HK1126315B - Contact-bonding device - Google Patents

Description

Crimping device

Technical Field

The present invention relates to a pressure bonding apparatus for mounting an electrical component on a substrate.

Background

Conventionally, in a mounting process for connecting an electrical component such as a semiconductor element to a substrate, a pressure bonding apparatus is used which heats the electrical component while pressing the electrical component against the substrate with a pressing head.

Reference numeral 101 in fig. 14(a) denotes a conventional crimping apparatus, and the crimping apparatus 101 includes a base 126 and a pressing head 120.

The pressing head 120 has: the metal frame is embedded with pressing rubber; sticking the pressing rubber on the metal plate by using an adhesive; and flowing liquid rubber into the metal frame to cure the rubber in the metal frame.

In the description of embedding the pressing rubber 122 in the head main body 121 made of a metal frame, the surface of the pressing rubber 122 is formed to be flush with the surface of the head main body 121 or to protrude downward from the surface of the head main body 121, and when the pressing head 120 is pressed against the object 110 to be pressure-bonded on the base 126, the surface of the pressing rubber 122 comes into contact with the object 110 to be pressure-bonded.

The object to be pressure-bonded 110 includes: the substrate 111 and the electric components 116 and 118 arranged on the substrate 111 and having different thicknesses form a step difference on the substrate 111 due to a difference in thickness between the electric components 116 and 118.

The pressing rubber 122 is made of an elastic material that deforms when pressure is applied, and the pressing rubber 122 first contacts the thickest electrical component 116, then the pressing rubber 122 deforms, and contacts the thick electrical component 116 to the thin electrical component 118 in order, and finally all the electrical components 116, 118 are pressed by the pressing rubber 122.

Before the crimping apparatus 101 presses the electrical components 116 and 118, the electrical components 116 and 118 and the substrate 111 are aligned, and the terminals of the electrical components 116 and 118 are positioned directly above the terminals of the substrate 111 with the adhesive 115 interposed therebetween.

The surface of the base 126 is made substantially horizontal, the substrate 111 is horizontally arranged on the surface, and when the pressing head 120 is moved vertically downward while heating the pressing object 110 to press the electric components 116 and 118, the electric components 116 and 118 move directly downward while pressing the adhesive 115, so that the terminals of the electric components 116 and 118 are in contact with the terminals of the substrate 111, and the electric components 116 and 118 are electrically connected to the substrate 111 (fig. 14 (b)). Thus, the conventional pressure bonding apparatus 101 can simultaneously connect electric components having different heights to 1 substrate.

However, when the pressing rubber 122 is depressed when it presses the electric components 116 and 118, the expanded portion of the pressing rubber 122 goes beyond the frame of the head body 121 due to the property of the surrounding portion expanding in reaction thereto, and the surface of the pressing rubber 122 expands in the horizontal direction.

Fig. 15 is a plan view showing a state where the surface of the pressing rubber 122 spreads in the horizontal direction, and the pressing rubber 122 flows in the radial direction around the center C of the planar shape. Since the amount of movement is larger at the end portions than in the vicinity of the center C of the pressing rubber 122, the electric components 116 and 118 pressed by the end portions of the pressing rubber 122 move in the horizontal direction together with the spread of the pressing rubber 122, and the terminals of the electric components 116 and 118 are displaced from the positions directly above the terminals of the board 111.

When the positional misalignment of the electrical components 116, 118 occurs, the terminals of the electrical components 116, 118 and the terminals of the substrate 111 become out of contact, and the connection reliability of the electrical components 116, 118 and the substrate 111 is lowered.

In addition, when the electric components 116 and 118 are mounted on both surfaces of the substrate 111 as well as one surface, the electric components 116 and 118 must be mounted 2 times for each surface, and the time required for mounting becomes long.

In the step of mounting the electrical components 116 and 118 on one surface and mounting the electrical components 116 and 118 on the other surface, the surface on which the electrical components 116 and 118 are already mounted faces the surface of the base 126, and therefore, in order to make the mounted electrical components 116 and 118 less likely to be damaged by pressing, it is necessary to form irregularities corresponding to the shapes of the electrical components 116 and 118 on the base 126.

However, in this method, the pedestal 126 needs to be newly formed every time the types of the electric components 116 and 118 and the substrate 111 or the connection positions of the electric components 116 and 118 are changed.

When the electrical components 116 and 118 mounted on one surface are connected to the other surface, the electrical components 116 and 118 are again heated and pressed, and the electrical components 116 and 118 are repeatedly heated and pressed to be damaged.

Patent document 1: japanese patent application laid-open No. 2002-359264

Patent document 2: japanese patent application laid-open No. 2005-32952

Disclosure of Invention

Problems to be solved by the invention

The present invention has been made to solve the above-described problems, and an object thereof is to provide a pressure bonding apparatus capable of reliably connecting an electric component and a substrate.

Means for solving the problems

In order to solve the above problems, a pressure bonding apparatus according to the present invention includes first and second pressing rubbers configured to be capable of pressing an object to be pressure bonded, which is disposed between the first and second pressing rubbers, with the first and second pressing rubbers, wherein a dam member having a height higher than a surface height of the first pressing rubber is disposed around the first pressing rubber, and the second pressing rubber is configured to be insertable into a space surrounded by the dam member.

The pressure bonding apparatus of the present invention includes first and third pressing rubbers configured to be capable of pressing an object to be pressure bonded, which is disposed between the first and third pressing rubbers, with the first and third pressing rubbers, wherein a dam member having a height higher than a surface height of the first and third pressing rubbers is disposed around the first and third pressing rubbers, respectively.

The pressure bonding apparatus of the present invention is configured as follows: the first pressing rubber is disposed on a first pressing plate, a first compression member capable of compressive deformation is disposed between the first pressing rubber and the first pressing plate, and the height of the first dam member is higher than the surface height of the first pressing rubber at least when the first compression member is compressed.

The pressure bonding apparatus of the present invention includes fourth and fifth pressing rubbers configured to be capable of pressing an object to be pressure bonded, which is disposed between the fourth and fifth pressing rubbers, with the fourth and fifth pressing rubbers, and includes a dam member surrounding the fourth and fifth pressing rubbers, the dam member being configured to be separable from the fourth and fifth pressing rubbers.

In the pressure bonding apparatus of the present invention, the dam member is cylindrical, and the fourth and fifth pressing rubbers are configured to be insertable into the inside of the cylinder of the dam member.

The present invention is configured as described above, and the first and second pressing rubbers sandwich the substrate so that the front surface and the back surface of the substrate are simultaneously pressed, whereby the electrical component can be simultaneously connected to the front surface and the back surface of the substrate.

The pressure bonding apparatus of the present invention includes first and second pressing rubbers, and is configured to be capable of pressing an object to be pressure bonded, which is disposed between the first and second pressing rubbers and has electric components disposed on both surfaces of a substrate, with the first and second pressing rubbers, and is characterized in that: a dam member that is higher than the surface height of the first pressing rubber and surrounds the first pressing rubber, the object to be pressure-bonded, and the second pressing rubber when pressure-bonded so as to block expansion of the first and second pressing rubbers in the horizontal direction is arranged around the first pressing rubber, the second pressing rubber is configured to be insertable into a space surrounded by the dam member, and the first and second pressing rubbers press the object to be pressure-bonded while the dam member surrounds the first pressing rubber, the object to be pressure-bonded, and the second pressing rubber, and fix the electric components to both surfaces of the substrate.

