices are described herein.
图2示出图1的放大系统52典型地包括具有一个或多个功率放大器(PA)的射频(RF)放大器组件54。在图2的示例中,将三个PA(60a至60c)图示为形成RF放大器组件54。应当理解,也可以实现其他数量的PA。还应当理解,也可以在具有其他类型的RF放大器的RF放大器组件中实现本申请的一个或多个特征。FIG2 shows that the amplification system 52 of FIG1 typically includes a radio frequency (RF) amplifier assembly 54 having one or more power amplifiers (PAs). In the example of FIG2 , three PAs ( 60 a to 60 c ) are illustrated as forming the RF amplifier assembly 54. It should be understood that other numbers of PAs may also be implemented. It should also be understood that one or more features of the present disclosure may also be implemented in an RF amplifier assembly having other types of RF amplifiers.
在一些实施例中,RF放大器组件54可以实现在一个或多个半导体晶片(die)上,并且这样的晶片可以包括在诸如功率放大器模块(PAM)或前端模块(FEM)这样的封装模块中。这样的封装模块典型地安装在与例如便携式无线设备相关联的电路板上。In some embodiments, the RF amplifier assembly 54 may be implemented on one or more semiconductor dies, and such dies may be included in a packaged module such as a power amplifier module (PAM) or a front-end module (FEM). Such a packaged module is typically mounted on a circuit board associated with, for example, a portable wireless device.
放大系统52中的PA(例如,60a至60c)典型地由偏压系统56施加偏压。另外,针对PA的电源电压典型地由电源系统58提供。在一些实施例中,偏压系统56和电源系统58中的任何一者或两者可以包括在前述具有RF放大器组件54的封装模块中。The PAs (e.g., 60a to 60c) in the amplification system 52 are typically biased by a bias system 56. Additionally, the supply voltage for the PAs is typically provided by a power system 58. In some embodiments, either or both of the bias system 56 and the power system 58 may be included in the aforementioned package module with the RF amplifier assembly 54.
在一些实施例中,放大系统52可以包括匹配网络62。这样的匹配网络可以被配置为为RF放大器组件54提供输入匹配和/或输出匹配功能。In some embodiments, the amplification system 52 may include a matching network 62. Such a matching network may be configured to provide input matching and/or output matching functionality for the RF amplifier assembly 54.
出于描述的目的,应当理解,图2的PA 60a至60c中的每个可以以多种方式来实现。图3A至图3E示出如何能够配置图2中的PA 60a至60c中的每个的非限制性的示例。图3A示出具有放大晶体管64的示例PA,其中,输入RF信号(RF_in)提供到晶体管64的基极,并且经放大的RF信号(RF_out)通过晶体管64的集电极输出。For purposes of this description, it should be understood that each of the PAs 60a to 60c of FIG2 can be implemented in a variety of ways. FIG3A to FIG3E illustrate non-limiting examples of how each of the PAs 60a to 60c of FIG2 can be configured. FIG3A illustrates an example PA having an amplifier transistor 64, wherein an input RF signal (RF_in) is provided to the base of the transistor 64, and an amplified RF signal (RF_out) is output through the collector of the transistor 64.
图3B示出具有以多级布置的多个放大晶体管(例如,64a、64b)的示例PA。输入RF信号(RF_in)提供到第一晶体管64a的基极,并且来自第一晶体管64a的经放大的RF信号通过其集电极输出。来自第一晶体管64a的经放大的RF信号提供到第二晶体管64b的基极,并且来自第二晶体管64b的经放大的RF信号通过其集电极输出,由此产生PA的输出RF信号(RF_out)。FIG3B shows an example PA having multiple amplifier transistors (e.g., 64a, 64b) arranged in multiple stages. An input RF signal (RF_in) is provided to the base of the first transistor 64a, and the amplified RF signal from the first transistor 64a is output through its collector. The amplified RF signal from the first transistor 64a is provided to the base of the second transistor 64b, and the amplified RF signal from the second transistor 64b is output through its collector, thereby generating the PA's output RF signal (RF_out).
在一些实施例中,可以将图3B的前述示例PA配置图示为如图3C中所示的两级或更多级。可以将第一级64a配置为例如驱动器级,并且可以将第二级64b配置为例如输出级。In some embodiments, the aforementioned example PA configuration of Figure 3B may be illustrated as two or more stages as shown in Figure 3C. The first stage 64a may be configured as, for example, a driver stage, and the second stage 64b may be configured as, for example, an output stage.
图3D示出,在一些实施例中,PA可以被配置为多尔蒂PA。这样的多尔蒂PA可以包括放大晶体管64a、64b,放大晶体管64a、64b被配置为提供输入RF信号(RF_in)的载波放大和峰值放大,以产生经放大的输出RF信号(RF_out)。输入RF信号可以由分离器分离为载波部分和峰值部分。经放大的载波和峰值信号可以由组合器组合以产生输出RF信号。FIG3D shows that in some embodiments, the PA can be configured as a Doherty PA. Such a Doherty PA can include amplifier transistors 64a, 64b, which are configured to provide carrier amplification and peak amplification of the input RF signal (RF_in) to generate an amplified output RF signal (RF_out). The input RF signal can be separated into a carrier portion and a peak portion by a splitter. The amplified carrier and peak signals can be combined by a combiner to generate an output RF signal.
图3E示出,在一些实施例中,PA可以以共射共基配置来实现。输入RF信号(RF_in)可以提供到作为共发射极器件操作的第一放大晶体管64a的基极。第一放大晶体管64a的输出可以通过其集电极提供,并且提供到作为共基极器件操作的第二放大晶体管64b的发射极。第二放大晶体管64b的输出可以通过其集电极提供,以便产生PA的经放大的输出RF信号(RF_out)。FIG3E shows that in some embodiments, the PA can be implemented in a cascode configuration. An input RF signal (RF_in) can be provided to the base of a first amplifier transistor 64a operating as a common-emitter device. The output of the first amplifier transistor 64a can be provided via its collector and provided to the emitter of a second amplifier transistor 64b operating as a common-base device. The output of the second amplifier transistor 64b can be provided via its collector to generate an amplified output RF signal (RF_out) of the PA.
在图3A至图3E的各个示例中,放大晶体管被描述为诸如异质结双极晶体管(HBT)这样的双极结型晶体管(BJT)。应当理解,本申请的一个或多个特征也可以以或者利用诸如场效应晶体管(FET)这样的其他类型的晶体管来实现。In the examples of Figures 3A to 3E, the amplifier transistor is described as a bipolar junction transistor (BJT) such as a heterojunction bipolar transistor (HBT). It should be understood that one or more features of the present application can also be implemented with or using other types of transistors such as field effect transistors (FETs).
图4示出,在一些实施例中,图2的放大系统52可以实现为高电压(HV)功率放大系统100。这样的系统可以包括HV功率放大器组件54,HV功率放大器组件54被配置为包括一些或全部的PA(例如,60a至60c)的HV放大操作。如在本文中所描述的那样,这样的PA可以由偏压系统56施加偏压。在一些实施例中,前述的HV放大操作可以由HV电源系统58促成。在一些实施例中,可以实现接口系统72,以提供在HV功率放大器组件54与偏压系统56和HV电源系统58中的任何一者或两者之间的接口功能。FIG4 shows that, in some embodiments, the amplification system 52 of FIG2 can be implemented as a high voltage (HV) power amplification system 100. Such a system can include an HV power amplifier assembly 54, which is configured to include HV amplification operations of some or all of the PAs (e.g., 60a to 60c). As described herein, such PAs can be biased by a bias system 56. In some embodiments, the aforementioned HV amplification operations can be facilitated by an HV power supply system 58. In some embodiments, an interface system 72 can be implemented to provide interface functionality between the HV power amplifier assembly 54 and either or both of the bias system 56 and the HV power supply system 58.