The pressure bonding apparatus of the present invention includes first and second pressing rubbers, and is configured to be capable of pressing an object to be pressure bonded, which is disposed between the first and second pressing rubbers and has electric components disposed on both surfaces of a substrate, with the first and second pressing rubbers, and is characterized in that: a dam member is disposed around the first pressing rubber so as to surround the first pressing rubber, the object to be pressure-bonded, and the second pressing rubber when pressure-bonding is performed, and the dam member blocks expansion of the first and second pressing rubbers in a horizontal direction, the first pressing rubber is disposed on a first pressing plate, a first compression member capable of compression deformation is disposed between the first pressing rubber and the first pressing plate, a height of the dam member is configured to be higher than a surface height of the first pressing rubber at least when the first compression member is compressed, and the second pressing rubber is configured to be insertable into a space surrounded by the dam member.

The pressure bonding apparatus of the present invention includes first and third pressing rubbers, and is configured to be capable of pressing an object to be pressure bonded, which is disposed between the first and third pressing rubbers and has an electric component disposed on both surfaces of a substrate, with the first and third pressing rubbers, and is characterized in that: dam members are disposed around the first and third pressing rubbers, the dam members having a height greater than a surface height of the first and third pressing rubbers and surrounding a periphery of the first pressing rubber, a periphery of the object to be pressure-bonded, and a periphery of the third pressing rubber when pressure-bonding is performed so as to block expansion of the first and third pressing rubbers in a horizontal direction, and the first and third pressing rubbers press the object to be pressure-bonded while the dam members surround a periphery of the first pressing rubber, a periphery of the object to be pressure-bonded, and a periphery of the third pressing rubber, and fix the electric components to both surfaces of the substrate.

The pressure bonding apparatus of the present invention includes first and third pressing rubbers, and is configured to be capable of pressing an object to be pressure bonded, which is disposed between the first and third pressing rubbers and has an electric component disposed on both surfaces of a substrate, with the first and third pressing rubbers, and is characterized in that: dam members are disposed around the first and third pressing rubbers so as to surround the first pressing rubber, the object to be pressure-bonded, and the third pressing rubber when pressure-bonding is performed, respectively, so as to block expansion of the first and third pressing rubbers in the horizontal direction, the first pressing rubber is disposed on a first pressing plate, a first compression member capable of compressive deformation is disposed between the first pressing rubber and the first pressing plate, and the dam members are configured so that the height of the dam members is higher than the surface height of the first pressing rubber at least when the first compression member is compressed.

The pressure bonding apparatus of the present invention includes fourth and fifth pressing rubbers, and is configured to be capable of pressing an object to be pressure bonded, which is disposed between the fourth and fifth pressing rubbers and has an electric component disposed on both surfaces of a substrate, with the fourth and fifth pressing rubbers, and is characterized in that: the pressing device includes a dam member that surrounds the peripheries of the fourth and fifth pressing rubbers and surrounds the periphery of the fourth pressing rubber, the periphery of the object to be pressed, and the periphery of the fifth pressing rubber when the pressing is performed so as to block expansion of the fourth and fifth pressing rubbers in the horizontal direction, wherein the dam member is configured to be separable from the fourth and fifth pressing rubbers, and the fourth and fifth pressing rubbers press the object to be pressed while the dam member surrounds the periphery of the fourth pressing rubber, the periphery of the object to be pressed, and the periphery of the fifth pressing rubber, thereby fixing the electric components to both surfaces of the substrate.

ADVANTAGEOUS EFFECTS OF INVENTION

Since the electrical components can be connected to the front and back surfaces of the substrate at the same time, the time required for the mounting process is shortened, and damage to the electrical components due to heating and pressing is reduced. Since the electric component does not move horizontally not only on the front surface but also on the back surface of the substrate, and a displacement of the electric component does not occur, an electric device with high reliability can be obtained. When the pressing rubber is not spread horizontally when pressing the object to be pressure-bonded, most of the force for deforming the pressing rubber becomes the force for pressing the object to be pressure-bonded, and therefore the pressing force during pressing is not wasted.

Drawings

Fig. 1 is a sectional view illustrating a first example of the pressure bonding apparatus.

Fig. 2 is a plan view illustrating the shapes of the pressing head and the pedestal.

Fig. 3(a) to (c) are sectional views illustrating a process of mounting an electrical component on a substrate.

Fig. 4(a) and (b) are enlarged sectional views illustrating a process of connecting an electrical component to a substrate.

Fig. 5(a) to (c) are sectional views illustrating a process of mounting an electric component using the pressure bonding apparatus of the second example.

Fig. 6 is a sectional view illustrating another example of the compression member.

Fig. 7 is a sectional view illustrating a third example of the crimping apparatus.

Fig. 8(a) to (c) are sectional views illustrating a process of mounting an electric component on a substrate.

Fig. 9(a) to (c) are sectional views illustrating a process of mounting an electrical component on a substrate using the pressure bonding apparatus of the fourth example.

Fig. 10(a) is a sectional view showing a state where the dam member is separated from the fourth and fifth pressing rubbers, and (b) is a sectional view showing a state where the dam member surrounds the fourth and fifth pressing rubbers.

Fig. 11 is a plan view illustrating an example of the dam member.

Fig. 12 is a plan view illustrating another example of the dam member.

Fig. 13 is a side view illustrating a state where the dam member is provided with notches.

Fig. 14(a) and (b) are sectional views illustrating a conventional crimping device.

Fig. 15 is a plan view illustrating expansion of the pressing rubber.

Description of the reference numerals

1. 4, 6 ~ 8

Protection film

12

15

A first dam member

A second pressing plate

A second pressing rubber

66.

30

A substrate

35

32. Electric component

Detailed Description

Reference numeral 1 in fig. 1 denotes a pressure bonding apparatus according to a first example of the present invention, and the pressure bonding apparatus 1 includes: first and second pressing heads 10 and 20, a table 9, and a driving device 2. The first pressing head 10 includes: a head body 11 made of metal, a hole 19 formed in the head body 11 and having a bottom, and a first pressing rubber 15 disposed in the hole 19.

The cross-sectional shape of the first pressing rubber 15 when cut in the horizontal direction is substantially the same as the cross-sectional shape of the region surrounded by the first dam member 16, and the bottom surface thereof is in close contact with and fixed to the bottom surface of the hole 19, and the side surface thereof is in contact with the side wall of the hole 19.

The height from the bottom surface to the surface of the first pressing rubber 15 is smaller than the depth of the hole 19, the periphery of the first pressing rubber 15 is surrounded by the first dam member 16 formed by the side wall of the hole 19, and a recess 17 having the surface of the first pressing rubber 15 as the bottom surface and the first dam member 16 as the side surface is formed between the surface of the first pressing rubber 15 and the tip of the first dam member 16.

The first pressing head 10 is disposed such that the opening 18 of the concave portion 17 faces downward and the surface of the first pressing rubber 15 is substantially horizontal.

In the first head body 11, a portion in close contact with the bottom surface of the first pressing rubber 15 is a first pressing plate 12, the first pressing plate 12 is attached to the driving device 2 via the shaft 3, and when the driving device 2 is operated to extend and contract the shaft 3, the first pressing plate 12 moves vertically together with the first pressing rubber 15 and the first dam member 16 while keeping the surface of the first pressing rubber 15 in a substantially horizontal state.

A table 9 is disposed at a position directly below the first pressing head 10, and a second pressing head 20 is disposed on the table 9.

The second pressing head 20 includes: in the second pressing head 20, a second head main body 21 formed of a metal pressing plate and a second pressing rubber 25 arranged on the surface of the second head main body 21 are in close contact with the table 9 on the surface on the second head main body 21 side, and the surface on the second pressing rubber 25 side faces upward. Therefore, the surface of the second pressing rubber 25 is exposed on the upper surface of the second pressing head 20.

Here, there is no arrangement around the second pressing rubber 25, the planar shape of the second pressing rubber 25 is made to be the same as or a similar shape smaller than the opening 18 of the concave portion 17 (fig. 2), and at least the upper end of the second pressing rubber 25 can be inserted into the concave portion 17 in the second pressing head 20.