在本文中描述与通过共射共基电流导引来增强功率放大器(PA)效率有关的示例。要注意的是,相对于传统的单端放大器,多尔蒂放大器可以提供效率优点。在一些实施例中,使用峰均比的高级调制方案要求或期望多尔蒂放大器以距离最大饱和输出功率(Psat)若干dB的方式进行操作,以维持线性度。由于多尔蒂放大器典型地具有距离P约6dB的效率峰值,所以其线性效率留有改善的空间。Examples related to enhancing power amplifier (PA) efficiency through cascode current steering are described herein. It is noted that Doherty amplifiers can offer efficiency advantages over conventional single-ended amplifiers. In some embodiments, advanced modulation schemes using peak-to-average ratios require or expect the Doherty amplifier to operate several dB away from the maximum saturated output power ( Psat ) to maintain linearity. Since Doherty amplifiers typically have an efficiency peak of approximately 6 dB away from P, their linear efficiency leaves room for improvement.
在本文中公开如何能够在没有射频(RF)输入分离器/移相器和输出组合器的复杂度的情况下获得类似于多尔蒂放大器的效率响应的示例。Disclosed herein are examples of how an efficiency response similar to that of a Doherty amplifier can be obtained without the complexity of a radio frequency (RF) input splitter/phase shifter and output combiner.
图5示出根据一些实现方式的电流导引共射共基放大器500的示例性示意图。如图5所示,电流导引共射共基放大器500具有共发射极510,所述共发射极510配置成在其基极处接收输入RF信号(RFin 502)并且通过其集电极(RFout 504)生成输出。这样的输出被示为提供到峰值放大器520的发射极,并且还提供到载波放大器530的发射极。载波放大器530被示为通过其集电极生成其输出,并且峰值放大器520被示为通过其集电极生成其输出。相应地,共发射极510和载波放大器530可以形成载波共射共基配置。类似地,共发射极510和峰值放大器520可以形成峰值共射共基配置。FIG5 illustrates an exemplary schematic diagram of a current-steering cascode amplifier 500 according to some implementations. As shown in FIG5 , the current-steering cascode amplifier 500 has a common emitter 510 configured to receive an input RF signal (RF in 502) at its base and generate an output through its collector (RF out 504). Such an output is shown as being provided to the emitter of a peaking amplifier 520 and also provided to the emitter of a carrier amplifier 530. The carrier amplifier 530 is shown as generating its output through its collector, and the peaking amplifier 520 is shown as generating its output through its collector. Accordingly, the common emitter 510 and the carrier amplifier 530 can form a carrier cascode configuration. Similarly, the common emitter 510 and the peaking amplifier 520 can form a peak cascode configuration.
在图5的示例中,载波放大器530和峰值放大器520的集电极节点被示为通过DC阻断电容元件542耦接。载波放大器530的集电极被示为通过DC阻断电容元件544耦接到输出节点(RFout 504)。5 , the collector nodes of carrier amplifier 530 and peaking amplifier 520 are shown coupled via DC blocking capacitive element 542. The collector of carrier amplifier 530 is shown coupled to the output node (RF out 504) via DC blocking capacitive element 544.
电源电压Vcc是552,被示为通过扼流电感元件554提供到峰值放大器520的集电极。电源电压556被示为通过扼流电感元件558提供到载波放大器530的集电极。The supply voltage Vcc is 552 and is shown as being provided to the collector of the peaking amplifier 520 through a choke inductor element 554. The supply voltage 556 is shown as being provided to the collector of the carrier amplifier 530 through a choke inductor element 558.
峰值放大器520被示为在其基极处用来自峰值偏压系统的峰值共射共基偏压Vcascode 562施加偏压。载波放大器530被示为在其基极处用来自载波偏压系统的载波共射共基偏压Vcascode 564施加偏压。Peaking amplifier 520 is shown biased at its base with a peak cascode bias voltage Vcascode 562 from a peak bias system. Carrier amplifier 530 is shown biased at its base with a carrier cascode bias voltage Vcascode 564 from a carrier bias system.
图6示出根据一些实现方式的共射共基偏压控制的示例曲线图600。如图6所示,载波共射共基偏压Vcascode 564(实线)和峰值共射共基偏压Vcascode562(虚线)作为输出功率Pout的函数而变化。例如,载波共射共基偏压Vcascode564被示为在Pout<Psat-3dB时具有约2V的值,而在Pout>Psat-3dB时具有约0V的值。峰值共射共基偏压Vcascode 562被示为在Pout<Psat-3dB时具有约0V的值,而在Pout>Psat-3dB时具有约2V的值。FIG6 illustrates an example graph 600 of cascode bias control according to some implementations. As shown in FIG6 , the carrier cascode bias voltage V cascode 564 (solid line) and the peak cascode bias voltage V cascode 562 (dashed line) vary as a function of the output power P out . For example, the carrier cascode bias voltage V cascode 564 is shown to have a value of approximately 2V when P out < Psat -3dB, and a value of approximately 0V when P out > Psat -3dB. The peak cascode bias voltage V cascode 562 is shown to have a value of approximately 0V when P out < Psat -3dB, and a value of approximately 2V when P out > Psat -3dB.
利用前述施加偏压的配置,在Pout<Psat-3dB时,可以获得如图7中所示的示例电流路径(例如,Icc路径700)。在峰值共射共基偏压Vcascode 562为0V(并且因此峰值放大器520关闭)并且载波共射共基偏压Vcascode 564为2V(并且因此载波放大器530接通)的这样的状态下,集电极电流Icc被示为流过载波放大器530和共发射极510的共射共基布置(例如,Icc路径700)。在这样的状态下的最大Pout为With the aforementioned biasing configuration, when Pout<Psat-3dB, an example current path (e.g., Icc path 700) can be obtained as shown in FIG7 . In such a state where the peak cascode bias voltage Vcascode 562 is 0V (and therefore the peak amplifier 520 is off) and the carrier cascode bias voltage Vcascode 564 is 2V (and therefore the carrier amplifier 530 is on), the collector current Icc is shown flowing through the cascode arrangement of the carrier amplifier 530 and the common emitter 510 (e.g., Icc path 700). The maximum Pout in such a state is
其中RLL为负载电阻。Where R LL is the load resistance.
类似地,利用前述施加偏压的配置,在Pout>Psat-3dB时,可以获得如图8所示的示例电流路径(例如,Icc路径800)。在峰值共射共基偏压Vcascode 562为2V(并且因此峰值放大器520接通)并且载波共射共基偏压Vcascode 564为0V(并且因此载波放大器530关闭)的这样的状态下,集电极电流Icc被示为流过峰值放大器520和共发射极510的共射共基布置(例如,Icc路径800)。在这样的状态下的最大Pout为Similarly, with the aforementioned biasing configuration, when Pout>Psat-3dB, an example current path (e.g., Icc path 800) as shown in FIG8 can be obtained. In such a state where the peak cascode bias voltage Vcascode 562 is 2V (and therefore the peak amplifier 520 is turned on) and the carrier cascode bias voltage Vcascode 564 is 0V (and therefore the carrier amplifier 530 is turned off), the collector current Icc is shown as flowing through the cascode arrangement of the peak amplifier 520 and the common emitter 510 (e.g., Icc path 800). The maximum Pout in such a state is
Vcc 2/(2RLL)=Vcc 2/(2RLL),其中RLL是负载电阻。 Vcc2 /( 2RLL ) = Vcc2 / ( 2RLL ), where RLL is the load resistance.
参照图6至图8的示例,分别向载波放大器530和峰值放大器520提供两个电源电压和Vcc。在一些实现方式中,针对峰值放大器520的电源电压Vcc 552可以从例如升压DC/DC转换器提供。在一些实现方式中,针对载波放大器530的电源电压556可以从例如降压转换器提供。6 to 8 , two power supply voltages, Vcc, are provided to the carrier amplifier 530 and the peaking amplifier 520, respectively. In some implementations, the power supply voltage Vcc 552 for the peaking amplifier 520 can be provided, for example, from a step-up DC/DC converter. In some implementations, the power supply voltage 556 for the carrier amplifier 530 can be provided, for example, from a step-down converter.