Next, a pressure-bonding object which can be pressure-bonded by the pressure-bonding apparatus 1and a process of pressure-bonding the pressure-bonding object 30 will be described.

Reference numeral 30 in fig. 4(a) denotes an object to be pressure-bonded, and the object to be pressure-bonded 30 includes: a substrate 31, an adhesive film 35, and electrical components 32, 33.

Terminals 37 are formed on the front and rear surfaces of the substrate 31, respectively, and the adhesive films 35 are disposed on the terminals 37 on the front surface of the substrate 31 and on the terminals 37 on the rear surface of the substrate 31, respectively.

The electric components 32 and 33 have terminals 38 and 39 such as bumps (bump) and pads (1and), and after the terminals 38 and 39 are aligned so as to be positioned on the terminals 37 of the substrate 31, the electric components 32 and 33 are placed on the adhesive film 35 by a mounting head (not shown), and are pressed by the mounting head with a small pressure while being heated at a low temperature, and are temporarily bonded (temporarily bonded) to the front and back surfaces of the substrate 31 by an adhesive force exerted from the adhesive film 35.

However, the adhesive force is weak, the electric components 32 and 33 are easily detached from the substrate 31 by physical impact, the terminal 37 of the substrate 31 is not in physical contact with the terminals 38 and 39 of the electric components 32 and 33, nor is it in mechanical contact, and the adhesive film 35 is present between the terminals 37, 38, and 39.

The adhesive film 35 is formed to be larger than the planar shape of the electric components 32 and 33, and a part thereof protrudes from the electric components 32 and 33 and is exposed between the electric components 32 and 33. Even when the adhesive film 35 is not exposed from the electrical components 32 and 33, a part of the adhesive film 35 is exposed from the outer peripheries of the electrical components 32 and 33 by pressing at the time of pressing described later.

The first and second pressing rubbers 15 and 25 are made of a material capable of adhering to the adhesive film 35, and in order to prevent the second pressing rubber 25 from contacting the adhesive film 35, the protective film 5 having low adhesiveness to the adhesive film 35 is disposed on the surface of the second pressing rubber 25, and then the object 30 to be pressure-bonded is disposed on the second pressing rubber 25 with the surface of the substrate 31 facing up and the back facing down (fig. 3 (a)).

Here, the surface of the second pressing rubber 25 is made horizontal, and the film thickness of the protective film 5 is uniform. Therefore, the portion on the second pressing rubber 25 on the surface of the protective film 5 is substantially horizontal.

The electrical components 32 and 33 having different thicknesses are bonded to the back surface of the substrate 31, and a plurality of the thickest electrical components 32 are arranged on the back surface of the substrate 31 so as to be spaced apart from each other, or if not, an auxiliary member for supporting the substrate 31 is arranged on the second pressing rubber 25, and the substrate 31 is held by the electrical components 32 and the auxiliary member, thereby being substantially horizontal.

Next, in order to prevent the first pressing rubber 15 from contacting the adhesive film 35, the protective film 5 is also disposed on the object 30 to be pressure bonded, and the front surface and the back surface of the object 30 to be pressure bonded are covered with the protective films 5, respectively.

When the protective film 5 is wider than the planar shape of the second pressing rubber 25 and the protective film 5 on the object 30 to be pressure-bonded hang down to the side of the second pressing rubber 25, the planar shape of the second pressing rubber 25 is made smaller than the opening 18 of the recess 17, and the outer shape of the second pressing rubber 25 including the hanging protective film 5 becomes substantially equal to the size of the opening 18.

The planar shape of the object 30 to be pressure-bonded is the same as or smaller than the planar shape of the second pressing rubber 25, the object 30 to be pressure-bonded is placed so that the outer periphery thereof does not protrude from the second pressing rubber 25, the orientations of the first and second pressing heads 10, 20 are aligned, the outer periphery of the second pressing rubber 25 including the protective film 5 is aligned with the opening 18, and then the object 30 to be pressure-bonded is inserted into the recess 17 of the first pressing head 10 when the first pressing head 10 is lowered.

When the total of the thickness of the electrical component 32 that is the thickest on the front surface of the substrate 31, the thickness of the electrical component 32 that is the thickest on the back surface of the substrate 31, and the thickness of the substrate 31 is set as the thickness of the object 30 to be pressure bonded, the depth of the concave portion 17, that is, the height from the front surface of the first pressing rubber 15 at the tip of the first dam member 33 is the same as or greater than the total of the thickness of the object 30 to be pressure bonded and the thickness of the protective film 5 that covers the front and back surfaces thereof, and the entire object 30 to be pressure bonded is housed in the concave portion 17 from the front surface to the back surface.

When the depth of the recess 17 is larger than the sum of the thickness of the object to be pressure-bonded 30 and the thickness of the protective film 5, the first pressing head 10 is lowered after the object to be pressure-bonded 8 is accommodated in the recess 17, and as described above, the outer shape of the second pressing rubber 25 including the protective film 5 becomes substantially equal to the size of the opening 18, so that the tip of the first dam member 16 is not pressed by the surface of the second pressing rubber 25, and the lowering of the first pressing head 10 is not stopped.

Further, the protective film 5 is made of a material that can be compressed and deformed, and even when the outer shape of the second pressing rubber 25 including the protective film 5 is slightly larger than the opening 18, the protective film 5 is compressed and deformed and enters the gap between the second pressing rubber 25 and the first dam member 16, so that the lowering of the first pressing head 10 is not stopped.

When the first pressing head 10 continues to descend, the object 30 to be pressed approaches the first pressing rubber 15 relatively.

When a plurality of types of electrical components 32 and 33 having different thicknesses are bonded to the surface of the substrate 31, a step is formed on the surface of the substrate 31 due to the difference in thickness. Here, the surface of the first pressing rubber 15 is made substantially horizontal, and since the first pressing head 10 is lowered in the vertical direction, when the lowering of the first pressing head 10 is continued, the surface of the first pressing rubber 15 is brought into contact with the thickest electrical component 32 of the electrical components 32 and 33 bonded to the surface of the substrate 31 via the protective film 5.

Fig. 3(b) shows a state where the first pressing rubber 15 is in contact with only the thickest electric component 32 before pressing the electric components 32 and 33 on the surface of the substrate 31, and since the depth of the concave portion 17 is the same as or above the thickness of the object 30 to be pressure-bonded including the protective film 5, the tip of the first dam member 16 is the same as or below the plane H on which the surface of the second pressing rubber 25 is located in a state where the first pressing rubber 15 is in contact with the thickest electric component 32.

The first and second pressing rubbers 15 and 25 are made of an elastic material (for example, an elastic body) that deforms when a force is applied and returns to its original shape when the force is removed, and the side surface of the first pressing rubber 15 is not fixed to the inner wall of the hole 19 although it is in contact with the inner wall, and the second pressing rubber 25 is not disposed at all around, so that the first and second pressing rubbers 15 and 25 can be deformed not only at the center portion thereof but also at the edge portions thereof.

Therefore, if the first pressing head 10 is lowered from the state shown in fig. 3(b) and the object 30 to be pressure-bonded is pressed by the first and second pressing rubbers 15 and 25, the portions of the first and second pressing rubbers 15 and 25 that contact the electrical component 32 are recessed, regardless of the edge portion or the central portion.

When the first pressing head 10 is further lowered to bring the first and second pressing rubbers 15 and 25 relatively closer to each other, the first and second pressing rubbers 15 and 25 sequentially press the electric components 32 having a relatively large thickness toward the electric components 33 having a relatively small thickness, and as a result, all the electric components 32 and 33 are pressed toward the substrate 31.

The first and second pressing rubbers 15 and 25 are made of a material in which a portion to which a force is applied is depressed and the other portion is expanded, such as an elastic material having a uniform inside, and a portion of the first pressing rubber 15 that is not in contact with the electrical components 32 and 33 is expanded downward, and a portion of the second pressing rubber 25 that is not in contact with the electrical components 32 and 33 is expanded upward.

Since the first and second pressing rubbers 15 and 25 are relatively close to each other before the deformation, even in the case where the surface of the second pressing rubber 25 before the deformation is on the same plane as the front end of the first dam member 16, after the deformation, at least the surface portion of the second pressing rubber 25 is accommodated in the recess 17, and the side surface of the portion accommodated in the recess 17 is surrounded by the first dam member 16.

The side surface is in close contact with the first dam member 16, or even if there is a gap between the side surface and the first dam member 16, the gap is narrowed to such an extent that the expanded first pressing rubber 15 does not flow out, and the first pressing rubber 15 does not spread horizontally. Further, since the gap is narrow, even if the portion of the second pressing rubber 25 accommodated in the concave portion 17 is expanded in the horizontal direction, the expansion is small enough to be ignored.

As described above, since the side surfaces of the portions of the second pressing rubber 25 accommodated in the concave portions 17 are in close contact with the first dam member 16 to such an extent that the first and second pressing rubbers 15 and 25 do not spread in the horizontal direction, even when the expanded portions of the first and second pressing rubbers 15 and 25 are filled in the concave portions between the electrical components 32 and 33, the expanded portions do not flow in the horizontal direction, that is, in the direction orthogonal to the moving direction of the first pressing head 10.

Since the surface portions of the first and second pressing rubbers 15 and 25 do not spread horizontally, a force spreading outward is not applied to the electric components 32 and 33, and the electric components 32 and 33 are pressed against the adhesive film 35 at the same position as in the temporary pressure bonding.

Here, the second head main body 21 incorporates a heater 28, and the object 30 to be pressure-bonded is heated to a predetermined temperature by energization of the heater 28, whereby the adhesive film 35 has high fluidity by heating.

Therefore, when the electric components 32 and 33 are pressed against the adhesive film 35, the adhesive film 35 is pressed back, the terminals of the electric components 32 and 33 are sunk into the adhesive film 35, the terminals 38 and 39 of the electric components 32 and 33 are brought into direct contact with the terminals 37 of the substrate 31, and the electric components 32 and 33 are electrically connected to the substrate 31.

When the adhesive film 35 contains a thermosetting resin, the adhesive film 35 is cured by heating, and when the adhesive film 35 contains a thermoplastic resin, the adhesive film 35 is cured when the temperature is lowered after the heating is completed.

Accordingly, the electric components 32 and 33 are mechanically connected to the substrate 31 via the cured adhesive film 35, thereby obtaining the electric device 30a (fig. 3 (c)).

When the positional deviation occurs when the electrical components 32 and 33 are pressed, the terminals 38 and 39 of the electrical components 32 and 33 do not come into contact with the terminals 37 of the substrate 31, and therefore the reliability of the electrical device 30a is lowered, but when the pressure bonding device 1 of the present invention is used, the positional deviation of the electrical components 32 and 33 does not occur as described above, and therefore the reliability of the electrical device 30a manufactured by using the pressure bonding device 1 of the present invention is high.

Since the protective film 5 is positioned between the first pressing rubber 15 and the object 30 to be pressure-bonded, and between the second pressing rubber 25 and the object 30 to be pressure-bonded, even if the adhesive film 35 overflows from the outer periphery of the electric components 32, 33 when the electric components 32, 33 are pressed, the first and second pressing rubbers 15, 25 do not directly contact the adhesive film 35.

Therefore, the first and second pressing rubbers 15 and 25 are not adhered to the adhesive film 35, and when the first pressing head 10 is moved upward, the first pressing rubber 15 is separated from the electrical device 30a, and when the electrical device 30a is lifted, the electrical device 30a is separated from the second pressing rubber 25, and the electrical device 30a can be taken out from the pressure bonding apparatus 1.

The above description has been made of the case where the object 30 to be pressure-bonded is accommodated in the concave portion 17 formed in advance in the pressing head 10, and then the first pressing rubber 15 is brought into contact with the object 30 to be pressure-bonded.

Reference numeral 4 in fig. 5(a) denotes a pressure bonding apparatus according to a second example of the present invention, and this pressure bonding apparatus 4 has the same configuration as the pressure bonding apparatus 1 according to the first example except that a first compression member 46 is disposed between a first pressing rubber 15 and a first pressing plate 12, and the arrangement of the first and second pressure bonding heads 10 and 20 is also the same.

The first pressing rubber 15 is made of the above-described elastic material having uniform inside, whereas the first compression member 46 is made of a material having a void inside, such as sponge rubber, and the void is crushed and reduced in volume when a force is applied.

A movable plate 47 is disposed between the first pressing rubber 15 and the first compression member 46, the first compression member 46 has an upper end attached to the surface of the first pressing plate 12, a lower end attached to the surface of the movable plate 47, and the first pressing rubber 15 has an upper end attached to the rear surface of the movable plate 47. Therefore, the first compression member 46, the movable plate 47, and the first pressing rubber 15 are arranged in the stated order from the first pressing plate 12 toward the vertically lower side.

The first compression member 46 has a cross-sectional shape when cut in the horizontal direction, which is the same as the cross-sectional shape of the region surrounded by the first dam member 16, and the side surface of the first compression member 46 is in contact with the first dam member 16, similarly to the first pressing rubber 15.

However, the side surface of the first compression member 46 is not fixed to the first dam member 16, and further, neither the first pressing rubber 15 nor the movable plate 47 is fixed to the first dam member 16. Therefore, the first pressing rubber 15 and the movable plate 47 are configured to be movable within the area surrounded by the first dam member 16 when the thickness of the first compression member 46 is changed.

When an electric device is manufactured using this pressure bonding apparatus 4, as in the case of using the pressure bonding apparatus 1 of the first example, the object 30 to be pressure bonded is disposed on the second pressing rubber 25 via the protective film 5, and the first pressing rubber 15 is brought into contact with the thickest electric component 32 via the protective film 5.

The force required to deform the first compression member 46 is smaller than the force required to deform the first and second pressing rubbers 15 and 25, and if the first pressing head 10 is further lowered, when the first pressing plate 12 is pressed against the first compression member 46, the first compression member 46 is compressed before the first and second pressing rubbers 15 and 25 are deformed, and the thickness thereof is reduced.

As described above, since the first pressing rubber 15 is configured to be movable in the region surrounded by the first dam member 16, when the thickness of the first compression member 46 is reduced, the first pressing rubber 15 moves upward, a recess that does not exist before the first compression member 46 is compressed appears, and the object 30 to be pressure-bonded is accommodated in the recess.

Since the amount of deformation of the first compression member 46 is limited, the compression is stopped when the first compression member 46 is deformed to some extent.

Fig. 5(b) shows a state before the first and second pressing rubbers 15, 25 are deformed in a state where the compression of the first compression member 46 is stopped, and in this state, the tip of the first dam member 16 protrudes downward beyond the surface of the first pressing rubber 15 by the amount by which the first pressing rubber 15 moves upward, and the tip thereof is the same as the plane H on which the surface of the second pressing rubber 25 is located, or protrudes downward beyond the plane H.

When the first pressing head 10 is further lowered after the deformation of the first compression member 46 is stopped, the first and second pressing rubbers 15 and 25 are pressed by the electric components 32 and 33 to be depressed, and the portions thereof not in contact with the electric components 32 and 33 are expanded, but the surface of the first pressing rubber 15 is not expanded in the horizontal direction because the gap between the second pressing rubber 25 and the first dam member 16 is small, as in the case of the pressure bonding device 1 of the first example.

Further, since at least the surface portion of the second pressing rubber 25 is accommodated in the concave portion 17 by the deformation of the first and second pressing rubbers 15 and 25, the second pressing rubber 25 does not spread in the horizontal direction even if the surface thereof swells upward. Therefore, in the pressure bonding device 4, the electric components 32 and 33 do not move in the horizontal direction, and the electric device 30a with high reliability can be obtained.