同样参照图6至图8,在Pout<Psat-3dB的第一区域中,峰值放大器520的共射共基基极电压被拉至地,而载波放大器530的共射共基基极电压被拉高(例如,2V)。这样的配置迫使从电源电压556拉走基本上所有的集电极电流。在该配置中的PA的最大输出功率为Vcc 2/(4RLL),在该输出功率时实现最大效率。6-8 , in the first region where Pout < Psat -3 dB, the cascode base voltage of the peaking amplifier 520 is pulled to ground, while the cascode base voltage of the carrier amplifier 530 is pulled high (e.g., 2 V). This configuration forces substantially all collector current to be drawn away from the supply voltage 556. The maximum output power of the PA in this configuration is Vcc2 /( 4RLL ), at which maximum efficiency is achieved.
在Pout>Psat-3dB的区域中,峰值放大器520的共射共基基极电压被拉高(例如2V),而载波放大器530的共射共基基极电压被拉至地。这样的配置迫使从电源电压Vcc 552拉走基本上所有的集电极电流。在该配置中的PA的最大输出功率为Vcc 2/(2RLL)或者比载波放大器配置高3dB。In the region of Pout > Psat - 3dB, the cascode base voltage of the peaking amplifier 520 is pulled high (e.g., 2V), while the cascode base voltage of the carrier amplifier 530 is pulled to ground. This configuration forces substantially all collector current to be drawn away from the supply voltage Vcc 552. The maximum output power of the PA in this configuration is Vcc2 / ( 2RLL ) or 3dB higher than the carrier amplifier configuration.
另外要注意的是,采用共射共基配置的放大器的前述电源抑制(supplyrejection)在任何一个配置中保留放大器的增益。这样的效果可以在电源电压Vcc 552与电源电压556之间的过渡期间最小化或减小幅度到幅度(AM-AM)响应中的任何不连续性。Also note that the aforementioned supply rejection of the amplifier in the cascode configuration preserves the gain of the amplifier in either configuration. This effect can minimize or reduce any discontinuity in the amplitude-to-amplitude (AM-AM) response during the transition between the supply voltage Vcc 552 and the supply voltage 556.
图9示出根据一些实现方式的载波放大器和峰值放大器的示例响应。根据一些实现方式,图表910示出峰值放大器和载波放大器的功率附加效率(PAE)响应的示例。根据一些实现方式,图表920示出峰值放大器和载波放大器的PAE响应的另外的示例。根据一些实现方式,图表930示出峰值放大器和载波放大器的幅度到幅度(AM-AM)响应的示例。根据一些实现方式,图表940示出峰值放大器和载波放大器的幅度到相位(AM-PM)响应的示例。FIG9 illustrates example responses of a carrier amplifier and a peaking amplifier, according to some implementations. According to some implementations, graph 910 illustrates an example of power added efficiency (PAE) responses of the peaking amplifier and the carrier amplifier. According to some implementations, graph 920 illustrates additional examples of PAE responses of the peaking amplifier and the carrier amplifier. According to some implementations, graph 930 illustrates an example of amplitude-to-amplitude (AM-AM) responses of the peaking amplifier and the carrier amplifier. According to some implementations, graph 940 illustrates an example of amplitude-to-phase (AM-PM) responses of the peaking amplifier and the carrier amplifier.
图10示出根据一些实现方式的作为整体的电流导引共射共基放大器的示例性能曲线图。根据一些实现方式,图表1010示出功率附加效率(PAE)对输出功率(Pout)的示例。根据一些实现方式,图表1020示出PAE对输出功率(Pout)的另外的示例。根据一些实现方式,图表1030示出增益对输出功率(Pout)的示例。根据一些实现方式,图表1040示出相位对输出功率(Pout)的示例。FIG10 illustrates example performance graphs for a current-steering cascode amplifier as a whole, according to some implementations. According to some implementations, graph 1010 illustrates an example of power-added efficiency (PAE) versus output power ( Pout ). According to some implementations, graph 1020 illustrates another example of PAE versus output power ( Pout ). According to some implementations, graph 1030 illustrates an example of gain versus output power ( Pout ). According to some implementations, graph 1040 illustrates an example of phase versus output power ( Pout ).