The first compression member 46 is not particularly limited as long as it is a member whose volume is reduced by pressing, and may be configured by a spring 48 as shown in fig. 6, and when the spring 48 is contracted by pressing with the first pressing plate 12 and its length is shortened, the surface of the first pressing rubber 15 is pushed up and a concave portion appears. Further, the movable plate 47 need not be particularly provided as long as the force applied to the first pressing rubber 15 can be transmitted to the first compression member 46.

As described above, the first pressing plate 12 is attached to the shaft 3 of the driving device 2, the first pressing head 10 is moved, and the first and second pressing rubbers 15 and 25 are relatively brought close to each other, but the present invention is not limited to this, and the second pressing head 20 may be moved or both the first and second pressing heads 10 and 20 may be moved in a state where the first pressing head 10 is stationary as long as the first and second pressing rubbers 15 and 25 are relatively movable.

The above description has been made of the case where the object 30 to be pressure-bonded is disposed on the surface of the second pressing rubber 25 and the first pressing head 10 is lowered, but the present invention is not limited to this.

The surface of the second pressing head 20 on which the second pressing rubber 25 is disposed may be disposed facing downward, the first pressing head 10 may be disposed such that the surface on which the concave portion 17 is formed at a position below the second pressing head 20 faces upward, the object 30 to be pressure-bonded may be disposed on the bottom surface of the concave portion 17, that is, the surface of the first pressing rubber 15, and one or both of the first and second pressing heads 10 and 20 may be moved to bring the first and second pressing rubbers 15 and 25 into relative proximity to each other, thereby pressing the surface of the second pressing rubber 25 against the object 30 to be pressure-bonded.

The orientation of the surfaces of the first and second pressing rubbers 15 and 25 is not limited to the horizontal, and the first and second pressing heads 10 and 20 may be arranged so that the surfaces of the first and second pressing rubbers 15 and 25 are substantially perpendicular to each other.

Although the moving direction of the first and second pressing heads 10 and 20 is not particularly limited, it is preferable to move substantially perpendicularly to the front and rear surfaces of the substrate 31 in order to prevent displacement of the electrical components 32 and 33, and therefore, when the substrate 31 is parallel to the surfaces of the first and second pressing rubbers 15 and 25, the moving direction of the first and second pressing heads 10 and 20 is substantially perpendicular to the surfaces of the first and second pressing rubbers 15 and 25.

Although the case where the second pressing rubber 25 is not disposed around the periphery thereof and the side surface thereof is exposed has been described above, the present invention is not limited to this, and the side surface of the second pressing rubber 25 may be covered with, for example, a metal thin plate (sliding plate) so that the second pressing rubber 25 is not rubbed by the first dam member 16.

When the side surface of the second pressing rubber 25 is covered with the sliding plate, the sliding plate is in close contact with the first dam member 16 when the second pressing head 20 is accommodated in the concave portion 17, or even if there is a gap between the sliding plate and the first dam member 16, the gap is so narrow that the expanded first pressing rubber 15 does not flow out, and therefore the first pressing rubber 15 does not spread in the horizontal direction.

The film thickness of the slide plate is small, and even if it deforms together with the second pressing rubber 25, its deformation stops in contact with the first dam member 16. Since the gap between the first dam member 16 and the slide plate before deformation is small, the amount of deformation is small, and therefore the horizontal expansion of the second pressing rubber 25 is small enough to be ignored.

In addition, even if the surface edge portion of the second pressing rubber 25 is expanded and then passes over the slide plate, since the film thickness of the slide plate is small, as described above, the gap between the slide plate and the first dam member 16 is small, and thus the amount of expansion in the horizontal direction of the portion passing over the slide plate is small.

In this way, the first and second pressing rubbers 15 and 25 do not spread horizontally, and the spread amount is negligibly small even if they spread, so that the displacement of the electric components 32 and 33 is unlikely to occur.

In the pressure bonding devices 1and 4 of the first and second examples, when the gap between the first dam member 16 and the second pressing rubber 25 is large, the gap is filled with the protective film 5 as long as the side surface of the second pressing rubber 25 is covered with the protective film 5.

Therefore, even in the case where the first dam member 16 is manufactured at a low cost without using a die or the like and the accuracy of the forming is low, by appropriately selecting the film thickness of the protective film 5 so that the gap between the first dam member 16 and the second pressing rubber 25 is filled, the first pressing rubber 15 does not flow out from the gap.

Although the case where the dam member is provided only on the first pressing head 10 has been described above, the present invention is not limited thereto.

Reference numeral 6 in fig. 7 denotes a pressure bonding apparatus according to a third example of the present invention, and the pressure bonding apparatus 6 includes a third pressing head 60 in addition to the first pressing head 10.

The first and third pressing heads 10 and 60 have the same structure, and each of the first and third pressing heads 10 and 60 includes: first and third head bodies 11, 61; bottomed holes (first and third holes) 19 and 69 provided in the first and third head bodies 11 and 61; and first and third pressing rubbers 15 and 65 disposed in the first and third holes 19 and 69.

The first and third pressing rubbers 15 and 65 are similarly arranged, the first and third pressing rubbers 15 and 65 are surrounded by first and third dam members 16 and 66 formed by the side walls of the first and third holes 19 and 69, respectively, and the tips of the first and third dam members 16 and 66 protrude higher from the surfaces of the first and third pressing rubbers 15 and 65, and first and third concave portions 17 and 67 are formed with the surfaces of the first and third pressing rubbers 15 and 65 as the bottom surfaces and the first and third dam members 16 and 66 as the side surfaces.

The openings 18, 68 of the first and third holes 19, 69 are substantially equal in shape, and when the first and third pressing heads 10, 60 are pressed against each other with the edges of the openings 18, 68 aligned in a manner such that the edges are coincident, the front ends of the first and third dam members 16, 66 become in contact with each other.

Here, the arrangement of the first pressing head 10 and the connection to the driving device 2 are similar to those of the first pressing head 10 of the pressure bonding device 1 of the first example, and the first pressing head 10 can move the table 9 vertically by the driving device 2 while keeping the surface of the first pressing rubber 15 oriented in a substantially horizontal direction.

In the third pressing head 60, the opening 68 of the third recess 67 is disposed on the table 9 so as to face upward, and the bottom surface of the third recess 67, i.e., the surface of the third pressing rubber 65, which is a placement surface on which the object 30 to be pressure-bonded is placed, is made substantially horizontal.

Next, a case where the object to be pressure-bonded 30 is connected by using the pressure-bonding apparatus 6 will be described.

The first and third pressing rubbers 15 and 65 are made of a material having high adhesiveness to the adhesive film 35, and in order to avoid contact with the adhesive film 35, the protective film 5 is disposed on the surface of the third pressing rubber 65, the object 30 to be pressure-bonded is disposed on the third pressing rubber 65, and the protective film 5 is further disposed on the surface of the object 30 to be pressure-bonded (fig. 8 (a)).

The total of the depths of the first and third recessed portions 17 and 67, that is, the total of the height from the surface of the first pressing rubber 15 to the tip of the first dam member 16 and the height from the surface of the third pressing rubber 65 to the tip of the third dam member 66 is made smaller than the total of the thickness of the object 30 to be pressure-bonded and the thickness of the protective film 5 covering the front and rear surfaces thereof.

Therefore, when the edges of the openings 18 and 68 of the first and third concave portions 17 and 67 are aligned and the first pressing head 10 is lowered, the surface of the first pressing rubber 15 contacts the object 30 to be pressure-bonded via the protective film 5 before the front ends of the first and third dam members 16 and 66 contact each other.