图11示出,在一些实施例中,可以在射频(RF)模块中实现在本文中所描述的电流导引共射共基放大器中的一些或全部。这样的模块可以是例如前端模块(FEM)。在图11的示例中,模块1100可以包括封装基板1102,并且多个部件可以安装在这样的封装基板上。例如,前端功率管理集成电路(FE-PMIC)部件1152、包括电流导引共射共基放大器500的功率放大器组件1154、匹配部件1156以及双工器组件1158可以安装和/或实现在封装基板1102上和/或封装基板1102内。诸如多个可选的表面安装技术(SMT)器件1104和天线开关模块(ASM)1106这样的其他部件也可以安装在封装基板1102上。虽然所有的各个部件被图示为部署在封装基板1102上,但是应当理解,一些部件可以实现在其他部件之上。FIG11 shows that, in some embodiments, some or all of the current-steering cascode amplifiers described herein can be implemented in a radio frequency (RF) module. Such a module can be, for example, a front-end module (FEM). In the example of FIG11 , module 1100 can include a packaging substrate 1102, and various components can be mounted on such a packaging substrate. For example, a front-end power management integrated circuit (FE-PMIC) component 1152, a power amplifier assembly 1154 including the current-steering cascode amplifier 500, matching components 1156, and a duplexer assembly 1158 can be mounted and/or implemented on and/or within packaging substrate 1102. Other components, such as a plurality of optional surface mount technology (SMT) devices 1104 and an antenna switch module (ASM) 1106, can also be mounted on packaging substrate 1102. While all of the various components are illustrated as being disposed on packaging substrate 1102, it should be understood that some components can be implemented on other components.
在一些实现方式中,具有在本文中所描述的一个或多个特征的器件和/或电路可以包括在诸如无线设备这样的RF设备中。这样的器件和/或电路可以直接地、以在本文中所描述的模块形式或者以其一些组合实现在无线设备中。在一些实施例中,这样的无线设备可以包括例如蜂窝电话、智能电话、具有或没有电话功能的手持无线设备、无线平板等。In some implementations, devices and/or circuits having one or more features described herein may be included in RF devices such as wireless devices. Such devices and/or circuits may be implemented in wireless devices directly, in the form of modules described herein, or in some combination thereof. In some embodiments, such wireless devices may include, for example, cellular phones, smartphones, handheld wireless devices with or without telephone functionality, wireless tablets, and the like.
图12图示具有在本文中所描述的一个或多个有利特征的示例射频(RF)设备1200。根据一些实现方式,RF设备1200是无线设备。在具有在本文中所描述的一个或多个特征的模块的背景下,这样的模块一般可以通过虚线框1100来图示,并且可以实现为例如前端模块(FEM)。如在本文中所描述的那样,这样的模块可以包括具有电流导引特征的一个或多个PA。根据一些实现方式,电流导引特征与如在本文中所描述的电流导引共射共基放大器500相类似地运作。FIG12 illustrates an example radio frequency (RF) device 1200 having one or more advantageous features described herein. According to some implementations, RF device 1200 is a wireless device. In the context of a module having one or more features described herein, such a module may be generally illustrated by dashed box 1100 and may be implemented, for example, as a front-end module (FEM). As described herein, such a module may include one or more PAs having a current steering feature. According to some implementations, the current steering feature operates similarly to the current steering cascode amplifier 500 described herein.
参照图12,功率放大器(PA)1220可以从收发器1210接收它们相应的RF信号,收发器1210可以以已知的方式来配置和操作,以生成待放大和发射的RF信号以及处理所接收的信号。收发器1210被示为与基带子系统1208进行交互,基带子系统1208被配置为提供适合于用户的数据和/或话音信号与适合于收发器1210的RF信号之间的转换。收发器1210还可以与功率管理部件1206进行通信,功率管理部件1206被配置为管理用于无线设备1200的操作的功率。这样的功率管理还可以控制基带子系统1208和模块1100的操作。12 , power amplifiers (PAs) 1220 can receive their respective RF signals from transceiver 1210, which can be configured and operated in a known manner to generate RF signals to be amplified and transmitted and to process received signals. Transceiver 1210 is shown interacting with baseband subsystem 1208, which is configured to provide conversion between data and/or voice signals suitable for a user and RF signals suitable for transceiver 1210. Transceiver 1210 can also communicate with power management component 1206, which is configured to manage power for operation of wireless device 1200. Such power management can also control the operation of baseband subsystem 1208 and module 1100.