Fig. 8(b) shows a state before the first and third pressing rubbers 15 and 65 press the object 30 in a state where the first pressing rubber 15 is in contact with the surface of the object 30 via the protective film 5, and a gap is present between the tip of the first dam member 16 and the tip of the third dam member 66.

When the first and third pressing plates 12 and 62 are provided as the portions of the first and third head bodies 11 and 61 that are in close contact with the bottom surfaces of the first and third pressing rubbers 15 and 65, the bottom surfaces of the first and third pressing rubbers 15 and 65 are fixed to the first and third pressing plates 12 and 62, respectively, but the side surfaces thereof are not fixed to the first and third dam members 16 and 66, and the first and third pressing rubbers 15 and 65 are configured such that the central portions and the edge portions thereof are deformable.

Therefore, when the first pressing head 10 is further lowered and the first and third pressing rubbers 15 and 65 are relatively brought close to each other, the first and third pressing rubbers 15 and 65 are sequentially pressed from the thick electric component 32 to the thin electric component 33, and the portions of the first and third pressing rubbers 15 and 65 that do not contact the electric components 32 and 33 expand, thereby pressing the object 30 to be pressure-bonded, as in the case of the pressure bonding apparatus 1 of the first example.

The pressure at which the object 30 is pressed is set according to the thickness of the adhesive film 35, the electric components 32 and 33, and the heating temperature of the adhesive film 35.

The sum of the depths of the first and third concave portions 17 and 67 is set to a depth at which the tips of the first and third dam members 16 and 66 do not directly contact each other even when the first and third pressing rubbers 15 and 65 are deformed when the object 30 to be pressure-bonded is pressed at a set pressure, and therefore, the first pressing head 10 is lowered while the deformation of the first and third pressing rubbers 15 and 65 continues, and the force for lowering the first pressing head 10 becomes the force for pressing the object 30 to be pressure-bonded after the deformation of the first and third pressing rubbers 15 and 65 is stopped (fig. 8 (c)).

Even if the edge portions of the protective film 5 protrude from the openings 18 and 68 and the leading ends of the first and third dam members 16 and 66 contact each other with the protruding protective film 5 interposed therebetween, the pressing against the object 30 to be pressure-bonded can be maintained by the compressive deformation of the protective film 5 as long as the protective film 5 is made of a material that can be compressively deformed as described above.

When the object 30 to be pressure-bonded is pressed, the surfaces of the first and third pressing rubbers 15 and 65 expand, but the front ends of the first and third dam members 16 and 66 protrude from the surfaces of the first and third pressing rubbers 15 and 65, so that the expanded portions of the surfaces of the first and third pressing rubbers 15 and 65 are blocked by the first and third dam members 16 and 66. Therefore, in the pressure bonding device 6, the surfaces of the first and third pressing rubbers 15 and 65 do not spread horizontally, and the electrical components 32 and 33 do not shift.

As in the case of the pressure bonding apparatus 1 of the first example, the heating means is provided on one or both of the first and third pressing heads 10 and 60, and the object 30 to be pressure bonded is pressed while heating, whereby the electric components 32 and 33 are not only electrically but also mechanically connected to the substrate 31, and the electric apparatus 30a can be obtained.

The case where the first and third concave portions 17 and 67 are formed before the first and third pressing rubbers 15 and 65 are deformed has been described above, but the present invention is not limited to this.

Reference numeral 7 in fig. 9(a) denotes a crimping apparatus according to a fourth example of the present invention. The pressure bonding apparatus 7 has the same configuration as the pressure bonding apparatus 6 of the third example except that the first and third compression members 46 and 76 are disposed between the first and third pressing plates 12 and 62 and the first and third pressing rubbers 15 and 65, and the first and third pressing heads 10 and 60 are also disposed in the same manner as the pressure bonding apparatus 6 of the third example.

The first and third compression members 46, 76 have the same configuration and arrangement as the first compression member 46 of the crimping apparatus 4 of the second example, and when the object 30 to be crimped is sandwiched between the first and third pressing rubbers 15, 65, the first and third compression members 46, 76 are compressed and reduced in film thickness before the first and third pressing rubbers 15, 65 are deformed, and the first and third pressing rubbers 15, 65 are pressed by the first and third pressing plates 12, 62 and move together with the movable plates 44, 77 within the holes 19, 69.

Fig. 9(b) shows a state before the first and third pressing rubbers 15, 65 are deformed in a state where the film thicknesses of the first and third compression members 46, 76 are reduced, and recesses having the surfaces of the first and third pressing rubbers 15, 65 as the bottom surfaces and the first and third dam members 16, 66 as the side walls are formed by the first and third pressing rubbers 15, 65 approaching the first and third pressing plates 12, 62, respectively.

The total depth of the concave portions at this time, that is, the total of the height from the surface of the first pressing rubber 15 to the tip of the first dam member 16 and the height from the surface of the third pressing rubber 65 to the tip of the third dam member 66 when the first and third compression members 46 and 76 are compressed is smaller than the thickness of the object 30 to be pressure bonded including the protective film 5 on the surface of the third pressing rubber 65 and the protective film 5 on the surface of the object 30 to be pressure bonded.

When the first and third compression members 46 and 76 are compressed, the tips of the first and third dam members 16 and 66 do not contact and do not interfere with the lowering of the first pressing head 10, and therefore, when the first pressing head 10 is further lowered, the first and third pressing rubbers 15 and 65 approach each other relatively, and the portions of the first and third pressing rubbers 15 and 65 that contact the electrical components 32 are recessed, with the result that all the electrical components 32 and 33 are pressed by the first and third pressing rubbers 15 and 65.

Since the total depth of the concave portions is set so that the tips of the first and third dam members 16 and 66 do not contact each other and a predetermined pressure is applied to the object 30 to be pressure-bonded, the electric components 32 and 33 are connected to the substrate 31 to obtain the electric device 30a as in the case of using the pressure bonding device 1 of the first example as long as the object 30 to be pressure-bonded is continuously pressed while being heated.

When the first and third pressing rubbers 15 and 65 are used to press the electrical components 32 and 33, the portions of the first and third pressing rubbers 15 and 65 that are not in contact with the electrical components 32 and 33 swell, but when the electrical components 32 and 33 are pressed, the first and third dam members 16 and 66 protrude from the surfaces of the first and third pressing rubbers 15 and 65, and therefore the first and third pressing rubbers 15 and 65 are blocked by the first and third dam members 16 and 66 and do not spread horizontally. Therefore, even when the pressure bonding apparatus 7 is used, the electric components 32 and 33 are not displaced, and the electric apparatus 30a with high reliability can be obtained.

The above description has been made of the case where at least the periphery of the first pressing rubber 15 is surrounded in advance by the first dam member 16, but the present invention is not limited to this.

Reference numeral 8 in fig. 10(a) denotes a fifth example crimping apparatus, and this crimping apparatus 8 has fourth and fifth pressing heads 80, 90 and a dam member 86.

The fourth and fifth pressing heads 80 and 90 have: the fourth and fifth pressing plates 82 and 92 are made of metal, and the fourth and fifth pressing rubbers 85 and 95 are disposed on the surfaces of the fourth and fifth pressing plates 82 and 92, and here, no arrangement is made around the fourth and fifth pressing rubbers 85 and 95, and the side surfaces of the fourth and fifth pressing rubbers 85 and 95 are exposed.

The planar shapes of the surfaces of the fourth and fifth pressing rubbers 85 and 95 are made to be the same or similar. As shown in fig. 11, the dam member 86 has a cylindrical shape, and the openings at both ends of the cylindrical shape are formed in a similar shape which is the same as or larger than the shape of the surfaces of the fourth and fifth pressing rubbers 85 and 95. Therefore, at least surface portions of the fourth and fifth pressing rubbers 85, 95 can be inserted into the openings of the dam member 86, respectively.

Here, the side surfaces of the fourth and fifth pressing rubbers 85 and 95 are substantially perpendicular to the front surfaces thereof, and the planar shapes of the fourth and fifth pressing rubbers 85 and 95 when cut in a direction parallel to the front surfaces thereof are substantially the same from the front surfaces to the back surfaces.

The dam member 86 has an inner wall surface substantially perpendicular to the opening at both ends, and has a cross-sectional shape substantially the same from one end to the other end when cut parallel to the opening, and the fourth and fifth pressing rubbers 85 and 95 can be inserted into the dam member 86 not only at the surface portion but also at the side surface thereof.

The fourth pressing head 80 is disposed such that the surface on which the fourth pressing rubber 85 is disposed faces downward. A table 9 is disposed below the fourth pressing head 80, and the fifth pressing head 90 is disposed on the table 9 such that a surface on which the fifth pressing rubber 95 is disposed faces upward.

The fourth pressing rubber 85 is inserted into the cylinder from one end of the dam member 86 by a transport unit not shown, and the dam member 86 is attached to the fourth pressing head 80. In this state, the other end of the dam member 86 protrudes downward from the surface of the fourth pressing rubber 85.

A protective film 5 is disposed on the surface of the fifth pressing rubber 95, an object 30 to be pressure-bonded is disposed on the protective film 5, and the protective film 5 is further disposed on the surface of the object 30 to be pressure-bonded. After the outer periphery of the surface of the fifth pressing rubber 95 is aligned so as to be positioned inside the opening of the lower end of the dam member 86, when the dam member 86 is lowered together with the fourth pressing head 80, the object 30 to be pressure-bonded is inserted into the dam member 86, and the fourth pressing rubber 85 is in contact with the object 30 to be pressure-bonded via the protective film 5.

The length of the tube of the dam member 86 is such that, when the fourth pressing rubber 85 is in contact with the object 30 to be pressure bonded, the lower end thereof is flush with the surface of the fifth pressing rubber 95 or protrudes below the surface of the fifth pressing rubber 85, 95 before the fourth and fifth pressing rubbers 85, 95 are deformed, and as in the case of the pressure bonding device 1 of the first example, when the object 30 to be pressure bonded is pressed, the fourth and fifth pressing rubbers 85, 95 do not spread horizontally, so that the electrical components 32, 33 are less likely to be displaced.

Although the case where the dam member 86 is integrally formed in a cylindrical shape has been described above, the present invention is not limited thereto.

Reference numeral 96 in fig. 12 denotes another example of the dam member, and the dam member 96 includes a plurality of plate-shaped wall members 99, and the wall members 99 are arranged along the side surface of the fourth pressing rubber 85 by a moving means not shown in the figure with the surface thereof directed in the vertical direction and attached to the fourth pressing plate 82, thereby forming one cylinder surrounding the periphery of the fourth pressing rubber 85.

In this state, the lower end of each wall member 99 protrudes downward from the surface of the fourth pressing rubber 85, and therefore the lower end of the tube surrounding the fourth pressing rubber 85 also protrudes downward from the surface of the fourth pressing rubber 85, and the object 30 to be pressure-bonded and the fifth pressing rubber 95 can be inserted into the portion protruding downward.

While the dam members 86 and 96 have been described as being attached to the fourth pressing head 80, the present invention is not limited to this, and the dam members 86 and 96 may be disposed so as to surround the periphery of the fifth pressing rubber 95 and have one end projecting upward from the surface of the fifth pressing rubber 95, and in this case, when the fourth pressing head 80 is lowered, the fourth pressing rubber 85 is accommodated in the recess formed by the dam members 86 and 96 and the surface of the fifth pressing rubber 95.

Further, the dam members 86 and 96 may not be mounted on any of the fourth and fifth pressing heads 80 and 90, and may surround the peripheries of the fourth and fifth pressing rubbers 85 and 95 during a period from when the fourth and fifth pressing rubbers 85 and 95 are opposed to each other across the object 30 to when the object 30 is pressed.

Further, the dam members 86 and 96 may be attached to the fourth and fifth pressing rubbers 85 and 95, respectively, and the object 30 to be pressure-bonded may be further pressed. In this case, the dam members 86 and 96 attached to the fourth and fifth pressing rubbers 85 and 95 are preferably configured and arranged in the same manner as the first and third dam members 16 and 66 of the pressure bonding apparatus 6 of the third example.

The length of the tube of the dam members 86, 96 and the arrangement of the dam members 86, 96 are not particularly limited, and when the object 30 to be pressure-bonded is pressed, the entire surface of the fourth and fifth pressing rubbers 85, 95 may be surrounded from the front surface to the back surface thereof, or the fourth and fifth pressing plates 82, 92 may be surrounded not only by the fourth and fifth pressing rubbers 85, 95, as long as at least the surface portions of the fourth and fifth pressing rubbers 85, 95 are surrounded.

In the pressure bonding device 8 of the fifth example, the fourth and fifth pressing rubbers 85 and 95 may be directly attached to the fourth and fifth pressing plates 82 and 92, or a compression member may be provided between the fourth and fifth pressing plates 82 and 92 and the fourth and fifth pressing rubbers 85 and 95 as in the pressure bonding device 7 of the fourth example.

The above description has been made on the case where the entire circumference of the first, third, fifth pressing rubbers 15, 65, 85, 95 is surrounded by the dam members 16, 66, 86, 96, but the present invention is not limited to this, and as long as the horizontal expansion of the first, third, fifth pressing rubbers 15, 65, 85, 95 can be prevented, the dam members 16, 66, 86, 96 may be formed with the notch 98 exposing a part of the side surfaces of the first, third, fifth pressing rubbers 15, 65, 85, 95 as shown in fig. 13.

The shape and size of the protective film 5 are not particularly limited, and the protective film 5 having a size that does not protrude from the surface of the first to fifth pressing rubbers 15, 25, 65, 85, 95 may be used as long as the adhesive film 35 can be prevented from contacting the first to fifth pressing rubbers 15, 25, 65, 85, 95, or the protective film 5 may be used to cover only a part of the surface of the object 30 to be pressure-bonded.

When the adhesive film 35 used has low adhesiveness to the first to fifth pressing rubbers 15, 25, 65, 85, and 95, one or more of the first to fifth pressing rubbers 15, 25, 65, 85, and 95 may be directly brought into contact with the object 30 to be pressure-bonded without using the protective film 5.

As a method of reducing the adhesiveness between the first to fifth pressing rubbers 15, 25, 65, 85, 95 and the adhesive rubber 35, there is a method of changing the constituent materials of the first to fifth pressing rubbers 15, 25, 65, 85, 95 to a material having low adhesiveness to the adhesive film 35, or providing a release layer having a release property from the adhesive film 35 on the surface of the first to fifth pressing rubbers 15, 25, 65, 85, 95.

The position where the heating unit is provided is not particularly limited, and may be provided on one or both of the two pressing heads (the first and second pressing heads 10 and 20, the first and third pressing heads 10 and 60, or the fourth and fifth pressing heads 80 and 90), or may be provided on the table 9 as long as heat conduction is possible. The adhesive film 35 may be heated by infrared radiation from the outside.

The adhesive film 35 may contain only one of a thermoplastic resin and a thermosetting resin, or may contain both of them.

The kind of the thermoplastic resin and the thermosetting resin is not particularly limited, and as the thermosetting resin, one or more kinds of epoxy resin, acrylic resin, urethane (urethane) resin, and the like can be used, and as the thermoplastic resin, one or more kinds of phenoxy (phenoxy) resin, polyvinyl alcohol, and the like can be used.

Instead of the adhesive film 35, a paste-like adhesive may be applied to the surface of the substrate 31, and the object 30 to be pressure-bonded may be formed by bonding an electric component to the adhesive.