基带子系统1208被示为连接到用户接口1202,以便于提供给以及接收自用户的话音和/或数据的各种输入和输出。基带子系统1208还可以连接到存储器1204,存储器1204被配置为存储数据和/或指令,以便于无线设备的操作,和/或向用户提供信息的存储。The baseband subsystem 1208 is shown connected to the user interface 1202 to facilitate various inputs and outputs of voice and/or data to and from the user. The baseband subsystem 1208 may also be connected to the memory 1204, which is configured to store data and/or instructions to facilitate the operation of the wireless device and/or to provide storage of information to the user.
在图12中所示的示例中,PA 1220的输出被示为(经由相应的匹配电路1222)被匹配并被路由到它们相应的双工器1224。这样的经放大和滤波的信号可以通过天线开关1214而被路由到天线1216以便发射。在一些实施例中,双工器1224可以允许使用公共天线(例如,1216)同时地执行发射和接收操作。在图12中,将所接收的信号示为被路由到可以包括例如一个或多个低噪声放大器(LNA)的“Rx”路径(未示出)。In the example shown in FIG12 , the outputs of the PAs 1220 are shown matched (via corresponding matching circuits 1222) and routed to their respective duplexers 1224. Such amplified and filtered signal can be routed to the antenna 1216 via the antenna switch 1214 for transmission. In some embodiments, the duplexer 1224 can allow transmit and receive operations to be performed simultaneously using a common antenna (e.g., 1216). In FIG12 , the received signal is shown as being routed to an "Rx" path (not shown) that can include, for example, one or more low noise amplifiers (LNAs).
多个其他无线设备配置可以利用在本文中所描述的一个或多个特征。例如,无线设备不需要是多频带设备。在另外的示例中,无线设备可以包括诸如分集天线这样的另外的天线以及诸如Wi-Fi、蓝牙和GPS这样的另外的连接特征。Many other wireless device configurations can utilize one or more of the features described herein. For example, a wireless device need not be a multi-band device. In other examples, a wireless device can include additional antennas such as a diversity antenna and additional connectivity features such as Wi-Fi, Bluetooth, and GPS.
除非上下文清楚地另有要求,否则贯穿说明书和权利要求书,措词“包括”、“包含”等应当以与排他性或穷尽性的意义相反的包括性的意义来解释,也就是说,应当以“包括但不限于”的意义来解释。如在本文中一般使用的那样,措词“耦接”指可以直接连接或者借助于一个或多个中间元件所连接的两个或多个元件。另外,措词“在本文中”、“在上文”、“在下文”以及相似含义的措词在本申请中使用时应当指作为整体的本申请,而不是本申请的任何具体部分。在上下文允许时,在使用单数或复数的以上描述中的措词也可以分别包括复数或单数。关于在提及两个或多个项目的列表时的措词“或”,该措词涵盖该措词的以下解释中的全部:列表中的任何项目,列表中的所有项目,以及列表中的项目的任何组合。Unless the context clearly requires otherwise, throughout the specification and claims, the words "comprises," "comprising," and the like should be interpreted in an inclusive sense, as opposed to an exclusive or exhaustive sense, that is, in the sense of "including but not limited to." As generally used herein, the word "coupled" refers to two or more elements that can be connected directly or by means of one or more intermediate elements. In addition, the words "herein," "above," "herein below," and words of similar meaning, when used in this application, should refer to this application as a whole and not to any specific part of this application. Where the context permits, words in the above description that use the singular or plural may also include the plural or singular, respectively. With respect to the word "or" when referring to a list of two or more items, the word covers all of the following interpretations of the word: any item in the list, all items in the list, and any combination of items in the list.