Further, the adhesive film 35 having conductive particles dispersed therein may be used to electrically connect the electric components 32 and 33 and the substrate 31 by sandwiching the conductive particles between the connection terminals 37 and 38 of the electric components 32 and 33 and the connection terminal 37 of the substrate 31.

The type of the protective film is not particularly limited, and a film having peelability to the adhesive film 35 is preferable, and for example, a film formed of polytetrafluoroethylene or a film formed of silicone rubber can be used.

The elastic material constituting the first to fifth pressing rubbers 15, 25, 65, 85, 95 is not particularly limited, but an elastic body (elastomer) having a rubber hardness (according to JIS S6050) of 40, 80 may be used, for example.

Rubber hardness was measured by JIS S6050: 2002 "test method 6". This is explained below.

The samples used for the tests were used after 24 hours from the manufacture. General matters common to chemical analysis are referred to JIS K0050. The hardness test was performed using a hardness tester, and the scale was read immediately in positive numbers by bringing the pressing surface into contact with the surface of the test piece held horizontally so that the needle of the tester was vertical. The test piece was measured at 3 equal parts of the entire surface, and one part was measured at each central part, and the hardness of the test piece was defined as the middle value.

The hardness tester is a spring (spring) hardness tester having a hemispherical shape with a indenter having a diameter of 5.08 mm. + -. 0.02 mm. The height of the pressing pin is 2.54 plus or minus 0.22mm when the scale is 0, and 0mm when the scale is 100. The relationship between the scale and the force of the spring is shown in table 1 below.

(Table 1)

Table 1: relationship of scale to spring force

Scale division	0	10	20	25	30	40	50	60	70	75	80	90	100
														Force N of the spring	0.54	1.32	2.11	2.50	2.89	3.68	4.46	5.25	6.03	6.42	6.82	7.60	8.39

Further, for elastomers having rubber hardnesses of 40, 60, and 80, respectively, the rubber hardnesses were measured at 30 ℃ intervals in the range of the measurement temperature of 30 ℃ to 240 ℃, and as a result, the variation in the rubber hardnesses was ± 2. Since this value can be regarded as a measurement error range, it is understood that the rubber hardness is a value not affected by a temperature change.

As the elastic body used for the first to fifth pressing rubbers 15, 25, 65, 85, 95, any of natural rubber and synthetic rubber can be used, but silicone rubber is preferably used from the viewpoint of heat resistance and pressure resistance.

The first to fifth pressing rubbers 15, 25, 65, 85, and 95 may be formed of the same material so as to have the same rubber hardness, or may be formed of different materials so as to have different rubber hardnesses.

The type of the substrate 31 used in the present invention is not particularly limited, and various substrates such as a rigid substrate and a flexible substrate can be used.

The type of the electrical components 32 and 33 connected to the substrate 31 is not particularly limited, and specifically, there are semiconductor elements, resistive elements, other substrates, and the like.

Before the electrical components 32 and 33 are connected to the front surface and the back surface of the substrate 31, other electrical components such as CR components may be connected to either or both of the front surface and the back surface of the substrate 31 during a period from when the electrical components 32 and 33 are connected to the front surface of the substrate 31 to when the electrical components 32 and 33 are connected to the back surface, or after the electrical components 32 and 33 are connected to both of the front surface and the back surface of the substrate 31.

Claims (6)

1. A pressure bonding apparatus having first and second pressing rubbers, the pressure bonding apparatus being configured to be capable of pressing an object to be pressure bonded, which is disposed between the first and second pressing rubbers and has an electric component disposed on both surfaces of a substrate, with the first and second pressing rubbers, the apparatus comprising:

a dam member which is higher than the surface height of the first pressing rubber and surrounds the periphery of the first pressing rubber, the periphery of the object to be pressure-bonded and the periphery of the second pressing rubber when pressure-bonding is performed so as to block the expansion of the first and second pressing rubbers in the horizontal direction is arranged around the first pressing rubber,

the second pressing rubber is configured to be inserted into a space surrounded by the dam member,

the first and second pressing rubbers press the object to be pressure-bonded while the dam member surrounds the periphery of the first pressing rubber, the periphery of the object to be pressure-bonded, and the periphery of the second pressing rubber, and fix the electric components to both surfaces of the substrate.

2. A pressure bonding apparatus having first and second pressing rubbers, the pressure bonding apparatus being configured to be capable of pressing an object to be pressure bonded, which is disposed between the first and second pressing rubbers and has an electric component disposed on both surfaces of a substrate, with the first and second pressing rubbers, the apparatus comprising:

a dam member is disposed around the first pressing rubber so as to surround the first pressing rubber, the object to be pressure-bonded, and the second pressing rubber when pressure-bonding the first pressing rubber and the second pressing rubber, and to block expansion of the first and second pressing rubbers in the horizontal direction,

the first pressing rubber is arranged on a first pressing plate,

a first compression member capable of compression deformation is disposed between the first pressing rubber and the first pressing plate,

the dam member is configured to have a height higher than a surface height of the first pressing rubber at least when the first compression member is compressed,

the second pressing rubber is configured to be insertable into a space surrounded by the dam member.

3. A pressure bonding apparatus having first and third pressing rubbers, the pressure bonding apparatus being configured to be capable of pressing an object to be pressure bonded, which is disposed between the first and third pressing rubbers and has an electric component disposed on both surfaces of a substrate, with the first and third pressing rubbers, the apparatus comprising:

dam members which are higher than the surface height of the first and third pressing rubbers and surround the periphery of the first pressing rubber, the periphery of the object to be pressure-bonded, and the periphery of the third pressing rubber when pressure-bonded so as to block the expansion of the first and third pressing rubbers in the horizontal direction are arranged around the first and third pressing rubbers, respectively,

the first and third pressing rubbers press the object to be pressure-bonded while the dam member surrounds the periphery of the first pressing rubber, the periphery of the object to be pressure-bonded, and the periphery of the third pressing rubber, and fix the electric components to both surfaces of the substrate.

4. A pressure bonding apparatus having first and third pressing rubbers, the pressure bonding apparatus being configured to be capable of pressing an object to be pressure bonded, which is disposed between the first and third pressing rubbers and has an electric component disposed on both surfaces of a substrate, with the first and third pressing rubbers, the apparatus comprising:

dam members are disposed around the first and third pressing rubbers to block expansion of the first and third pressing rubbers in a horizontal direction, the dam members surrounding the first pressing rubber, the object to be pressure-bonded, and the third pressing rubber during pressure bonding,

the first pressing rubber is arranged on a first pressing plate,

a first compression member capable of compression deformation is disposed between the first pressing rubber and the first pressing plate,

the dam member is configured to have a height higher than a surface height of the first pressing rubber at least when the first compression member is compressed.

5. A pressure bonding apparatus including fourth and fifth pressing rubbers, the pressure bonding apparatus being configured to be capable of pressing an object to be pressure bonded, which is disposed between the fourth and fifth pressing rubbers and has an electric component disposed on both surfaces of a substrate, with the fourth and fifth pressing rubbers, the pressure bonding apparatus comprising:

a dam member surrounding the peripheries of the fourth and fifth pressing rubbers and surrounding the periphery of the fourth pressing rubber, the periphery of the object to be pressure-bonded, and the periphery of the fifth pressing rubber during pressure bonding to block the expansion of the fourth and fifth pressing rubbers in the horizontal direction,

the dam member is configured to be separable from the fourth and fifth pressing rubbers,

the fourth and fifth pressing rubbers press the object to be pressure-bonded while the dam member surrounds the periphery of the fourth pressing rubber, the periphery of the object to be pressure-bonded, and the periphery of the fifth pressing rubber, and fix the electric components to both surfaces of the substrate.

6. The crimping apparatus of claim 5, wherein:

the dam-type member is in a cylindrical shape,

the fourth and fifth pressing rubbers are configured to be inserted into the tube of the dam member.