本发明的实施例的以上详细描述不打算是穷尽性的或者将本发明局限于上文所公开的确切形式。尽管在上文出于说明的目的而描述了本发明的具体实施例和示例,但是如本领域技术人员将意识到的那样,在本发明范围内可能有各种等效的修改。例如,虽然处理或块以给定的次序呈现,但是替代的实施例可以以不同的次序执行具有这些步骤的处理或者采用具有这些块的系统,并且一些处理或块可以被删除、移动、添加、细分、组合和/或修改。这些处理或块中的每个可以以各种不同的方式来实现。另外,虽然处理或块有时被示为串行地执行,但是替代地,这些处理或块也可以并行地执行,或者可以在不同时间执行。The above detailed description of the embodiment of the present invention is not intended to be exhaustive or to limit the present invention to the exact form disclosed above. Although specific embodiments of the present invention and examples have been described above for illustrative purposes, various equivalent modifications may be possible within the scope of the present invention as will be appreciated by those skilled in the art. For example, although processes or blocks are presented in a given order, alternative embodiments may perform processes with these steps or adopt systems with these blocks in different orders, and some processes or blocks may be deleted, moved, added, subdivided, combined and/or modified. Each of these processes or blocks may be implemented in various ways. In addition, although processes or blocks are sometimes shown as being performed serially, alternatively, these processes or blocks may also be performed in parallel, or may be performed at different times.
可以将在本文中所提供的本发明的教导应用于其他系统,而不必是上述的系统。可以组合上述的各个实施例的元件和动作,以提供另外的实施例。The teachings of the invention provided herein can be applied to other systems, not necessarily the system described above.The elements and acts of the various embodiments described above can be combined to provide further embodiments.
虽然已经描述了本发明的一些实施例,但是这些实施例仅作为示例而呈现,而不打算限制本申请的范围。实际上,在本文中所描述的新颖方法和系统可以以多种其他形式来实施;另外,可以在不脱离本申请的精神的情况下,在本文中所描述的方法和系统的形式上做出各种省略、替换和改变。所附的权利要求和它们的等效物旨在涵盖将落入本申请的范围和精神内的这样的形式或修改。Although some embodiments of the present invention have been described, these embodiments are presented only as examples and are not intended to limit the scope of the present application. In fact, the novel methods and systems described herein may be implemented in a variety of other forms; in addition, various omissions, substitutions, and changes in the form of the methods and systems described herein may be made without departing from the spirit of the present application. The accompanying claims and their equivalents are intended to cover such forms or modifications as would fall within the scope and spirit of the present application.
Claims (20)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US62/116,464 | 2015-02-15 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| HK1241148A1 HK1241148A1 (en) | 2018-06-01 |
| HK1241148B true HK1241148B (en) | 2021-11-19 |
Family
ID=
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107408924B (en) | Enhanced amplifier efficiency by cascode current steering | |
| US10291185B2 (en) | Doherty power amplifiers with different operating biases | |
| US10658991B2 (en) | Common base pre-amplifier | |
| US10063200B2 (en) | Feedback circuit for power amplifier | |
| US9831841B2 (en) | Switchable base feed circuit for radio-frequency power amplifiers | |
| US11031915B2 (en) | Biasing an amplifier using a mirror bias signal | |
| US9634619B2 (en) | Power amplifier bias circuit having parallel emitter follower | |
| US9935588B2 (en) | Linearity performance for multi-mode power amplifiers | |
| US9467101B2 (en) | Systems, circuits and methods related to multi-mode power amplifiers having improved linearity | |
| TW201633698A (en) | Power amplification system with adjustable common base bias | |
| TWI606689B (en) | Cascode amplifier segmentation for enhanced thermal ruggedness | |
| HK1241148B (en) | Enhanced amplifier efficiency through cascode current steering | |
| HK1241148A1 (en) | Enhanced amplifier efficiency through cascode current steering | |
| HK1225177B (en) | Cascode amplifier segmentation for enhanced thermal ruggedness | |
| HK1225177A1 (en) | Cascode amplifier segmentation for enhanced thermal ruggedness | |
| HK1225176A1 (en) | Power amplifier module with power supply control | |
| HK1225867A1 (en) | Power amplification system with adjustable common base bias | |
| HK1225176B (en) | Power amplifier module with power supply control |